JPH0735771A - Inspecting jig for electric characteristic of semiconductor device - Google Patents

Abstract

PURPOSE:To provide an inspecting jig which can securely inspect electric characteristics of an unpackaged semiconductor device without damaging the semiconductor device. CONSTITUTION:An inspecting jig includes a guide 10 for covering a face 5a of a semiconductor device 5 where solder ball electrodes 50 are provided and a plurality of fine needle electrodes 20 which can be in electrical contact with the plurality of solder ball electrodes 50, respectively, wherein at each portion corresponding to the solder ball electrode 50 of the guide 10, the fine needle electrode 20 is provided through a guide hole 15 where insertion is possible. The fine needle electrode 20 has an elastic part 21 which can buffer pressing force of the fine needle electrode 20 against the solder ball electrode 50. Therefore, only by inserting the fine needle electrode 20 into the guide hole 15, the electrode 20 can be securely brought into contact with the solder ball electrode 50, thereby securing conductivity between them. In addition, since parts other than the solder ball electrodes 50 of the semiconductor device are covered by the guide 10, the fine needle electrodes 20 can be prevented from being contact with the parts other than the solder ball electrodes 50.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor technology and a technology particularly effective when applied to a semiconductor device inspection technology.
For example, the present invention relates to an inspection jig useful for inspecting electrical characteristics of a semiconductor device having a solder ball electrode.

[0002]

2. Description of the Related Art Conventionally, a semiconductor device on which a highly integrated circuit is formed (in the present specification, means a semiconductor chip) is shipped to a user in a state of a semiconductor package sealed with resin or ceramic. Therefore, the completion inspection of the electrical characteristics of the semiconductor device performed immediately before shipment has been performed in the state of the semiconductor package in which the semiconductor device is enclosed in the package, not in the unpackaged semiconductor device alone. That is, each lead of the semiconductor package is electrically connected to an inspection needle electrode provided in the inspection device, and the inspection device and each electrode of the semiconductor device are connected via each needle electrode and each lead. Electrical characteristics were measured by exchanging electrical signals between them. Regarding the connection between the lead and the needle electrode, for example, in the case of a semiconductor package for surface mounting in which a solder ball electrode is used as the lead,
A probe needle, which is a needle electrode of the inspection device, is mechanically pressed against the solder ball electrode by using a spring.

By the way, in recent years, in order to further miniaturize various products on which semiconductor devices are mounted, a technique of mounting unpackaged semiconductor devices, that is, semiconductor chips on the mounting boards of those products has been considered. There is. In such a chip direct mounting technique, a flip chip type semiconductor device in which a solder ball electrode (solder bump) is formed on each electrode of the semiconductor device is used.

[0004]

However, in order to inspect the electrical characteristics of the semiconductor device in the non-packaging state by applying the above-described technique for inspecting the electrical characteristics of the semiconductor package, the following problems are encountered. There is a point. That is, the problem is that the size and pitch of the solder ball electrodes in the semiconductor device (distance between the solder ball electrodes adjacent to each other) is extremely smaller than the size and pitch of the solder ball electrodes of the semiconductor package. Not only is it very difficult to ensure that all probe needles are in contact with all solder ball electrodes of the semiconductor device and to electrically connect them, but the semiconductor device is slightly displaced from the predetermined position The tip of the needle may damage the surface of the semiconductor device or contaminate the surface of the semiconductor device.

The present invention has been made in view of the above circumstances, and the use thereof does not damage a semiconductor device,
It is a main object to provide a jig for inspecting electric characteristics of a semiconductor device, which can surely inspect the electric characteristics of a semiconductor device in a non-packaging state. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0006]

The typical ones of the inventions disclosed in the present application will be outlined below. That is, in the jig for inspecting the electrical characteristics of the semiconductor device of the present invention, the guide tool covering the surface of the semiconductor device on which the solder ball electrodes are provided and the plurality of solder ball electrodes are electrically contacted respectively. A plurality of possible fine needle electrodes are provided, and guide holes through which the fine needle electrodes can be inserted are provided at positions corresponding to the solder ball electrodes of the guide tool. The guide hole may have a size such that the solder ball electrode can be inserted therein. Further, the fine needle electrode may have an elastic portion capable of relaxing the pressing force of the fine needle electrode with respect to the solder ball electrode.

