JP7109844B1 - Transfer device - Google Patents

Abstract

Kind Code: A1 A transfer device capable of attaching a substrate attached to a transfer source adhesive tape to a transfer destination adhesive tape and peeling off the transfer source adhesive tape from the substrate with a simple configuration is provided. A transfer device (1) affixes a second adhesive tape to a substrate mounted on a ring frame via a first adhesive tape, and peels off the first adhesive tape from the substrate. The transfer device 1 includes fixing means for fixing a ring frame, a transfer stage 10 arranged on the opposite side of the adhesive surface of the first adhesive tape and having a recess on the side facing the substrate, the transfer stage 10 being movable up and down. Pressurizing means for exhausting and pressurizing air into a space surrounded by a convex member 20 disposed in a concave portion and erected toward the substrate, the transfer stage 10 and the first adhesive tape, the transfer stage 10 and the first adhesive tape. A decompression means for decompressing the space surrounded by the first adhesive tape by sucking air, and a sticking device 60 for sticking the second adhesive tape to the substrate are provided. [Selection drawing] Fig. 2

Description

The present invention relates to a transfer device.

2. Description of the Related Art In the manufacturing process of a semiconductor device, so-called transfer may be performed in which a semiconductor wafer mounted on a ring frame via a tape is mounted on another ring frame via another tape.

For example, after dicing a semiconductor wafer, a chip is turned upside down, or the patterned surface is attached to a dicing tape and mounted, and the chip is turned over at the time of die bonding. Various transfer apparatuses have been proposed for such transfer of semiconductor wafers (for example, Patent Document 1).

JP 2020-31165 A

In the re-sticking apparatus of Patent Document 1, after the substrate is attached to the adhesive tape of the transfer destination by the attaching apparatus, it is conveyed to the peeling apparatus, and the adhesive tape of the transfer source is peeled off by the peeling apparatus. For this reason, in addition to the two stages of the sticking device and the peeling device, a conveying device for moving between the stages is required, so that the structure of the entire device becomes complicated and large.

The present invention has been made in view of the above problems, and an object of the present invention is to attach a substrate attached to an adhesive tape of a transfer source with a simple structure to an adhesive tape of a transfer destination, and to To provide a transfer device capable of separating from a substrate.

A transfer device according to the present invention includes:
A transfer device that adheres a second adhesive tape to a substrate mounted on a ring frame via a first adhesive tape and peels the first adhesive tape from the substrate,
fixing means for fixing the ring frame;
a vertically movable transfer stage disposed on the opposite side of the adhesive surface of the first adhesive tape and having a concave portion on the side facing the substrate;
a convex member arranged in the concave portion of the transfer stage and erected toward the substrate;
a pressurizing means for pressurizing the space surrounded by the transfer stage and the first adhesive tape by exhausting air;
decompression means for decompressing air in a space surrounded by the transfer stage and the first adhesive tape;
a sticking device for sticking the second adhesive tape to the substrate,
The inside of the concave portion is pressurized by exhaust air from the pressurizing means, and the attaching device attaches the second adhesive tape to the substrate in a state in which the substrate is supported by the first adhesive tape;
The first adhesive tape is peeled off from the substrate by decompressing the inside of the recess by suction by the decompressing means and sucking the first adhesive tape.
It is characterized by

Further, the convex member is a column having a tapered tip,
a support table disposed in the concave portion and having a passage hole through which the convex member can pass;
a support table elevating means for elevating and lowering the support table,
Preferably, the support table is lifted along the convex member by the support table elevating means to support the substrate, and is lowered by the support table elevating means.

ADVANTAGE OF THE INVENTION According to the present invention, it is possible to provide a transfer device capable of sticking a substrate attached to an adhesive tape of a transfer source to an adhesive tape of a transfer destination and peeling the adhesive tape of the transfer source from a substrate with a simple configuration. can.

