JP7051379B2 - Film forming equipment and embedding processing equipment - Google Patents

Description

The present invention relates to a film forming apparatus for forming a film on an electronic component attached to a protective sheet, and an embedding processing apparatus for embedding the electronic component in the adhesive surface of the protective sheet.

Wireless communication devices such as mobile phones are equipped with a large number of electronic components such as semiconductor devices. Electronic components are transported from a processing device to a processing device in order to undergo various processes. A typical example of the treatment is the formation of an electromagnetic wave shielding film. The electromagnetic wave shield film suppresses the influence of electromagnetic waves on the inside and outside, such as leakage of electromagnetic waves to the outside, in order to prevent the influence on communication characteristics. Generally, an electronic component is formed by forming an outer shape with a sealing resin, and in order to shield electromagnetic waves, a conductive electromagnetic wave shielding film is provided on the top surface and side surfaces of the sealing resin (see Patent Document 1). ..

A plating method is known as a method for forming an electromagnetic wave shielding film. However, since the plating method requires a wet process such as a pretreatment step, a plating treatment step, and a posttreatment step such as washing with water, an increase in manufacturing cost of electronic parts is unavoidable. Therefore, the sputtering method, which is a dry process, is attracting attention. In the sputtering method, an inert gas is introduced into the vacuum vessel in which the target is placed, and a DC voltage is applied. Then, the ions of the inert gas turned into plasma collide with the target of the film-forming material, and the particles knocked out from the target are deposited on the electronic component. This deposited layer becomes an electromagnetic wave shielding film.

The film forming apparatus that realizes the sputtering method is a columnar chamber having a vacuum chamber inside, a rotary table housed in the chamber and having a rotation axis coaxial with the chamber, and a film forming position partitioned in the chamber. Has. By placing the electronic component on the rotary table and rotating the rotary table along the circumferential direction, the electronic component reaches the film forming position and the electromagnetic wave shielding film is formed. As described above, the rotary transfer of electronic components also exists in the processing apparatus.

In such transportation of electronic components inside and outside the device, the electronic components are subject to inertial force due to acceleration / deceleration, rotation, or the like, and there is a risk that the electronic components may tip over or fall out of the film forming position. Therefore, the electronic component is attached to the adhesive film, and undergoes transportation and formation of an electromagnetic wave shielding film. The adhesive force that resists the inertial force keeps the electronic component in the proper position.

Further, the adhesive film not only improves the staticity of the electronic component, but also prevents the particles of the electromagnetic wave shielding film from adhering to the electrodes during the film forming process, and maintains the insulation between the electrodes. Electrodes of electronic components are generally called solder ball bumps, and are formed by joining spherical solder (solder balls) having a diameter of several tens of μm to several hundreds of μm to pad electrodes of electronic components. That is, the electrodes of the electronic components are embedded in the flexible adhesive film, and the exposed electrode surface on which the electrodes are exposed is brought into close contact with the adhesive film. As a result, the electrode and the exposed electrode surface are covered with the adhesive film, so that the particles of the electromagnetic wave shielding film cannot enter between the exposed electrode surface and the adhesive film and do not reach the electrode.

International Publication No. 2013/035819 Japanese Unexamined Patent Publication No. 6-97268

When attaching an electronic component to an adhesive film, there is a risk that air bubbles may enter between the exposed electrode surface and the adhesive film. The entry of air bubbles causes a decrease in the adhesion between the electronic component and the adhesive film. Then, in the worst case, when the electronic components are transported between the devices or in the film forming apparatus, the electronic components that have lost the inertial force are peeled off from the adhesive film, and between the exposed electrode surface and the adhesive film. , There will be a gap leading to the electrode. During the film forming process, particles of the electromagnetic wave shielding film enter through the gaps and adhere to the electrodes. If particles of the electromagnetic wave shielding film adhere so as to crosslink between the electrodes, the insulation between the electrodes cannot be maintained.

As a technique for attaching the adhesive film, there is known a technique of pressing and attaching the adhesive film with a long member such as a long roller or a row of brushes (see Patent Document 2). However, it is difficult to uniformly press the adhesive film against all of the plurality of electronic components and the plurality of electrodes of the electronic components with such a long member. Therefore, in a place where the pressing is insufficient, a gap is generated between the exposed electrode surface and the adhesive film, and it is not possible to prevent the entry of air bubbles.

The present invention has been proposed to solve the above-mentioned problems, and prevents air bubbles from entering between an electronic component to be film-formed and a protective sheet to which the electronic component is attached, and is an electronic component. It is an object of the present invention to provide a film forming apparatus and an embedding processing apparatus capable of satisfactorily adhering a protective sheet to a film forming apparatus.

In order to achieve the above object, the present invention is a film forming apparatus for an electronic component in which an exposed electrode surface on which an electrode is formed is attached to an adhesive surface of a protective sheet.
An embedding processing unit that embeds the electrodes of the electronic component in the adhesive surface of the protective sheet, and
A film forming processing unit for forming a film forming material on the electronic component in which the electrode is embedded in the protective sheet, and a film forming processing unit.
Equipped with
The embedding processing unit is
A flat surface that is located opposite to the protective sheet with the electronic component in between and faces the electronic component.
At least, a decompression unit that decompresses the space between the protective sheet and the flat surface.
A pressure adjusting unit that adjusts the pressure in the space opposite to the flat surface with the protective sheet sandwiched between them.
A mounting surface located on the side opposite to the flat surface with the protective sheet sandwiched between them.
An air hole on the mounting surface side that opens in the above-mentioned mounting surface and generates a negative pressure prior to the decompression by the decompression unit to separate the protective sheet from the flat surface.
Have,
The pressure adjusting unit is the pressure in the space opposite to the space between the protective sheet and the flat surface in a state where the depressurization is maintained after the decompression of the space by the decompression unit. The electronic component and the protective sheet are pressed against each other with the flat surface as a pawl.
It is characterized by.

The pressure adjusting unit includes the air hole on the surface side described above, and the air hole on the surface side described above generates a positive pressure after the decompression of the space by the decompression unit and the depressurization is maintained. The protective sheet may be pressed against the electronic component stopped on the flat surface.

The embedding processing unit is
A flat surface that opens to the flat surface as the decompression unit or separately from the decompression unit to generate a negative pressure to attract the electronic component to the flat surface and to attract the protective sheet toward the flat surface. It may have a surface-side air hole.

Further, in order to achieve the above object, the present invention is a film forming apparatus for an electronic component in which an electrode exposed surface on which an electrode is formed is attached to an adhesive surface of a protective sheet.
An embedding processing unit that embeds the electrodes of the electronic component in the adhesive surface of the protective sheet, and
A plate mounting portion for attaching the protective sheet to a cooling plate having air holes penetrating the front and back in a range including an area where the electronic components are arranged, and a plate mounting portion.
A film forming processing unit for forming a film forming material on the electronic component of the protective sheet attached to the cooling plate, and a film forming processing unit.
After passing through the film-forming processing portion, a plate releasing portion for releasing the adhesion between the cooling plate and the protective sheet, and a plate releasing portion.
A peeling processing unit for peeling the electronic component from the protective sheet whose adhesion to the cooling plate has been released,
Equipped with
The embedding processing unit is
A flat surface located on the opposite side of the protective sheet across the electronic component and facing the electronic component,
A first decompression unit that decompresses at least the space between the protective sheet and the flat surface.
A pressure adjusting unit that adjusts the pressure in the space opposite to the flat surface with the protective sheet sandwiched between them.
A mounting surface located on the side opposite to the flat surface with the protective sheet sandwiched between them.
An air hole on the mounting surface side that opens in the above-mentioned mounting surface and generates a negative pressure prior to the decompression by the decompression unit to separate the protective sheet from the flat surface.
Have,
The pressure adjusting unit sandwiches the protective sheet rather than the space between the protective sheet and the flat surface in a state where the depressurization is maintained after the decompression of the space by the first decompression unit. The pressure in the space opposite to the flat surface is relatively increased, and the electronic component and the protective sheet are pressed against each other with the flat surface as a pawl.
The plate mounting portion is
It has a second decompression portion that decompresses the space between the region of the protective sheet in which the electronic components are arranged and the cooling plate.
After the decompression by the second decompression unit, the protective sheet and the cooling plate are pressed against each other.
The plate release portion is
A positive pressure generating hole that generates a positive pressure in the air hole of the cooling plate,
While pressurizing the region of the protective sheet where the electronic components are arranged through the positive pressure generating hole, the portion of the protective sheet that is out of the region where the electronic components are arranged is pressed down. It has a fixing portion that releases the presser after the area where the electronic components are arranged is separated from the cooling plate.
The peeling processing unit is
A mounting portion that supports the electronic component attached to the protective sheet, and a mounting portion that supports the electronic component.
A chuck that grips the end of the protective sheet, moves relative to the above-mentioned placement portion, and continuously peels off toward the opposite end of the end.
Having a fixing portion for fixing the position of the electronic component when the electronic component is peeled off from the protective sheet.
It is characterized by.

Further, in order to achieve the above object, the present invention presents the electronic component on the adhesive surface of the protective sheet with respect to the electronic component on which the exposed electrode surface on which the electrode is formed is attached to the adhesive surface of the protective sheet. It is an embedding processing device that embeds the electrodes of
A flat surface located on the opposite side of the protective sheet across the electronic component and facing the electronic component,
At least, a decompression unit that decompresses the space between the protective sheet and the flat surface.
A pressure adjusting unit that adjusts the pressure in the space opposite to the flat surface with the protective sheet sandwiched between them.
A mounting surface located on the side opposite to the flat surface with the protective sheet sandwiched between them.
An air hole on the mounting surface side that opens in the above-mentioned mounting surface and generates a negative pressure prior to the decompression by the decompression unit to separate the protective sheet from the flat surface.
Have,
The pressure adjusting unit is the pressure in the space opposite to the space between the protective sheet and the flat surface in a state where the depressurization is maintained after the decompression of the space by the decompression unit. The electronic component and the protective sheet are pressed against each other with the flat surface as a pawl.
It is characterized by.

According to the present invention, it becomes difficult for air bubbles to enter between the electronic component and the protective sheet, the adhesion between the electronic component and the protective sheet is improved, and the situation where the particles of the electromagnetic wave shielding film adhere to the electrode can be suppressed.

It is a side view which shows the electronic component which was film-formed. It is a side view which shows the state of the electronic component which undergoes a film formation process. It is an exploded perspective view which shows the state of the electronic component at the time of receiving a film forming process. It is a transition diagram which shows the film formation process flow of an electronic component. It is a block diagram which shows the structure of a film forming apparatus. It is a schematic diagram which shows the structure of the embedding processing part. It is a transition diagram which shows the state in each process of the embedding processing part schematically. It is an enlarged view between the electronic components in the embedding processing part. It is a schematic diagram which shows the structure of the plate mounting part. It is a transition diagram which shows the state in each process of a plate mounting part schematically. It is a schematic diagram which shows the structure of the film formation processing part. It is a schematic diagram which shows the structure of the plate release part. It is a transition diagram which shows the state in each process of a plate release part schematically. It is a schematic diagram which shows the other structure of the plate release part. It is a schematic diagram which shows the other structure of the plate release part. It is a schematic diagram which shows the structure of the peeling process part. It is a figure which shows the upper surface of the part embedded sheet in a peeling process part. It is a transition diagram which shows the state in each process of a peeling process part schematically. It is a schematic diagram which shows the mode of preventing the floating of an electronic component. It is a photograph which took a picture of an electrode after peeling an electronic component from a protective sheet by a peeling processing part. It is a top view which shows the other aspect of the part embedded sheet in a peeling process part. It is a top view which shows the other aspect of the sheet in which a part is embedded in the peeling process part. It is a top view which shows the other aspect of the sheet in which a part is embedded in the peeling process part. It is a block diagram which shows the other structure of the film forming apparatus. It is a schematic diagram which shows the structure of the conventional push-up device. It is a schematic diagram which shows the push-up of an electronic component in a conventional push-up device. It is a photograph showing the state of the electrode after the adhesive film is reattached to the electronic component.

(Electronic parts)
FIG. 1 is a side view showing an electronic component that has been film-formed. As shown in FIG. 1, an electromagnetic wave shielding film 605 is formed on the surface of the electronic component 60. The electronic component 60 is a surface mount component such as a semiconductor chip, a diode, a transistor, a capacitor, or a SAW filter. A semiconductor chip is an integrated circuit such as an IC or LSI in which a plurality of electronic elements are integrated. This electronic component has a substantially rectangular parallelepiped shape such as BGA, LGA, SOP, QFP, WLP, etc., and one surface thereof is an electrode exposed surface 601. The electrode exposed surface 601 is a surface on which the electrode 602 is exposed, faces the mounting substrate, and is connected to the mounting substrate. The electrode 602 is an electrode called a ball bump or a solder ball bump, and is formed by mounting a spherically formed solder (solder ball) having a diameter of several tens of μm to several hundreds of μm on a pad electrode.

The electromagnetic wave shielding film 605 shields electromagnetic waves. The electromagnetic wave shielding film 605 is formed of, for example, a material such as Al, Ag, Ti, Nb, Pd, Pt, Zr or the like. The electromagnetic wave shielding film 605 may be formed of a magnetic material such as Ni, Fe, Cr, or Co. Further, SUS, Ni, Ti, V, Ta or the like may be formed as the base layer of the electromagnetic wave shielding film 605, and SUS, Au or the like may be formed as the outermost protective layer.

The electromagnetic wave shielding film 605 is formed on the top surface 603 and the side surface 604 of the electronic component 60, that is, on the outer surface other than the electrode exposed surface 601. The top surface 603 is the surface opposite to the electrode exposed surface 601. The side surface 604 is an outer peripheral surface that connects the top surface 603 and the electrode exposed surface 601 and extends at an angle different from that of the top surface 603 and the electrode exposed surface 601. In order to obtain the shielding effect of blocking electromagnetic waves, the electromagnetic wave shielding film 605 may be formed at least on the top surface 603. A ground pin (not shown) exists on the side surface 604. The formation of the electromagnetic wave shielding film 605 with respect to the side surface is also for grounding the electromagnetic wave shielding film 605.

