KR20210036329A - Resin molding apparatus and manufacturing method of molded product - Google Patents

Abstract

The present invention relates to a resin molding device and a method for manufacturing a resin molded product. According to the present invention, the present invention suppresses deformation of a molded object when only one side of the molded object is resin-sealed. The resin molding device can perform resin-molding for a first surface of a first mold side of the molded object held in a first mold and a second surface of the other side by using a molding frame including the first mold and a second mold opposite to each other. The first mold includes a concave unit opposite to the first surface of the molded object. The resin molding device comprises: a gas supplying unit which supplies gas in the concave unit; an atmospheric pressure measuring unit which measures atmospheric pressure in the concave unit; and a controlling unit which controls a gas supply amount by the gas supplying unit to reduce a pressure difference of the first surface and the second surface of the molded object based on a measured result by the atmospheric pressure measuring unit.

Description

A resin molding apparatus and a manufacturing method of a resin molded product TECHNICAL FIELD [RESIN MOLDING APPARATUS AND MANUFACTURING METHOD OF MOLDED PRODUCT]

The present invention relates to a resin molding apparatus and a method of manufacturing a resin molded article.

For example, Japanese Unexamined Patent Application Publication No. 2017-94521 (Patent Document 1) describes a compression method and a compression apparatus for compression molding a work in which a plurality of semiconductor chips are mounted on both sides of a substrate. In the compression method and compression apparatus described in Patent Document 1, both sides are resin-molded in one resin molding step.

Japanese Unexamined Patent Publication No. 2017-94521

In the case of resin-molding only one surface of the substrate by the compression method and compression apparatus described in Patent Document 1, there is a possibility that the amount of deformation of the object to be molded increases due to the molding pressure.

A resin molding apparatus according to an embodiment of the present invention uses a molding mold including a first mold (frame) and a second mold opposed to each other, and the first mold side of the molded object held in the first mold. As a resin molding apparatus capable of resin molding the second surface side opposite to the first surface, the first type has a concave portion facing the first surface of the object to be molded, and the resin molding apparatus supplies a gas into the concave portion. The amount of gas supplied by the gas supply unit to reduce the pressure difference between the first surface side and the second surface side of the object to be molded based on the result of measurement by the gas supply unit to be formed, the air pressure measurement unit to measure the atmospheric pressure in the concave unit, and the air pressure measurement unit. It includes a control unit for controlling.

A resin molding apparatus according to another embodiment of the present invention uses a mold including a first mold and a second mold opposite to each other, and the first surface of the molded object held in the first mold on the side of the first mold is A resin molding apparatus capable of resin molding the opposite second surface side, wherein the first mold has a concave portion facing the first surface of the object to be molded, and the resin molding apparatus includes a gas supply unit for supplying gas into the concave portion, and a first Based on the driving mechanism used to close the mold and the second mold, a pressure measurement unit that measures the pressure on the second surface side of the molding object, and the measurement result by the pressure measurement unit, the first and second surfaces of the molding object are And a control unit for controlling the drive mechanism to reduce the pressure difference on the surface side.

A resin molding apparatus according to another embodiment of the present invention uses a mold including a first mold and a second mold opposite to each other, and the first surface of the molded object held in the first mold on the side of the first mold is As a resin molding device capable of resin molding the second side of the opposite side, the first type has a concave portion facing the first side of the object, and the resin molding device is a drive used to close the first and second types. Measurement results by the mechanism, a pressure measurement unit that measures the pressure on the second surface side of the object to be molded, a gas supply unit that supplies gas into the concave portion, an atmospheric pressure measurement unit that measures the atmospheric pressure in the concave portion, and the pressure measurement unit And a control unit that controls the closing force by the drive mechanism and the amount of gas supplied by the gas supply unit based on the measurement result by the atmospheric pressure measurement unit.

A resin molding apparatus according to another embodiment of the present invention uses a mold including a first mold and a second mold opposite to each other, and the first surface of the molded object held in the first mold on the side of the first mold is A resin molding apparatus capable of resin-molding the second side of the opposite side, wherein the first type has a concave portion facing the first surface of the object to be molded, and the resin molding apparatus includes a gas supply unit for supplying gas into the concave portion, and a molding frame. A decompression mechanism capable of decompressing the enclosed space including, and a communication path capable of communicating the concave portion of the type 1 and the enclosed space, and when depressurizing the enclosed space by the decompression mechanism, the communication path is opened to seal the concave portion and the concave portion. When the space is communicated and pressure is applied to the second surface of the object to be molded, the communication path is closed to block the recess and the enclosed space.

