JPH05134001A - Inspection method of semiconductor device - Google Patents

Abstract

PURPOSE:To achieve electrical conduction with a measuring machine easily and positively even in the case of an IC package with a reduced pitch between leads due to multiple pins and miniaturization. CONSTITUTION:Four corners of an IC package 3 are fixed by a fixing tool 6, a needle card 1 which is developed exclusively for each IC package is dropped from an upper surface, and then a lead 4 of an IC package 3 is allowed to contact a needle 2 of the needle card. The needle card is taken out as a land at a corner of the card according to pattern wiring, a connector 5 is connected to the land, electrical conduction with the measuring machine is achieved, and then an electrical characteristic inspection is performed. The needle and the lead of the IC package are allowed to contact by the needle card 1 from an upper surface of the IC package 3 and then electrical conduction with the measuring machine is achieved, thus achieving an electrical conduction with the measuring machine easily and positively even in the case of the IC package with the reduced pitch between leads due to multiple pins and miniaturization and enabling electrical characteristic inspection to be made easily.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a measuring instrument and a method for electrically connecting an IC package when inspecting the electrical characteristics of an IC package product.

[0002]

2. Description of the Related Art FIG. 5 shows a conventional electrical connection method between a measuring instrument and an IC package. Here, 3 is an IC package,
4 is the lead of the IC package, 5 is the wiring with the measuring instrument, 9
Is a dedicated contact jig called a socket, 10 is a contact pin, and 11 is a pressing jig called a pusher.

As a conventional method for electrically connecting the measuring instrument and the IC package, a dedicated contact jig 9 with the measuring instrument called a socket is developed for each IC package, and the IC package 3 is placed in the socket 9. Then, using a jig 11 called a pusher for holding the IC package 3 from above, the IC package 3 is pressed from above so that the leads 4 of the IC package and the contact pins 10 of the socket come into contact with each other. 9 and the measuring instrument were brought into contact with each other by the wiring 5 to establish electrical continuity between the measuring instrument and the IC package.

FIG. 6 shows a top view of the socket. In the socket 9, a contact pin 10 is formed in the socket to establish electrical connection with the lead 4 of the IC package. The contact pins are insulated by an insulator such as plastic.

[0005]

However, in the above-mentioned conventional technique, the pitch between leads becomes smaller as the number of pins and the size of the IC package are increased. Therefore, when developing the socket, the pitch between the contact pins is also very small, so when insulating between the contact pins, it becomes difficult for an insulator such as plastic to enter between the contact pins, and Insulation becomes impossible. For this reason, it is extremely difficult to make a dedicated socket for an IC package that has a large number of pins, is miniaturized, and has a small lead pitch, and it is difficult to electrically connect the measuring instrument and the IC package.

Therefore, the present invention solves such a problem, and an object of the present invention is to easily and surely measure an IC package having a large number of pins and a small lead pitch due to miniaturization. It is an object of the present invention to provide a method capable of electrically connecting with.

[0007]

According to a method for inspecting an IC package semiconductor device of the present invention, an IC package is fixed by a fixing jig, and a needle and a lead of the IC package are brought into contact with each other from above by a needle card and a measuring machine is used. It is characterized in that the electrical characteristics are inspected by establishing electrical continuity with.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a side view showing the mechanism of the present invention, and FIG.
1 is a top view showing the mechanism of the present invention, in which 1 is a needle card,
Reference numeral 2 is a needle in the needle card, 3 is an IC package, 4 is a lead of the IC package, 5 is a connector and wiring for making contact between the measuring instrument and the needle card, and 6 is a fixing jig for fixing the IC package.

Here, the four corners of the IC package 3 are fixed by the fixing jigs 6, the needle card 1 developed exclusively for each IC package 3 is lowered from the upper surface, and the needles 2 and I of the needle card are fixed.
Contact with the lead 4 of the C package. The needle card 1 is exposed as a land in the corner of the card by pattern wiring, and the land portion is used to make contact between the measuring machine and the needle card.
The contact between the needle card 1 and the measuring machine is made by the connector and the wiring 5. By this method, the leads 4 of the IC package can be electrically connected to the measuring instrument, and the electrical characteristics of the IC package can be inspected.

FIG. 3 is a side view showing another embodiment of the present invention.

Here, in the above-mentioned embodiment, the IC package 4 is used.
Is fixed by the fixing jig 6 in the front surface state, but in this embodiment, the IC package 3 is fixed by the fixing jig 6 in the rear surface state, and the needle card 1 is lowered from the upper surface. By making contact between the needle 2 of the needle card and the lead 4 of the IC package, electrical continuity is established between the lead 4 of the IC package and the measuring instrument. According to this method, the leads 4 of the IC package
It is possible to measure with the marking surface facing up, even with an IC package that is reverse-bent and marked on the back surface.

FIG. 4 is also a side view showing another embodiment of the present invention, 7 is an IC module in which an IC chip is mounted on a substrate, and 8 is a measurement land in the IC module.

Although the above-mentioned embodiments have described the IC package, this embodiment fixes the IC module with the fixing jig 6 and lowers the needle card 1 from the upper surface.
The needle 2 of the needle card and the measuring land 8 of the IC module are brought into contact with each other to establish electrical connection with the measuring machine.

According to this method, in the case of the IC module, since the position of the measurement land is in the substrate, it is very difficult to set the contact pin at the position of the measurement land in the substrate with the socket. Also, if the pitch between the lands becomes small, it becomes impossible, and electrical connection with the measuring machine becomes impossible. However, the present invention makes it possible.

[0015]

As described above, as in the present invention, the needle and the lead of the IC package are brought into contact with each other from the upper surface of the IC package by the needle card to establish the electrical connection with the measuring instrument, and thus the multi-pin, Even in an IC package having a smaller lead pitch due to miniaturization, it is possible to easily and reliably perform electrical conduction with the measuring instrument, and it is possible to easily perform electrical characteristic inspection.

[Brief description of drawings]

FIG. 1 is a side view of an embodiment of the present invention.

FIG. 2 is a top view of an embodiment of the present invention.

FIG. 3 is a side view of another embodiment of the present invention.

FIG. 4 is a side view of another embodiment of the present invention.

FIG. 5 is a side view showing a contact method between a conventional measuring device and an IC package.

FIG. 6 is a top view showing the mechanism of the socket.

[Explanation of symbols]

 1 Needle card 2 Needle card needle 3 IC package 4 IC package lead 5 Wiring with measuring machine 6 Fixing jig 7 IC module 8 Measuring land 9 Socket 10 Contact pin 11 Pusher (holding jig)

Claims (1)

[Claims] 1. A method for inspecting an IC package product, comprising:
Fix the C package with a fixing jig, and then touch the needle with the lead of the IC package from above with a needle card.
A method of inspecting a semiconductor device, which comprises inspecting electrical characteristics by establishing electrical connection with a measuring instrument.