JP2009033074A - Sheet pasting machine - Google Patents

Sheet pasting machine Download PDF

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JP2009033074A
JP2009033074A JP2007198251A JP2007198251A JP2009033074A JP 2009033074 A JP2009033074 A JP 2009033074A JP 2007198251 A JP2007198251 A JP 2007198251A JP 2007198251 A JP2007198251 A JP 2007198251A JP 2009033074 A JP2009033074 A JP 2009033074A
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sheet
means
sticking
adhesive sheet
layer
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JP2007198251A
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JP4801018B2 (en
Inventor
Masahisa Otsuka
昌久 大塚
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Lintec Corp
リンテック株式会社
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet pasting machine capable of automatically specifying a pasting mode in accordance with the type of a rolled original material and automatically pasting a pasting sheet to an pasted object. <P>SOLUTION: The sheet pasting machine is provided with: a supporting means 11 for supporting a ring frame RF and a wafer W; a supplying means 12 for supplying a single-layer rolled original material R1, a multi-layer rolled original material R2 and a multi-layer pre-cut rolled original material R3; first and second cut forming means 13 and 14 for forming a cut C on the single-layer rolled original material R1 and the multi-layer rolled original material R2 from the side of an adhesive sheet substrate SB and forming a pasting sheet S; a pasting means 16 for pasting the pasting sheet S; a detecting means 19 for detecting the type of each of the rolled original materials R1-R3; and a control means for specifying any one of the plurality of the pasting modes on the basis of signal patterns of the detecting means 19 and controlling each of the means. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a sheet affixing device, and more particularly, can automatically affix a sticking mode for each type of original fabric and affix a sticking sheet to an adherend, in particular via a sticking sheet. The present invention relates to a sheet sticking apparatus suitable for integrating (mounting) a semiconductor wafer on a ring frame.

  Conventionally, when a semiconductor wafer (hereinafter simply referred to as a “wafer”) is integrated with a ring frame, a sticking sheet such as a dicing sheet or a mounting sheet is placed on the inside of the ring frame. It is a common practice to apply over the entire area. For example, Patent Document 1 discloses an apparatus for sticking such a sticking sheet. The sheet sticking device in the document enables feeding of a strip-like original fabric in which a pre-cut adhesive sheet is temporarily attached at a predetermined interval on one surface of a release sheet, and a peel plate is provided in the middle of feeding the original fabric. The adhesive sheet is attached to the ring frame and the wafer while peeling the adhesive sheet from the release sheet.

JP 2005-159044 A

The sheet sticking device described in Patent Document 1 is a dedicated device for one type of original fabric, and has versatility that enables operation by selecting a sticking mode according to the type of the original fabric. It is not. That is, the sheet sticking device of Patent Document 1 is intended for an original fabric having a precut application sheet, while an original fabric in which a belt-like adhesive sheet base material is temporarily attached to one surface of the belt-like release sheet. A sheet for sticking cannot be formed and stuck on the way out.
In this case, it is only necessary to provide a notch forming means comprising a die cut roller or the like between the raw material supply means and the peel plate.
However, even if it is possible to deal with both the original fabric on which the pasting sheet is formed in advance and the original fabric on which the pasting sheet is formed during feeding, the operator visually confirms the original fabric for setting and changing the apparatus operating conditions. This has the disadvantage that it requires skill and great labor for the initial operation of the operation.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences. The purpose of the present invention is to automatically apply one sticking mode according to the types of original fabrics even if different types of original fabrics are applied. It is intended to provide a sheet sticking apparatus having versatility that can automatically stick a sticking sheet to an adherend.

In order to achieve the above-mentioned object, the present invention provides a single-layer original fabric composed of a support means for supporting an adherend and a strip-shaped adhesive sheet substrate, or a strip-shaped release sheet on the adhesive surface side of the adhesive sheet substrate. A supply means for supplying at least two layers of the multi-layer pre-cut original fabric in which the adhesive sheet is temporarily attached at a predetermined interval to one surface of the at least two layers of the multi-layer original fabric or the strip-shaped release sheet, A notch forming means for forming a sticking sheet by providing a closed-loop cut from the adhesive sheet base material side, a sticking means for sticking the sticking sheet to an adherend, and a type of the raw fabric. A sheet sticking device comprising a plurality of detection means for detecting, and a control means for controlling each of the means according to the type of the original fabric,
The control means includes a function for specifying one sticking mode from a plurality of preset sticking modes, and each means for specifying and executing the one sticking mode according to an output signal of the detecting means. The structure of controlling is adopted.

In the present invention, the plurality of pasting modes are:
(A) The single-layer original fabric is fed to a relative position of the adherend and attached to the adherend, and then the adhesive sheet base material is cut out according to the size of the adherend to form an adhesive sheet. Layer aftercut application mode,
(B) After the adhesive sheet base material after the release sheet is peeled off from the multilayer original fabric is fed out to the relative position of the adherend and attached to the adherend, the adhesive sheet base material is the size of the adherend. Multi-layer after-cut sticking mode that cuts out according to the shape of the sticking sheet,
(C) In the course of feeding out the multi-layer original fabric, a cut sheet is provided in the adhesive sheet base material to form a sticking sheet, and the sticking sheet is peeled off from the peeling sheet and stuck on the adherend. mode,
(D) A multi-layer pre-cut application mode in which the multi-layer pre-cut original fabric is fed out and the application sheet is released from the release sheet and applied to the adherend.
Including
The control means can be configured to identify the one sticking mode from at least two sticking modes (A) to (D).

  Further, the sticking means includes pressing the original sheet feeding means, a peeling means for peeling the adhesive sheet base material or the sticking sheet from the release sheet, and the adhesive sheet base material or sticking sheet against the adherend. A pressing means for sticking, an unnecessary sheet winding means for winding up an adhesive sheet substrate portion located outside the sticking sheet as an unnecessary sheet, and a release sheet winding means for winding the release sheet are provided. .

  Furthermore, the detection means includes a notch detection means, an adhesive sheet base material detection means, and a release sheet detection means, one sticking mode specified from the signal combination pattern of each of the detection means, and the control means When the pasting mode input in the field does not match, the operation is prohibited.

  Further, the incision detection means is arranged downstream of the supply means in the original fabric feeding direction, while the adhesive sheet base material detection means is arranged upstream of the unnecessary sheet winding means in the original fabric feeding direction. The release sheet detecting means may be arranged on the downstream side of the peeling means in the original fabric feeding direction.

According to the present invention, a single layer original fabric or a multilayer original fabric or a multilayer precut original fabric can be supplied, and by detecting the state of these original fabrics via a plurality of detection means, the layer structure of the original fabric, The presence or absence of the sticking sheet can be detected, and the sticking sheet can be stuck on the adherend by operating the necessary means accordingly. Therefore, no matter what original fabric is applied to the supply means, it is not necessary for the operator to visually check and set or change the operating conditions, or to initialize the device. Can be started.
Further, by setting the above-described (A) to (D) as the pasting mode, a sheet pasting operation corresponding to at least four pasting modes can be performed.
Furthermore, since the sticking means is constituted by a raw material feeding means, a peeling means, a pressing means, an unnecessary sheet winding means and a peeling sheet winding means, it can be easily applied to an existing sheet sticking apparatus.
In addition, the control means is adopted because it is configured to prohibit driving when one sticking mode specified from the signal combination pattern of each detecting means and the sticking mode input to the control means do not match. Even if the operator tries to perform an incorrect sheet sticking operation on the original fabric, the operation is prohibited, so that a malfunction can be avoided.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic front view of a sheet sticking apparatus according to the present embodiment, and FIG. 2 shows a schematic perspective view thereof. FIG. 3 is a block diagram of the sheet sticking apparatus. In these drawings, the sheet sticking device 10 includes a single-layer original fabric R1 comprising a ring frame RF as an adherend and a support means 11 for supporting a wafer W, and a belt-like adhesive sheet base material SB or the adhesive sheet base material. A two-layered multi-layer original fabric R2 (see FIGS. 7 and 8) in which a strip-shaped release sheet RL is temporarily attached to the adhesive surface side of SB or an adhesive sheet S at a predetermined interval on one surface of the release sheet RL. Supply means 12 for supplying the temporarily attached multilayer pre-cut original fabric R3 (see FIG. 9), and a closed-loop cut C from the adhesive sheet base SB side to the original fabrics R1 and R2 to provide an adhesive sheet S First and second notch forming means 13 and 14 to be formed, affixing means 16 for affixing the affixing sheet S to the ring frame RF and the wafer W, and the respective types according to the types of the original fabrics R1 to R3 Predetermined control of means And control means 17 (see FIG. 3) is configured by a plurality of detecting means 19 for detecting the type of the raw R1-R3. In addition, the adhesive sheet substrate SB in the present invention includes those in which an adhesive layer is provided on one surface of a belt-shaped substrate and those in which a release treatment layer is provided on the other surface of a belt-shaped substrate, A material that can act as an adhesive sheet by itself is referred to as a single-layer original fabric R1. In addition, the release sheet RL used for the multilayer original fabric R2 can be exemplified by a strip-like sheet provided with a release treatment layer, which is regarded as a single layer, and is temporarily attached to the adhesive sheet substrate R1. This is referred to as a two-layered multi-layer raw material R2.

  The support means 11 includes an outer table 20 that supports the ring frame RF, an inner table 21 that supports the wafer W, and a base table 22 that supports the outer table 20 and the inner table 21 so as to be movable up and down. The outer table 20 is provided with a circular hole 20A in the center, while the outer peripheral side is provided in a shape that forms a square in plan view. On the other hand, the inner table 21 is provided in a substantially circular shape having a smaller diameter than the inner diameter of the hole 20A and is disposed in the hole 20A. The outer table 20 and the inner table 21 have suction holes (not shown) formed on the upper surface side so that the ring frame RF and the wafer W can be sucked and held. Further, the upper table 20 and the inner table 21 can be adjusted in height by the linear motors 24 and 25, respectively.

  The support means 11 is provided so as to be movable in the left-right direction in FIG. The moving means 26 includes a pair of guide rails 27 for guiding a slider 22A provided on the lower surface side of the base table 22, a feed screw shaft 28 penetrating through a nut member 22B provided on the lower surface side of the base table 22, and The motor M1 is configured to rotate the feed screw shaft 28.

  The supply means 12 is constituted by a supply roller 30 that is rotated by driving of a motor M 2, and the raw fabrics R 1 to R 3 that are selectively supported by the supply means 12 are provided via the guide rollers 31 and 32. It can be supplied to the cut forming means 14 side.

  The first notch forming means 13 has moved the support means 11 to the position indicated by the solid line in FIG. 1 when using the raw fabric R1 or R2 not provided with the closed loop notch C. Then, after the adhesive sheet base material SB is attached to the ring frame RF and the wafer W, the adhesive sheet base material SB is formed with a closed loop-shaped cut C to form the application sheet S. The first cut forming means 13 includes a cutting blade 34 whose cutting edge is directed to the lower end side, and a linear motion motor 35 that supports the cutting blade 34 so as to be movable in the vertical direction. The linear motor 35 is supported on one end side of an arm 36 that is rotatably provided in a plane by driving the motor M3, and is directly fixed to a frame (not shown) in a state where the motor M3 can be raised and lowered. A moving motor M4 is disposed, and the cutting blade 34 is provided so as to be movable up and down together with the unit U below the motor M3 by the direct acting motor M4. Here, the unit U is provided in a cylinder 38 provided on the other end side of the arm 36, a pressing roller 39 as pressing means provided movably up and down by the cylinder 38, and a lower part of the arm 36. A pressing member 41 as a pressing means having a lower open type cylindrical container shape supported via the rotary bearing 40, and a lower surface side central portion below the outer peripheral portion are provided inside the pressing member 41. And a pressing pad 42 as pressing means made of an elastic member such as rubber provided in a curved or inclined surface shape. The pressing pad 42 is provided so as to be movable up and down via the cylinder 43.

  The second notch forming means 14 forms a closed loop-like notch C in the adhesive sheet base material SB in the case of using the raw fabric R2 supplied from the supplying means 12, and the ring frame RF and the wafer W are formed. This is for forming the sticking sheet S immediately before sticking (see FIGS. 7 and 8). The second cut forming means 14 includes a die cut roller 46 having a closed-loop blade 45 on the outer peripheral surface, and a platen roller 47 disposed so as to sandwich the raw fabric R2 between the die cut roller 46. .

  As shown in FIGS. 1 and 3, the sticking means 16 includes first and second feeding means 50 and 51 for feeding the original fabrics R1 to R3, and a sticking sheet S or a peeling sheet RL from the release sheet RL. In addition to the peeling means 52 made of a peel plate or the like for peeling the adhesive sheet substrate SB and the pressing roller 53 as pressing means for pressing and sticking the sticking sheet S to the ring frame RF and the wafer W, the pressing roller 39 and The pressing pad 42, first and second unnecessary sheet winding means 55, 56 for winding the adhesive sheet base material portion located outside the sticking sheet S as the unnecessary sheet S1, and the release sheet for winding the release sheet RL Winding means 57 is provided.

  As shown in FIG. 1, the first feeding means 50 includes a first feeding roller 60 that is rotated by a motor M5 and a first pinch roller 61 that can be brought into contact with and separated from the first feeding roller 60. The means 51 includes a second feeding roller 62 driven by a motor M6, and a second pinch roller 63 that can come into contact with and separate from the second feeding roller 62. The first unnecessary sheet winding means 55 is constituted by a first winding roller 65 that is rotated by a motor M7, while the second unnecessary sheet winding means 56 is a second winding that is rotated by a motor M8. A take-up roller 66 is used. Further, the release sheet winding means 57 includes a release sheet winding shaft 67 that is rotated by a motor M9. As shown by a two-dot chain line in FIG. 1, the first feeding means 50 is movable in the left-right direction via the frame F, cuts the adhesive sheet base material SB, and attaches the adhesive sheet S to the ring frame. The RF sheet and the unnecessary sheet S1 positioned on the outer peripheral side after being attached to the wafer W are also peeled off from the upper surface of the outer table 20.

  The control means 17 has a function of specifying one pasting mode from a plurality of preset pasting modes. In this pasting mode, the single-layer original fabric R1 is fed to the relative position of the ring frame RF and the wafer W and pasted on them, and then the adhesive sheet base material SB is cut out according to the size of the ring frame RF, and the pasting sheet S is removed. Single-layer after-cut pasting mode to be formed, and adhesive sheet base material SB after peeling release sheet RL is peeled off from the multilayer original fabric R2 are fed to the relative positions of ring frame RF and wafer W, and then bonded. The sheet base SB is cut out according to the size of the ring frame RF to form a multi-layer after-cut sticking mode for forming the sticking sheet S, and the adhesive sheet base SB is cut in the middle of feeding the multi-layer raw fabric R2. After forming the sticking sheet S, the multilayer sheet is peeled off from the release sheet RL and attached to the ring frame RF and the wafer W. The cut pasting mode and the multi-layer precut original fabric R3 in which the pasting sheet S is temporarily attached to one surface of the release sheet RL at a predetermined interval are fed out, and the pasting sheet S is peeled off from the release sheet RL Including a frame RF and a multi-layer pre-cut application mode for attaching to the wafer W.

  As shown in FIG. 1 and FIG. 3, the detection means 19 includes a notch detection means 70 disposed on the downstream side of the supply means 11 in the original feed direction, and an original of the first unnecessary sheet winding means 55. It includes an adhesive sheet base material detection means 71 arranged on the upstream side in the counter feed direction and a release sheet detection means 72 arranged on the downstream side in the original feed direction of the peeling means 52. The signals of the detection means 70 to 72 are outputted to the control means 17, and the control means 17 specifies one pasting mode from a plurality of pasting modes inputted in advance by a combination pattern of these signals. It is designed to perform the pasting operation automatically. When the control is performed so that the operator can select the pasting mode, the pasting mode selected by the operator is compared with the pasting mode specified from the signal combination pattern of each of the detection means 70 to 72. If not done, it is controlled to prohibit driving. Each of the detection means 70 to 72 can be configured by a phototube, a camera, a wide-angle imaging sensor, or the like. Further, the adhesive sheet base material detecting means 71 may be arranged upstream of the second unnecessary sheet winding means 56 in the original fabric feeding direction as indicated by a two-dot chain line in FIG.

  Next, a method for executing the pasting mode by the sheet pasting device 10 will be described.

[Single-layer aftercut application mode]
As shown in FIGS. 1 and 2, the single-layer original fabric R <b> 1 is set on the supply unit 12, and its lead end is fixed to the first winding roller 65 via the first feeding unit 50. On the other hand, the ring frame RF and the wafer W supported by the support means 11 are maintained at the positions indicated by the solid lines in FIG. At this time, the pressing member 41 is positioned above the adhesive sheet substrate SB fed between the press roller 53 and the first feeding roller 60.

  When the power is turned on, the cut detection means 70, the adhesive sheet base material detection means 71 and the release sheet detection means 72 detect the objects to be detected and output respective detection signals to the control means 17. That is, since the notch detection means 70 does not detect the notch C, the OFF signal is detected, and the adhesive sheet base material detection means 71 detects the adhesive sheet base material SB (unnecessary sheet S1) and outputs the ON signal, and the release sheet detection means. Since 72 does not detect the release sheet RL, it outputs an OFF signal to the control means 17, respectively. Based on the pattern of these signals, the control means 17 determines that the currently set original is a single layer original R1, and the adhesive sheet base SB is attached to the ring frame RF and the wafer W after the adhesive sheet base SB is attached. The single-layer aftercut application mode for forming the cut C in SB will be specified. Note that the incision detecting means is scanned in the original feed direction in order to detect a wide area (the same applies hereinafter).

