JP2001133745A - Method of assembling substrate and device therefor - Google Patents

Method of assembling substrate and device therefor

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Publication number
JP2001133745A
JP2001133745A JP31689699A JP31689699A JP2001133745A JP 2001133745 A JP2001133745 A JP 2001133745A JP 31689699 A JP31689699 A JP 31689699A JP 31689699 A JP31689699 A JP 31689699A JP 2001133745 A JP2001133745 A JP 2001133745A
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Japan
Prior art keywords
substrate
substrates
bonding
adhesive sheet
vacuum
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JP31689699A
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Japanese (ja)
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JP3574865B2 (en
Inventor
Satoshi Hachiman
Akira Hirai
Kiyoshi Imaizumi
Masayuki Saito
潔 今泉
聡 八幡
明 平井
正行 齊藤
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Hitachi Techno Eng Co Ltd
日立テクノエンジニアリング株式会社
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Priority to JP31689699A priority Critical patent/JP3574865B2/en
Publication of JP2001133745A publication Critical patent/JP2001133745A/en
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Publication of JP3574865B2 publication Critical patent/JP3574865B2/en
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Abstract

PROBLEM TO BE SOLVED: To provide a method of assembling substrates capable of bonding the substrates to each other with high accuracy in a vacuum even in the case the substrates are made greater in size and smaller in thickness.
SOLUTION: The one substrate to be bonded is held on another substrate to be bonded so as to face each other and both substrates are bonded to each other in a vacuum with an adhesive disposed at either of the substrates. The one substrate is held onto the other substrate by tacky adhesive means and the substrates are bonded to each other by narrowing the spacing in the vacuum.
COPYRIGHT: (C)2001,JPO

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、真空チャンバ内で貼り合せる基板同士をそれぞれ保持して対向させ真空中で間隔を狭めて貼り合わせる基板の組立方法とその装置に関する。 The present invention relates to the assembly method of the substrate for bonding to narrow the gap in a vacuum are opposed to each other respectively hold the boards bonding in a vacuum chamber and its device.

【0002】 [0002]

【従来の技術】液晶表示パネルの製造には、透明電極や薄膜トランジスタアレイなどを設けた2枚のガラス基板を数μm程度の極めて接近した間隔をもって接着剤(以下、シール剤ともいう)で貼り合わせ(以後、貼り合せ後の基板をセルと呼ぶ)、それによって形成される空間に液晶を封止する工程がある。 The manufacture of the liquid crystal display panel, bonding with an adhesive with a very close spacing of about several μm two glass substrates provided with a transparent electrode and a thin film transistor array (hereinafter, also referred to as a sealant) (hereinafter referred to as the substrate after bonding the cell), there is a step of sealing the liquid crystal in a space formed by it.

【0003】この液晶の封止には、注入口を設けないようにシール剤をクローズしたパターンに描画した一方の基板上に液晶を滴下しておいて他方の基板を一方の基板上に配置し、真空中で上下の基板を接近させて貼り合せる特開昭62−165622号公報で提案された方法や、一方の基板上に注入口を設けるようにシール剤をパターン描画して真空中で基板を貼り合わせた後に液晶を注入口から注入する特開平10−26763号公報で提案された方法などがある。 [0003] sealing of the liquid crystal, in advance by dropping a liquid crystal disposed the other substrate on one substrate inlet to avoid any sealant closed drawn to pattern one of the substrates provided , and proposed methods be bonded Sho 62-165622 JP is brought closer to the upper and lower substrates in a vacuum, the substrate in a vacuum by pattern drawing the sealant so as to provide an inlet on one of the substrates and a method proposed in JP-a 10-26763 discloses to inject the liquid crystal from the injection port after bonding the.

【0004】 [0004]

【発明が解決しようとする課題】上記従来技術では、シール剤のパターン描画の前後に係わらず、いずれも両基板を真空中で貼り合わせているが、真空中では大気状態時のように基板を大気との圧力差で吸引吸着することができない。 In THE INVENTION to be solved INVENTION The above prior art, regardless of the front and rear of the patterning of the sealant, although both are bonded to the substrates in a vacuum, a substrate such as during atmospheric conditions in a vacuum can not be sucked adsorbed at a pressure differential with the atmosphere.

【0005】そこで、上側に位置する基板(以下、上基板と呼ぶ。)の端部を機械的に保持すると、基板の中央部がたわみ、そのたわみは最近の基板大型化,薄板化傾向が強まるにつれて大きくなっている。 [0005] Therefore, the substrate (hereinafter, referred to as an upper substrate.) Positioned above the mechanically holding an end portion of the central portion of the substrate is bending, the bending recent substrate size, the thinning tendency stronger It is larger him to.

【0006】貼り合わせをする前に、上下両基板の周縁部(端部)に設けた位置合わせマークを利用して光学的に位置決めを行うが、たわみが大きくなる程両基板の端部同士の間隔が拡がり、位置合わせマークに焦点を合せ難くなって正確な位置合わせが困難となる。 [0006] Prior to the bonding, the vertical using alignment marks provided on the periphery of the substrates (end) optically performing positioning, but the deflection is enough for both substrates ends between large spreading interval, precise alignment becomes difficult not easily focused on the alignment mark.

【0007】また、貼り合わせをする時には、上基板のたわんでいる中央部が周縁部よりも先に下側の基板(以下、下基板と呼ぶ。)に接触するので、基板間隔を一定にする為に基板間に散布されているスペーサが動き、基板上に形成されている配向膜などを傷つけてしまう。 Further, in the case that the bonding, the lower substrate before the peripheral edge portion central portion which bends on the substrate (hereinafter, referred to as a lower substrate.) The contact with, the substrate gap constant spacers movement is sprayed between the substrates in order, damage the like alignment film formed on the substrate.

【0008】また、貼り合せる上下の基板を同一サイズとし、シール剤を基板の周縁部ぎりぎりの位置に設ける傾向にあり、このような場合には上基板の保持代がほとんど取れないという問題もある。 Further, the be bonded upper and lower substrates and the same size, tend to provide a sealant on the periphery marginal position of the substrate, there is a problem that the holding allowance of the upper substrate is hardly taken in such a case .