A method of manufacturing a resin molded article according to one embodiment of the present invention uses a mold including a first mold and a second mold opposite to each other, and the first mold side of the molded object held in the first mold A method for manufacturing a resin molded article in which a second surface side opposite to the surface is resin-molded, comprising the step of measuring the atmospheric pressure in the recess of the type 1 opposite to the first surface of the object to be molded, and the result of the measurement of the atmospheric pressure. On the basis of, a step of supplying gas into the concave portion and closing the object to be molded is provided while controlling the amount of gas supplied to reduce the pressure difference between the first and second faces of the object to be molded.

A method of manufacturing a resin molded article according to another embodiment of the present invention uses a mold including a first mold and a second mold opposite to each other, and the first surface of the molded object held in the first mold is on the side of the first mold. A method of manufacturing a resin molded article in which a second surface side opposite to that of is resin-molded, comprising a step of measuring a pressure on a second surface side of the object to be molded, and a first surface side of a molded object based on the result of the measurement on the pressure. And a step of closing the molding object while controlling the closing force so as to reduce the pressure difference on the second surface side.

A method of manufacturing a resin molded article according to another embodiment of the present invention uses a mold including a first mold and a second mold opposite to each other, and the first surface of the molded object held in the first mold is on the side of the first mold. A method of manufacturing a resin molded article in which a second surface side opposite to that of the object is resin-molded, comprising: a step of measuring an atmospheric pressure in a recess of a type 1 opposite to the first surface of the object; and A process of measuring pressure and a process of closing a molding object while supplying gas into the recess while controlling the supply amount and closing force of the gas based on the measurement result of the atmospheric pressure and the measurement result of the pressure. Equipped.

In addition, ``blocking'' in the present application document does not mean complete blocking of the concave portion and the enclosed space, but as long as the pressure difference between the first and second sides can be reduced by increasing the air pressure in the concave portion, A slight gas leak may occur between the recess and the enclosed space.

According to the embodiment disclosed herein, the amount of deformation of the object to be molded can be suppressed when only one surface of the object to be molded is resin-molded.

The above and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the present invention, which is understood in connection with the accompanying drawings.

1 is a schematic plan view of a resin molding system including a resin molding apparatus according to Embodiments 1 and 2;
2 is a schematic cross-sectional view of a resin molding apparatus according to Embodiment 1. FIG.
3 is a schematic cross-sectional view (No. 1) illustrating a part of steps in the resin molding method according to the first embodiment.
4 is a schematic cross-sectional view (No. 2) illustrating some steps of the resin molding method according to the first embodiment.
5 is a schematic cross-sectional view (No. 3) illustrating some steps of the resin molding method according to the first embodiment.
6 is a schematic cross-sectional view (No. 4) illustrating some steps of the resin molding method according to the first embodiment.
7 is a schematic cross-sectional view (No. 5) illustrating some steps of the resin molding method according to the first embodiment.
8 is a schematic cross-sectional view (No. 6) illustrating some steps of the resin molding method according to the first embodiment.
9 is a schematic cross-sectional view (No. 7) illustrating some steps of the resin molding method according to the first embodiment.
10 is a diagram showing a flow of each step of the resin molding method according to the first embodiment.
11 is a schematic cross-sectional view of a resin molding apparatus according to a second embodiment.
Fig. 12 is a diagram for explaining deformation of a molding object (No. 1).
Fig. 13 is a diagram for explaining deformation of a molding object (No. 2).
14 is a diagram for explaining deformation of an object to be molded (No. 3).

Hereinafter, an embodiment will be described. In addition, in the drawings used for description of the embodiment, the same reference numerals denote the same or corresponding parts.

1 is a schematic plan view of a resin molding system including a resin molding apparatus according to Embodiments 1 and 2 described later. The resin molding system 1000 illustrated in FIG. 1 performs resin molding on a molding object such as a substrate. The resin material for resin molding is a thermosetting resin, and the resin material may be in a liquid state, or may be in a granular form or in a sheet form.

In the example of FIG. 1, the resin molding system 1000 supplies a resin supply module 1001 for supplying a resin material, four molding modules 1002A, 1002B, 1002C, and 1002D, and a molding object 100A before molding. Together with each other, a supply/accommodation module 1003 for accommodating the molded object 100B after molding is provided as a constituent element.

The component resin supply module 1001, the four molding modules 1002A, 1002B, 1002C, and 1002D, and the supply/accommodation module 1003 can be attached to and detached from each other for different components, and are also interchangeable. Can be. For example, with the resin supply module 1001 and the molding module 1002A mounted, the molding module 1002B is mounted on the molding module 1002A, and the supply/receiving module 1003 to the molding module 1002B. It can be equipped. As such, the number of shaping modules is variable. Further, the resin supply module 1001 and the molded product supply/storage module 1003 may be integrated into one module. By doing as described above, it is possible to optimize the configuration of the resin molding system 1000 in response to the production mode and the amount of production, and to improve productivity.

