JP4266454B2 - socket - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a socket for detachably mounting an electrical component having a large number of lead terminals to electrically connect each lead to an external device.
[0002]
[Prior art]
6A to 6D are cross-sectional views showing the configuration of a conventional burn-in test socket.
FIG. 7A is a cross-sectional view showing the configuration of a conventional burn-in test socket, showing a state in which a first type IC chip is loaded, and FIG. 7B shows a conventional burn-in test. FIG. 7C is a cross-sectional view showing the configuration of the test socket, and shows a state in which the second type IC chip is loaded. FIG. 7C shows a portion P surrounded by an alternate long and short dash line in FIG. FIG. 7 (d) is an enlarged view, FIG. 7 (d) is an enlarged view of a portion Q surrounded by an alternate long and short dash line in FIG. 7 (b), and FIG. 7 (e) is an alternate long and short dashed line in FIG. FIG. 7F is an enlarged view of the enclosed portion Q, and FIG. 7F is an enlarged view of the portion R enclosed by the alternate long and short dash line in FIG.
[0003]
As shown in FIGS. 6A to 6D, this socket 101 is used, for example, for testing a TSOP (Thin Small Outline Package) IC chip 105 and has a base 102 made of plastic. is doing.
[0004]
The cover 103 is attached to the base 102 so as to be able to approach or separate from the base 102, and the cover 103 is separated from the base 102 by a spring (not shown) in a state where no pressing force is applied to the cover 103. It is configured to be energized.
[0005]
On the base 102, a plurality of contacts 109 formed in a leaf spring shape using an elastic metal material are arranged. The number of contacts 109 is the same as the number of IC leads 111 derived from the package periphery of the IC chip 105, and the tip of each contact 109 is configured to be able to contact each IC lead 111 with elasticity. ing.
[0006]
The contact 109 is fixed to the base 102 in a state in which the lead portion 191 is led out almost vertically from the bottom surface of the base 102, and the lead portion 191 is configured so that the socket 101 can be soldered to a printed circuit board (not shown). Has been.
[0007]
Each contact 109 is configured to engage with a guide portion 103 a provided on the cover 103 and swing to engage the IC chip 105 and electrically connect to the IC lead 111.
[0008]
That is, when the cover 103 is pushed down with respect to the base 102, the lever portion 195 of the contact 109 engages with the guide portion 103a of the cover 103 as shown in FIGS. The contact portion 109a is separated from the adapter 104, so that the IC chip 105 can be mounted.
[0009]
Thereafter, when the IC chip 105 is mounted and the pressure on the cover 103 is released, the contact 109 comes into contact with the tip of the IC lead 111 due to its own spring property, as shown in FIG. A good electrical connection between the IC lead 111 and the contact 109 is achieved by the reaction force of the contact 109.
[0010]
[Problems to be solved by the invention]
By the way, in this type of socket 101, the IC chip 105 is positioned by the positioning portion 104a provided in the adapter 104 when the IC chip 105 is loaded.
[0011]
However, as shown in FIGS. 7C and 7D, there are IC chips 105 of this type having different package thicknesses (t ₁ , t ₂ ) even if the package size is the same. .
[0012]
For this reason, conventionally, the sockets 1011 and 1012 in which the height of the positioning portion 104a is different depending on each type of IC chip 1051 and 1052 must be used, which increases the area of the part where the socket is installed. There was a problem.
[0013]
On the other hand, it is possible to attach the first IC chip 1051 to the socket 1012 for the second IC chip 1052, but in this case, as shown in FIGS. 7E and 7F, the second IC chip Since the clearance between 1012 and the positioning portion 104a increases (C ₁ > C ₂ ), the positions of the IC lead 111 and the contact 109 are not aligned, making it difficult to contact them. As a result, this method cannot be adopted because there is a possibility of causing a conduction failure.
[0014]
The present invention has been made to solve the above-described problems of the prior art, and an object of the present invention is to provide a socket in which different types of electrical elements can be accurately positioned and loaded with one socket. .
[0015]
[Means for Solving the Problems]
The socket of the present invention made to achieve the above object is a socket for attaching at least two kinds of electric elements, and for connecting the detachably attached electric elements to an external circuit, wherein a plurality of electric elements are attached. A contact, a base on which a plurality of contacts are disposed, and an adapter mounted on the base. The adapter includes a recess capable of accommodating an electronic element, and an electrical element provided at the bottom of the recess. A seat portion for receiving one surface and a positioning portion for positioning an electric element formed on the inner peripheral edge of the recess, wherein at least two positioning surfaces having different inclination angles are formed on the positioning portion; The positioning surfaces are continuously connected from one to the other, and at least two positioning surfaces are inclined angles of side surfaces of the at least two types of electric elements. It is substantially equal to the angle.
