CN208722847U - A kind of chip encapsulating device - Google Patents
A kind of chip encapsulating device Download PDFInfo
- Publication number
- CN208722847U CN208722847U CN201821408702.3U CN201821408702U CN208722847U CN 208722847 U CN208722847 U CN 208722847U CN 201821408702 U CN201821408702 U CN 201821408702U CN 208722847 U CN208722847 U CN 208722847U
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- Prior art keywords
- chip
- turntable
- platform
- binding
- identification
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Abstract
The utility model discloses a kind of chip encapsulating device, including turntable and it is symmetrically disposed on the chip platform at the turntable both ends and binds platform, the chip platform and the binding platform can be X, Y-direction movement, and plane where the turntable is vertically arranged with the chip platform and binding platform respectively；Perpendicular to refracting prisms are equipped on the straight line at the center of turntable, the refracting prisms are connected with driving mould group, are equipped with identification camera in the driving mould group；It is provided with multiple around the symmetrical binding head of the center of turntable on the turntable, the binding head can do Z-direction along the diametrical direction of the turntable and move.Chip encapsulating device provided by the utility model can be achieved at the same time high speed, high-precision encapsulation, and be applicable in multiple packing forms.
Description
Technical field
The utility model relates to chip encapsulation technology fields, more particularly to a kind of chip encapsulating device.
Background technique
Encapsulation may be considered last procedure of integrated circuit production process, refer to chip (Die) in inhomogeneity
Be laid out on the frame or substrate of type, be adhesively fixed connection, draw connecting terminal simultaneously by plastic packaging material (EMC) it is fixed formed it is different
A kind of technique of the packaging body of shape.
With the complication of integrated circuit, improving for unit volume information is higher and higher with unit time processing speed,
Consequent is the raising of encapsulating products number of pins.The development trend of another aspect miniaturization of electronic products is very clear, this
The kind market demand proposes corresponding requirement to circuit package technology, is no longer satisfied with the original protection of encapsulation, support, connection etc.
Function, but more emphasize chip size and quantity that encapsulating products can carry in unit volume or area.Generally
For, measure a chip encapsulation technology it is advanced whether important indicator be the ratio between chip area and package area, this ratio
It is better closer to 1.
Chip packaging factory is also higher and higher to the performance requirement of chip encapsulating device.Not only want to reach placement accuracy < ±
5μm.Also to meet the performance indicator of production efficiency UPH > 10000.And equipment will also have versatility, can mount formal dress
Processing chip, and reverse installation process chip can be mounted.
Existing Advanced Packaging or precision do not reach requirement or reach requirement speed and be difficult to meet customer need,
And it is also difficult to achieve the mount formats of kinds of processes.
Utility model content
The purpose of the utility model is to provide a kind of chip encapsulating devices, to solve the above-mentioned problems of the prior art,
High speed, high-precision encapsulation are realized simultaneously, and can be applicable in multiple packing forms.
To achieve the above object, the utility model provides following scheme:
The utility model provides a kind of chip encapsulating device, including turntable and the chip for being symmetrically disposed on the turntable both ends
Platform and binding platform, the chip platform and the binding platform can do X, Y-direction movement, plane difference where the turntable
It is vertically arranged with the chip platform and binding platform；Perpendicular to being equipped with refracting prisms on the straight line at the center of turntable,
The refracting prisms are connected with driving mould group, are equipped with identification camera in the driving mould group；It is provided on the turntable multiple
Around the symmetrical binding head of the center of turntable, the binding head can do Z-direction along the diametrical direction of the turntable and move.
Optionally, the refracting prisms include upward refracting prisms and downward refracting prisms；The identification camera includes knowing
Other chip platform camera and identification binding platform camera；The driving mould group includes driving up mould group and downwards driving mould group；
Two refracting prisms, identification camera and driving Mo Zu correspond to complete setting respectively.
Optionally, the binding head is hollow structure, including the Z-direction mobile mechanism being installed on the turntable, the Z-direction
It is arranged with rotating electric machine in mobile mechanism, is fixedly installed with the suction nozzle being obliquely installed on the outside of the rotating electric machine.
