TW541430B - Test device for semiconductor wafers - Google Patents

Abstract

A test device for semiconductor wafers is to send a plurality of test signals to the component portion formed from wafers and to determine if the component portion is good or defective based on test results. The test device for semiconductor wafers comprises: a plurality of needles electrically contacting with the component portion; a probe card with a grounding portion disposed on its main surface at the vicinity of the needle; a contact portion electrically contacting the needle; and a wafer for test with a needle disposed on its main surface electrically contacting the grounding portion.

Description

541430 V. Description of the invention (1) Technical field of the invention The present invention relates to a semiconductor substrate testing device for testing a semiconductor substrate (hereinafter referred to as a wafer) in which a semiconductor integrated circuit element and the like are incorporated. It can measure the waveform of the test signal sent from the tester body with high accuracy. Known Techniques Semiconducting complex numbers, subcomponents. The test is completed especially BGA (Bal1 is popular, so when testing 'such as semiconductor-based wafers, the contact point can be the test head to the IC number. For example, the limb circuit components of different kinds of frequency measurement are on silicon wafers. The production of substrates such as glass plates is completed through various processes such as dicing, wire bonding and packaging. IC components such as electricity are tested for operation before shipment, but the state of this test product or the state of the wafer is performed. In recent years, With the development of semiconductor manufacturing technology, wafer-sized packages such as Grid Array) type 10 components are used in the package: sealed in the state of the wafer, and then cut: the state of the circle to test the operation of the module A lot. ^: I: 5 tlC semiconductor substrate test device. Known in real Kaiping 5 ~ 1 ^ 4 cm Α & 板 board test device, disclosed by the two Agen. In this way, the vacuum suction system provided on the probe card is touched and the test is performed. (Needle contact) and during the test of the operation of the wafer, self-tester ^ 'send out the test letter J test shown in Figure 4' as the test module assembly,-generally in practice: two reasons can not Perform the test shown in Figure 4 at high time.

2〇30-3398-? F-ptd The phase of the test signal a 'b == b Q 541430 V. Description of the invention (2) The waveform of the test signal is used to correct the phase of the two test signals. In a test device called a processing IC that uses a finished IC component as a test object, the phase correction is generally performed by connecting the oscilloscope for waveform observation and the contact pins of the test head, but the contact pins of the test head and the ground point (ground , GND) When far away, noise is mixed into the waveform output to the oscilloscope, and the correct waveform cannot be obtained. For example, as shown in Fig. 5, for a normal waveform X, a waveform of a waveform y or a waveform z is observed. Therefore, if there is a contact point near the contact pin, use it. If there is no ground point near the contact point, another grounding base is provided. However, in a semiconductor substrate testing device that uses a wafer as a test object, the pins corresponding to the pins of the processor are arranged at a narrow interval of 1 50 // m, and it is extremely difficult to set a ground point near the pins δ. #Thus, using the wiring pattern 4 and the like of the probe card arranged at a relatively wide interval to measure the waveform of the number, but in this method, because it is not the name of the input wafer on the viewing side and the number of pieces is $ 1 > 士, # 口 备 士 细 夕 # # A The test sign of the contact point of the 4 pieces, but it will be far away from that ", at first, the waveform of the test signal measured by the turn-in department, there is a problem in its correctness. T line q and the summary of the invention = The purpose of the day i is to provide a semiconductor substrate testing device that can measure the waveform of the test signal sent from the tester body and so on. The test method is provided by the first form of the present invention. A semiconductor substrate signal is sent to a component part formed by a test body substrate to send a plurality of test boards for testing. The test set includes determining whether the component part is good or bad, 'the semiconductor-based first needle contact' is electrically connected to the component part.

2030-3398-??. Ptd Page 5 M1430

V. Description of the invention (3) Touch; probe card, grounding part on 1 u on one of its main faces, on the thunder animal .., on electricity and test. +, Touch, and measuring crystal and connection, The second needle-like connection of the contact of the present invention is better. The arrangement of the measuring crystal: the point and the grounding portion has a structured contact point and a contact portion. In the present invention, it is preferable that a test wafer is provided with respect to the probe card. In the present invention, it is preferable that the substrate and the module and the measurement wafer are provided on the substrate to work in the present invention. It may further include a signal waveform of a test signal which is connected with a wheel-out terminal of a chip and enumerated in the test signal of the present invention. (2) If the probe card for the second test device according to the present invention is connected to the base board of the electric test head, and a plurality of pins are connected in contact with the component part on a main surface, a ground part is provided. In the present invention, the grounding part is a ground part or a plurality of pin contacts. (3) If the second substrate according to the present invention is connected to the head substrate near the first pin contact, the contact part is connected to the electrical chip. 'Electric point is set on one of the main surfaces. According to the first needle shape of the probe card, the wafers form a pair or more of the second needle shape, including the wafer table for measuring, so that the first needle contact and the grounding portion with a high content are moved. It also includes a substrate table, which holds the first pin contact of the semi-conductive card, and this table. L 5 Tiger characteristic 1 measurement device, and the characteristics of the test signal from the measurement wheel. The characteristics are not particularly limited, but for example, it is possible to provide a semiconductor substrate test device and a semiconductor substrate test device in one form. The electrical and semiconductor substrate points are provided. One of the needle contact points is provided near the needle contact point. Follow the settings. 1 form, providing a semiconductor substrate

