JPH04199864A - Burn in substrate wiring check device - Google Patents

Abstract

PURPOSE:To make it possible to check for a burn in substrate wiring even when a pin to pin span is narrowed by thrusting a prove card from above under such a condition that a check device is mounted on said burn in substrate and carrying out wiring check. CONSTITUTION:When an attempt is made to carry out wiring check for a burn in substrate 1 to which a capless IC socket 3 is mounted, an IC package 9 for a 'burn in substrate 1' check device is mounted to the capless IC socket 3. Then, a probe card 5 is thrust thereto from the upper part of the IC package 9 where bobbin pins 6a and 6b for the probe card 5 are brought into contact with pads 11a and 11b of the IC package 9 so as to carry out wiring check. When wiring check is carried out, using the burn in substrate 1 device in this manner, it is possible to prevent the bending of the pins of the capless of the IC package, improve the contact failure of the bobbing pins. It is also possible to meet with such a case even when the pin to pin span of the IC socket is reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to checking the wiring of a burn-in board on which a lidless SMD package socket (hereinafter referred to as an IC socket) is mounted.

[Conventional technology]

FIG. 4 is a sectional view of a burn-in board on which a conventional lidded IC socket is mounted when checking the wiring, and FIG. 5 is a partially enlarged sectional view of a probe card used for checking the wiring of the burn-in board.

In the figure, (1) is a burn-in board, (2a), (2
b) is the pattern inside the burn-in board (1), (3) is the IC socket with lid mounted on the burn-in board (1),
(4a) and (4b) are the pins inside the IC socket with lid (3), (5) is the probe card, (6) is the pogo pin of the probe card (5), (7a) and (7b) are the tester (
(8) is a signal line to the tester.

Next, the operation will be explained.

When implementing the wiring check of the burn-in board + 1) on which the IC socket with lid (3) is mounted as shown in Figure 4,
The wiring was checked by pressing the probe card (5) from above into contact with the C socket (3). In this case, the wiring check is from the signal line (7a) from the tester.
) (7b), the pogo pin (6) inside the probe card (5), the IC socket with lid (3), and the internal bottle (4a).
) (4b), pattern (2) inside burn-in board (1)
), it can be implemented by checking the continuity of the signal lines (8a) and (8b) to the tester.

[Invention or problem to be solved]

The wiring check for a burn-in board mounted with a conventional IC socket with a lid was configured as described above, so for a burn-in board mounted with an IC socket without a lid, the pin shape of the IC socket is different, so the wiring check of the IC socket without a lid is If you press the pogo pin from the top, the pin may bend.
Further, there are problems in that the pogo pins do not come into contact with each other, and that there is a limit to the pitch of the pogo pins when the pitch between the pins becomes narrow.

This invention was made to solve the above-mentioned problems, and it eliminates the bending of the pins when checking the wiring of a burn-in board mounted with a lidless IC socket, and also eliminates poor contact between pogo pins and pins. To make it possible to check the wiring of a burn-in board even when the pitch between the burn-in boards becomes narrow.

[Means to solve the problem]

The burn-in board checking device according to the present invention includes:
The IC package has a pad on the top, and the lead of the IC package and the top pad are wired as a pair inside the IC package, and this burn-in board checking device is mounted on a burn-in board with a lidless IC socket mounted. In this state, the probe card is pressed from above to check the wiring.

[Effect]

The burn-in board checking device of the present invention prevents the pins of the lidless IC socket from bending, improves the poor contact of the pogo pin of the probe, and Wiring can be checked even if the pitch between the bins is narrow.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

Figure 1 is a cross-sectional view of a burn-in board mounted with a lidless IC socket, which is an embodiment of the present invention, during wiring check. FIG. 3 is a top view of the burn-in board checking device used.

In the figure, (1) is a burn-in board, (2a) (2b
) is the pattern inside the burn-in board (1), (3) is the lidless IC socket mounted on the burn-in board (1),
(4a) (4b) are the pins inside the lidless IC socket (3), (5) is the probe card, (6a) (6b) are the pogo pins of the probe card (5), (7a) and (7b) are the pins from the tester. Signal line, (8aX8b) is the signal line to the tester, (9) is the IC package, (10a) (
10b) is the lead of the IC package (9), (lla)
(llb) is the pad on the top of the IC package (9), (1
2a) (12b) is the gold wire inside the IC package (9).

Next, the operation will be explained.

When implementing a wiring check on the burn-in board (1) mounted with the lidless IC socket (3) shown in Fig. 1, the IC package (9) of the burn-in board check device is mounted on the lidless IC socket, and the probe card (5
) from the top of the IC package (9) and check the wiring by bringing the pogo pins (6a) (6b) of the probe card (5) into contact with the pads (lla) (llb) of the IC package (9). implement. In this case, check the wiring from the signal lines (7a) (7b) from the tester.
Pogo pins (6a) (6b) inside the probe card (5)
, IC package (9) upper butt (lla) (Il
b), Gold wire (+2a) (12b) inside the IC package
, IC package (9) REIT' (10a) (10
b), IC socket without lid (3) internal pin (4a)
(4b), pattern inside the burn-in board (2a) (2
b) This can be done by checking the continuity of the signal lines (8a) and (8b) to the tester.

In the above embodiment, the pads (lla) (llb) on the top of the IC package (9) of the device for checking the burn-in board are in the - column as shown in FIG. 9) Pad (lla) (llb
) may be placed on the top surface of the IC package (9).

In FIGS. 2 and 3, the leads (10a) (10b) of the IC package (9) are shown leading out in four directions.
Similar effects can be obtained even when b) is in two directions.

〔Effect of the invention〕

As described above, according to the present invention, if a wiring check is performed using a burn-in board check device, bending of pins of a lidless IC socket can be prevented, contact failure of pogo pins can be reduced, and burn-in board check can be performed. By changing the position of the upper pad of the device used, it is possible to cope with the narrowing of the pitch between the pins of the IC socket without a lid.

In addition, even in different types of packages with the same number of pins, if the position of the pogo pins of the probe card is the same, it is possible to share them.

[Brief explanation of the drawing]

Fig. 1 is a cross-sectional view of a burn-in board mounted with a lidless IC socket, which is an embodiment of the present invention, when checking the wiring, and Figs. A top view of the burn-in board checking device used, FIG. 4 is a cross-sectional view of a burn-in board mounted with a conventional lidless IC socket during wiring check, and FIG. 5 is a partially enlarged cross-sectional view of a pogo pin of a probe card. In the figure, (1) is a burn-in board, (2a) to (2
b) Haha turn, (3) is IC socket, (4a) ~ (
4b) Hahin, (5) is a probe card, (6a) ~ (
6b) is the pogo pin, (7a) to (7b) are the signal lines of the tester, (8a) to (8b) are the signal lines to the tester, (9) is the IC package, (10a) to (10)
b) indicates a lead, (Ila) to (Ilb) indicate a bat, and (12a) to (+2b) indicate a gold wire. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

[Claims] Conducted a wiring check on a burn-in board with a lidless IC socket mounted using an IC package device that has a pad on the top of the IC package, and the leads of the IC package are wired as a pair inside the IC package. A device for checking burn-in board wiring, which is characterized by: