JP7132198B2 - Deposition equipment and embedding processing equipment - Google Patents

Description

The present invention relates to a film forming apparatus for forming a film on an electronic component attached to a protective sheet, and an embedding processing apparatus for embedding the electronic component in the adhesive surface of the protective sheet.

A large number of electronic components such as semiconductor devices are mounted on wireless communication devices typified by mobile phones. Electronic components are transported from processing equipment to processing equipment for various processes. A representative example of the treatment is the formation of an electromagnetic wave shielding film. The electromagnetic wave shield film suppresses the influence of electromagnetic waves inside and outside, such as leakage of electromagnetic waves to the outside, in order to prevent influence on communication characteristics. In general, an electronic component has an outer shape formed by a sealing resin, and in order to shield electromagnetic waves, a conductive electromagnetic wave shielding film is provided on the top surface and side surfaces of this sealing resin (see Patent Document 1). .

A plating method is known as a method of forming an electromagnetic wave shield film. However, since the plating method requires wet processes such as a pre-treatment process, a plating process, and a post-treatment process such as washing with water, it is inevitable that the manufacturing cost of electronic parts increases. Therefore, the sputtering method, which is a dry process, is attracting attention. In the sputtering method, an inert gas is introduced into a vacuum vessel in which a target is placed, and a voltage is applied. Then, the plasmatized inert gas ions collide with the target of the film-forming material, and the particles ejected from the target are deposited on the electronic component. This deposited layer becomes an electromagnetic wave shielding film.

A film forming apparatus that implements the sputtering method includes a cylindrical chamber whose interior is a vacuum chamber, a rotary table that is housed in the chamber and has a rotating shaft that is coaxial with the chamber, and a film forming position that is partitioned within the chamber. have An electronic component is placed on a rotary table, and the rotary table is rotated in a circumferential direction to bring the electronic component to a film forming position, thereby forming an electromagnetic wave shielding film. In this manner, the electronic components are rotated and conveyed even within the processing apparatus.

When the electronic parts are conveyed inside and outside the apparatus, the electronic parts are subject to inertial force due to acceleration/deceleration, rotation, and the like, and there is a risk that the electronic parts may fall over or fall out of the film forming position. Therefore, the electronic component is attached to the adhesive film, transported, and subjected to deposition of the electromagnetic wave shielding film. Adhesive force that resists inertial force can stop electronic components and keep them in proper positions. Such an adhesive film is hereinafter referred to as a protective sheet.

The protective sheet not only improves the blocking performance of the electronic component, but also prevents the particles of the electromagnetic wave shielding film from adhering to the electrodes during the film forming process, thereby maintaining the insulation between the electrodes. Electrodes of electronic components are generally called solder ball bumps, and are formed by bonding spherical solder (solder balls) with a diameter of several tens of μm to several hundred μm to pad electrodes of electronic components. The electrodes are exposed from the electrode exposed surface of the electronic component and are arranged in a matrix.

Such an electrode is embedded in a flexible adhesive film, and the exposed surface of the electrode is brought into close contact with the protective sheet. The embedding of the electrodes is performed by placing the electronic component on the adhesive surface of the protective sheet and pressing it. As a result, since the electrodes and the exposed electrode surfaces are covered with the protective sheet, the particles of the electromagnetic wave shielding film cannot enter between the exposed electrode surfaces and the protective sheet and do not reach the electrodes.

International Publication No. 2013/035819 JP-A-6-97268

Even if the electronic component is pressed against the protective sheet in order to embed the electrodes of the electronic component in the protective sheet as described above, the surface of the protective sheet may not be deformed following the surface of the electrode and the exposed electrode surface. As a result, a gap leading to the outside or a gap not leading to the outside may be generated between the electrode exposed surface and the protective sheet.

Particles of the electromagnetic wave shielding film enter through the gap leading to the outside during the film formation process. If the particles of the electromagnetic wave shielding film that have entered the gap adhere to the electrodes so as to bridge the gaps, the insulation between the electrodes cannot be maintained.

Moreover, if a gap that does not communicate with the outside is generated, the adhesion between the electronic component and the protective sheet is reduced. For this reason, when the electronic component is transported between apparatuses or transported within the film forming apparatus, the electronic component that loses the inertial force is peeled off from the protective sheet, and as described above, the electrode exposed surface and the protective sheet are separated from each other. This causes a gap leading to the outside between

In order to prevent the particles of the electromagnetic wave shielding film from entering as described above, among the plurality of electrodes arranged in a matrix, the space between the outermost electrode and the outer edge of the electrode exposed surface is covered with a protective sheet. is required. However, in recent years, the miniaturization of electronic components has progressed, and not only the gap between electrodes but also the distance from the outermost electrode to the outer edge of the electrode exposed surface has become very short. Then, since the area of the electrode exposed surface near the outer edge becomes small, the surface of the protective sheet is deformed so as to follow the surface of the electrode and the electrode exposed surface, making it difficult to secure the contact area. For this reason, in the case of electronic components that have been miniaturized, the problems of gaps and voids as described above are more likely to occur.

SUMMARY OF THE INVENTION The present invention has been proposed to solve the above-described problems, and aims to provide an embedding processing apparatus that performs embedding processing in which the electrode exposed surface of an electronic component is brought into good contact with a protective sheet. aim. Another object of the present invention is to provide a film-forming apparatus that performs film-forming processing on an electronic component that has undergone embedding processing so that the electrode exposed surface is in good contact with a protective sheet.

In order to achieve the above object, the film forming apparatus of the present invention is a film forming apparatus for an electronic component in which an electrode exposed surface on which electrodes are formed is attached to an adhesive surface of a protective sheet, the protective sheet and an embedding processing unit for embedding the electrode in the adhesive surface of the protective sheet, and a film forming processing unit for depositing a film forming material on the electronic component having the electrode embedded in the protective sheet, The processing section includes a chamber whose interior can be evacuated, a sheet pressurizing body provided in the chamber and positioned on the opposite side of the electronic component with the protective sheet interposed therebetween, and a sheet pressurizing body provided in the chamber. and a sheet-side elastic body provided on the sheet pressurizing body and having a flat sheet-facing surface facing the protective sheet. and a flat component facing surface provided on the component pressing body and facing the electronic component, and the sheet pressing body and the component pressing body are moved relative to each other, whereby the sheet facing surface and the component facing surface are moved relative to each other. and a driving mechanism for pressing the electronic component and the protective sheet against each other.

According to the embedding processing apparatus of the present invention, it is possible to carry out the embedding processing of bringing the electrode exposed surface of the electronic component into good contact with the protective sheet. Further, according to the film forming apparatus of the present invention, it is possible to further perform the film forming process on the electronic component that has been subjected to the embedding process of bringing the exposed electrode surface into good contact with the protective sheet.

It is a side view which shows the electronic component by which the film-forming process was carried out. FIG. 10 is a side view showing a state of the electronic component after undergoing film formation processing; FIG. 4 is an exploded perspective view showing a state of the electronic component when undergoing film formation processing; FIG. 4 is a transition diagram showing a film forming process flow for an electronic component; It is a block diagram which shows the structure of a film-forming apparatus. 4 is a schematic diagram showing the configuration of an embedding processing unit; FIG. FIG. 4 is a transition diagram schematically showing states in each step of the embedding processing section; FIG. 4 is a transition diagram schematically showing states in each step of the embedding processing section; FIG. 4 is a transition diagram showing states of electronic components in an embedding processing unit; It is a figure which shows the state in which the protective sheet and the component side elastic body contact|connected. It is a schematic diagram which shows a plate mounting part. It is a schematic diagram which shows a film-forming process part. It is a schematic diagram which shows a plate release part. It is a schematic diagram which shows a peeling process part.

[Electronic parts]
FIG. 1 is a side view showing an electronic component 60 subjected to film formation. An electromagnetic wave shielding film 605 is formed on the surface of the electronic component 60 . Note that FIG. 1 shows only the electromagnetic wave shielding film 605 in cross section. The electronic component 60 is a surface mount component such as a semiconductor chip, diode, transistor, capacitor or SAW filter. A semiconductor chip is an integrated circuit such as an IC or LSI in which a plurality of electronic elements are integrated. This electronic component 60 has a substantially rectangular parallelepiped shape such as BGA, LGA, SOP, QFP, WLP, etc., and one surface is an electrode exposed surface 601 . The electrode exposed surface 601 is a surface where the electrode 602 is exposed, faces the mounting substrate, and is connected to the mounting substrate. The electrodes 602 are called ball bumps or solder ball bumps, and are formed by mounting spherical solder (solder balls) having a diameter of several tens of micrometers to several hundred micrometers on a pad electrode.

The electromagnetic wave shield film 605 shields electromagnetic waves. The electromagnetic wave shielding film 605 is made of a material such as Al, Ag, Ti, Nb, Pd, Pt, Zr, or the like. The electromagnetic shielding film 605 may be made of a magnetic material such as Ni, Fe, Cr, Co, or the like. Further, SUS, Ni, Ti, V, Ta, etc. may be formed as the underlying layer of the electromagnetic wave shielding film 605, and SUS, Au, etc. may be formed as the outermost protective layer.

The electromagnetic wave shielding film 605 is formed on the top surface 603 and side surfaces 604 of the electronic component 60 , that is, on the outer surface other than the electrode exposed surface 601 . The top surface 603 is the surface opposite to the electrode exposed surface 601 . The side surface 604 is an outer peripheral surface that connects the top surface 603 and the electrode exposed surface 601 and extends at an angle different from that of the top surface 603 and the electrode exposed surface 601 . In order to obtain the shielding effect of blocking electromagnetic waves, the electromagnetic wave shielding film 605 should be formed at least on the top surface 603 . However, in order to obtain a good shield effect, it is preferable to form not only the entire top surface 603 but also the entire side surface 604 . A ground pin (not shown) is present on the side surface 604 . The formation of the electromagnetic wave shielding film 605 on the side surface 604 is also for grounding the electromagnetic wave shielding film 605 .

[Protection sheet]
FIG. 2 is a side view showing the state of the electronic component 60 after undergoing the film forming process. In FIG. 2, members other than the electronic component 60 are shown in cross section. FIG. 3 is an exploded perspective view showing how the electronic component 60 is supported during film formation. As shown in FIGS. 2 and 3 , the electrodes 602 of the electronic component 60 are embedded in the protective sheet 61 before the film forming process, and the exposed electrode surfaces 601 are in close contact with the protective sheet 61 . By embedding the electrode 602 in the protective sheet 61 , the particles of the electromagnetic wave shielding film 605 are prevented from reaching the electrode 602 . In addition, since the electrode exposed surface 601 and the protective sheet 61 are in close contact with each other, there is no room for the particles of the electromagnetic shielding film 605 to enter between the electrode exposed surface 601 and the protective sheet 61. Particles are less likely to reach.

The protective sheet 61 is made of heat-resistant synthetic resin such as PEN (polyethylene naphthalate) or PI (polyimide). One surface of the protective sheet 61 is an adhesive surface (adhesive layer) 611 having flexibility with which the electrode 602 bites and adhesiveness with which the electrode exposed surface 601 adheres. As the adhesive surface 611, various adhesive materials such as silicone-based resins, acrylic-based resins, urethane resins, and epoxy resins are used.

The adhesive surface 611 includes an outer frame region 613 that extends inward from the edge of the protective sheet 61 to a predetermined distance, a middle frame region 614 that extends inward from the inner periphery of the outer frame region 613 to a predetermined distance, and an inner side of the middle frame region 614 . is divided into a component arrangement area 615 of . The electronic component 60 is attached to the component arrangement area 615 . A frame-shaped frame 62 is attached to the outer frame region 613 . The middle frame area 614 is a range where the protective sheet 61 is bent, and neither the frame 62 nor the electronic component 60 is attached. A non-adhesive surface 612 is opposite to the adhesive surface 611 .

The protective sheet 61 is adhered to the cooling plate 63 via the adhesive sheet 64 . The cooling plate 63 is made of metal such as SUS, ceramics, resin, or other materials with high thermal conductivity. The cooling plate 63 is a heat radiation path that releases heat from the electronic component 60 and suppresses excessive heat accumulation. The adhesive sheet 64 has adhesiveness on both sides, increases adhesion between the protective sheet 61 and the cooling plate 63 , and secures a heat transfer area to the cooling plate 63 .

A height H1 from the surface of the component array area 615 to the upper end surface of the frame 62 is higher than a height H2 from the surface of the component array area 615 to the top surface 603 of the electronic component 60 (see FIG. 4). The height H1 is the length in the direction in which the electronic component 60 is pressed against the protective sheet 61, that is, the length in the direction perpendicular to the plane of the protective sheet 61. For convenience, it may be referred to as the thickness H1, but it has the same meaning. . In short, if a flat plate is placed on the frame 62, the top surface 603 of the electronic component 60 does not reach the flat plate.

A guide portion insertion hole 621 is provided through one end portion of the frame 62 . The guide portion insertion hole 621 has a long oval, rectangular, circular, or the like opening along the end portion of the frame 62, and is provided so as to pass through the surface attached to the protective sheet 61 and the opposite exposed surface. there is That is, for example, when a bar member is inserted into the guide insertion hole 621 and the end of the protective sheet 61 is pushed (see FIG. 14), one end of the protective sheet 61 is separated from the frame 62 .

A pusher insertion hole 631 is formed in the cooling plate 63 and the adhesive sheet 64 . The pusher insertion hole 631 does not align with the guide section insertion hole 621 and is penetrated at a position closed by the frame 62 . A plurality of pusher insertion holes 631 are provided so that the entire frame 62 is lifted in parallel when a rod-shaped member, for example, is inserted into the pusher insertion hole 631 and the tip of the rod-shaped member pushes up the frame 62 . For example, if the frame 62 is a rectangular frame, the pusher insertion holes 631 are positioned at the four corners or at the center of each side. From the viewpoint of maintaining the parallelism of the frame 62, the rod-like member preferably has a rectangular tip end face, that is, a thin plate shape or an L-shaped cross section. may have. The pusher insertion hole 631 correspondingly has a rectangular shape, an L shape, or a circular shape.

Furthermore, in the cooling plate 63 and the adhesive sheet 64, a large number of fine air holes 632 are formed at regular intervals over the entire area where the inner frame area 614 and the component arrangement area 615 of the protective sheet 61 are attached. This air hole 632 has, for example, a microcylindrical shape or a slit shape. The air holes 632 are provided to uniformly apply a negative pressure or a positive pressure to at least the component array region 615 of the protective sheet 61 stuck to the cooling plate 63 . The number of the air holes 632, the penetration interval and the penetration range are not limited to this. The air holes 632 may be arranged densely on the outside while the air holes 632 may be arranged sparsely on the outside.

[Deposition process flow]
In the film forming process, the electronic component 60 is separated into individual pieces on which the electromagnetic wave shielding film 605 is formed through a component mounting process, a component embedding process, a plate mounting process, a film forming process, a plate releasing process, and a component peeling process. is obtained.

FIG. 4 is a diagram showing a film forming process flow of the electronic component 60. As shown in FIG. As shown in FIG. 4, in the component placement step, the components are arranged in a state in which the electrode exposed surface 601 of the electronic component 60 faces the component unplaced sheet 65 in which the frame 62 is adhered to the protective sheet 61 . Electronic components 60 are arranged in region 615 . The protective sheet 61 to which the frame 62 is attached and the electronic components 60 are arranged but the electrodes 602 are not yet embedded is called a component-mounted sheet 66 .

In the component embedding step, the electrodes 602 are embedded in the protective sheet 61 of the component-mounted sheet 66 , and the exposed electrode surface 601 is brought into close contact with the protective sheet 61 . The protective sheet 61 in which the electrodes 602 are embedded is referred to as a component-embedded sheet 67 regardless of whether the electromagnetic wave shielding film 605 is formed or not. In the plate mounting step, the component-embedded sheet 67 is adhered to the cooling plate 63 via the adhesive sheet 64 . The cooling plate 63 with the component-embedded sheet 67 in close contact is referred to as a component mounting plate 68 .

In the film forming process, particles of the electromagnetic wave shielding film 605 are deposited from the top surface 603 side of the electronic component 60 to form the electromagnetic wave shielding film 605 on the electronic component 60 . At this time, the electrodes 602 of the electronic component 60 are buried in the protective sheet 61 . Also, the electrode exposed surface 601 is in close contact with the protective sheet 61 . Therefore, particles of the electromagnetic wave shielding film 605 are prevented from adhering to the electrode 602 .

In the plate release step, the cooling plate 63 is removed and the form of the component-embedded sheet 67 is restored. Then, in the component peeling process, the electronic components 60 are peeled off from the protective sheet 61 to separate the component-unmounted sheet 65 and the individual electronic components 60 . Also, the protective sheet 61 is removed from the frame 62 in preparation for reuse of the frame 62 . Thus, the film forming process is completed.

[Deposition equipment]
FIG. 5 shows the film forming apparatus 7 responsible for the component embedding process, the plate mounting process, the film forming process, the plate releasing process, and the component peeling process in the film forming process flow described above. The film forming apparatus 7 includes an embedding processing section 1 , a plate mounting section 2 , a film forming processing section 3 , a plate releasing section 4 and a peeling processing section 5 . Each section is connected by a conveying section 73, necessary members are introduced in each process, and members processed in each process are discharged. The transport unit 73 is, for example, a conveyor, and may be a transport table that is movable along a linear track with a ball screw or the like.

In addition, the film forming apparatus 7 includes a CPU for controlling the operation timing of each component included in the embedding processing unit 1, the plate mounting unit 2, the film forming processing unit 3, the plate releasing unit 4, and the peeling processing unit 5, a ROM, A control unit 74 such as a computer or microcomputer having a RAM and a signal transmission circuit is accommodated. Furthermore, an air pressure circuit 75 for supplying positive pressure and negative pressure to the embedding processing section 1, the plate mounting section 2, the film forming processing section 3, the plate releasing section 4 and the peeling processing section 5 is accommodated. The control unit 74 also controls an electromagnetic valve in the pneumatic circuit 75 to switch between generation of negative pressure, release of negative pressure, generation of positive pressure, and release of positive pressure.

[Embedding processing part]
(Constitution)
The embedding processing unit 1 that performs the component embedding process will be described. FIG. 6 is a schematic diagram showing the configuration of the embedding processing unit 1. As shown in FIG. A component-mounted sheet 66 is input to the embedding processing section 1 . The embedding processing unit 1 sandwiches the component-mounted sheet 66 between the sheet pressurizer 120 and the component pressurizer 130 in vacuum, and presses the electronic component 60 against the protective sheet 61 . As a result, the embedding processing section 1 embeds the electrodes 602 of the electronic component 60 in the protective sheet 61 and further brings the electrode exposed surface 601 into close contact with the protective sheet 61 .

The embedding processing section 1 includes a chamber 10, a sheet presser 120, and a component presser 130, as shown in FIG. The chamber 10 is a container whose interior can be evacuated. The chamber 10 includes a cover portion 11 and a mounting portion 12 that are arranged to face each other. The cover portion 11 is a box-shaped member having an opening at the bottom facing the mounting portion 12 and having an internal space 111 for accommodating the component-mounted sheet 66 to be embedded. The mounting portion 12 is a rectangular parallelepiped member. The opening of the cover portion 11 and the vicinity of the edge portion of the mounting portion 12 are opposing surfaces 11a and 12a that face each other and are arranged in parallel.

A sealing member 115 such as an O-ring is provided on the facing surface 11 a of the cover portion 11 . The cover part 11 is provided so as to be movable in directions approaching and separating from the mounting part 12 by a drive mechanism such as an air pressure or hydraulic cylinder (not shown). As a result, the opposing surface 11a of the cover portion 11 and the opposing surface 12a of the mounting portion 12 are aligned with each other through the sealing member 115, so that the sealing position for sealing the internal space 111 and the opposing surface 11a By separating from the facing surface 12 a of the mounting portion 12 , the internal space 111 is moved to an open position that is open to the atmosphere.

The mounting portion 12 is provided with a pusher insertion hole 12b, which is a through hole. The position of the pusher insertion hole 12 b is a position corresponding to the frame 62 of the component-mounted sheet 66 placed on the sheet pressing member 120 . A pusher 13, which will be described later, is inserted through the pusher insertion hole 12b. Between the pusher 13 and the inside of the pusher insertion hole 12b, there is provided a sealing member 12c such as an O-ring or packing for slidably sealing the pusher 13. As shown in FIG.

Further, the mounting portion 12 is formed with an exhaust hole 12d. The exhaust hole 12 d is connected to the pneumatic circuit 75 . The air pressure circuit 75 allows the internal space 111 of the sealed chamber 10 to be decompressed via the exhaust hole 12d.

The sheet presser 120 is a member provided in the chamber 10 and located on the opposite side of the electronic component 60 with the protective sheet 61 interposed therebetween. In this embodiment, the sheet pressing member 120 is a plate fixed on the mounting section 12 . A flat surface 120a is the surface of the sheet pressurizing member 120 that faces the component-mounted sheet 66. As shown in FIG. The area of the flat surface 120a is equal to or larger than the area of the component-mounted sheet 66. As shown in FIG. A plurality of guide pins (not shown) are provided on the flat surface 120a, and the guide pins abut against the outer edge of the frame 62, thereby preventing the component-mounted sheet 66 from being dislocated.