  When the control means 17 specifies the single layer aftercut sticking mode, the control means outputs a signal for executing the single layer aftercut sticking mode. That is, while outputting an operation signal to the support means 11, the supply means 12, the 1st notch formation means 13, the 1st delivery means 50, and the 1st unnecessary sheet winding means 55, it is the 2nd notch formation means. 14. Control is performed so as not to output an operation signal to the second feeding means 51, the second unnecessary sheet winding means 56, the release sheet winding means 57, and the moving means 26. Note that a stop signal is output to each means to which no operation signal is output so as to stop at a predetermined position (the same applies hereinafter).

  The adhesive sheet base material SB extending between the press roller 53 and the first take-up roller 60 is lowered while the entire unit U including the pressing member 41 is lowered by driving the linear motion motor M4, while the outer table 20 and the inner table 21. Is raised, the adhesive sheet base material SB is pressed against the upper surface side of the ring frame RF (see FIGS. 4 and 5).

  Next, the cutter blade 34 is lowered by the drive of the linear motor 35, penetrates the surface of the adhesive sheet base SB, and the motor M3 is driven to rotate the arm 36 in a plane, thereby substantially reducing the adhesive sheet base SB. Cut into a circle. And while the inside is set as the sticking sheet S and the outside is classified as the unnecessary sheet S1, the cutter blade 34 moves backward.

  When the adhesive sheet substrate SB is cut in this way, the pressing roller 39 is lowered by the cylinder 38 and presses the outer peripheral side of the sticking sheet S to make one rotation, so that the outer peripheral portion of the sticking sheet S is removed. While being affixed to the ring frame RF, the pressing pad 42 is lowered by the cylinder 43 to press the affixing sheet S against the wafer W. Thereby, the ring frame RF and the wafer W are integrated. In FIG. 5, the adhesive sheet base SB is shown as being completely separated into the sticking sheet S and the unnecessary sheet S1 for easy understanding, but in practice, the sticking sheet cut into a circle is used. The outer portion of S is continuously connected as an unnecessary sheet S1.

  When the application of the application sheet S and the cutting of the adhesive sheet base material SB are completed, the linear motion motor M4 moves upward through a driving means (not shown), and the entire unit below the linear motion motor M4 is shown in FIG. Retreat to a position above the position where Then, the first feeding means 50 moves to the right in FIG. 1 while being rotated by the motor M5 (see the two-dot chain line position in FIG. 1), and is an unnecessary sheet stuck on the outer peripheral side of the ring frame RF and the outer table 20. S1 is peeled off. After completion of the peeling, the motor M5 is locked and returns to the position indicated by the solid line in FIG. In synchronization with this return, the motor M7 is driven to wind up the unnecessary sheet S1 by the first winding roller 65, and at the same time, the motor M2 of the supply means 12 is driven to support the new adhesive sheet substrate SB. It will be supplied above the means 11. Further, the wafer W integrated with the ring frame RF through the sticking sheet S is transferred to the next process through a transfer means (not shown). Then, a new ring frame RF and wafer W are transferred to the support means 12, and thereafter the same operation is repeated to sequentially perform integration processing. When the adhesive sheet base SB is attached to the ring frame RF and the wafer W, the tip of the cutter blade 34 is attached to the ring by keeping the adhesive sheet base SB positioned on the outer peripheral side of the pressing member 41 in an inclined posture. It is also possible to form the cuts C in the adhesive sheet base material SB without contacting the frame RF.

[Multi-layer aftercut application mode]
As shown in FIG. 6, the multilayer original fabric R <b> 2 is set on the supply unit 12, and the adhesive sheet substrate SB and the release sheet RL are peeled off at the front end position of the peeling unit 52. Then, the lead end of the adhesive sheet substrate SB is fixed to the first winding roller 65 via the first feeding means 50, and the lead end of the release sheet RL is peeled off via the second feeding means 51. Fix to the sheet take-up shaft 67. Moreover, the support means 11 is maintained at the same position as the single-layer aftercut application mode.

  When the power is turned on, the notch detection means 70 does not detect the notch C, so an OFF signal is detected, and the adhesive sheet base material detection means 71 detects the adhesive sheet base material SB (unnecessary sheet S1) and outputs an ON signal. The detection means 72 detects the release sheet RL and outputs an ON signal to the control means 17. Based on the pattern of these signals, the control means 17 causes the currently set original fabric to be the multilayer original fabric R2, and after the adhesive sheet base material SB is attached to the ring frame RF and the wafer W, the adhesive sheet base material. The multi-layer aftercut application mode for forming the cut C in the SB is specified.

  When the control means 17 specifies the multilayer aftercut sticking mode, the control means outputs a signal for executing the multilayer aftercut sticking mode. That is, the operation signal is sent to the support means 11, the supply means 12, the first notch forming means 13, the first and second feeding means 50 and 51, the first unnecessary sheet winding means 55, and the release sheet winding means 57. On the other hand, control is performed so as not to output an operation signal to the second notch forming unit 14, the second unnecessary sheet winding unit 56, and the moving unit 26.

