JP2004158351A - Socket board for ic device test - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable a test of an IC device by sharing a socket board. <P>SOLUTION: Lands of patterns corresponding to a connecting terminal arrangement of the IC device are respectively formed on both faces of the socket board for the test. That is, in the socket board for the test, because the lands of the patterns corresponding to the connecting terminal arrangement of the IC device which has an even number of terminal arrangement are formed on one face, and because the lands of the patterns corresponding to the connecting terminal arrangement of the IC device which is an odd number of terminal arrangement is formed on another face, it becomes possible to inspect the IC devices of the even number terminal arrangement or the odd number terminal arrangement by exchanging the front and the rear of the socket board for the test. Thus, it becomes possible to test different kinds of IC devices by sharing one socket board for the test. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a test socket board used for an IC test apparatus for evaluating electrical characteristics of an IC device (semiconductor integrated circuit). In particular, even if a plurality of connection terminals provided in a packaged IC device such as a CSP (Chip Scale Package) type or a BGA (Ball Grid Array) type are either an odd-numbered terminal array or an even-numbered terminal array. A test socket in which a single test socket board can be shared and IC devices having the above terminal arrangements can be inspected without separately manufacturing a dedicated test socket board for each of these IC devices. About the board.
[0002]
[Prior art]
Recently, an IC called a CSP (Chip Scale Package) type or a BGA (Ball Grid Array) type, in which a large number of connection terminals formed of spherical electrodes such as solder balls are arranged in a grid on one side of a miniaturized package. The device has been put to practical use. In order to ship such packaged IC devices such as CSP type and BGA type as final products whose performance and quality are guaranteed, all or part of the IC devices are extracted in each step of the manufacturing department and the inspection department. It is necessary to inspect its electrical characteristics. The IC test device is a device for inspecting the electrical characteristics of the IC device. The device under test (DUT: Device Under Test) mounted on the test socket board, that is, the connection terminals of the IC device to be tested. A predetermined test pattern data is given, the output data from the device under test is read out, and the output data is analyzed to determine whether there is any problem in the basic operation and function of the device under test. Is going. In such an IC test apparatus, in general, a large number of the same type of IC devices can be easily exchanged and inspected without directly mounting the IC devices directly on a test socket board. An IC device is indirectly mounted on a test socket board via a mountable IC socket.
[0003]
[Problems to be solved by the invention]
By the way, on the surface of the conventional test socket board on the IC socket side, a connection region made of a conductor (for example, a thin metal wire) called a land is arranged corresponding to the arrangement of connection terminals of the IC devices mounted on the IC socket. The connection terminals and the lands are in contact with each other to ensure electrical connection between the IC device and the test socket board. Therefore, if the arrangement of the connection terminals is different, such as the arrangement of the odd-numbered terminals or the arrangement of the even-numbered terminals, even if the external shape of the IC device is the same, the electric connection between the IC device and the test socket board is made. In order to ensure a proper connection, it is necessary to individually manufacture a test socket board having a land pattern formed so as to correspond to each of the odd-numbered terminal arrangement and the even-numbered terminal arrangement according to each IC device. However, it takes a long manufacturing time and high manufacturing cost to individually manufacture the test socket board according to the type of the IC device. Therefore, until the new test socket board is completed, the user must use the IC device. No tests could be performed. That is, there is a problem that the production of a test socket board according to each of the odd-numbered terminal arrangement and the even-numbered terminal arrangement IC devices has caused delays in development of the IC devices and increased development costs. there were.
[0004]
The present invention has been made in view of the above points, and the arrangement of a plurality of connection terminals provided in a packaged IC device such as a CSP type or a BGA type is either an odd terminal arrangement or an even terminal arrangement. However, a test in which a single test socket board is shared and the IC devices of the above-described terminal arrangements can be inspected without separately manufacturing a dedicated test socket board for each of these IC devices. It is intended to provide a socket board for use.