A sheet-side elastic body 121 is provided on the flat surface 120a. The sheet-side elastic body 121 is an elastically deformable sheet, and has a flat sheet-facing surface 121 a facing the component-mounted sheet 66 . For example, rubber such as silicone rubber can be used as the seat-side elastic body 121 . It should be noted that the seat-side elastic body 121 may be an elastic body made of a material capable of obtaining the effects of elastic deformation, which will be described later. For example, various materials such as urethane rubber, nitrile rubber, ethylene rubber, fluororubber, and Hanenite are applicable. The flatness means that the electronic components 60 on the component-mounted sheet 66 are flat enough to be uniformly pressed, and minute unevenness and surface roughness are allowed. In the present embodiment, the sheet-side elastic body 121 is attached to the flat surface 120a of the sheet pressurizing body 120 with an adhesive or the like on the side opposite to the sheet facing surface 121a. The sheet-side elastic body 121 may have a sheet-facing surface 121 a larger than the component arrangement region 615 .

As shown in FIG. 6, the height, that is, the thickness Ts of the sheet-side elastic body 121 is thicker than the thickness Te of the electrode 602 (see FIGS. 1 and 2). Further, the hardness of the seat-side elastic body 121 is preferably Shore A15 or more and Shore A50 or less. A component-mounted sheet 66 is placed on the sheet-facing surface 121 a of the sheet-side elastic body 121 . At this time, the guide pins provided on the flat surface 120a of the sheet pressing member 120 come into contact with the outer edge of the frame 62 as described above. As a method for fixing the component-mounted sheet 66 to the sheet-side elastic body 121, a mechanical chuck, a vacuum chuck, or an electrostatic chuck may be used.

The seat pressure body 120 and the seat side elastic body 121 are provided with pusher insertion holes 120b and 121b, which are through holes through which the pusher 13 is inserted, respectively. As a result, the pusher 13 that advances and retreats in the pusher insertion holes 12b, 120b, and 121b can protrude from the seat facing surface 121a of the seat-side elastic body 121. As shown in FIG. When the pushers 13 protrude from the pusher insertion hole 121b, the pushers 13 separate the component-mounted sheet 66 from the sheet-side elastic body 121 and lift it parallel to the sheet facing surface 121a. It is For example, when the outer shape of the frame 62 is rectangular, pusher insertion holes 12b, 120b, and 121b are provided corresponding to each corner of the frame 62, and the pushers 13 are arranged in each of them.

The pusher 13 is a rod-shaped member provided so as to be able to move forward and backward in the pusher insertion holes 12b, 120b, and 121b by a drive mechanism (not shown). The drive mechanism is configured by, for example, a cam mechanism. That is, the rear end portion of the pusher 13 serves as a cam follower. The cam follower follows the peripheral surface of the oval cam. The cam is axially supported by a rotary motor and is rotatable in the circumferential direction. When the rotary motor is driven and the cam rotates, the cam follower climbs the bulging portion of the cam, pushes up the pusher 13, and the tip of the pusher 13 protrudes from the pusher insertion hole 121b.

The component presser 130 is a member provided in the chamber 10 and located on the opposite side of the protective sheet 61 with the electronic component 60 interposed therebetween. The surface of the component pressurizing body 130 facing the electronic component 60 is a flat surface 130a. The flat surface 130a has a size equal to or larger than the component arrangement area 615. As shown in FIG. The component pressing body 130 of this embodiment is a cone having a flat surface 130a as a bottom surface. That is, the component pressurizing body 130 has a shape expanding toward the flat surface 130a with the center on the side opposite to the flat surface 130a as the apex.

The component pressurizing body 130 is provided movably in directions approaching and separating from the component-mounted sheet 66 by a drive mechanism 132 . The drive mechanism 132 is, for example, a pneumatic or hydraulic cylinder, and its drive shaft 132a is airtightly passed through a through hole provided in the ceiling of the cover portion 11 by a sealing member 132b such as an O-ring. The drive shaft 132 a is connected to the apex of the cone of the component pressing body 130 .

A component-side elastic body 131 is provided on the flat surface 130a. The component-side elastic body 131 is an elastically deformable sheet, and has a flat component facing surface 131 a facing the component-mounted sheet 66 . For example, silicone rubber or the like can be used as the component-side elastic body 131 . Materials applicable to the component-side elastic body 131 are the same as those of the seat-side elastic body 121 . The flatness means that the electronic components 60 on the component-mounted sheet 66 are flat enough to be uniformly pressed, and minute unevenness and surface roughness are allowed. In the present embodiment, the component-side elastic body 131 is adhered to the entire flat surface 130a of the component pressurizing body 130 with an adhesive or the like on the side opposite to the component facing surface 131a. The area of the component-side elastic body 131 should be larger than the area of the component arrangement region 615 .

Fa<Fb, where Fa is the adhesive force between the component facing surface 131a and the adhesive surface 611 of the protective sheet 61, and Fb is the adhesive force between the electrode exposed surface 601 and the adhesive surface of the protective sheet 61. FIG. Therefore, even if the protective sheet 61 comes into contact with the component facing surface 131a, it is easily peeled off from the component facing surface 131a while maintaining adhesion to the electrode exposed surface 601. FIG. Further, the component facing surface 131a has a surface roughness Ra (arithmetic mean roughness) of 1.6 or more and 25 or less. As a result, the component facing surface 131 a is easily separated from the top surface 603 of the electronic component 60 . However, since the component facing surface 131 a is less likely to slide in the direction parallel to the top surface 603 of the electronic component 60 , the electronic component 60 is less likely to shift in the planar direction of the protective sheet 61 .

(motion)
The operation flow of the embedding processing unit 1 will be described with reference to FIGS. 7 to 10. FIG. 7 and 8 are transition diagrams schematically showing states in each step of the embedding processing unit 1. FIG. FIG. 9 is a transition diagram showing states of the electronic component 60 in the embedding processing unit 1. As shown in FIG. FIG. 10 is a diagram showing a state in which the protective sheet 61 and the component-side elastic body 131 are in contact with each other.

First, as shown in FIG. 7A, the cover portion 11 is sufficiently separated from the mounting portion 12, and the tip of the pusher 13 protrudes from the sheet facing surface 121a of the seat side elastic body 121. As shown in FIG. In this state, the component-mounted sheet 66 is put into the embedding processing section 1 . The frame 62 of the loaded component-mounted sheet 66 is supported by the pusher 13 .

As shown in FIG. 7B, when the pusher 13 is retracted into the pusher insertion holes 12b, 120b, and 121b, the component-mounted sheet 66 comes into contact with the sheet-facing surface 121a of the sheet-side elastic body 121. As shown in FIG. At this time, the guide pin comes into contact with the outer edge of the component-mounted sheet 66 .

As shown in FIG. 7C, when the cover portion 11 is moved to the sealing position toward the mounting portion 12, the facing surface 11a of the cover portion 11 and the facing surface 12a of the mounting portion 12 are brought into contact with the sealing member. match via 115; As a result, the component-mounted sheet 66 is confined in the internal space 111 sealed by the sealing member 115 .