The resin supply module 1001 is provided with a moving mechanism 301. The moving mechanism 301 is supported by the rail 401 and moves along the rail 401. In a state in which the resin supply module 1001 and the molding module 1002A are mounted, the movement mechanism 301 moves along the direction (X direction) in which the resin supply module 1001 and the molding module 1002A are arranged.

A dispenser 501 which is a resin supply mechanism is provided in the moving mechanism 301. The dispenser 501 moves in the Y direction in the moving mechanism 301. The moving mechanism 301 may also be moved in the Y direction. In the example of FIG. 1, a nozzle 502 is attached to the tip of the dispenser 501. Resin for resin molding can be supplied to the resin molding apparatus 1 by the dispenser 501 and the nozzle 502. In addition, the shape of the dispenser 501 is not limited to that shown in Fig. 1, for example, the dispenser 501 may be disposed along the vertical direction (Z direction), in other words, may be disposed in the vertical direction.

Each of the molding modules 1002A, 1002B, 1002C, and 1002D is provided with a resin molding apparatus 1, respectively. The structure of the resin molding apparatus 1 will be described later.

The molded article supply/storage module 1003 is provided with a supply portion 601 for supplying the molded object 100A (substrate) before resin molding and a storage portion 701 for housing the molded object 100B after resin molding. The molded product supply/storage module 1003 is provided with a loader 602 and an unloader 702. In addition, in the molded product supply/storage module 1003, rails 401 supporting the loader 602 and the unloader 702 are provided along the X direction. The loader 602 and the unloader 702 move along the rail 401.

The loader 602 and the unloader 702 supported by the rail 401 are between the molded product supply/storage module 1003, each of the molding modules 1002A, 1002B, 1002C, 1002D, and the resin supply module 1001, It moves in the X direction. In the state in which the molded product supply/receiving module 1003 and the molding module 1002D are mounted, the loader 602 and the unloader 702 are in the direction in which the molded product supply/receive module 1003 and the molding module 1002D are arranged ( X direction).

In addition, the loader 602 and the unloader 702 move in the Y direction. That is, the loader 602 and the unloader 702 move in the horizontal direction. In addition, in the present application document, the terms ``horizontal direction'' and ``vertical direction'' are not limited only to the strict horizontal and vertical directions, and are slightly inclined with respect to the horizontal and vertical directions to the extent that they do not interfere with the motion of moving components. Including the case of losing.

The loader 602 supplied with the molding object 100A before molding moves along the rail 401 and reaches any one of the molding modules 1002A, 1002B, 1002C, and 1002D. The loader 602 that has reached any one of the molding modules 1002A, 1002B, 1002C, and 1002D supplies the molding object 100A to the resin molding apparatus 1.

The molding object 100B resin-molded by the resin molding apparatus 1 is mounted on the unloader 702. The unloader 702 on which the molding object 100B is mounted moves to the molded product supply/storage module 1003, and the molded object 100B is accommodated in the molded product supply/storage module 1003.

(Embodiment 1)

2 is a schematic cross-sectional view of the resin molding apparatus according to the first embodiment. The resin molding apparatus 1 according to the present embodiment includes an upper fixed plate 2, a lower fixed plate 3, and a movable plate 4. Between the upper fixing board (2) and the lower fixing board (3), the support part (5) is extended in the vertical direction, and both ends of the support part (5) are the upper fixing board (2) and the lower fixing board (3). ) Is fixed. A drive mechanism 6 is provided in a region between the plurality of support portions 5 in the lower fixing plate 3. The drive mechanism 6 is a power generating mechanism for moving the movable panel 4 vertically upward and downward, and for applying a molding pressure to the object to be molded. In this embodiment, the upper fixed plate 2 and the lower fixed plate 3 are fixed, and the movable plate 4 is relatively movable with respect to the upper fixed plate 2 and the lower fixed plate 3 have. In addition, although the support|pillar part 5 in the resin molding apparatus 1 of embodiment is a flat plate, it may be a columnar shape, for example, and the shape is not limited.

The resin molding apparatus 1 of the embodiment includes a first mold 11 and a second mold 21. The first mold 11 is provided on the vertically lower side of the upper fixed plate 2, and the second mold 21 is provided on the vertically upper side of the movable plate 4. The first mold 11 and the second mold 21 face each other.

The first mold 11 includes an upper surface member 12, an elastic member 13, and a side member 14. The elastic member 13 is provided between the top member 12 and the side member 14. Further, the first mold 11 has a concave portion 15 formed by an upper surface member 12 and a side member 14. The concave portion 15 faces the first surface 101 of the object 100. In the state shown in FIG. 2, a gap 16 is formed between the upper surface member 12 and the side member 14.

