JP2012255700A - Electronic component measuring apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component measuring apparatus which is capable of measuring a microelectronic component easily and highly accurately.SOLUTION: An electronic component measuring apparatus comprises a contact retainer 15 which is placed in an upper part of a pallet 2 and an electrode block 21 which is placed in an upper part of the contact retainer. In the contact retainer 15, a flexible film 18 is mounted on a lower surface of a retainer plate 17 in which a contact hole 16 is formed and a contact pin 19 is provided which is protruded from a contact seat 20 exposed on an upper surface of the flexible film 18 to a lower side of the flexible film 18 and is disposed in an upper part of an electrode of a workpiece W to be measured. In the electrode block 21, an electrode pin 22 protruded downward is attached to a block body. Electrical characteristics of the workpiece are then measured while pressing the contact seat 20 with the electrode pin 22 and depressing the contact pin 19 to an electrode pad 30 of the workpiece W.

Description

  The present invention relates to an electronic component measuring apparatus, and more particularly to an electronic component measuring apparatus for measuring electrical characteristics of an ultra-small electronic component such as a crystal resonator.

  Conventionally, an etching apparatus for etching a crystal resonator with an ion beam for frequency adjustment is known (see, for example, Patent Document 1). This etching system is equipped with a large number of quartz crystal workpieces on the pallet matrix, and etching is performed by irradiating the bottom of the workpiece with the ion beam emitted from the ion beam emitting device provided below. I do. At this time, the frequency of each workpiece is measured by a frequency measuring means connected to the electrode pad of each workpiece, and when the frequency reaches an appropriate value, the shutter of the ion beam entrance is closed to block the ion beam. ing. As a measuring device for such a micro electronic component such as a crystal resonator or LSI, there is a device for measuring electrical characteristics such as frequency characteristics by bringing a contact pin (pogo pin) into contact with an electrode of a workpiece (patent) Reference 2).

  FIG. 8 shows an example of a conventional electronic component measuring apparatus using contact pins. As shown in the figure, the measurement is performed by bringing a contact pin (pogo pin) 42 into contact with the electrode pad 41 of the workpiece W accommodated in the mounting hole 40a of the pallet 40. If the size of the workpiece W is not constant and is too small with respect to the mounting hole 40a, rattling may occur in the mounting hole 40a. In this case, the contact pin 42 does not hit the electrode pad 41 accurately, resulting in poor contact. Therefore, accurate measurement cannot be performed. Therefore, a plate 44 such as an iron plate is placed on the pallet 40, and the upper surface of the workpiece W is pressed by a pressing piece 44a provided in a bridge shape at the opening of the plate 44.

US Pat. No. 6,273,991 JP 2010-281675 A

  In the conventional electronic component measuring apparatus as shown in Patent Document 2, it is necessary to move the contact pin down to contact the electrode pad during measurement. That is, the contact pin repeats contact / detachment with the electrode pad. When the workpiece W is an ultra-small workpiece W such as a crystal resonator (for example, 2.0 × 1.6 mm or less, and the electrode pad is 1 mm or less), even if the workpiece W is misaligned in the mounting hole, There was a problem that the contact with the electrode pad was poor and the measurement was inaccurate or impossible.

  The size of the workpiece W is not constant, and if the workpiece W is slightly smaller than the size of the mounting hole 40a of the pallet 40, the workpiece W is rattled in the mounting hole and is likely to be displaced. When the position of the workpiece W is shifted as described above, a phenomenon that the contact pin 42 cannot accurately contact the electrode pad 41 occurs. Therefore, as shown in FIG. 8, it is necessary to use a plate 44 and keep the workpiece W from moving. As described above, the method of using the plate 44 is not only complicated, but also when the height of the workpiece W is small, the presser piece 44a may not come into contact with the workpiece W. There was a problem that it could not be fixed and the measurement was inaccurate or impossible.

  SUMMARY OF THE INVENTION The present invention solves the above-described problems, and an object of the present invention is to provide an electronic component measuring apparatus capable of measuring an ultra-small workpiece with high accuracy.

  In order to solve the above-mentioned problems, an electronic component measuring apparatus according to claim 1 is an electronic component measuring apparatus that measures the electrical characteristics of a workpiece mounted in a mounting hole formed in a pallet, and is provided above the pallet. A contact retainer to be placed; and an electrode block to be placed on top of the contact retainer, the contact retainer having a flexible film attached to a lower surface of a retainer plate in which a contact hole is formed; A contact pin that protrudes from the contact seat exposed on the upper surface of the flexible membrane to the lower side of the flexible membrane and is arranged on the upper part of the electrode of the workpiece to be measured is provided. A protruding electrode pin is attached. The contact pin is pressed with the electrode pin to press the contact pin against the electrode pad of the workpiece, Characterized in that the electrical characteristics as measured.

