CN108962803A - Crystal grain transfer device - Google Patents
Crystal grain transfer device Download PDFInfo
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- CN108962803A CN108962803A CN201710346357.9A CN201710346357A CN108962803A CN 108962803 A CN108962803 A CN 108962803A CN 201710346357 A CN201710346357 A CN 201710346357A CN 108962803 A CN108962803 A CN 108962803A
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- transfer
- crystal grain
- component
- transfer component
- transfer device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Feeding Of Articles To Conveyors (AREA)
Abstract
The present invention relates to a kind of crystal grain transfer devices, include the first transfer mechanism, second transfer mechanism and image capture component, first transfer component of the first transfer mechanism is rotated along the first rotating path, second transfer component captures the opposite sides of target crystal grain in docking location with the first transfer component respectively in a manner of docking and transfers target crystal grain, wherein the second shift machine is configured to space of withing a hook at the end, retaining space be the second transfer component it is mobile be formed by track do not pass through region, image capture component is set in retaining space and is located on docking center line, it is set and captures the second transfer component and butt up against the die locations image after the first transfer component, brilliant prelocalization compensation is set for the first transfer component to use.
Description
Technical field
The present invention relates to a kind of crystal grain transfer devices, more particularly to a kind of crystal grain transfer device of efficiently and accurately.
Background technique
In the processing procedure of semiconductor wafer level packaging, it is necessary to wafer is cut into the crystal grain that pluralizes, then therefrom chooses non-defective unit, weight
Newly it is configured on substrate to carry out subsequent processing.Traditional practice is using revolving mechanical arm to shift crystal grain, and
In order to reduce the rotary inertia of mechanical arm, generallys use several rotary machine arms engaging one another and turned in a manner of docking
Move crystal grain.
However, mechanical arm is easy to appear bit errors, two especially axially different machines when crystal grain is shifted in docking
Tool arm is in docking, it is more difficult to precisely contraposition.Although it is auxiliary to can use the image capturing mechanism being arranged on the outside of mechanical arm
The problem of helping calibration to align, but being limited to shooting angle, is still difficult to overcome the problems, such as bit errors.And if until docking is completed
Afterwards, mechanical arm goes to other angles and carries out filming image again, then the efficiency for shifting crystal grain is seriously tied down.
Summary of the invention
Therefore, to solve the above problems, the purpose of the present invention is providing a kind of crystal grain transfer device of efficiently and accurately.
The present invention is that technological means used by solving problem of the prior art is to provide a kind of crystal grain transfer device, packet
Contain: the first transfer mechanism, including the first transfer component, the first transfer component is around first rotation along the first rotating path
And it rotates；Second transfer mechanism, including the second transfer component, the second transfer component be set and be moved to docking location and with
First rotating path intersection, and this second transfer component with this first transfer component be set and in the docking location to dock
Mode capture the opposite sides of target crystal grain of the position on the docking center line of the docking location respectively and transfer the target crystalline substance
Grain, wherein second shift machine is configured to space of withing a hook at the end, which is that the second transfer component movement is formed by rail
Mark does not pass through region, which passes through the retaining space；And image capture component, it is set in the retaining space
And be located on the docking center line, which is set and captures the second transfer component handover in first transfer
Die locations image after component is used with the positioning compensation before crystalline substance is set for the first transfer component.
A kind of crystal grain transfer device is provided in an embodiment of the present invention, and wherein the image capture component includes at least one
Reflecting mirror and image acquisition member, the reflecting mirror are set in the retaining space and are located on the docking center line, the image capture
Part is arranged in such a way that optical path corresponds to the reflecting mirror, and captures the die locations image after transfer indirectly.
A kind of crystal grain transfer device is provided in an embodiment of the present invention, which surrounds the second rotation axis
It is rotated along the second rotating path, which is connected on first rotating path in the docking location, and the reservation is empty
Between for the second transfer component do not pass through region along what second rotating path rotation was formed by track.