[0007]

When the inspection jig of the above means is used, the solder ball electrode is exposed in the guide hole by covering the semiconductor device with the guide tool, and the portion other than the solder ball electrode of the semiconductor device is covered with the guide tool. . Therefore,
By inserting the fine needle electrode into the guide hole, the fine needle electrode is guided by the guide hole and surely comes into contact with the solder ball electrode, so that electrical continuity between them is secured. In addition, by making the size of the guide hole such that the solder ball electrode is just inside the guide hole, deformation of the solder ball electrode that can occur when the fine needle electrode is pressed is prevented. Further, if the fine needle electrode is provided with the elastic portion, the pressing force on the solder ball electrode when the fine needle electrode is brought into contact with the solder ball electrode is relieved, and the deformation of the solder ball electrode is prevented.

[0008]

EXAMPLE An example of a jig for inspecting the electrical characteristics of a semiconductor device according to the present invention (hereinafter simply referred to as "inspection jig") will be described below. FIG. 1 shows an outline of the inspection jig. As shown in the figure, this inspection jig 1
Reference numeral 00 is an inspection jig used for inspecting the electrical characteristics of the semiconductor device 5 having the solder ball electrodes 50, and includes a guide tool 10 and fine needle electrodes 20. The reference numeral 55 indicates a substrate of a semiconductor chip on which an integrated circuit is formed.

The guide 10 is made of an insulating material such as ceramics or plastics, and at least the surface 5a of the semiconductor device 5 on which the solder ball electrodes 50 are arranged.
It is supposed to cover. For example, in FIG. 1, the guide tool 1
0 is provided with an upper plate portion 11 and a side plate portion 12 integrated with the periphery thereof. The upper plate portion 11 and the side plate portion 12 are provided.
The semiconductor device 5 is just accommodated in the space A defined by and. Thereby, the semiconductor device 5 is positioned and fixed during the inspection.

Guide holes 15 through which the fine needle electrodes 20 can be inserted are provided through the front and back of the upper plate portion 11 of the guide 10 at positions corresponding to the solder ball electrodes 50. The guide hole 15 is formed in the solder ball electrode 50 and the fine needle electrode 2
The fine needle electrode 20 is guided to the solder ball electrode 50 when 0 is contacted.

The back side of the guide hole 15 (the back surface 1 of the upper plate portion 11)
The size of the opening end on the 1b side) is larger than the thickness (diameter) of the fine needle electrode 20 and smaller than or exactly the same as the diameter of the solder ball electrode 50. Even if the position of the fine needle electrode 20 and the position of the solder ball electrode 50 are deviated, the shape of the guide hole 15 is set so that the fine needle electrode 20 can be guided to the solder ball electrode 50.
The taper shape may be tapered such that it goes from the front surface 11a to the back surface 11b.

The fine needle electrodes 20 are made of a conductor such as metal and are arranged in the fixing plate 25 at a pitch corresponding to the position of the solder ball electrodes 50 in the semiconductor device 5. And the base end (upper part) of each fine needle electrode 20.
An elastic portion 21 is provided on the side of the solder ball electrode 50 so as to relieve the pressing force of the fine needle electrode 20 against the solder ball electrode 50 when the fine needle electrode 20 is brought into contact with the solder ball electrode 50. That is, the elastic portion 21 absorbs the pressing force to prevent the solder ball electrode 50 from being applied with an excessive pressing force. Further, at the base end of each fine needle electrode 20, a measuring device 7 provided outside the inspection jig 100.
Each connection terminal (wiring) 26 (see FIG. 2) is electrically connected.

The elastic portion 21 is formed, for example, by bending a part of the fine needle electrode 20 into a substantially loop shape.
Therefore, when the pressing force increases, the loop is bent and the solder ball electrode 50 always receives an appropriate pressing force. Instead of bending the fine needle electrode 20 in a loop shape, a fine coil spring or an air cushion may be provided between the base end of the fine needle electrode 20 and the fixing plate 25. Good.

FIG. 2 shows an inspection jig 10 having the above-mentioned structure.
A tester system using 0 is shown. As shown in the figure, each fine needle electrode 20 of the inspection jig 100 is connected to the measuring device 7. This measuring device 7
It is connected to a control device 8 such as a computer, and outputs electric signals such as current and voltage whose ON / OFF and size are controlled by the control device 8 to each fine needle electrode 20. Further, an electric signal such as a current or a voltage caused in the semiconductor device 5 is detected by the outputted electric signal and is outputted to the control device 8. It goes without saying that the control device 8 is connected with an operation device 80 such as a keyboard and a display device 85 such as a display.