[0005]
[Means for Solving the Problems]
In the test socket board according to the first aspect of the present invention, the IC socket and the test socket board are aligned by positioning pins so as to be located on the center (distributed to the center), and the electrical characteristics of the IC device are determined. A test socket board used for electrically connecting an IC device exchangeably mounted on an IC socket when performing an inspection, wherein an even-numbered terminal array is arranged on one surface of the IC device. A land having a pattern corresponding to the arrangement of the connection terminals of the IC device having an odd-numbered terminal arrangement on the other surface, and a surface facing the IC device mounted on the IC socket. By selectively using one of the surfaces according to the connection terminal arrangement of the IC device, Characterized in that to be able to ensure electrical connection to the device.
[0006]
According to the present invention, it becomes possible to inspect IC devices having different connection terminal arrangements by sharing one test socket board. That is, the test socket board has lands of a pattern corresponding to the arrangement of the connection terminals of the IC devices having an even-numbered terminal arrangement on one surface, and the arrangement of the connection terminals of the IC devices having the odd-numbered terminal arrangement on the other surface. Since the lands having the corresponding patterns are formed, it is possible to inspect an IC device having an even-numbered terminal arrangement or an odd-numbered terminal arrangement by reversing the front and rear sides of the test socket board. In this way, different types of IC devices can be inspected by sharing one test socket board.
[0007]
The test socket board according to claim 2 of the present invention is a test socket board used for electrically connecting an IC device exchangeably mounted on an IC socket when inspecting electrical characteristics of the IC device. And a land having a pattern corresponding to the arrangement of the connection terminals of the IC device, which is an even-numbered terminal arrangement and an odd-numbered terminal arrangement, is formed integrally on only one surface, and the lands correspond to the connection terminal arrangement of the IC device. By being selectively used, electrical connection with IC devices having different connection terminal arrangements can be secured. According to this, an IC device having an even-numbered terminal arrangement or an odd-numbered terminal arrangement can be inspected on only one side without changing the front and back of the test socket board.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
[0009]
FIG. 1 is a perspective view showing an outline of the overall configuration of a test socket board according to the present invention. As can be understood from FIG. 1, an IC device (not shown) such as a CSP (Chip Scale Package) type or a BGA (Ball Grid Array) type to be tested is predetermined for the test socket board 1 according to the present invention. An IC socket 3 that can be mounted at a position can be removably mounted. An IC device such as a CSP type or a BGA type mounted on the IC socket 3 is an IC device having a structure in which a large number of connection terminals formed of spherical electrodes such as solder balls are arranged in a lattice on one side of a miniaturized package. is there. On the front and back surfaces of the test socket board 1, circuits composed of chip resistors, capacitors, and the like are mounted on the respective surfaces, and in addition to the circuits, positions corresponding to the connection terminal arrangement of the IC devices mounted on the IC socket 3. The terminal connection part 2 is formed of a conductor (for example, a thin metal wire or the like) called a plurality of lands arranged on the terminal. Since the detailed description of the land in the terminal connection portion 2 will be described later, the description here is omitted.
[0010]
Inspection of the IC device mounted on the IC socket 3 involves transmitting and receiving various signals between the IC device and the test socket board 1 via one of the front and back circuits of the test socket board 1 facing the IC socket 3. It is done by doing. That is, the IC socket 3 has a connection terminal composed of a plurality of spherical electrodes formed on an IC device to be tested mounted at a predetermined position and a plurality of lands formed on the terminal connection portion 2 of the test socket board 1. The electrical connection between the IC device and the test socket board 1 is ensured by being attached to the test socket board 1 so as to be in contact with each other. Then, a value (for example, address data, test pattern data, a write enable signal, a chip select signal, etc.) applied from each circuit surface-mounted on the test socket board 1 to the IC device mounted on the IC socket 3 And various signals such as reference information (also referred to as judgment values) are transmitted, and the obtained output data from the IC device (eg, output voltage data, output timing measurement values, pass / fail data, etc.) is analyzed. The inspection of the IC device is performed. The IC socket 3 allows the user to easily replace the IC device to be tested, thereby enabling a large number of similar IC devices to be inspected sequentially and quickly.
