JP2007078456A - IC socket and IC tester using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize an IC socket capable of testing accurately and an IC tester using the same.
The present invention is an improvement in an IC socket to which an IC package having a plurality of spherical or planar leads is attached. This device has a socket body on which an elastic contact pin is mounted, a conductor attached to the upper surface of the socket body, and electrically connected to the spherical or planar lead and electrically connected to the contact pin. An apparatus comprising: a sheet in which at least two conductors are electrically connected to each other.
[Selection] Figure 1

Description

  The present invention relates to an IC socket to which an IC package having a spherical or planar lead is attached and an IC tester using the same, and more particularly to an IC socket capable of performing a test with accuracy and an IC tester using the same.

  An IC package incorporating an IC chip was provided with lead pins. However, with the high integration, an IC package (BGA (Ball Grid Array) package) instead of a spherical lead made of solder has come to be used. When testing this BGA package with an IC tester, the test is performed with the BGA package attached to an IC socket. Such an IC socket is described in Patent Documents 1 and 2, for example.

JP-A-8-148247 JP 2005-166477 A

  Patent Document 1 is an elastic contact pin that makes electrical contact with a spherical lead. In Patent Document 2, the spherical lead of the IC package is inserted into the hole of the through-hole conductor, and electrical connection is made with the spherical lead, the through-hole conductor, and an elastic contact pin. Suppressed.

  In Patent Documents 1 and 2, such a contact pin has a curved shape or a spring shape in order to provide elasticity. For this reason, the IC socket sacrifices the resistance of the contact pin when electrically connecting the printed circuit board and the IC package.

  As a result, even if a desired voltage is applied to the IC socket, the voltage applied to the IC package is not an expected voltage because the contact pin is interposed. In recent years, IC packages have spherical power leads or grounds that are equal to or more than the number of signals, and even if the same power supply voltage is intended, there is a problem that the same power supply voltage cannot be obtained due to the contact pin resistance. .

  Accordingly, an object of the present invention is to realize an IC socket capable of performing a test with high accuracy and an IC tester using the same.

In order to achieve such a problem, the invention according to claim 1 of the present invention is:
In an IC socket to which an IC package having a plurality of spherical or planar leads is attached,
A socket body for mounting elastic contact pins;
A sheet attached to the upper surface of the socket main body, having a conductor electrically connected to the spherical or planar lead and electrically connected to the contact pin, and at least two conductors electrically connected; An IC socket characterized by comprising:
The invention according to claim 2
In an IC socket to which an IC package having a plurality of spherical or planar leads is attached,
A socket body for mounting elastic contact pins;
A sheet attached to the upper surface of the socket body, having a conductor electrically connected to the spherical or planar lead and electrically connected to the contact pin;
And a wiring pattern provided on the sheet for electrically extracting a signal of the conductor.
The invention described in claim 3
In an IC socket to which an IC package having a plurality of spherical or planar leads is attached,
A socket body for mounting elastic contact pins in the through holes;
A sheet attached to the upper surface of the socket body, having a conductor electrically connected to the spherical or planar lead and electrically connected to the contact pin;
A flexible wiring sheet that is attached around the sheet and electrically connected to a printed circuit board to which the socket body is attached is provided.
Invention of Claim 4 is invention in any one of Claims 1-3, Comprising:
The sheet is a flexible printed circuit board.
The invention according to claim 5 is an IC tester,
The IC socket according to any one of claims 1 to 4 is used.
The invention described in claim 6
An IC tester using the IC socket according to claim 2,
The source line is electrically connected to the sheet conductor, the sense line is electrically connected to the wiring pattern for taking out the sheet conductor signal, and the current or voltage is output via the source line and measured by the sense line. It is a feature that a current voltage output unit for performing the above is provided.

The present invention has the following effects.
(1) Since the conductors are electrically connected by the sheet, the resistance between the IC pins can be reduced without being influenced by the resistance of the contact pins, and a test with high IC operation accuracy can be performed.
(2) Since the source line is electrically connected to the conductor and the sense line is electrically connected to the wiring pattern, the signal of the source line is controlled while monitoring the signal of the conductor from the sense line, so that the IC Tests with high accuracy of operation can be performed.
(3) Since the flexible wiring sheet can be connected to the IC package without using a contact pin, a load or the like can be connected without being affected by the resistance of the contact pin, and a highly accurate test can be performed. .
(4) Since the current / voltage output unit electrically connects the source line to the conductor and the sense line to the wiring pattern via the contact pin, a highly accurate test can be performed.

  Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 1 is a block diagram showing an embodiment of the present invention.

