JPH0621169A - Wafer prober, ic prober, and their probing methods - Google Patents

Abstract

PURPOSE:To provide an electric characteristic test for a device stably and effectively in good conditions, by forming a stationary stage for a probe card so that a probe needle can be movable for a desired length in a desired direction after the probe needle is put in contact with an IC electrode pad. CONSTITUTION:A wafer prober used for an electric characteristic test for an IC in a semiconductor wafer 9 has a stationary stage 7 for fastening a probe card 8. The stationary stage 7 is also used to put a prove needle 1 (a probe electrode) in contact with each IC-device electrode pad to be measured. The probe needle l is made movable for a desired length in a desired direction after the probe needle 1 is put in contact with the IC-device electrode pad. In this way, since the contact pressure and the wiping quantity thereof are set separately as an individual parameter, a wafer probing step can be carried out without an optimizing designing step for an incident angle of the probe needle 1 to the wafer 9.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probing mechanism of a prober device for inspecting electric characteristics of an IC formed on a semiconductor wafer and a package having the semiconductor IC mounted thereon.

[0002]

2. Description of the Related Art When conducting an electrical characteristic inspection, it is necessary to electrically connect an electrode pad of a non-measurement device or a lead of a package to an electrode metal of a probe needle or socket of a measurement system with a constant low contact resistance. . In order to obtain a constant low contact resistance, oxide film, foreign matter,
Need to remove dirt. Hitherto, as a most efficient method for this purpose, a method called wiping in which metals are rubbed together has been adopted.

A conventional probing mechanism will be described with reference to FIGS. 5, 6 and 7.

First, FIG. 5 is a view showing a wiping mechanism in a conventional wafer prober, in which 1 is a probe needle,
Reference numeral 32 denotes an IC electrode built in the wafer 9.

By vertically raising the stage 10 for fixing the wafer 9 to the probe needle 1 obliquely incident on the wafer surface, the probe needle and the IC electrode pad of the wafer are brought into contact with each other. Then, the contact resistance is lowered by obtaining an appropriate wiping effect and contact pressure, so that the stage is further raised. A rising y yields a wiping length of x.

However, according to the conventional method, in order to obtain an appropriate contact pressure and wiping length, it is necessary to optimize the incident angle of the probe needle with respect to the wafer surface.

The wiping direction is limited to the penetration direction of the probe needle.

There is a problem.

Next, FIG. 6 is a view showing a wiping mechanism using a socket in a conventional package handler. Reference numeral 29 is an IC package lead, and 31 is a socket electrode.

From the contact position between the package lead 29 and the socket electrode 31, the package is pushed down by y,
A wiping amount of x is obtained.

Also in this method, it is necessary to design the socket for obtaining the optimum wiping effect and the contact pressure.

FIG. 7 is a view showing a contact mechanism using a pogo pin without using a socket in a conventional package handler, where 21 is a pogo pin and 28 is a pogo pin 21.
A base for fixing the base, 27 is a stage for fixing the base 28,
30 is a stage for fixing the IC package.

According to this mechanism, it is impossible to perform wiping only by vertically pressing the pogo pin 21 against the lead 29 in order to establish electrical continuity.

[0014]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, to make it possible to arbitrarily set the contact pressure and the wiping amount as independent parameters, and to set the wiping direction to the probe electrode. It is to be able to set an arbitrary fixed direction irrespective of the incident direction of.

[0015]

The above object can be achieved by the following means.

In a wafer prober for inspecting the electrical characteristics of an IC formed on a semiconductor wafer, when the probe electrode attached to the wafer prober is brought into contact with the electrode pad of each non-measurement IC device, the probe electrode is not measured. After contacting the electrode pad of the IC device, it has a probe card fixed stage that allows the probe electrode to move in an arbitrary direction for an arbitrary distance.

In a wafer prober for inspecting the electrical characteristics of an IC formed on a semiconductor wafer, when the probe electrode attached to the wafer prober is brought into contact with the electrode pad of each non-measurement IC device, the probe electrode is arbitrarily set. In a package handler for inspecting the electrical characteristics of a package mounted with a semiconductor IC that has a wafer fixed stage that can move an arbitrary distance in any direction, the probe electrodes attached to the package handler are used as leads of individual non-measurement IC packages. In a package handler for inspecting electrical characteristics of a package mounted with a semiconductor IC, which has a probe electrode fixing portion that allows the probe electrode to move in an arbitrary direction in an arbitrary direction when brought into contact, a probe electrode attached to the package handler Of individual non-measured IC packages When brought into contact with the over-de, an IC package fixing unit for a movable any distance probe electrode in any direction.