It is a perspective view explaining transfer of a board|substrate. It is a sectional view showing a schematic structure of a transfer device. 2 is a plan view showing a schematic configuration of a transfer stage; FIG. 4A and 4B are cross-sectional views for explaining the operation of the transfer device; FIG. 4A and 4B are cross-sectional views for explaining the operation of the transfer device; FIG. 4A and 4B are cross-sectional views for explaining the operation of the transfer device; FIG. 4A and 4B are cross-sectional views for explaining the operation of the transfer device; FIG. 4A and 4B are cross-sectional views for explaining the operation of the transfer device; FIG. 4A and 4B are cross-sectional views for explaining the operation of the transfer device; FIG. 4A and 4B are cross-sectional views for explaining the operation of the transfer device; FIG. It is a sectional view explaining a transfer device concerning other forms.

A transfer device according to this embodiment will be described with reference to the drawings. The transfer device, as shown in FIG. 1, adheres a second adhesive tape TA2 to a substrate W such as a semiconductor wafer mounted on a transfer source ring frame RF1 via a first adhesive tape TA1, and then, from the substrate W This is an apparatus for mounting the substrate W on the transfer destination ring frame RF2 via the second adhesive tape TA2 by peeling off the first adhesive tape TA1.

2 and 3, the transfer device 1 includes a transfer stage 10, a convex member 20, a support table 30, a support table elevating device 31, a transfer source ring frame fixing device 40, a transfer destination ring frame placement unit 50, It includes a pasting device 60, a cutting device 70, a transfer stage lifting device (not shown), a pressurizing device (not shown), and a pressure reducing device (not shown).

The transfer stage 10 is configured to be movable up and down by a transfer stage elevating device. The transfer stage lifting device may have any configuration as long as it can move the transfer stage 10 up and down. be done.

The transfer stage 10 has a recess opening upward. Specifically, the transfer stage 10 has a shape in which a disc-shaped outer peripheral portion is erected upward to form an outer wall, and a disc-shaped concave portion is formed. ing.

A plurality of convex members 20 are erected in the concave portion of the transfer stage 10 . Specifically, the convex member 20 is a columnar body such as a columnar shape or a polygonal columnar shape. It is tapered. The height of the protruding member 20 is set so that the tapered tip is at the same height as the upper end of the outer wall of the transfer stage 10 .

An exhaust port 11 and an air intake port 12 are formed in a bottom plate portion, which is a concave portion of the transfer stage 10 . The exhaust port 11 is connected to a pressurizing device (not shown), more specifically, an exhaust device. Further, the intake port 12 is connected to a decompression device (not shown), more specifically, an intake device. Air is discharged from the exhaust device into the recess through the exhaust port 11 . On the other hand, the air in the recess is sucked in by an air intake device through the air intake port 12 .

Further, in the bottom plate portion of the transfer stage 10, an elevating shaft passage hole is formed through which an elevating shaft 34 of a support table elevating device 31, which will be described later, passes. A seal member 13 is arranged so as to surround the elevation shaft passage hole. The seal member 13 is specifically an O-ring, and prevents air from leaking out of the concave portion through the elevating shaft passage hole.

The support table 30 is arranged within the recess of the transfer stage 10 . The support table 30 has a disk shape with a diameter slightly smaller than the diameter of the recess, is thinner than the depth of the recess, and has a plurality of passage holes through which the convex member 20 can pass. Each convex member 20 is configured to enter each passage hole. The support table 30 is configured to be movable along the erecting direction of the convex member 20 by a support table lifting device 31 .

The support table lifting device 31 may have any structure as long as the support table 30 can be lifted and lowered. The upper ends of the four elevating shafts 34 pass through the elevating shaft passage holes of the transfer stage 10 and are fixed to the lower part of the support table 30 , and the lower ends of the elevating shafts 34 are fixed to the connection member 33 . The connection member 33 is connected to an elevating cylinder 32, and when the elevating cylinder 32 raises and lowers the connecting member 33, the elevating shaft 34 and the support table 30 are also raised and lowered.

The support table 30 functions to support the substrate W from below when the second adhesive tape TA2 is attached to the substrate W, thereby reducing the load applied to the substrate W during attachment.

The pressurizing means, as described above, exhausts air into the concave portion of the transfer stage 10 through the exhaust port 11 . This presses the first adhesive tape TA1 from below.

As described above, the decompression means sucks the air in the concave portion of the transfer stage 10 through the suction port 12 and sucks the first adhesive tape TA1 downward.

The transfer source ring frame fixing device 40 has an upper fixing member 41 and a lower fixing member 42 . The upper fixing member 41 and the lower fixing member 42 can be moved up and down so that they are separated from each other and close to each other. and fix it.

The transfer destination ring frame arrangement portion 50 is a portion where the transfer destination ring frame RF2 is arranged. A substrate W is mounted on the transfer destination ring frame RF2 via a second adhesive tape TA2.

The sticking device 60 has a function of sticking the second adhesive tape TA2 to the substrate W and the transfer destination ring frame RF2 and fixing the substrate W and the transfer destination ring frame RF2 via the second adhesive tape TA2. The sticking device 60 may have any form as long as it can stick the second adhesive tape TA2 to the substrate W and the transfer destination ring frame RF2.

For example, here is a form having a bonding roller 61 that can move along the substrate W. As shown in FIG. The second adhesive tape TA2 wound around the winding roller 62 is pulled out to a predetermined position by the winding roller 63, and the second adhesive tape TA2 is adhered to the substrate W and the transfer destination ring frame RF1 by the pasting roller 61. .

The cutting device 70 cuts the second adhesive tape TA2 along the shape of the transfer destination ring frame RF2. After the second adhesive tape TA2 is attached to the substrate W and the transfer destination ring frame RF2, the cutting device 70 rotates the blade along the shape of the transfer destination ring frame RF2 to cut the second adhesive tape TA2. It may be cut into a shape corresponding to the shape of the transfer destination ring frame RF2 before the second adhesive tape TA2 is attached. As an apparatus configuration for cutting the second adhesive tape TA2 before sticking, for example, a configuration having a precut mechanism having a cutting roller as described in Japanese Patent No. 5508508 can be mentioned.

Next, the transfer operation of the transfer device 1 will be described. 4 to 10, part of the configuration is omitted for simplification of explanation.

First, as shown in FIG. 4, the transfer source ring frame RF1 on which the substrate W is mounted via the first adhesive tape TA1 is arranged and fixed by the transfer source ring frame fixing device 40. As shown in FIG. The transfer source ring frame RF1 is fixed with the adhesive surface of the first adhesive tape TA1 and the substrate W facing upward.

Subsequently, as shown in FIG. 5, the transfer stage 10 is lifted by the lifting device, and the transfer stage 10 contacts the lower surface of the first adhesive tape TA1.

As shown in FIG. 6, the transfer stage 10 is further raised, and the substrate W is raised to the height at which the transfer destination ring frame RF2 is arranged. Also, air is supplied into the concave portion of the transfer stage 10 through the exhaust port 11 by the exhaust device. As a result, the space surrounded by the recess and the first adhesive tape TA1 is pressurized. Further, the support table 30 is lifted by the support table lifting device 31, and the substrate W is supported from below.

Then, as shown in FIG. 7, the second adhesive tape TA2 is applied to the upper surface of the substrate W and the transfer destination ring frame RF2 by the application roller 61. As shown in FIG. Since the support table 30 supports the substrate W from below and the substrate W is pushed up by the first adhesive tape TA1, the load on the substrate W caused by the application of the second adhesive tape TA2 is reduced. reduced. Thereby, the substrate W and the ring frame RF2 are fixed via the second adhesive tape TA2.

After that, the second adhesive tape TA2 is cut into a circular shape along the ring frame RF2, and the substrate W is mounted on the transfer destination ring frame RF2 via the second adhesive tape TA2 as shown in FIG. becomes.