  The electronic component measuring apparatus according to claim 2 is characterized in that the contact pin is in contact with the contact seat in a state where a contact retainer is placed on the pallet.

  3. The electronic component measuring apparatus according to claim 1, wherein the electrode pin is a pogo electrode provided with a contact pin slidably inserted into an outer cylinder. .

  The electronic component measuring apparatus according to claim 4, wherein the workpiece is mounted on a pallet having a matrix-shaped mounting hole, and the contact holes are provided in a matrix corresponding to the mounting hole. .

  The electronic component measuring apparatus according to claim 5, wherein the contact pin and the contact seat are provided in a pair with respect to one work, and each of the contact seats has an elliptical shape having the same major axis direction, The contact pins are eccentrically provided in a direction approaching each other and provided on the contact seat, and the electrode pins press the contact seat in a position eccentric in a direction away from the contact pin. The electronic component measuring apparatus according to claim 1.

  According to the present invention, the contact retainer with the contact pin attached to the contact film is placed on the workpiece, and the contact pin is operated with the electrode pin of the electrode block. Can be brought into contact with the electrode pad, and the electrical characteristics of a small workpiece can be measured easily and with high accuracy.

It is a perspective view which shows embodiment of the electronic component measuring device of this invention. It is a vertical side view of the electronic component measuring device of the present invention. It is a vertical side view which shows the principal part of the electronic component measuring device of this invention. It is a vertical side view which shows the principal part of the electronic component measuring device at the time of measurement. It is a top view of a contact film. It is a top view of the electrode block for measurement. It is a top view of a contact film and a work part at the time of measurement. It is the conventional electronic component measuring device, (a) is a top view, (b) is sectional drawing.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view of a transfer boat portion of an etching apparatus equipped with an electronic component measuring apparatus of the present invention, and FIG. 2 is a longitudinal side view of the electronic component measuring apparatus of the present invention.

  In FIGS. 1 and 2, a pallet 2 is mounted on a transport boat 1. The transport boat 1 includes an aperture 4 in which a large number of incident holes 3 are formed, and side plates 5 formed on both sides of the aperture 4. A protruding edge 6 is formed on the four circumferences of the aperture 4, a recess 7 is formed inside the protruding edge 6, and the aperture 4 is formed in the recess 7. A plurality of horizontal guide rolls 8 are provided on the projecting edge 6, and vertical guide rolls 10 are provided on both sides of the side plate 5, and are conveyed along the guide rail 9 of the etching apparatus.

  The pallet 2 is fitted in the recess 7. In the pallet 2, a large number of rectangular mounting holes 11 for mounting a workpiece W such as a crystal resonator are formed in a matrix. A workpiece W is mounted in the mounting hole 11 of the pallet 1, the transfer boat 1 is sent to an etching apparatus (not shown), and plasma ions are controlled by a shutter 12 to perform etching processing. On the pallet 1, a contact retainer 15 which is a part of the electronic component measuring apparatus of the present invention is attached.

  3 and 4 are cross-sectional views showing details of the contact retainer 15, and FIG. 5 is a plan view of the contact film. The contact retainer 15 includes a retainer plate 17 in which contact holes 16 corresponding to the mounting holes 11 are formed in a matrix, a contact film 18 attached to the lower surface of the tritainer plate 17, and attached to the contact film 18. The contact pin 19 is used.

  The contact film 18 is made of a flexible synthetic resin film and is attached to the lower surface of the retainer plate 17. The contact pin 19 is integrally provided on the lower surface of the contact seat 20 exposed on the upper surface of the flexible film 18, and is entirely made of a conductive metal. As shown in FIG. 5, the contact seat 20 has an oval shape, and the contact pin 19 is provided eccentrically inside the contact seat 20 (in a direction approaching the facing contact seat 20). Two contact seats 20 and contact pins 19 are provided for one contact hole 16. As shown in FIG. 4, the electrode block 21 is set on the retainer plate 17.

  FIG. 6 is a plan view of the electrode block. In FIG. 6, the electrode block 21 includes a block body 26 and electrode pins 22 attached to the block body 26 (see FIG. 1). The block body 26 is a rectangular block, and 2 × 16 electrode pin mounting portions 24 are formed, and four insertion holes 25 are formed in one electrode pin mounting portion 24. . Of the four insertion holes 25, two insertion holes on the diagonal are selected, and the electrode pins 22 are inserted and fixed thereto.