  In FIG. 1, the BGA package 1 is provided with a plurality of spherical leads 11. The socket body 2 mounts contact pins 23 having elasticity in through holes 21 and 22 provided vertically at a predetermined pitch. The contact pin 23 includes a contact portion 231, a curved portion 232, and a terminal portion 233. The contact portion 231 is inserted into the through hole 21. The curved portion 232 is connected to the contact portion 231 and one end, is curved in a substantially C shape, and is given an elastic force. One end of the terminal portion 233 is connected to the other end of the curved portion 232, and the other end is inserted into the through hole 22. The printed circuit board 3 is electrically connected to a test head of an IC tester (not shown), the socket body 2 is attached by screwing, and is electrically connected to the terminal portion 233 of the contact pin 23.

  The flexible printed circuit board 4 is a sheet, is attached to the upper surface of the socket body 2, and has a plurality of through-hole conductors 41 that are electrically connected to the spherical leads 11 and electrically connected to the contact pins 23. The flexible printed circuit board 4 is provided with a plurality of holes 42 as shown in the top view of FIG. The through-hole conductor 41 is formed with lands on the upper and lower sides of the flexible printed circuit board 4. For example, copper is plated with gold so that the lands are electrically connected to each other, and the diameter of the spherical lead 11 is about 80%. Is set to the diameter of The through-hole conductors 41a and 41b are electrically connected to each other by the copper pattern 43, and the through-hole conductor 41a is electrically connected to the spherical lead 11 of the BGA package 1, but the through-hole conductor 41b is It is not electrically connected to the spherical lead 11.

  The current / voltage output unit 5 is provided in an IC tester (not shown), electrically connects the source line 51 to the through-hole conductor 41a via the printed circuit board 3 and the contact pin 23a, and passes through the printed circuit board 3 and the contact pin 23b. Then, the sense line 52 is electrically connected to the through-hole conductor 41b, current or voltage is output through the source line, and measurement is performed with the sense line.

  The operation of such an apparatus will be described. The BGA package 1 is pressed from above, and the spherical lead 11 is guided to the hole of the through-hole conductor 41. Further, when the BGA package 1 is pushed, the flexible printed board 4 is pushed through the spherical leads 11, and the through-hole conductor 41 of the flexible printed board 4 comes into contact with the contact portion 231 of the contact pin 23. Further, the curved portion 232 of the contact pin 23 is deformed, and electrical connection between the spherical lead 11 and the contact pin 23 is realized through the through-hole conductor 41. As a result, the spherical lead 11, the through-hole conductor 41, and the contact pin 23 can be electrically connected, and the BGA package 1 and the printed circuit board 3 are electrically connected.

  Then, the IC tester performs a test on the BGA package 1. Here, the test by the current voltage output unit 5 of the IC tester will be described. The current / voltage output unit 5 supplies current or voltage to the spherical lead 11 of the BGA package 1 through the source line 51, the printed circuit board 3, the contact pin 23a, and the through-hole conductor 41a. At this time, the current-voltage output unit 5 measures the current or voltage in the spherical lead 41a from the sense line 52 through the through-hole conductor 41a, the copper pattern 43, the through-hole conductor 41b, the contact pin 23b, and the printed board 3. .

  In this way, since the signal of the through-hole conductor 41a is connected so as to be taken out from the through-hole conductor 41b with high accuracy, the current / voltage output or the accurate output without taking into consideration the influence of the resistance of the contact pins 23a and 23b. Measurement can be performed and a test with high accuracy can be performed.

Next, a second embodiment will be described with reference to FIG.
In FIG. 3, a flexible printed circuit board 6 is provided in place of the flexible printed circuit board 4, is attached to the upper surface of the socket body 2, and is a through hole that is electrically connected to the spherical lead 11 and electrically connected to the contact pin 23. A conductor 61 is provided. Similar to the through-hole conductor 41, the through-hole conductor 61 has lands formed on the upper and lower sides of the flexible printed circuit board 6, and has a diameter of about 80% of the diameter of the spherical lead 11 so as to electrically connect the lands. Set to diameter. Further, as shown in FIG. 4, the through-hole conductors 61 a to 61 c are electrically connected by a copper pattern layer 62 inside the flexible printed board 6.

  The connection of such a device to the socket body 2 of the BGA package 1 is the same as the device shown in FIGS. Since the spherical leads 11 of the BGA package 1 are electrically connected to each other via the through-hole conductors 61a to 61c and the copper pattern layer 62 on the flexible printed circuit board 6, the printed circuit board 3 is connected from an IC tester (not shown). When the ground voltage is applied to the contact pin 23 and the through-hole conductor 61a, the same ground voltage is applied to the through-hole conductors 61b and 62c through the copper pattern layer 62.

  Thereby, the same ground voltage can be given to the spherical lead 11 electrically connected to the through-hole conductors 61a to 61c. That is, the BGA package 1 can be tested in the same state as when the BGA package 1 is actually mounted on a printed circuit board without being affected by the resistance of the contact pins 23.

