JPH04109646A - Semiconductor probing testing device - Google Patents

Abstract

PURPOSE:To efficiently test a semiconductor device and to reduce a production cost by so altering the angle of a probe card by holding means as to bring a plurality of probe styluses into sufficient contact with the corresponding electrodes of the device. CONSTITUTION:Holding means 20, 21 can so alter an elevation angle of a probe card 2 as to bring a plurality of probe styluses 31, 32 into sufficient contact with corresponding electrodes of a semiconductor device 4. The means 20, 21 desirably have node coupling units having degree of two or more freedoms such as, for example, ball joints, cross joints, etc. Thus, even if a semiconductor device 4 to be tested is inclined to the stage 1, the styluses 31, 32 can be effectively brought into contact with the corresponding electrodes of the device, and the device which cannot heretofore use a probe card, can be tested.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to semiconductor probing test equipment. More specifically, the present invention relates to a semiconductor probing test device that tests the electrical characteristics of a semiconductor device.

BACKGROUND OF THE INVENTION Electrical characteristics of a semiconductor device including a semiconductor chip such as a conventional LSI are often measured in order to confirm the operation after each step in the development stage and manufacturing stage.

A semiconductor probing test device is generally used to test this electrical property. A semiconductor probing test apparatus includes a stage on which a semiconductor device to be tested is mounted, and a probe card including a probe needle that contacts a test circuit and an electrode of the semiconductor device to electrically connect the electrode of the semiconductor device and the test circuit. A probe card is generally equipped with a plurality of probe needles.

FIG. 3 shows a schematic perspective view of the probe card.

The probe card shown in FIG. 3 includes a substrate 30 on which a test circuit is formed, and probe needles 31 to 36 arranged in a hole 40 in the center of the substrate 30 so as to protrude from the periphery.

The probe needles 31 to 36 are the input/output terminals of the above-mentioned test circuit, and are made of tungsten and have very thin and sharp tips, and are shaped to be suitable for contacting minute electrodes of semiconductor devices. Also, the tip is usually bent downward. The probe needles 31 to 36 are arranged in correspondence with the arrangement of electrodes of the semiconductor device to be tested, and when testing, they respectively contact the electrodes of the semiconductor device at the same time.

Problems to be Solved by the Invention In the conventional semiconductor probing test apparatus described above, the stage and the probe card are arranged so as to face each other in parallel. For example, when testing a semiconductor chip such as an LSI mounted on a substrate at an angle, some of the probe needles may not be able to make sufficient contact with the electrodes of the semiconductor chip.

FIG. 2 is a schematic cross-sectional view of a case where a conventional semiconductor probing test apparatus tests a semiconductor chip tilted and mounted on a hybrid IC substrate. In Figure 2,
The semiconductor probing test apparatus includes a stage 1 and a probe card 2 similar to the one shown in FIG. 3 held by an arm 21. For simplicity, it is assumed that the probe card 2 is provided with two probe needles, probe needles 31 and 32. Probe card 2 is arm 2
The probe card 2 is held parallel to the stage 1 by the probe card 1, and the longitudinal and horizontal positional relationships and distances between the probe card 2 and the stage 1 can be adjusted as desired.

A hybrid IC board 5 on which a semiconductor chip 4 is fixed with paste 6 is mounted on the stage 1. As shown in the drawing, the semiconductor chip 4 is fixed to the hybrid IC substrate 5 in an inclined manner so that the right side of the drawing is higher. As described above, it is common for the semiconductor chip 4 to be fixed at an angle as a result of production variations, which may affect the performance of the product.
It has no effect on quality.

However, when testing the semiconductor chip 4 shown in FIG. 2, the probe card 2 is brought close to the stage 1,
Even if the probe needles 32 are brought into contact with the corresponding electrodes of the semiconductor chip 4, the probe needles 31 do not come into contact with the electrodes of the semiconductor chip 4. If the probe card 2 is brought close to the stage 1 until the probe needles 31 come into contact with the corresponding electrodes, the probe needles 32 and the electrodes in contact with the probe needles 32 will be damaged.

