TWI495035B - - Google Patents
Info
- Publication number
- TWI495035B TWI495035B TW101147490A TW101147490A TWI495035B TW I495035 B TWI495035 B TW I495035B TW 101147490 A TW101147490 A TW 101147490A TW 101147490 A TW101147490 A TW 101147490A TW I495035 B TWI495035 B TW I495035B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101147490A TW201423899A (en) | 2012-12-14 | 2012-12-14 | Electric component pressing mechanism and testing facility applying the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101147490A TW201423899A (en) | 2012-12-14 | 2012-12-14 | Electric component pressing mechanism and testing facility applying the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201423899A TW201423899A (en) | 2014-06-16 |
TWI495035B true TWI495035B (en) | 2015-08-01 |
Family
ID=51394134
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101147490A TW201423899A (en) | 2012-12-14 | 2012-12-14 | Electric component pressing mechanism and testing facility applying the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201423899A (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI550747B (en) * | 2014-07-03 | 2016-09-21 | Chroma Ate Inc | Temperature control of the floating buffer test seat |
JP2016075550A (en) * | 2014-10-06 | 2016-05-12 | セイコーエプソン株式会社 | Electronic component conveyance device and electronic component inspection device |
CN105572437B (en) * | 2014-10-16 | 2018-07-20 | 鸿劲科技股份有限公司 | Electronic assembly test device and its test equipment of application |
TW201809697A (en) * | 2016-06-24 | 2018-03-16 | 鴻勁科技股份有限公司 | Temperature control device for press-bonding unit of electronic component and testing device using the same capable of keeping the temperature difference between primary and secondary effect surfaces of a cooling chip within a better range |
TWI580979B (en) * | 2016-06-24 | 2017-05-01 | Electronic components crimping device and its application test classification equipment | |
TWI623754B (en) * | 2017-01-26 | 2018-05-11 | Electronic component testing device and test classification device | |
TWI677685B (en) * | 2018-10-08 | 2019-11-21 | 鴻勁精密股份有限公司 | Electronic component test equipment |
CN111044839B (en) * | 2018-10-11 | 2022-02-25 | 鸿劲精密股份有限公司 | Electronic component testing apparatus |
TWI701450B (en) * | 2019-07-17 | 2020-08-11 | 美商第一檢測有限公司 | Environmental control equipment |
TWI705257B (en) | 2019-07-17 | 2020-09-21 | 美商第一檢測有限公司 | Environmental control equipment |
CN112309489A (en) * | 2019-07-26 | 2021-02-02 | 第一检测有限公司 | Environment control device |
CN112309486A (en) * | 2019-07-26 | 2021-02-02 | 第一检测有限公司 | Chip testing device |
CN112309487A (en) * | 2019-07-26 | 2021-02-02 | 第一检测有限公司 | Chip testing system |
CN112309491A (en) * | 2019-07-26 | 2021-02-02 | 第一检测有限公司 | Environment control device |
TWI714332B (en) * | 2019-11-01 | 2020-12-21 | 美商第一檢測有限公司 | Environmental control device and chip testing system |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020011859A1 (en) * | 1993-12-23 | 2002-01-31 | Kenneth R. Smith | Method for forming conductive bumps for the purpose of contrructing a fine pitch test device |
US20070063721A1 (en) * | 2005-09-19 | 2007-03-22 | Formfactor, Inc. | Apparatus And Method Of Testing Singulated Dies |
EP1574865B1 (en) * | 2002-12-04 | 2007-06-06 | Advantest Corporation | Pressing member and electronic component handling device |
US7868636B2 (en) * | 2007-05-11 | 2011-01-11 | Amst Co., Ltd. | Probe card and method for fabricating the same |
WO2012159003A1 (en) * | 2011-05-19 | 2012-11-22 | Celerint, Llc. | Parallel concurrent test system and method |
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2012
- 2012-12-14 TW TW101147490A patent/TW201423899A/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020011859A1 (en) * | 1993-12-23 | 2002-01-31 | Kenneth R. Smith | Method for forming conductive bumps for the purpose of contrructing a fine pitch test device |
EP1574865B1 (en) * | 2002-12-04 | 2007-06-06 | Advantest Corporation | Pressing member and electronic component handling device |
US20070063721A1 (en) * | 2005-09-19 | 2007-03-22 | Formfactor, Inc. | Apparatus And Method Of Testing Singulated Dies |
US7868636B2 (en) * | 2007-05-11 | 2011-01-11 | Amst Co., Ltd. | Probe card and method for fabricating the same |
WO2012159003A1 (en) * | 2011-05-19 | 2012-11-22 | Celerint, Llc. | Parallel concurrent test system and method |
Also Published As
Publication number | Publication date |
---|---|
TW201423899A (en) | 2014-06-16 |