JP2010103137A - Sticking apparatus of adhesive tape, and sticking method of adhesive tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sticking apparatus of adhesive tape which sticks an adhesive tape, in a state spread uniformly, to a member to be stuck (a lead frame), and to provide a sticking method of adhesive tape. <P>SOLUTION: The sticking apparatus of adhesive tape includes a flat stage 1 which moves up and down while mounting a member to be stuck (a lead frame) 2, a holding portion 7 which is installed above the member to be stuck (a lead frame) 2 in order to hold a ring 8 across which an adhesive tape 4 is stretched, a container 12 which contains the stage 1 and the holding portion 7, an exhaust section 9 which exhausts the atmosphere in the container 12, and a control section 11 which elevates the stage 1 in a state where the container 12 is enclosed and the atmosphere is exhausted by the exhaust section 9 so that the member to be stuck (a lead frame) 2 and the adhesive tape 4 are pushed to each other. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an adhesive tape attaching device and an attaching method thereof, and more particularly to an attaching device for attaching a dicing adhesive tape to a plate-like lead frame and an attaching method thereof.

  As a related technique, there is a method and an apparatus for attaching a wafer protective adhesive film, for example, one described in Patent Document 1. A cross-sectional view of the sticking device described in Patent Document 1 is shown in FIG.

  The sticking method of the adhesive film 114 using this device is to replace the inside of the sealed space with a nitrogen atmosphere and further extend the cylinder rod 121 in a state where the pressure is reduced by the vacuum pump 120 to lower the pressing member 113, and the adhesive film 114 is moved to the pressing member. The adhesive film 114 is stuck on the back surface of the semiconductor wafer 112 from the central portion toward the outer peripheral portion.

  At this time, since the adhesive film 114 is affixed concentrically from the center to the outer periphery of the semiconductor wafer 112, an effect similar to that of adhering while pressing with a rolling roller is obtained. Air bubbles are unlikely to be generated between the wafer 112 and the adhesive film 114.

After the application is completed, the pressing member 113 is raised, the operation of the vacuum pump 120 is stopped, the valve is opened, the inside of the sealed space is made atmospheric pressure, the upper case is opened, and the semiconductor wafer 112 is taken out (paragraph [0017] ).
JP 2001-210701 A

However, the prior art described in the above literature has room for improvement in the following points.
Since the adhesive film 114 is pressed down and attached to the wafer 112, it is attached in a state of extending along the curved lower surface of the pressing member 113. After the application, the stretched adhesive film 114 may be warped due to the force to return it to its original shape.

  FIG. 4 is a cross-sectional view showing the attaching operation when the related art adhesive film attaching method is carried out. The adhesive film 114 is deformed according to the shape of the pressing member 113. This causes the adhesive film 114 to stick to the wafer 112 in a stretched state. In this case, there is a possibility that proper processing is not performed in the next dicing process. Moreover, there is a possibility that the pasting state changes depending on the difference in the amount of elongation of the tape.

  According to the present invention, a flat stage for placing and lowering a member to be pasted, a holding part that is installed above the member to be stuck and holds a ring to which an adhesive tape is stretched, and the stage and its holding part, The container to be accommodated, the exhaust part for exhausting the air in the container, the container is sealed, and the stage is raised in a state where the air is exhausted by the exhaust part, and the adherend member and the adhesive tape are An adhesive tape sticking device having a control unit that presses each other is provided.

  According to the present invention, a step of placing a member to be stuck on a stage, a step of fixing a ring on which an adhesive tape is stretched to a holding portion above the member to be stuck placed on the stage, the stage and the stage There is provided an adhesive tape attaching method comprising a step of reducing the atmospheric pressure in a container that accommodates a holding portion, and a step of raising the stage and pressing the member to be attached and the adhesive tape against each other.

  According to the present invention, since the sealed space where the adhesive tape is attached to the member to be adhered is decompressed and the planar stage is raised, the adhesive tape and the member to be adhered are pressed against each other, so that no air remains. In addition, the adhesive tape can be attached in a state of being uniformly stretched.

  According to the present invention, it is possible to affix the adhesive tape to the member to be adhered in a state where the adhesive tape is uniformly extended.