[0016]
In the case of the present invention , since the positioning portion is provided with positioning surfaces having different inclination angles, different types of electric elements can be positioned and loaded with high accuracy. As a result, according to the present invention, a socket applicable to a plurality of types of electrical elements can be obtained.
[0017]
Furthermore, the positioning portion 2 kinds of the provision of the positioning surface of the inclined angle, the two types of inclination angle of inclination of the positioning surfaces of the inlet side of the electric element of the positioning surface of the positioning surface of the seating portion of the electrical device It is also effective to make it larger than the angle.
[0018]
Furthermore, if a positioning surface having an angle substantially equal to the inclination angle of the side surface of the electric element is provided in the positioning portion, each part of the side surface of the electric element abuts against the corresponding positioning surface in a uniform state. Therefore, positioning with higher accuracy can be performed.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a preferred embodiment of a socket according to the present invention will be described in detail with reference to the drawings.
Fig.1 (a) is a top view which shows the external appearance structure of the socket of this Embodiment, FIG.1 (b) is the sectional view on the AA line of Fig.1 (a).
Fig.2 (a) is a side view of the socket of this Embodiment, FIG.2 (b) is BB sectional drawing of Fig.1 (a).
[0020]
The socket 1 of the present embodiment is generally composed of a base 2, a cover 3, and an adapter 4, which are formed using a resin material such as polyetherimide.
Here, the base 2 is fixed on a circuit board such as a printed board (not shown), and is formed in a square shape, for example.
[0021]
On the other hand, the cover 3 is formed in a rectangular frame shape having substantially the same size as the base 2, and an opening 3a for inserting an IC chip 5 (51, 52), which is an electric element, in the central portion thereof. Is formed.
[0022]
The base 2 and the cover 3 are configured to approach or leave while maintaining a parallel state to each other. A coil spring 6 is provided between the cover 3 and the base 2, and the cover 3 and the base 2 are urged away from each other.
[0023]
The base 2 is provided with a plurality of contacts 9 that are integrally formed using an elastic metal material. These contacts 9 are provided in the same number as the IC leads 11 derived from the periphery of the package 10 of the IC chip 5, and the contact portions 9 a of the contacts 9 are arranged at the tips of the IC leads 11 by the configuration described below. It can come into contact with the portion with elasticity from above.
[0024]
As shown in FIG. 2 (b), the contact 9 has a U-shaped base 90 fixed to the mounting portion of the base 2, and a rod-shaped lead portion 91 is formed on one side of the base 90. Has been. The base portion 90 of the contact is fixed to the base 2, and the lead portion 91 is led out from the bottom surface of the base 2, and can be connected to a connection terminal on a circuit board (not shown) by soldering the lead portion 91. It is like that.
[0025]
On the other hand, an IC connection portion 92 is provided on the other side of the base 90 of the contact 9, that is, on the cover 3 side in a state where the contact 9 is attached.
[0026]
The IC connection portion 92 is formed so that a portion formed so as to extend from the base portion 90 is bent to have a spring property, and a spring portion 93 is branched from the tip portion of the spring portion 93 into two. The contact arm portion 94 and the lever portion 95 are configured.
[0027]
The cover 3 is formed with guide groove portions 30 that engage with the lever portions 95 of the respective contacts 9. The guide groove portion 30 has a groove bottom portion 31 that is inclined by a predetermined angle toward the upper portion of the cover 3, and the groove bottom portion 31 and the distal end portion of the lever portion 95 of the contact 9 as the cover 3 is pushed down. And the contact arm portion 94 of the contact 9 is moved in a direction away from the adapter 4.
[0028]
On the other hand, the adapter 4 is formed to be slightly smaller than the base 2 and is assembled to the center portion of the base 2. The adapter 4 is formed with a concave portion 4a having a rectangular opening capable of accommodating the IC chip 5, and a seat portion 4b for receiving the IC chip 5 is provided at the bottom of the concave portion 4a.
[0029]
Further, a tapered introduction portion 4c for drawing the IC chip 5 is formed at the inner peripheral edge of the opening end portion of the adapter 4, and the introduced IC chip 5 is positioned below the introduction portion 4c. A positioning part 4d is provided for this purpose.
