JP3019355U - Probe card for testing semiconductor wafers - Google Patents

Abstract

(57) [Summary] [Purpose] To provide a probe card having excellent impedance characteristics, which can sufficiently cope with the measurement even if the number of electrode pads of the device under test increases. [Structure] Each of the contact needle insertion guide portions 12 of the insulating substrate 10 provided with the contact needle insertion guide portions 12 corresponding to the arrangement of the electrode pad of the DUT is formed by bending one conductive wire. Vertical contact parts and inclined parts are formed, and the vertical contact parts of the contact needles 20 to which the spring property is imparted throughout are inserted and aligned in the same plane, and each contact needle 20 has its rear end. Part of the test piece is fixedly pressed by a pressing plate 30 which is movable from above, and the vertical contact part of the contact needle 20 is brought into contact with each electrode pad of the DUT to test the electrical characteristics of the DUT. Be seen.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a probe card for testing electrical characteristics of electronic components having fine electrodes such as semiconductor wafers and liquid crystal substrates. More specifically, it is used for fine electrode pads for connection to external terminals such as semiconductor wafers and liquid crystal substrates. The present invention relates to a probe card in which a contact needle is brought into contact and a voltage or current is applied to test its electrical characteristics.

[0002]

[Prior art]

 As is well known, in the final process of manufacturing semiconductor wafers, liquid crystal substrates, etc., in order to reduce the cost, the electrical characteristics are tested to check whether these chips are good or bad. Such a check is performed with the probe card connected to a device called a prober, and the contact needles of the probe card are in contact with the fine electrode pads for connection of electronic components such as semiconductor chips. . As a conventional probe card of this type, although not particularly shown, a large number of contact needles with tapered tips on the bottom surface of the substrate are arranged in a fan shape around the tip, and It is generally attached by fixing an area of about 3 to 7 mm with an adhesive, and the rear end of the contact needle is generally electrically connected to the pattern on the printed circuit board by soldering. It was

[0003]

[Problems to be solved by the device]

 By the way, in the conventional probe card, since many contact needles are arranged in a fan shape, when the number of electrode pads arranged in a straight line increases, the rear end portion of the contact needles spreads too much and the arrangement becomes improper. Since it is possible, there is a problem that the number of contact needles to be arranged is limited, and due to the structure of the contact needles being long, the impedance matching that a metal plate or metal foil is fixed to the bottom surface of the substrate No countermeasures can be taken, and after the total number of contact needles has contacted each electrode pad, the contact needles are further bited into the electrode pads to reduce the contact resistance, and the test is performed. The amount of movement of the contact needle is extremely small, 0.1 to 0.15 mm, and there is a problem that the contact needle will be deformed or damaged if it is bitten further. The fact that there was no initial pressure at the initial stage of the contact needle also caused deterioration of contact resistance. As described above, the conventional probe card is limited in the number of contact needles, the contact area, and the length, and the simultaneous measurement of a large number of ICs, the IC measurement of 500 to 1000 pins, and the batch of a large-area liquid crystal substrate. Measurements were difficult and these measurements were done in pieces. Also, in the conventional probe card, the contact needles are fixed with an adhesive, so not only can the contact needles not be replaced due to wear, but also the probe needles require considerable skill in arranging the contact needles during processing and assembly. There is a problem that the card assembling work cannot be easily performed.

The present invention has been made in view of the above problems of the conventional technique, and an object thereof is to increase the number of electrode pads to be tested or increase the area thereof. In addition, it is possible to deal with the parallelism error that could not be covered by the conventional one because the movement amount of the contact needle is 1 mm or more, and there is an initial pressure that stabilizes the contact resistance. However, even with the same contact needle, the final pressure suitable for the DUT can be set at the time of manufacturing, it has excellent impedance characteristics, and individual contact needles can be replaced, and the arrangement of contact needles is easy for assembly. The purpose is to provide a probe card that is much easier to assemble.

[0005]

[Means for solving problems]

 For these purposes, the present invention provides an insulating substrate having a large number of contact needle insertion guide portions around the opening or at the edge corresponding to the arrangement of electrode pads of a device under test such as a semiconductor wafer, and one insulating substrate. The conductive wire is bent to form a vertical contact portion for the electrode pad, a short upward slant portion and a long downward slant portion, and the vertical contact portion is inserted into each of the insertion guide portions of the insulating substrate to form the same plane. The present invention is characterized by comprising a large number of contact needles arranged in a line and a movable holding plate that holds the arranged contact needles on the insulating substrate by sandwiching the contact needles from above.

