TW201129806A - Conductive member, connecting member, testing apparatus and method for repairing connecting member - Google Patents

Conductive member, connecting member, testing apparatus and method for repairing connecting member

Info

Publication number
TW201129806A
TW201129806A TW099129713A TW99129713A TW201129806A TW 201129806 A TW201129806 A TW 201129806A TW 099129713 A TW099129713 A TW 099129713A TW 99129713 A TW99129713 A TW 99129713A TW 201129806 A TW201129806 A TW 201129806A
Authority
TW
Taiwan
Prior art keywords
connecting member
conductive
section
conductive member
testing apparatus
Prior art date
Application number
TW099129713A
Other languages
Chinese (zh)
Other versions
TWI418800B (en
Inventor
Yoshiharu Umemura
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW201129806A publication Critical patent/TW201129806A/en
Application granted granted Critical
Publication of TWI418800B publication Critical patent/TWI418800B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

In an opening arranged on a connecting member frame which electrically connects a test head, which tests a device to be tested, and the device to be tested, a conductive member, which has a conductive section electrically connecting the test head and the device to be tested, and a holding section, which has elasticity and holds the conductive section, is removably arranged. The conductive member may be held removably from the frame by elasticity of the holding section. The holding section has a protruding section which fits in the opening, and the conductive member may be held removably from the frame by a force generated between the protruding section and the side surface of the opening.
TW099129713A 2009-09-10 2010-09-02 A conductive member, a connecting member, a test apparatus, and a method of repairing the connecting member TWI418800B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/004484 WO2011030379A1 (en) 2009-09-10 2009-09-10 Conductive member, connecting member, testing apparatus and method for repairing connecting member

Publications (2)

Publication Number Publication Date
TW201129806A true TW201129806A (en) 2011-09-01
TWI418800B TWI418800B (en) 2013-12-11

Family

ID=42351875

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099129713A TWI418800B (en) 2009-09-10 2010-09-02 A conductive member, a connecting member, a test apparatus, and a method of repairing the connecting member

Country Status (4)

Country Link
JP (1) JP4487016B1 (en)
KR (1) KR101025265B1 (en)
TW (1) TWI418800B (en)
WO (1) WO2011030379A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI637179B (en) * 2014-11-27 2018-10-01 日商精工愛普生股份有限公司 Electronic component conveying device, electronic component inspection device, and electronic component pressing device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013008324A1 (en) 2013-05-08 2014-11-13 Feinmetall Gmbh Electrical contacting device
TWI609188B (en) * 2015-09-25 2017-12-21 矽品精密工業股份有限公司 Detection apparatus and detection method
JP6815251B2 (en) * 2017-03-30 2021-01-20 東京エレクトロン株式会社 Inspection system, wafer map display, wafer map display method, and computer program
KR102580832B1 (en) * 2018-09-03 2023-09-20 삼성전기주식회사 Contact structure and substrate holder having the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3198135B2 (en) * 1991-12-28 2001-08-13 ホーヤ株式会社 Method for manufacturing insulating organic resin film with probe in circuit test element, insulating organic resin film and circuit test element with probe
KR100245050B1 (en) * 1997-01-31 2000-02-15 남재우 Forming method of a probe needle
KR100356823B1 (en) * 2001-01-04 2002-10-18 주식회사 하이닉스반도체 Probe card
CN100343676C (en) * 2003-05-13 2007-10-17 日本麦可罗尼克斯股份有限公司 Probe for testing electric conduction
CN1957259A (en) * 2004-04-27 2007-05-02 Jsr株式会社 Sheetlike probe, its manufacturing method and its application
JP4365766B2 (en) * 2004-10-26 2009-11-18 京セラ株式会社 Wafer support member and semiconductor manufacturing apparatus using the same
JP2008059895A (en) * 2006-08-31 2008-03-13 Masashi Okuma Contact sheet and its manufacturing method, and cable and elastic member for forming contact sheet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI637179B (en) * 2014-11-27 2018-10-01 日商精工愛普生股份有限公司 Electronic component conveying device, electronic component inspection device, and electronic component pressing device

Also Published As

Publication number Publication date
KR101025265B1 (en) 2011-03-29
TWI418800B (en) 2013-12-11
JPWO2011030379A1 (en) 2013-02-04
JP4487016B1 (en) 2010-06-23
KR20110031410A (en) 2011-03-28
WO2011030379A1 (en) 2011-03-17

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees