JP2011114272A - Sheet pasting apparatus and pasting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress unwanted bonding of an adhesive which has oozed out, in pasting of a bonding sheet having a split permitting cut formed thereon. <P>SOLUTION: The sheet pasting apparatus includes a supply means for unreeling an original sheet on which bonding sheets S are temporarily attached with a predetermined interval on a strip-like peeling sheet; a peeling plate for peeling the bonding sheets S by folding back the peeling sheet, the midway of unreeling by the supplying means; and a pressing means 16 for pressing the peeled bonding sheet S to a wafer W to paste the sheet. Each bonding sheet S is constituted of a base material sheet BS and an adhesive layer AD, formed on one surface of the base material sheet BS. The split permitting cut C is formed on the base material sheet BS or on the base material sheet BS and the adhesive layer AD, and a noncontact portion 31 is formed on a press roller 30 of the pressing means 16, and the noncontact portion 31 is formed in a region corresponding to a position where the split permitting cut C is formed, when the bonding sheet S is pressed. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a sheet sticking apparatus and a sticking method, and more particularly, to a sheet sticking apparatus and a sticking method capable of sticking an adhesive sheet on which a split allowable cut is formed to an adherend.

  Conventionally, a sheet sticking apparatus for sticking an adhesive sheet to an adherend such as a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) has been widely used. As such a sheet sticking apparatus, for example, Patent Documents 1 and 2 disclose this. In the sheet sticking device of Patent Document 1, the adhesive sheet is peeled off from the release sheet while the adhesive sheet is temporarily attached to one surface of the belt-like release sheet, and pressed onto the adherend by a pressing roller. It is provided as possible. The sheet sticking device of Patent Document 2 is provided so that an adhesive sheet is placed on an adherend and then a reduced pressure atmosphere is applied, and then the adhesive sheet is pressed against the adherend by a pressing member.

  By the way, recently, there is a tendency that the diameter of the wafer is increased, and the adhesive sheet is also increased accordingly. Therefore, a large peeling force is required when peeling the adhesive sheet. For this reason, in order to peel off the adhesive sheet, when the peeling tape is attached to the adhesive sheet and then peeled off by moving the peeling tape and the wafer relative to each other, the peeling tape extends or cuts off. There is a problem of frequent defects. Therefore, as a countermeasure for such a problem, it is conceivable to use an adhesive sheet in which a division allowable cut is formed. Thereby, by dividing the adhesive sheet with a division permissible cut into a small size, the adhesive sheet can be peeled off by reducing the force required for peeling, so that the peeling tape extends or cuts. This can be prevented and the occurrence of defective peeling can be avoided.

JP 2005-223190 A JP 2003-300025 A

  However, when affixing an adhesive sheet on which a split permissible cut is formed by the sheet sticking device of Patent Documents 1 and 2, the adhesive has exuded from the split permissible cut to the surface side of the adhesive sheet in advance, When the pressing means such as a pressing member presses the adhesive sheet, the adhesive oozes out from the split allowable cut to the surface side of the adhesive sheet, so that the oozed adhesive adheres to the pressing means. There is an inconvenience. If the pressing means to which the adhesive is attached is continuously used as it is, when the pressing means is separated from the adhesive sheet, the pressing means and the adhesive sheet are bonded, and the adhesive sheet or the wafer is lifted or moved. As a result, inconveniences such as defective adhesion of the adhesive sheet or damage of the wafer are caused.

[Object of invention]
It is an object of the present invention to prevent sticking failure and damage to an adherend by suppressing adhesion of an exuded adhesive to a pressing means when sticking an adhesive sheet formed with a division allowable cut. It is providing the sheet sticking apparatus and the sticking method.

In order to achieve the above object, the present invention provides a sheet sticking apparatus for sticking an adhesive sheet to an adherend,
The adhesive sheet is composed of a base sheet and an adhesive layer provided on one surface of the base sheet, and a split allowable cut is formed in the base sheet or the base sheet and the adhesive layer,
A supply means for supplying the adhesive sheet; and a pressing means for pressing and sticking the adhesive sheet supplied by the supply means to the adherend,
The said pressing means has taken the structure that it has the non-contact part which prevents the said division | segmentation permissible cut and its peripheral region from contacting the said pressing means at the time of the said adhesive sheet being pressed.