【0009】それゆえ、本発明の目的は、基板サイズが大型化,薄板化しても真空中で高精度に貼り合せることが可能な基板の組立方法とその装置を提供することにある。 [0009] It is therefore an object of the present invention is to provide a substrate size is large, it thinned and board assembly method that can be bonded with high accuracy in a vacuum and the device.

【0010】また、本発明の他の目的は、基板周縁部際に接着剤が設けられるものでも容易に上基板を保持でき,しかも配向膜などを傷つけることなく貼り合せることが可能な基板の組立方法とその装置を提供することにある。 Another object of the present invention, also those adhesive is provided in the peripheral portion of the substrate can be easily held on the substrate, yet the assembly of substrate that can be bonded without damaging an alignment film to provide a method and apparatus.

【0011】 [0011]

【課題を解決するための手段】上記目的を達成する本発明の特徴とするところは、貼り合わせる一方の基板を貼り合わせる他方の基板上に保持して対向させ、いづれかの基板に設けた接着剤により真空中で貼り合わせるものおいて、粘着手段で一方の基板を他方の基板上に保持させ、真空中で間隔を狭めて貼り合わせを行うことにある。 It is a feature of the present invention to achieve the above object, there is provided a means for solving] causes the counter holding the other substrate to be bonded to one of the substrates to be bonded, Izure of adhesive provided on the substrate the at those bonded in a vacuum, one of the substrate with adhesive means is held on the other substrate is to carry out bonding by narrowing the gap in a vacuum.

【0012】 [0012]

【発明の実施の形態】以下、本発明の一実施形態を図に基づいて説明する。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment of the present invention based on FIG. 図1,図2において、本発明になる基板組立装置1は、下チャンバ部T1と上チャンバ部T 1 and 2, the substrate assembly apparatus 1 according to the present invention, the upper and the lower chamber section T1 chamber section T
2から構成され、下チャンバ部T1の下には、XYθ駆動機構(図示を省略した)が備えられている。 Is composed of two, under the lower chamber portion T1, XY.theta. Drive mechanism (not shown) is provided. このXY駆動機構により、下チャンバ部T1は、図面上で左右のX The XY drive mechanism, the lower chamber section T1 is, X in the left and right on the drawing
軸方向と、X軸と直交するY軸方向に往来できるようになっている。 The axial direction, to be able to come and go in the Y-axis direction perpendicular to the X axis. また、θ駆動機構により、シャフト2から真空シール3を介して下基板1aを搭載するテーブル4 Also, the θ drive mechanism, the table 4 for mounting the lower substrate 1a through a vacuum seal 3 from the shaft 2
を下チャンバユニット5に対して水平に回動可能としている。 It is rotatable horizontally with respect to the lower chamber unit 5. 尚、下基板1aは、テーブル4上に搭載されると、機械的にピンやローラ等で位置決め固定される構造及び吸引吸着される構造になっているが、簡略化のためそれらの構造の図示は省略している。 The lower substrate 1a, when mounted on the table 4, it has become mechanically pins or rollers or the like by the positioning fixed is the structure and the suction adsorbed the structure of those structures for simplicity shown It is omitted.

【0013】上チャンバ部T2では、上チャンバユニット6とその内部の加圧板7がそれぞれ独立して上下動できる構造になっている。 [0013] In the upper chamber portion T2, it has a structure in which the pressure plate 7 of the inner upper chamber unit 6 can move up and down independently. 即ち、上チャンバユニット6 In other words, the upper chamber unit 6
は、リニアブッシュと真空シールを内蔵したハウジング8を有しており、シャフト9をガイドとしてフレーム1 Has a housing 8 with a built-in linear bushing and a vacuum seal, the frame 1 a shaft 9 as a guide
0に固定されたシリンダ11により上下のZ軸方向に移動する。 0 by a cylinder 11 fixed to move up and down in the Z axis direction.

【0014】XYθ駆動機構上の下チャンバ部T1が上チャンバ部T2の直下に移動して上チャンバユニット6 [0014] upper lower chamber portion T1 on the XYθ drive mechanism is moved directly below the upper chamber portion T2 chamber unit 6
が下降すると、下チャンバユニット5の周りに配置してあるOリング12に上チャンバユニット6のフランジが接触し一体となり、真空チャンバとして機能する状態になる。 There When lowered, the flange of the upper chamber unit 6 is integrated in contact with the O-ring 12 which is disposed around the lower chamber unit 5, a state which serves as a vacuum chamber. ここで、下チャンバユニット5の周囲に設置されたボールベアリング13は、真空によるOリング12のつぶれ量を調整するもので、上下方向の任意の位置に設定可能となっている。 Here, the ball bearing 13 installed on the periphery of the lower chamber unit 5 is to adjust the amount collapse of the O-ring 12 by vacuum, and can set an arbitrary position in the vertical direction. Oリング12のつぶれ量は、真空チャンバ内を真空に保つことができ、かつ、最大の弾性が得られる位置に設定する。 Amount collapse of the O-ring 12 can be kept vacuum chamber to a vacuum, and is set to a position where maximum elastic is obtained. 真空により発生する大きな力は、ボールベアリング13を介して下チャンバユニット5で受けており、後述する上下基板の貼り合わせ時に下チャンバ部T1をOリング12の弾性範囲内で容易に微動させ精密位置決することができる。 Large forces generated by the vacuum is received in the lower chamber unit 5 via a ball bearing 13, precise location is easily fine movement of the lower chamber portion T1 within the elastic range of the O-ring 12 on attachment of the upper and lower substrates to be described later it is possible to attain.

【0015】ハウジング8は、上チャンバユニット6が下チャンバユニット5と真空チャンバを形成して大気圧で変形しても、シャフト9に対し真空漏れを起こさないで上下動可能な真空シールを内蔵しているので、真空チャンバの変形がシャフト9に与える力を吸収することができ、シャフト9に支持された加圧板7の変形がほぼ防止でき、粘着シート18に貼り付けられた上基板1bとテーブル4に保持された下基板1aとの平行を保って貼り合せが可能となる。 [0015] The housing 8 has an upper chamber unit 6 forms a lower chamber unit 5 and the vacuum chamber be modified at atmospheric pressure, without causing a vacuum leak incorporates a vertically movable vacuum seal to shaft 9 since it is, it is the deformation of the vacuum chamber to absorb the force applied to the shaft 9, the deformation of the pressure plate 7 which is supported by the shaft 9 can be prevented substantially, and the substrate 1b on which is stuck to the adhesive sheet 18 table bonded kept parallel to the lower substrate 1a held by the 4 becomes possible. 尚、加圧板7の上下動はシャフト9の上部に設置された図示を省略した駆動機構で行う。 Incidentally, the vertical movement of the pressure plate 7 is controlled by a driver mechanism (not shown) installed on the top of the shaft 9.

【0016】14は上チャンバユニット6の側面に配置された真空配管で、図示していない真空バルブと配管ホースで真空源に接続され、これらは真空チャンバ内を減圧し真空にする時に使用される。 [0016] 14 is a vacuum pipe which is arranged on a side surface of the upper chamber unit 6 is connected to a vacuum source in the illustrated vacuum valve not hose, which are used when the vacuum depressurizing the vacuum chamber . 15はガスパージバルブとチューブで、窒素ガス(N 2 )やクリーンドライエアー等の圧力源に接続され、これらは真空チャンバを大気圧に戻す時に使用される。 15 is a gas purge valve and tubing connected to a nitrogen gas (N 2) and a pressure source, such as clean dry air, which are used when returning the vacuum chamber to atmospheric pressure.

【0017】次に、上基板1bを保持する粘着シート1 Next, the pressure-sensitive adhesive sheet 1 for holding the upper substrate 1b
8の駆動機構について説明する。 It will be described 8 of the drive mechanism. 上チャンバユニット6 The upper chamber unit 6
内の17はスピンドルで、ロール状に巻き付けた粘着シート18を送り出し方向に駆動回転,自由回転,送り出し方向と逆トルクがかかった状態での送り出し方向への回転及び回転固定が可能になっている。 17 of the inner in the spindle, and is rotationally drivable in a direction feeding the pressure-sensitive adhesive sheet 18 wound into a roll, the rotation and the rotation fixing of the free rotation, the feeding direction in a state where dispensing direction and reverse torque is applied is .

【0018】粘着シート18は、回転自由のローラ19 [0018] The pressure-sensitive adhesive sheet 18, free rotation of the roller 19
を介して反対側の回転自由のローラ20に向かい、ローラ20と相対的に位置固定し配置されたスピンドル21 Toward the rotational freedom of the roller 20 on the opposite side via a spindle 21 which is relatively stationary positioned with the roller 20
で巻き取り可能となっている。 And has a take-up possible. スピンドル21は、粘着シート18を巻き取り方向に駆動回転が可能で、かつ、 The spindle 21 is capable of driven to rotate in the winding direction a pressure-sensitive adhesive sheet 18, and,
巻き取り方向にトルクがかかった状態での逆回転と回転固定が可能になっている。 Reverse rotation and rotation fixing in a state in which applied torque in the winding direction is enabled. また、ローラ20と相対的に位置固定された巻き取り用のスピンドル21は、粘着シート18を巻き取り方向に駆動回転しながらスピンドル17の方向に水平駆動可能になっている。 The spindle 21 for winding that is relatively stationary and the roller 20 is adapted to be horizontally driven in the direction of the spindle 17 while rotated in the winding direction of the adhesive sheet 18. 尚、粘着シート18の粘着面は下側になるように巻き取られているので、上基板1bが粘着シート18に貼り付くと下基板1 Since the adhesive surface of the adhesive sheet 18 is wound so that the lower side, the lower substrate when the upper substrate 1b is stuck to the adhesive sheet 18 1
aと対向するようになる。 It comes to a and the counter.

【0019】スピンドル17の上記回転動作は、図2に示しているように、モータ24により行う。 [0019] The rotating operation of the spindle 17, as shown in FIG. 2, performed by the motor 24. スピンドル21の上記回転動作は、モータ25により行い、上記水平動作は、モータ25が固定されたボールナット28 The rotational movement of the spindle 21 is carried out by the motor 25, the horizontal operation, the ball nut 28 by the motor 25 is fixed
が、モータ27の駆動によりボールねじ26が回転し移動することで実現する。 But the ball screw 26 by the motor 27 can be realized by moving and rotating. 尚、ボールナット28の水平動作用ガイドは、図示を省略した。 The horizontal operation guide of the ball nut 28 are not shown. 29、30は、ボールねじ26のサポート軸受で、サポート軸受29は上チャンバユニット6に固定され、サポート軸受30はモータ24及びローラ19のシャフトとともにブラケット31 29 and 30, in support bearings of the ball screw 26, support bearings 29 fixed to the upper chamber unit 6, the bracket 31 together with the shaft support bearing 30 motor 24 and the roller 19
に固定され、ブラケット31は、上チャンバユニット6 It is fixed to the bracket 31, the upper chamber unit 6
に固定される構造となっている。 It has a structure that is fixed to.

【0020】22a、22bは画像認識カメラで、上下各基板1a,1bに設けられている位置合わせマークを読み取るために設置される。 [0020] 22a, 22b in the image recognition camera is installed to read the alignment mark provided upper and lower substrates 1a, to 1b. 23a、23bは、透明な覗き窓で、上チャンバユニット6に設けられた穴6a、 23a, 23b is a transparent peephole, hole 6a provided in the upper chamber unit 6,
6bの真空遮断を行う。 Performing a vacuum interrupter of 6b.