(During film formation processing)
FIG. 2 is a side view showing a state of an electronic component after undergoing a film forming process. Further, FIG. 3 is an exploded perspective view showing a state of an electronic component when undergoing a film forming process. As shown in FIGS. 2 and 3, in the electronic component 60, the electrode 602 is embedded in the protective sheet 61 in advance, and the electrode exposed surface 601 is in close contact with the protective sheet 61. By embedding the electrode 602 in the protective sheet 61, the particles of the electromagnetic wave shielding film 605 are prevented from reaching the electrode 602. Further, due to the close contact between the electrode exposed surface 601 and the protective sheet 61, there is no room for the particles of the electromagnetic wave shielding film 605 to enter between the electrode exposed surface 601 and the protective sheet 61, and the particles of the electromagnetic wave shielding film 605 can reach the electrode 602. The sex is reduced.

The protective sheet 61 is a heat-resistant synthetic resin such as PEN (polyethylene naphthalate) and PI (polyimide). One surface of the protective sheet 61 is an adhesive surface (adhesive layer) 611 having the flexibility that the electrode 602 bites into and the adhesiveness that the exposed electrode surface 601 adheres to. As the adhesive surface 611, various adhesive materials such as silicone-based and acrylic-based resins, urethane resins, and epoxy resins are used.

The adhesive surface 611 has an outer frame area 613 extending inward from the end of the protective sheet 61 to a predetermined distance, an inner frame area 614 extending inward from the inner circumference of the outer frame area 613 to the inside, and an inner side of the inner frame area 614. It is divided into the component arrangement area 615 of. The electronic component 60 is attached to the component array area 615. A frame-shaped frame 62 is attached to the outer frame area 613. The middle frame region 614 is a range in which the protective sheet 61 is bent, and neither the frame 62 nor the electronic component 60 can be attached. The opposite surface of the adhesive surface 611 is a non-adhesive surface 612.

The protective sheet 61 is attached to the cooling plate 63 via the adhesive sheet 64. The cooling plate 63 is made of a metal such as SUS, ceramics, a resin, or other material having high thermal conductivity. The cooling plate 63 is a heat dissipation path that dissipates heat from electronic components and suppresses excessive heat storage. The adhesive sheet 64 has adhesiveness on both sides, enhances the adhesion between the protective sheet 61 and the cooling plate 63, and secures a heat transfer area to the cooling plate 63.

The height H1 from the surface of the component arrangement region 615 to the upper end surface of the frame 62 is higher than the height H2 from the surface of the component arrangement region 615 to the top surface 603 of the electronic component 60. The height H1 may be paraphrased as the thickness H1 for convenience, but it has the same meaning. In short, assuming that a flat plate is placed on the frame 62, the top surface 603 of the electronic component 60 does not reach the flat plate.

A guide portion insertion hole 621 is formed at one end of the frame 62. The guide portion insertion hole 621 has an opening such as a long oval, a rectangle, or a round circle along the end of the frame 62, and is formed through a surface to be attached to the protective sheet 61 and an exposed surface opposite to the surface. ing. That is, for example, when a rod-shaped member is inserted into the guide portion insertion hole 621 and the end of the protective sheet 61 is pushed (see FIG. 18), one end of the protective sheet 61 is peeled off from the frame 62.

A pusher insertion hole 631 is formed in the cooling plate 63 and the adhesive sheet 64. The pusher insertion hole 631 does not match the guide portion insertion hole 621 and is inserted at a position where the pusher insertion hole 631 is closed by the frame 62. When a rod-shaped member is inserted into the pusher insertion hole 631 and the frame 62 is pushed up by the tip of the rod-shaped member, a plurality of pusher insertion holes 631 are formed so that the entire frame 62 is lifted in parallel. For example, if the frame 62 is a frame body having a rectangular outer shape, the pusher insertion holes 631 are located at the four corners or further at the center of each side. From the viewpoint of maintaining parallelism of the frame 62, it is desirable that the rod-shaped member has a rectangular tip surface, that is, a thin plate shape, an L-shaped cross section, or the like, but the rod-shaped member is not limited to this and has a round tip surface. You may have. The pusher insertion hole 631 has a corresponding rectangular, L-shaped or round circular shape.

Further, the cooling plate 63 and the adhesive sheet 64 are formed with a large number of fine air holes 632 at equal intervals over the entire range to which the middle frame region 614 and the component arrangement region 615 of the protective sheet 61 are attached. The air hole 632 has, for example, a minute cylindrical shape or a slit shape. The air hole 632 is provided in order to apply a negative pressure or a positive pressure evenly through the air hole 632 to at least the component arrangement region 615 of the protective sheet 61 attached to the cooling plate 63. The number of air holes 632, the penetration interval, and the penetration range are not limited to this. For example, even if the air holes 632 are provided only in the range corresponding to the component placement area 615, the center of the cooling plate 63 and the adhesive sheet 64. The air holes 632 may be densely arranged in the air holes 632, while the outside may be sparsely arranged, or only one may be provided at a position corresponding to the center of the component placement area 615.

(Film formation process flow)
In the film forming process, the electromagnetic wave shielding film 605 is formed and separated into individual pieces through a component mounting process, a component embedding process, a plate mounting process, a film forming process, a plate removing process, and a component peeling process. Is obtained.

FIG. 4 is a diagram showing a film forming process flow of electronic components. As shown in FIG. 4, in the component mounting process, the component arrangement is performed with the electrode exposed surface 601 of the electronic component 60 facing the component unmounted sheet 65 to which the frame 62 is attached to the protective sheet 61. The electronic components 60 are arranged in the area 615. A state in which the frame 62 is attached to the protective sheet 61 and the electronic components 60 are further arranged, but the electrodes 602 are not yet embedded is referred to as a component-mounted sheet 66.

In the component embedding step, the electrode 602 is embedded in the protective sheet 61 with respect to the component-mounted sheet 66, and the electrode exposed surface 601 is brought into close contact with the protective sheet 61. Regardless of whether the electromagnetic wave shielding film 605 is formed or not formed, the state in which the electrode 602 is embedded in the protective sheet 61 is referred to as a component-embedded sheet 67. In the plate mounting step, the component-embedded sheet 67 is brought into close contact with the cooling plate 63 via the adhesive sheet 64. The state in which the cooling plate 63 is mounted is referred to as a component mounting plate 68.

In the film forming step, particles of the electromagnetic wave shielding film 605 are deposited from the top surface 603 side of the electronic component 60 to form the electromagnetic wave shielding film 605 on the electronic component 60. At this time, the electrode 602 of the electronic component 60 is embedded in the protective sheet 61, and the exposed electrode surface 601 is in close contact with the protective sheet 61, so that the particles of the electromagnetic wave shielding film 605 are prevented from adhering to the electrode 602. To.

In the plate release step, the cooling plate 63 is removed and returned to the form of the component-embedded sheet 67. Then, in the component peeling step, the electronic component 60 is peeled from the protective sheet 61 and separated into the component unmounted sheet 65 and the individual electronic component 60. Further, the protective sheet 61 is peeled off from the frame 62 in preparation for reuse of the frame 62. This completes the film forming process.

(Film formation device)
Of the above film formation process flows, FIG. 5 shows a film forming apparatus responsible for a component embedding process, a plate mounting process, a film forming process, a plate releasing process, and a component peeling process. As shown in FIG. 5, the film forming apparatus 7 includes an embedding processing unit 1, a plate mounting unit 2, a film forming processing unit 3, a plate releasing unit 4, and a peeling processing unit 5. Each unit is connected by a transport unit 73, members required for each process are input, and members that have been processed in each process are discharged. The transport unit 73 is, for example, a conveyor, and may be a transport table that is movable along a straight track with a ball screw or the like.

Further, the film forming apparatus 7 includes a CPU and a ROM that control the operation timing of each component included in the embedding processing unit 1, the plate mounting unit 2, the film forming processing unit 3, the plate releasing unit 4, and the peeling processing unit 5. A control unit 74 such as a computer or a microcomputer having a RAM and a signal transmission circuit is housed. Further, an pneumatic circuit 75 that supplies positive pressure or negative pressure to the embedding processing unit 1, the plate mounting unit 2, the film forming processing unit 3, the plate releasing unit 4, and the peeling processing unit 5 is accommodated. The control unit 74 also controls the solenoid valve in the pneumatic circuit 75, and switches between negative pressure generation, negative pressure release, positive pressure generation, and positive pressure release.

(Embedding processing unit)
The embedding processing unit 1 responsible for the component embedding process will be described. FIG. 6 is a schematic diagram showing the configuration of the embedding processing unit 1. The component-mounted sheet 66 is loaded into the embedding processing unit 1. The embedding processing unit 1 draws the protective sheet 61 toward the electronic component 60 while restraining the electronic component 60, and presses the protective sheet 61 against the electronic component 60. As a result, the embedding processing unit 1 causes the electrode 602 of the electronic component 60 to bite into the protective sheet 61, and further brings the electrode exposed surface 601 into close contact with the protective sheet 61.

As shown in FIG. 6, the embedding processing unit 1 includes a ceiling unit 11 and a mounting table 12. The ceiling portion 11 and the mounting table 12 are both blocks having internal spaces 111 and 121. The ceiling portion 11 and the mounting table 12 are arranged to face each other, and have flat surfaces 112 and 122 parallel to each other on the facing side. Both flat surfaces 112 and 122 have the same shape as the component-mounted sheet 66, or are wider than the component-mounted sheet 66. The mounting table 12 is immovable. On the other hand, the ceiling portion 11 can be raised and lowered with respect to the mounting table 12. The ceiling portion 11 approaches the mounting table 12 at least up to a distance of the thickness H1 of the frame 62 of the component-mounted sheet 66.

A component-mounted sheet 66 is placed on the mounting table 12. The flat surface 122 of the mounting table 12 is the mounting surface of the component-mounted sheet 66. The flat surface 122 is made of an adhesive non-slip member. Further, a large number of air holes 123 leading to the internal space 121 are formed through the flat surface 122 of the mounting table 12. The penetration range of the air hole 123 is the same size as the inside of the frame 62 of the component-mounted sheet 66, or at least the same shape as the component arrangement area 615. The penetration position of the air hole 123 is a position facing the inner region of the frame 62 or a position facing the component arrangement region 615 when the component mounted sheet 66 is mounted on the mounting table 12.

In the internal space 121 of the mounting table 12, an air pressure supply hole 124 is further formed at a position different from the flat surface 122. The air pressure supply hole 124 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe, a positive pressure supply pipe, and the like (not shown). Therefore, positive pressure or negative pressure is selectively generated in the air hole 123 through the air pressure supply hole 124 and the internal space 121. The air hole 123, the air pressure supply hole 124, and the air pressure circuit 75 function as a pressure adjusting unit.

Further, the flat surface 122 of the mounting table 12 is opened with a pusher insertion hole 125 penetrating the mounting table 12. The pusher insertion hole 125 is provided outside the penetration range of the air hole 123. Specifically, the penetration position of the pusher insertion hole 125 is a position where the guide portion insertion hole 621 of the frame 62 is avoided and the frame 62 closes when the component-mounted sheet 66 is mounted. A pusher 13 is inserted through the pusher insertion hole 125. The pusher 13 can appear and disappear from the flat surface 122 of the mounting table 12. When the pusher 13 protrudes from the pusher insertion hole 125, the component-mounted sheet 66 is separated from the mounting table 12, lifted in parallel, and installed with sufficient rigidity, number, and arrangement intervals to support it. For example, if the outer shape of the frame 62 is rectangular, the rods are arranged corresponding to each corner of the frame 62.

Next, a large number of air holes 113 leading to the internal space 111 are also formed in the flat surface 112 of the ceiling portion 11. The penetrating range of the air hole 113 is a range having the same shape as the inside of the frame 62 of the component-mounted sheet 66, or at least the same shape as the component arrangement area 615, and extends over the entire component arrangement area 615. The penetration position of the air hole 113 is a position facing the inner region of the frame 62 or a position facing the component arrangement region when the component mounted sheet 66 is mounted on the mounting table 12.

An air pressure supply hole 114 is formed in the internal space 111 of the ceiling portion 11 at a position different from that of the flat surface 112. The air pressure supply hole 114 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe, and the like (not shown). Therefore, a negative pressure is generated in the air hole 113 through the air pressure supply hole 114 and the internal space 111. The air hole 113, the air pressure supply hole 114, and the air pressure circuit 75 function as a decompression unit.

Further, on the flat surface 112 of the ceiling portion 11, an O-ring 115 surrounding the penetration range of the air hole 113 is installed along the frame 62 of the component-mounted sheet 66 mounted on the mounting table 12.

FIGS. 7A to 7G show the flow of operation of the embedding processing unit 1. 7 (a) to 7 (g) are transition diagrams schematically showing the states of the embedding processing unit 1 in each step. First, as shown in FIG. 7A, the component-mounted sheet 66 is loaded into the embedding processing unit 1. The ceiling portion 11 is sufficiently separated from the mounting table 12, and the tip of the pusher 13 projects from the flat surface 122 of the mounting table 12. When the component-mounted sheet 66 is loaded, the frame 62 of the component-mounted sheet 66 is aligned with the pusher 13 , and the component-mounted sheet 66 is supported by the pusher 13 .

Next, as shown in FIG. 7B, the pusher 13 is retracted into the pusher insertion hole 125. As a result, the component-mounted sheet 66 descends to the flat surface 122 of the mounting table 12. Further, the ceiling portion 11 is moved toward the mounting table 12. Then, the frame 62 of the component-mounted sheet 66 is sandwiched between the flat surface 112 of the ceiling portion 11 and the flat surface 122 of the mounting table 12. The height H1 from the surface of the component arrangement region 615 to the upper end surface of the frame 62 is higher than the height H2 from the surface of the component arrangement region 615 to the top surface 603 of the electronic component 60. Therefore, when the frame 62 is sandwiched, the top surface 603 of the electronic component 60 does not reach the flat surface 112 of the ceiling portion 11. Therefore, the component arrangement area 615 on which the electronic component 60 is placed is confined in the closed space 14 surrounded by the flat surface 112 of the ceiling portion 11, the protective sheet 61, and the frame 62 and sealed by the O-ring 115.

