JPH0250450A - Semiconductor characteristics measurement - Google Patents

Abstract

PURPOSE:To make it unnecessary to change probe needles for respective types of measuring objects by a method wherein pad coordinate positions are inputted beforehand and the probe needle parts are moved in accordance with the input data to obtain the contacts between the pads and the probe needles. CONSTITUTION:While a semiconductor device 1 formed on a wafer is still on the wafer, measurement probe needles 3 fixed to pad coordinate positions beforehand are brought into contact with bonding pads 2 to measure the characteristics of the device 1. By this method, the pad coordinate positions are inputted beforehand and the probe needle parts are moved in accordance with the input data to obtain the contacts between the pads 2 and the probe needles 3. In other words, the measuring apparatus side probe needles are aligned with the pad positions on the chip automatically. With this constitution, it is not necessary to change the needles for the respective types of the measuring objects before the measurement and trouble of designing and manufacturing probe cards for the respective types can be omitted.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for measuring the characteristics of a semiconductor device, and particularly to a method for measuring the electrical characteristics of a device on a wafer.

(Prior Art) Conventionally, this type of device has been designed so that measurement probes 3, 3, . . . come into contact with pad position coordinates determined in advance by each semiconductor element 1, as shown in FIGS. The designed probe fixing card 4 is fixed to the device, and by vertical movement of the card, the pad of the semiconductor element 1 on the measurement stage 5 and the measurement probe 3 are fixed.
maintained contact with.

[Problem to be solved by the invention]

In the conventional apparatus described above, since the pad coordinates differ depending on the product type, a card board to which the probe is fixed must be designed and manufactured for each product type. Therefore.

In actual measurements, it is necessary to replace the probe for each type of product, which poses a problem in that it is costly.

An object of the present invention is to provide a method for measuring semiconductor characteristics that solves the above problems.

[Differences between the invention and the prior art]

The present invention differs from the conventional measurement method described above in that a probe is mounted on the device itself and the pad position is automatically recognized.

C'all! Means for Solving %I] To achieve the above object, the present invention involves bringing a measurement probe fixed in advance at a pad coordinate position into contact with a bonding pad while keeping a semiconductor element formed on a wafer in a wafer state; In the method of measuring characteristics, the pad seat position is input in advance.

Based on this data, the probe is moved to bring the pad into contact with the probe.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view showing the relationship between an element and a measuring probe in a measuring state in the measuring method of the present invention, and FIG. 2 is a side view of the same. By the way, the semiconductor manufacturing apparatus of the present invention has a function of mechanically and automatically aligning the pad position of the chip on the wafer and the position of the probe on the measuring device side. First, the position of the bonding pad 2 on the semiconductor element 1 is stored in advance in the device memory in three-dimensional coordinates (xtyyZ).When actually measuring, the coordinates stored in the memory can be used for each product type. After reading, the measuring probe 3 is set on the pad 2. In this case, since the number of bins differs depending on the product type, the probe closest to the position of the pad 2 is calculated internally, and that probe 3 is activated. When measuring each chip on the entire wafer, alignment between the probe and the moving direction of the chip is performed by correction operations at several points on the wafer, as in the conventional method. Furthermore, the pitch of the probes is set at a position of approximately several tens of pitches.

〔Effect of the invention〕

As explained above, in measuring the electrical characteristics of semiconductor devices, the present invention automatically aligns the pad position on the chip with the measurement probe on the equipment side, thereby eliminating the need to replace the probe for each type of device before measurement. This also has the effect of eliminating the trouble of designing and manufacturing probe cards for each type.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing the relationship between a semiconductor element and a measuring probe in the measurement method of the present invention, FIG. 2 is a side view of the same, FIG. 3 is a plan view showing the measuring mechanism of a conventional device, and FIG. FIG. 2 is a diagram showing a probe fixing card. 1... Semiconductor element 2... Bonding pad 3... Measurement probe

Claims (1)

[Claims] (1) In this method, the properties of a semiconductor element formed on a wafer are measured by contacting the bonding pad with a measurement probe fixed at the pad coordinate position in advance while the semiconductor element is in the wafer state.The pad coordinate position is input in advance. , a semiconductor characteristic measuring method characterized by moving a probe part based on the data and bringing the pad into contact with the probe.