【0021】7a、7bは基板の位置合わせマークを見るため、加圧板7に設けた小径の穴である。 [0021] 7a, 7b is to see alignment marks of the substrate, a small diameter hole provided in the pressure plate 7. ここで、粘着シート18の幅は、粘着シート18が画像認識カメラ22a、22bの視野を塞がないよう、図2に示すように、通常基板の対角位置にある位置合わせマーク24 Here, the width of the pressure-sensitive adhesive sheet 18, so that the pressure-sensitive adhesive sheet 18 does not block the field of view of the image recognition camera 22a, 22b, as shown in FIG. 2, the alignment mark 24 in the normal diagonal positions of the substrate
a、24bのY方向の距離より僅かに小さくしておくと良い。 a, good idea to slightly less than the distance 24b in the Y direction.

【0022】次に、図3乃至図5で本基板組立装置1で基板を貼り合わせる工程について説明する。 [0022] Next, steps for bonding the substrate in FIGS. 3 to 5 in the substrate assembly apparatus 1. 図3(a)は上基板1bが保持される前の上チャンバ部T2の初期状態を示しており、スピンドル21は粘着シート18を広げた状態で図の右側に移動させてあり、加圧板7は上方に待機している。 Figure 3 (a) shows the initial state of the upper chamber portion T2 before the upper substrate 1b is maintained, the spindle 21 is Yes is moved to the right side of FIG in a state of bringing the pressure-sensitive adhesive sheet 18, the pressure plate 7 It is waiting upward.

【0023】図3(b)は加圧板7を下降させ粘着シート18に接触させた後、更にやや下降させた状態を示している。 [0023] FIG. 3 (b) after contacting the adhesive sheet 18 lowers the pressing plate 7, further shows a state in which a slightly lowered. この時、スピンドル17と21に巻き取られている粘着シート18が両方から送り出されるが、粘着シート18はスピンドル17,21を回転駆動させるそれぞれのモータでトルク制御を行い、常に引っ張り力がかかった状態にする。 At this time, although the pressure-sensitive adhesive sheet 18 which is wound on the spindle 17 and 21 is fed from both pressure-sensitive adhesive sheet 18 is subjected to torque control for each motor for rotating the spindle 17 and 21, always pulling force is applied to state. 引っ張り力は上基板1bの重量で決定し、図3(c)に示すように,上基板1bを貼り付け保持させても加圧板7との間に隙間が殆どできない量に設定する。 Tensile force determined by the weight of the upper substrate 1b, as shown in FIG. 3 (c), is set to an amount that hardly a gap between the upper substrate 1b Paste retained allowed pressurizing plate 7 even when the.

【0024】このように上基板1bを粘着シート18に貼り付け保持した後、図4に示すように、上基板1bと下基板1aの貼り合わせを行なう。 [0024] After holding Paste Thus the upper substrate 1b on the adhesive sheet 18, as shown in FIG. 4, it performs the bonding of the upper substrate 1b and the lower substrate 1a.

【0025】先ず、図4(a)に示すように、下基板1a [0025] First, as shown in FIG. 4 (a), the lower substrate 1a
をテーブル4上に搭載した下チャンバ部T1を上チャンバ部T2の真下に移動させ、図4(b)に示すように、シリンダ11により上チャンバユニット6を下降させ、下チャンバユニット5の周りに配置してあるOリング12 The move the lower chamber portion T1 mounted on the table 4 just below the upper chamber portion T2, as shown in FIG. 4 (b), the upper chamber unit 6 is lowered by the cylinder 11, around the lower chamber unit 5 is disposed O-ring 12
に上チャンバユニット6のフランジを接触させ上下チャンバ部T1,T2を一体にしてから真空配管14から真空排気を行う。 Performing evacuation from the vacuum pipe 14 to the upper chamber unit flange contacting the upper and lower chamber portions T1 of 6, T2 after the integrally.

【0026】尚、下基板1aはテーブル4上に位置決め固定されており、下基板1a上の外周には、シール剤がクローズしたパターンで描画されており、その内側には適量の液晶が滴下されている。 [0026] The lower substrate 1a is positioned and fixed on the table 4, on the outer periphery on the lower substrate 1a, which is drawn in a pattern sealant is closed, an appropriate amount of liquid crystal is dropped on its inner side ing.

【0027】さて、上チャンバユニット6と下チャンバユニット5が一体になってできた真空チャンバ内が所定の真空度に達したら、図4(c)に示すように、上下両基板1a,1bの位置合わせを行いながらシャフト9上の図示していない上下駆動機構を動作させ,加圧板7を下降させ、所定の加圧力で上下両基板1a,1bの間隔を狭めて所望間隔で貼り合わせる。 [0027] Now, when the vacuum chamber upper chamber unit 6 and the lower chamber unit 5 is Deki is integral reaches a predetermined degree of vacuum, as shown in FIG. 4 (c), upper and lower substrates 1a, 1b of while positioning by operating the vertical drive mechanism (not shown) on the shaft 9, lowers the pressure plate 7 are bonded at desired intervals the upper and lower substrates 1a, by narrowing the spacing 1b at a predetermined pressure.

【0028】この時も加圧板7が降下するにつれスピンドル17と21に巻き取られている粘着シート18が両方から送り出されるが、上記したように粘着シート18 [0028] Although the pressure-sensitive adhesive sheet 18 which is wound on the spindle 17 and 21 As this time also the pressure plate 7 is lowered is fed from both pressure-sensitive adhesive sheet 18 as described above
は常に適切な引っ張り力が掛かった状態なので、粘着シート18が伸びたり切れたりしない。 Since the state is always appropriate tensile force is applied, does not or cut-off growth in the pressure-sensitive adhesive sheet 18. また、この引っ張り力により上基板1bは粘着シート18を介して加圧板7にほぼ密着していて上基板1bの中央部が極端に垂れ下がっていることはなく、上下両基板1a,1bはほぼ平行であるから、上基板1bの中央部が基板1a上に散布されたスペーサに悪影響を与えたり、基板同士の位置合わせが不可能になることはない。 Also, rather than the central portion of the upper substrate 1b upper substrate 1b have substantially close contact with the pressure plate 7 via the adhesive sheet 18 is hanging extreme by the tension force, the upper and lower substrates 1a, 1b are substantially parallel since it is, or adversely affect the spacer central section is sprayed on a substrate 1a of the upper substrate 1b, never aligned between the substrates becomes impossible.