  Since this multilayer aftercut sticking mode is substantially the same as the single layer aftercut sticking mode except that an operation of winding the release sheet RL is added, description of the operation is omitted.

[Multi-layer cut cut pasting mode]
As shown in FIGS. 7 and 8, the multi-layer original fabric R2 is set on the supply means 12, and the lead end of the adhesive sheet substrate SB is fixed to the second winding roller 66 at a position past the nip roller 74. The release sheet RL is fixed to the release sheet take-up shaft 67 via the release means 52 and the second feeding means 51. The support means 11 is maintained at a position indicated by a two-dot chain line in FIG.

  When the power is turned on, the cut detection means 70 does not detect the cut C, so an OFF signal is generated, and the adhesive sheet base material detection means 71 does not detect the adhesive sheet base material SB (unnecessary sheet S1), so an OFF signal is output. The detection means 72 detects the release sheet RL and outputs an ON signal to the control means 17. Based on the pattern of these signals, the control means 17 is provided with a notch C for the adhesive sheet base material SB in the middle of feeding the multilayer original R2 when the original set is the multilayer original R2. The sheet S is formed, and the multilayer immediately preceding cut sticking mode in which the sticking sheet S is peeled off from the release sheet RL and attached to the ring frame RF and the wafer W is specified.

  When the control unit 17 specifies the multiple layer immediately preceding cut pasting mode, the control unit outputs a signal for executing the multiple layer just prior cut pasting mode. That is, an operation signal is sent to the support means 11, the supply means 12, the second notch forming means 14, the second feeding means 51, the second unnecessary sheet winding means 56, the release sheet winding means 57, and the moving means 26. On the other hand, control is performed so that no operation signal is output to the first notch forming unit 13, the first feeding unit 50, and the first unnecessary sheet winding unit 55.

  In this multi-layer immediately preceding cut pasting mode, the pasting operation is performed before the pasting operation is performed. That is, the multi-layer original fabric R2 supplied from the supply unit 12 is fed out by the second feeding unit 51. At this time, the die cut roller 46 forms a cut C in the adhesive sheet substrate SB, and the sticking sheet S is peeled off. After being fed out at the tip of 52 until it is detected by a sensor (not shown), it stops and enters a standby state. At this time, the adhesive sheet base SB outside the sticking sheet S is wound up by the second unnecessary sheet winding means 56 as the unnecessary sheet S1.

  When it is confirmed by a sensor (not shown) that the ring frame RF and the wafer W are placed on the support means 11 by a transfer means (not shown), the support means 11 is moved to the position indicated by the solid line shown in FIG. Moved to. Thereafter, the outer table 20 and the inner table 21 are moved upward by the linear motion motors 24 and 25 and set so that the ring frame RF and the upper surface of the wafer W are located in the same plane.

  Next, the supporting means 11 is conveyed leftward in FIG. 7 by the moving means 26, and the second feeding means 51 is driven to rotate in synchronization with the conveyance, and the sticking sheet S is peeled off at the tip of the peeling means 52. The sheet RL is peeled off, pressed by the press roller 53, and attached to the ring frame RF and the wafer W. At this time, the release sheet RL is taken up by the release sheet take-up means 57, and the unnecessary sheet S1 is taken up by the second unnecessary sheet take-up means 56.

[Multi-layer precut application mode]
As shown in FIG. 9, the multi-layer precut original fabric R <b> 3 in which the adhesive sheet S is temporarily attached to one surface of the release sheet RL at a predetermined interval is set in the supply unit 12, and at a position past the nip roller 74. The lead end of the unnecessary sheet S1 is fixed to the second take-up roller 66, and the release sheet RL is fixed to the release sheet take-up shaft 67 via the release means 52 and the second feeding means 51. The support means 11 is maintained at a position indicated by a two-dot chain line in FIG. The unnecessary sheet S1 in the multi-layer pre-cut original fabric R3 is used to eliminate the pressing scratches and steps caused by the overlapping sheets S in the radial direction in a state where the unnecessary sheet S1 is wound in a roll shape without being present. It serves as a spacer provided.

  When the power is turned on, the cut detection means 70 detects the cut C and outputs an ON signal, and the adhesive sheet base material detection means 71 does not detect the adhesive sheet base material SB (unnecessary sheet S1). The detection means 72 detects the release sheet RL and outputs an ON signal to the control means 17. Based on the pattern of these signals, the control means 17 causes the currently set original fabric to be a multi-layer precut original fabric R3, feeds the multi-layer precut original fabric R3, and releases the adhesive sheet S from the release sheet RL. Thus, the multi-layer precut application mode to be applied to the ring frame RF and the wafer W is specified.

