JP2002190361A - Socket for electrical component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the socket to prevent electric component contacts from being caught by the others, such as lower contact pieces, when fitting them into the socket. SOLUTION: This socket consists of the socket 13 accommodating IC package 12, a plural number of contact pins 16 detachable from IC lead 12b on IC package 12 and the operational part 17 fitted for any free vertical movement. Here the contact pin 16 has movable contact piece 16c which brought into contact with the upper face of IC lead 12b as well as movable contact piece 16c to contact with the lower face of IC lead 12b. Socket 23 has the floating plate 15, to which IC package 12 is laid and fitted for vertical movement with elastic parts loaded vertically. By keeping the height of surface 15a in laying the floating plate 15 with the movable contact 16c separated from an IC lead 12b, the IC lead 12b can be made to be in floated state from the fixed contact 16d.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical component socket for removably housing an electrical component such as a semiconductor device (hereinafter referred to as an "IC package"), and more particularly, to an electrical component having an improved electrical component housing. It is about sockets.

[0002]

2. Description of the Related Art Conventionally, as this type of "electric component socket", there is an IC socket for detachably holding an IC package as an "electric component".

[0003] IC packages as "electric components" are:
A so-called gull wing type, in which a plurality of IC leads, which are “terminals”, protrude in a crank shape from two opposing sides of a substantially rectangular parallelepiped package body.

On the other hand, an IC socket has a socket body,
A mounting portion for mounting the IC package is formed,
A guide portion for positioning a rectangular parallelepiped IC package at a predetermined position is provided.

[0005] The socket body is provided with a plurality of elastically deformable contact pins which are separated from and connected to the IC leads of the IC package. This contact pin
It has an upper contact piece in contact with the upper surface of the IC lead and a lower contact piece in contact with the lower surface of the IC lead.

Further, an operating member is disposed on the socket body so as to be movable up and down, and the operating member is lowered against the urging force of the contact pin or the like, so that the contact portion is formed at the cam portion of the operating member. The operation piece of the pin is pressed outward. Thereby, the spring portion of the contact pin is elastically deformed so that the upper contact piece is separated from the IC lead. When the operating member is lifted, the upper contact returns by the elastic force of the spring portion and comes into contact with the upper surface of the IC lead, so that the IC lead is moved between the upper contact and the lower contact. The contact pin and the IC lead are electrically connected to each other by being sandwiched therebetween.

[0007]

However, in such a conventional device, the lower contact piece is raised from the socket body so that the IC lead of the IC package can be brought into good contact with the lower contact piece. Slightly protruding from the IC
If the IC package is inserted into the socket body slightly obliquely,
There is a possibility that the IC leads of the C package may be caught by the lower contact pieces and cannot be inserted properly, or the IC leads and the lower contact pieces of the IC package may be damaged.

Accordingly, an object of the present invention is to provide an electrical component socket which can prevent the electrical component terminal from being caught by another component such as a lower contact piece when the electrical component is accommodated in the socket body. .

[0009]

In order to achieve the above object, according to the first aspect of the present invention, there is provided a socket body for accommodating an electric component, and a socket attached to the socket body and separated from and connected to a terminal of the electric component. A plurality of possible contact pins, and an operating member provided on the socket body so as to be movable up and down, wherein the contact pin has an upper contact piece that contacts an upper surface of the terminal, and moves the operating member up and down. By doing so, in the electrical component socket in which the upper contact piece is displaced to be separated from and connected to the terminal, a floating plate on which the electrical component is placed is mounted on the socket body by an elastic member. The floating plate is disposed movably up and down in a state of being biased, and the height of the mounting surface of the floating plate is such that the electric component is mounted on the floating plate mounting surface, Serial in a state in which the upper contact piece is displaced is separated from the terminal, characterized in that the electrical component terminal is a set electrical component socket so that the floated from other members.

According to a second aspect of the present invention, in addition to the configuration of the first aspect, the contact pin has an upper contact piece that contacts an upper surface of the terminal and a lower contact piece that contacts a lower surface of the terminal. The height of the mounting surface of the floating plate, the electric component is mounted on the floating plate mounting surface, the upper contact piece is displaced and separated from the terminal, Along with the terminal of the electric component being set to be in a state of floating from the contact portion of the lower contact piece,
When the operating member is raised, the lowering means lowers the floating plate to bring the lower surface of the terminal of the electric component on the floating plate into contact with the contact portion of the lower contact piece. Features.