  Hereinafter, embodiments will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

FIG. 1 shows an adhesive tape applicator according to this embodiment.
The adhesive tape attaching apparatus according to the present embodiment is installed above a flat stage 1 for placing and adhering a member to be attached (lead frame) 2 and a member to be attached (lead frame) 2, and an adhesive tape 4 is stretched thereon. The holding part 7 for holding the ring 8, the container 12 for housing the stage 1 and the holding part 7, the exhaust part 9 for exhausting the atmosphere in the container 12, and the container 12 are sealed, and the exhaust part 9 In the exhausted state, the control unit 11 includes a control unit 11 that raises the stage 1 and presses the adherend member (lead frame) 2 and the adhesive tape 4 together.

  The sealed space where the adhesive tape 4 is adhered to the adherend member (lead frame) 2 is decompressed and the adherent member (lead frame) 2 and the adhesive tape 4 are pressed against each other by the flat stage 1, so that air remains. Is suppressed. In addition, since the adhesive tape 4 is not attached in a non-uniformly stretched state, dicing in the next process can be performed in a normal state.

  In the adhesive tape attaching apparatus according to the present embodiment, the container 12 includes a lower case 6 and an upper lid 5, and the lower case 6 is provided with a control unit 11, a stage 1, and a holding unit 7. Note that a sealing member using an O-ring is provided between the lower case 6 and the upper lid 5 in order to maintain a sealed space. The lower case 6 is further provided with an exhaust port 9 and connected to a vacuum pump 13 for reducing the pressure.

  According to the structure according to the present embodiment, the stage 1 is provided on the lower case 6 side, and there is no drive device above the adherend member (lead frame) 2 or the adhesive tape 4. For this reason, it is not necessary to make the upper lid 5 into a complicated structure, and maintenance is easy. In addition, the upper lid 5 is lighter and more workable than when the upper lid 5 itself has a drive device. Furthermore, since the movable part when sticking the member (lead frame) 2 to the adhesive tape 4 is only the stage 1 on which the member (lead frame) 2 is placed, the member to be stuck (lead frame) 2 is adhesive. There is no worry of foreign matter falling on the tape 4.

  The upper lid 5 may be provided with a planar elastic member 3. The sealed space where the adhesive tape 4 is adhered to the adherend member (lead frame) 2 is decompressed, the flat stage 1 on which the adherend member (lead frame) 2 is placed is raised, and the adhesive tape 4 is sandwiched between the upper lid 5 and the adhesive tape 4. Press against the provided elastic member 3 having a planar shape.

  Here, the elastic member 3 may be provided with a slight inclination 10 with respect to the stage 1 with the upper lid 5 closed. When the member to be bonded (lead frame) 2 is pressed against the adhesive tape 4 and further pressed against the inclined elastic member 3, the air between the member to be bonded (lead frame) 2 and the adhesive tape 4 is pushed out to create bubbles. Can be pasted without any problems.

  Note that the holding portion 7 on which the ring 8 to which the adhesive tape 4 is stretched is also slightly inclined so that the adhesive tape 4 and the elastic member 3 are in contact with each other in a substantially parallel state with the upper lid 5 closed. . In this way, as the stage on which the member to be adhered is placed rises, the member to be adhered and the adhesive tape gradually come into contact from one side, and no bubbles are formed between the member to be adhered (lead frame) 2 and the adhesive tape 4. Can be pasted.

  Next, the manufacturing method of this embodiment will be described. A method for applying the adhesive tape 4 of this embodiment will be described with reference to FIG.

First, the upper cover 5 of the adhesive tape applying device is opened, and the member to be applied (lead frame) 2 is placed on the stage 1 (step S1).
Next, the ring 8 to which the adhesive tape 4 is stretched is placed on the holding part 7 of the lower case 6 with the adhesive part facing down (step S2).
Next, the upper lid 5 is closed (step S3).
Next, the atmospheric pressure in the sealed space formed by the upper lid 5 and the lower case 6 is reduced from the exhaust part 9 (step S4).
Next, the stage 1 is raised by the control unit 11, the adhesive tape 4 and the member to be adhered (lead frame) 2 are pressed against the elastic member 3 provided on the upper lid 5, and the member to be adhered (lead frame) 2 is adhered to the adhesive tape 4. (Step S5).