Then, a negative pressure is generated in the exhaust hole 12d of the mounting section 12, and the internal space 111 in which the component-mounted sheet 66 is confined is decompressed to evacuate. At this stage, as shown in FIG. 9A, the electronic component 60 is placed on the protective sheet 61 without the electrodes 602 embedded in the adhesive surface 611 of the protective sheet 61. and the adhesive surface 611, and this gap is also decompressed.

As shown in FIG. 8A, the component pressing member 130 is moved toward the sheet pressing member 120 to press the component facing surface 131a of the component-side elastic member 131 against the electronic component 60. As shown in FIG. Then, the electrodes 602 of the electronic component 60 are buried in the adhesive surface 611 of the protective sheet 61 . Then, as shown in FIG. 9B, the sheet-side elastic body 121 is deformed so as to sink together with the protective sheet 61, so that the electrode 602 is deformed so as to follow the surface of the electrode 602 and the electrode exposed surface 601 around it. and the electrode exposed surface 601 are in close contact with the protective sheet 61 . Therefore, insufficient embedding of the electrode 602 in the protective sheet 61 at the end of the component array region 615 and insufficient adhesion of the exposed electrode surface 601 to the protective sheet 61 can be prevented.

The close contact between the electrode exposed surface 601 and the protective sheet 61 is performed under the reduced pressure environment as described above, and the sealed internal space 111 has no or very little air. Therefore, the possibility of air bubbles entering between the electrode exposed surface 601 and the protective sheet 61 is reduced. In addition, since the component pressing body 130 is a cone extending from the drive shaft 132a to the flat surface 130a, the pressure from the drive shaft 132a is not concentrated in the center but is uniformly distributed over the flat surface 130a. Therefore, unlike a flat plate, the pressure of the drive shaft 132a is not concentrated in the center and curved, and all the electronic components 60 are evenly pressurized.

As shown in FIG. 9(B), the electronic component 60 pressed in this manner sinks along with the sheet-side elastic body 121 along with the protective sheet 61 immediately below. For this reason, the protective sheet 61 around the electronic component 60 that is pressed is once raised toward the component facing surface 131 a of the component-side elastic body 131 .

Next, as shown in FIG. 8B, the component-side elastic body 131 is separated from the electronic component 60 by moving the component-side elastic body 130 away from the sheet-pressurizing member 120 . Then, as shown in FIG. 9C, as the sheet-side elastic body 121 returns to its original shape, the raised portion of the protective sheet 61 returns to its original flat surface. For this reason, the protective sheet 61 is kept in close contact with the electrode exposed surface 601 , but the protective sheet 61 does not come into close contact with the lower portion of the side surface 604 of the electronic component 60 . Therefore, in the subsequent film forming process, the electromagnetic wave shielding film 605 can be formed up to the lower portion of the side surface 604 of the electronic component 60, and the electromagnetic wave incident from the side surface side can be shielded satisfactorily.

In addition, as shown in FIG. 10 , the adhesive surface 611 may reach the component facing surface 131 a of the component-side elastic body 131 due to the protrusion of the protective sheet 61 . Even in this case, since the protective sheet 61 returns to its original shape as the sheet-side elastic body 121 returns to its original shape after the pressing is released, it is easy to separate from the part-side elastic body 131 . Moreover, the adhesive force Fa between the component facing surface 131a of the component-side elastic body 131 and the adhesive surface 611 of the protective sheet 61 is greater than the adhesive force Fb between the electrode exposed surface 601 of the electronic component 60 and the adhesive surface 611 of the protective sheet 61. Since the protective sheet 61 is small, the adhesive surface 611 of the protective sheet 61 can be more easily peeled off from the component-side elastic body 131 while maintaining adhesion to the electrode exposed surface 601 .

Furthermore, the component facing surface 131a has a surface roughness Ra (arithmetic mean roughness) of 1.6 or more and 25 or less. Therefore, when the component pressurizing body 130 releases the pressure applied to the electronic component 60 , the component facing surface 131 a of the component-side elastic body 131 is easily separated from the electronic component 60 .

As described above, when the electrode 602 of the electronic component 60 is embedded in the protective sheet 61 and the electrode exposed surface 601 of the electronic component 60 is in close contact with the protective sheet 61, the pressure reduction from the exhaust hole 12d by the pneumatic circuit 75 is stopped. The vacuum inside the chamber 10 is released. Along with this, the pusher 13 is moved in the axial direction along the pusher insertion holes 12b, 120b, and 121b to protrude from the seat facing surface 121a of the seat side elastic body 121 again.

Then, as shown in FIG. 8C, the cover portion 11 is moved in a direction away from the placing portion 12 . Finally, the pusher 13 is stopped, and the cover portion 11 is stopped at a position separated from the mounting portion 12 . This completes the embedding of the electronic component 60 in the protective sheet 61 by the embedding processor 1 .

It should be noted that it is necessary to release the pressure applied to the electronic component 60 by the component pressurizing body 130 before releasing the evacuation of the chamber 10 . When the vacuum inside the chamber 10 is released before the pressurization of the electronic component 60 is released, the ambient pressure becomes atmospheric pressure while the protective sheet 61 is raised as described above. Then, when the adhesive surface 611 of the protective sheet 61 adheres to the side surface 604 of the electronic component 60 or adheres to the component facing surface 131a of the component-side elastic body 131, the adhered state is changed by the ambient atmospheric pressure. This is because it is fixed and cannot be peeled off.

[Plate mounting part]
Next, the plate mounting section 2 that performs the plate mounting process will be described. 11A and 11B are schematic diagrams showing the plate mounting portion 2. FIG. A cooling plate 63 to which an adhesive sheet 64 is attached in advance and a component-embedded sheet 67 prepared by the embedding processing section 1 are put into the plate mounting section 2 . The plate mounting unit 2 presses the component-embedded sheet 67 against the cooling plate 63 and attracts the component-embedded sheet 67 to the cooling plate 63 . 63 is brought into close contact.

The plate mounting section 2 includes a ceiling section 21 and a mounting table 22 . The ceiling portion 21 and the mounting table 22 are arranged to face each other. On the other hand, the ceiling part 21 can be raised and lowered with respect to the mounting table 22 . The ceiling part 21 is a block having an internal space 211 and has a flat surface 212 on the surface facing the mounting table 22 . The mounting table 22 has a bottomed cup shape. An opening 221 of the mounting table 22 faces the ceiling portion 21 .

The edge 222 of the mounting table 22 supports the cooling plate 63 and the opening 221 is closed by the cooling plate 63 . The surface of the cooling plate 63 opposite to the surface to which the adhesive sheet 64 is attached contacts the edge portion 222 . Further, the component-embedded sheet 67 is placed on the cooling plate 63 so as to face the adhesive sheet 64 . An air pressure supply hole 223 is provided through the bottom of the mounting table 22 . The air pressure supply hole 223 is connected to the air pressure circuit 75 .

Furthermore, a pusher insertion hole 224 is provided through the edge portion 222 of the mounting table 22 so as to penetrate the mounting table 22 . The pusher 23 is inserted through the pusher insertion hole 631 and is airtightly sealed with a sealing member such as an O-ring. The pusher 23 can be retracted through the mounting table 22, the cooling plate 63, and the adhesive sheet 64. As shown in FIG.