A kind of crystal grain transfer device is provided in an embodiment of the present invention, which includes arm-piece and connection
Part, vertical second rotation axis of the arm-piece, the connector have bending part and connect the arm-piece and the second transfer mechanism
Rotary shaft is to form the retaining space.
A kind of crystal grain transfer device, the first rotation and second rotation axis are provided in an embodiment of the present invention
It is parallel.
A kind of crystal grain transfer device, the first rotation and second rotation axis are provided in an embodiment of the present invention
It is vertical.
A kind of crystal grain transfer device, the first rotation and second rotation axis are provided in an embodiment of the present invention
Press from both sides an angle.
A kind of crystal grain transfer device is provided in an embodiment of the present invention, which has a plurality of first to move
Turn component.
A kind of crystal grain transfer device is provided in an embodiment of the present invention, which has a plurality of second to move
Turn component.
A kind of crystal grain transfer device is provided in an embodiment of the present invention, which is parallel-moving type shift machine
Structure, the second transfer component are set and move back and forth and hand in a transverse direction in the docking location and first rotating path
Meeting.
Via the technology used in the present invention means, it can accurately shoot the first transfer component and set the crystal grain transferred before crystalline substance
Position images, thus can accurately align, and promote the efficiency and quality for placing crystal grain.
Specific embodiment of the present invention attached will be further described by embodiment below and in schema.
Detailed description of the invention
Fig. 1 is the docking schematic diagram of display crystal grain transfer device according to a first embodiment of the present invention.
Fig. 2 is the rotation schematic diagram of display crystal grain transfer device according to a first embodiment of the present invention.
Fig. 3 is the rotation schematic diagram of the crystal grain transfer device of display according to a second embodiment of the present invention.
Fig. 4 is the docking schematic diagram of the crystal grain transfer device of display according to a third embodiment of the present invention.
Fig. 5 is the docking schematic diagram of the crystal grain transfer device of display according to a fourth embodiment of the present invention.
Appended drawing reference
100 crystal grain transfer devices
100a crystal grain transfer device
100b crystal grain transfer device
100c crystal grain transfer device
1 first transfer mechanism
11 first rotary shafts
12 first transfer components
2 second transfer mechanisms
21 second rotary shafts
22 second transfer components
221 arm-piece
222 connectors
3 image capture components
31 reflecting mirrors
32 image captures
D target crystal grain
The first rotating path of R1
The second rotating path of R2
S retaining space
T crystal grain placement platform
Specific embodiment
Below according to Fig. 1 to Fig. 5, and illustrate embodiments of the present invention.The explanation is not limitation implementation of the invention
Mode, and it is one kind of the embodiment of the present invention.
As shown in Figures 1 and 2, crystal grain transfer device 100 includes: the first transfer mechanism 1, second transfers mechanism 2 and image
Capture component 3.
As shown in Figure 1, the first transfer mechanism 1 includes the first rotary shaft 11 and the first transfer component 12, the first transfer component
12 rotation axis for surrounding the first rotary shaft 11 are rotated along the first rotating path R1.In the present embodiment, the first rotary shaft 11
The vertical paper of rotation axis, the parallel paper of the first rotating path R1, however the invention is not limited thereto.
Second transfer mechanism 2 includes the second rotary shaft 21 and the second transfer component 22, and the second transfer component 22 surrounds second
The rotation axis of rotary shaft 21 is rotated along the second rotating path R2.In the present embodiment, the rotation axis of the second rotary shaft 21
It is parallel to paper, the second rotating path R2 is perpendicular to paper.Second rotating path R2 is connected on the first rotary road in docking location
Diameter R1, and the second transfer component 22 is set with the first transfer component 12 and is captured respectively in a manner of docking in the docking location
The opposite sides of target crystal grain D of the position on the docking center line of the docking location and transfer target crystal grain D.In the present embodiment
In, the second transfer component 22 and the first transfer component 12 are the mechanical arm of assimilating type, are drawn in a manner of docking, transfer target
Crystal grain D, however the invention is not limited thereto.