According to a third aspect of the present invention, in addition to the configuration according to the second aspect, the lowering means is configured to move the upper contact piece in a state where the upper contact piece is in contact with the upper surface of the electric component terminal. By the elastic force, the floating plate is lowered,
The lower surface of the terminal of the electric component on the floating plate is brought into contact with the contact portion of the lower contact piece.

According to a fourth aspect of the present invention, in addition to the configuration of the second aspect, the lowering means is provided with a pressing portion for pressing the floating plate on the upper contact piece, and the pressing portion is provided with the floating portion. The lower surface of the terminal of the electrical component on the floating plate is brought into contact with the contact portion of the lower contact piece by contacting the plate and pressing down to lower it.

According to a fifth aspect of the present invention, in addition to the configuration of the second aspect, the lowering means has a pressing member provided on the socket body, and the pressing member lowers the operation member. When the operating member is resiliently deformed and retracted from the insertion area of the electric component, and when the operating member is raised, the operating member comes into contact with the floating plate and is pressed downward to lower the floating member. Wherein the lower surface of the terminal of the electrical component is brought into contact with the contact portion of the lower contact piece.

The invention according to claim 6 is the invention according to claims 2 to 5
In addition to the configuration described in any one of the above, the lower contact piece of the contact pin is formed to be elastically deformable, and the floating plate is lowered so that the lower surface of the electric component terminal contacts the lower contact piece. When the floating plate is further lowered from the state in which it is in contact with the portion, the lower contact piece is elastically deformed, and the contact portion of the lower contact piece slides on the lower surface of the electric component terminal. It is characterized by having done.

[0015]

Embodiments of the present invention will be described below.

[First Embodiment of the Invention] FIGS. 1 to 6 show a first embodiment of the present invention.

First, the structure will be described.
An IC socket as an “electric component socket”. The IC socket 11 is used for performing a performance test of the IC package 12 as an “electric component”.
The purpose of this is to electrically connect the IC lead 12b as the "terminal" 2 and a printed wiring board (not shown) of a measuring instrument (tester).

The IC package 12 is a so-called gull wing type as shown in FIG.
A large number of IC leads 12b protrude in a crank shape from two opposing sides of the rectangular package body 12a toward the side.

On the other hand, the IC socket 11 is roughly
It has a socket body 13 mounted on a printed wiring board, and the socket body 13 has a floating plate 15 having a mounting surface 15a on which the IC package 12 is mounted. It is arranged movably.

The floating plate 15 has I
A guide portion 15 for guiding the IC package 12 when the C package 12 is stored and for positioning the IC package 12 at a predetermined position.
b, and as shown in FIG.
Urged upward by A locking piece 15c extends downward from the floating plate 15, and a hook 15d formed at the lower end of the locking piece 15c is connected to a locked portion 13c formed on the socket body 13.
The floating plate 15 is stopped at the highest position by being locked to the b.

The socket body 13 is provided with a plurality of elastically deformable contact pins 16 electrically connected to the IC leads 12b, and has a rectangular frame-like shape for elastically deforming the contact pins 16. Operation member 1
7 is arranged to be able to move up and down.

The contact pin 16 is made of a material having spring properties and excellent conductivity, and
(See FIG. 2 etc.).

More specifically, the contact pin 16 has a fixing portion 16a fixed to the socket body 13 on the lower side, and the fixing portion 16a is
a. A fixed contact piece 16b as a "lower contact piece" and a movable contact piece 16c as an "upper contact piece" protrude upward from the fixed portion 16a.

The fixed contact piece 16b has a fixed contact portion 16d formed at the upper end thereof and in contact with the lower surface of the IC lead 12b.