【0029】因みに、基板同士の位置合わせは、上チャンバユニット6に設けた覗き窓23a、23bから画像認識カメラ22a、22bで上下各基板1a,1bに設けられている位置合わせマークを読み取って画像処理により位置を計測し、下チャンバ部T1の図示していないXYθ駆動機構を微動させて、高精度な位置合わせを行なう。 [0029] Incidentally, the alignment of the boards, the image reading viewing window 23a provided in the upper chamber unit 6, an image recognition camera 22a from 23b, the upper and lower substrates 1a at 22b, an alignment mark provided on the 1b processed by measuring the position, by fine movement of the XYθ drive mechanism (not shown) of the lower chamber section T1, perform highly accurate positioning. この微動において、Oリング12が極端に変形しないで真空が維持されるように、ボールベアリング13 In this fine movement, such that a vacuum is maintained in the O-ring 12 is not excessively deformed, the ball bearing 13
が上下チャンバユニット6,5の間隔を維持している。 There has maintained a distance between the upper and lower chamber units 6,5.

【0030】貼り合わせが終了すると、真空配管14につながっている図示していない真空バルブを締めてガスパージバルブ15を開き、真空チャンバ内にN 2やクリーンドライエアーを供給し、大気圧に戻してからガスパージバルブ15を閉じて、図5に示す貼り合わせで形成されたセルの取り出し工程に移る。 [0030] bonding is completed, open the gas purge valve 15 by tightening the vacuum valve (not shown) is connected to the vacuum pipe 14, to supply N 2 and clean dry air into the vacuum chamber, it is returned to atmospheric pressure close the gas purge valve 15 from moves to take out the process of the cells formed by bonding shown in FIG.

【0031】先ず、図5(a)に示すように、シリンダ11で上チャンバユニット6を上昇させた後、加圧板7 [0031] First, as shown in FIG. 5 (a), after raising the upper chamber unit 6 in the cylinder 11, the pressure plate 7
を上昇させる。 Raising the.

【0032】貼り合せた上基板1bの上面には粘着シート18が貼り付いているので、以下、粘着シート18を剥がす動作について図5(b)で説明する。 [0032] Since the upper surface of the upper bonded substrate 1b is stuck the adhesive sheet 18, will be described in FIG. 5 (b) operation for peeling off the adhesive sheet 18.

【0033】この動作は、スピンドル21を回転させ粘着シート18を巻き取ると同時に、巻き取り速度と同期した速さで回転固定したスピンドル17の方向に水平移動させることにより行う。 [0033] This operation is performed by horizontally moving in the direction of the rotating the spindle 21 winding the adhesive sheet 18 simultaneously, the spindle 17 which is rotationally fixedly at a speed that is synchronized with the winding speed.

【0034】この時、粘着シート18は上基板1bの上面から徐々に無理なく剥がされ、スピンドル21がスピンドル17に最も近接した時にすべて剥がれるようになっており、スピンドル21は粘着シート18の剥取手段としても働いている。 [0034] At this time, the adhesive sheet 18 is peeled off without gradually forced from the upper surface of the upper substrate 1b, the spindle 21 is adapted to peel off all when closest to the spindle 17, the spindle 21 of the pressure-sensitive adhesive sheet 18 peeling It is working also as a means.

【0035】貼り合わされた下基板1aはテーブル4で吸引吸着させており、粘着シート18が剥がされている途中でもずれたり持ち上がったりしない。 [0035] bonded together lower substrate 1a was is sucked suction table 4, no or lifted or displaced even while the adhesive sheet 18 has been removed.

【0036】上記動作が終了すると、図5(b)に示すように下チャンバ部T1を図の左側に移動させ、テーブル4から上下基板1b,1aを貼り付けてできたセルpc [0036] When the operation is completed, the lower chamber portion T1 as shown in FIG. 5 (b) is moved to the left in the figure, the cell pc which Deki from table 4 pasting the upper and lower substrates 1b, and 1a
を外すとともに、スピンドル17から新しい粘着シート18を送り出すためスピンドル21を回転固定した状態で右方向に水平移動させ、次の貼り合わせに備える。 With removing and moved horizontally to the right while rotating the fixed spindle 21 to deliver a new adhesive sheet 18 from the spindle 17, ready for the next bonding.

【0037】次に、図6により本発明の他の実施形態になる基板貼合装置での基板貼り合わせを説明する。 Next, the substrate bonding at the substrate bonding apparatus according to the other embodiment of the present invention will be described with reference to FIG.

【0038】図6で図1乃至図5に示した一実施形態と同一物若しくは相当物には同一符号を付けて、説明は省略する。 [0038] The same components or equivalent components and the embodiment shown in FIGS. 1 to 5 in FIG. 6 with the same reference numerals, and description thereof is omitted.

【0039】この実施形態では、スピンドル21による粘着シート18の巻き取りに代えて、粘着シート18のチャック機構45を設け、スピンドル17側のローラ1 [0039] In this embodiment, instead of the winding of the adhesive sheet 18 by the spindle 21, the chuck mechanism 45 of the pressure-sensitive adhesive sheet 18 is provided, the spindle 17 side roller 1
9の近傍に粘着シート18のカッタ40や粘着シート1 9 cutter 40 and the pressure-sensitive adhesive sheet 1 of the adhesive sheet 18 in the vicinity of
8のチャックのための駆動機構を設けている。 It is provided a drive mechanism for the 8 of the chuck.