[0006]

【Example】

 An embodiment will be described with reference to the drawings together with the operation thereof. FIG. 1 is a plan view showing an example of a probe card suitable for contacting electrode pads arranged in a rectangular shape on the periphery of a semiconductor wafer chip, and FIG. 2 is an enlarged vertical cross-sectional view of the same, in which the present invention is proposed. The probe card is composed of an insulating substrate, a large number of contact needles, and a plurality of holding plates.

The insulating substrate 10 has a rectangular shape as a whole, and has a rectangular opening 11 corresponding to the arrangement of the electrode pads 101 of the device under test 100 such as a semiconductor wafer in a substantially central portion thereof. A large number of contact needle insertion guide portions 12 are provided at equal intervals in the vertical direction around the opening 11. The contact needle insertion guide portion 12 is for inserting a vertical contact portion of a contact needle which will be described later, and as shown in FIGS. 3 and 4, the tip of the opening periphery of the insulating substrate 10 is slanted. As the cut vertical groove, the contact state between the electrode pad 101 and the contact needle contact portion can be visually confirmed, or as shown in FIGS. 5 and 6, a vertical round hole may be used. It is optional to select it.

As illustrated in FIG. 7, the contact needle 20 is formed by bending one thin conductive wire. To explain further, the vertical contact portion 21 and the short upward sloped portion 22 are formed by the first bending process with an angle for making contact with the electrode pad 101 almost vertically, and then the restoring force is increased to increase the stroke. A second downward bending portion 23 is formed by the second bending process for obtaining the initial pressure at the time, and the contact needle has a spring property as a whole. Then, as shown in FIGS. 1 and 2, the contact needles 20 are aligned and arranged on the same plane by inserting the respective vertical contact portions 21 into the respective guide portions 12. At the same time, it is held by a holding plate described later. A step surface portion 13 is formed on the lower surface of the insulating substrate 10 and up to a portion of each contact needle 20 close to the short upward inclined portion 21, and a metal plate or a metal foil 14 is formed on the step surface portion 13. The contact needles 20 are firmly fixed so that the impedance of each contact needle 20 can be maintained well. As shown in FIG. 1, the holding plate 30 has a rectangular shape having a sufficient length to hold all the contact needles 20 arranged on each side of the opening 11 in the direction orthogonal to the insulating plate. It is composed of a plate 31 and a metal plate 32 which is superposed and fixed on the insulating plate 31, and the holding plate 30 is provided so as to be movable along the direction in which the contact needles 20 are aligned. To further explain, as shown in FIGS. 1 and 8, the contact is made outside the double-sided contact needles 20 arranged around each opening 11 in the insulating substrate 10 including the metal plate or the metal foil 14, and the contact is made. Long grooves 15 are formed in parallel with the needles 20, the female connecting member 16 with the flange portion 17 is loosely inserted into the holding plate 30 from below the respective long grooves 15, and the male screw 18 from the holding plate 30 side is connected to the female type. It is attached by screwing into the screw hole 19 of the member 16, and by loosening the male screw 18 and displacing the holding plate 30 in the left-right direction along the long groove 15, it is suitable for the DUT 100 with the same contact needle 20. The initial pressure and final pressure can be set.

The probe card shown in FIGS. 9 to 11 is used when the DUT 100 is a liquid crystal substrate or the like, and the contact needles 20 are aligned and arranged on the linear edge portion of the insulating substrate 10. The probe card is different from the probe card shown in FIG. 1 only in that it is provided, and other configurations are exactly the same. Therefore, only the reference numerals are attached and the description of the configuration is omitted.

[0010]

[Effect of device]

 Therefore, according to the present invention, the vertical contact portions 21 of the contact needles 20 are linearly arranged by being inserted into the respective penetration guide portions 12 of the insulating substrate 10, so that It is possible to cope with an increase in the number of electrode pads 101 or an increase in the area, and it is also possible to cope with the parallelism error that could not be covered by the conventional one because the movement amount of the contact needle 20 is 1 mm or more. It is possible.

Further, according to the present invention, since the vertical contact portion 21 of the contact needle 20 is inserted and aligned with the guide portion 12 and aligned on the insulating substrate 10, a metal plate is formed on the lower surface of the insulating substrate 10. Alternatively, the metal foil 14 can be provided, and the impedance of the contact needle 20 can be excellently maintained.