Then, as shown in FIG. 9, the exhaust device stops, and the exhaust of air into the concave portion of the transfer stage 10 through the exhaust port 11 stops. Also, the support table 30 is lowered by the support table lifting device 31 . Air in the concave portion of the transfer stage 10 is sucked through the suction port 12 by the suction device. The first adhesive tape TA1 is sucked into the recess by reducing the pressure in the space surrounded by the recess and the first adhesive tape TA1. Therefore, the portion of the first adhesive tape TA1 that was in contact with the support table 30 is peeled off from the substrate W, except for the portion of contact with the convex member 20 . The first adhesive tape TA<b>1 and the substrate W are bonded only at the tip of the convex member 20 .

Then, as shown in FIG. 10, the transfer stage 10 is lowered to its original position by the transfer stage lifting device. Since the bonding portion between the substrate W and the first adhesive tape TA1 is small, the first adhesive tape TA1 is peeled off without applying a peeling load to the substrate W at the bonding portion. Then, the first adhesive tape TA1 is completely peeled off from the substrate W.

In this way, the second adhesive tape TA2 is attached to the substrate W, and the first adhesive tape TA1 is peeled off from the substrate W, completing the transfer. As described above, in the transfer device 1, even with a simple configuration, the second adhesive tape TA2 is attached to the substrate W and the first adhesive tape TA1 is peeled off from the substrate W on the same stage. It can be carried out.

In addition, the transfer device 1 performs dicing of the substrate W on which the active fault layer for dicing is formed by the laser by expanding the first adhesive tape TA1, and transfers it to the second adhesive tape TA2. There may be. While dicing the substrate W, it is possible to transfer the substrate W in a chipped state.

In this case, the distance between the transfer source ring frame fixing device 40 and the transfer destination ring frame arrangement portion 50 is set to a distance that allows the first adhesive tape TA1 to be sufficiently expanded and the substrate W to be diced. obtain. Alternatively, the placement position of the transfer destination ring frame placement portion 50 may be adjusted to a higher position, or the transfer destination ring frame placement portion 50 may be raised to an arbitrary height.

Also, in the above embodiment, an example in which the support table 30 is provided has been described, but depending on the strength of the substrate W and the material of the first adhesive tape TA1, the support table 30 may not be provided. As shown in FIG. 11, it may be a convex member 20 that is integrated and has a plurality of tapered convex portions on its surface.

Reference Signs List 1 transfer device 10 transfer stage 11 exhaust port 12 intake port 13 seal member 20 convex member 30 support table 31 support table lifting device 32 lifting cylinder 33 connection member 34 lifting shaft 40 transfer source ring frame fixing device 41 upper fixing member 42 lower fixing Member 50 Transfer destination ring frame arrangement portion 60 Applicator 61 Applicator roller 62 Winding roller 63 Winding roller 70 Cutting device TA1 First adhesive tape TA2 Second adhesive tape W Substrate RF1 Transfer source ring frame RF2 Transfer destination ring frame

Claims (2)

A transfer device that adheres a second adhesive tape to a substrate mounted on a ring frame via a first adhesive tape and peels the first adhesive tape from the substrate,
fixing means for fixing the ring frame;
a vertically movable transfer stage disposed on the opposite side of the adhesive surface of the first adhesive tape and having a concave portion on the side facing the substrate;
a convex member arranged in the concave portion of the transfer stage and erected toward the substrate;
a pressurizing means for pressurizing the space surrounded by the transfer stage and the first adhesive tape by exhausting air;
decompression means for decompressing air in a space surrounded by the transfer stage and the first adhesive tape;
a sticking device for sticking the second adhesive tape to the substrate,
The inside of the concave portion is pressurized by the air exhausted by the pressurizing means, and the attaching device attaches the second adhesive tape to the substrate in a state in which the substrate is supported by the first adhesive tape;
The first adhesive tape is peeled off from the substrate by decompressing the inside of the recess by suction by the decompressing means and sucking the first adhesive tape.
A transfer device characterized by: The convex member is a columnar body with a tapered tip,
a support table disposed in the concave portion and having a passage hole through which the convex member can pass;
a support table elevating means for elevating and lowering the support table,
The support table is lifted along the convex member by the support table elevating means to support the substrate, and is lowered by the support table elevating means.
2. The transfer device according to claim 1, wherein:

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