The movable contact piece 16c has a spring portion 16e which is curved in an arc shape, and a horizontal portion 16f which extends substantially horizontally toward the center of the socket body 13 is formed above the spring portion 16e. An inclined portion 16g extending obliquely upward from the horizontal portion 16f is formed.
A movable contact portion 16h extends substantially horizontally from the upper end of the socket g toward the center of the socket body 13. When the movable contact portion 16h contacts the upper surface of the IC lead 12b and presses it downward, the IC lead 12b is sandwiched by the fixed contact portion 16d of the fixed contact piece 16b. . Further, on the contact pin 16, an operation piece 16i pressed by the operation member 17 branches upward from the horizontal portion 16f. Further, a lead portion 16k connected to a printed wiring board (not shown) is formed below the fixed portion 16a.

As shown in FIG. 1 and the like, the operating member 17 has a rectangular frame shape corresponding to the shape of the IC package 12, and has an opening 17a large enough to allow the IC package 12 to be inserted. The IC package 12 is inserted through the opening 17a and is mounted on the mounting surface 15a of the floating plate 15.

As shown in FIGS. 2 and 3, the operating member 17 is vertically movable with respect to the socket body 13, is urged upward by a spring 18, and engages at the highest position. The stop claw 17b is locked to the locked portion 13c of the socket body 13, and the upper end position of the operation member 17 is regulated.

Further, the operating member 17 has a cam portion 17d slidably in contact with the operating piece 16i of the contact pin 16 on the outer surface side of the opposing long sides 17c of the rectangular shape. By lowering, the operating piece 16i of the contact pin 16 is pressed by the cam portion 17d, the spring portion 16e is elastically deformed, and the movable contact portion 16h is displaced obliquely upward. .

The height relationship between the mounting surface 15a of the floating plate 15 and the fixed contact portion 16d of the fixed contact 16b is determined by lowering the operation member 17 and moving the movable contact 16a.
c is displaced from the IC lead 12b by displacing the IC package 12 with the floating plate 15
The IC lead 12b and the fixed side contact portion 16
The gap C is set so that a gap C is formed between the IC lead 12b and the other member (see FIGS. 4 and 5).

When the operating member 17 is raised,
The floating plate 15 is lowered by "down means", and the lower surface of the IC lead 12b on the floating plate 15 is fixed to the fixed side contact portion 16 of the fixed contact piece 16b.
d (see FIG. 6).

In the first embodiment, as shown in FIG. 5, the "lowering means" is such that the movable contact piece 16c is
As shown in FIG. 6, the floating plate 15 is lowered by the elastic force of the movable contact piece 16c from the state where the floating plate 15 is in contact with the upper surface of the floating plate 1b.
5, the lower surface of the IC lead 12b is brought into contact with the fixed side contact portion 16d.

Next, a method of using the IC socket 11 having such a configuration will be described.

First, a plurality of IC sockets 11 are arranged on the printed wiring board by inserting the lead portions 16k of the contact pins 16 of the IC socket 11 into the insertion holes of the printed wiring board and soldering them in advance. deep.

Then, the IC package 12 is set in the IC socket 11 by, for example, an automatic machine as follows, and is electrically connected.

That is, while the IC package 12 is held by the automatic machine, the operating member 17 is pressed downward against the urging force of the contact pin 16 to be lowered. Then, the contact pin operation piece 16i is pressed by the cam portion 17d of the operation member 17, the spring portion 16e is elastically deformed, and the movable contact portion 16h is displaced obliquely upward and is opened to the maximum, and the IC package is opened. 12 is evacuated from the insertion range.

Then, in this state, the IC package 12 is released from the automatic machine and is mounted on the mounting surface 15a of the floating plate 15 (see FIG. 4).

When mounting the IC package 12 on the mounting surface 15a of the floating plate 15,
The package 12 may be inserted slightly obliquely. However, even in such a case, since the fixed side contact portion 16d of the fixed contact piece 16b of the contact pin 16 does not protrude above the floating plate mounting surface 15a, the IC package 12 mounted on the mounting surface 15a Unlike the related art, the IC lead 12b does not catch on the fixed contact portion 16d.

As a result, the IC package 12 can be satisfactorily accommodated (placed on the placement surface 15a), and damage to the IC leads 12b and the fixed contact pieces 16b of the IC package 12 can be prevented.