[0011]
As described above, a plurality of lands are formed on each of the terminal connection portions 2 formed on the front surface and the back surface of the test socket board 1 according to the present invention, and the IC device to be tested mounted on the IC socket 3 The electrical connection between the IC device and the test socket board 1 is ensured by the contact between the connection terminals formed of a plurality of spherical electrodes provided on the socket and the lands. Therefore, lands formed on the terminal connection portions 2 on the test socket board 1 will be described with reference to FIG. FIG. 2 is a conceptual diagram showing one embodiment of a land pattern when lands are formed on both the front and rear surfaces of the test socket board. FIG. 2A shows a land pattern corresponding to an IC device having an even-numbered terminal array (10 × 10) formed on the front side of the test socket board, and FIG. 2B shows a land pattern formed on the back side of the test socket board. 3 shows a land pattern corresponding to an odd-numbered terminal array (9 × 9) IC device. However, in order to make the explanation easy to understand, only a part of the land pattern in the terminal connection part 2 of the test socket board 1 is enlarged. Further, an example in which a land is formed so as to correspond to a full-grid IC device as an IC device to be tested has been described.
[0012]
A plurality of through holes 2b penetrating through the substrate body of the test socket board 1 are formed in advance in the terminal connection portion 2 of the test socket board 1 in correspondence with the arrangement of the connection terminals X of the IC device. Reference numeral 2b electrically connects the front and back surfaces of the test socket board 1 and is also electrically connected to a test motherboard (not shown). The lands 2a are formed on the front surface or the back surface of the test socket board 1 in a pattern as shown in FIG. 2A or 2B with reference to each through hole 2b. That is, when the arrangement of the connection terminals X of the IC device is an even-numbered terminal arrangement as shown in the right diagram of FIG. 2A, the lands 2a are removed from the through holes 2b as shown in the left diagram of FIG. The area of the land 2a is expanded in a direction in which the formation direction is matched with the even-numbered terminal arrangement, that is, in a direction in which each connection terminal X of the IC device contacts the land 2a when the IC device is mounted on the IC socket 3. The land 2a is formed. In such an embodiment, when the test socket board 1 and the IC device are overlapped (that is, the IC device is mounted on the IC socket 3), each of the squares shown by dotted lines in FIG. All the lands 2a formed for each through hole 2b come into contact with each connection terminal X of the IC device (however, only some of the connection terminals X that are in contact are shown in the figure).
[0013]
On the other hand, in the case where the arrangement of the connection terminals X of the IC device is an odd-numbered terminal arrangement as shown in the right diagram of FIG. 2B, the land from each through hole 2b as shown in the left diagram of FIG. The area of the land 2a is extended in a direction in which the direction in which the 2a is formed matches the arrangement of the odd-numbered terminals, that is, in a direction in which the connection terminals X of the IC device and the land 2a come into contact when the IC device is mounted on the IC socket 3. To form the land 2a. In such an embodiment, when the test socket board 1 and the IC device are superimposed (that is, the IC device is mounted on the IC socket 3), all the lands 2a formed for each through hole 2b are integrated with the IC. Only the lands 2a formed for each through hole 2b shown in the square frame shown by the dotted line in the figure do not come into contact with each connection terminal X of the IC device. (However, only a part of the connection terminals X that are in contact is shown in the figure).
[0014]
As described above, the lands 2a electrically connected to the through holes 2b on the front side and the back side of the test socket board 1 differ depending on the arrangement of the connection terminals (even terminal arrangement or odd terminal arrangement) of the IC device. It is formed so that the area is widened in the direction. As a result, using both surfaces of one test socket board 1, it is possible to perform a test corresponding to an IC device having a different terminal arrangement such as an even terminal arrangement or an odd terminal arrangement. Note that the land 2a may be formed in a uniform size such that all contact positions are relatively the same, thereby simplifying the formation of the land 2a.
[0015]
In the above-described embodiment, the land 2a is formed on both sides of the test socket board 1 in accordance with the arrangement of the connection terminals X of the IC device. However, the present invention is not limited to this. Alternatively, the lands 2a having a predetermined pattern may be formed on only one side of the test socket board 1 so that an IC device having an even-numbered terminal arrangement or an odd-numbered terminal arrangement can be inspected. FIG. 3 shows an embodiment of a land pattern which can correspond to an even-numbered terminal arrangement or an odd-numbered terminal arrangement of only one side of the test socket board 1. FIG. 3 is a conceptual diagram showing one embodiment of a land pattern in the case where lands are formed only on one surface of the test socket board.