A large number of air holes 213 communicating with the internal space 211 are provided through the flat surface 212 of the ceiling portion 21 . An air pressure supply hole 214 is provided through the interior space 211 of the ceiling portion 21 at a location different from the flat surface 212 . The air pressure supply hole 214 is connected to the air pressure circuit 75 .

Further, on the flat surface 212 of the ceiling portion 21, along the frame 62 of the component-embedded sheet 67 placed on the mounting table 22, a sealing member 215 such as an O-ring surrounds the penetrating range of the air hole 213. is set up. That is, the outer peripheral portion of the flat surface 212 of the ceiling portion 21 presses the frame 62 via the sealing member 215 and presses the outer peripheral portion of the protective sheet 61 against the cooling plate 63 .

As shown in FIG. 11A, the plate mounting unit 2 has the cooling plate 63 mounted on the edge 222 of the mounting table 22 and the pusher 23 supporting the frame 62 of the component-embedded sheet 67. In this state, the ceiling part 21 is lowered to generate a negative pressure in the internal space 211 to suck the electronic component 20 onto the flat surface 212 . When the pusher 23 and the ceiling part 21 are lowered and the frame 62 is pressed against the adhesive sheet 64 via the protective sheet 61, a closed space is formed between the cooling plate 63 on which the adhesive sheet 64 is installed and the protective sheet 61. .

As shown in FIG. 11B, while maintaining the negative pressure in the ceiling portion 21, the mounting table 22 is also caused to have a negative pressure, and then the negative pressure in the ceiling portion 21 is gradually changed to a positive pressure. Then, the component-embedded sheet 67 is attached by being pressed against the adhesive sheet 64 attached to the cooling plate 63 .

[Deposition processing unit]
Next, the film-forming processing part 3 which takes charge of the film-forming process is demonstrated. FIGS. 12A and 12B are schematic diagrams showing the film forming processing section 3. FIG. The film forming section 3 forms an electromagnetic wave shielding film 605 on each electronic component 60 on the component mounting plate 68 by sputtering. As shown in FIG. 12A, the film forming processing section 3 has a chamber 31 and a load lock chamber 32 . The chamber 31 is a cylindrical vacuum chamber whose diameter is larger in the radial direction than in the axial direction. The interior of the chamber 31 is partitioned into a plurality of fan-shaped partitions by partitions 33 extending along the radial direction. A processing position 311 and a film forming position 312 are assigned to some fan-shaped sections.

The partition 33 extends from the ceiling surface of the chamber 31 toward the bottom surface, but does not reach the bottom surface. A rotary table 34 is installed in the space on the bottom side without the partition 33 . The rotary table 34 is a conveying device that conveys the cooling plate 63 . Electronic components 60 embedded in the protective sheet 61 are mounted on the cooling plate 63 . The rotary table 34 has a disk shape coaxial with the chamber 31 and rotates in the circumferential direction. The component mounting plate 68 introduced into the chamber 31 from the load-lock chamber 32 is placed on the rotary table 34 and travels around the processing position 311 and the film forming position 312 while rotating along a circular track.

In order to maintain the position of the component mounting plate 68 with respect to the rotary table 34, the rotary table 34 holds the component mounting plate 68 such as grooves, holes, projections, jigs, holders, mechanical chucks, or adhesive chucks. A retaining means is provided.

A surface treatment section 35 is installed at the treatment position 311 . A process gas such as argon gas is introduced into the surface treatment section 35, and a high frequency voltage is applied to convert the process gas into plasma to generate electrons, ions, radicals, and the like. For example, the surface-treated portion 35 is a cylindrical electrode that opens toward the rotary table 34, and is applied with a high-frequency voltage from an RF power supply.

A target 361 constituting a sputtering source 36 is installed at the film forming position 312, and a sputtering gas, which is an inert gas such as argon gas, is introduced. The sputtering source 36 applies electric power to the target 361 to turn the sputtering gas into plasma and cause the generated ions or the like to collide with the target 361 to eject particles. The target 361 is made of the material of the electromagnetic wave shielding film 605 . That is, the particles of the electromagnetic wave shielding film 605 are ejected from the target 361 , and the ejected particles of the electromagnetic shielding film 605 are deposited on the electronic component 60 on the rotary table 34 .

For example, two film forming positions 312 are provided. The target material for each film forming position 312 may be the same material, or different materials may be used to form the laminated electromagnetic wave shielding film 605 . A known power supply such as a DC power supply, a DC pulse power supply, an RF power supply, or the like can be applied as the power supply for applying power to the sputtering source 36 of each film forming position 312 . A power source for applying power to the sputtering sources 36 may be provided for each sputtering source 36, or a common power source may be used by switching with a switch.

In such a film-forming processing unit 3, the surface of the electronic component 60 is cleaned and roughened by etching or ashing at the processing position 311, and the adhesion of the electromagnetic wave shielding film 605 to the electronic component 60 is improved. Also, by depositing the particles of the target 361 on the electronic component 60 at the film forming position 312 , the electromagnetic wave shielding film 605 is formed on the electronic component 60 . Since the electrode 602 is embedded in the protective sheet 61 and the exposed electrode surface 601 is in close contact with the protective sheet 61, the particles of the electromagnetic wave shielding film 605 are prevented from adhering to the electrode 602, and the exposed electrode surface 601 and the protective sheet are prevented from adhering. 61, particles of the electromagnetic wave shielding film 605 are prevented from entering. Furthermore, the heat of the electronic component 60 is transferred to the cooling plate 63, and excessive heat accumulation in the electronic component 60 is suppressed.

In addition, although this film-forming process part 3 forms a film on the electronic component 60 using a sputtering method, the film-forming method is not restricted to this. For example, the film-forming processing unit 3 may be a device that forms the electromagnetic wave shielding film 605 on the electronic component 60 by vapor deposition, spray coating, application, or the like.

[Plate release part]
Next, the plate releasing section 4 that performs the plate releasing process will be described. 13A and 13B are schematic diagrams showing the plate release portion 4. FIG. A component mounting plate 68 in which an electromagnetic wave shielding film 605 is formed on the electronic component 60 is put into the plate releasing section 4 . As the first step for obtaining the individual electronic components 60 , the plate releasing section 4 peels off the component-embedded sheet 67 from the cooling plate 63 .

As shown in FIG. 13A, the plate releasing section 4 includes a ceiling section 41 and a mounting table 42. As shown in FIG. The ceiling part 41 and the mounting table 42 are arranged to face each other. On the other hand, the ceiling part 41 can be raised and lowered with respect to the mounting table 42 . The ceiling part 41 is a block having an internal space 411 and has a flat surface 412 on the surface facing the mounting table 42 . The mounting table 42 has a bottomed cup shape, and the opening 421 faces the ceiling portion 41 .

In this mounting table 42 , the edge 422 supports the component mounting plate 68 and the opening 421 is closed by the component mounting plate 68 . The edge 422 abuts the cooling plate 63 . An air pressure supply hole 423 is provided through the bottom of the mounting table 42 . The air pressure supply hole 423 is connected to the air pressure circuit 75 .