Next, when the pressing force of the operation member 17 by the automatic machine is released, the operation member 17 is raised by the urging force of the spring 18 and the elastic force of the spring portion 16e of the contact pin 16, and the movable contact piece of the contact pin 16 is moved. 16c begins to return. When the operating member 17 is raised to a predetermined position, the movable contact portion 1 of the contact pin 16 is moved.
6h is a predetermined I of the positioned IC package 12.
It contacts the upper surface of the C lead 12b (see FIG. 5).

As shown in FIG. 6, when the operating member 17 is further raised, the spring portion 16e of the movable contact piece 16c is moved.
As a result, the upper surface of the IC lead 12b of the IC package 12 is pressed downward while wiping, so that the floating plate 1
5 is lowered against the urging force of the spring 14. In other words, the spring constant of the spring portion 16e of the contact pin 16 and the spring constant of the spring 14 are set so that the floating plate 15 is lowered as such.

As the floating plate 15 descends, the lower surface of the IC lead 12b comes into contact with the fixed contact portion 16d of the contact pin fixing contact piece 16b, and the IC lead 12b comes into contact with the fixed contact portion 16d and the movable contact portion 16d.
h and are electrically connected.

[Second Embodiment of the Invention] FIGS. 7 and 8 show a second embodiment of the present invention.

The second embodiment of the present invention is directed to a "descent means".
Is different from the first embodiment.

In other words, the "lowering means" of the second embodiment is such that the floating plate 15
A pressing portion 16m for pressing is formed, and the pressing portion 16m
Is contacted with the floating plate 15 and pressed downward to lower the IC leads 12b of the IC package 12 on the floating plate 15 so that the lower surface of the IC lead 12b contacts the fixed contact portion 16d of the fixed contact piece 16b. It has become. The fixed side contact portion 16d is inserted into a slit (not shown) formed in the floating plate 15.

In this manner, as compared with the case where the floating plate 15 is lowered by pressing the IC leads 12b as shown in the first embodiment, the IC pin 12 is directly pressed by the contact pins 16 so that the IC The force acting on the lead 12b can be reduced.

The other configuration and operation are the same as those of the first embodiment, and the description is omitted.

[Third Embodiment of the Invention] FIGS. 9 and 10 show a third embodiment of the present invention.

The third embodiment of the present invention is directed to a "descent means".
Is different from the first embodiment.

That is, the “lowering means” of the third embodiment is different from the contact pin 16 in that the socket body 13
Is provided with a pressing member 20. This pressing member 20
Has substantially the same shape as the movable contact piece 16 c of the contact pin 16, and has a spring portion 20 a that can be elastically deformed, a pressing portion 20 b that presses the floating plate 15, and an operating member 17.
An operation piece 20c pressed by the cam portion 17d is formed. The pressing portion 20b is connected to the floating plate 1
In the pressed state of No. 5, it does not come into contact with the IC lead 12b.

The pressing member 20 includes the contact pin 1
Similarly to the movement of the movable contact piece 16c, by lowering the operation member 17, the operation piece 20c is pressed by the cam portion 17d of the operation member 17, and the pressing portion 20b is displaced to the retreat position. When the operation member 17 is lifted after the IC package 12 is placed, the operation member 17 is returned by the elastic force of the spring portion 20a, and the pressing portion 20b contacts the upper surface of the floating plate 15 as shown in FIG. And
When the operating member 17 is further raised, the floating plate 15 is pushed down as shown in FIG. 10 by the elastic force of the spring portion 20a, and as in the first embodiment, not shown in FIG. 16h is IC lead 1
The IC lead 12b comes into contact with the lower surface of the contact pin 2b and is held between the fixed contact portion 16d and the movable contact portion 16h of the contact pin 16.

In such a case, the first embodiment
As shown in (1), when the floating plate 15 is directly pressed by the pressing member 20, the force acting on the IC lead 12b can be reduced as compared with the case where the floating plate 15 is lowered by pressing the IC lead 12b.

The other configuration and operation are the same as those of the first embodiment, and the description is omitted.

[Embodiment 4] FIGS. 11 to 13
Shows a fourth embodiment of the present invention.

Embodiment 4 of the present invention relates to Embodiment 1
The fixing contact piece 16b of the contact pin 16 is different from that of FIG. That is, a spring portion 16p is formed on the fixed contact piece 16b, and the floating plate 15 is pushed down to fix the fixed-side contact portion 16d to the IC lead 12b.
After contact with the lower surface of the floating plate 15
When is lowered, the spring portion 16p is elastically deformed, so that the fixed-side contact portion 16d is moved in the direction of arrow A from the state shown in FIG. 13 to exert the wiping effect.