Further, according to the present invention, since the contact needle 20 is fixedly pressed at the rear end portion of the insulating substrate 10 by the pressing plate 30 which is movable from above, the contact needle 20 is In the case of wear or the like, it is possible to release the pressing by the pressing plate 30, remove it from the guide portion 12, and replace it with a new one. In addition, since the contact needle 20 is formed into a spring-like structure having a restoring force as a whole by bending one conductive wire, an initial pressure that stabilizes the contact resistance can be obtained, and further the pressing plate can be obtained. Since 30 is provided so as to be movable, it is possible to set the initial pressure and the final pressure suitable for the DUT 100 even with the same contact needle 20 by shifting the pressing plate 30 in the left-right direction.

Further, according to the present invention, since the tip of the contact needle insertion guide portion 12 in the insulating substrate 10 is cut obliquely, the contact state between the electrode pad 101 and the contact needle contact portion 21 is maintained. You can see.

Further, according to the present invention, since the vertical contact portions 21 of the contact needles 20 are aligned with each other by being inserted into the guide portions 12, a probe for aligning the contact needle contact portions 21 and the like is provided. Card assembly work is much easier.

[Brief description of drawings]

FIG. 1 is a plan view of an example of a probe card according to the present invention.

FIG. 2 is an enlarged vertical sectional view of the above.

FIG. 3 is an enlarged plan view showing an example of a contact needle insertion guide portion.

FIG. 4 is a vertical sectional view of the above.

FIG. 5 is an enlarged plan view showing another example of the contact needle insertion guide portion.

FIG. 6 is a vertical sectional view of the above.

FIG. 7 is a side view of the contact needle.

FIG. 8 is a partially enlarged cross-sectional view showing a moving structure of a holding plate.

FIG. 9 is a partially omitted plan view showing another example of the probe card according to the present invention.

FIG. 10 is an enlarged side view of FIG.

11 is a partial cross-sectional view of FIG.

[Explanation of symbols]

 10 Insulating Substrate 11 Opening 12 Contact Needle Penetration Guide 13 Stepped Surface 14 Metal Plate or Metal Foil 15 Long Groove 16 Female Connecting Member 18 Male Screw 20 Contact Needle 21 Vertical Contact 22 Short Upward Slope 23 Long Downward Slope 30 Presser Plate 100 DUT 101 Electrode pad

Claims (5)

[Scope of utility model registration request] 1. An insulating substrate having a large number of contact needle insertion guide portions around openings corresponding to an array of electrode pads of a device under test such as a semiconductor wafer, and one conductive wire is bent to form the electrode pad. A plurality of contact needles formed with a vertical contact portion, a short upward slant portion and a long downward slant portion, and the vertical contact portions being inserted into the respective insertion guide portions of the insulating substrate and aligned in the same plane; A test probe card for a semiconductor wafer or the like, comprising: a holding plate that holds the contact needles arranged in an array on the insulating substrate by holding it from above. 2. An insulating substrate having a large number of contact needle insertion guide portions at its linear edges corresponding to the arrangement of electrode pads of a device under test such as a liquid crystal substrate, and a single conductive wire is bent to form an insulating substrate. A vertical contact portion, a short upward slant portion and a long downward slant portion for the electrode pad are formed, and the vertical contact portion is inserted into each of the insertion guide portions of the insulating substrate and arranged in the same plane. A test probe card for a semiconductor wafer or the like, comprising a contact needle and a holding plate for holding and holding the contact needles aligned and arranged on the insulating substrate from above. 3. A metal plate or a metal foil is fixed to a step surface portion formed on the lower surface of the insulating substrate and extending to a portion close to the short upward inclined portion of the contact needle. A probe card for testing a semiconductor wafer according to claim 1 or 2. 4. The holding plate is composed of an insulating plate and a metal plate that is superposed and fixed on the insulating plate, and is provided so as to be movable along the alignment arrangement direction of the contact needles. A probe card for testing a semiconductor wafer or the like according to claim 1. 5. The contact needle insertion guide portion of the insulating substrate is a vertical groove that is obliquely cut so that a contact state between a through vertical hole or a contact needle contact portion and an electrode pad can be visually confirmed. 5. A probe card for testing a semiconductor wafer or the like according to claim 1.