When the component arrangement region 615 is confined in the closed space 14, a negative pressure is generated in the air holes 123 of the mounting table 12 and the protective sheet 61 is attracted to the flat surface 122 as shown in FIG. 7 (c). Subsequently, as shown in FIG. 7D, a negative pressure is also generated in the air hole 113 of the ceiling portion 11 to reduce the pressure in the closed space 14 in which the component arrangement region 615 is confined. It is desirable that the degree of depressurization is close to vacuum because the pressure exerted by both air holes 113 and 123 is the same. The reason why the air holes 123 of the mounting table 12 generate negative pressure in advance is that the protective sheet 61 is attracted to the mounting table 12 so that the lower side of the protective sheet 61 is in the process of depressurizing the sealed space 14. This is to prevent the air pressure from becoming excessive with respect to the air pressure on the upper side , and thereby preventing the electronic component 60 from vigorously rushing into the flat surface 112 of the ceiling portion 11. At this stage, since the electronic component 60 is placed on the protective sheet 61 in a state where the electrode 602 is not embedded in the adhesive surface 611 of the protective sheet 61, it is placed between the electrode exposed surface 601 and the adhesive surface 611. There is a gap, and this gap is also depressurized.

When the depressurization is completed, as shown in FIG. 7 (e), the air hole 123 on the mounting table 12 side is gradually changed from the negative pressure to the positive pressure while maintaining the negative pressure on the ceiling portion 11 side, and the mounting table is completed. The air holes 123 of 12 are converted to positive pressure. The electronic component 60 and the protective sheet 61 are gently sucked up by the flat surface 112 of the ceiling portion 11 and gently pushed up. The electronic component 60 is pressed against the flat surface 112 of the ceiling portion 11 and stopped. On the other hand, since the adhesive surface 611 of the protective sheet 61 is flexible, it is further attracted to the flat surface 112 even after the electronic component 60 is stopped, and is further pushed up toward the flat surface 112.

Then, the electrode 602 of the electronic component 60 is embedded in the adhesive surface 611 of the protective sheet 61, more specifically, the protective sheet 61, and the electrode exposed surface 601 of the electronic component 60 is in close contact with the protective sheet 61. At this time, the flat surface 112 of the ceiling portion 11 includes the component arrangement area 615, and the component arrangement area 615 is made to imitate flat. In other words, the component array region 615 does not bend. Therefore, it is possible to prevent insufficient embedding of the electrode 602 or insufficient adhesion of the exposed electrode surface 601 at the end of the component arrangement region 615.

The contact process between the exposed electrode surface 601 and the protective sheet 61 is performed in a reduced pressure environment, and there is no or very little air in the closed space. Therefore, the possibility of air bubbles entering between the exposed electrode surface 601 and the protective sheet 61 is low.

Further, FIG. 8 is an enlarged view of the electronic components 60 in the embedding processing unit 1. As shown in FIG. 8, the positive pressure generated in the mounting table 12 pushes up at least the component arrangement region 615 of the protective sheet 61 without unevenness. Then, the flexible protective sheet 61 is further pushed toward the flat surface 112 of the ceiling portion 11 in each gap between the adjacent electronic components 60 without being blocked by the electronic components 60. Then, the adhesive surface 611 of the protective sheet 61 rises up to the lower side surface of the electronic component 60, and the protective sheet 61 also adheres to the lower side surface of the electronic component 60. Therefore, it is possible to more reliably prevent particles of the electromagnetic wave shielding film 605 from entering between the electrode exposed surface 601 and the protective sheet 61.

When the electrode 602 of the electronic component 60 is embedded in the protective sheet 61 and the exposed electrode surface 601 of the electronic component 60 and the lower side surface are in close contact with the protective sheet 61, the pusher 13 is pushed by the pusher 13 as shown in FIG. 7 (f). It is moved axially along the insertion hole 125 and reappears from the flat surface 122 of the mounting table 12. At the same time, the ceiling portion 11 is separated from the mounting table 12 at the same speed as the traveling speed of the pusher 13. Finally, as shown in FIG. 7 (g), the pusher 13 is stopped, and the ceiling portion 11 is further separated from the mounting table 12, so that the sandwiching of the component-embedded sheet 67 is released. As a result, the embedding of the electronic component 60 in the protective sheet 61 by the embedding processing unit 1 is completed.

The negative pressure on the ceiling portion 11 side and the positive pressure on the mounting table 12 side are shown in FIG. 7 (e) after the contact of the electrode exposed surface 601 of the electronic component 60 with the protective sheet 61 is completed. It may be released before the ceiling portion 11 is raised. Regarding the negative pressure on the ceiling portion 11 side, if the negative pressure on the ceiling portion 11 side is released immediately before the ceiling portion 11 is raised in FIG. 7 (g), the electronic component 60 is stabilized on the protective sheet 60 when the pusher 13 is raised in FIG. 7 (f). It is preferable because it can be held.

In this way, the ceiling portion 11 and the mounting base 12 are fixed portions for sandwiching the component-mounted sheet 66 by sandwiching the frame 62 from both sides. Further, the ceiling portion 11, the protective sheet 61, and the frame 62 define a closed space 14 for confining the component arrangement area 615. The O-ring 115 enhances the reliability of the closed space 14 by sealing. Further, the air hole 113 of the ceiling portion 11 is a decompression portion for depressurizing the closed space 14.

The flat surface 122 of the mounting table 12 serves as a mounting surface for the component-mounted sheet 66. The air hole 123 that opens in the flat surface 122 of the mounting table 12 generates a negative pressure prior to the decompression of the closed space 14 to prevent the electronic component 60 from rushing into the flat surface 112 of the ceiling portion 11. As a preventive means, the component arrangement region 615 is pressed against the flat surface 112 of the ceiling portion 11 by a positive pressure in combination with the negative pressure of the ceiling portion 11 to serve as a pressing means for embedding the electrode 602 of the electronic component 60.

Further, the flat surface 112 of the ceiling portion 11 is a flattening means that imitates the component arrangement region 615 flat and enhances the burying effect of the electrode 602 and the adhesion effect of the exposed electrode surface 601. The air hole 113 that opens in the flat surface 112 of the ceiling portion 11 presses the component arrangement region 615 against the flat surface 112 of the ceiling portion 11 by a negative pressure in combination with the positive pressure of the mounting table 12, and the electrode 602 of the electronic component 60. The suction means for burying the protective sheet 61, combined with the positive pressure of the mounting table 12, sucks the protective sheet 61 into the gap between the electronic components 60 and makes the protective sheet 61 adhere to the lower side surface of the electronic component 60.

In this way, the embedding processing unit 1 embeds the electrode 602 of the electronic component 60 in the adhesive surface 611 of the protective sheet 61, but has a decompression unit that reduces the pressure in the space including the electronic component 60 and the component arrangement region 615. I tried to have it. Then, after the depressurization, the electronic component 60 and the protective sheet 61 are pressed against each other. As a result, air bubbles do not enter between the electronic component 60 and the protective sheet 61 and the adhesion is not insufficient, the possibility that a gap is formed between the electronic component 60 and the protective sheet 61 is reduced, and the electromagnetic wave shielding film 605 It is possible to avoid the situation where the particles adhere to the electrode 602.

Further, the embedding processing unit 1 is provided with a flat surface 112 of the ceiling portion 11 and a pressure adjusting unit that adjusts the pressure in the space on the opposite side of the flat surface 112 with the protective sheet 61 interposed therebetween. The flat surface 112 is located opposite to the protective sheet 61 with the electronic component 60 interposed therebetween, and faces the electronic component 60. Further, for example, the air hole 123, the air pressure supply hole 124, and the air pressure circuit 75 are examples of the pressure adjusting unit. This pressure adjusting portion is the pressure in the space between the mounting table 12 and the protective sheet 61, that is, the space on the side opposite to the flat surface 112 with the protective sheet 61 interposed therebetween, rather than the space between the protective sheet 61 and the flat surface 112. Was made relatively large.

As a result, the electronic component 60 and the protective sheet 61 are directed toward the flat surface 112, and the flat surface 112 is used as a pawl so that the electronic component 60 and the protective sheet 61 are pressed against each other. Therefore, the component arrangement region 615 of the protective sheet 61 follows a flat surface, and the electrode exposed surface 601 of the electronic component 60 and the protective sheet 61 are pressed against each other in a parallel state. Therefore, there is no room for bubbles to enter.

The thicknesses of the electronic component 60 and the protective sheet 61 are not uniform and vary. Since the differential pressure between the pressure of the closed space 14 and the pressure between the mounting table 12 and the protective sheet 61 can apply a force to evenly press the electronic component 60 and the protective sheet 61 regardless of the variation in the thickness, a plurality of pressures can be applied. A sufficient pressing force can be reliably applied between each of the plurality of electrodes 602 of the electronic component 60 and the adhesive surface 611 of the protective sheet 61, and each electrode 602 of each electronic component 60 can be embedded in the protective sheet 61. can.

Further, the embedding processing unit 1 has a flat surface 122 of the mounting table 12, that is, a mounting surface located opposite to the flat surface 112 with the protective sheet 61 interposed therebetween. Then, an air hole 123 was formed in the mounting table 12 by opening the mounting surface and generating a negative pressure prior to depressurization to separate the protective sheet 61 from the flat surface 112. As a result, it is possible to prevent the electronic component 60 from being damaged by vigorously rushing the electronic component into the flat surface 112 during depressurization.

The air hole 113 of the ceiling portion 11 and the air hole 123 of the mounting table 12 that press the electronic component 60 and the protective sheet 61 together were used as the decompression part, but a third air hole was separately formed in the closed space 14, and the third air hole was formed. A negative pressure may be generated in the air hole of No. 3 to reduce the pressure.

Further, the air hole 123 on the mounting table 12 side turns to generate positive pressure after depressurization, and the protective sheet 61 is further pressed against the electronic component 60 stopped by the flat surface 112. As a result, the adhesive surface 611 rises together with the protective sheet 61 in the gap between the electronic components 60, and the lower side surface of the electronic component 60 can also be covered with the protective sheet 61. Therefore, it is possible to reliably prevent a gap from being formed between the exposed electrode surface 601 and the protective sheet 61. Further, even in the case of electronic components such as SOP and QFP having a thin plate-shaped electrode at the lower part of the side surface, the electrode 602 can be covered with the protective sheet 61 to prevent the particles of the electromagnetic wave shielding film 605 from adhering to the electrode. The membrane device 7 can be applied.

In this embodiment, a negative pressure is generated in the ceiling portion 11, and a positive pressure is generated in the mounting table 12 on the side opposite to the ceiling portion 11 with the protective sheet 61 interposed therebetween. The first is to press the electronic component 60 and the protective sheet 61 against each other, and the second is to raise the adhesive surface 611 in the gap between the electronic components 60 to cover the lower side surface.

However, in order to achieve pressing the electronic component 60 and the protective sheet 61 against each other, a differential pressure of this magnitude is not essential. The differential pressure at which the electrode 602 of the electronic component 60 is embedded in the protective sheet 61 depends on the flexibility of the protective sheet 61, and the negative pressure on the mounting table 12 side is applied without turning the mounting table 12 side to positive pressure. It may be weaker than the negative pressure on the ceiling portion 11 side. That is, relatively large means that the ceiling portion 11 side has a negative pressure and the mounting table 12 has a positive pressure including atmospheric pressure, and the negative pressure of the mounting table 12 is higher than the negative pressure on the ceiling portion 11 side. It suffices to create a differential pressure that allows the electrode 602 to be embedded in the protective sheet 61 by the ceiling portion 11 side and the mounting table 12 side, including the case where the pressure is lower than the atmospheric pressure.

However, the electronic component 60 and the protective sheet are generated by the differential pressure between the negative pressure on the ceiling portion 11 side and the atmospheric pressure generated on the mounting table 12 on the opposite side of the protective sheet 61 with the protective sheet 61 sandwiched between them, or the pressure exceeding the atmospheric pressure. When pressing the 61, a large pressing force can be applied, so that a sufficient pressing force is surely given between the plurality of electrodes 602 of each of the plurality of electronic components 60 and the adhesive surface 611 of the protective sheet 61. And each electrode 602 of each electronic component 60 can be embedded in the protective sheet 61.

Further, the protective sheet 61 is pushed up by the differential pressure, but the amount of pushing up of the component arrangement region 615 is determined by the flat surface 112. That is, since the amount of deformation of the protective sheet 61 is defined by the flat surface 112, the pushing force due to the differential pressure is also applied to the gap between the electronic components 60 in the component arrangement region 615. At this time, since the gap between the electronic components 60 is not in contact with the flat surface 112, there is a decompression space above the gap. Therefore, the adhesive surface 611 of the gap portion is raised by the differential pressure together with the protective sheet 61, and the lower side surface of the electronic component 60 can also be covered with the protective sheet 61.

Therefore, in the present embodiment, in order to cover the lower side surface of the electronic component 60, a negative pressure is generated in the ceiling portion 11 and a positive pressure is generated in the mounting table 12, so that the component arrangement region 615 is flattened by the ceiling portion 11. It was pressed against the surface 112. However, depending on the flexibility of the protective sheet 61, the adhesive surface 611 is between the electronic components 60 even if the pressure is not the difference between the pressure close to the vacuum on the ceiling portion 11 side and the atmospheric pressure on the mounting table 12 side or the pressure exceeding the atmospheric pressure. May be uplifted in the gap. Therefore, in order to cover the lower part of the side surface of the electronic component 60, it is desirable to turn the mounting table 12 side to positive pressure, but it is not essential to adjust the mounting table 12 side to positive pressure. That is, it suffices if the differential pressure can be adjusted according to the flexibility of the protective sheet 61, and depending on the flexibility of the protective sheet 61, the negative pressure may be weakened even if the pressure on the mounting table 12 side does not reach the atmospheric pressure after the decompression is completed. You may.

Further, the electromagnetic wave shielding film 605 described later can improve the shielding performance by connecting to the ground wiring of the electronic component 60. This ground wiring is wiring for letting unnecessary electromagnetic waves escape to the outside, and is generally formed on the side surface of the electronic component 60. It is necessary to avoid obstructing the connection between the electromagnetic wave shielding film 605 and the ground wiring due to the protrusion of the adhesive surface 611 leading to the lower part of the side surface of the electronic component 60.

Since the embedding processing unit 1 can independently adjust the pressures on the ceiling portion 11 side and the mounting table 12 side to create a desired differential pressure, the height of the ridge reaching the lower side surface of the electronic component 60 is adjusted. It can be controlled uniformly on the lower side surface of the electronic component 60. That is, by bringing the lower part of the side surface into close contact with the protective sheet 61, the gap leading to the electrode 602 is more reliably sealed, or the electronic component 60 is SOP, QFP, etc., and the electrode on the lower side surface is embedded in the protective sheet 61 while the side surface is embedded. The protective sheet 61 does not reach the ground wiring of 604, and the ground wiring can be exposed.

A known mechanism can be applied to the operation mechanism of the ceiling portion 11 and the operation mechanism of the pusher 43, and the present invention is not limited to the mechanism of the mechanism.