^ 1430 V. Description of the invention (4): The wafer for measuring radon 'includes: contact radon, which is in electrical contact with the-pin contact provided on the ... detection card; and the ground contact. According to the second form, the fourth form, the measurement of the splicing plate on the electric rolling and the vicinity of the first needle-shaped contact is provided. The component part is tested after the signal. According to the result, the part contacting the component part ^ is determined to be the same as the semiconductor substrate test device. The vicinity of the knife is a contact point, and the measurement test signal can be specifically listed as "No." The characteristics are not particularly limited, but for example, send the test ii: pin: ί: f The board test device has a transmission part to the module part, and these needles are shaped like =: The grounding characteristics near the pin contact are better. / 、 The ground part is used as the input part to measure the test signal.

Before the above invention, > BT semiconductor substrate or = 2 series of test objects such as wafers or glass substrates, etc., the measurement B is only used, and on the way, the second pin of the measurement wafer is detected. The first pin of the card :: The 3 contact parts are in contact with the ground part of the probe card and the second pin of the test chip, and the test signal is sent in this state. The signal characteristics of the input device and the input device of the semiconductor substrate at the point i of the component and the input of the test object are as follows: The same test signal is output to the same amount of electrical environment. Therefore, you can test the actual signal… and test the characteristics of the test signal, and the reliability of the measurement result.

2030-3398-FF-ptd Page 7 541430 V. Description of the invention (5) Significantly raise the South. Further, in the present invention, since a grounding portion is provided near the detection card, the possibility of mixing noise or the like through the% number of the contact from the grounding portion is extremely small. The aa tablet sent the letter to each pin-shaped contact or several of the probe card for this measurement, so the measurement wafer was moved to each, each, and (for) the measurement wafer. Set a plurality of pairs of second needle-needle contacts. If you measure each of the multiple needle-needle contacts in the direction of measurement ^ = section 'You can measure all the first needle-like contacts at the same time.', No. ' It is possible to shorten the time when the pair of second pin contacts are provided, or the number of contact points of a signal characteristic measuring device such as a chip oscilloscope for measurement. ： = A Dedicated workbench device, ^ said "chip", no need to measure the wafer pattern, simple explanation is advantageous in terms of cost and space. In order to make the present invention understandable, the following enumerations are preferred, features, and advantages can be more obvious and easy as follows: Good ... column, and in accordance with the accompanying drawings for detailed description, FIG. 1 shows the present invention, FIG. 2 The overall view of the main body of the touch panel & board test device shown in FIG. Face view. Sectional view of the main part of the conductor substrate test Pei Zhi FIG. 3 is a plan view showing the B 4 # ^ a τ p clothing test card of FIG. 1. ^ Yi Bu Zi 1 (: waveform diagram of a test device (testing example of the Weeping Sword. Minus π body) output test letter Figure 5 is a waveform diagram for explaining the subject of the present invention. § 2030-3398-PF -ptd 541430

5. Description of the invention (6) The measurement wafer 3 on the side of the embodiment of the invention 5 Fig. 3 shows two measurement wafers, but the figure on the left side of the measurement wafer is shown in Fig. 1, The semiconductor substrate test of this embodiment: the device body test after the test signal; test head 20: connected by J: Temple and m-type for the body 10; and the wafer w of the probe 302 and sequentially moved into The test head 20 is placed in a plurality of component parts made in the wafer w. Then ,,,, and) contact, at the probe 30, the wafer w being tested is in a _chip multi-semiconductor circuit (assembly part), and is tested by the wafer suction nozzle in the case of testing ^ ^ ) Vacuum suction, keep the alignment state in high precision position. Because: plate 3 is said; on wafer table 31 'the wafer table; relative to the bottom plate 32 can be moved with high accuracy in the χγ plane not shown in Fig. 1, and B is the whole or only table 31 The circular nozzle can be raised and lowered in the z-axis direction. -In addition, although the illustration is omitted, a case where a high temperature test is performed after a predetermined temperature is applied to the wafer W 'is heated by a heater built in the wafer suction nozzle. μ In the probe 30 of this embodiment, a card holder 3 3 is set on the upper part of the wafer table 31, and a detection card 34 is held here. The detection card 34 of this example has a rectangular base plate 341 made of Tao Jing or Shi Xi, and a plurality of pins 342 (equivalent to this Invention No .. Needle-shaped contacts) are arranged in a plurality of rows as shown in FIG. 3. On the same main surface of the substrate 41, a pattern of a ground portion 343 connected to the ground is formed between the rows of the pins 342.