The other configuration and operation are the same as those of the first embodiment, and the description is omitted.

In each of the above-described embodiments, the present invention is applied to the IC socket 11 as the “socket for electric parts”. However, the present invention is not limited to this, and can be applied to other devices.

In the above-described embodiment, the present invention is applied to a so-called open-top type. However, the present invention is not limited to this, and can be applied to a so-called clam-shell type.

Further, in each of the above embodiments, the contact pin 16 is fixed to the fixed contact 16b (lower contact) and the movable contact 1
6c (upper contact) has been described, but the present invention is not limited to this. A movable contact 16c (upper contact) alone may be used. The upper contact piece may be separated from the upper contact piece. Even if it has only the upper contact piece, in the initial state where the electric component is placed on the floating plate, the terminal of the electric component is floating with respect to other members such as the socket body, so that it may be caught. Therefore, it is possible to improve the accommodating capacity of the electric components.

Further, it goes without saying that the shape of the IC lead 12b (terminal) is not limited to the so-called gull-wing type, but can be applied to a straight type or the like. I
The present invention is applied to an electrical component socket corresponding to one in which IC leads protrude laterally from two opposing sides of a C package, but the present invention is not limited to this. It is also possible to apply the present invention to an electrical component socket corresponding to an IC package in which IC leads protrude.

[0060]

As described above, according to the first aspect of the present invention, when the electric component is accommodated in the socket body, that is, when the electric component is mounted on the floating plate mounting surface. In some cases, the electric component may be inserted slightly obliquely. However, in this case, since the terminal of the electric component mounted on the mounting surface floats from other members, unlike the related art, the terminal may be caught by the contact portion of the contact pin lower contact piece. Nothing. As a result, the electric components can be satisfactorily accommodated, and the terminals of the electric components and the lower contact piece can be prevented from being damaged.

According to the invention described in claim 2, according to claim 1
In addition to the above effects, when the operating member is raised, the lowering means lowers the floating plate so that the lower surface of the terminal of the electric component on the floating plate is brought into contact with the contact portion of the lower contact piece. Thus, the electrical component terminal can be securely connected and electrically connected between the upper contact piece and the lower contact piece of the contact pin.

According to the invention described in claim 3, according to claim 2
In addition to the effect described above, the floating plate is lowered by the elastic force of the contact pins. Therefore, no separate component is required to lower the floating plate, and the number of components does not increase.

According to the invention set forth in claim 4, according to claim 2,
In addition to the effect of the above, by forming a pressing portion to contact and press the floating plate on the upper contact piece,
Since the floating plate is directly pressed, a large force does not act on the terminal of the electric component, so that damage to the terminal can be prevented.

According to the invention described in claim 5, according to claim 2
In addition to the above effects, the pressing member provided on the socket body presses the floating plate downward and presses it down, so that the elastic force of the contact pins does not need to be as strong as necessary to press down the floating plate. Pins can be manufactured at low cost.

According to the sixth aspect of the present invention, in addition to the above effects, the floating plate is lowered and the lower surface of the electric component terminal is brought into contact with the contact portion of the lower contact piece.
When the floating plate is further lowered, the lower contact piece is elastically deformed, and the contact portion of the lower contact piece slides on the lower surface of the electric component terminal, so that a wiping effect is exhibited. It has a practically useful effect.

[Brief description of the drawings]

FIG. 1 is a plan view of an IC socket according to Embodiment 1 of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG. 1 according to the first embodiment.

FIG. 3 is a sectional view taken along line BB of FIG. 1 according to the first embodiment.

FIG. 4 is an essential part cross-sectional view showing a lowest state of the operation member according to Embodiment 1;

FIG. 5 is a main-portion cross-sectional view showing the operation member according to Embodiment 1 in the middle of ascent;

FIG. 6 is an essential part cross-sectional view showing a highest state of the operation member according to Embodiment 1;

FIG. 7 is a cross-sectional view of a main part of the operation member corresponding to FIG. 5 according to Embodiment 2 of the present invention, showing a state where the operation member is being lifted;

FIG. 8 is a cross-sectional view of a main part showing a highest state of the operation member corresponding to FIG. 6 according to the second embodiment.