[0030]
3A is a cross-sectional view taken along the line AA in FIG. 1A, showing a state in which the first type IC chip is loaded, and FIG. 3B is a cross-sectional view of FIG. It is an AA line sectional view and shows the state where the 2nd type IC chip was loaded.
4A is an enlarged view of a portion P surrounded by a one-dot chain line in FIG. 3A, and FIG. 4B is a portion surrounded by a one-dot chain line in FIG. 3B. It is a figure which expands and shows Q.
5A is an enlarged view of a portion Q surrounded by a one-dot chain line in FIG. 3B, and FIG. 5B shows a portion R surrounded by the one-dot chain line in FIG. FIG.
[0031]
As shown in FIGS. 4A and 4B and FIGS. 5A and 5B, the positioning portion 4d of the present embodiment has two different inclination angles with respect to the moving direction (vertical direction) of the cover 3. Two positioning surfaces 41 and 42 are provided.
[0032]
In the case of the present invention, in order to deal with different types of IC chips 51 and 52, the angle of the first positioning surface 41 on the cover 3 (upper) side is set to α as shown in FIGS. When the angle of the second positioning surface 42 on the seating surface (lower) side is β, the angle α of the first positioning surface 41 is configured to be larger than the angle β of the second positioning surface 42. Is preferred.
[0033]
By configuring in this way, an appropriate clearance can be secured for two types of IC chips 51 and 52, for example, COL type and LOC type, and each can be easily positioned.
[0034]
Furthermore, in the present embodiment, the angles of the positioning surfaces 41 and 42 correspond to the inclination angles of the side surfaces of the IC chips 51 and 52 to be loaded.
That is, in the case of the present embodiment, as shown in FIGS. 4A and 4B, the inclination angle of the side surface 51a of the COL type IC chip 51 whose package thickness is t ₁ is α (for example, 33 °). As shown in FIGS. 5A and 5B, when the inclination angle of the side surface 52a of the LOC type IC chip 52 whose package thickness is t ₂ is β (for example, 15 °), as shown in FIGS. The angle of the positioning surface 41 is set to be α, and the angle of the second positioning surface 42 is set to be equal to β.
[0035]
Further, with respect to the height of the first and second positioning surfaces 41 and 42, particularly the height h ₁ of the first positioning surface 41, from the viewpoint of positioning each IC chip 51 and 52 with higher accuracy, FIG. (b), the relative package thickness t ₁ of the corresponding COL type of IC chip 51 is preferably set to be in the range of 0.4t ₁ ~0.6t _1, more preferably 0 Set to about 5t ₁ .
[0036]
According to the present embodiment having such a configuration, the point where the straight line of the slope forming the angle α of the IC chips 51 and 52 intersects the straight line of the slope forming the angle β of the IC chip 52 is the package thickness. The clearance between the COL type IC chip 51 and the first positioning surface 41 is 0.08 mm and the LOC type IC chip 52 is within the range of the smaller _{one of the} lengths t _{1 and} t ₂ (t ₁ ). The clearance with the second positioning surface 42 can be made substantially equal to 0.06 mm.
[0037]
In this embodiment, when the IC chips 51 and 52 are loaded in the socket 1, the cover 3 is pressed against the base 2, and the lever portion 95 of the contact 9 is engaged with the groove bottom portion 31 of the guide groove portion 30 of the cover 3. The contact arm portion 94 of the contact 9 is retracted, and the IC chips 51 and 52 are dropped into the concave portion 4a of the adapter 4 in this state.
[0038]
Next, when the force applied to the cover 3 is released, the cover 3 is separated from the base 2 by the biasing force of the coil spring 6, and the lever portion 95 of the contact 9 and the groove bottom portion 31 of the guide groove portion 30 of the cover 3 are disengaged. The contact portion 9 a of the contact 9 is pressed against the tip of the IC lead 11 of the IC chip 5 by the elastic force of the contact 9, whereby the IC chips 51 and 52 are loaded into the socket 1.
[0039]
As described above, according to the present embodiment, since the positioning portions 41 and 42 of the adapter 4 are provided with the positioning surfaces 41 and 42 having different inclination angles, the COL type and the LOC type 2 are provided with one socket 1. Each kind of IC chips 51 and 52 can be positioned and loaded with high accuracy.
