JP2006138790A - Measuring jig of electrical characteristic in integrated circuit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a measuring jig for measuring each kind of electrical characteristic by one measuring jig even if conditions, such as the size of a package, the pitch of pins, and the number of pins, are changed, when measuring the electrical characteristics of a BGA-type integrated circuit, or the like. <P>SOLUTION: The measuring jig measures various kinds of electrical characteristics while a group of probe pins erected on a test board are in contact with a group of solder balls in a surface mount type package type semiconductor integrated circuit. A prescribed solder ball and a probe pin are wired 25 between the group of solder balls 104 and the group of probe pins 201 by allowing the arrangement pitch of the group of probe pins to correspond to the ball pitch of the group of solder balls for interposing a pitch conversion substrate 20 to conduct electricity. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an integrated circuit electrical characteristic measuring jig, and particularly when measuring the electrical characteristics of a surface-mount package type semiconductor integrated circuit, conditions such as package size, pin pitch, and number of pins are changed. The present invention also relates to an integrated circuit electrical property measuring jig that can measure various electrical properties with a single unit.

  With the progress of high integration of semiconductor integrated circuits, a ball grid type package (hereinafter referred to as BGA), which is a kind of surface mount type package, is responded to the desire to give as many connection terminals as possible to a miniaturized package. ) Appeared. A semiconductor integrated circuit in which an IC chip is sealed in this BGA is a BGA type integrated circuit (see, for example, Patent Document 1).

4 is an external perspective view of an example of a BGA type integrated circuit, FIG. 5 is an enlarged cross-sectional view of the BGA type integrated circuit, and FIG. 6 is an external perspective view of a solder ball group.
As shown in FIGS. 4 to 6, the BGA type integrated circuit 100 having a square planar shape is provided with an integrated circuit (IC chip) 103 mounted on one surface of a substrate 101 by being sealed in a molding resin 102. A solder ball (ball grid) 104 is provided on the other surface. The integrated circuit 103 and the solder ball 104 are connected via a through hole 105.
A state in which a large number of individual solder balls 104 exist (for example, 1000) is referred to as a solder ball group.

  Before mass-producing the BGA type integrated circuit having the above configuration, a prototype of the BGA type integrated circuit is manufactured, various tests are performed, and whether or not the prototype satisfies the design specifications is tested. Within this test is a measurement of electrical properties.

FIG. 7 is a schematic exploded perspective view of an integrated circuit electrical characteristic measuring jig used for measuring electrical characteristics of a conventional prototype BGA type integrated circuit, and FIG. 8 is a side of the integrated circuit electrical characteristic measuring jig. It is sectional drawing.
As shown in FIGS. 7 and 8, the integrated circuit electrical property measuring jig 200 includes, for example, a test board 202 in which 1000 probe pins 201 are erected in a matrix, a fixed block 203, a plate 204, A coil spring 205 and a pressure lid 206 are provided.

The material of the test board 202 is glass epoxy resin, has a square shape, and is connected to an electrical property measuring instrument (not shown). The interval between the probe pins 201 erected in a matrix is 1 mm pitch.
The material of the fixed block 203 is aluminum, the planar shape is square, the side wall is surrounded by the periphery, and the fixed block recess 203a is formed. A through hole is formed in the bottom surface of the fixed block 203 corresponding to the standing position of the probe pin 201, and the probe pin 201 is inserted into each through hole.

  The plate 204 is made of vinyl chloride resin, has a square shape that can be inserted into the fixed block recess 203a, and the plate recess 204a is formed. Guide holes 204b are formed through the bottom surface of the plate 204 so as to correspond to the normal positions of the probe pins 201. The plate 204 is disposed above the probe pin 201 so as to be movable up and down. When the plate 204 is positioned below, the tip of the probe pin 201 is inserted into the guide hole 204b to stabilize the position of the probe pin 201. It is supposed to let you.

Coil springs 205 are disposed at the four corners of the fixed block recess 203a, respectively, and always urge the plate 204 upward.
The pressure lid 206 is made of aluminum and has a square shape that can be inserted into the plate recess 204a. When the BGA type integrated circuit 100 is loaded in the plate recess 204a, the pressure lid 206 is pressed from above. It has become.
By this pressing, all the solder balls 104 and the probe pins 201 are arranged in contact with each other and are brought into conduction with each other and can be measured by an electrical characteristic measuring device (not shown) via the test board 202.
Japanese Patent Laid-Open No. 11-176548

By the way, there are various types of BGA type integrated circuit prototypes in ball pitch size and external size.
For these various types of BGA type integrated circuits, the conventional integrated circuit electrical characteristic measuring jig 200 is adapted to the ball pitch size / outer size / number of pins used for measurement (the number of probe pins) of the BGA type integrated circuit, An integrated circuit electrical property measurement jig was developed.

In other words, when measuring BGA type integrated circuits that differ even under one of the ball pitch size and external size, you must develop a new integrated circuit electrical characteristic measurement jig. ) Could not be measured.
The necessity for new development of this integrated circuit electrical characteristic measuring jig is the same for a CSP (Chip Size Package) type semiconductor integrated circuit which is another surface mount type package type semiconductor integrated circuit.

  The present invention has been made to solve the above problems, and when measuring the electrical characteristics of a surface-mount package type semiconductor integrated circuit, conditions such as package size, pin pitch, and number of pins have changed. Another object of the present invention is to provide an integrated circuit electrical property measuring jig that can measure various electrical properties with a single unit.

In order to achieve this object, the invention according to claim 1 is directed to various types of electrical devices in a state where probe pins set up on a test board are in contact with solder balls of a surface-mount package type semiconductor integrated circuit. In an integrated circuit electrical property measurement jig for measuring properties,
Between the solder ball group (the solder ball 104 in FIG. 1) and the probe pin group (probe pin 201), the ball pitch (for example, 1.27 mm) of the solder ball group is changed to the arrangement pitch (for example, 1 mm) of the probe pin group. ), And a pitch conversion board (conversion board 20) in which a predetermined solder ball and a predetermined probe pin are electrically connected is interposed.

  The above configuration is illustrated in FIGS. 1 and 2, for example. In this way, when the arrangement pitch of the probe pin group is 1 mm, for example, and the ball pitch of the solder ball group is 1.27 mm, for example, the conversion board 20 is interposed, and the solder ball 104 corresponding to the wiring 25 is connected. Since the probe pin 201 is connected, if only the conversion substrate 20 is changed, the electrical characteristic measurement of a semiconductor integrated circuit having a different solder ball pitch or the number of solder balls can be performed with a single integrated circuit electrical characteristic measurement jig. It can be carried out.

  In the case of the conventional example (see FIGS. 7 and 8), it is necessary to newly develop the test board 202, the plate 204, the fixed block 203, and the pressure lid 206 according to the BGA type integrated circuit 100. However, according to the present invention, since only the conversion substrate 20 needs to be newly developed, the development period and cost of the integrated circuit electrical characteristic measuring jig can be greatly reduced.

The invention described in claim 2 is the integrated circuit electrical property measuring jig according to claim 1,
The pitch conversion board (conversion board 20) includes wiring therein, and the wiring (reference numeral 25 in FIG. 2) is an isotonic wiring.

  The above configuration is illustrated in FIG. 2, for example. In this case, the ball receiving round 24 that contacts the solder ball 104 and the round 22 that contacts the probe pin 201 are isotonic wirings (wirings having the same wiring length). Can be made equal to each other, and accurate electrical characteristic measurement can be performed.

According to a third aspect of the present invention, there is provided the integrated circuit electrical characteristic measuring jig according to the first or second aspect,
A configuration comprising probe pin stabilization means (plate 204A) for standing the probe pin group in a stable state between the probe pin group (probe pin 201 in FIG. 1) and the pitch conversion substrate (conversion substrate 20). It is as.