Optionally, it is provided on the binding platform and dips in glue or scaling powder disk.
Optionally, the turntable two sides are respectively arranged with identification flip-chip camera and identification chip camera.
Optionally, it is provided with invertible head between the identification chip camera and the chip platform, is set on the invertible head
The suction nozzle installed there are two setting at obtuse angle activity.
Optionally, eight or six binding heads are evenly arranged on the turntable.
Optionally, the turntable is driven using DD motor.
The utility model achieves following technical effect compared with the existing technology:
The utility model can be achieved at the same time high speed, high-precision encapsulation, and can be applicable in multiple packing forms.Formal dress
It is realized on the same device with upside-down mounting, does not need to carry out any hardware adjustment, it is only necessary to switch corresponding software, it can be right
Fanout is answered, the techniques such as DAF, FC really realize a tractor serves several purposes.When work, because being more turntable structures, coring piece, overturning handover
Chip, identification chip, the processes such as patch chip carry out simultaneously on the different binding heads on turntable, so that the work of equipment be made to imitate
Rate significantly improves.The hollow special construction of binding head designs, and when patch can accomplish to paste when seeing, equipment precision is allowed to be protected
Card.High speed and super precision is allowed to be possibly realized.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only the utility model
Some embodiments for those of ordinary skill in the art without any creative labor, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 is the utility model overall structure diagram；
Fig. 2 is the utility model binding head main view；
Fig. 3 is the utility model binding head side view；
Fig. 4 is the utility model binding head top view；
Fig. 5 is one structural schematic diagram of the utility model embodiment；
Fig. 6 is two structural schematic diagram of the utility model embodiment；
Fig. 7 is three structural schematic diagram of the utility model embodiment；
Wherein, 1 be turntable, 2 be chip platform, 3 be binding platform, 4 be binding head, 5 be upward refracting prisms, 6 be to
Lower refracting prisms, 7 be identification chip platform camera, 8 be identification binding platform camera, 9 to drive up mould group, 10 be to drive downwards
Dynamic model group, 11 be Z-direction mobile mechanism, 12 be rotating electric machine, 13 be suction nozzle, 14 to dip in glue or scaling powder disk, 15 be identification upside-down mounting
Chip camera, 16 be identification chip camera, 17 be invertible head, 18 be suction nozzle.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
The purpose of the utility model is to provide a kind of chip encapsulating devices, to solve the above-mentioned problems of the prior art,
High speed, high-precision encapsulation are realized simultaneously, and can be applicable in multiple packing forms.
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, with reference to the accompanying drawing and have
Body embodiment is described in further detail the utility model.
Embodiment one
The utility model provides a kind of chip encapsulating device, as Figure 1-Figure 5, including turntable 1 and be symmetrically disposed on turn
The chip platform 2 and binding platform 3 at 1 both ends of disk, chip platform 2 and binding platform 3 can be X, Y-direction movement, put down where turntable 1
Face is vertically arranged with chip platform 2 and binding platform 3 respectively；Perpendicular to being equipped with refracting prisms on the straight line at 1 center of turntable,
Refracting prisms are connected with driving mould group, drive and are equipped with identification camera in mould group；Eight are provided on turntable 1 around 1 center of turntable
Symmetrical binding head 4, binding head 4 can do Z-direction along the diametrical direction of turntable 1 and move.
It is further preferred that refracting prisms include upward refracting prisms 5 and downward refracting prisms 6；Identify that camera includes knowing
Other chip platform camera 7 and identification binding platform camera 8；Driving mould group includes driving up mould group 9 and downwards driving mould group 10,
It drives up mould group 9 and driving mould group 10 can respectively drive two identification cameras back-and-forth motions downwards, it is burnt to change identification camera
Away from position；Two refracting prisms, identification camera and driving Mo Zu correspond to complete setting respectively.Binding head 4 is hollow structure, including
The Z-direction mobile mechanism 11 being installed on turntable 1, is arranged with rotating electric machine 12 in Z-direction mobile mechanism 11, solid on the outside of rotating electric machine 12
Dingan County is equipped with the suction nozzle 13 being obliquely installed.