For example, the ceiling portion 11 is connected to a ball screw whose axis is extended in the direction from the ceiling portion 11 toward the mounting table 12 and a rail guide extending in the direction from the ceiling portion 11 toward the mounting table 12. The ceiling portion 11 moves toward the mounting table along the rail according to the rotation direction of the screw shaft. In the ceiling portion 11, the ball screw and the rail guide extend so that the ceiling portion 11 approaches the mounting base 12 up to the distance of the thickness H1 of the frame 62 of the component-mounted sheet 66. Since it is sufficient that the ceiling portion 11 and the mounting table 12 can be moved relatively, the ceiling portion 11 is not limited to the one that moves, and the mounting table 12 may be moved, or the ceiling portion 11 and the mounting table 12 may be moved. Both of them may move.

Further, the pusher 13 has a cam follower at the rear end. The cam follower follows the peripheral surface of the egg-shaped cam. The cam is pivotally supported by a rotary motor and can rotate in the circumferential direction. When the rotary motor is driven and the cam rotates, the cam follower climbs the bulging portion of the cam, the pusher 13 is pushed up, and the tip of the pusher 13 protrudes from the insertion hole.

Further, as a method of fixing the component-mounted sheet 66, the frame 62 is sandwiched between the ceiling portion 11 and the mounting base 12, and the sealed space 14 is defined by the ceiling portion 11, the mounting base 12, and the frame 62. Both positive pressure and negative pressure are selectively generated in the air holes 123 of the mounting table 12, but the pressure is not limited to these. For example, one or both of the ceiling portion 11 and the mounting table 12 may be shaped like a cup, and the component-mounted sheet 66 may be accommodated in the internal space defined by the ceiling portion 11 and the mounting table 12. A block body for sandwiching the frame 62 from both sides may be provided, and the component-mounted sheet 66 may be sandwiched between the block bodies. In this case, the height of the frame 62 does not matter. Both a through hole for generating a negative pressure and a through hole for generating a positive pressure may be formed on the flat surface 122 of the mounting table 12.

(Plate mounting part)
Next, the plate mounting portion 2 responsible for the plate mounting process will be described. FIG. 9 is a schematic view showing the configuration of the plate mounting portion 2. The component-embedded sheet 67 created by the embedding processing unit 1 and the cooling plate 63 to which the adhesive sheet 64 is previously attached are put into the plate mounting unit 2. The plate mounting portion 2 presses the component-embedded sheet 67 against the cooling plate 63 and attracts the component-embedded sheet 67 to the cooling plate 63 to cool the component-embedded sheet 67 via the adhesive sheet 64. Adhere to 63.

As shown in FIG. 9, the plate mounting portion 2 includes a ceiling portion 21 and a mounting table 22. The ceiling portion 21 and the mounting table 22 are arranged so as to face each other. The mounting table 22 is immovable. On the other hand, the ceiling portion 21 can be raised and lowered with respect to the mounting table 22. The ceiling portion 21 approaches the mounting table 22 at least up to a distance of the thickness H1 of the frame 62 of the component-embedded sheet 67.

The ceiling portion 21 is a block having an internal space 211, and has a flat surface 212 on a surface facing the mounting table 22. The mounting table 22 has a bottomed cup shape. The opening 221 of the mounting table 22 faces the ceiling portion 21. The flat surface 212 of the ceiling portion 21 has the same shape as the component-embedded sheet 67, or is wider than the component-embedded sheet 67. On the other hand, the opening 221 of the mounting table 22 has an inclusion area of the component arrangement area 615 or more and the middle frame area 614 or less. The edge 222 around the opening 221 of the mounting table 22 has a width equal to or larger than the width of the frame 62.

In this mounting table 22, the edge portion 222 supports the cooling plate 63, and the opening 221 is closed by the cooling plate 63. The surface of the cooling plate 63 opposite to the surface to which the adhesive sheet 64 is attached abuts on the edge 222. Further, the component-embedded sheet 67 is placed on the cooling plate 63 so as to face the adhesive sheet 64. An air pressure supply hole 223 is formed through the bottom of the mounting table 22. The air pressure supply hole 223 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe, and the like (not shown). Therefore, a negative pressure is generated in the air hole 632 of the cooling plate 63 placed with the opening 221 closed. The adhesive sheet 64 may be previously attached to the non-adhesive surface 612 of the protective sheet 61 before being put into the plate mounting portion 2.

Further, a pusher insertion hole 224 penetrating the mounting table 22 is formed in the edge portion 222 of the mounting table 22. The penetration position of the pusher insertion hole 224 matches the pusher insertion hole 631 of the cooling plate 63, while the frame 62 avoids the guide portion insertion hole 621 of the frame 62 when the component-embedded sheet 67 is placed. It is a position that is blocked by. A pusher 23 is inserted through the pusher insertion hole 631. The pusher 23 can appear and disappear through the mounting table 22, the cooling plate 63, and the adhesive sheet 64.

The pusher 23 is installed with a rigidity, a number, and a positional relationship that allows the component-embedded sheet 67 to be separated from the cooling plate 63 and supported in parallel while protruding from the cooling plate 63. For example, if the outer shape of the frame 62 is rectangular, it is arranged as a bar corresponding to each corner of the frame 62. Pusher insertion holes 631 are also provided according to the number and positional relationship of the pushers 23.

Next, a large number of air holes 213 leading to the internal space 211 are formed in the flat surface 212 of the ceiling portion 21. The penetration range of the air hole 213 is the same size as the inside of the frame 62 of the component-embedded sheet 67, or at least the same shape as the component arrangement area 615. The penetration position of the air hole 213 is a position where the component arrangement region 615 covers the component array region 615 when the component-embedded sheet 67 is mounted on the mounting table 22.

In the internal space 211 of the ceiling portion 21, an air pressure supply hole 214 is provided at a position different from that of the flat surface 212. The air pressure supply hole 214 is connected to an air pressure circuit 75 including a compressor, a positive pressure supply pipe, a negative pressure supply pipe, and the like (not shown). Therefore, positive pressure and negative pressure are selectively generated in the air hole 213 through the air pressure supply hole 214 and the internal space 211. That is, the internal space 211, the flat surface 212, the air hole 213, the air pressure supply hole 214, and the pneumatic circuit 75 of the ceiling portion 21 have a function as a protective sheet holding portion and a function as a positive pressure portion. When a negative pressure is generated in the hole 213, the function of the protective sheet holding portion is exerted, and when the pneumatic circuit 75 generates a positive pressure in the air hole 213, the function of the positive pressure portion is exerted.

Further, on the flat surface 212 of the ceiling portion 21, an O-ring 215 that surrounds the penetration range of the air hole 213 is installed along the frame 62 of the component-embedded sheet 67 mounted on the mounting table 22. That is, the outer peripheral portion of the flat surface 212 of the ceiling portion 21 presses the frame 62 via the O-ring 215, and the outer peripheral portion of the protective sheet 61 is pressed against the cooling plate 63. That is, the ceiling portion 21 has a function as a pressing portion that presses the outer peripheral portion of the protective sheet 61 against the cooling plate 63.

FIG. 10 shows the flow of operation of such a plate mounting portion 2. FIG. 10 is a transition diagram schematically showing the state of the plate mounting portion 2 in each step. First, as shown in FIG. 10A, the ceiling portion 21 is first separated from the mounting table 22. A cooling plate 63 is pre-mounted on the mounting table 22. Further, the pusher 23 penetrates the mounting table 22, the cooling plate 63, and the adhesive sheet 64, and protrudes toward the ceiling portion 21. In this state, the frame 62 of the component-embedded sheet 67 is aligned with the pusher 23, and the component-embedded sheet 67 is supported by the pusher 23. Then, the ceiling portion 21 is lowered toward the pusher 23, and the frame 62 of the component-embedded sheet 67 is sandwiched between the ceiling portion 21 and the pusher 23.

At this time, the height H1 from the surface of the component arrangement region 615 to the upper surface of the frame 62 is higher than the height H2 from the surface of the component arrangement region 615 to the top surface 603 of the electronic component 60. Therefore, when the frame 62 is sandwiched, the top surface 603 of the electronic component 60 does not reach the flat surface 212 of the ceiling portion 21. Therefore, at least the component arrangement region 615 is confined in the closed space 24a defined by the ceiling portion 21, the protective sheet 61, and the frame 62 and sealed by the O-ring 215.

When the component arrangement region 615 is confined in the closed space 24a, a negative pressure is generated on the flat surface 212 of the ceiling portion 21. The electronic component 60 is attracted to the flat surface 212. The component-embedded sheet 67 is distorted in the middle frame region 614, and is attracted to the flat surface 212 while keeping the entire component arrangement region 615 flat. Therefore, the component arrangement region 615 does not bend so as to bend, and the embedded electrode 602 does not separate from the protective sheet 61. It is preferable to gradually reduce the pressure on the flat surface 212 of the ceiling portion 21 to generate a negative pressure so that the electronic component 60 does not vigorously rush toward the flat surface 212. The magnitude of the negative pressure at this time is preset in the control unit 74. Considering the relationship with the depressurization of the closed space 24b described later, the pressure is preferably close to vacuum (0 atm).

Next, as shown in FIG. 10B, the pusher 23 and the ceiling portion 21 are lowered toward the mounting table 22 at a constant speed. Then, the region of the frame 62 of the component-embedded sheet 67 is brought into contact with the adhesive sheet 64 on the cooling plate 63. Further, the area of the frame 62 is attached to the adhesive sheet 64 by moving the ceiling portion 21 toward the mounting table 22 and pressing the ceiling portion 21. When the region of the frame 62 of the component-embedded sheet 67 is brought into contact with the adhesive sheet 64 on the cooling plate 63, the negative pressure of the ceiling portion 21 is maintained, and the component-embedded sheet 67 is the ceiling portion. Since it is attracted to the flat surface 212 of 21, the component arrangement region 615 is in non-contact (separated state) with respect to the adhesive sheet 64.

Here, when the negative pressure is not generated in the ceiling portion 21, the component-embedded sheet 67 comes into contact with the adhesive sheet 64 in the presence environment of air. Then, there is a possibility that air bubbles may enter between the component-embedded sheet 67 and the adhesive sheet 64. When air bubbles enter, the heat insulating area reaching the cooling plate 63 decreases, and the heat dissipation effect of the electronic component 60 at the time of film formation decreases. However, in the plate mounting portion 2, in the presence of air, the component-embedded sheet 67 is raised in the direction away from the adhesive sheet 64, so that the entry of air bubbles is prevented.

When the frame 62 is in close contact with the adhesive sheet 64 via the protective sheet 61, that is, when pressed, the frame 62 is defined by the protective sheet 61, the cooling plate 63, and the frame 62, and the non-adhesive surface 612 of the protective sheet 61 and the cooling plate 63 are formed. The adhesive sheet 64 side is confined in the closed space 24b. When the closed space 24b is formed, as shown in FIG. 10 (c), a negative pressure is also generated on the mounting table 22 while maintaining the negative pressure of the ceiling portion 21. In other words, the pressure in the closed space 24b is reduced while the outer peripheral portion (outer frame region 613) of the protective sheet 61 is pressed by the ceiling portion 21. Through the air holes 632 of the cooling plate 63 and the air holes 632 of the pressure-sensitive adhesive sheet 64, the sealed space 24b between the cooling plate 63 on which the pressure-sensitive adhesive sheet 64 is installed and the protective sheet 61 is depressurized. At this time, the negative pressure generated in the mounting table 22 is a negative pressure slightly closer to the atmospheric pressure than the negative pressure generated in the ceiling portion 21, and the size is such that the adsorption of the electronic component 60 to the ceiling portion 21 can be maintained. good. This negative pressure is preset in the control unit 74.

When the depressurization of the sealed space 24b between the cooling plate 63 on which the adhesive sheet 64 is installed and the protective sheet 61 to the preset negative pressure is completed, as shown in FIG. 10 (d), the mounting table 22 While maintaining the negative pressure, the negative pressure of the ceiling portion 21 is gradually changed to the positive pressure. In other words, the holding of the protective sheet 61 by the ceiling portion 21 is released while the decompression of the closed space 24b is maintained. The component-embedded sheet 67 is gently sucked down and pushed down toward the adhesive sheet 64, and the component-embedded sheet 67 is pressed against the adhesive sheet 64 attached to the cooling plate 63. Then, the component-embedded sheet 67 is attached to the cooling plate 63 via the adhesive sheet 64.

If the negative pressure on the mounting table 22 side and the negative pressure on the ceiling portion 21 side are the same or substantially the same, the protective sheet 61 elastically shrinks and the protective sheet 61 comes into contact with the adhesive sheet 64. Therefore, the negative pressure on the mounting table 22 side may be the same as or substantially the same as the negative pressure on the ceiling portion 21, and the negative pressure on the ceiling portion 21 side may be gradually changed to the positive pressure after contact.

Finally, as shown in FIG. 10 (e), by moving the ceiling portion 21 so as to be separated from the mounting table 22, the component-embedded sheet 67, the adhesive sheet 64, and the cooling plate 63 are overlapped with each other. Release the pinch. This completes the production of the component mounting plate 68 including the electronic component 60, the protective sheet 61, the adhesive sheet 64, and the cooling plate 63. The positive pressure generated in the ceiling portion 21 and the negative pressure generated in the mounting portion 22 may be released while the ceiling portion 21 is separated from the mounting table 22.

That is, the ceiling portion 21, the pusher 23, and the mounting table 22 are drive units that bring the component-embedded sheet 67 and the cooling plate 63 close to each other. The ceiling portion 21 and the mounting table 22 serve as a fixing portion for sandwiching the component-embedded sheet 67 and the cooling plate 63, and also serve as a pressing portion for pressing the frame 62 and the cooling plate 63 into close contact with each other. Further, the pneumatic supply hole 223 of the mounting table 22 is a decompression unit that reduces the pressure in the closed space 24b between the component-embedded sheet 67 and the cooling plate 63. Further, the air hole 213 of the ceiling portion 21 is a decompression portion that reduces the pressure of the closed space 24a between the flat surface 212 of the ceiling portion 21 and the component-embedded sheet 67.