  Next, a third embodiment will be described with reference to FIG. In FIG. 5, a flexible printed circuit board 7 is provided in place of the flexible printed circuit board 6, has a through-hole conductor similar to that described above, and is flexible so as to be electrically connected to the printed circuit board 3 around the flexible printed circuit board 7. A wiring sheet 71 is provided.

  The connection of such a device to the socket body 2 of the BGA package 1 is the same as the device shown in FIGS. The flexible wiring sheet 71 allows the printed circuit board 3 and the flexible printed circuit board 7 to be electrically connected without using the contact pins of the socket body 2. As a result, a load or the like for the BGA package is provided on the printed circuit board 3, and the load or the like for the BGA package can be realized without using a contact pin that increases the resistance value, and a test with high accuracy can be performed. it can.

  The present invention is not limited to this, and the configuration in which the through hole 22 having a gap with the terminal portion 233 of the contact pin 23 is provided in the socket body 2 is shown, but a configuration without a gap may be used.

  Moreover, although the contact pin 23 showed the structure which provides elasticity by the curved part 232, you may make it a coil spring. The contact pin 23 may be a spring pin having a spring inside.

  Moreover, although BGA was shown as IC package, LGA (Land Grid Array), WLCSP (Wafer Level Chip Scale Package), etc. may be sufficient. Further, not a spherical lead but a planar lead may be used.

  Moreover, although the example of the flexible printed circuit board 4 was shown, a normal printed circuit board may be used.

  Moreover, as shown in Patent Document 2, for example, a configuration in which a sheet-like elastic rubber such as silicon rubber is provided may be used. The elastic rubber is provided between the upper surface of the socket body 2 and the flexible printed circuit board 4 and is provided with a through hole into which the contact pin 23 is inserted.

  Moreover, although the copper pattern 43 and the copper pattern layer 62 showed the example formed with copper, aluminum, gold | metal | money, etc. may be sufficient. In short, any wiring pattern may be used as long as electricity is applied.

  1 and 2, the through-hole conductors 41a and 41b are connected to each other, and the source line 51 and the sense line 52 of the current-voltage output unit 5 are electrically connected to the through-hole conductors 41a and 41b. However, the present invention is not limited to this, and the following may be used. The source line 51 is electrically connected to the BGA package 1 via the contact pin 23a and the through-hole conductor 41a, and the sense line 52 is electrically connected to the contact pin 23b and the flexible printed board 41b (copper pattern 43). Then, it is electrically connected to the through-hole conductor 41 a through the copper pattern 43. That is, a configuration in which the through-hole conductor 41a is not provided may be used. Moreover, the structure which does not connect via the contact pin 23b may be sufficient, and the structure which can be electrically connected with a sense line and the through-hole conductor 41a should just be sufficient.

  Moreover, although the through-hole conductors 41 and 61 are shown, a conductor without a hole may be used.

1 is a structural cross-sectional view showing a first embodiment of the present invention. It is a top view of the flexible printed circuit board 4 of the apparatus shown in FIG. It is the structure sectional drawing which showed the 2nd Example of this invention. It is a top view of the flexible printed circuit board 6 of the apparatus shown in FIG. It is the structure perspective view which showed the 3rd Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 BGA package 11 Spherical lead 2 Socket body 23 Contact pin 3 Printed circuit board 4, 6, 7 Flexible printed circuit board 41, 61 Through-hole conductor 43 Copper pattern 5 Current voltage output part 62 Copper pattern layer 71 Flexible wiring sheet

Claims (6)

In an IC socket to which an IC package having a plurality of spherical or planar leads is attached,
A socket body for mounting elastic contact pins;
A sheet attached to the upper surface of the socket main body, having a conductor electrically connected to the spherical or planar lead and electrically connected to the contact pin, and at least two conductors electrically connected; An IC socket characterized by comprising: In an IC socket to which an IC package having a plurality of spherical or planar leads is attached,
A socket body for mounting elastic contact pins;
A sheet attached to the upper surface of the socket body, having a conductor electrically connected to the spherical or planar lead and electrically connected to the contact pin;
An IC socket, comprising: a wiring pattern provided on the sheet for electrically extracting a signal of the conductor. In an IC socket to which an IC package having a plurality of spherical or planar leads is attached,
A socket body for mounting elastic contact pins in the through holes;
A sheet attached to the upper surface of the socket body, having a conductor electrically connected to the spherical or planar lead and electrically connected to the contact pin;
An IC socket comprising: a flexible wiring sheet attached to a periphery of the sheet and electrically connected to a printed circuit board to which the socket body is attached.   The IC socket according to claim 1, wherein the sheet is a flexible printed circuit board.   An IC tester using the IC socket according to claim 1. An IC tester using the IC socket according to claim 2,
The source line is electrically connected to the sheet conductor, the sense line is electrically connected to the wiring pattern for taking out the sheet conductor signal, and the current or voltage is output via the source line and measured by the sense line. An IC tester provided with a current-voltage output unit for performing the above.

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