  When the control unit 17 specifies the multi-layer precut application mode, the control unit 17 outputs a signal for executing the multi-layer precut application mode. That is, while the operation signal is output to the support unit 11, the supply unit 12, the second feeding unit 51, the second unnecessary sheet winding unit 56, the release sheet winding unit 57, and the moving unit 26, the first notch Control is performed so as not to output an operation signal to the forming means 13, the second notch forming means 14, the first feeding means 50, and the first unnecessary sheet winding means 55.

  In this multi-layer precut sticking mode, before the sticking operation is performed, the multi-layer precut original fabric R3 is fed by the second feeding means 51, and the sticking sheet S is detected by a sensor (not shown) at the tip of the peeling means 52. Until it stops, it stops and enters the standby state. The subsequent operation is substantially the same as the multilayer immediately preceding cut pasting mode except that the operation of the second incision forming means 14 is not performed, and thus the description of the operation is omitted.

  As described above, in the present embodiment, each of the detection means 70 to 72 detects which of the original fabrics R1 to R3 is applied to the supply means 12, and the paste mode is automatically determined based on the detected signal pattern. Therefore, the sheet sticking apparatus 10 can be provided that can save the setting work by the operator and can stick the sticking sheet S efficiently.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the above embodiment, the case where the sticking sheet S is stuck to the ring frame RF and the wafer W is shown and described, but either one may be used as an adherend. Further, the adherend is not limited to the ring frame RF or the semiconductor wafer W, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. It may be a wafer or a compound wafer.

  Further, the first notch forming means 13 has a structure in which, for example, a cutter blade 34 is attached to the tip of a robot arm whose movement locus is taught along the outer periphery of the ring frame, or can be rotated and moved up and down in a plane. A structure attached to a possible simple arm may be employed.

  Further, as the multilayer precut original fabric R3, a type having no unnecessary sheet S1 acting as a spacer on the outer peripheral side of the sticking sheet S can be adopted. In this case, the control unit 17 performs control so that the second unnecessary sheet winding unit 56 is not driven.

  In the present embodiment, the case where the four pasting modes described above are selectively specified has been described. However, it is only necessary that at least two pasting modes can be executed, and further, it is difficult to increase the number of pasting modes. Absent.

The schematic front view of the sheet sticking apparatus which shows the state which performs single-layer aftercut sticking mode. The schematic perspective view of FIG. The block block diagram which shows the whole structure of the sheet sticking apparatus which concerns on this embodiment. Explanatory drawing which shows the state just before sticking of the adhesive sheet in single layer aftercut sticking mode. Explanatory drawing which shows the state which affixed the adhesive sheet in single layer aftercut sticking mode, and cut | disconnected the adhesive sheet base material. The schematic perspective view which shows the state which performs multilayer aftercut sticking mode. The schematic front view of the sheet sticking apparatus which shows the state which performs the multilayer immediately preceding cut sticking mode. FIG. 8 is a schematic perspective view of FIG. 7. The schematic perspective view which shows the state which performs multilayer precut sticking mode.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 11 Support means 12 Supply means 13 1st notch formation means 14 2nd notch formation means 16 Sticking means 17 Control means 19 Detection means 39 Pressing roller (pressing means)
41 Holding member (pressing means)
42 Pressing pad (pressing means)
50 First feeding means 51 Second feeding means 52 Peeling means 53 Press roller (pressing means)
55 First unnecessary sheet winding means 56 Second unnecessary sheet winding means 57 Release sheet winding means 70 Incision detection means 71 Adhesive sheet base material detection means 72 Release sheet detection means C Incision R1 Single layer original fabric R2 Layer original fabric R3 Multi-layer pre-cut original fabric RF Ring frame RL Release sheet S Adhesive sheet S1 Unnecessary sheet SB Adhesive sheet substrate W Semiconductor wafer (Substrate)

Claims (5)