When binding head 4 works, Z-direction mobile mechanism 11 adjusts position, and suction nozzle 13 picks up chip from chip platform 2 later,
Through the hollow circular hole of binding head 4, it can be seen that suction nozzle 13 and chip can easily carry out the knowledge of position and angle to chip
Not, chip angle is compensated by the rotation of rotating electric machine 12.
In the present embodiment when specific works, the core that mould group 9 is moved to suitable position identification chip platform 2 is driven up first
Piece position.What chip platform 2 was moved to identification chip platform camera 7 identifies chip position to be taken, at the same time driving mould downwards
10 groups of positions to be bound for being moved to load plate on suitable position identification binding platform 3, turntable 1 rotate binding head 4 to taking piece position
Afterwards, the chip from taking on chip platform 2 of Z-direction mobility binding head 4 drives up the mobile change identification chip platform camera 7 of mould group 9
Focal position identifies the chip position taken and angle through hollow binding head 4, and the rotation of turntable 1 will pick up the binding of chip
First 4 are moved at binding platform 3, drive mould group 10 to be moved to suitable position downwards, so that identification binding platform camera 8 is known
Not Bang Ding platform 3, by the chip picked up on binding head 4 accurately mount binding platform 3 on load plate binding position.
Embodiment two
As shown in fig. 6, the present embodiment is on the basis of example 1, the chip encapsulating device in embodiment one is set side by side
Two sets are set, to further increase working efficiency, two different positive cartridge chips can be produced simultaneously.
Further, the present embodiment can also realize the production of reverse installation process, specifically, the binding head in first set equipment
After 4 remove chip from the chip platform 2 of first set equipment, 90 degree are rotated with turntable 1, at this point, the binding of first set equipment
First 4 are handed off to chip on the binding head 4 of second set of equipment by Z-direction mobile mechanism 11, and the binding head 4 of second set of equipment should
In flip-chip to the binding platform 3 of second set of equipment.
Embodiment three
The present embodiment is the further improvement made on the basis of example 1, on the basis of example 1, such as
Shown in Fig. 7, the present embodiment is provided on binding platform 3 and dips in glue or scaling powder disk 14.1 two sides of turntable are respectively arranged with identification and fall
Cartridge chip camera 15 and identification chip camera 16.Identification flip-chip camera 15 and identification chip camera 16 are symmetrically disposed on turntable
1 two sides.Invertible head 17 is provided between identification chip camera 16 and chip platform 2, there are two at obtuse angle for setting on invertible head 17
Activity installation suction nozzle 18.Binding head 4 there are six being uniformly arranged on turntable 1.Turntable 1 is driven using DD motor.
When the positive cartridge chip of the present embodiment:
Chip position on 7 identification chip platform 2 of identification chip platform camera, binding head 4 take core away from chip platform 2
Piece, turntable 1, which rotates clockwise, goes to identification 15 position of flip-chip camera, and identification chip camera 16 carries out back identification, identification
Binding platform camera 8 is when the binding head 4 that turntable 1 turns to chipless gets out of the way binding 3 position of platform, on identification binding platform 3
Tie up piece position.Then the binding head 4 of microarray strip, which is gone to, binds 3 position of platform, 11 setting in motion of Z-direction mobile mechanism of binding head 3,
Identify that binding platform camera 8 adjusts focal length, position of the circular hole identification chip on binding head 4 on binding head 4 simultaneously.It will
Chip is placed into the binding position on binding platform 3.If you need to dip in adhesive process, binding head 4 is first being tied up after going to binding 3 position of platform
Dipping on fixed platform 3 dips in glue on glue or scaling powder disk 14, then binding position patch of the mobility binding head 4 on binding platform 3.