The flat surface 212 of the ceiling portion 21 holds the component-embedded sheet 67 by generating a negative pressure prior to the decompression between the component-embedded sheet 67 and the cooling plate 63, and the component-embedded sheet 67 is pre-embedded. The sheet 67 with embedded parts is cooled by positive pressure as a positive pressure part in combination with suction by negative pressure of the mounting table 22, which is a separation means for preventing air bubbles from entering between the sheet 67 and the cooling plate 63. It is a pressing means to be brought into close contact with the plate 63. The mounting table 22 serves as a suction means for bringing the component-embedded sheet 67 into close contact with the cooling plate 63 by a negative pressure in combination with the pressing of the ceiling portion 21 by a positive pressure.

In this way, the plate mounting portion 2 attaches the protective sheet 61 in which the electrode 602 of the electronic component 60 is embedded to the cooling plate 63. The plate mounting portion 2 has a ceiling portion 21 as a pressing portion for pressing the outer peripheral portion of the protective sheet 61 such as the frame 62 against the cooling plate 63, and reduces the space between the component arrangement region 615 and the cooling plate 63. It has a decompression unit. Further, the plate mounting portion 2 presses the protective sheet 61 and the cooling plate 63 against each other via the adhesive sheet 64 under a state where the pressure is reduced by the pressure reducing portion. As a result, the protective sheet 61 and the cooling plate 63 can be brought into close contact with each other without air bubbles entering, and a sufficient heat transfer area to the cooling plate 63 can be secured.

Further, the plate mounting portion 2 sucks up the protective sheet 61 by negative pressure on the flat surface 212 of the ceiling portion 21, that is, on the side opposite to the cooling plate 63 with the protective sheet 61 interposed therebetween, and attaches the cooling plate 63 and the protective sheet 61. It was made to have an air hole 213 to be separated. The flat surface 212 having the air holes 213 serves as a protective sheet holding portion, and is a region in which the electronic components 60 of the protective sheet 61 are arranged when the pressing portion brings the outer peripheral portion of the protective sheet 61 into contact with the cooling plate 63. The protective sheet 61 is held so as to separate the cooling plate 63 from the cooling plate 63. and,
The negative pressure is maintained until the pressure is reduced between the component-embedded sheet 67 and the cooling plate 63 by the pressure reducing portion, and the holding is released under the reduced pressure state. As a result, it is possible to prevent the protective sheet 61 and the cooling plate 63 from sticking to each other when the depressurization is not completed, further reducing the possibility of air bubbles entering between the protective sheet 61 and the cooling plate 63, and further reducing the cooling plate. A sufficient heat transfer area to 63 can be secured.

Further, the air hole 213 that opens in the flat surface 212 of the ceiling portion 21 is provided before the pusher 23 descends and the ceiling portion 21 comes into contact with the mounting table 22 via the frame 62 of the component-embedded sheet 67, that is, the component. Negative pressure is generated before the embedded sheet 67 and the cooling plate 63 approach each other, and at the latest before the space between the cooling plate 63 provided with the adhesive sheet 64 and the protective sheet 61 is defined. .. As a result, it is possible to prevent the protective sheet 61 from being accidentally attached to the cooling plate 63 at the time when the protective sheet 61 and the cooling plate 63 are set on the plate mounting portion 2.

Further, the plate mounting portion 2 has a flat surface 212 of the ceiling portion 21. The flat surface 212 is located opposite to the cooling plate 63 with the protective sheet 61 interposed therebetween, and faces the electronic component 60. The air hole 213 that keeps the cooling plate 63 and the protective sheet 61 apart from each other until the end of depressurization between the component-embedded sheet 67 and the cooling plate 63 is made to open in the flat surface 212. As a result, the protective sheet 61 can be made to imitate flat without bending and bending due to the pressure difference between the front and back of the protective sheet 61 during depressurization, and the electronic component 60 can be made to follow the protective sheet while the plate is mounted. It is possible to prevent the situation of peeling from 61.

The air hole 213 on the ceiling portion 21 side serves as a positive pressure portion, and after the pressure between the component-embedded sheet 67 and the cooling plate 63 reaches a predetermined set value, it shifts from negative pressure generation to positive pressure generation and protects it. The sheet 61 was pressed against the cooling plate 63. That is, the air hole 213 is a means for pressing the protective sheet 61 and the cooling plate 63 as a keeping distance from the cooling plate 63 of the protective sheet 61, a pressure reducing portion for reducing the pressure in the closed space 24a, and a positive pressure portion for generating positive pressure. Also serves as. However, the air holes provided in another member may function as separation, depressurization, and close contact means.

For example, as in the present embodiment, the cooling plate 63 is provided with an air hole 632. The plate mounting portion 2 has a mounting table 22 on which the cooling plate 63 is mounted and a negative pressure is generated. Then, the protective sheet 61 may be attracted to the cooling plate 63 through the mounting table 22 on which the cooling plate 63 is placed and the air holes 632 of the cooling plate 63.

As the operating mechanism of the ceiling portion 21 and the operating mechanism of the pusher, a known mechanism may be adopted, and the present invention is not limited to the mechanism of the mechanism.

For example, the ceiling portion 21 is connected to a ball screw whose axis is extended in the direction from the ceiling portion 21 toward the mounting table 22 and a rail guide extending in the direction from the ceiling portion 21 toward the mounting table 22. In this case, the ceiling portion 21 moves toward the mounting table 22 along the rail according to the rotation direction of the screw shaft. In the ceiling portion 21, the ball screw and the rail guide extend so that the ceiling portion 21 approaches the mounting base 22 up to the distance of the thickness H1 of the frame 62 of the component-mounted sheet 66.

Further, the pusher 13 has a cam follower at the rear end. The cam follower follows the peripheral surface of the egg-shaped cam. The cam is pivotally supported by a rotary motor and can rotate in the circumferential direction. When the rotary motor is driven and the cam rotates, the cam follower climbs the bulging portion of the cam and the pusher 13 is pushed up.

Further, as a method of defining the closed space 24a and the closed space 24b, the component embedding sheet 67 and the cooling plate 63 are not used as one element of the drawing means, but are defined by the ceiling portion 21 and the mounting table 22. good. For example, one or both of the ceiling portion 21 and the mounting table 22 are cup-shaped, and in one space defined by the ceiling portion 21 and the mounting table 22 so as to include the component-mounted sheet 66 and the cooling plate 63. It may be accommodated, and the front and back surfaces of the component-mounted sheet 66 may be further divided by the ceiling portion 21 and the mounting table 22. However, in this case, it is desirable that the ceiling portion 21 has a side wall extending toward the mounting table 22 while surrounding the flat surface 212 in which the air holes 213 are opened. This side wall is in close contact with the flat surface of the mounting table 22 to define one closed space. The O-ring 215 is installed on the end face of the side wall.

(Film film processing unit)
Next, the film forming process unit 3 which is responsible for the film forming process will be described. FIG. 11 is a schematic view showing the configuration of the film forming processing unit 3. The film forming processing unit 3 forms an electromagnetic wave shielding film 605 on each electronic component 60 on the component mounting plate 68 by sputtering. As shown in FIG. 11, the film forming processing unit 3 has a chamber 31 and a load lock chamber 32. The chamber 31 is a cylindrical vacuum chamber whose diameter is larger in the radial direction than in the axial direction. The inside of the chamber 31 is divided into a plurality of fan-shaped sections by a partition 33 extending along the radial direction. A processing position 311 and a film forming position 312 are assigned to some fan-shaped sections.

The partition 33 extends from the ceiling surface of the chamber 31 toward the bottom surface, but does not reach the bottom surface. A rotary table 34 is installed in the space on the bottom surface side where there is no partition 33. The rotary table 34 has a disk shape coaxial with the chamber 31 and rotates in the circumferential direction. The component mounting plate 68 thrown into the chamber 31 from the load lock chamber 32 is placed on the rotary table 34, and goes around the processing position 311 and the film forming position 312 while rotating around the circular locus.

In order to maintain the position of the component mounting plate 68 with respect to the rotary table 34, the rotary table 34 holds a component mounting plate 68 such as a groove, a hole, a protrusion, a jig, a holder, a mechanical chuck, or an adhesive chuck. Holding means are installed.

A surface treatment unit 35 is installed at the treatment position 311. A process gas such as argon gas is introduced into the surface treatment unit 35, and the process gas is turned into plasma by applying a high frequency voltage to generate electrons, ions, radicals and the like. For example, the surface treatment unit 35 is a tubular electrode opened on the rotary table 34 side, and a high frequency voltage is applied by an RF power supply.

A target 361 constituting the sputter source 36 is installed at the film forming position 312, and a sputter gas which is an inert gas such as argon gas is introduced. The sputtering source 36 applies electric power to the target 361 to turn the sputtering gas into plasma, collide the generated ions or the like with the target, and knock out the particles. The target 361 is made of the material of the electromagnetic wave shielding film 605. That is, the particles of the electromagnetic wave shielding film 605 are ejected from the target 361, and the ejected particles of the electromagnetic wave shielding film 605 are deposited on the electronic component 60 on the rotary table 34.

The film forming position 312 is provided at, for example, two places. The target material of each film formation position 312 may be the same material or may be a different material to form a laminated electromagnetic wave shielding film 605. As a power source for applying electric power to the spatter source 36 of each film formation position 312, a well-known power source such as a DC power supply, a DC pulse power supply, or an RF power supply can be applied. Further, the power source for applying electric power to the spatter source 36 may be provided for each spatter source 36, or a common power source may be switched by a switch and used.

In such a film forming processing unit 3, the surface of the electronic component 60 is cleaned and roughened by etching or ashing at the processing position 311 to improve the adhesion of the conductive shield film to the electronic component 60. Further, by depositing the particles of the target 361 on the electronic component 60 at the film forming position 312, a conductive shield film is formed on the electronic component 60. Since the electrode 602 is embedded in the protective sheet 61 and the exposed electrode surface 601 is in close contact with the protective sheet 61, particles of the electromagnetic wave shielding film 605 are prevented from adhering to the electrode 602, and the exposed electrode surface 601 and the protective sheet are prevented from adhering. Particles of the electromagnetic wave shielding film 605 are prevented from entering between the area and the area 61. Further, the heat of the electronic component 60 is transferred to the cooling plate 63, and excessive heat storage of the electronic component 60 is suppressed.

The film forming processing unit 3 forms a film on the electronic component 60 by using a sputtering method, but the film forming method is not limited to this. For example, the film forming processing unit 3 may form the electromagnetic wave shielding film 605 on the electronic component 60 by vapor deposition, spray coating, coating, or the like.

(Plate release part)
Next, the plate release unit 4 responsible for the plate release step will be described. FIG. 12 is a schematic view showing the configuration of the plate release portion 4. After the electromagnetic wave shield film 605 is formed, the component mounting plate 68 is inserted into the plate release portion 4. The plate releasing portion 4 peels off the component-embedded sheet 67 from the cooling plate 63 as a first step for obtaining the individual electronic component 60.

As shown in FIG. 12, the plate releasing portion 4 includes a ceiling portion 41 and a mounting table 42. The ceiling portion 41 and the mounting table 42 are arranged so as to face each other. The mounting table 42 is immovable. On the other hand, the ceiling portion 41 can be raised and lowered with respect to the mounting table 42. The ceiling portion 41 approaches the mounting table 42 at least up to a distance of the thickness H1 of the frame 62 of the component mounting plate 68.

The ceiling portion 41 is a block having an internal space 411, and has a flat surface 412 on a surface facing the mounting table 42. The mounting table 42 has a bottomed cup shape, and the opening 421 faces the ceiling portion 41. The flat surface 412 of the ceiling portion 41 has the same shape as the component mounting plate 68, or is wider than the component mounting plate 68. On the other hand, the opening 421 of the mounting table 42 has an inclusion area of the component arrangement area 615 or more and the middle frame area 614 or less. The edge portion 422 around the opening 421 of the mounting table 42 has a width equal to or larger than the width of the frame 62.

In the mounting table 42, the edge portion 422 supports the component mounting plate 68, and the opening 421 is closed by the component mounting plate 68. The cooling plate 63 side abuts on the edge 422. An air pressure supply hole 423 is formed in the bottom of the mounting table 42. The air pressure supply hole 423 is connected to an air pressure circuit 75 including a compressor (not shown), a positive pressure supply pipe, and the like. Therefore, a positive pressure is generated in the air hole 632 of the component mounting plate 68 placed with the opening 421 closed.

Further, a pusher insertion hole 424 penetrating the mounting table 42 is formed in the edge portion 422 of the mounting table 42. The penetration position of the pusher insertion hole 424 matches the pusher insertion hole 631 of the cooling plate 63, while when the component mounting plate 68 is mounted, the guide portion insertion hole 621 of the frame 62 is avoided and the pusher insertion hole 624 is closed by the frame 62. It is the position to be done. A pusher 43 is inserted through the pusher insertion hole 424. The pusher 43 moves in the axial direction so that the tip can be projected to a position higher than the frame 62 of the component mounting plate 68 mounted on the mounting table 42.

The pusher 43 peels off the component-embedded sheet 67 from the cooling plate 63 against the adhesive force between the outer frame region 613 and the adhesive sheet 64, separates the component-embedded sheet 67 from the cooling plate 63, and embeds the component. It is installed with rigidity, number, and positional relationship so that the embedded sheet 67 can be lifted and supported in parallel. For example, if the outer shape of the frame 62 is rectangular, it is arranged as a bar corresponding to each corner of the frame 62. Pusher insertion holes 424 are also provided according to the number and positional relationship of the pushers 43.

Further, a pair of holding blocks 44 are arranged on both sides of the mounting table 42. The sandwiching block 44 sandwiches only the cooling plate 63 among the component mounting plates 68 mounted on the mounting table 42. That is, the pair of sandwiching blocks 44 are arranged at the same height as the cooling plate 63 mounted on the mounting table 42, and have the same thickness as the cooling plate 63. The sandwiching blocks 44 can be brought into contact with each other around the cooling plate 63. However, the sandwiching block 44 is immovable in the direction in which the ceiling portion 41 and the mounting table 42 are lined up.

Next, a large number of air holes 413 leading to the internal space 411 are formed in the flat surface 412 of the ceiling portion 41. The penetration range of the air hole 413 is the same size as the inside of the frame 62 of the protective sheet 61, or at least the same shape as the component arrangement area 615. The penetration position of the air hole 413 is a position where the component arrangement region 615 covers the component mounting plate 68 when the component mounting plate 68 is mounted on the mounting table 42.

In the internal space 411 of the ceiling portion 41, an air pressure supply hole 414 is provided at a position different from that of the flat surface 412. The air pressure supply hole 414 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe, and the like (not shown). Therefore, a negative pressure is generated in the air hole 413 through the air pressure supply hole 414 and the internal space 411.