The second mold 21 includes a bottom member 22, an elastic member 23, and a side member 24. The elastic member 23 is provided between the bottom member 22 and the side member 24. The elastic member 23 of the second mold 21 has a stronger elastic force than the elastic member 13 of the first mold 11. Further, the second mold 21 has a cavity 25 composed of a bottom member 22 and a side member 24.

The resin molding apparatus 1 of the embodiment includes a first type holding portion 31 and a second type holding portion 41. The first type holding part 31 includes a side wall part 32 extending in a vertical downward direction, a rubber material 33 (elastic material) provided at an end of the side wall part 32, and an upper heater plate 34. ). The upper heater plate 34 is located between the upper fixing plate 2 and the first mold 11. The type 2 holding part 41 includes a side wall part 42 extending vertically upward, a rubber material 43 (elastic material) provided at the end of the side wall part 42, and a lower heater plate 44. do. The lower heater plate 44 is located between the movable plate 4 and the second mold 21. The rubber material 33 of the first type holding part 31 and the rubber material 43 of the second type holding part 41 face each other. Either of the rubber material 33 of the first type holding portion 31 and the rubber material 43 of the second type holding portion 41 may be omitted.

The resin molding apparatus 1 of the embodiment includes a closing pressure measuring unit 50 and a control unit 60. In FIG. 2, the closing pressure measuring part 50 is composed of a torsion gauge provided on the post part 5, but the shape of the closing pressure measuring part 50 is not limited to this, and the bottom member 22 of the second type 21 You may arrange the closing pressure measuring part 50 directly under ). The control unit 60 is provided outside the resin molding apparatus 1 and is connected to the drive mechanism 6 and the closing pressure measuring unit 50. The control unit 60 can control the power of the drive mechanism 6 based on the measurement result of the closing pressure by the closing pressure measurement unit 50. The closing pressure relates to the pressure on the side of the second surface 102 of the object 100, and the closing pressure measuring unit 50 measures the pressure on the side of the second surface 102 of the object 100. It is the measurement unit. Controlling the power of the drive mechanism 6 controls the amount of rotation of the motor when a servo motor is used as the drive mechanism 6, for example.

The resin molding apparatus 1 of the embodiment is connected to the concave portion 15 of the first mold 11 and is provided with a vent passage 75 for connecting the inside of the concave portion 15 and an external space of atmospheric pressure. The ventilation path 75 is connected to the gas supply part 70 and the gas discharge part 72 in addition to the concave part 15. The gas supply part 70 can supply gas into the concave part 15. The gas supply unit 70 is connected to the control unit 60. The control unit 60 may control the amount of gas supplied by the gas supply unit 70. Further, a control valve 73, an air pressure measuring unit 71, and an on-off valve 74 are provided on the ventilator 75. The atmospheric pressure measurement unit 71 measures the fluctuation of the atmospheric pressure in the concave portion 15 by measuring the atmospheric pressure in the ventilator 75. In other words, the atmospheric pressure measurement unit 71 measures the atmospheric pressure in the concave portion 15 through the ventilation path 75. The control valve 73 is arranged in series with the gas supply unit 70. The opening/closing valve 74 is located immediately before the gas discharge part 72. The ventilation path 75 is connected to the external space through the gas discharge part 72.

Hereinafter, a manufacturing method of sealing a semiconductor chip will be described as an example of a method of manufacturing a resin molded article using the resin molding apparatus of the embodiment with reference to FIGS. 3 to 9. Referring to FIG. 3, first, the control valve 73 and the on/off valve 74 on the ventilator 75 are in a closed state. Next, the object to be molded 100 is supplied under the side member 14 of the first mold 11. The molding object 100 has a first surface 101 and a second surface 102 opposite to the first surface, and the second surface 102 is an object of resin molding. The first mold 11 faces the first surface 101 of the molding object 100, and the second mold 21 faces the second face 102 of the molding object 100. At least one ventilation hole (not shown) may be provided on a surface of the side member 14 of the first mold 11 that faces the first surface 101 of the object 100. The vent hole is connected to a suction mechanism (not shown), and the molding object 100 is held by the first mold 11 by suctioning the air in the vent hole to adsorb the molding object 100. In addition to adsorbing the molding object 100, for example, a pawl portion is provided on the side member 14, and the molded object 100 is gripped by the pawl portion to the first mold 11 You may keep it. Thereby, even when the apparatus is stopped urgently and the suction mechanism is stopped, it is possible to prevent the object to be molded 100 from falling.