Furthermore, a pusher insertion hole 424 is provided through the edge portion 422 of the mounting table 42 . The pusher 43 is inserted through the pusher insertion hole 424 and is airtightly sealed with a sealing member such as an O-ring. The pusher 43 moves in the axial direction so that the tip thereof can protrude to a position higher than the frame 62 of the component mounting plate 68 placed on the mounting table 42 .

A pair of clamping blocks 44 are arranged on both sides of the mounting table 42 . The sandwiching block 44 sandwiches only the cooling plate 63 among the component mounting plates 68 placed on the mounting table 42 . The sandwiching blocks 44 can move toward and away from each other with the cooling plate 63 as the center.

Next, a large number of air holes 413 communicating with the internal space 411 are provided through the flat surface 412 of the ceiling portion 41 . An air pressure supply hole 414 is provided through the interior space 411 of the ceiling portion 41 at a location different from the flat surface 412 . An air pressure circuit 75 is connected to the air pressure supply hole 414 .

Further, on the flat surface 412 of the ceiling portion 41, a sealing member 415 such as an O-ring is installed along the frame 62 of the component mounting plate 68 placed on the mounting table 42 to surround the penetrating range of the air hole 413. ing.

In such a plate release unit 4 , the component mounting plate 68 to which the cooling plate 63 is attached is mounted on the mounting table 42 . As shown in FIG. 13A, the ceiling portion 41 is lowered toward the mounting table 42 and the flat surface 412 of the ceiling portion 41 is brought into contact with the frame 62 of the component mounting plate 68 . As shown in FIG. 13B, negative pressure is generated in the sealed internal space 411 of the ceiling portion 41 and positive pressure is generated in the mounting table 42 . As a result, sufficient force acts on the component array region 615 to separate the component array region 615 from the cooling plate 63 , and the component array region 615 is separated from the cooling plate 63 .

When the component arrangement area 615 is peeled off from the cooling plate 63, the outer frame area 613 to which the frame 62 is attached is peeled off from the cooling plate 63 due to the movement of the ceiling part 41 as the pusher 43 advances. Peel off from 63 .

[Peeling treatment part]
Furthermore, the peeling processing section 5 that takes charge of the component peeling process will be described. FIGS. 14A and 14B are schematic diagrams showing the peeling treatment section 5. FIG. A component-embedded sheet 67 from which the cooling plate 63 has been removed is fed through the plate releasing unit 4 to the peeling processing unit 5 , and the individual electronic components 60 are peeled off from the protective sheet 61 .

This peeling processing unit 5 includes a mounting table 51 on which a component-embedded sheet 67 is mounted, a chuck 52 that grips the protective sheet 61 and moves continuously, and a chuck that hooks the edge of the protective sheet 61 . 52 includes a guide portion 53 that creates a trigger for gripping the protective sheet 61, a sheet stopper 54 that creates a peeling starting point for the protective sheet 61, and a component stopper 55 that prevents the electronic component 60 from floating.

The mounting table 51 has a flat surface 511 on which the component-embedded sheet 67 is mounted. The component-embedded sheet 67 is placed with the electronic component 60 facing the flat surface 511, the top surface 603 of the electronic component 60 in contact with the mounting surface, and the protective sheet 61 facing upward.

This mounting table 51 is a block having an internal space 512 . A large number of air holes 513 are formed through the flat surface 511 of the mounting table 51 in a region facing the component arrangement region 615 . The air hole 513 communicates with the internal space 512 of the mounting table 51 . An air pressure supply hole 514 is provided through the internal space 512 of the mounting table 51 at a location different from the flat surface 511 . The air pressure supply hole 514 is connected to the air pressure circuit 75 .

The chuck 52 is a pair of blocks with gripping surfaces facing each other. A pair of blocks can be connected and separated. The chuck 52 is supported by a moving device that is horizontally and vertically movable, and moves along the protective sheet 61 placed on the flat surface 511 of the mounting table 51 at an attack angle of 45 degrees with respect to the flat surface 511 . move continuously.

The sheet stopper 54 is a roller that has a cylindrical shape with a long axis that crosses one side of the protective sheet 61 and that can rotate about its axis. The sheet stopper 54 maintains a constant height with respect to the flat surface 511 of the mounting table 51, maintains a position right below the chuck 52, and extends the protective sheet 61 mounted on the mounting table 51 along the direction perpendicular to the long axis. traversing the

The component stopper 55 is a roller that has a cylindrical shape with a long axis that traverses at least the entire component arrangement area 615 of the protective sheet 61 and that can rotate about its axis. The component stopper 55 is arranged so as to be able to approach and separate from the sheet stopper 54 .

The guide portion 53 is arranged at a position coaxial with the guide portion insertion hole 621 of the frame 62 . The tip of the guide portion 53 faces the guide portion insertion hole 621 of the frame 62 . This guide part 53 is movable in the axial direction, protrudes toward the edge of the protective sheet 61 , pushes the edge of the protective sheet 61 up toward the chuck 52 , and moves the frame 62 until the edge of the protective sheet 61 reaches the chuck 52 . advances through the guide portion insertion hole 621 of the . This guide part 53 peels off one side of the protective sheet 61 by pushing up.

14A, the component-embedded sheet 67 is placed on the mounting table 51 with the top surface 603 of the electronic component 60 in contact with the flat surface 511. do. A negative pressure is generated in the air hole 513 of the mounting table 51 to hold the electronic component 60 on the flat surface 511 . The guide portion 53 moves upward in the axial direction to project the edge of the protective sheet 61 away from the frame 62 , peel off the edge of the protective sheet 61 , and guide it toward the chuck 52 .

When the edge of the protective sheet 61 reaches the chuck 52, the pair of blocks are closed and the chuck 52 grips the edge of the protective sheet 61 as shown in FIG. 14(B). When the chuck 52 grips the edge of the protective sheet 61 , the component stopper 55 is moved to bring the component stopper 55 and the sheet stopper 54 closer together to a distance less than the length of the electronic component 60 .

The chuck 52 is pulled up while moving the chuck 52 and the sheet stopper 54 along the protective sheet 61 . Then, the protective sheet 61 is pulled up by the chuck 52 with the sheet stopper 54 as a starting point, and the electronic component 60 is separated from the protective sheet 61 with the sheet stopper 54 as a starting point. As a result, all the electronic components 60 are peeled off from the protective sheet 61 and arranged on the flat surface 511 of the mounting table 51 . In this way, electronic components 60 separated from protective sheet 61 are collected.

(Effect)
(1) This embodiment is a film forming apparatus 7 for an electronic component 60 in which an electrode exposed surface 601 having an electrode 602 formed thereon is attached to an adhesive surface 611 of a protective sheet 61, and the adhesive surface of the protective sheet 61 is An embedding processing unit 1 for embedding electrodes 602 in 611 and a film forming processing unit 3 for forming a film of a film forming material on the electronic component 60 with the electrodes 602 embedded in the protective sheet 61 are provided.