Further, the present invention provides a sheet sticking apparatus for sticking an adhesive sheet to an adherend,
The adhesive sheet is composed of a base sheet and an adhesive layer provided on one surface of the base sheet, and a split allowable cut is formed in the base sheet or the base sheet and the adhesive layer,
Supply means for supplying the adhesive sheet, support means for supporting the adhesive sheet supplied by the supply means from the base sheet side, and pressing the adhesive sheet supported by the support means against the adherend A pressing means for attaching,
The support means has a configuration in which when the adhesive sheet is supported, it has a non-contact portion that prevents the split permissible cut and its peripheral region from coming into contact with the support means.

  In the present invention, a configuration in which the support unit includes an outer peripheral pressing unit that can contact the outer peripheral region of the adhesive sheet and press the outer peripheral region is preferably employed.

  Furthermore, you may take the structure of providing the pressure reduction means which forms a pressure reduction atmosphere around the said to-be-adhered body and an adhesive sheet.

Further, the sticking method of the present invention is a sheet sticking method for sticking an adhesive sheet to an adherend,
The adhesive sheet is composed of a base sheet and an adhesive layer provided on one surface of the base sheet, and a split allowable cut is formed in the base sheet or the base sheet and the adhesive layer,
Supplying the adhesive sheet;
And a step of pressing and adhering the adhesive sheet without contacting the split permissible cut and its peripheral region.

  According to the present invention, since the non-contact part is formed in the pressing unit, the pressing unit can press and stick the adhesive sheet without contacting the split allowable cut and the peripheral area. Therefore, the adhesive oozes out from the division allowable cut in advance to the surface side of the adhesive sheet, or the adhesive sheet oozes out from the division allowable cut into the base sheet side by pressing and sticking the adhesive sheet. However, it is possible to prevent the adhesive from adhering to the pressing means. Thereby, the adhesion between the pressing means and the adhesive sheet by the adhesive can be suppressed, and the adhesive sheet and the adherend move together with the pressing means, and the adhesive sheet sticking failure and the adherend are damaged. Can be avoided.

  In addition, since the non-contact portion is formed on the support means for supporting the adhesive sheet supplied from the supply means, the support means can support and paste the adhesive sheet without contacting the split permissible cut and its peripheral area. it can. Therefore, in the same way as the effects described above, the adhesive has oozed out from the split allowable cut to the surface side of the adhesive sheet in advance, or the adhesive sheet is pressed from the split allowable cut to apply the adhesive to the base material. Even if it oozes out to the sheet side, it is possible to prevent the adhesive from adhering to the support means. As a result, adhesion between the support means and the adhesive sheet by the adhesive can be suppressed, and the adhesive sheet and the adherend move together with the support means and the sticking failure of the adhesive sheet or damage to the adherend occurs. Can be avoided.

  Further, when the outer peripheral pressing means is provided in the supporting means, for example, when a brittle one such as a wafer having a circuit formed inside is adopted as the adherend, a large pressing force is applied to the area where the circuit is formed. If added, the wafer may be damaged. For this reason, if only the outer peripheral area of the adherend is pressed strongly by the outer peripheral pressing means, cleaning water, chemicals, etc. at the time of wafer grinding or surface treatment enter from the outer edge of the adhesive sheet and are formed on the wafer. It is possible to prevent the circuit from functioning by attaching to the circuit.

  In addition, when a reduced pressure atmosphere is formed around the adherend and the adhesive sheet by the decompression unit, it is possible to prevent air bubbles from being mixed and stuck between the adherend and the adhesive sheet.

The schematic front view of the sheet sticking apparatus which concerns on 1st Embodiment. (A) is a schematic perspective view of an adhesive sheet, (B) is an AA cross section B arrow view of (A). The schematic left view of FIG. The schematic partial cross section front view of the sheet sticking apparatus which concerns on 2nd Embodiment. FIG. 5 is a left side partial cross-sectional view of FIG. 4. (A), (B) is a partial schematic perspective view of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[First Embodiment]
1 to 3, in the sheet sticking apparatus 10, an adhesive sheet S is temporarily attached to a holding means 11 for placing and holding a wafer W as an adherend and a strip-like release sheet RL at a predetermined interval. The feeding means 13 that peels the adhesive sheet S from the release sheet RL and supplies the adhesive sheet S in the course of feeding the strip-shaped raw fabric R, and presses the adhesive sheet S peeled from the release sheet RL against the wafer W. It comprises a pressing means 16 for attaching.

  The adhesive sheet S includes a base material sheet BS and an adhesive layer AD provided on one surface of the base material sheet BS, that is, the lower surface in FIG. 2B, and a circuit surface via the adhesive layer AD. Affixed to the upper surface of the wafer W.

  In the adhesive sheet S, a division allowable cut C is formed. In this embodiment, the division | segmentation permissible cut C is formed so that the both ends may each reach the outer edge of the base material sheet | seat BS through the center of the adhesive sheet S, and the adhesive sheet S is formed along this division | segmentation permissible cut C. By cutting, the adhesive sheet S can be formed as the first and second divided sheets S1 and S2.

  The split allowable cut C is formed only on the base sheet BS as shown by a solid line in FIG. 2 (B), as well as the entire thickness direction of the base sheet BS and an adhesive as shown by a two-dot chain line in FIG. It may be formed in a part of the thickness direction of the layer AD, in other words, a depth less than the thickness of the adhesive sheet S and greater than the thickness of the base sheet BS. The depth of the division allowable cut C is a cutting force for cutting the adhesive sheet S along the division allowable cut C rather than the peeling force when peeling the first divided sheet S1 or the second divided sheet S2 from the wafer W. Is set to be smaller.

  As shown in FIG. 1, the holding means 11 is constituted by a table whose upper surface is formed as a suction surface for the wafer W. The holding means 11 is provided so as to be movable in the left-right direction in FIG. 1 via the slider 20 </ b> A of the linear motor 20.

  The supply means 13 is supported by a frame (not shown) and supports a roll-shaped original fabric R, and the adhesive sheet S is folded from the release sheet RL by folding the release sheet RL in the course of feeding the original fabric R. The peel plate 15 to be peeled, the driving roller 24 and the pinch roller 25 that sandwich the peeling sheet RL after passing through the peel plate 15, and the winding that winds the peeling sheet RL after passing through the peeling plate RL with a predetermined torque by a driving means (not shown). A take-up shaft 26 is provided. The drive roller 24 is rotatably provided via a motor M.

  The pressing means 16 includes a press roller 30 located on the tip side (left side in FIG. 1) of the peel plate 15 and a linear motor (not shown) that supports the press roller 30 so as to be movable up and down in FIG. . Further, as shown in FIG. 3, the press roller 30 has a groove 31 as a non-contact portion. This groove 31 is formed at the center in the extending direction of the press roller 30 so as to prevent the split allowable cut C and its peripheral region E from contacting when the press roller 30 presses the adhesive sheet S. Is formed. In the present embodiment, the width WI of the groove 31 is set to 2 mm, and the height HE is also set to 2 mm. Therefore, the peripheral region E is a region having a width of 2 mm along the extending direction across the division allowable cut C. Note that the width WI and the height HE of the groove 31 can be appropriately changed according to the width in the extending direction of the split allowable cut C and the amount of the adhesive AD exudation AD1 (see FIG. 3).

  Next, a method for sticking the adhesive sheet S by the sheet sticking apparatus 10 will be described.

  As an initial work, the original fabric R supported by the support shaft 22 is pulled out by a predetermined length, and the original fabric R is wound around so as to be folded back at the tip of the peel plate 15, and then the original roller R is interposed between the driving roller 24 and the pinch roller 25. The lead end of the original fabric R is fixed to the winding shaft 26 by passing the anti-R.

  Then, the wafer W is sucked and held on the upper surface of the holding means 11 through a transfer means (not shown), and the linear motor 20 is driven to move the holding means 11 leftward in FIG. Next, when it is detected by a sensor (not shown) that the wafer W has reached a predetermined position, the press roller 30 is lowered via a linear motor (not shown), and the left end portion of the adhesive sheet S in FIG. At the same time as pressing the left end of W, the motor M rotates in synchronization with the movement of the slider 20A, so that the adhesive sheet S is peeled off at the tip of the peel plate 15 and the peeled adhesive sheet S is removed from the wafer W. Affixed to the top surface. At this time, since the groove 31 is formed in the press roller 30, the press roller 30 does not come into contact with the division allowable cut C and the peripheral region E, and as shown in FIG. The adhesive AD seepage AD1 is formed on the other surface of the base sheet BS from the cut C, that is, the upper surface in FIG. 3, or when the press roller 30 presses the adhesive sheet S, the split allowable cut C Even if the adhesive AD oozes out AD1 of the adhesive AD on the other surface of the base sheet BS, that is, the upper surface in FIG. 3, the oozing out AD1 can be prevented from adhering to the press roller 30. it can. The wafer W to which the adhesive sheet S is affixed is transferred to the next process via a transfer device (not shown), and thereafter the same operation as described above is repeated.

  Therefore, according to such an embodiment, the press roller 30 does not come into contact with the division allowable cut C and its peripheral region E by the groove 31, so that the adhesive AD oozes out AD1 from the division allowable cut C. Moreover, it can suppress that the said oozing-out AD1 adheres. As a result, it is possible to prevent the adhesive sheet S and the wafer W from being moved together with the press roller 30 to cause the adhesion failure of the adhesive sheet S and the breakage of the wafer W.

[Second Embodiment]
Next, a sheet pasting apparatus according to a second embodiment of the present invention will be described with reference to FIGS. In the following description, the same reference numerals are used for the same or equivalent components as in the first embodiment, and the description is omitted or simplified.

  In the second embodiment, the support means 41 that can support the adhesive sheet S, the outer peripheral pressing means 42 incorporated in the support means 41, and the linear motion that supports the support means 41 so as to be movable in the vertical direction in FIG. A motor 43 and a decompression unit 50 that forms a decompressed atmosphere around the wafer W and the adhesive sheet S are provided.

  The support means 41 includes a suction head 41B having a plurality of suction holes 41A on the lower surface side and a support body 41D that supports the suction head 41B via a shaft 41C. The suction holes 41A serve as a suction pump (not shown). The connected adhesive sheet S is provided so as to be capable of being adsorbed and supported from the other surface side (upper surface in FIG. 4) side of the base sheet BS. Further, as shown in FIG. 6, a groove 44 as a non-contact portion is formed on the lower surface of the support means 41, that is, the lower surfaces of the suction head 41B and the support body 41D. The groove 44 is formed so as to prevent the division allowable cut C and the peripheral area E from contacting the support means 41 when the adhesive sheet S is supported. Also in the case of the second embodiment, the width WI of the groove 44 is set to 2 mm and the height HE is set to 2 mm as in the first embodiment (see FIG. 3). Therefore, the peripheral region E is a region having a width of 2 mm along the extending direction across the division allowable cut C. Note that the width WI and the height HE of the groove 44 can be appropriately changed in accordance with the width in the extending direction of the division allowable cut C and the amount of the adhesive AD exuding AD1.

  The outer peripheral pressing means 42 has a hole 46A through which the shaft 41C passes, and a ring-shaped contact body 46 whose lower end portion in FIG. And a linear motor 47 that is movably supported. As shown in FIG. 6B, the lower end portion of the contact body 46 is provided so as to move in the direction of the arrow AR by the operation of the linear motion motor 47 so as to protrude from the lower surface of the support means 41. In the case of this embodiment, the contact body 46 has a planar shape of a circle having a diameter of 300 mm, which is the same as the outer edge shape of the wafer W, and the width of the annular lower end portion is set to 2.5 mm.