The object to be molded 100 is, for example, a lead frame, a substrate, a semiconductor substrate (such as a Si wafer), a metal substrate, a glass substrate, a ceramic substrate, a wiring substrate, etc., and a semiconductor chip capable of being disposed is used as the object to be molded 100. I can. The size of the object to be molded 100 is, for example, about 100 to 300 mm in width (one side or diameter), but is not limited thereto. In addition, regardless of the presence or absence of wiring on the object 100 to be molded.

Next, as shown in FIG. 4, the film 111 is supplied so that the upper surface of the bottom member 22 of the 2nd mold 21, and the upper surface and the inner side surface of the side member 24 may be covered. The film 111 may have an arbitrary shape, such as a circle, an ellipse, a rectangle, and a square, for example. By an adsorption mechanism (not shown), the film 111 is adsorbed according to the shape of the bottom member 22 and the side member 24. After the film 111 is supplied to the second mold 21, as shown in FIG. 3, the resin material 110 is supplied into the cavity 25 of the second mold 21. When the second mold 21 is heated by the lower heater plate 44 provided in the second mold holding portion 41, the resin material 110 is in a softened or melted state. The heating temperature of the lower heater plate 44 is, for example, 100 to 200°C. This heating temperature is determined in accordance with the properties of the resin material. In addition, the supply of the film 111 and the resin material 110 to the second mold 21 may be prior to supply of the object 100 to the first mold 11, or the first mold of the object 100 It may be after the supply to (11) or simultaneously with the supply of the object 100 to the first mold (11).

Next, as shown in the schematic cross-sectional view of FIG. 5, the movable plate 4 is raised by the drive mechanism 6 to hold the rubber material 33 and the second type of the first type holding part 31. The rubber material 43 of the part 41 is brought into contact. After that, the rubber materials 33 and 43 are compressed, constituted by the first type holding part 31 and the second type holding part 41, and the first type 11 and the second type 21 A closed space 17 containing is formed. After that, the decompression in the enclosed space 17 is started using a decompression mechanism 80 made of a decompression pump or the like. The decompression by the decompression mechanism 80 continues until the air pressure in the enclosed space 17 reaches a predetermined predetermined value, and when the air pressure in the enclosed space 17 reaches a predetermined value, the state is maintain. Air bubbles generated in the resin material 110 can be removed by making the sealed space 17 in a reduced pressure state. At this time, the gap 16 between the top member 12 and the side member 14 is maintained by the elastic force of the elastic member 13 of the first type 11, and the recess 15 and the closed space 17 ) Communicates with each other, so that the inside of the concave portion 15 is also decompressed, and the atmospheric pressure in the concave portion 15 and the sealed space 17 is maintained substantially equal. In this way, the gap 16 between the upper surface member 12 and the side member 14 functions as a communication path for communicating the concave portion 15 and the sealed space 17. When depressurizing the enclosed space 17 by the decompression mechanism 80, the gap 16 (communication path) is opened to communicate the concave portion 15 and the enclosed space 17. In addition, the air pressure of the concave portion 15 and the closed space 17 may not be completely matched.

Next, as shown in the schematic cross-sectional view of FIG. 6, the movable plate 4 is further raised by the drive mechanism 6, and the side members 14 and the second mold 21 of the first mold 11 are used. ) Of the side member 24 fits the molding object (100). Thereby, the elastic member 13 of the first mold 11 is compressed. Since the elastic member 23 of the second type 21 has stronger elastic force than the elastic member 13 of the first type 11, the elastic member 23 of the second type 21 at this point is at least completely compressed. It doesn't happen.

When the elastic member 13 of the first mold 11 is compressed, the gap 16 is closed. At this time, the inside of the concave portion 15 is maintained in a reduced pressure state. When the gap 16 is closed, the concave portion 15 and the enclosed space 17 are blocked, but it is not completely blocked, and a slight gas leak may occur. By setting the inside of the concave portion 15 to a reduced pressure state, a state in which the pressures on the first surface 101 side and the second surface 102 side of the object 100 are equal can be maintained. The concave portion 15 faces the first surface 101 of the object 100. Since the electronic components and the like mounted on the first surface 101 of the object 100 are accommodated in the space within the concave portion 15, the electronic components and the like on the first surface 101 are formed when closing. ) Of the upper surface member 12 can be prevented from being damaged by contacting the electronic component. In addition, it goes without saying that it is not necessary to implement an electronic component or the like on the first surface 101 of the object 100.

Next, as shown in the schematic cross-sectional view of FIG. 7, the movable board 4 is further raised by the drive mechanism 6. When the elastic member 23 of the second mold 21 is compressed, the second surface 102 of the object 100 and the resin material 110 contact, and the second surface 102 is resin-molded. . At this time, a molding pressure is generated in the vertical upward direction from the bottom member 22 of the second mold 21. On the second surface 102 of the object 100, a pressure is applied by pressing the resin material 110 in the cavity 25. In this way, the object 100 is closed. At this time, the elastic member 13 of the first mold 11 is compressed, and the gap 16 (communication path) is closed, so that the concave portion 15 and the closed space 17 are blocked.