Therefore, conventionally, when testing a semiconductor chip mounted on a hybrid IC board at an angle,
The test was conducted without using a probe card, using a testing device in which each probe needle could be moved independently, and by bringing each probe needle into contact with the electrode one by one. However, carrying out a test by bringing each probe needle into contact with an electrode is very time-consuming and inefficient.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor probing test device that solves the problems of the prior art described above.

Means for Solving the Problems According to the present invention, a stage on which a semiconductor device to be tested is mounted, a circuit for measuring the electrical characteristics of the semiconductor device, and an electrode of the semiconductor device are in contact with each other. In a semiconductor probing test device comprising a probe card having a plurality of probe needles electrically coupled to the device, and a holding means for holding the probe card, each of the plurality of probe needles is connected to a corresponding electrode of the semiconductor device. There is provided a semiconductor probing test apparatus characterized in that the holding means can change the angle of the probe card so that the probe card is in sufficient contact with the probe card.

Function: The semiconductor probing test device of the present invention includes a stage;
Since the angle between the probe card and the probe card can be changed, even if the semiconductor device to be tested is tilted with respect to the stage,
It is possible to reliably bring the probe needle into contact with the corresponding electrode of the semiconductor device.

The holding means of the semiconductor probing test apparatus of the present invention has two degrees of freedom, such as a ball joint or a cross joint.
It is preferable to include the above-mentioned joint joint portion.

EXAMPLES Hereinafter, the present invention will be explained in more detail with reference to Examples, but the following disclosure is merely an example of the present invention and does not limit the technical scope of the present invention in any way.

Embodiment FIG. 1(a) shows a schematic perspective view of a semiconductor probing test apparatus of the present invention. The semiconductor probing test apparatus shown in FIG. 1 includes a stage 1 and a probe card 2 held by an arm 21 having a ball joint 20. As shown in FIG. The probe card 2 is equipped with probe needles 31 and 32. The angle of the probe card 2 can be arbitrarily changed by the ball joint 20, and the distance and the positional relationship between the probe card 2 and the stage 1 in the front, rear, left and right directions can be adjusted as in the conventional case.

A semiconductor chip 4 is placed on the stage 1 as in the case of FIG.
A hybrid IC board 5 which is tilted and fixed with paste 6 is mounted. In the semiconductor probing test apparatus of the present invention, even if the semiconductor chip 4 is tilted as shown in FIG. The angle of the probe card 2 can be changed to make contact with the probe card 2.

The semiconductor probing test device of this embodiment has an arm 21
Although the angle of the probe card 2 is changed by the ball joint 20 provided therein, the aspect of the semiconductor probing test apparatus of the present invention is not limited to this. for example,
A cross joint can also be used instead of a ball joint.

As described in detail, the semiconductor probing test apparatus of the present invention is capable of testing semiconductor devices for which conventional probe cards could not be used. Therefore, it is possible to test semiconductor devices more efficiently than in the past, which is effective in reducing production costs.

[Brief explanation of the drawing]

FIG. 1(a) is a schematic perspective view of a semiconductor probing test device of the present invention, and FIG. 1(b) is a schematic diagram of testing a semiconductor device with the semiconductor probing test device of the present invention. FIG. 2 is a schematic cross-sectional view of a conventional semiconductor probing test device used to test a semiconductor chip tilted and mounted on a hybrid IC board, and FIG. 3 is a schematic perspective view of a probe card. . [Main reference numbers] 1... Stage, 2... Probe card, 31-36... Probe needle, 4... Semiconductor chip, 5... Hybrid IC board

Claims (1)

[Claims] A stage on which a semiconductor device to be tested is mounted, a circuit for measuring the electrical characteristics of the semiconductor device, and a plurality of probe needles that contact electrodes of the semiconductor device and electrically couple the circuit and the semiconductor device. and a holding means for holding the probe card, wherein the holding means holds the probe card so that the plurality of probe needles are in sufficient contact with the corresponding electrodes of the semiconductor device. A semiconductor probing test device characterized in that the angle of the semiconductor probing test device can be changed.