  The decompression means 50 includes an upper case 51 that supports the linear motion motor 43 from above, and a lower case 52 on which the holding means 11 is placed while forming a sealable space H by a combination of the upper case 51. And a pipe 53 connected to the lower case 52. The piping 53 is connected to a solenoid valve and a decompression pump (not shown) so that a reduced pressure atmosphere including a vacuum can be formed in the space H, or the reduced pressure can be released to an atmospheric pressure. In the case of this embodiment, a pressing means is comprised by the piping 53, the solenoid valve which is not shown in figure, and a pressure reduction pump.

  The upper case 51 is provided so as to be movable in the left-right direction in FIG. 4 via a slider 55A of the linear motor 55. The linear motor 55 is supported by elevating means (not shown), so that the upper case 51 can be raised and lowered together with the linear motor 55.

  In the present embodiment, when the adhesive sheet S is attached to the wafer W on the holding means 11, the peel plate 15 with the contact body 46 depressed from the lower surface of the support means 41 as shown in FIG. The adhesive sheet S peeled off at the tip of the base sheet is sucked and supported on the lower surface of the support means 41 from the other surface side of the base sheet BS. At this time, the outer peripheral area of the adhesive sheet S is located below the contact body 46 in FIG. 4, and the division allowable cut C is located below the groove 44 and the division allowable cut C and the peripheral area E thereof. And the lower surface of the support means 41 is supported by the support means 41 without contact. Next, the linear motor 55 is operated to move the upper case 51 above the lower case 52, and the adhesive sheet S supported by the support means 41 is moved and positioned on the wafer W. Next, an elevating means (not shown) is operated, and the lower surface of the upper case 51 is brought into close contact with the upper surface of the lower case 52 to form the space H. At this time, the adhesive sheet S supported by the support means 41 is positioned above the wafer W at a predetermined interval.

  After the formation of the space H, pressure reduction in the space H is started through the pipe 53. When it is detected by the detection means (not shown) that the space H has reached a predetermined reduced pressure state, the linear motion motor 43 is operated to lower the support means 41, and the adhesive layer AD of the adhesive sheet S is placed on the upper surface of the wafer W. Contact. Next, the linear motion motor 47 and the linear motion motor 43 are linked and operated to lower the contact body 46, and the contact body 46 presses the outer edge region of the adhesive sheet S toward the wafer W and supports it. The means 41 is separated from the upper surface of the adhesive sheet S. That is, the positional relationship between the support means 41 and the contact body 46 is in the state shown in FIG. In this state, the pressure inside the space H is gradually changed to the atmospheric pressure through the pipe 53, so that the adhesive sheet S is applied with a force that presses the adhesive sheet S toward the wafer W side. Note that through holes (not shown) are formed in the contact body 46 and the suction head 41B so that atmospheric pressure acts on the space surrounded by the contact body 46, the suction head 41B, and the adhesive sheet S. Here, the pressure in the space H becomes smaller than the pressure of the supporting means 41 for sucking and supporting the adhesive sheet S and the pressure of the holding means 11 for sucking and holding the wafer W, and the adhesive sheet S and the wafer W are stuck to each other. In the case of moving before being performed, the support method of the support means 41 may be changed to another support method such as electrostatic support or check support.

  Thereafter, the linear motion motor 47 and the linear motion motor 43 are linked to operate, thereby bringing the support means 41 into contact with the upper surface of the adhesive sheet S and separating the contact body 46 from the adhesive sheet S. At this time, even if the bleeding AD1 of the adhesive AD adheres to the contact body 46, the contact of the contact body 46 to the adhesive sheet S is only the outer edge region, and the support means 41 is the upper surface of the adhesive sheet S. Therefore, the adhesive sheet S can be prevented from being lifted. After the contact body 46 is lifted, the upper case 51 and the pressing means 40 are lifted through lifting means (not shown), and the wafer W to which the adhesive sheet S is attached is transferred to the next process via a transfer device (not shown). The operation similar to the above is repeated.