  The above configuration is illustrated in FIG. 1, for example. In this way, since the plate 204A includes the guide hole 204b for stably standing the probe pin 201, stable contact between the probe pin 201 and the round 22 of the conversion substrate 20 can be ensured.

The invention according to claim 4 is the integrated circuit electrical property measuring jig according to any one of claims 1 to 3,
A pressing means (pressure lid 206) for pressing and securing the contact state between the solder balls (104), the pitch conversion board (conversion board 20) and the probe pin (201) is provided, and the pressing means uses the semiconductor integrated circuit ( When the BGA type integrated circuit 100B) of FIG. 3 is pressed, the semiconductor integrated circuit is provided with side surface stabilizing means (outside fixing adjusting screw 31) for fixing the semiconductor integrated circuit in a stable state from the side surface.

  The above configuration is illustrated in FIGS. 2 and 3, for example. In this way, even if the size of the BGA type integrated circuit 100B is small, the BGA type integrated circuit 100B is pressed and fixed from the side surface by the outer shape fixing adjustment screw 31, so that the solder ball 104 is measured at the time of measurement. And the contact state of the conversion substrate 20 with the ball receiving round 24 can be secured satisfactorily.

  According to the first aspect of the present invention, the electrical characteristics of semiconductor integrated circuits having different solder ball pitches and different numbers of solder balls can be measured with a single integrated circuit electrical characteristic measuring jig by changing only the pitch conversion substrate. be able to. In addition, since only a pitch conversion substrate needs to be newly developed, the development period and cost of the integrated circuit electrical characteristic measuring jig can be greatly reduced.

According to the second aspect of the present invention, since the internal wiring of the pitch conversion board is isotonic wiring (wiring having the same wiring length), the speed at which the electric signal is transmitted can be made equal, and the electrical Characteristic measurements can be made.
According to the third aspect of the present invention, since the probe pin stabilizing means (plate) includes the guide hole for stabilizing the probe pin, stable contact between the probe pin and the contact terminal (round) of the pitch conversion board can be ensured.

  According to the fourth aspect of the present invention, even when the size of the BGA type integrated circuit is small, the BGA type integrated circuit is pressed and fixed from the side surface by the side surface stabilizing means (outer shape fixing adjusting screw). In this case, it is possible to satisfactorily ensure the contact state between the solder balls and the contact terminals (ball receiving rounds) of the pitch conversion board.

Hereinafter, the “integrated circuit electrical characteristic measuring jig” of the present invention will be described based on the illustrated embodiment.
(1) First Embodiment FIG. 1 is a side sectional view of the present embodiment, and FIG. 2 is a side sectional view of a conversion substrate used in the present embodiment. In addition, the same code | symbol is attached | subjected to the already demonstrated member, and duplication description is abbreviate | omitted.

  As shown in FIG. 1, the integrated circuit electrical property measuring jig 10 includes a test board 202 having 1000 probe pins 201 erected in a matrix, a conversion board 20, a fixed block 203A, a plate 204A, The coil spring 205 and the pressure lid 206 are provided.

  In the present embodiment, the number of probe pins 201 is 1000, but it is preferable to increase the number of probes as much as possible (for example, 2000). If the number of probe pins is increased in this way, even if the number of solder balls of the BGA type integrated circuit increases, the electrical characteristics of various BGA type integrated circuits with different numbers of solder balls can be measured with one conversion board. Can be performed.

  The electrical characteristic measurement using this integrated circuit electrical characteristic measuring jig 10 is a BGA type integrated circuit 100A having, for example, 700 solder balls 104 in a matrix, and the pitch between the solder balls is 1.27 mm.

  As shown in FIG. 2, the conversion substrate 20 is made of glass epoxy resin, and 1000 rounds (contact terminals) 22 are fixed on the lower surface of the substrate body 21 in a matrix corresponding to the probe pins 201. The vertical and horizontal pitch between rounds is 1 mm.