When the molding pressure is generated, the closing pressure measuring unit 50 detects the amount of distortion of the post portion 5 corresponding to the molding pressure. The closing pressure measurement unit 50 converts the amount of distortion into a voltage value and transmits an electronic signal to the control unit 60. In addition, in the resin molding apparatus 1 of the embodiment, the closing pressure measuring unit 50 is provided on the post portion 5 to measure the amount of distortion of the post portion 5, but directly under the bottom member 22 of the second type. It may be placed in the mold to measure the molding pressure.

The control unit 60 transmits an instruction to supply gas to the gas supply unit 70 so as to have a pressure equal to the molding pressure based on the electric signal from the closing pressure measurement unit 50. The gas supply unit 70 is, for example, an electric power regulator. The gas supply unit 70 opens the control valve 73 based on the support signal from the control unit 60, and, as shown by the arrow (A), the gas in the concave portion 15 through the ventilation path 75. Supply. The amount of gas supplied is controlled by adjusting the open/close state of the control valve 73. In addition, at this time, the on-off valve 74 located on the side of the gas discharge part 72 is in a closed state. While supplying gas into the concave portion 15, the atmospheric pressure measurement portion 71 detects the pressure value of the vent passage 75, and transmits the pressure value to the control portion 60. The control unit 60 is based on the amount of distortion of the closing pressure measurement unit 50 and the measured value of the atmospheric pressure measurement unit 71, the pressure received by the first surface 101 of the object 100 and the second surface 102. In order to reduce the pressure difference in pressure, the amount of gas supplied into the concave portion 15 is controlled. That is, when the molding pressure is applied to the second surface 102 of the object 100, the gap 16 between the upper member 12 and the side member 14 is closed, so that the concave portion 15 and the enclosed space 17 are closed. ) Is blocked, and then gas is supplied into the concave portion 15. At this time, the control unit 60 is based on the measurement result by the atmospheric pressure measurement unit 71, the gas supply unit ( 70) to control the amount of gas supplied.

When the closing is performed, when the concave portion 15 of the first mold 11 is in a depressurized state, the roughly flat molding object 100 receives the molding pressure from the bottom member 22 of the second mold 21 , It becomes easy to deform into a shape that is convexly curved upward.

In the resin molding apparatus of the embodiment of the present invention, when a molding pressure is generated in the vertical upward direction from the bottom member 22 of the second mold 21 with respect to the object 100, molding applied to the second face 102 side. By applying a gas having a pressure in the opposite direction to the pressure to the first surface 101 side, A pressure difference between the pressure applied to the first surface 101 and the pressure applied to the second surface 102 can be reduced. For this reason, even when only the second surface 102 of the object 100 is resin-molded, deformation of the object 100 can be suppressed.

After a predetermined time has elapsed from the state shown in FIG. 7, the control valve 73 is closed and the on/off valve 74 is opened, and as shown by the arrow B in FIG. 8, the ventilation path 75 The gas in the concave portion 15 is discharged from the gas discharge portion 72 by passing through ). Thereby, the pressure in the concave portion 15 can be returned to atmospheric pressure at the time of opening. Further, without opening and closing the control valve 73 and the on-off valve 74, the movable panel 4 may be lowered and opened. Even in this case, the first mold 11 is separated from the second mold 21 and the elastic member 13 of the first mold 11 returns to an uncompressed state, so that the concave portion 15 and the enclosed space Block with (17) is canceled. Then, after the resin on the second surface 102 has been cured, as shown in FIG. 9, the movable plate 4 is lowered to open, and the object 100 is taken out. In addition, curing of the resin may continue even after opening.

The method for manufacturing a resin molded article by the resin molding apparatus 1 of the present embodiment is to resin mold the second surface 102 side of the object to be molded 100 held in the first mold 11, as shown in FIG. As shown, the process (S10) of supplying the molding object 100A before resin molding to the resin molding apparatus 1 from the molded product supply/storage module 1003, and the first mold 11 and the second mold 21 ) Forming an enclosed space 17 including (S20), a step of depressurizing the enclosed space 17 in a state in which the concave portion 15 and the enclosed space 17 are communicated (S30), and the enclosed space After depressurizing (17), the step of blocking communication between the concave portion 15 and the enclosed space 17 (S40), measurement of the atmospheric pressure in the concave portion 15, and the drive mechanism 6 Step (S50) of closing the object 100A while supplying gas into the concave portion 15 while measuring the closing pressure and controlling the supply amount and closing force of the gas based on the measurement results (S50), and before opening The process of returning the pressure in the concave portion 15 and the closed space 17 to atmospheric pressure (S60), the process of opening (S70), and the resin-molded molding object 100B are supplied to the molded product supply/storage module 1003. A step (S80) of accommodating in) is provided.