[0018]

Embodiments of the present invention will be described below with reference to FIGS. 1, 2, 3 and 4.

FIG. 1 is a schematic view showing a mechanism of a probing part of a wafer prober according to an embodiment of the present invention,
Reference numeral 1 is a probe needle that is an electrode that is electrically connected to inspect the characteristics of an IC formed on a wafer, 8 is a probe card for fixing the probe needle 1, and 7 is a stage for fixing the probe card 8. , 9 is a wafer, 10 is a stage for fixing the wafer 9, 2a is an X stage for finely moving the stage 10 for the purpose of wiping, 3a is the same Y stage, 4 is for bringing the wafer into contact with the probe needle 1. Z
An up mechanism 5, an X stage for indexing the wafer stage 10 for each IC chip formed on the wafer, 6 for the Y stage, and 11 for a control device for controlling each movable part.

The Z-up mechanism 4 raises the stage 10 by the amount indicated by the controller 11, and the electrode of the wafer 9 comes into contact with the probe 1 to apply a necessary load. Next, the X stage 2a or the Y stage 3a slides the stage 10 and the wafer 9 in the horizontal direction by the amount instructed by the control device 11 to wipe the electrodes and the probe. The wiping amount at this time can be arbitrarily set in the control device in advance.

Further, in this embodiment, the X stage 2a and the Y stage 3a for finely moving the stage 10 for the purpose of wiping, the wafer stage 10, and the wafer stage 10 are formed on the wafer.
The C stage is separated from the X stage 5 and the Y stage 6 for indexing, but it is not always necessary to separate them when they have both functions.

FIG. 2 is also a schematic view showing the mechanism of the probing part of the wafer prober in the embodiment of the present invention. The difference from the example of FIG. 1 is that X for wiping in FIG. While the Y stages 2a and 3a are attached to the wafer stage 10, the X and Y stages 2b and 3b for wiping are attached to the stage 7 for fixing the probe card 8 in the example of FIG. To be there. In this example as well, an arbitrary wiping operation is possible.

FIG. 3 is a schematic view showing the mechanism of the probing part of the package handler in the embodiment of the present invention. 21 is a pogo pin for making an electrical connection for inspecting the characteristics of the IC package, and 28 is a A board for fixing the pogo pin 21, a stage 27 for fixing the board 28, a lead 29 of the IC package, a stage 30 for fixing the IC package, and a stage 23a for finely moving the stage 30 for the purpose of wiping. , 24 are Z-up mechanisms for bringing the leads 29 into contact with the pogo pins 21.

The Z-up mechanism 24 raises the stage 30, and the leads 29 come into contact with the pogo pins 21 to apply a necessary load. Next, by the stage 23a, the stage 30 and the lead 29
Slides and wipes the lead 29 and the pogo pin.

FIG. 4 is also a schematic view showing the mechanism of the probing part of the package handler in the embodiment of the present invention. The difference from the example of FIG. 3 is that the stage 23a for wiping in FIG. 4 is attached to the stage 30, whereas in the example of FIG. 4, the stage 23b for wiping is attached to the stage 27 that fixes the base 28. In this example as well, an arbitrary wiping operation is possible.

[0026]

As described above, according to the present invention, the contact pressure and the wiping amount can be arbitrarily set as independent parameters. Therefore, it is necessary to optimize the design of the incident angle of the probe needle on the wafer. Disappears.

According to the above, when a plurality of probe needles are applied to the same device, probe needles of different designs such as various lengths, thicknesses, angles, etc. can be mixed and used, and miniaturization,
This will increase the flexibility and possibility of designing and creating probing jigs and probe cards for devices with increasing pin count.

Further, since the wiping direction can be set to an arbitrary fixed direction irrelevant to the incident direction of the probe needle, it is not necessary to make the layout and size of the wafer pad in consideration of the incident direction of the probe needle. All you have to do is make the pad design conscious of wiping.

This makes it possible to reduce the pad spacing of the wafer.

Wiping is also possible for a probe that is incident perpendicularly to the wafer.

Thus, even for a device in which pads are arranged on the entire surface of the IC, a probing jig,
It is possible to create a probe card.

