JPH05347335A - Probe card - Google Patents

Abstract

PURPOSE:To easily investigate and judge whether it can be settled within the contact resistance value for being inspected normally separately with each probe needle for ground or bias of a probe card. CONSTITUTION:A switch 11 for short-circuiting or opening every probe needle is installed at the base of each probe needle 9 for ground or each probe needle 10 for bias, and one end of the preceding switch 11 is connected to a pattern for ground or a pattern for bias. Hereby, it follows that a switch 11 for short- circuiting or opening every probe needle is installed between the probe needle used for ground or bias and the pattern for ground or the pattern for bias provided on a probe card substrate, so when inspecting a semiconductor device with the probe card, it can be investigated and judged easily whether the device can be settled within the contact resistance value for being normally inspected, separately with each probe needle.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card, and more particularly to a probe card that can be used when performing an electrical inspection in a semiconductor device manufacturing process.

[0002]

2. Description of the Related Art A conventional probe card has a probe card substrate 1 of an insulating flat plate on which wiring 4 used for inspecting a semiconductor device is printed as shown in FIG.
The probe needle 2 to be brought into contact with the electrode pad of the semiconductor device is fixed by an adhesive 3 and is connected to the printed wiring 4 on the probe card substrate 1.

As shown in FIG. 2A, the wiring 4 is connected with one of the input / output signal probe needles 6 to one of the input / output signal patterns 5, and the ground pattern 7 or the bias pattern 8 is provided. One or more of the ground probe needles 9 and the bias probe needles 10 were directly connected to each of them.

When a semiconductor device is inspected using the above-mentioned probe card, the probe needle tip and the electrode pad of the semiconductor device are brought into contact with each other, but a contact resistance value is expected in order to normally inspect the semiconductor device. Must be a value within the range. As an example of a method for investigating whether or not the probe card is in a state capable of containing the value within the contact resistance value, a probe is provided on a semiconductor wafer coated with the same metal film as the electrode pad of the semiconductor device. Touch the needle,
There is a method in which a continuity test is performed for each pair of two probe needles to obtain a contact resistance value.

[0005]

In the conventional probe card, the ground pattern or the bias pattern 1 is used.
One or more ground probe needles or bias probe needles are directly connected to the book, so that the probe card can contain the value within the contact resistance value necessary for inspecting the semiconductor device. When investigating whether or not there is only one ground probe needle for one ground pattern, the above-mentioned investigation is possible.
If there are two or more probe needles connected to the ground pattern or bias pattern, check whether all the ground probe needles or all bias probe needles can accommodate the expected contact resistance value. It was difficult to do.

[0006]

A probe card according to the present invention includes a probe needle used for grounding or biasing and a probe needle for grounding or biasing provided on a probe card substrate. Each switch has a short or open switch.

Since the switch is provided for each ground probe needle in this way, only one ground probe needle or only one bias probe needle is used by the switch for ground when conducting the above-mentioned continuity test. It can be performed by connecting to a pattern or a bias pattern.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a top view of a probe card according to an embodiment of the present invention. In manufacturing the probe card, first, the probe needles 6, 9 and 10 are fixed to the probe card substrate 1 with the adhesive 3 (see FIG. 2B). Each of the ground probe needle 9 and the bias probe needle 10 is provided with a switch 11 for shorting or opening one by one, and one end of the switch 11 is connected to the ground pattern 7 or the bias pattern 8. The needle base of the input / output signal probe needle 6 is directly connected to the input / output signal pattern.

When conducting the continuity test of the probe card of the present invention described above, only one of the ground probe needles 9 is switched to the ground pattern 7 by the switch 11, and only one of the bias probe needles 10 is switched. Is connected to the bias pattern 8 and is performed. When the first introduction test is completed, only one of the other ground probe needles 9 is connected to the ground pattern 7 by the switch 11, and another one of the bias probe needles 10 is connected by the switch 11 to establish continuity. Conduct the test. When there are two or more ground probe needles or bias probe needles, the above operation is repeated.

[0010]

As described above, the probe card of the present invention is short-circuited for each probe needle between the grounding or bias pattern provided on the probe card substrate used for grounding or biasing. Equipped with a switch to open, so when inspecting semiconductor devices with a probe card, it is easy to investigate and determine whether or not it is possible to store the contact resistance value for proper inspection for each probe needle. Can be done

[Brief description of drawings]

FIG. 1 is a top view showing a probe card according to an embodiment of the present invention.

FIG. 2 is a diagram showing a prior art probe card;
(A) is a top view and (b) is a side sectional view.

[Explanation of symbols]

 1 Probe Card Board 2 Probe Needle 3 Adhesive 4 Wiring 5 I / O Signal Pattern 6 I / O Signal Probe Needle 7 Ground Pattern 8 Bias Pattern 9 Ground Probe Needle 10 Bias Probe Needle 11 Switch

Claims (1)

[Claims] 1. A probe card used for an electrical inspection in a semiconductor device manufacturing process, including a probe needle used for grounding or biasing, and a grounding or biasing pattern provided on a probe card substrate. A probe card comprising a switch for shorting or opening each of the probe needles between the two.