[0040]
In particular, in the present embodiment, the positioning portion 4d is provided with the first and second positioning surfaces 41, 42 having an angle equal to the inclination angles α, β of the side surfaces 51a, 52a of the IC chips 51, 52. Therefore, each part of the side surfaces 51a, 52a of each IC chip 51, 52 comes into contact with the first positioning surface 41 or the second positioning surface 42 in a uniform state. On the other hand, highly accurate positioning can be performed.
[0041]
The present invention is not limited to the above-described embodiment, and various modifications can be made as described below.
For example, in the above-described embodiment, the two positioning surfaces are provided in the positioning portion of the adapter, but the present invention is not limited to this, and it is possible to provide three or more positioning surfaces.
[0042]
Further, the inclination angle of each positioning surface is not limited to that of the above-described embodiment, and can be changed as appropriate. However, if the tilt angle of each positioning surface is made equal to the tilt angle of the side surface of each IC chip as in the above embodiment, each IC chip can be positioned and loaded with higher accuracy.
[0043]
Furthermore, the present invention can be applied not only to burn-in test sockets but also to various electrical characteristic test sockets.
[0044]
【The invention's effect】
As described above, according to the present invention, different types of electrical elements can be accurately positioned and loaded with one socket.
[Brief description of the drawings]
1A is a plan view showing an external configuration of a socket according to an embodiment of the present invention; FIG. 1B is a cross-sectional view taken along line AA in FIG. 1A; FIG. Side view (b): It is the BB sectional drawing of Fig.1 (a).
3A is a cross-sectional view taken along line AA in FIG. 1A, and shows a state in which a first type IC chip is loaded. FIG. 3B is a cross-sectional view taken along line AA in FIG. FIG. 4 (a) is an enlarged view of a portion P surrounded by a one-dot chain line in FIG. 3 (a). FIG. 5B is an enlarged view of a portion Q surrounded by a dashed line in FIG. 3B. FIG. 5A is an enlarged view of a portion Q surrounded by a dashed line in FIG. (B): An enlarged view of a portion R surrounded by a one-dot chain line in FIG. 5 (a). FIG. 6 (a) to (d): Cross-sectional views showing the configuration of a conventional burn-in test socket. 7A is a cross-sectional view showing a configuration of a conventional burn-in test socket, and shows a state in which a first type IC chip is loaded. FIG. 7B is a conventional burn-in test. FIG. 7 is a cross-sectional view showing a configuration of a socket for use, and shows a state in which a second type IC chip is loaded (c): an enlarged view showing a portion P surrounded by a one-dot chain line in FIG. (D): FIG. 7 (b) is an enlarged view of the portion Q surrounded by the one-dot chain line (e): FIG. 7 (b) is an enlarged view of the portion Q surrounded by the one-dot chain line (f) ): Enlarged view of the portion R surrounded by the alternate long and short dash line in FIG. 7E.
DESCRIPTION OF SYMBOLS 1 …… Socket 2 …… Base 3 …… Cover 4 …… Adapter 4d …… Positioning part 41 …… First positioning surface 42 …… Second positioning surface 5 …… IC chip (electric element) 51 …… COL Type IC chip 52 …… LOC type IC chip 9 …… Contact 11 …… IC lead

Claims (3)

At least two types of electrical elements can be mounted, and a socket for connecting the detachably mounted electrical elements to an external circuit,
Multiple contacts,
A base provided with a plurality of contacts;
An adapter mounted on the base,
The adapter has a recess capable of accommodating an electronic element, a seating portion for receiving one surface of the electrical element provided at the bottom of the recess, and a positioning portion formed on the inner periphery of the recess for positioning the electrical element. ,
The positioning portion is formed with at least two positioning surfaces having different inclination angles, and the at least two positioning surfaces are continuously connected from one to the other, and the at least two positioning surfaces have the at least two types of electric surfaces. Socket that is approximately equal to the angle of inclination of each side of the element Of the at least two positioning surfaces, angle of inclination of the positioning surfaces of the inlet side of the electric element has been configured so as to be larger than the inclination angle of the positioning surface of the seating portion of the electrical device, according to claim 1 socket . The socket further includes a cover configured to approach or leave the base;
  The tip of each contact includes a base, a spring portion extending from the base, a contact arm portion and a lever portion branched from the spring portion,
  The socket according to claim 1, wherein the cover is engaged with a lever portion of each contact, and the contact arm portion is moved away from the adapter when the cover is approached to the base.

Images