  As shown in FIG. 3, the electrode pin 22 is composed of an outer cylinder 22a attached to the block body 26 and a contact 22b slidably inserted into the lower portion of the outer cylinder 22a. It is supported by a spring 23 accommodated in the outer cylinder 22a. For example, a pogo electrode is used as the electrode pin 22.

Next, the measurement operation of the electronic component will be described.
In a state where the transfer boat 1 is pulled out of the etching apparatus, a work W such as a crystal resonator to be etched is set in the mounting hole 11 of the pallet 1 (see FIG. 3). Then, the contact retainer 15 is placed on the upper surface of the pallet 4. As a result, the tips of the contact pins 19 of the flexible film 18 lightly contact the electrode pads 30 provided at the corners on the diagonal line of the workpiece W.
In this state, as shown in FIG. 4, the electrode block 21 is placed on the retainer plate 17 of the contact retainer 15, and the contact seat 20 of the contact pin 19 is pressed by the electrode pin 22. Thereby, the electrode flexible film | membrane 18 curves a little below, and the contact pin 19 contacts the electrode pad 30 of the workpiece | work W strongly, and it will be in the state in which reliable electrical conduction is carried out. In this state, the transfer boat 1 is sent to an etching apparatus (not shown) to perform etching processing. The electrode pin 22 is connected to a measuring instrument (not shown) through a conductive wire, and measures the frequency characteristics and other electrical characteristics of each workpiece W during the etching process. Etching is performed until an optimum electrical characteristic is obtained by opening and closing the shutter 12.

  As described above, the contact pin 19 provided on the contact film 18 provided on the contact retainer 15 is brought into contact with the electrode pad 30 of the work W, whereby the contact pin 19 is brought into contact with the work W by the elastic force of the contact film 18. Measurement can be performed with the workpiece W kept in contact at all times, and the workpiece W need not be fixed with a plate as in the prior art.

  As shown in FIG. 7, the shape of the contact seat 20 is eccentric, that is, the electrode pin 22 is provided at a position eccentric from the contact pin 19 outward of the contact seat 20 (in a direction far from the opposing contact seat 20). Thus, a contact retainer can be commonly used without changing the position of the electrode pin 22 and the position and size of the contact seat 20 for any size of work (for example, an ultra-small work having dimensions of 2.0 × 1.6 millimeters or less). There is an advantage that 15 can be used. In addition, there is an advantage that any work can be handled only by changing the position of the contact pin 19 depending on the position and size of the electrode pad 30 of the work W. However, the contact seat 20 may be circular, the contact pin 19 may be provided at the center, and the electrode pin may be configured to push directly above the contact pin, and the contact seat 20 is not limited to an eccentric shape. .

2 Pallet 15 Contact retainer 16 Contact hole 17 Retainer plate 18 Contact film 19 Contact pin 20 Contact seat 21 Electrode block 22 Electrode pin 22a Outer cylinder 22b Contact 26 Block body 30 Electrode pad W Workpiece

Claims (5)

An electronic component measuring device for measuring electrical characteristics of a workpiece mounted in a mounting hole formed in a pallet,
A contact retainer placed on top of the pallet;
An electrode block placed on top of the contact retainer,
The contact retainer has a flexible membrane attached to the lower surface of a retainer plate in which contact holes are formed, protrudes from the contact seat exposed on the upper surface of the flexible membrane below the flexible membrane, and With contact pins placed on top of the electrodes,
The electrode block is one in which an electrode pin protruding downward is attached to the block body,
An electronic component measuring apparatus, wherein the contact pin is pressed against the electrode pad of the workpiece by pressing the contact seat with the electrode pin, and the electrical characteristics of the workpiece are measured.   The electronic component measuring apparatus according to claim 1, wherein the contact pin contacts the contact seat in a state where the contact retainer is placed on the pallet.   3. The electronic component measuring apparatus according to claim 1, wherein the electrode pin is a pogo electrode having a contact pin that is slidably inserted into an outer cylinder.   4. The work according to claim 1, wherein the workpiece is mounted on a pallet having a matrix-shaped mounting hole, and the contact hole of the contact retainer is provided in a matrix corresponding to the mounting hole. The electronic component measuring device according to claim 1.   A pair of the contact pins and contact seats are provided for one workpiece, and each of the contact seats has an elliptical shape having the same major axis direction, and the contact pins are eccentric in a direction approaching each other. 5. The contact seat according to any one of claims 1 to 4, wherein the contact seat is pressed at a position that is eccentric in a direction away from the contact pin. The electronic component measuring apparatus described.

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