TWI495035B - - Google Patents

Info

Publication number
TWI495035B
TWI495035B TW101147490A TW101147490A TWI495035B TW I495035 B TWI495035 B TW I495035B TW 101147490 A TW101147490 A TW 101147490A TW 101147490 A TW101147490 A TW 101147490A TW I495035 B TWI495035 B TW I495035B
Authority
TW
Taiwan
Application number
TW101147490A
Other languages
Chinese (zh)
Other versions
TW201423899A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW101147490A priority Critical patent/TW201423899A/en
Publication of TW201423899A publication Critical patent/TW201423899A/en
Application granted granted Critical
Publication of TWI495035B publication Critical patent/TWI495035B/zh

Links

TW101147490A 2012-12-14 2012-12-14 Electric component pressing mechanism and testing facility applying the same TW201423899A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW101147490A TW201423899A (en) 2012-12-14 2012-12-14 Electric component pressing mechanism and testing facility applying the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101147490A TW201423899A (en) 2012-12-14 2012-12-14 Electric component pressing mechanism and testing facility applying the same

Publications (2)

Publication Number Publication Date
TW201423899A TW201423899A (en) 2014-06-16
TWI495035B true TWI495035B (en) 2015-08-01

Family

ID=51394134

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101147490A TW201423899A (en) 2012-12-14 2012-12-14 Electric component pressing mechanism and testing facility applying the same

Country Status (1)

Country Link
TW (1) TW201423899A (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI550747B (en) * 2014-07-03 2016-09-21 Chroma Ate Inc Temperature control of the floating buffer test seat
JP2016075550A (en) * 2014-10-06 2016-05-12 セイコーエプソン株式会社 Electronic component conveyance device and electronic component inspection device
CN105572437B (en) * 2014-10-16 2018-07-20 鸿劲科技股份有限公司 Electronic assembly test device and its test equipment of application
TW201809697A (en) * 2016-06-24 2018-03-16 鴻勁科技股份有限公司 Temperature control device for press-bonding unit of electronic component and testing device using the same capable of keeping the temperature difference between primary and secondary effect surfaces of a cooling chip within a better range
TWI580979B (en) * 2016-06-24 2017-05-01 Electronic components crimping device and its application test classification equipment
TWI623754B (en) * 2017-01-26 2018-05-11 Electronic component testing device and test classification device
TWI677685B (en) * 2018-10-08 2019-11-21 鴻勁精密股份有限公司 Electronic component test equipment
CN111044839B (en) * 2018-10-11 2022-02-25 鸿劲精密股份有限公司 Electronic component testing apparatus
TWI701450B (en) * 2019-07-17 2020-08-11 美商第一檢測有限公司 Environmental control equipment
TWI705257B (en) 2019-07-17 2020-09-21 美商第一檢測有限公司 Environmental control equipment
CN112309489A (en) * 2019-07-26 2021-02-02 第一检测有限公司 Environment control device
CN112309486A (en) * 2019-07-26 2021-02-02 第一检测有限公司 Chip testing device
CN112309487A (en) * 2019-07-26 2021-02-02 第一检测有限公司 Chip testing system
CN112309491A (en) * 2019-07-26 2021-02-02 第一检测有限公司 Environment control device
TWI714332B (en) * 2019-11-01 2020-12-21 美商第一檢測有限公司 Environmental control device and chip testing system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020011859A1 (en) * 1993-12-23 2002-01-31 Kenneth R. Smith Method for forming conductive bumps for the purpose of contrructing a fine pitch test device
US20070063721A1 (en) * 2005-09-19 2007-03-22 Formfactor, Inc. Apparatus And Method Of Testing Singulated Dies
EP1574865B1 (en) * 2002-12-04 2007-06-06 Advantest Corporation Pressing member and electronic component handling device
US7868636B2 (en) * 2007-05-11 2011-01-11 Amst Co., Ltd. Probe card and method for fabricating the same
WO2012159003A1 (en) * 2011-05-19 2012-11-22 Celerint, Llc. Parallel concurrent test system and method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020011859A1 (en) * 1993-12-23 2002-01-31 Kenneth R. Smith Method for forming conductive bumps for the purpose of contrructing a fine pitch test device
EP1574865B1 (en) * 2002-12-04 2007-06-06 Advantest Corporation Pressing member and electronic component handling device
US20070063721A1 (en) * 2005-09-19 2007-03-22 Formfactor, Inc. Apparatus And Method Of Testing Singulated Dies
US7868636B2 (en) * 2007-05-11 2011-01-11 Amst Co., Ltd. Probe card and method for fabricating the same
WO2012159003A1 (en) * 2011-05-19 2012-11-22 Celerint, Llc. Parallel concurrent test system and method

Also Published As

Publication number Publication date
TW201423899A (en) 2014-06-16

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