  Here, the elastic member 3 attached to the back side of the upper lid 5 is in contact with the adhesive tape 4 in a state where the member (lead frame) 2 and the adhesive tape 4 are set and the upper lid 5 is closed. In this state, the stage 1 on which the member to be adhered (lead frame) 2 is set up rises, whereby the adhesive tape 4 is adhered to the member to be adhered (lead frame) 2. For this reason, the adhesive tape 4 is affixed to the to-be-adhered member (lead frame) 2 with almost no expansion and contraction.

  After the pressing operation is completed, the stage 1 is lowered, the vacuum pump 13 is stopped, and the inside of the container 12 is returned to normal pressure. The upper lid 5 is opened, and the ring 8 of the adhesive tape 4 to which the member (lead frame) 2 is stuck is taken out.

  The elastic member 3 is attached with the adhesive tape 4 with a slight inclination 10 with respect to the stage 1 with the upper lid 5 closed. That is, when the stage 1 on which the adherend member (lead frame) 2 is set rises, the adhesive tape 4 is applied by the planar elastic member 3 provided on the upper lid 5 of the container 12 by the planar stage 1. Is adhered to the member to be adhered (lead frame) 2 and pressed so as to escape the atmosphere, so that no air remains between the adhesive tape 4 and the member to be adhered.

  The member to be adhered (lead frame) 2 can be adhered to the adhesive tape 4 without mixing bubbles, and can be adhered without using the elongation of the adhesive tape 4, so that it is adhered depending on the type of the adhesive tape 4 Can be pasted without any difference in state.

As mentioned above, although embodiment of this invention was described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.
For example, although the member to be bonded has been described as a lead frame, the lead frame may be a lead frame in which a semiconductor device is sealed with resin. Further, a wiring board or a wiring board in which a semiconductor device is sealed with a resin may be used. Furthermore, a semiconductor wafer may be used.

  Although the next process of the adhesive tape attaching process is described as dicing, it may be performed by grinding the back surface of the semiconductor wafer. In this case, however, a tape is applied to the front side of the wafer.

It is sectional drawing for implementing the adhesive tape sticking apparatus which concerns on embodiment. It is process drawing for enforcing the sticking method of the adhesive tape which concerns on embodiment. It is sectional drawing of the adhesive film sticking apparatus which concerns on related technology. It is sectional drawing which shows operation | movement of the adhesive film sticking apparatus which concerns on related technology.

Explanation of symbols

1: Stage 2: Member to be pasted (lead frame)
3: Elastic member 4: Adhesive tape 5: Upper lid 6: Lower case 7: Holding part 8: Ring 9: Exhaust part 10: Inclination 11: Control part 12: Container 13: Vacuum pump

Claims (5)

A flat stage on which a member to be pasted is placed and moved up and down;
A holding unit that is installed above the member to be pasted and holds a ring to which an adhesive tape is stretched;
A container for housing the stage and the holding unit;
An exhaust section for exhausting the atmosphere in the container;
In a state where the container is sealed and the air is exhausted by the exhaust unit, the stage is raised, and a control unit that presses the adherend member and the adhesive tape together,
A pressure-sensitive adhesive tape affixing device. In the adhesive tape sticking device according to claim 1,
The container comprises a lower case and an upper lid,
Adhesive tape attaching device in which the lower case is provided with the control unit, the stage, and the holding unit In the adhesive tape sticking device according to claim 2,
The upper lid has a flat elastic member against which the member to be bonded and the adhesive tape are pressed by the stage,
The elastic member is an adhesive tape attaching device having an inclination with respect to the stage in a state where an upper lid is closed. A step of placing a member to be stuck on a flat stage;
Fixing a ring stretched with an adhesive tape on the holding part above the member to be stuck placed on the stage;
Reducing the atmospheric pressure in a container containing the stage and the holding unit;
Raising the stage and pressing the member to be adhered and the adhesive tape together;
A method for applying a pressure-sensitive adhesive tape comprising: In the sticking method of the adhesive tape of Claim 4,
The container includes a lower case and an upper lid, the lower case is provided with the stage and the holding portion, and the upper lid is flat with an inclination with respect to the stage with the upper lid closed. Elastic members are provided,
A method for applying an adhesive tape, comprising the step of raising the stage and pressing the member to be applied and the adhesive tape against the elastic member.

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