  Therefore, even in such an embodiment, even if the bleeding AD1 of the adhesive AD is formed from the division allowable cut C, the bleeding AD1 can be prevented from adhering to the support means 41, and the support means It is possible to avoid the adhesive sheet S and the wafer W from moving together with the 41 and the adhesion failure of the adhesive sheet S and the breakage of the wafer W.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, when the adhesive sheet S provided with a plurality of division allowable cuts C is to be applied, a plurality of grooves 31 and 44 may be provided accordingly, or according to the shape of the division allowable cuts C. The shape of the grooves 31 and 44 may be changed.

Further, the adherend in the present invention is not limited to a wafer, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. It may be a compound wafer.
Furthermore, the adhesive sheet S is an adhesive sheet that is not cut into a predetermined shape in advance, or an adhesive sheet that does not have the release sheet RL, in addition to those that have been cut into a predetermined shape as in the above embodiment. May be. In this case, the configuration of the supply unit may be changed as appropriate, and the cutting unit or the like may be cut into a predetermined shape immediately before or after being attached to the wafer W.
Further, the decompression means 50 in the second embodiment is not an essential requirement, and the pressure means may be configured by the linear motion motor 43 without the decompression means 50. In such a configuration, if a large pressing force is applied by the suction head 41B, the circuit of the wafer W may be damaged. Therefore, the outer peripheral pressing means 42 may be pressed strongly only in the outer peripheral region. . This prevents cleaning water, chemicals, or the like from the outer edge of the adhesive sheet S from adhering to the circuit formed on the wafer W during grinding or surface treatment of the wafer W and preventing the circuit from functioning. can do.
Further, the non-contact portion is not limited to the grooves 31 and 44 shown in the above embodiment, and for example, the non-contact portion may be configured by a U-shaped or V-shaped groove, or a plurality of presses. It is good also as a non-contact part by arrange | positioning a roller and several support means at predetermined intervals.

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 13 Supply means 15 Peel plate (peeling means)
16 Pressing means 31, 44 Groove (non-contact part)
41 support means 42 outer periphery pressing means 50 pressure reducing means AD adhesive layer BS base sheet C split permissible cut R original fabric RL release sheet S protective sheet W adherend (semiconductor wafer)

Claims (5)

In a sheet sticking device for sticking an adhesive sheet to an adherend,
The adhesive sheet is composed of a base sheet and an adhesive layer provided on one surface of the base sheet, and a split allowable cut is formed in the base sheet or the base sheet and the adhesive layer,
A supply means for supplying the adhesive sheet; and a pressing means for pressing and sticking the adhesive sheet supplied by the supply means to the adherend,
The sheet sticking apparatus, wherein the pressing means includes a non-contact portion that prevents the split permissible cut and its peripheral area from coming into contact with the pressing means when the adhesive sheet is pressed. In a sheet sticking device for sticking an adhesive sheet to an adherend,
The adhesive sheet is composed of a base sheet and an adhesive layer provided on one surface of the base sheet, and a split allowable cut is formed in the base sheet or the base sheet and the adhesive layer,
Supply means for supplying the adhesive sheet, support means for supporting the adhesive sheet supplied by the supply means from the base sheet side, and pressing the adhesive sheet supported by the support means against the adherend A pressing means for attaching,
The sheet sticking apparatus, wherein the support means includes a non-contact portion that prevents the split permissible cut and its peripheral region from coming into contact with the support means when the adhesive sheet is supported.   The sheet affixing device according to claim 2, wherein the supporting means includes an outer peripheral pressing means capable of contacting the outer peripheral area of the adhesive sheet and pressing the outer peripheral area.   The sheet sticking device according to claim 1, 2 or 3, further comprising a pressure reducing means for forming a reduced pressure atmosphere around the adherend and the adhesive sheet. In the sheet sticking method for sticking the adhesive sheet to the adherend,
The adhesive sheet is composed of a base sheet and an adhesive layer provided on one surface of the base sheet, and a split allowable cut is formed in the base sheet or the base sheet and the adhesive layer,
Supplying the adhesive sheet;
A sheet pasting method comprising: pressing and pasting the adhesive sheet without contacting the split permissible cut and a peripheral region thereof.

Images