FIG. 9 is a cross-sectional view of a main part of an operation member corresponding to FIG. 5 according to Embodiment 3 of the present invention, showing a state where the operation member is being lifted;

FIG. 10 is a cross-sectional view of a main part showing a highest state of the operation member corresponding to FIG. 6 according to the third embodiment.

FIG. 11 is a sectional front view of a half corresponding to FIG. 1 according to Embodiment 4 of the present invention.

FIG. 12 is a cross-sectional view of a main part of the operation member corresponding to FIG. 5 according to the fourth embodiment, showing a middle state of the operation member;

FIG. 13 is a cross-sectional view of a main part showing a highest state of the operation member corresponding to FIG. 6 according to the fourth embodiment.

[Explanation of symbols]

 11 IC socket (socket for electric parts) 12 IC package (electric parts) 12a Package body 12b IC lead (terminal) 13 Socket body 14 Spring (elastic member) 15 Floating plate 15a Placement surface 16 Contact pin 16b Fixed contact piece (bottom) 16c Movable contact (upper contact) 16d Fixed contact part (contact part) 16e Spring part 16h Movable contact part 16i Operation piece 16m Press part 16p Spring part 17 Operation member 20 Press member 20b Press part C Gap

Claims (6)

[Claims] A socket body for accommodating an electric component, a plurality of contact pins attached to the socket body and detachable from a terminal of the electric component, and an operating member provided on the socket body so as to be vertically movable. The contact pin has an upper contact piece that contacts an upper surface of the terminal, and by moving the operation member up and down,
In the electrical component socket in which the upper contact piece is displaced to be separated from and connected to the terminal, a floating plate on which the electrical component is placed is urged upward by an elastic member in the socket body. The height of the mounting surface of the floating plate is set such that the electric component is mounted on the mounting surface of the floating plate, and the upper contact piece is displaced to separate from the terminal. A socket for an electric component, wherein the terminal of the electric component is set to be in a state of being floated from another member in a state where the electric component is made to be in the state. 2. The contact pin has an upper contact piece in contact with an upper surface of the terminal and a lower contact piece in contact with a lower surface of the terminal, and a height of a mounting surface of the floating plate is: A state in which the electric component is mounted on the floating plate mounting surface, the upper contact piece is displaced and separated from the terminal, and the terminal of the electric component floats from the contact portion of the lower contact piece. When the operating member is raised, the lowering means lowers the floating plate so that the lower surface of the terminal of the electric component on the floating plate contacts the lower contact piece. The electrical component socket according to claim 1, wherein the electrical component socket is configured to contact the portion. 3. The lowering means lowers the floating plate by an elastic force of the upper contact piece in a state where the upper contact piece is in contact with an upper surface of the electric component terminal,
3. The electrical component socket according to claim 2, wherein a lower surface of the terminal of the electrical component on the floating plate is brought into contact with a contact portion of the lower contact piece. 4. The lowering means has a pressing portion formed on the upper contact piece for pressing the floating plate, and the pressing portion contacts the floating plate and presses the floating plate downward to lower the floating plate. The lower surface of a terminal of the electric component on a plate is brought into contact with a contact portion of the lower contact piece.
An electrical component socket as described. 5. The lowering means has a pressing member provided on the socket main body, and when the operating member is lowered, the pressing member is elastically deformed and retracted from the electric component insertion range. Further, when the operating member is raised, the lower surface of the terminal of the electrical component on the floating plate is pressed down by contacting the floating plate and lowered, so that the contact portion of the lower contact piece is formed. The electrical component socket according to claim 2, wherein the electrical component socket is brought into contact with the electrical component. 6. The lower contact piece of the contact pin is formed so as to be elastically deformable, and the floating plate is lowered so that the lower surface of the electric component terminal is brought into contact with the contact portion of the lower contact piece. When the floating plate is further lowered, the lower contact piece is elastically deformed so that a contact portion of the lower contact piece slides on a lower surface of the electric component terminal. Item 6. An electrical component socket according to any one of Items 2 to 5.