  Further, 700 ball receiving recesses 23 are formed in a matrix at a pitch of 1.27 mm on the upper surface of the substrate body 21 corresponding to the positions of the solder balls 104 of the BGA type integrated circuit 100A. A ball receiving round 24 as a contact terminal is fixed to the bottom surface of the ball receiving recess 23. As described above, since the spherical portion of the solder ball 104 is configured to fit into the ball receiving recess 23, the solder ball 104 and the ball receiving recess 23 are not misaligned. Therefore, the solder ball 104 and the ball receiving round 24 are surely brought into conductive contact when the pressurizing lid 206 described below is pressed downward.

Inside the substrate body 21, the round 22 and the ball receiving round 24 are connected by wiring (isotonic wiring: wiring of equal length) 25. As described above, since isotonic wiring is performed inside the substrate body, the speeds of transmission of electrical signals between the individually corresponding solder balls 104 and probe pins 201 can be all made equal.
By configuring the conversion substrate 20 as described above, the solder balls 104 having a pitch of 1.27 mm can be converted into an array of probe pins 201 having a pitch of 1 mm.

Next, differences between the fixed block 203 and the plate 204 of the conventional example (see FIGS. 7 and 8) and the fixed block 203A and the plate 204A of the present embodiment will be described.
The fixed block 203A of the present embodiment has the same dimensions, area, and material as the conventional block except that the height of the side wall surrounding the fixed block 203A is slightly higher than that of the conventional example.

In the conventional plate 204, the plate recess 204a is formed so as to surround the periphery. However, the plate 204A of the present embodiment does not surround the periphery and is a flat plate. In the case of the conventional example, when the plate is a flat plate, when the coil spring 205 is biased upward, the plate spring may be tilted to the left and right.
On the other hand, in the case of the present embodiment, since the conversion substrate 20 having a thickness (for example, 10 mm) is disposed immediately above the plate 204A, even if the plate 204A is biased upward by the coil spring 205, the plate 204A There is no risk of tilting left and right.

Next, the operation of this embodiment will be described.
In the state shown in FIG. 1, first, the BGA type integrated circuit 100A is placed on the conversion substrate 20 with the solder ball 104 side down. At this time, the BGA type integrated circuit 100 </ b> A is moved lightly left and right and back and forth so that each solder ball 104 is inserted into the corresponding ball receiving recess 23. By this left-right back-and-forth movement, each solder ball enters the corresponding ball receiving recess 23.

  Next, when the pressure lid 206 is pushed downward, the BGA type integrated circuit 100A, the conversion substrate 20 and the plate 204A are pushed downward. Then, the corresponding solder ball 104 and the ball receiving round 24 first come into contact and become conductive, and when the pressure lid 206 is further pushed in, the corresponding round 22 and the probe pin 201 eventually come into contact. It becomes possible to conduct.

  That is, even if the arrangement pitches of both the solder balls 104 of the BGA type integrated circuit 100A and the probe pins 201 are different, the solder balls 104 and the probe pins 201 are in a conductive state. It is possible to perform a predetermined electrical characteristic measurement by a device (not shown).

(2) Second Embodiment FIG. 3 is a side sectional view of the present embodiment.
The difference between the integrated circuit electrical property measurement jig 10A of the present embodiment and the integrated circuit electrical property measurement jig 10 of the first embodiment is that the side wall of the fixed block 203B is slightly lowered, That is, the external shape fixing adjustment screws 31 are arranged on the side walls so as to be screwable.
Further, the BGA type integrated circuit 100B applied to the integrated circuit electrical characteristic measuring jig 10A of the present embodiment is slightly smaller in outer shape than the BGA type integrated circuit 100A and has fewer solder balls (for example, 500 pieces). .

Next, the operation of this embodiment will be described.
In a state in which the distance between the outer shape fixing adjustment screws 31 is increased, the BGA type integrated circuit 100B is placed on the conversion substrate 20, and the BGA type integrated circuit 100B is lightly shaken back and forth and left and right, and each solder ball 104 is moved. Lightly fit into the corresponding ball receiving recess 23.