As shown in Figures 1 and 2, the second transfer mechanism 2 is formed with retaining space S.Retaining space S is the second transfer component 22
Along the second rotating path R2 rotation be formed by track not by region, which passes through retaining space S.
Image capture component 3 be set in retaining space S and be located on the docking center line and camera lens towards the docking position
It sets.Image capture component 3 is set and captures and transfer component in first in the second transfer component handover on the docking center line
Die locations image afterwards.
As shown in Figure 1, in the present embodiment, the second transfer component 22 includes arm-piece 221 and connector 222.Arm-piece 221 is hung down
The axis of straight second rotary shaft 21, connector 222 have bending part and connect arm-piece 221 and the second rotary shaft 21 to be formed and be retained
Space S.However the invention is not limited thereto, connector 222 can also have arc sections and connect arm-piece 221 and the second rotary shaft 21 with
It forms retaining space S or connector 222 connects arm-piece 221 and the second rotary shaft 21 in such a way that opposite arm-piece 221 is inclined
To form retaining space S.
Via setting image capture component 3 in the retaining space S on the docking center line, so that image capture component 3
It can closely and accurately capture die locations image of second transfer component 22 handover after the first transfer component.
For example, as shown in Figure 1, the second transfer component 22 first draws target crystal grain D, it is then moved to the docking position
It sets.First transfer component 12 equally rotation draws target crystal grain D to the docking location in a manner of docking.
Then, as shown in Fig. 2, the second transfer component 22 decontrols target crystal grain D and continues to rotate and leave the docking location,
Image capture component 3 captures the second transfer component 22 and butts up against the die locations image after the first transfer component 12.
Further, crystal grain transfer device 100 of the invention further includes calculating to put with control mechanism (not shown) and crystal grain
Horizontalization platform T, calculating connect image capture component 3 and crystal grain placement platform T with control mechanism signal.It calculates and control mechanism foundation
The die locations image, the position of the target crystal grain D after can further calculating transfer, offset error, and control crystal grain placement
Platform T adjusts the position of crystal grain placement platform T, angle according to the error calculated to compensate die locations, offset error.Most
Afterwards, the first transfer component 12 is passed to the crystal grain compensation placement location of crystal grain placement platform T and puts crystal grain.
In the present embodiment, although using second transfer component 22 divert the aim crystal grain D to first transfer component 12 as act
Example, however, the present invention is not limited thereto.In addition to this, the first transfer component 12, which can execute target crystal grain D, sets crystalline substance, and the present invention is unlimited
In this.
In the present embodiment, the rotation axis of the first rotary shaft 11 and the rotation axis of the second rotary shaft 21 are vertical.So
And the invention is not limited thereto, the rotation axis of the rotation axis of the first rotary shaft 11 and the second rotary shaft 21 can be it is parallel, make
One transfer component 12 and the second transfer component 22 are all rotated in a manner of vertical paper and dock transfer target crystal grain D.
Further, the first transfer mechanism 1 has a plurality of first transfer components 12, and the second transfer mechanism 2 has plural number
A second transfer component 22, so that the speed of docking transfer target crystal grain D can substantially be accelerated.
The present invention proposes second embodiment again.As shown in figure 3, the crystal grain transfer device 100a of second embodiment and first is real
The crystal grain transfer device 100 for applying example is similar, includes the first transfer mechanism 1 and the second transfer mechanism 2.With the crystal grain of first embodiment
Transfer device 100 the difference is that, the image capture component 3 of the crystal grain transfer device 100a of second embodiment includes at least reflecting
Mirror 31 and image acquisition member 32, reflecting mirror 31 are set in retaining space S and are located on the docking center line, image acquisition member 32
It is arranged in such a way that optical path corresponds to reflecting mirror 31, and captures the die locations image after transfer indirectly.In the present embodiment, it reflects
Mirror 31 is one, and the camera lens of image acquisition member 32 is by reflecting mirror 31 indirectly towards the docking location.However the present invention is unlimited
In this, reflecting mirror 31 can also form reflection microscope group for most, image acquisition member 32 with optical path corresponds to the reflecting mirror group and
Connect the die locations image after capturing transfer.