【0040】即ち、図6では簡略化のために上基板1b [0040] That is, above for simplicity in FIG substrate 1b
の図示を省略しているが、基板貼り合わせ後に、アクチュエータ42を介してカッタ台41を支持したカッタベース43をアクチュエータ44でカッタ40の刃の下端位置まで上昇させる。 Although not shown, after the bonding substrate to the cutter base 43 supporting the cutter table 41 through the actuator 42 in the actuator 44 is raised to the lower end position of the blade of the cutter 40.

【0041】次に、セルpcの外周部で粘着シート18 Next, the outer peripheral portion of the cell pc adhesive sheet 18
の幅方向(図のY方向)にカッタ40を移動させ、上基板1bが貼り付いている粘着シート18を切断する。 In the width direction to move the cutter 40 in the (Y direction in the drawing), to cut the adhesive sheet 18 to the upper substrate 1b is stuck.

【0042】チャック45は粘着シート18の把持を開放し、粘着シート18を付けたままセルpcを取り出し、適宜な時点でセルpcから粘着シート18を剥ぎ取る。 The chuck 45 releases the gripping of the adhesive sheet 18, takes out the cell pc leaving the adhesive sheet 18, strip the adhesive sheet 18 from the cell pc at appropriate time points. この剥ぎ取りまでは粘着シート18は、セルpcの保護膜として働く。 Until this stripping the adhesive sheet 18 serves as a protective film of the cell pc. シール剤硬化のためにUV光を照射することがあれば、粘着シート18の大抵の粘着層はU If there is to be irradiated with UV light for sealant cure, most of the adhesive layer of the adhesive sheet 18 is U
V光で劣化するので適宜な時点での粘着シート18を剥ぎ取りは容易である。 Since degradation in V light Strip adhesive sheet 18 at appropriate time points it is easy.

【0043】セルpcを取り出した後は、カッタ台41 [0043] After removal of the cell pc, the cutter table 41
をアクチュエータ42で僅かに下降させ、粘着シート1 It was slightly lowered by the actuator 42, the pressure-sensitive adhesive sheet 1
8の端部にチャック45のつかみ代を作る。 Make a grip margin of the chuck 45 at the end of the 8. カッタ40 Cutter 40
が退行(図の位置に戻ること)してから、モータ27の駆動でボールねじ26が回転し、チャック45がスピンドル17側のローラ19のところに行って粘着シート1 From There regressed (it returns to the position in FIG.), The ball screw 26 is rotated by driving the motor 27, the pressure-sensitive adhesive sheet 1 chuck 45 is performed at the spindle 17 side of the roller 19
8の端部を把持する。 Gripping the end of the 8. 尚、チャック45における粘着シート18の把持を行なう駆動機構は、チャック45内に内蔵されている。 The driving mechanism for the gripping of the adhesive sheet 18 in the chuck 45 is incorporated in the chuck 45.

【0044】その後、アクチュエータ44でカッタベース43を下降させ、チャック45をモータ27で図の右側に移動させて粘着シート18を繰り出すとともに水平に維持し、次の上基板1bの保持に備える。 [0044] Then, to lower the cutter base 43 by an actuator 44, the chuck 45 is maintained horizontally with is moved to the right in FIG motor 27 feeds the adhesive sheet 18 comprises a holding of the next on the substrate 1b.

【0045】次に、図7で本発明の更に他の実施形態になる基板貼合装置での基板貼り合わせを説明する。 Next, explaining a further substrate bonded with the substrate bonding apparatus according to the other embodiment of the present invention in FIG.

【0046】図7で図1乃至図5に示した一実施形態と同一物若しくは相当物には同一符号を付けて、説明は省略する。 [0046] The same components or equivalent components and the embodiment shown in FIGS. 1 to 5 in Figure 7 are given the same reference numerals, and description thereof is omitted.

【0047】図7において、50は加圧板7に設けた開孔で、上方にアクチュエータ51を備え、このアクチュエータ51から下方に向かって伸びた軸の先に粘着部材52が設けられている。 [0047] In FIG. 7, 50 in the apertures provided in the pressure plate 7, an actuator 51 upward, is provided above the adhesive member 52 of the shaft extending downward from the actuator 51. アクチュエータ51の動作で、 In operation of the actuator 51,
開孔50内で粘着部材52が上下する。 The adhesive member 52 up and down in the opening 50.

【0048】上基板1bは、粘着部材52の下面にその粘着作用で加圧板7の下面に密着した形で保持している。 The upper substrate 1b is held in the form of being in close contact with the lower surface of the pressure plate 7 with its adhesive applied to the lower surface of the adhesive member 52. 即ち、開孔50は上基板1bを下基板1aに対して水平に対向させるべく保持できるように、上基板1bの大きさ,形状に合わせて適宜な間隔や位置で加圧板7に設けられている。 That is, opening 50 is so can hold in order to face horizontally on the substrate 1b to the lower substrate 1a, the size of the upper substrate 1b, provided the pressure plate 7 at appropriate intervals and located in accordance with the shape there.

【0049】下基板1aをテーブル4上に固定した下チャンバ部T1は上基板1bを粘着部材52で保持している上チャンバ部T2の下に移動される。 [0049] is moved under the upper chamber portion T2 lower chamber portion T1 fixing the lower substrate 1a on the table 4 is holding the upper substrate 1b with adhesive member 52.

【0050】その後、図6(b)で示すように、シリンダ11で上チャンバユニット6を下降させ、下チャンバユニット5と真空チャンバを形成してから内部を減圧し、真空にする。 Thereafter, as shown in FIG. 6 (b), lowering the upper chamber unit 6 in the cylinder 11, the inner and reduced pressure to form a lower chamber unit 5 and the vacuum chamber, a vacuum.

【0051】次に、上下両基板1b,1aの位置合せをして、シャフト9で加圧板7を下降させ、加圧板7で直に上基板1bを押して上下両基板1b,1aの貼り合わせを行なう。 Next, the upper and lower substrate 1b, and the alignment of 1a, lowers the pressure plate 7 with the shaft 9, the upper and lower substrate 1b by pressing the upper substrate 1b directly at the pressure plate 7, the bonding of 1a carried out. この場合、開孔50には粘着部材52があるので、加圧力は上基板1bに平等に加わる。 In this case, since the opening 50 is the adhesive member 52, pressure is exerted on equality on the upper substrate 1b.