  1. A single layer original made of a support means for supporting an adherend and a belt-like adhesive sheet substrate, or at least two layers of a multilayer raw material having a belt-like release sheet temporarily attached to the adhesive surface of the adhesive sheet substrate Alternatively, a supply means for supplying at least two layers of the multi-layer precut original fabric in which the adhesive sheet is temporarily attached to one surface of the strip-shaped release sheet at a predetermined interval, and a closed loop from the adhesive sheet substrate side to the original fabric An incision forming means for forming a sticking sheet by providing an incision, a sticking means for sticking the sticking sheet to an adherend, a plurality of detecting means for detecting the type of the original fabric, A sheet sticking device provided with a control means for predetermined control of each means according to the type,
    The control means includes a function for specifying one sticking mode from a plurality of preset sticking modes, and each means for specifying and executing the one sticking mode according to an output signal of the detecting means. The sheet sticking apparatus characterized by controlling.
  2. The plurality of pasting modes are:
    (A) The single-layer original fabric is fed to a relative position of the adherend and attached to the adherend, and then the adhesive sheet base material is cut out according to the size of the adherend to form an adhesive sheet. Layer aftercut application mode,
    (B) The adhesive sheet base material after the release sheet is peeled off from the multi-layer original fabric is fed out to the relative position of the adherend and attached to the adherend, and then the adhesive sheet base material is the size of the adherend. Multi-layer after-cut sticking mode that cuts out according to the shape of the sticking sheet,
    (C) In the course of feeding out the multi-layer original fabric, a cut sheet is provided in the adhesive sheet base material to form a sticking sheet, and the sticking sheet is peeled off from the peeling sheet and stuck on the adherend. mode,
    (D) A multi-layer pre-cut application mode in which the multi-layer pre-cut original fabric is fed out and the application sheet is released from the release sheet and applied to the adherend.
    Including
    The sheet sticking apparatus according to claim 1, wherein the control means specifies the one sticking mode from at least two sticking modes (A) to (D).
  3.   The pasting means is a means for feeding the original fabric, a peeling means for peeling the adhesive sheet base material or the sticking sheet from the release sheet, and pressing the adhesive sheet base material or the sticking sheet to the adherend. It is provided with pressing means, unnecessary sheet winding means for winding the adhesive sheet substrate portion located outside the sheet for sticking as an unnecessary sheet, and release sheet winding means for winding the release sheet. Item 3. A sheet sticking device according to item 1 or 2.
  4.   The detection means includes a notch detection means, an adhesive sheet base material detection means, and a release sheet detection means. One pasting mode specified from the signal combination pattern of each detection means, and input to the control means 4. The sheet sticking apparatus according to claim 1, wherein the sheet sticking mode is prohibited when the sticking mode does not match.
  5.   The notch detection means is disposed downstream of the supply means in the original fabric feeding direction, while the adhesive sheet base material detection means is disposed upstream of the unnecessary sheet winding means in the original fabric feeding direction, The sheet sticking device according to claim 3 or 4, wherein the release sheet detecting means is disposed downstream of the peeling means in the original roll feeding direction.
JP2007198251A 2007-07-31 2007-07-31 Sheet pasting device Active JP4801018B2 (en)

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JP4801018B2 JP4801018B2 (en) 2011-10-26

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011114272A (en) * 2009-11-30 2011-06-09 Lintec Corp Sheet pasting apparatus and pasting method
WO2014006956A1 (en) * 2012-07-06 2014-01-09 ニチゴー・モートン株式会社 Film-like resin laminating device
JP2014072229A (en) * 2012-09-27 2014-04-21 Lintec Corp Sheet sticking device and sheet sticking method
JP2014183095A (en) * 2013-03-18 2014-09-29 Lintec Corp Device and method for sticking sheet

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047823A (en) * 2002-07-12 2004-02-12 Tokyo Seimitsu Co Ltd Dicing tape sticking device and back grind dicing tape sticking system
JP2004237988A (en) * 2003-02-03 2004-08-26 Ishida Co Ltd Labeler
WO2006027953A1 (en) * 2004-09-06 2006-03-16 Lintec Corporation Tape applicator, tape mounter, and tape mounting method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047823A (en) * 2002-07-12 2004-02-12 Tokyo Seimitsu Co Ltd Dicing tape sticking device and back grind dicing tape sticking system
JP2004237988A (en) * 2003-02-03 2004-08-26 Ishida Co Ltd Labeler
WO2006027953A1 (en) * 2004-09-06 2006-03-16 Lintec Corporation Tape applicator, tape mounter, and tape mounting method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011114272A (en) * 2009-11-30 2011-06-09 Lintec Corp Sheet pasting apparatus and pasting method
WO2014006956A1 (en) * 2012-07-06 2014-01-09 ニチゴー・モートン株式会社 Film-like resin laminating device
JP2014017309A (en) * 2012-07-06 2014-01-30 Nichigo Morton Co Ltd Film-like resin lamination device
JP2014072229A (en) * 2012-09-27 2014-04-21 Lintec Corp Sheet sticking device and sheet sticking method
JP2014183095A (en) * 2013-03-18 2014-09-29 Lintec Corp Device and method for sticking sheet

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