The present invention proposes 3rd embodiment again.As shown in figure 4, the crystal grain transfer device 100b of 3rd embodiment and first is real
The crystal grain transfer device 100 for applying example is similar, transfers mechanism 2 and image capture component 3 comprising the first transfer mechanism 1, second.With
The crystal grain transfer device 100 of one embodiment the difference is that, the first rotary shaft of the crystal grain transfer device 100b of 3rd embodiment
Line 11 and the second rotation axis 12 press from both sides an angle.First transfer component 12 non-vertically surrounds first rotation 11 with angle
Rotation, the motion profile of the first transfer component 12 is in coniform.Similarly, the second transfer component 22 is also with angle and non-vertically
It is rotated around the second rotation axis 21, the motion profile of the second transfer component 22 is equally in coniform.Match via space appropriate
It sets, the second rotating path R2 is made to be connected on the first rotating path R1, to make the second transfer component 22 and the first transfer component 21
The opposite of target crystal grain D of the position on the docking center line of the docking location is captured respectively in a manner of docking in the docking location
Two sides and transfer target crystal grain.
The present invention proposes fourth embodiment again.As shown in figure 5, the crystal grain transfer device 100c of fourth embodiment and first is real
The crystal grain transfer device 100 for applying example is similar, transfers mechanism 2 and image capture component 3 comprising the first transfer mechanism 1, second.With
The crystal grain transfer device 100 of one embodiment the difference is that, the crystal grain transfer device 100c of fourth embodiment this second transfer
Mechanism 2 be a parallel-moving type transfer mechanism, second transfer component 22 be set and move back and forth in a transverse direction and in the docking
Position is intersected with the first rotating path R1, second transfer component 22 with first transfer component 12 be set and the docking location with
The mode of docking captures the opposite sides of target crystal grain D of the position on the docking center line of the docking location respectively and transfers target
Crystal grain D.Translation direction may, for example, be the up and down direction in drawing, or the direction of vertical drawing, and the invention is not limited thereto.?
In the present embodiment, the retaining space that the second transfer mechanism 2 is formed is that the second transfer movement of component 22 is formed by not leading to for track
Cross region, docking center line again passes through the retaining space, and image capture component 3 is set in the retaining space and to be located at this right
It connects on center line.
Above narration and explanation is only the explanation of presently preferred embodiments of the present invention, and those skilled in the art are worked as can
Make other modifications according to claim bounded by and above-mentioned explanation, so that these modifications should be for this
The spirit of invention and in interest field of the invention.
Claims (10)
1. a kind of crystal grain transfer device, includes:
First transfer mechanism, including the first transfer component, the first transfer component is around first rotation along the first rotation
Path and rotate；
Second transfer mechanism, including the second transfer component, the second transfer component be set and be moved to docking location and with
The first rotating path intersection, and the second transfer component is set with the first transfer component and docks position described
It sets the opposite sides for capturing target crystal grain of the position on the docking center line of the docking location respectively in a manner of docking and moves
Turn the target crystal grain, it is characterised in that second shift machine is configured to space of withing a hook at the end, and the retaining space is described the
Two transfer components are mobile be formed by track not by region, the docking center line is across the retaining space；And
Image capture component is set in the retaining space and is located on the docking center line, the image capture component
It is set and captures the second transfer component and butt up against the die locations image after the first transfer component, with for described
First transfer component is set the positioning compensation before crystalline substance and is used.
2. crystal grain transfer device as described in claim 1, it is characterised in that the image capture component includes at least one
Reflecting mirror and image acquisition member, the reflecting mirror are set in the retaining space and are located at the docking center line
On, the image acquisition member is arranged in a manner of the corresponding reflecting mirror of optical path, and captures the crystal grain position after transfer indirectly
Set image.