Further, on the flat surface 412 of the ceiling portion 41, an O-ring 415 surrounding the penetration range of the air hole 413 is installed along the frame 62 of the component mounting plate 68 mounted on the mounting table 42. The peripheral edge of the flat surface 412 of the ceiling 41 facing the frame 62 functions as a fixing portion for pressing the portion of the protective sheet 61 that is out of the component arrangement area 615 in which the electronic components 60 are arranged. This fixed portion presses the protective sheet 61 over the entire peripheral portion facing the frame 62, that is, the frame 62 is pressed over the entire area, but it is not always necessary to press the protective sheet 61 over the entire area, and the protective sheet 61 is partially pressed. There may be places that do not exist.

FIG. 13 shows the flow of operation of such a plate releasing portion 4. FIG. 13 is a transition diagram schematically showing the state of the plate releasing portion 4 in each step. First, as shown in FIG. 13A, the ceiling portion 41 is separated from the mounting table 42, and the pusher 43 is buried in the pusher insertion hole 424 of the mounting table 42. Then, the component mounting plate 68 is mounted on the mounting table 42. When the component mounting plate 68 is placed, the cooling plate 63 is fixed by the sandwiching block 44.

Next, as shown in FIG. 13B, the ceiling portion 41 is lowered toward the mounting table 42, and the flat surface 412 of the ceiling portion 41, that is, the fixed portion is brought into contact with the frame 62 of the component mounting plate 68. .. At this time, the height H1 from the surface of the component arrangement region 615 to the upper surface of the frame 62 is higher than the height H2 from the surface of the component arrangement region 615 to the top surface 603 of the electronic component 60. Therefore, when the frame 62 is sandwiched, the top surface 603 of the electronic component 60 does not reach the flat surface 412 of the ceiling portion 41. Therefore, at least the component arrangement area 615 is confined in the closed space 45 defined by the ceiling portion 41, the protective sheet 61, and the frame 62 and sealed by the O-ring 415.

When the component arrangement region 615 is confined in the closed space 45, a negative pressure is generated in the ceiling portion 41 and a positive pressure is generated in the mounting table 42 as shown in FIG. 13 (c). As a result, a force sucked up by the flat surface 412 of the ceiling portion 41 and a force pushed up toward the flat surface 412 of the ceiling portion 41 away from the mounting table 42 act on the component arrangement region 615 inside the frame 62. Due to the suction force and the pushing force, a force sufficient to separate the component arrangement region 615 from the cooling plate 63 acts on the component arrangement region 615, and the component arrangement region 615 is peeled from the cooling plate 63. The magnitudes of the negative pressure of the ceiling portion 41 and the positive pressure of the mounting table 42 at this time are preset in the control unit 74.

At the time when the component arrangement region 615 is peeled off, the protective sheet 61 is flat without distortion, so that the momentum of the component arrangement region 615 toward the flat surface 412 of the ceiling portion 41 is small, and the electronic component 60 is peeled off from the protective sheet 61, or The situation where the electronic component 60 pops out from the protective sheet 61 is prevented. Even if the component arrangement area 615 is vigorously peeled off, the flat surface 412 of the ceiling portion 41 is reserved, and the electronic component 60 is stopped by the flat surface 412, so that the electronic component 60 is peeled off from the protective sheet 61 or protected. The risk of falling off the sheet 61 is reduced.

In order to further enhance the effect of reducing the risk of peeling or falling off of the electronic component 60 from the protective sheet 61, the top surface 603 and the flat surface of the electronic component 60 are in a state before the protective sheet 61 is peeled from the cooling plate 63. It is preferable that the distance between the 412 and the 412 is as small as possible. Therefore, the distance between the top surface 603 and the flat surface 412 of the electronic component 60 may be set to the minimum necessary distance for peeling the protective sheet 61 from the cooling plate 63.

Further, for example, the air holes 632 on which the positive pressure acts are gradually increased with respect to the plurality of air holes 632 of the cooling plate 63, for example, positive from one end to the other end of the cooling plate 63. The mounting table 42 is designed so that the air holes 632 on which the pressure acts increases, or the range of the air holes 632 on which the positive pressure acts gradually expands from the air hole 632 located on the central side to the outer peripheral side. A plurality of systems for generating positive pressure may be provided by partitioning the space in the opening 421 into a plurality of spaces. By doing so, it is possible to prevent the component arrangement region 615 from being peeled off from the cooling plate 63 at once, and it is possible to prevent the electronic component 60 from vigorously rushing into the flat surface 412 of the ceiling portion 41.

Further, when the component arrangement region 615 is peeled off, the electronic component 60 comes into contact with the flat surface 412 of the ceiling portion 41, only the middle frame region 614 of the protective sheet 61 bends, and at least the component arrangement region 615 remains flat. In other words, if the flat surface 412 of the ceiling portion 41 is absent, the protective sheet 61 bends so as to be curved with air. Then, there is a possibility that the electronic component 60 is peeled off from the protective sheet 61, but since the component arrangement region 615 is maintained on a flat surface, the peeling of the electronic component 60 is suppressed.

When the component arrangement region 615 is peeled off from the cooling plate 63, as shown in FIG. 13D, the pusher 43 is inserted into the pusher insertion hole 424 of the mounting table 42, the pusher insertion hole 424 of the cooling plate 63, and the pusher insertion of the adhesive sheet 64. The frame 62 is brought into contact with the frame 62 through the hole 424 via the protective sheet 61. Then, the pusher 43 is further advanced, and at the same time, the ceiling portion 41 is separated from the mounting table 42 at the same speed as the pusher 43. Since the cooling plate 63 is gripped by the holding block 44 and is immovable in position, the outer frame region 613 to which the frame 62 is attached is also peeled off from the cooling plate 63, and the entire protective sheet 61 is peeled off from the cooling plate 63.

At this time, the positive pressure of the mounting table 42 and the negative pressure of the ceiling portion 41 are maintained. Therefore, the situation where the component arrangement region 615 hangs down toward the cooling plate 63 due to its own weight and reattaches is suppressed. Further, since the positive pressure of the mounting table 42 is maintained, the peeling of the outer frame region 613 to which the frame 62 is attached from the cooling plate 63 is assisted.

Finally, as shown in FIG. 13 (e), by stopping the pusher 43 and moving the ceiling portion 41 further away from the mounting table 42, the sandwiching with the component-embedded sheet 67 is released and cooling is performed. The peeling of the protective sheet 61 from the plate 63 is completed. The positive pressure of the mounting table 42 and the negative pressure of the ceiling portion 41 may be released during this period.

That is, the ceiling portion 41 is a fixing portion that presses the frame 62 located outside the component arrangement region 615. Further, the air pressure supply hole 423 of the mounting table 42 becomes a positive pressure generation hole, pressurizes the component arrangement region 615 through the air hole 632 of the cooling plate 63, and peels the component arrangement region 615 from the cooling plate 63 before the frame 62. It is a pressurizing means. The air hole 413 of the ceiling portion 41 serves as a negative pressure generating hole, attracts the component arrangement region 615, and serves as a suction means for assisting the peeling from the cooling plate 63.

Further, the flat surface 412 of the ceiling portion 41 serves as a restraining means for suppressing peeling or falling off of the electronic component 60 from the protective sheet 61 when the component arrangement region 615 is peeled off, and further, the protective sheet 61 is made to imitate flat and electronic. It is a flattening means for suppressing the component 60 from peeling off from the protective sheet 61. The pusher 43 is a pushing-up means for peeling the frame 62 from the cooling plate 63 after the component arrangement region 615 is peeled off.

In this way, the plate releasing portion 4 removes the cooling plate 63 after undergoing the film forming step. The plate release portion 4 is provided with a mounting table 42 having a positive pressure generating hole as an example of the air pressure supply hole 423 and a fixing portion as an example of the ceiling portion 41. The positive pressure generating hole faces the cooling plate 63 and generates positive pressure. While the positive pressure of the mounting table 42 pressurizes the component arrangement area 615, the fixing portion presses a portion of the protective sheet 61 that is out of the component arrangement area 615, for example, the frame 62, and presses the component arrangement area 615. Was released from the cooling plate 63 after it was separated from the cooling plate 63.

As a result, when the component arrangement area 615 is peeled off, the protective sheet 61 remains flat, so that the situation in which the component arrangement area 615 jumps up due to the reaction of the protective sheet 61 returning to flatness is avoided. Therefore, it is possible to prevent the electronic component 60 from peeling off from the protective sheet 61 and falling off.

More specifically, when positive pressure is supplied from a plurality of air holes 632 provided in the range corresponding to the middle frame region 614 and the component arrangement region 615 in the cooling plate 63, the positive pressure causes the protective sheet 61 to be cooled by the cooling plate. It begins to peel off from 63. The peeled portion of the protective sheet 61 generated by this is gradually expanded and connected from the portion where the peeling has started due to the continuously supplied positive pressure, and spreads outward. Finally, this peeling portion reaches the boundary portion between the outer frame region 613 and the middle frame region 614, which is the inner peripheral edge of the frame 62 pressed by the fixing portion, and the component arrangement region 615 and the middle frame region of the protective sheet 61 are reached. 614 is completely separated from the cooling plate 63. At this time, the boundary portion between the outer frame region 613 and the middle frame region 614 finally reached by the peeled portion of the protective sheet 61 is pressed by the flat surface 412 as the fixing portion via the frame 62. Even if the component arrangement region 615 and the middle frame region 614 are peeled off, the protective sheet 61 is prevented from jumping up vigorously.

Moreover, since the outer frame region 613 is pressed by the flat surface 412 as the fixing portion via the frame 62, positive pressure is prevented from leaking from between the protective sheet 61 and the cooling plate 63. The entire component arrangement area 615 can be reliably and stably peeled off. As a result, it is possible to prevent the electronic component 60 from peeling off from the protective sheet 61 and falling off.

Further, the plate releasing portion 4 has a flat surface 412 of the ceiling portion 41 separated from the protective sheet 61 on the ceiling portion 41 side, that is, opposite to the cooling plate 63 with the protective sheet 61 interposed therebetween. The flat surface 412 is designed to hold down the bulge of the component arrangement region 615 while the component arrangement region 615 is pressed. As a result, the component arrangement region 615 follows a flat surface, and the electronic component 60 can be more reliably prevented from peeling off. Further, since the flat surface 412 stops the electronic component 60 even if the component arrangement region 615 jumps up, it is possible to further prevent the electronic component 60 from peeling off from the protective sheet 61 and falling off.

Further, the plate releasing portion 4 has a negative pressure generating hole for generating a negative pressure so as to face the protective sheet 61. As an example, an air hole 413 that generates a negative pressure is provided on the flat surface 412 of the ceiling portion 41. The air holes 413 attract the protective sheet 61 together with the pressure applied to the component arrangement region 615 by the air holes 632. Therefore, the protective sheet 61 can be peeled off from the cooling plate 63 by assisting the pressurization of the component arrangement region 615, and peeling errors are less likely to occur.

Further, the plate releasing portion 4 is provided with a pusher 43. After the component arrangement region 615 separates from the cooling plate 63, the pusher 43 advances in the cooling plate 63 and pushes up the pressed portion such as the frame 62 in the direction away from the cooling plate 63. As a result, after the component arrangement area 615 is peeled off, the entire protective sheet 61 can be peeled off. The fixed portion having the ceiling portion 41 as an example may be separated from the protective sheet 61 as the pusher 43 advances when the pressing is released.

As the operating mechanism of the ceiling portion 41, the operating mechanism of the sandwiching block 44, and the operating mechanism of the pusher 43, known mechanisms may be adopted, and the present invention is not limited to the mechanism of the mechanism.

For example, the ceiling portion 41 is connected to a ball screw whose axis extends in the direction from the ceiling portion 41 toward the mounting table 42 and a rail guide extending in the direction from the ceiling portion 41 toward the mounting table 42. In this case, the ceiling portion 41 moves toward the mounting table 42 along the rail according to the rotation direction of the screw shaft. In the ceiling portion 41, the ball screw and the rail guide extend so that the ceiling portion 41 approaches the mounting base 42 up to the distance of the thickness H1 of the frame 62 of the component-mounted sheet 66.

Further, on the outer side of the holding block 44, the peripheral surface of the egg-shaped cam is individually brought into contact with the pair of holding blocks 44. The cam is pivotally supported by a rotary motor and can rotate in the circumferential direction. When the rotary motor is driven, the cam is rotated, and the bulging portion of the cam hits the pinching block 44, the pinching block 44 is pushed toward the cooling plate 63 to pinch the cooling plate 63.

Further, the pusher 43 has a cam follower at the rear end. The cam follower follows the peripheral surface of the egg-shaped cam. The cam is pivotally supported by a rotary motor and can rotate in the circumferential direction. When the rotary motor is driven and the cam rotates, the cam follower climbs the bulging portion of the cam and the pusher 43 is pushed up.

Further, the plate releasing portion 4 peels off the protective sheet 61 from the cooling plate 63 by generating a positive pressure on the mounting table 42. The flat surface 412 of the ceiling portion 41 is an additional function of imitating the peeled protective sheet 61 flatly, and the air hole 413 opened in the flat surface 412 of the ceiling portion 41 also assists the pressurization by the mounting table 42. It is an additional function. Therefore, as shown in FIG. 14, the ceiling portion 41 has a square tube shape in which the opening edge is brought into contact with the frame 62, and the flat surface 412 may be omitted. Further, as shown in FIG. 15, the air hole 413 may be omitted from the flat surface 412 of the ceiling portion 41.

(Peeling processing part)
Finally, the peeling processing unit 5 responsible for the component peeling step will be described. FIG. 16 is a schematic view showing the configuration of the peeling processing unit 5. The component-embedded sheet 67 from which the cooling plate 63 has been removed is put into the peeling processing section 5 via the plate releasing section 4, and the individual electronic components 60 are peeled from the protective sheet 61 as the final step. When the peeling processing unit 5 is separated from the film forming apparatus 7, it may be referred to as a peeling processing device.

As shown in FIG. 16, the peeling processing unit 5 includes a mounting table 51 on which a component-embedded sheet 67 is placed, a chuck 52 that grips and continuously moves the protective sheet 61, and a protective sheet 61. It is provided with a guide portion 53 that hooks an end portion to create a trigger for the chuck 52 to grip the protective sheet 61, a sheet stopper 54 that creates a peeling base point of the protective sheet, and a component stopper 55 that prevents the electronic component 60 from floating. ing.