541430 V. Description of the invention (7) The pin 3 4 2 is set upright, for example, in contact with a terminal (a contact point in a state before wire bonding) of an assembly part formed on the wafer w, and is sequentially moved in the χγζ space. The wafer table 31 described above can contact each terminal of the component part to be tested. In addition, the probe card 34 of this embodiment is assembled on the opposite side of the substrate 341 (tops in Figs. 1 and 2 and back in Fig. 3) with one of the connections 344 consisting of a zero insertion force connector and the like. In addition, Zero Insertion Force Connector (Z: Zero Insertion F (D: ree Connector) means that when inserting and removing 1 phase with the Zero Insertion Force Connector 22 on the other side of the test head, which will be described later, on the 20 side. It is not necessary to apply the connection type 7 of the type 7 in the direction of insertion and removal. For example, the cylinder can be used to drive the 2 forward and backward movements in the vertical connection ^ to move the cam engaged with the track up and down. The method of expanding or reducing the interval between the socket contact pieces that pinches the contact pins, or other methods. Each contact of the f-pin 342 and the zero insertion force connector 344 uses a wiring pattern formed on the detection card soil plate 341 or Through-holes (both are omitted for connection on the electric rolling. In addition, in the semiconductor substrate test device of the present invention, the device for electrically connecting the probe card 34 and the test head 20 is not limited. +,: F * 妾 ™, system There are no problems with other types of connectors or connection terminals. "The test chat of the semiconductor substrate test device i is located on the wafer work and the upper part of the production" Although the figure * is omitted, various substrates such as performance boards are installed here. F This test head The bottom of 20 is shown in figure! In this case the top plate 21 of the stationary panel following contact ring 22. Also, the contacting

541430 V. Description of the invention (8) — The ring 22 fixes the other side 221 of the zero insertion force connector described above. (2) The cross-sectional diagram of FIG. 2 is not the installation state of the zero insertion force connectors 221 and 344. . In addition, although detailed illustrations are omitted, the positional alignment of the probe card 34 and the receiver 22 described above is performed by engaging the guide pad of the contact ring 22 provided on the probe card 34 side or the like. Furthermore, the zero insertion force connector 2 2 J provided on the contact ring 22 side and the performance board in the test head 20 are electrically connected by a plurality of wires or daughter boards. In particular, in the probe 30 of this embodiment, the measuring wafer 35 shown in FIG. 3 is a flange 311 provided on the wafer table 31 as shown in FIG. The measurement wafer 35 has a substrate 351 made of ceramic or silicon, which is the same as the substrate 341 of the probe card 34. On one of the main surfaces of the substrate 351 (the upper side in FIGS. I and 2 and the lower side in FIG. 3 is the lower side). On the right in Fig. 3, a pattern is formed of a pin 352 (equivalent to Ben Lamin's second pin-shaped contact) and a contact portion 3 5 3 connected to the ground wire. The distance between these pins 3 5 2 and the contact portion 3 5 3 is set to be approximately equal to the distance between the above-mentioned probe card 3 4, the pins 3 4 2 and the ground portion 3 4 3, as shown in FIG. One pair of pins 342 and the grounding part 343 approaching the detection card 34, 1 the contact part of the test chip 3 5 3, the 3 3 pin of the detection card 3 4 2 simultaneously touch the grounding part 343 of the detection card 34, and the measurement The contact portion 353 of the wafer 35. In addition, the pin 352 and the contact portion 353 of the wafer 35 for measurement are connected to the oscilloscope 40 via a cable or the like as shown in the right figure of Fig. 3, and the waveform of the measured test signal is observed. Next, the role will be explained.

In the case of testing the wafer W, first, the wafer w is positioned and sucked and held by the wafer suction nozzle, for example, the probe card 34 pin 342 contacts the target wafer W.