3. crystal grain transfer device as described in claim 1, it is characterised in that the second transfer component is around the second rotation
Axis is rotated along the second rotating path, and second rotating path is connected on first rotation in the docking location
Turn path, the retaining space is formed by track along the second rotating path rotation for the second transfer component
Do not pass through region.
4. crystal grain transfer device as claimed in claim 3, it is characterised in that the second transfer component includes arm-piece and company
Fitting, vertical second rotation axis of the arm-piece, the connector have bending part and connect the arm-piece
And the rotary shaft of the second transfer mechanism is to form the retaining space.
5. crystal grain transfer device as claimed in claim 3, it is characterised in that the first rotation and described second
Rotation axis is parallel.
6. crystal grain transfer device as claimed in claim 3, it is characterised in that the first rotation and described second
Rotation axis is vertical.
7. crystal grain transfer device as claimed in claim 3, it is characterised in that the first rotation and described second
One angle of rotary shaft wire clamp.
8. crystal grain transfer device as described in claim 1, it is characterised in that described first transfer mechanism has a plurality of the
One transfer component.
9. crystal grain transfer device as claimed in claim 3, it is characterised in that described second transfer mechanism has a plurality of the
Two transfer components.
10. crystal grain transfer device as described in claim 1, it is characterised in that the second transfer mechanism is parallel-moving type transfer
Mechanism, the described second transfer component be set and move back and forth in a transverse direction and in the docking location and described
The intersection of first rotating path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710346357.9A CN108962803A (en) | 2017-05-17 | 2017-05-17 | Crystal grain transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710346357.9A CN108962803A (en) | 2017-05-17 | 2017-05-17 | Crystal grain transfer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108962803A true CN108962803A (en) | 2018-12-07 |
Family
ID=64461342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710346357.9A Pending CN108962803A (en) | 2017-05-17 | 2017-05-17 | Crystal grain transfer device |
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| Country | Link |
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| CN (1) | CN108962803A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI755129B (en) * | 2020-10-30 | 2022-02-11 | 梭特科技股份有限公司 | A chip pick-and-place transfer device and method for chip positioning thereof |
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| TWI239796B (en) * | 2002-03-11 | 2005-09-11 | Georg Rudolf Sillner | Apparatus for the manufacture and/or processing of semiconductor chips or components and transfer and flip-over module |
| CN101472394A (en) * | 2007-12-25 | 2009-07-01 | 富葵精密组件(深圳)有限公司 | Contraposition device |
| CN103069559A (en) * | 2010-08-17 | 2013-04-24 | 佳能安内华股份有限公司 | Substrate transfer apparatus, system for manufacturing electronic device, and method for manufacturing electronic device |
| CN106206392A (en) * | 2015-05-07 | 2016-12-07 | 梭特科技股份有限公司 | Crystal grain location advancing equipment and crystal grain location method for arranging |
| CN106373914A (en) * | 2016-11-10 | 2017-02-01 | 北京中电科电子装备有限公司 | Chip bonding device |
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2017
- 2017-05-17 CN CN201710346357.9A patent/CN108962803A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI239796B (en) * | 2002-03-11 | 2005-09-11 | Georg Rudolf Sillner | Apparatus for the manufacture and/or processing of semiconductor chips or components and transfer and flip-over module |
| CN101472394A (en) * | 2007-12-25 | 2009-07-01 | 富葵精密组件(深圳)有限公司 | Contraposition device |
| CN103069559A (en) * | 2010-08-17 | 2013-04-24 | 佳能安内华股份有限公司 | Substrate transfer apparatus, system for manufacturing electronic device, and method for manufacturing electronic device |
| CN106206392A (en) * | 2015-05-07 | 2016-12-07 | 梭特科技股份有限公司 | Crystal grain location advancing equipment and crystal grain location method for arranging |
| CN106373914A (en) * | 2016-11-10 | 2017-02-01 | 北京中电科电子装备有限公司 | Chip bonding device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI755129B (en) * | 2020-10-30 | 2022-02-11 | 梭特科技股份有限公司 | A chip pick-and-place transfer device and method for chip positioning thereof |
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