When the present embodiment flip-chip:
Chip position on 16 identification chip platform 2 of identification chip camera, invertible head 17 are turned to 2 position of chip platform,
Suction nozzle 18 takes chip away from chip platform 2, and brick turning head 17 rotates 120 ° and carries out chip friendship with the binding head 4 on turntable 1 later
It connects, turntable 1, which rotates clockwise, goes to progress back identification at identification chip camera 16, and identification binding platform camera 8 is at 1 turn of turntable
Move chipless binding head 4 get out of the way binding 3 position of platform when, identification binding platform 3 on tie up piece position.Then drawing has chip
Binding head 4 go to binding 3 position of platform, binding head 4 start Z-direction movement, while identify binding platform camera 8 adjust focal length,
Position of the circular hole identification chip on binding head 4 on binding head 4.Chip is placed into the bindings bit on binding platform 3
It sets.If you need to dip in scaling powder technique, binding head 4 goes to behind binding 3 position of platform and first dips in glue or scaling powder disk on binding platform 3
Scaling powder is dipped on 14, then mobility binding platform 3 and binding head 4, the binding position patch on binding platform 3.
Specific case is applied in the utility model to be expounded the principles of the present invention and embodiment, it is above
The explanation of embodiment is merely used to help understand the method and its core concept of the utility model；Meanwhile for the one of this field
As technical staff, based on the idea of the present invention, there will be changes in the specific implementation manner and application range.To sum up
Described, the content of the present specification should not be construed as a limitation of the present invention.
Claims (8)
1. a kind of chip encapsulating device, it is characterised in that: including turntable and the chip platform for being symmetrically disposed on the turntable both ends
With binding platform, it is mobile that the chip platform and the binding platform can do X, Y-direction, turntable place plane respectively with institute
It states chip platform and binding platform is vertically arranged；It is described perpendicular to being equipped with refracting prisms on the straight line at the center of turntable
Refracting prisms are connected with driving mould group, are equipped with identification camera in the driving mould group；It is provided on the turntable multiple around institute
The symmetrical binding head of center of turntable is stated, the binding head can do Z-direction along the diametrical direction of the turntable and move.
2. chip encapsulating device according to claim 1, it is characterised in that: the refracting prisms include upward refracting prisms
With downward refracting prisms；The identification camera includes identification chip platform camera and identification binding platform camera；The driving mould
Group includes driving up mould group and downwards driving mould group；Two refracting prisms, identification camera and driving Mo Zu are corresponded to respectively
Complete setting.
3. chip encapsulating device according to claim 1, it is characterised in that: the binding head includes being installed on the turntable
On Z-direction mobile mechanism, rotating electric machine is arranged in the Z-direction mobile mechanism, is fixedly installed with and inclines on the outside of the rotating electric machine
The suction nozzle being tiltedly arranged.
4. chip encapsulating device according to claim 1, it is characterised in that: be provided on the binding platform and dip in glue or help
Solder flux disk.
5. chip encapsulating device according to claim 1, it is characterised in that: the turntable two sides are respectively arranged with identification and fall
Cartridge chip camera and identification chip camera.
6. chip encapsulating device according to claim 5, it is characterised in that: the identification chip camera and the chip are flat
Invertible head is provided between platform, there are two the suction nozzles installed at obtuse angle activity for setting on the invertible head.
7. chip encapsulating device according to claim 3, it is characterised in that: be evenly arranged with eight or six on the turntable
A binding head.
8. chip encapsulating device according to claim 1, it is characterised in that: the turntable is driven using DD motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821408702.3U CN208722847U (en) | 2018-08-30 | 2018-08-30 | A kind of chip encapsulating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821408702.3U CN208722847U (en) | 2018-08-30 | 2018-08-30 | A kind of chip encapsulating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208722847U true CN208722847U (en) | 2019-04-09 |
Family
ID=65980174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821408702.3U Expired - Fee Related CN208722847U (en) | 2018-08-30 | 2018-08-30 | A kind of chip encapsulating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208722847U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109216240A (en) * | 2018-08-30 | 2019-01-15 | 大连佳峰自动化股份有限公司 | A kind of chip encapsulating device |
-
2018
- 2018-08-30 CN CN201821408702.3U patent/CN208722847U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109216240A (en) * | 2018-08-30 | 2019-01-15 | 大连佳峰自动化股份有限公司 | A kind of chip encapsulating device |
| CN109216240B (en) * | 2018-08-30 | 2024-01-19 | 大连佳峰自动化股份有限公司 | Chip packaging equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190409 Termination date: 20190830 |