In the closing step (S50), only one of the measurement of the air pressure in the concave portion 15 and the measurement of the closing pressure by the drive mechanism 6 is performed, and the amount of gas supplied and the amount of gas supplied based on the measurement result of the one One or both of the closing force may be controlled. In addition, when both the measurement of the atmospheric pressure in the concave portion 15 and the measurement of the closing pressure by the drive mechanism 6 are performed, only one of the gas supply amount and the closing force is based on the measurement results of both of them. It may be controlled.

The pressure in the concave portion 15 of the first mold 11 first decreases as the enclosed space 17 is depressurized by the decompression mechanism 80, and becomes below atmospheric pressure. Next, after the closing is started, as the pressure of the gas supplied by the gas supply unit 70 increases, the pressure in the concave portion 15 rises and becomes more than atmospheric pressure. The increase in pressure may continue during resin molding. When the difference between the molding pressure and the pressure in the concave portion 15 is not substantially seen, gas supply is stopped, and the pressure in the concave portion 15 is maintained at a constant value. After that, by closing the control valve 73 and opening the on-off valve 74, the gas in the concave portion 15 is discharged to the outside, and the pressure in the concave portion 15 returns to atmospheric pressure. After that, opening is performed. In this way, the semiconductor chip is resin-sealed, and the second surface 102 side of the object 100 can be resin-molded.

According to the resin molding apparatus 1 according to the present embodiment and a method of manufacturing a resin molded article using the same, even when resin molding is performed on only one side of the molded object 100, the amount of deformation of the molded object 100 can be suppressed.

In addition, in the above, an example in which only the second surface 102 of the object 100 is resin-molded has been described, but after the second surface 102 is resin-molded, the first surface 101 is similarly resin-molded. , It goes without saying that both sides of the object to be molded 100 may be resin-molded.

(Embodiment 2)

11 is a schematic cross-sectional view of a resin molding apparatus according to a second embodiment. The resin molding apparatus 1A according to the present embodiment is a modified example of the resin molding apparatus 1 according to the first embodiment, and is connected to the vent passage 81 connected to the depressurization mechanism 80 and the recess 15 It is characterized in that a communication path (90) connected to the ventilated path (75) is provided.

On the communication path 90, an on-off valve 91 is provided. The ventilation path 81 communicates with the sealed space 17 formed by the first type holding portion 31 and the second type holding portion 41. The ventilation path 75 communicates with the concave portion 15. Accordingly, the communication path 90 connecting the ventilation path 81 and the ventilation path 75 can communicate the concave portion 15 and the sealed space 17.

When depressurizing the closed space 17 by the pressure reducing mechanism 80, the on-off valve 91 is opened to communicate the concave portion 15 and the closed space 17. On the other hand, when pressure is applied to the second surface 102 of the object 100, the opening/closing valve 91 is closed to block the concave portion 15 and the sealed space 17, and then within the concave portion 15 Supply gas. At this time, the control unit 60 is based on the measurement result by the atmospheric pressure measurement unit 71, the gas supply unit ( 70) to control the amount of gas supplied.

Other than the above point, since it is the same as that of the resin molding apparatus 1 according to the first embodiment, detailed description is not repeated.

Also with the resin molding apparatus 1A according to the present embodiment, similarly to the first embodiment, the amount of deformation of the molding object 100 can be suppressed even when only one surface of the molding object 100 is resin-molded.

(Deformation of the object to be molded)

Hereinafter, deformation of the object 100 will be described with reference to FIGS. 12 to 14. In addition, in FIGS. 12 to 14, the film 111 is omitted for convenience of illustration.

As described above, in the resin molding apparatus according to Embodiments 1 and 2, when pressure is applied to the second surface 102 of the object 100, the concave portion 15 and the enclosed space 17 are blocked. Next, gas is supplied into the concave portion 15 to reduce the pressure difference between the first surface 101 side and the second surface 102 side of the object 100. For example, when this gas is not supplied, the molding object 100 is deformed into an upwardly convex shape as shown in FIG. 12 by the molding pressure of the resin material 110. By deforming into a convex shape, the thickness of the resin material 110 formed on the second surface 102 is disturbed. In addition, by deforming into a convex shape, there is a concern that the object to be molded 100 or a semiconductor chip disposed on the object to be molded 100 may be damaged.