2030-3398-PFp t d page 11 5 'Explanation of the invention (9) ----- The contact point of the component part generally rises at χγ. With this, test a few :::; circle, when the table 31 side to the t position side, let the wafer table = 'once the test is completed here τ Τ-^ ^, such as the detection card 34 Needle 342 contacts; up;; = make the wafer table 31 align with cm while repeating this operation on the π plane, and test the installation in all areas. In the case where wafer w is subjected to a high temperature test, it is within. . It is: the heating state of D, the crystal is heated, and the temperature is raised to, for example, 10; J_, _p, especially, in the semiconductor substrate test device 1 of this example, before the two-circle test is performed, or during the wafer test, it takes: m test self test | § body i 〇 through the test head 20 After the waveform of the measured signal sent to the module, the phase of each test signal is corrected. That is, "Move the wafer table 31 in the χγ plane" so that the measurement wafer 35 fixed to the flange 1 is located below the probe card 34. Here, if a pin 342 of the probe 4 and a ground portion 343 formed in the vicinity of the probe 4 are in contact with the 7 portions 353 and the pins 352, the wafer table is raised. Then, after sending the predetermined test signal from the tester body 10 in this state, it is observed with an oscilloscope. In this example, because it is at the same position as the component part of the wafer w where the test signal is actually input, the front end of the pin 342 of the probe card 34 is used as the test signal input part to the oscilloscope 40. The waveform of the signal becomes approximately equal to the actual input. In addition, since the grounding portion 3 4 3 is provided near the pin 3 4 2 on the detection card 34, noise and other signal waveforms observed with the oscilloscope 40 are also extremely suppressed, and as a result, a correct test signal wave can be obtained.

2030-3398-PF.ptd Page 12

Claims (1)

541430 _ Tiger 891171QQ φ ^ C \ l 0, 1 ", one of the patent application scopes and one type of semiconductor substrate test device, test the signal after the complex test signal is formed on the substrate of the leather substrate, According to the results, the module development is judged. The semiconductor substrate test device includes: a pin-shaped contact, which is in electrical contact with the component; a connection = card 2 with one main surface provided near the first pin-shaped contact; 4 'Electrically connected to the test head substrate; $ contact' is in electrical contact with the pin; and No. ::: ί :: It is provided on one of the main surfaces to be electrically and electrically connected to the ground contact measurement 2 ΐ t Please refer to the semiconductor substrate test device in the first scope of the patent, 'the column and the right: according to the row of the first pin-shaped contact and the grounding part of the probe card', there is a second pin-shaped contact that constitutes a pair or more And the contact part. Including the semiconductor substrate test device with the quantity = item 18, and the contact between the needle contact and the ground part is also included. "The semiconductor device test device including item 1 in the scope of its patent application is also included below. The card is wrong :: Enabling the assembly portion and the probe needle contacts Bian contacting a brother; measuring the wafer provided on the substrate stage. The semiconductor substrate test device of the range i, the signal characteristic measurement device, is connected to the output terminal of the measurement wafer and outputs the characteristics of the test signal. 6. If the semiconductor substrate testing device of item 5 of the patent application scope, the characteristic of the test signal is a signal waveform. Λ 2030-3398-PFl.ptc Page 14B Month Mikity 891171QA Patent application scope ^ A probe card for a semiconductor substrate test device is electrically connected to the test head substrate of a half-gamma, board test device, and on one main surface A plurality of pin-shaped contacts that are in contact with the component portion of the semiconductor substrate are provided, and a ground portion is provided near the pin-shaped contacts. 8 · If a probe for a semiconductor substrate test device according to item 7 of the scope of patent application is used, the grounding portion and a plurality of needle contacts are provided together. 9 · A wafer for measuring a semiconductor substrate testing device, comprising: a contact portion electrically contacting a first pin-shaped contact provided on the probe of the semiconductor substrate testing device; and a second pin-shaped contact, Electrically contact a ground portion provided near the first pin-shaped contact. 1. The amount of test signal characteristics in a semiconductor substrate test device 2. 〃 =, use a probe card to send a test signal to the component part formed on the semiconductor substrate and test it, and judge the component part according to the result Fortunately, the probe card is electrically connected to the semiconductor substrate test board, and the name is _ 士 &% @ 7, the column head is adjacent to the base, -f is placed on the electrical and semiconductor substrate components 2 = 1 Needle-shaped contacts, and are arranged or routed close to these needle-shaped contacts ^ Prepare before sending a test signal to the component part formed by 4 semiconductor substrates: a wafer for measurement, the measurement wafer is set on one main surface 1 The contact portion of the first pin-shaped contact and the second pin-shaped contact that is electrically contacted with the ground portion;-, the first pin-shaped contact of the probe card and the measurement chip Pick up 2030-3398-PFl.ptc Year e,, _ case number 89117199_ year month date __., B IT-Λ VI. Patent application contact, and the grounding part of the aforementioned probe card and the second needle-like point of the aforementioned measurement chip, constitute Electrical contact; sending a test signal to the probe card and inputting it to the measurement chip; testing the test signal input to the measurement chip. 11. According to the method for measuring the characteristics of a test signal on a semiconductor substrate test device under the scope of the patent application No. 10, the characteristic of the test signal is a signal waveform. 1 2. If the method for measuring the characteristics of the test signal on a semiconductor substrate test device according to item 10 or 11 of the scope of the patent application, the method further includes: combining the characteristics of the aforementioned test signal with the characteristics of a regular test signal Performing comparison; and correcting the test signal according to the aforementioned comparison result. 2030-3398-PFl.ptc Page 16