The mounting table 51 has a flat surface 511 on which the component-embedded sheet 67 is placed. In the component-embedded sheet 67, the electronic component 60 is directed to the flat surface 511, the top surface 603 of the electronic component 60 is brought into contact with the mounting surface, and the protective sheet 61 is mounted with the protective sheet 61 facing upward. The flat surface 511 is made of an adhesive non-slip member, and the staticity of the electronic component 60 is improved. The outer peripheral region of the flat surface 511 is dug down one step at a depth corresponding to the height H1 from the surface of the component arrangement region 615 to the end surface of the frame 62 so that the frame 62 can enter, and the protective sheet 61 is flat. The electronic component 60 is placed on the flat surface 511 while maintaining the above.

The mounting table 51 is a block having an internal space 512. A large number of air holes 513 are formed in the flat surface 511 of the mounting table 51 in a region facing the component arrangement region 615. The air hole 513 communicates with the internal space 512 of the mounting table 51. The internal space 512 of the mounting table 51 is provided with an air pressure supply hole 514 at a position different from that of the flat surface 511. The air pressure supply hole 514 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe, and the like (not shown). Therefore, a negative pressure is generated in the air hole 513 through the air pressure supply hole 514 and the internal space 512.

The chuck 52 is a pair of blocks with the gripping surfaces facing each other. The pair of blocks can be attached to and detached from each other. The chuck 52 is supported by a moving device that is movable in the horizontal and vertical directions, and has an angle of attack of 45 degrees with respect to the flat surface 511 along the protective sheet 61 mounted on the flat surface 511 of the mounting table 51. Move continuously. That is, the chuck 52 moves away from the mounting table 51 while traversing the flat surface 511 of the mounting table 51. Continuous movement means moving at a constant speed, preferably without stopping in the middle. The range of movement of the chuck 52 is from the end of the protective sheet 61 where the trigger for gripping is created to the opposite end of the end.

The seat stopper 54 is a roller having a long-axis cylindrical shape that crosses one side of the protective sheet 61 and is rotatable around the axis. The seat stopper 54 can be made of a metal such as stainless steel. Further, the diameter of the seat stopper 54 can be set to 5 mm to 10 and several mm when the length crossing the protective sheet 61 is about 200 mm to 300 mm. In this embodiment, a stainless steel cylinder having a diameter of 6 mm is used.

The seat stopper 54 keeps a constant height with reference to the flat surface 511 of the mounting table 51, maintains a position directly under the chuck 52, and is mounted on the mounting table 51 along a direction orthogonal to the long axis. To traverse. The arrangement height of the sheet stopper 54 coincides with the combined height of the electronic component 60 excluding the electrode 602 and the protective sheet 61. That is, the seat stopper 54 travels while pressing the non-adhesive surface 612 of the protective sheet 61. The degree of pressing shall be such that the electrode 602 is not damaged, rubbed, or crushed. The moving range of the seat stopper 54 is from the front of the guide portion 53, that is, the edge of the guide portion insertion hole 621 of the frame 62 to the opposite end of the protective sheet 61.

The component stopper 55 is a roller having a long-axis cylindrical shape that traverses at least the entire component arrangement region 615 of the protective sheet 61 and is rotatable about the axis. The component stop roller 55 can be made of a metal such as stainless steel. The diameter of the component stop roller 55 may be determined in consideration of the diameter of the sheet stop roller 54 and the size of the electronic component 60, but if the diameter is set to be smaller than the sheet stop roller 54, the diameter is closer to the seat stop roller 54. Can be placed. In the present embodiment, a stainless steel cylinder having the same diameter as the seat stop roller 54 is used.

The component stopper 55 is arranged so as to be able to approach and separate from the seat stopper 54. While the chuck 52 and the seat stopper 54 move longitudinally through the mounting table 51, the component stopper 55 follows the seat stopper 54 at a constant distance. The fixed distance is less than the length of the electronic component 60 (the length in the moving direction of the component stopper 55) attached to the protective sheet 61. When the chuck 52 and the seat stopper 54 are located at the end of the mounting table 51, the component stopper 55 takes a distance so as to be located on the opposite bank to the seat stopper 54 with the guide portion insertion hole 621 interposed therebetween.

The guide portion 53 is arranged at a position where the axis is common to the guide portion insertion hole 621 of the frame 62. The tip of the guide portion 53 faces the guide portion insertion hole 621 of the frame 62. The guide portion 53 is movable in the axial direction, protrudes toward the end of the protective sheet 61, pushes up the end of the protective sheet 61 toward the chuck 52, and the frame 62 until the end of the protective sheet 61 reaches the chuck 52. Advance into the guide hole insertion hole 621. The guide portion 53 peels off one side of the protective sheet 61 by pushing it up. Therefore, the guide portion insertion hole 621 has a pin shape and is installed at a plurality of locations along one side of the protective sheet 61.

For example, as shown in FIG. 17, the penetrating positions of the guide portion insertion holes 621 are located at equal intervals with the center of one side of the frame 62 interposed therebetween. The guide portion 53 is installed corresponding to the guide portion insertion hole 621, and the guide portion 53 is formed in the shape of a round bar. Then, the chuck 52 and the sheet stopper 54 are vertically cut in a direction orthogonal to one side of the frame 62, and the electronic component 60 is peeled off from the protective sheet 61.

FIG. 18 shows the flow of operation of such a peeling processing unit 5. FIG. 18 is a transition diagram schematically showing the state of the peeling processing unit 5 in each step. First, as shown in FIG. 18A, the component-embedded sheet 67 is placed on the mounting table 51 in a state where the top surface 603 of the electronic component 60 is in contact with the flat surface 511. That is, between the plate releasing unit 4 and the peeling processing unit 5, an inversion device is provided for upside down the component-embedded sheet 67 separated from the cooling plate 63 by the plate releasing section 4, and the component is embedded. The finished sheet 67 is placed on the mounting table 51 in an inverted state. A negative pressure is generated in the air hole 513 of the mounting table 51, and the electronic component 60 is attracted to the flat surface 511. The seat stopper 54 is moved to the edge of the guide portion insertion hole 621 of the frame 62, and the chuck 52 is positioned directly above the guide portion insertion hole 621 of the frame 62. The component stopper 55 is opened with respect to the seat stopper 54 and is positioned outside the guide portion insertion hole 621 of the frame 62.

As shown in FIG. 18B, the guide portion 53 is moved upward in the axial direction. The guide portion 53 moves in the guide portion insertion hole 621 of the frame 62 and reaches the end of the protective sheet 61 attached to the frame 62. The guide portion 53 further advances and projects the end of the protective sheet 61 in a direction away from the frame 62. As a result, the end of the protective sheet 61 begins to be peeled off by the guide portion 53. As the guide portion 53 advances further, the end of the protective sheet 61 is guided toward the chuck 52 while being sandwiched between the guide portion 53 and the seat stopper 54. While the guide portion 53 guides the end of the protective sheet 61, the chuck 52 may also move toward the end of the protective sheet 61 to pick up the end of the protective sheet 61.

As shown in FIG. 18C, when the end of the protective sheet 61 reaches the chuck 52, the pair of blocks is closed and the end of the protective sheet 61 is gripped by the chuck 52. When the chuck 52 grips the end of the protective sheet 61, as shown in FIG. 18D, the guide portion 53 is embedded in the guide portion insertion hole 621 of the frame 62, and then the component stopper 55 is moved to move the component. The stopper 55 and the seat stopper 54 are brought close to each other to a distance less than the length of the electronic component 60.

As shown in FIG. 18 (e), the chuck 52 is pulled up while moving the chuck 52 and the seat stopper 54 along the protective sheet 61. Since the end of the protective sheet 61 is gripped by the chuck 52 and the seat stopper 54 runs on the protective sheet 61, the protective sheet 61 is pulled up to the chuck 52 with the seat stopper 54 as the base point and the seat stopper 54 as the base point. The electronic component 60 is peeled off from the protective sheet 61. When the peeled protective sheet 61 is peeled off while maintaining a vertical state, for example, the speed components of the horizontal movement and the vertical movement of the chuck 52 may be kept the same. If both speed components are the same, peeling can be continuously performed without stopping as long as the movement speed does not stop, but it is preferable to maintain both movement speeds at a constant speed.

At this time, as shown in FIG. 19, the peeling of the electronic component 60 from the protective sheet 61 progresses, and only the end portion of the electronic component 60 is sandwiched between the sheet stopper 54 and the flat surface 511 of the mounting table 51. Then, the electronic component 60 tends to float so as to lift the peeling start end 60a. However, the component stopper 55 follows the seat stopper 54. The component stopper 55 presses the peeling start end 60a side that is about to rise. Therefore, the electronic component 60 is prevented from floating, the gap 94 between the electrode 602 peeled off from the protective sheet 61 and the protective sheet 61 continues to exist, the electronic component 60 does not reattach, and the mounting table 51 is flat. Maintained on surface 511. Further, since the seat stopper 54 is a roller that can rotate around the axis, it rotates when the electronic component 60 is pressed, and rubbing against the electronic component 60 is suppressed.

Further, the seat stopper 54 travels while pressing the non-adhesive surface 611 of the protective sheet 61. Therefore, until the peeling of the electronic component 60 starts and only the end portion of the electronic component 60 being peeled is sandwiched between the seat stopper 54 and the flat surface 511 of the mounting table 51, the sheet stopper 54 is also electronic. It prevents the component 60 from following the peeled protective sheet 61. However, from the viewpoint of exerting the function of creating the base point of peeling by the sheet stopper 54, it is not essential that the sheet stopper 54 travels while pressing the non-adhesive surface 611 of the protective sheet 61. That is, the seat stopper 54 may be moved to a position slightly distant from the protective sheet 61.

Then, as shown in FIG. 18 (f), when the chuck 52 and the sheet stopper 54 completely traverse the component arrangement area 615 of the protective sheet 61, all the electronic components 60 are peeled off from the protective sheet 61 and the mounting table is placed. Lined up on the flat surface 511 of 51. By recovering the electronic component 60, the formation of the electromagnetic wave shielding film 605 in the film forming apparatus 7 is completed. The angle of attack at which the chuck 52 traverses the flat surface 511 of the mounting table 51 and moves away from the mounting table 51 is not limited to 45 degrees. The position of the chuck 52 may be fixed and the mounting table 51 may be continuously moved to peel off the protective sheet 61, or both the chuck 52 and the mounting table 51 may be movable. good. That is, the chuck 52 and the mounting table 51 may move relatively.

Here, FIG. 25 is a schematic view showing the configuration of a conventional push-up device. This push-up device is a device for peeling the electronic component 60 from the adhesive film 9 having flexibility and adhesiveness similar to the protective sheet 61, and includes a pin body 8 movable in the axial direction. An adhesive film 9 to which an electronic component 60 is attached is set at the tip of the pin body 8. The pin body 8 pushes up the adhesive film 9 from the surface opposite to the attachment surface of the electronic component 60. The pin body 8 deforms the adhesive film 9 into a mountain shape with the electronic component 60 to be peeled off at the apex. Therefore, the sticking area between the electronic component 60 and the adhesive film 9 is reduced, whereby the electronic component 60 is peeled off from the adhesive film 9.

FIG. 26 is a schematic view showing a state of peeling of the electronic component 60 by this push-up device. As shown in FIG. 26, a plurality of electronic components 60 are attached to the adhesive film 9 with a gap. From the viewpoint of production efficiency, the intervals between the electronic components 60 attached to the adhesive film 9 are narrow. Therefore, when one electronic component 60 is pushed up, the distortion of the adhesive film 9 spreads to the attachment region of the adjacent electronic component 60. Then, while the peeling target is pushed up, a part of the adhesive film 9 is peeled off from the adjacent electronic component 60, and a peeling portion 91 is generated. However, when the peeling of the peeling target is completed, the pin body 8 retracts in the axial direction, so that the bending of the adhesive film 9 is eliminated. Then, the adhesive film 9 is reattached to the peeled portion 91, and the adhesive film 9 is reattached to the electronic component 60.

Then, FIG. 27 is a photograph showing the state of the electrode 602 after the adhesive film 9 is reattached to the electronic component 60. As shown in FIG. 27, when the adhesive film 9 is reattached, the electrode 602 is attached to the electrode 602. Residue 93 of the adhesive film 9 may be generated. The residue 93 of the adhesive film 9 may burn and carbonize during reflow when mounting the electronic component 60, which may cause poor connection or the like.

On the other hand, FIG. 20 is a photograph of the electrode 602 after the electronic component 60 is peeled from the protective sheet 61 by the peeling processing unit 5. According to the peeling processing unit 5, the protective sheet 61 is always maintained flat by the sheet stopper 54, and once the protective sheet 61 is peeled off, the protective sheet 61 returns to the electronic component 60 and is reattached. Can be prevented. Further, the position of the electronic component 60 is fixed by the component stopper 55 and the air hole 513 of the mounting table 51, and it is possible to prevent the electronic component 60 from floating so as to catch up with the protective sheet 61 and reattach. As a result, as shown in FIG. 20, no residue of the protective sheet 61 was found on the electrode 602 of the electronic component 60.

In this way, the peeling processing unit 5 peels off the electronic component 60 from the protective sheet 61 after the film formation by the film forming processing unit 3. The peeling processing unit 5 is provided with a mounting table 51, a chuck 52, and a fixing unit for fixing the position of the electronic component 60. The mounting table 51 supports the electronic component 60 attached to the protective sheet 61. The chuck 52 grips the end portion of the protective sheet 61, moves relative to the mounting table 51, and continuously peels off toward the opposite end of the end portion. The fixing portion fixes the position of the electronic component 60 when the electronic component 60 is peeled off from the protective sheet 61. As a result, the electronic component 60 and the protective sheet 61 are not reattached after being peeled off once, and the residue 93 of the protective sheet 61 can be suppressed from being generated in the electronic component 60.

The fixing portion is, for example, a flat surface 511 of a mounting table 51 in which a component stopper 55 or an air hole 513 is penetrated. The component stopper 55 follows the seat stopper 54 at a distance less than the length of the electronic component 60, and suppresses the lifting of the electronic component 60. The mounting table 51 attracts the electronic component 60 and suppresses the floating. However, as long as the mounting table 51 has a function as a fixing portion, it is not necessary to take suction by the air hole 513. For example, the mounting table 51 may be an adhesive chuck, an electrostatic chuck, or a mechanical chuck as long as the electronic component 60 can be fixed.