In addition, in the resin molding apparatus according to the first and second embodiments, when the airtight space 17 is depressurized by the decompression mechanism 80, the gap 16 (communication path) to the communication path 90 are opened to open the concave portion ( 15) and the airtight space 17 are made to communicate with each other, and the air pressure in the concave portion 15 is also lowered in accordance with the air pressure of the airtight space 17. For example, when this communication is not performed, the atmospheric pressure in the concave portion 15 is relatively high, and the object to be molded 100 is deformed into a downwardly convex shape as shown in FIG. 13. In this case as well as in the example of FIG. 12, the thickness of the resin material 110 formed on the second surface 102 after opening is disturbed or the object 100 is deformed.

According to the resin molding apparatus according to the first and second embodiments, when the airtight space 17 is depressurized by the decompression mechanism 80, the gap 16 (communication path) to the communication path 90 are opened to open the concave portion ( 15) and the closed space 17 are communicated with each other, and when pressure is applied to the second surface 102 of the object 100, the recess 15 and the closed space 17 are blocked, and then the recess is (15) Since the pressure difference between the first surface 101 side and the second surface 102 side of the object 100 to be formed can be reduced by supplying the gas, as shown in Fig. 14, molding Resin sealing can be performed while holding the object 100 in a substantially flat state.

As described above, the embodiments and examples have been described, but it is also planned from the beginning to appropriately combine the above-described embodiments and the configurations of the respective examples.

Although the embodiment of the present invention has been described, it should be considered that the embodiment disclosed this time is illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, and it is intended that the meanings equivalent to the claims and all modifications within the scope are included.

[Industrial availability]

According to the embodiment disclosed herein, a resin molding apparatus and a method of manufacturing a resin molded article can be provided.

1, 1A: resin molding apparatus 2: upper fixing board
3: lower fixed panel 4: movable panel
5: support part 6: drive mechanism
11: first type 12: upper surface member
13: elastic member 14: side member
15: concave portion 16: gap
17: closed space 21: type 2
22: bottom member 23: elastic member
24: side member 25: cavity
31: type 1 holding portion 32: side wall portion
33: rubber material 34: upper heater plate
41: type 2 holding portion 42: side wall portion
43: rubber material 44: lower heater plate
50: closing pressure measurement unit 60: control unit
70: gas supply unit 71: barometric pressure measurement unit
72: gas discharge unit 73: control valve
74: on-off valve 75: to vent
80: decompression mechanism 90: communication path
91: on/off valve 100, 100A, 100B: object to be molded
101: page 1 102: page 2
110: resin material 111: film
301: moving mechanism 401: rail
501: dispenser 502: nozzle
601: supply unit 602: loader
701: storage unit 702: unloader
1000: resin molding system 1001: resin supply module
1002A-1002D: Molding module 1003: Molded product supply/storage module
A, B: arrows

Claims (5)

Using a mold containing the first and second types facing each other,
A resin molding apparatus capable of resin-molding a second surface side opposite to the first surface of the first mold side of the molding object held in the first mold,
The first mold has a concave portion facing the first surface of the molding object,
The resin molding apparatus,
A gas supply part for supplying gas into the concave part,
A decompression mechanism capable of decompressing the sealed space including the mold,
And a communication path capable of communicating the concave portion of the first type and the sealed space,
When depressurizing the sealed space by the decompression mechanism, the communication path is opened to communicate the concave portion and the sealed space,
When pressure is applied to the second surface of the object to be molded, the communication path is closed to block the concave portion and the sealed space. The method of claim 1,
The first type includes an upper surface member, a side member, and an elastic member provided between the upper surface member and the side member,
The concave portion is formed by the upper surface member and the side member,
The communication path is constituted by a gap formed between the upper surface member and the side member,
When the airtight space is depressurized by the decompression mechanism, the gap is maintained to open the four wing communication path, and when pressure is applied to the second surface of the molding object, the elastic member is compressed. A resin molding apparatus, characterized in that to close the. The method according to claim 1 or 2,
A resin molding apparatus further comprising a vent passage connecting the inside of the recess of the first type and an external space of atmospheric pressure. Using a mold containing the first and second types facing each other,
A method for producing a resin molded article for resin-molding a second surface side opposite to the first side of the first mold side of the molding object held in the first mold,
A step of measuring the atmospheric pressure in the concave portion of the first type opposite to the first surface of the molding object, and
Based on the measurement result of the atmospheric pressure, the molding object is closed while controlling the supply amount of gas to reduce the pressure difference between the first surface side and the second surface side of the molding object while supplying gas into the concave portion. It has a process to do,
Before supplying the gas, a process of forming a closed space including the molding frame,
A step of depressurizing the closed space in a state in which the concave portion of the first type and the closed space are in communication,
And a step of blocking communication between the concave portion and the sealed space after depressurizing the sealed space. The method of claim 4,
A method for producing a resin molded article, further comprising a step of returning the pressure in the concave portion to atmospheric pressure before opening.

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