[0016]
As can be understood from FIG. 3, when the lands 2a that can correspond to the even-numbered terminal arrangement or the odd-numbered terminal arrangement of the IC device are formed on only one surface of the test socket board 1, each through hole 2b The direction in which the lands 2a are formed in accordance with the arrangement of the even-numbered terminal arrangement and the odd-numbered terminal arrangement, that is, the direction in which each connection terminal X of the IC device contacts the formed land 2a when the IC device is mounted on the IC socket 3. The land 2a is formed so as to expand the area of the land 2a. That is, the lands 2a are formed such that the area of the lands 2a extends in the contactable direction in each of the even-numbered terminal arrangement and the odd-numbered terminal arrangement centering on the through hole 2b. In such an embodiment, when the test socket board 1 and the IC device are superposed (that is, the IC device is mounted on the IC socket 3), if the terminal arrangement is an even-numbered terminal arrangement, each through hole 2b is provided. All the formed lands 2a are in contact with the respective connection terminals X of the IC device on the upper left side of the lands 2a, and in the case of an odd-numbered terminal arrangement, lands other than the lands 2a formed on the lowermost and rightmost side in the drawing. 2a is in contact with each connection terminal X of the IC device on the lower right side of the land 2a. By forming the lands 2a in this manner, it is possible to easily inspect an IC device having an even-numbered terminal arrangement or an odd-numbered terminal arrangement on only one side of the test socket board 1, that is, without having to turn over the test socket board 1. Will be able to
[0017]
The formation pattern of the land 2a formed on the test socket board 1 as shown in the above-described embodiment is an example, and is not limited to this. In other words, what kind of land 2a can be provided if each connection terminal X formed of a spherical electrode provided on the IC device and each land 2a formed on the terminal connection portion 2 of the test socket board 1 can come into contact with each other. It is needless to say that the formation pattern may be used.
[0018]
【The invention's effect】
According to the present invention, by forming a land having a pattern corresponding to each of the even-numbered terminal arrangement and the odd-numbered terminal arrangement of the IC device on the socket board, the IC socket, and one test socket board having the IC at the center position. Even if the IC devices have different terminal arrangements, it is possible to easily inspect these IC devices by sharing one test socket board without manufacturing a new test socket board. The excellent effect is obtained.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an outline of an overall configuration of a test socket board according to the present invention.
FIG. 2 is a conceptual diagram showing one embodiment of a land pattern in a case where lands are formed on both the front and rear surfaces of a test socket board. FIG. 2A shows a land pattern corresponding to an IC device having an even-numbered terminal arrangement, and FIG. 2B shows a land pattern corresponding to an IC device having an odd-numbered terminal arrangement.
FIG. 3 is a conceptual diagram showing one embodiment of a land pattern in a case where lands are formed only on one surface of a test socket board.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Test socket board, 2 ... Terminal contact part, 2a ... Land, 2b ... Through hole, 3 ... IC socket, X ... Spherical electrode (connection terminal)

Claims (2)

A test socket board used for electrically connecting an IC device exchangeably mounted on an IC socket when inspecting electrical characteristics of the IC device,
A land of a pattern corresponding to an arrangement of connection terminals of an IC device having an even-numbered terminal arrangement is formed on one surface, and a land of a pattern corresponding to an arrangement of connection terminals of an IC device having an arrangement of odd-numbered terminals is formed on the other surface. And
By selectively using one of the surfaces according to the connection terminal arrangement of the IC device as a surface facing the IC device mounted on the IC socket, electrical connection with IC devices having different connection terminal arrangements is achieved. A test socket board characterized in that it is possible to secure a test socket board. A test socket board used for electrically connecting an IC device exchangeably mounted on an IC socket when inspecting electrical characteristics of the IC device,
A land having a pattern corresponding to the arrangement of the connection terminals of the IC device having the even-numbered terminal arrangement and the odd-numbered terminal arrangement is integrally formed only on one surface,
A test socket board, wherein the lands are selectively used in accordance with the arrangement of connection terminals of an IC device, thereby ensuring electrical connection with IC devices having different arrangements of connection terminals.

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