As described above, it is possible to realize an environment in which the electrical characteristic inspection of a device which is miniaturized and has a large number of pins can be performed more efficiently and stably.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing a mechanism of a probing unit of a wafer prober according to an embodiment of the present invention.

FIG. 2 is a schematic diagram showing a mechanism of a probing unit of a wafer prober according to an embodiment of the present invention.

FIG. 3 is a schematic diagram showing a mechanism of a probing unit of the package handler of the embodiment of the present invention.

FIG. 4 is a schematic view showing a mechanism of a probing unit of the package handler of the embodiment of the present invention.

FIG. 5 is a diagram showing a wiping mechanism in a conventional wafer prober.

FIG. 6 is a diagram showing a wiping mechanism using a socket in a conventional package handler.

FIG. 7 is a view showing a contact mechanism using a pogo pin that does not use a socket in a conventional package handler.

[Explanation of symbols]

 1 ... Probe needles 2a, 2b ... Wiping X stage 3a, 3b ... Wiping Y stage 4 ... Z up mechanism 5 ... Wafer stage Index X stage 6・ ・ ・ Wafer stage Y stage for index 7 ・ ・ ・ ・ ・ Probe card fixing stage 8 ・ ・ ・ ・ ・ Probe card 9 ・ ・ ・ Wafer 10 ・ ・ ・ Wafer stage 11 ・ ・ ・ ・ ・Control device 21 ・ ・ ・ ・ ・ Pogo pins 23a, 23b ・ ・ Wiping stage 24 ・ ・ ・ ・ ・ Z up mechanism 27 ・ ・ ・ ・ ・ Pogo pin base fixing stage 28 ・ ・ ・ ・ ・ Pogo pin fixing base 29 ・ ・ ・..IC package leads 30..IC package fixing stage 31..Socket electrodes 32..IC electrodes made on wafer

Claims (6)

[Claims] 1. A wafer prober for inspecting the electrical characteristics of an IC formed on a semiconductor wafer, the probe electrode being attached to an electrode pad of an individual non-measurement IC device when the probe electrode is attached to the wafer prober. A prober apparatus for a wafer, comprising a probe card fixing stage that moves a probe electrode in an arbitrary direction in an arbitrary distance after being brought into contact with an electrode pad of a non-measurement IC device. 2. A wafer prober for inspecting the electrical characteristics of an IC formed on a semiconductor wafer, wherein the probe electrode is attached to an electrode pad of an individual non-measurement IC device when the probe electrode is attached to the wafer prober. A prober apparatus for a wafer, comprising a wafer fixing stage that moves a probe electrode in an arbitrary direction in an arbitrary distance after being brought into contact with an electrode pad of a non-measurement IC device. 3. In a package handler for inspecting the electrical characteristics of a package having a semiconductor IC mounted thereon, when the probe electrode attached to the package handler is brought into contact with the lead of each non-measurement IC package, the probe electrode is not measured. After contacting the leads of the IC package,
A prober device for an IC package, which has a probe electrode fixing portion for moving the probe electrode in an arbitrary direction in an arbitrary distance. 4. In a package handler for inspecting the electrical characteristics of a package having a semiconductor IC mounted thereon, when the probe electrode attached to the package handler is brought into contact with the lead of each non-measurement IC package, the probe electrode is not measured. After contacting the leads of the IC package,
The probe electrode is movable in any direction for any distance I
An IC package prober device having a C package fixing portion. 5. A wafer prober for inspecting electrical characteristics of an IC formed on a semiconductor wafer, the probe electrode being attached to the electrode pad of each non-measurement IC device when the probe electrode attached to the wafer prober is brought into contact with the probe electrode. After contacting the electrode pad of the non-measurement IC device, the probe electrode or the non-measurement IC device is slid, wiped, and rubbed in an arbitrary direction in an arbitrary direction to make electrical connection, thereby probing a wafer. Method. 6. A package handler for inspecting electrical characteristics of a package having a semiconductor IC mounted thereon, wherein probe electrodes attached to a package handler are not measured with probe electrodes when contacting the leads of individual non-measurement IC packages. An IC package probing method characterized in that after a lead of an IC device comes into contact, a probe electrode or a non-measurement IC package is slid, wiped, and rubbed together in an arbitrary direction in an arbitrary direction to establish an electrical connection.