【0052】貼り合わせてできたセルpcの上基板1b [0052] on top of the cell pc that Deki bonded substrate 1b
から粘着部材52を剥がす時は、アクチュエータ51により開孔50内で粘着部材52を上昇(退行)させる。 When peeling off the adhesive member 52 from causes increase in the opening 50 of the adhesive member 52 by the actuator 51 (regression).
すると、加圧板7の開孔50の周縁部が上基板1bの移動を阻止するので、簡単に粘着部材52と上基板1bを引き離すことができ、加圧板7が粘着部材52の剥取手段として働く。 Then, since the periphery of the opening 50 of the pressure plate 7 prevents the movement of the upper substrate 1b, can be pulled apart easily adhesive member 52 and the upper substrate 1b, as the pressure plate 7 is stripped means of the adhesive member 52 work.

【0053】その後、真空チャンバ内に窒素ガスN 2やクリーンドライエアー等を供給し内部をパージしつつ大気圧に戻し、加圧板7を上昇させ上チャンバユニット6 [0053] Then, while purging the internal supplying nitrogen gas N 2 and clean dry air or the like in the vacuum chamber back to atmospheric pressure, the upper chamber unit to raise the pressure plate 7 6
を上昇させ、下チャンバ部T1を図の左側に移動させてから、セルpcをテーブル4から取り出す。 Increasing the, move the lower chamber portion T1 on the left side of the figure, take out the cell pc from table 4.

【0054】この実施形態によれば、粘着部材が加圧板7に内蔵されているので、上チャンバユニット6内が簡素化され、真空チャンバの小型化により、減圧真空化の時間を短縮でき、処理枚数を高めることができる。 [0054] According to this embodiment, since the adhesive member is incorporated in the pressure plate 7, simplifies the upper chamber unit 6, the size of the vacuum chamber, can reduce the vacuum evacuation time processing it is possible to increase the number of sheets.

【0055】また、上基板1bのたるみを起こす中央部を加圧板7に内蔵した粘着部材で吊り上げておくことができるから、上基板の中央部がたわんで配向膜などを傷つける心配はない。 [0055] Further, since it is possible to keep lifting an adhesive member having a built-in central portion causing sagging of the upper substrate 1b on the pressure plate 7, the central portion of the upper substrate is no fear of damaging the like alignment film bends.

【0056】以上の実施形態に限らず、テーブル4に粘着部材を仕込んで、下基板1aの固定に利用してもよい。 [0056] not limited to the above embodiments, charged with adhesive material on the table 4, it may be utilized to secure the lower substrate 1a. また、粘着シート18に代えて、上基板1bの平行な2辺に沿うように複数本の粘着テープを図1,図2に示した機構の如きもので、上チャンバユニット内で移動可能に設置して、上基板1bを下基板1aに平行となるように保持させてもよい。 Further, instead of the adhesive sheet 18, Fig. 1 a plurality of the adhesive tape along the two parallel sides of the upper substrate 1b, those such as mechanism shown in FIG. 2, to be movable in the upper chamber unit installed and it may be held in parallel to the upper substrate 1b lower substrate 1a.

【0057】いずれの実施形態でも、上基板をその主面側で保持しているので、中央部のたるみを消すことができ、シール剤が基板の周縁部ぎりぎりに設けられていても上基板の保持に支障はない。 [0057] In either embodiment, since holding the upper substrate with the main surface side, can erase the slack in the central portion, the sealing agent of the upper substrate be provided so barely peripheral portion of the substrate there is no problem to hold.

【0058】 [0058]

【発明の効果】以上説明したように、本発明によれば、 As described in the foregoing, according to the present invention,
基板サイズが大型化,薄板化しても真空中で高精度に基板同士を貼り合せることができる。 Substrate size large, it is possible to bond the substrates to each other with high accuracy in a vacuum be thinned.

【0059】また本発明によれば、基板周縁部際に接着剤が設けられるものでも容易に上基板を保持でき,しかも配向膜などを傷つけることなく貼り合せることができる。 [0059] According to the present invention, even those that adhesive is provided in the peripheral portion of the substrate can be easily held on the substrate, yet can be bonded without damaging an alignment film.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の一実施形態を示す基板組立装置の概略断面図である。 1 is a schematic cross-sectional view of a substrate assembly apparatus showing an embodiment of the present invention.

【図2】図1に示した基板組立装置における粘着シートの駆動機構の斜視図である。 It is a perspective view of the drive mechanism of the pressure-sensitive adhesive sheet of the substrate assembly apparatus shown in FIG. 1. FIG.

【図3】図1に示した基板組立装置での上下両基板を貼り合わせる初期の工程を示す要部の断面図である。 3 is a cross-sectional view of a main part showing an initial step of bonding the upper and lower substrates at the substrate assembly apparatus shown in FIG.

【図4】図1に示した基板組立装置での上下両基板を貼り合わせる工程を示す要部の断面図である。 4 is a sectional view of a main part showing a step of bonding upper and lower substrates at the substrate assembly apparatus shown in FIG.

【図5】図1に示した基板組立装置での上下両基板を貼り合わせて形成したセルの取り出し工程を示す要部の断面図である。 5 is a sectional view of a main part showing a take-out step of the cell which is formed by bonding the upper and lower substrates at the substrate assembly apparatus shown in FIG.

【図6】本発明の他の実施形態になる基板組立装置での上下両基板を貼り合わせる工程を示す要部の斜視図である。 6 is a perspective view of a main part showing a upper and lower substrates bonded steps in other exemplary substrate assembly apparatus according to the embodiment of the present invention.