  Next, in a state where the pressure lid 206 is pressed down, the four outer shape fixing adjustment screws 31 are firmly screwed in, and the BGA type integrated circuit 100B is fixed so as to be displaced from side to side. Accordingly, since the solder ball 104 and the ball receiving round 24 are not misaligned during the measurement, it is possible to perform an accurate electrical characteristic measurement as in the first embodiment.

  In the second embodiment, the case where the solder ball pitch of the BGA type integrated circuit is 1.27 mm and the probe pin pitch is 1 mm has been described. However, when the solder ball pitch and the probe pin pitch are the same (for example, both pitches are 1 mm), the conversion substrate 20 is removed, the solder ball 104 and the probe pin 201 corresponding to each other are brought into contact with each other, and the pressure lid 206 is pressed. In the state of pressing down, four external shape fixing adjustment screws 31 are screwed to fix the BGA type integrated circuit 100B. The electrical characteristics may be measured in this fixed state.

  In the first and second embodiments, the case of the BGA type integrated circuit has been described. However, the present invention can be applied to any surface mount type package type semiconductor integrated circuit using a CSP package or the like. Of course.

It is side sectional drawing of 1st embodiment of this invention. It is a sectional side view of the conversion board used for the first embodiment. It is a sectional side view of the second embodiment of the present invention. It is an external appearance perspective view of an example of a BGA type integrated circuit. It is an expanded sectional view of the BGA type integrated circuit. It is an external appearance perspective view of the solder ball group in the BGA type integrated circuit. It is a general | schematic disassembled perspective view of the integrated circuit electrical property measurement jig | tool used for the electrical property measurement of the BGA type integrated circuit of the conventional prototype. It is a sectional side view of the integrated circuit electrical property measuring jig.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Integrated circuit electrical property measurement jig | tool of 1st embodiment 10A Integrated circuit electrical property measurement jig | tool of 2nd embodiment 20 Conversion board | substrate 21 Substrate body 22 Round (contact terminal)
23 Ball receiving recess 24 Ball receiving round 25 Wiring (isotonic wiring)
31 External fixing screw 100A BGA type integrated circuit used in the first embodiment 100B BGA type integrated circuit used in the second embodiment 203A Fixed block used in the first embodiment 203B Used in the second embodiment Fixed block 204A plate used in the first embodiment 100 BGA type integrated circuit 101 substrate 102 molding resin 103 integrated circuit (IC chip)
DESCRIPTION OF SYMBOLS 104 Solder ball 105 Through hole 200 Conventional integrated circuit electrical property measuring jig 201 Probe pin 202 Test board 203 Fixed block 203a Fixed block recessed part 204 Plate 204a Plate recessed part 204b Guide hole 205 Coil spring 206 Pressure cover

Claims (4)

In an integrated circuit electrical property measurement jig for measuring various electrical characteristics in a state where probe ball groups erected on a test board are in contact with solder balls of a surface-mount package type semiconductor integrated circuit,
Between the solder ball group and the probe pin group, a pitch conversion board in which the ball pitch of the solder ball group is adapted to the arrangement pitch of the probe pin group and the predetermined solder ball and the predetermined probe pin are electrically connected is interposed. An integrated circuit electrical characteristic measuring jig characterized by being made. The integrated circuit electrical property measurement jig according to claim 1,
The integrated circuit electrical characteristic measuring jig according to claim 1, wherein the pitch conversion board includes wiring therein, and the wiring is isotonic wiring. In the integrated circuit electrical property measuring jig according to claim 1 or 2,
An integrated circuit electrical characteristic measurement jig comprising probe pin stabilizing means for standingly standing the probe pin group in a stable state between the probe pin group and the pitch conversion board. In the integrated circuit electrical property measuring jig according to any one of claims 1 to 3,
A pressing means for pressing and securing the contact state between the solder ball, the pitch conversion substrate and the probe pin is provided, and when the semiconductor integrated circuit is pressed by the pressing means, the semiconductor integrated circuit is fixed in a stable state from the side. An integrated circuit electrical characteristic measuring jig comprising a side stabilization means.

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