According to the above-described embodiment, since the upper plate portion 11 of the guide tool 10 is provided with the guide holes 15 at positions corresponding to the solder ball electrodes 50 of the semiconductor device 5, the guide tool 10 is provided. The solder ball electrode 50 is exposed in the guide hole 15 and the other portion of the semiconductor device 5 is covered by the upper plate portion 11 only by covering the semiconductor device 5 to be measured with. Therefore, the fine needle electrode 2 is inserted into the guide hole 15.
Only by inserting 0, the fine needle electrode 20 is guided and surely comes into contact with the solder ball electrode 50, and the contact resistance between the fine needle electrode 20 and the solder ball electrode 50 is reduced.
The electrical characteristic inspection can be reliably performed.

Further, by the upper plate portion 11, the fine needle electrode 2
Since 0 is prevented from coming into contact with a portion other than the solder ball electrode 50, it is possible to prevent the semiconductor device from being damaged. Further, positioning and fixing of the semiconductor device 5 at the time of measurement can be easily performed. Furthermore, since the elastic portion 21 is provided on the fine needle electrode 20, the solder ball electrode 50
Since an excessive pressing force is prevented from being applied to the solder ball electrode 50, it is possible to prevent the solder ball electrode 50 from being deformed.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say. For example, the diameter of the guide hole 15 is set so that the solder ball electrode 50 can enter the hole, and the solder ball electrode 5 is inserted in the guide hole 15.
The characteristic inspection may be performed with 0 inserted. Further, in order to prevent the deformation of the solder ball electrode 50, a through hole into which the solder ball electrode 50 can be inserted is provided between the substrate 55 of the semiconductor device 5 and the guide tool 10 at a position corresponding to the solder ball electrode 50. You may make it interpose a board. In this case, it goes without saying that the plate is made of an insulating material such as epoxy resin. Furthermore, the guide tool 10 may be mounted on the semiconductor device 5 after the epoxy resin or the like is dropped and solidified to firmly fix the solder ball electrode 50.

In the above description, the case where the invention made by the present inventor is mainly applied to the inspection of electric characteristics of a single semiconductor device in a non-packaging state, which is the field of application in the background, has been described. The present invention is not limited to this, and can be used for the electrical characteristic inspection of a packaged semiconductor device on which the semiconductor device is mounted.

[0019]

The effects obtained by the representative one of the inventions disclosed in the present application will be briefly described as follows. That is, when measuring the electrical characteristics of a semiconductor device in a non-packaging state, if this inspection jig is used, only the solder ball electrode is exposed in the guide hole of the guide tool. The fine needle electrode can be surely brought into contact with the solder ball electrode only by inserting, and the conduction between the two can be secured. Further, since the portions other than the solder ball electrodes of the semiconductor device are covered with the guide tool, it is possible to prevent the fine needle electrodes from coming into contact with the portions other than the solder ball electrodes.
Therefore, the electrical characteristics of the semiconductor device can be reliably inspected without damaging it.

[Brief description of drawings]

FIG. 1 is an enlarged longitudinal sectional view of an essential part showing an outline of an example of an inspection jig according to the present invention.

FIG. 2 is a schematic configuration diagram of an inspection device to which the inspection jig is connected.

[Explanation of symbols]

 5 semiconductor device 5a surface (surface on which solder ball electrodes are provided) 10 guide tool 15 guide hole 20 fine needle electrode 21 elastic portion 50 solder ball electrode 100 inspection jig

Claims (3)

[Claims] 1. A jig used when inspecting the electrical characteristics of a semiconductor device having a plurality of solder ball electrodes, the surface of the semiconductor device on which the solder ball electrodes are provided. And a plurality of fine needle electrodes capable of electrically contacting the plurality of solder ball electrodes, respectively, and the fine needle electrodes are provided at respective locations corresponding to the solder ball electrodes of the guide tool. A jig for inspecting electrical characteristics of a semiconductor device, wherein a guide hole that can be inserted is provided so as to penetrate therethrough. 2. The jig for inspecting the electrical characteristics of a semiconductor device according to claim 1, wherein the guide hole has a size such that the solder ball electrode can be inserted therein. 3. The electric device of a semiconductor device according to claim 1, wherein the fine needle electrode has an elastic portion capable of relaxing a pressing force of the fine needle electrode with respect to the solder ball electrode. Jig for inspection of static characteristics.