JP2005129678A5 - - Google Patents
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- JP2005129678A5 JP2005129678A5 JP2003362967A JP2003362967A JP2005129678A5 JP 2005129678 A5 JP2005129678 A5 JP 2005129678A5 JP 2003362967 A JP2003362967 A JP 2003362967A JP 2003362967 A JP2003362967 A JP 2003362967A JP 2005129678 A5 JP2005129678 A5 JP 2005129678A5
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- JP
- Japan
- Prior art keywords
- tape
- vacuum
- wafer
- dicing tape
- dicing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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しかし、図7に示した従来の技術においては、大気中でローラー73を用いてウェハー74にダイシング用テープ75を貼り付けているため、ウェハー74とダイシング用テープ75との間に空気が残留するという問題があった。また、ウェハー74とダイシング用テープ75の間に残留空気が残った状態で次工程のチップ分割を実施すると、チップの分割中にチップの割れや欠けが生じ、歩留まりを悪化させるという問題があった。ここで、ウェハー74とダイシング用テープ75との間の残留空気を外部に押し出すようにして取り除くには、作業に多大な工数を必要としていた。 However, in the conventional technique shown in FIG. 7, since the dicing tape 75 is attached to the wafer 74 using the roller 73 in the atmosphere, air remains between the wafer 74 and the dicing tape 75. There was a problem. In addition, when chip division of the next process is performed in a state where residual air remains between the wafer 74 and the dicing tape 75, there is a problem that chip breakage or chipping occurs during chip division and the yield is deteriorated. . Here, in order to remove the residual air between the wafer 74 and the dicing tape 75 by extruding it to the outside, a large number of man-hours are required for the operation.
そして、本発明によれば、真空室中で板状物とテープとを保持し、2つの弾性体を用いて前記テープの前記板状物と対向する面の反対側の面から押圧して板状物にテープを貼り付けるため、板状物とテープとの間に空気が残留することがなく、薄い板状物であっても反りを発生させずにテープを貼り付けることができる。 And according to this invention, a plate-shaped object and a tape are hold | maintained in a vacuum chamber, and it presses from the surface on the opposite side of the surface which opposes the said plate-shaped object of the tape using two elastic bodies. Since the tape is affixed to the sheet, air does not remain between the plate and the tape, and even a thin sheet can be affixed without causing warpage.
図2は、ウェハー4をウェハーガード19内の第2のゴムシート18の中央部に載置し、ダイシング用テープ5を貼り付けたダイシングフレーム16をフレーム台17に配置し、上蓋7を閉めることにより、第2の気密空間8及び第3の気密空間9を形成した状態を示す。第1の真空弁3、第2の真空弁11及び第3の真空弁15を大気側から真空側に切り換えることにより、第1の真空開口2から第1の気密空間1を真空圧に保持し、第2の真空開口10から第2の気密空間8及び第3の気密空間9を真空圧に保持し、第3の真空開口14から第4の気密空間13を真空圧に保持する。図3に示すように、フレーム台17に溝21が形成されているため、第2の真空開口10及び第2の気密空間8を経由して第3の気密空間9の真空圧を保持することができる。
In FIG. 2, the
本発明にかかるテープ貼付装置及び貼付方法は、上述のような板状物としての半導体ウェハーへのダイシング用テープの貼付や表面保護テープの貼付に限らず、半導体ウェハー以外の基板にダイシング用テープ、フィルムテープや樹脂を貼り付ける際、光学用ウェハーや基板を鏡面加工するときに、セラミック板に固定するテープを貼り付ける際等にも利用することができる。 Tape applying apparatus and a sticking method according to the present invention is not limited to the pasting of the adhesive and the front surface protection tape for dicing tape to the semiconductor wafer as a plate-like material as described above, the dicing tape to the substrate other than a semiconductor wafer It can also be used when affixing a tape to be fixed to a ceramic plate when applying a mirror tape to an optical wafer or substrate when applying a film tape or resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003362967A JP4152295B2 (en) | 2003-10-23 | 2003-10-23 | Tape applicator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003362967A JP4152295B2 (en) | 2003-10-23 | 2003-10-23 | Tape applicator |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005129678A JP2005129678A (en) | 2005-05-19 |
JP2005129678A5 true JP2005129678A5 (en) | 2008-04-10 |
JP4152295B2 JP4152295B2 (en) | 2008-09-17 |
Family
ID=34642421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003362967A Expired - Fee Related JP4152295B2 (en) | 2003-10-23 | 2003-10-23 | Tape applicator |
Country Status (1)
Country | Link |
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JP (1) | JP4152295B2 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4559122B2 (en) | 2004-05-25 | 2010-10-06 | 有限会社都波岐精工 | Tape bonding apparatus and tape bonding method |
JP4848153B2 (en) * | 2005-08-10 | 2011-12-28 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
JP2008153597A (en) * | 2006-12-20 | 2008-07-03 | Hitachi Setsubi Eng Co Ltd | Dicing-tape sticking method and device for semiconductor wafer |
JP4733069B2 (en) * | 2007-05-22 | 2011-07-27 | リンテック株式会社 | Sheet sticking device and sticking method |
JP2009071145A (en) * | 2007-09-14 | 2009-04-02 | Hitachi Setsubi Eng Co Ltd | Method and device for sticking dicing tape on plate type member such as semiconductor wafer |
JP4812131B2 (en) * | 2008-04-18 | 2011-11-09 | Necエンジニアリング株式会社 | Substrate bonding equipment |
JP5261308B2 (en) * | 2009-07-24 | 2013-08-14 | リンテック株式会社 | Pressing device |
JP5660821B2 (en) * | 2010-08-06 | 2015-01-28 | リンテック株式会社 | Sheet sticking device and sticking method |
JP5649125B2 (en) | 2011-07-01 | 2015-01-07 | Necエンジニアリング株式会社 | Tape applicator |
JP6130264B2 (en) * | 2013-08-09 | 2017-05-17 | リンテック株式会社 | Sheet sticking device and sheet sticking method |
JP6388331B2 (en) * | 2014-07-14 | 2018-09-12 | Necプラットフォームズ株式会社 | Tape sticking device and tape sticking jig |
JP7109844B1 (en) * | 2022-04-18 | 2022-08-01 | 大宮工業株式会社 | Transfer device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4022306B2 (en) * | 1998-03-03 | 2007-12-19 | 不二越機械工業株式会社 | Wafer bonding method and bonding apparatus |
JP2003007808A (en) * | 2001-06-20 | 2003-01-10 | Mighty Engineering:Kk | Wafer taping machine using vacuum |
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2003
- 2003-10-23 JP JP2003362967A patent/JP4152295B2/en not_active Expired - Fee Related
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