Further, a guide portion 53 projecting toward the end portion of the protective sheet 61 is provided. The chuck 52 is positioned at the protruding tip of the guide portion 53 before gripping the end portion of the protective sheet 61. Then, the guide portion 53 faces the chuck 52 and guides the end portion of the protective sheet 61 to the guide portion 53. As a result, a trigger for the chuck 52 to be gripped can be created, and the possibility of a peeling error between the electronic component 60 and the protective sheet 61 can be reduced.

Further, it is provided with a sheet stopper 54 that moves along the protective sheet 61 together with the chuck 52 and creates a base point for peeling. The sheet stopper 54 is located near the protrusion of the guide portion 53, and the end portion of the protective sheet 61 peeled off by the guide portion 53 is sandwiched together with the guide portion 53 to be guided to the chuck 52. As a result, the chuck 52 can more reliably grip the end of the protective sheet 61, and can reduce the possibility of peeling error between the electronic component 60 and the protective sheet 61.

Although the seat stopper 54 has been described as an example of a cylindrical body having an axis orthogonal to the moving direction of the seat stopper 54, it is sufficient that the seat stopper 54 can travel while pressing the protective sheet 61, and even if it is a plate-shaped body or a block body. good. Further, the component stopper 55 has been described as an example of a cylindrical body having an axis orthogonal to the moving direction of the component stopper 55, but may be a plate-shaped body, a block body, or a brush. When the component stopper 55 is a cylindrical body, it is a roller that can rotate around its axis, so that it rotates when the electronic component 60 is pressed down, and rubbing against the electronic component 60 is suppressed.

As the operation mechanism of the chuck 52, the operation mechanism of the seat stopper 54, the operation mechanism of the component stopper 55, and the operation mechanism of the guide portion 53, known mechanisms may be adopted, and the present invention is not limited to the mechanism of the mechanism. not.

For example, in the chuck 52, the following operation mechanism can be adopted. That is, both blocks are supported by the base, and one block is immovable with respect to the base. The other block is movable with respect to one block. An egg-shaped cam is in contact with the outside of the movable block. When this cam is rotated and the block approaches the major axis range, the movable block is pushed by the cam and approaches the immovable block. Further, a compression spring is provided between the pair of blocks to urge the pair in the direction of widening the distance between the blocks. When the cam is rotated and the block approaches the short diameter range, the movable block is separated from the immovable block by the urging force of the compression spring.

Further, for example, a ball screw and a rail extending at an angle of 45 degrees with respect to the flat surface 511 of the mounting table 51 are arranged, and the base of the chuck 52 is fixed to the slider of the ball screw and grips the rail. .. When the screw shaft of the ball screw is rotated by the motor, the chuck 52 moves along the rail from one end to the other end of the mounting table 51.

Further, regarding the component stopper 55, a tension spring is interposed between the base supporting the component stopper 55 and the seat stopper 54, and the ellipse is provided between the bases supporting both the rollers 54 and 55 while urging the rollers in the direction of approaching each other. When the cam is arranged in the shape of a cam and the major axis range of the cam is in contact with the base, the cams are urged in the direction of separating both rollers against the urging force of the tension spring.

Further, the guide portion 53 has a cam follower at the rear end portion. The cam follower follows the peripheral surface of the egg-shaped cam. The cam is pivotally supported by a rotary motor and can rotate in the circumferential direction. When the rotary motor is driven and the cam rotates, the cam follower climbs the bulging portion of the cam and the guide portion 53 is pushed up.

Further, the piercing position of the guide portion insertion hole 621 is set to a position equally spaced across the center of one side of the frame 62. This makes it easy to peel off the entire side of the protective sheet 61. The guide portion 53 was installed corresponding to the guide portion insertion hole 621, and the guide portion 53 was formed in the shape of a round bar. Then, the chuck 52 and the sheet stopper 54 are vertically cut in a direction orthogonal to one side of the frame 62, and the electronic component 60 is peeled off from the protective sheet 61. The peeling processing unit 5 is not limited to this, and can adopt various shapes of guide portion insertion holes and guide portions, and can also adopt various peeling directions.

For example, as shown in FIG. 21, a guide portion 53 having a long rounded rectangular shape, an oval shape, a rectangular cross section, or the like at the tip along one side of the frame 62 can be adopted. According to the guide portion 53, the range in which the protective sheet 61 is projected is widened, so that the protective sheet 61 can be easily rolled up and the end of the protective sheet 61 can easily reach the chuck 52. Further, as shown in FIG. 22, instead of the guide portion insertion hole 621, a notch 622 including the arrangement region of the guide portion 53 may be formed in the frame 62. Further, as shown in FIG. 23, the guide portion insertion hole 621 is arranged at the corner portion of the frame 62, and the chuck 52 and the seat stopper 54 are moved diagonally with the corner portion of the frame 62 as the peeling start point. It may be peeled off along the diagonal line of the protective sheet 61.

(Other embodiments)
The present invention is not limited to the above embodiment, but also includes the following aspects. That is, as shown in FIG. 24, the film forming apparatus 7 may further include a transfer unit 71 that is responsible for the component mounting process. The transfer unit 71 is responsible for the component mounting process, and transfers the electronic component 60 from the tray on which the electronic component 60 before the film forming process is mounted to the component non-mounted sheet 65. For example, the tray and the component unmounted sheet 65 may be arranged side by side, and the transfer unit 71 may be a robot that can move vertically and horizontally in a range including the tray and the component unmounted sheet 65. For example, a vacuum chuck is attached to the tip of the arm of the robot. The transfer unit 71 generates a negative pressure on the tray to hold the electronic component 60, releases the negative pressure due to vacuum breakage or an atmospheric opening on the component-unmounted sheet 65, and mounts the electronic component 60 on the component-unmounted sheet 65. Arrange on the table 65.

Further, the film forming apparatus 7 is an apparatus including an embedding processing unit 1, a plate mounting unit 2, a film forming processing unit 3, a plate releasing unit 4, and a peeling processing unit 5, but each of these units is configured as an independent device. It may be systematized. That is, the embedding processing unit 1 may be an independent embedding processing device, the plate mounting unit 2 may be an independent plate mounting device, and the film forming processing unit 3 may be an independent film forming processing device. The plate release unit 4 may be an independent plate release device, and the release processing unit 5 may be an independent release processing device.

In the above embodiment, the height H1 from the surface of the component arrangement region 615 to the upper end surface of the frame 62 is higher than the height H2 from the surface of the component arrangement region 615 to the top surface of the electronic component 60. However, the height is not limited to this, and the height may be lower than H2. In this case, a region of the flat surfaces 112, 212, 412 of the ceiling portions 11, 21, 41 facing the component arrangement region 615 is formed in a recessed portion that allows a difference between the height H1 and the height H2. It suffices to make it possible to form the closed spaces 14, 24a and 45.

Although the embodiment of the present invention and the modification of each part have been described above, the embodiment and the modification of each part are presented as an example, and the scope of the invention is not intended to be limited. These novel embodiments described above can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the invention described in the claims.

1 Embedded processing unit 11 Ceiling unit 111 Internal space 112 Flat surface 113 Air hole 114 Air pressure supply hole 115 O-ring 12 Mounting table 121 Internal space 122 Flat surface 123 Air hole 124 Air pressure supply hole 125 Pusher insertion hole 13 Pusher 14 Sealed space 2 Plate mounting part 21 Ceiling part 211 Internal space 212 Flat surface 213 Air hole 214 Air pressure supply hole 215 O-ring 22 Mounting stand 221 Opening 222 Edge part 223 Air pressure supply hole 224 Pusher insertion hole 23 Pusher 24a Sealed space 24b Sealed space 3 Film formation processing Part 31 Chamber 311 Processing position 312 Formation position 32 Load lock chamber 33 Separation part 34 Rotating table 35 Surface processing part 36 Spatter source 361 Target 4 Plate release part 41 Ceiling part 411 Internal space 412 Flat surface 413 Air hole 414 Air pressure supply hole 415 O-ring 42 Mounting table 421 Opening 422 Edge part 423 Air pressure supply hole 424 Pusher insertion hole 43 Pusher 44 Holding block 45 Sealed space 5 Peeling processing part 51 Mounting table 511 Flat surface 512 Internal space 513 Air hole 514 Air pressure supply hole 52 Chuck 53 Guide Part 54 Sheet stop roller 55 Parts stop roller 60 Electronic parts 60a Peeling start end 601 Electrode exposed surface 602 Electrode 603 Top surface 604 Side surface 605 Electromagnetic wave shield film 61 Protective sheet 611 Adhesive surface 612 Non-adhesive surface 613 Outer frame area 614 Middle frame area 615 Part arrangement area 62 Frame 621 Guide part insertion hole 622 Notch 63 Cooling plate 631 Pusher insertion hole 632 Air hole 64 Adhesive sheet 65 Parts not mounted sheet 66 Parts mounted sheet 67 Parts embedded sheet 68 Parts mounting plate 7 Membrane device 71 Transfer section 73 Transport section 74 Control section 75 Pneumatic circuit

Claims (5)

A film forming device for electronic components in which an exposed electrode surface with electrodes formed on the adhesive surface of a protective sheet is attached.
An embedding processing unit that embeds the electrodes of the electronic component in the adhesive surface of the protective sheet,
A film forming processing unit for forming a film forming material on the electronic component in which the electrode is embedded in the protective sheet, and a film forming processing unit.
Equipped with
The embedding processing unit is
A flat surface that is located opposite to the protective sheet with the electronic component in between and faces the electronic component.
At least, a decompression unit that decompresses the space between the protective sheet and the flat surface.
A pressure adjusting unit that adjusts the pressure in the space opposite to the flat surface with the protective sheet sandwiched between them.
A mounting surface located on the side opposite to the flat surface with the protective sheet sandwiched between them.
An air hole on the mounting surface side that opens in the above-mentioned mounting surface and generates a negative pressure prior to the decompression by the decompression unit to separate the protective sheet from the flat surface.
Have,
The pressure adjusting unit is the pressure in the space opposite to the space between the protective sheet and the flat surface in a state where the depressurization is maintained after the decompression of the space by the decompression unit. The electronic component and the protective sheet are pressed against each other with the flat surface as a pawl.
A film forming apparatus characterized by. The pressure adjusting portion includes the above-mentioned mounting surface side air hole, and includes the above-mentioned mounting surface side air hole.
The above-mentioned air hole on the mounting surface side is the electronic component with respect to the electronic component which has turned to the generation of positive pressure and stopped on the flat surface after the decompression of the space by the decompression unit is maintained. Pressing on the protective sheet,
The film forming apparatus according to claim 1 . The embedding processing unit is
A flat surface that opens to the flat surface as the decompression unit or separately from the decompression unit to generate a negative pressure to attract the electronic component to the flat surface and to attract the protective sheet toward the flat surface. Having a face-side air hole,
The film forming apparatus according to claim 1 or 2 . It is a film forming apparatus for electronic parts in which an electrode exposed surface on which an electrode is formed is attached to an adhesive surface of a protective sheet.
An embedding processing unit that embeds the electrodes of the electronic component in the adhesive surface of the protective sheet, and
A plate mounting portion for attaching the protective sheet to a cooling plate having air holes penetrating the front and back in a range including an area where the electronic components are arranged, and a plate mounting portion.
A film forming processing unit for forming a film forming material on the electronic component of the protective sheet attached to the cooling plate, and a film forming processing unit.
After passing through the film forming processing portion, a plate releasing portion for releasing the adhesion between the cooling plate and the protective sheet, and a plate releasing portion.
A peeling processing unit for peeling the electronic component from the protective sheet whose adhesion to the cooling plate has been released,
Equipped with
The embedding processing unit is
A flat surface located on the opposite side of the protective sheet across the electronic component and facing the electronic component,
A first decompression unit that decompresses at least the space between the protective sheet and the flat surface.
A pressure adjusting unit that adjusts the pressure in the space opposite to the flat surface with the protective sheet sandwiched between them.
A mounting surface located on the side opposite to the flat surface with the protective sheet sandwiched between them.
An air hole on the mounting surface side that opens in the above-mentioned mounting surface and generates a negative pressure prior to the decompression by the decompression unit to separate the protective sheet from the flat surface.
Have,
The pressure adjusting unit sandwiches the protective sheet rather than the space between the protective sheet and the flat surface in a state where the depressurization is maintained after the decompression of the space by the first decompression unit. The pressure in the space opposite to the flat surface is relatively increased, and the electronic component and the protective sheet are pressed against each other with the flat surface as a pawl.
The plate mounting portion is
It has a second decompression portion that decompresses the space between the region of the protective sheet in which the electronic components are arranged and the cooling plate.
After the decompression by the second decompression unit, the protective sheet and the cooling plate are pressed against each other.
The plate release portion is
A positive pressure generating hole that generates a positive pressure in the air hole of the cooling plate,
While pressurizing the region of the protective sheet where the electronic components are arranged through the positive pressure generating hole, the portion of the protective sheet that is out of the region where the electronic components are arranged is pressed down. It has a fixing portion that releases the presser after the area where the electronic components are arranged is separated from the cooling plate.
The peeling processing unit is
A mounting portion that supports the electronic component attached to the protective sheet, and a mounting portion that supports the electronic component.
A chuck that grips the end of the protective sheet, moves relative to the above-mentioned placement portion, and continuously peels off toward the opposite end of the end.
Having a fixing portion for fixing the position of the electronic component when the electronic component is peeled off from the protective sheet.
A film forming apparatus characterized by. An embedding processing device for embedding an electrode of an electronic component in the adhesive surface of the protective sheet with respect to an electronic component in which an exposed electrode surface on which an electrode is formed is attached to the adhesive surface of the protective sheet.
A flat surface located on the opposite side of the protective sheet across the electronic component and facing the electronic component,
At least, a decompression unit that decompresses the space between the protective sheet and the flat surface.
A pressure adjusting unit that adjusts the pressure in the space opposite to the flat surface with the protective sheet sandwiched between them.
A mounting surface located on the side opposite to the flat surface with the protective sheet sandwiched between them.
An air hole on the mounting surface side that opens in the above-mentioned mounting surface and generates a negative pressure prior to the decompression by the decompression unit to separate the protective sheet from the flat surface.
Have,
The pressure adjusting unit is the pressure in the space opposite to the space between the protective sheet and the flat surface in a state where the depressurization is maintained after the decompression of the space by the decompression unit. The electronic component and the protective sheet are pressed against each other with the flat surface as a pawl.
An embedding processing device characterized by.

Images