【図7】本発明の更に他の実施形態になる基板組立装置での上下両基板を貼り合わせる工程を示す要部の断面図である。 7 is a cross-sectional view of a main part showing a step of bonding the upper and lower substrates at the substrate assembly apparatus according to the other embodiment of the present invention.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 基板組立装置 1a 下基板 1b 上基板 4 テーブル 5 下チャンバユニット 6 上チャンバユニット 7 加圧板 12 Oリング 13 ボールベアリング 14 真空配管 17,21 スピンドル 18 粘着シート 1 substrate assembly apparatus 1a under the substrate 1b on the substrate 4 table 5 below the chamber unit 6 the upper chamber unit 7 pressing plate 12 O-ring 13 ball bearing 14 vacuum pipe 17, 21 the spindle 18 the adhesive sheet

フロントページの続き (72)発明者 齊藤 正行 茨城県竜ヶ崎市向陽台5丁目2番 日立テ クノエンジニアリング株式会社開発研究所 内 (72)発明者 平井 明 茨城県竜ヶ崎市向陽台5丁目2番 日立テ クノエンジニアリング株式会社開発研究所 内 Fターム(参考) 2H088 FA02 FA03 FA04 FA10 FA17 FA18 FA20 FA30 HA01 MA20 5G435 AA17 BB12 HH20 KK05 Of the front page Continued (72) inventor Saito, Masayuki Ibaraki Prefecture Ryugasaki City Koyodai 5-chome No. 2 Hitachi Te Techno Engineering Co., Ltd. developed the laboratory (72) inventor, Ibaraki Prefecture Ryugasaki City Akira Hirai Koyodai 5-chome No. 2 Hitachi Te Techno Engineering Co., Ltd. development Institute in the F-term (reference) 2H088 FA02 FA03 FA04 FA10 FA17 FA18 FA20 FA30 HA01 MA20 5G435 AA17 BB12 HH20 KK05

Claims (6)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】貼り合わせる一方の基板を貼り合わせる他方の基板上に保持して対向させ、いづれかの基板に設けた接着剤により真空中で貼り合わせる基板の組立方法において、 粘着手段で一方の基板を他方の基板上に保持させ、真空中で間隔を狭めて貼り合わせを行うことを特徴とする基板の組立方法。 1. A kept be bonded one of the substrates a bonding other substrate are opposed to each other, in the method of assembling a substrate bonding in a vacuum by an adhesive provided In any one of the substrates, one substrate with an adhesive means was held on the other substrate, the assembly method of a substrate, characterized in that bonding is performed by narrowing the gap in a vacuum.
  2. 【請求項2】上記請求項1に記載の基板の組立方法において、 一方の基板を粘着シートの下面にその粘着力で加圧板の下方に保持させ、他方の基板はテーブル上に保持し、前記粘着シートには一方の基板の主面と平行な方向の引っ張り力を掛けて両基板をほぼ平行に維持し、前記加圧板とテーブルの間隔を狭めることで粘着シートを介して両基板の貼り合わせを行うことを特徴とする基板の組立方法。 2. A method of assembling a substrate according to the claim 1, the one substrate is held under the pressure plate at its adhesive strength on the lower surface of the adhesive sheet, the other substrate is held on the table, the adhesive sheet maintains the tensile force both substrates over a plane parallel to the principal direction of one substrate substantially parallel, the pressure plate and through the adhesive sheet by narrowing the interval between the tables both substrates bonded together method of assembling a substrate and performing.
  3. 【請求項3】上記請求項2に記載の基板の組立方法において、 チャックで粘着シートの端部を把持し、水平に移動することで粘着シートに一方の基板の主面と平行な方向の引っ張り力を掛け、両基板の貼り合わせ後にカッタで粘着シートを幅方向に切断することを特徴とする基板の組立方法。 3. A method of assembling a substrate according to the claim 2, gripping the ends of the adhesive sheet in the chuck, the plane parallel to the principal direction of one substrate to the adhesive sheet by moving horizontally pulling method of assembling a substrate, characterized in that applying a force to cut the adhesive sheet in the widthwise direction by the cutter after bonding of the substrates.
  4. 【請求項4】上記請求項1に記載の基板の組立方法において、 一方の基板を加圧板に内蔵させた粘着手段で保持させ、 4. A method of assembling a substrate according to the claim 1, is held in the pressure-sensitive means is built one substrate to the pressure plate,
    両基板の貼り合わせを行ってから粘着手段を加圧板内に退行させることを特徴とする基板の組立方法。 Method of assembling a substrate, characterized in causing regression of adhesive means in the pressing plate after performing bonding of both substrates.
  5. 【請求項5】真空チャンバ内の上方に一方の基板を保持し、貼り合わせる他方の基板を真空チャンバ内の下方に保持して両基板を対向させ、いづれかの基板に設けた接着剤により真空中で両基板の間隔を狭めて基板同士を貼り合わせる基板の組立装置において、 一方の基板を他方の基板上に保持する粘着手段と、該粘着手段で保持した一方の基板とその下に位置する他方の基板の間隔を狭める手段、を有することを特徴とする基板の組立装置。 5. holds one substrate above the vacuum chamber, the other substrate bonding are opposed to both substrates held beneath the vacuum chamber, vacuum by an adhesive provided In any one of the substrate in in assembling device for the substrate for bonding the substrates to each other by narrowing the distance between both substrates, and an adhesive means for holding the one substrate on the other substrate, the other located under it one of the substrate held by the adhesive means assembly device substrate, characterized in that it comprises means, to narrow the spacing of the substrate.
  6. 【請求項6】上記請求項5に記載の基板の組立装置において、さらに他方の基板を保持するテーブルと、粘着手段で保持した一方の基板をその下に位置する他方の基板に対して加圧する加圧板と、他方の基板と貼り合わせた一方の基板から粘着手段を剥ぎ取る剥取手段、を有することを特徴とする基板の組立装置。 In the assembly device substrate according to claim 6, wherein said claim 5, further a table for holding the other substrate, pressed to the other substrate located one of the substrate held by adhesive means thereunder pressure plate and the assembly device for the substrate, characterized in that it comprises a peeling unit, stripping the adhesive means from one of the substrate bonded to the other substrate.
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