The embedding processing unit 1 includes a chamber 10 whose interior can be evacuated, a sheet pressurizing body 120 provided in the chamber 10 and positioned on the opposite side of the electronic component 60 with the protective sheet 61 interposed therebetween; A component pressurizing body 130 provided in the chamber 10 and located on the opposite side of the protective sheet 61 with the electronic component 60 therebetween, and a flat sheet facing surface provided on the sheet pressurizing body 120 and facing the protective sheet 61. 121a, a flat component facing surface 131a provided on the component pressurizing body 130 and opposed to the electronic component 60, and by relatively moving the sheet pressurizing body 120 and the component pressurizing body 130 and a driving mechanism 132 for pressing the electronic component 60 and the protective sheet 61 together between the sheet facing surface 121a and the component facing surface 131a.

Therefore, when the electronic component 60 is pressed against the protective sheet 61 , the sheet-side elastic body 121 is elastically deformed, so that the protective sheet 61 deforms following the surface of the electrode 602 and the electrode exposed surface 601 and adheres thereto. In other words, when the protective sheet 61 is supported by a hard plate or the like, the amount of deformation of the protective sheet 61 alone is limited. On the other hand, in this embodiment, since the protective sheet 61 is supported by the sheet-side elastic body 121, the thickness into which the electrode 602 sinks can be increased, and the protective sheet 61 allows the surface of the electrode 602 and the electrode. It becomes easy to deform along the unevenness of the exposed surface 601 . Therefore, the protective sheet 61 can be brought into close contact with the protective sheet 61 by suppressing the occurrence of gaps and gaps between the protective sheet 61 and the surface of the electrode 602 and the electrode exposed surface 601, and the particles of the electromagnetic wave shielding film 605 can escape from the gaps during film formation. prevented from entering. When relying on the deformation of only the protective sheet 61, a high pressure is required to crimp the protective sheet 61. However, in the present embodiment, the sheet-side elastic body 121 is deformed, so a relatively low-pressure drive is required. Even the mechanism 132 can be easily deformed, and the size of the entire device can be reduced.

As a result, for example, even when the distance Wb (see FIG. 2) from the outermost electrode 602 to the outer edge of the electrode exposed surface 601 is small, the protective sheet 61 is brought into close contact with the surface of the electrode 602 and the electrode exposed surface 601. be able to. In addition, the protective sheet 61 needs to be relatively thin so that the heat accumulated in the electronic component 60 during film formation can be easily released to the film formation processing section 3 by heat conduction. However, if the protective sheet 61 is thin, the cushioning performance is weak and the amount of deformation is even smaller. Therefore, the electrode 602 protruding from the exposed electrode surface 601 by several tens of μm to several hundred μm cannot be absorbed by the deformation of the protective sheet 61 alone, and it is difficult for the protective sheet 61 to deform so as to conform to the surface of the electrode 602 and the electrode exposed surface 601 . In this embodiment, the sheet-side elastic body 121 deforms as described above, so that the amount of deformation of the protective sheet 61 can be ensured, so that the occurrence of gaps and voids can be suppressed.

Further, since the deformation of the sheet-side elastic body 121 is elastic deformation, the pressure is released after the sheet-facing surface 121a is deformed so as to sink when the electronic component 60 and the protective sheet 61 are pressed against each other. returns to its original flat shape. Then, even if the protective sheet 61 comes into contact with the side surface 604 of the electronic component 60 due to sinking, the protective sheet 61 returns to its original shape together with the sheet-side elastic body 121, thereby preventing adhesion to the side surface 604. can. As a result, the formation of the electromagnetic wave shielding film 605 is not hindered by the protective sheet 61 adhered to the side surface 604, and insufficient formation of the electromagnetic wave shielding film 605 on the side surface 604 and poor connection with the ground wiring can be prevented. Furthermore, even if the protective sheet 61 is deformed enough to come into contact with the component facing surface 131a, it returns to its original shape together with the sheet-side elastic body 121, thereby preventing it from adhering to the component facing surface 131a.

(2) The film-forming processing unit 3 includes a chamber 31 into which a sputtering gas is introduced, a sputtering source 36 provided in the chamber 31 for depositing a film-forming material by sputtering to form a film, and a protective sheet 61 embedded therein. It has a cooling plate 63 on which the electronic component 60 is mounted, and a transport device for transporting the cooling plate 63 .

As described above, by deforming the sheet-side elastic body 121, the protective sheet 61 can be deformed so as to follow the surface of the electrode 602 and the electrode exposed surface 601. Therefore, the protective sheet 61 can be made thinner, and the electronic component can be manufactured. The heat of 60 can be easily released to the cooling plate 63, and the heat dissipation effect can be enhanced.

(3) The thickness Ts of the sheet-side elastic body 121 is greater than the thickness Te of the electrode 602, and the hardness is Shore A15 or more and Shore A50 or less. For this reason, the sheet-side elastic body 121 has a preferable thickness so that the electrode 602 sinks and deforms together with the protective sheet 61 . Moreover, the protective sheet 61 deforms so as to follow the surface of the electrode 602 and the electrode exposed surface 601, and has a hardness suitable for returning to its original shape and peeling off from the side surface 604 and the component facing surface 131a. More specifically, if the hardness of the sheet-side elastic body 121 is less than Shore A15, the sheet-side elastic body 121 deformed under pressure when the electronic component 60 is embedded becomes difficult to restore. At the same time, it becomes difficult for the protective sheet 61 to return to its original shape. Therefore, when the protective sheet 61 comes into contact with the component-side elastic body 131 or the side surface 604 of the electronic component 60, it becomes difficult to peel off. In this embodiment, since the hardness of the sheet-side elastic body 121 is Shore A15 or more, the protective sheet 61 is easily peeled off even in such a case. On the other hand, if the hardness of the sheet-side elastic body 121 is higher than Shore A50, the sheet-side elastic body 121 is difficult to deform even when the electronic component 60 is embedded, and the protective sheet 61 is deformed together with the sheet-side elastic body 121 . becomes difficult. Therefore, when the distance Wb from the outermost electrode 602 to the outer edge of the electrode exposed surface 601 is narrow, it becomes difficult to bring the protective sheet 61 into close contact with the surface of the electrode 602 and the electrode exposed surface 601 . In this embodiment, since the hardness of the sheet-side elastic body 121 is Shore A50 or less, the protective sheet 61 is deformed to easily adhere to the surface of the electrode 602 and the electrode exposed surface 601 .

(4) Fa<Fb, where Fa is the adhesive force between the component facing surface 131a and the protective sheet 61, and Fb is the adhesive force between the electrode exposed surface 601 of the electronic component 60 and the adhesive surface 611 of the protective sheet 61. Therefore, even when the protective sheet 61 is in contact with the component facing surface 131a, it can be easily peeled off while maintaining adhesion to the electrode exposed surface 601. FIG. As a result, the protective sheet 61 is kept attached to the component facing surface 131a, and is prevented from contacting and adhering to the side surface 604 of the electronic component 60, thereby preventing the occurrence of portions where the film is not formed.

(5) The component facing surface 131a has a surface roughness Ra (arithmetic mean roughness) of 1.6 or more and 25 or less. Therefore, sticking to the electronic component 60 is prevented, and when the pressing is released, the electronic component 60 is prevented from following and rising.

(6) The component pressing body 130 is provided with a component-side elastic body 131 having a component facing surface 131a. Therefore, when the protective sheet 61 is in contact with the component facing surface 131a, it is possible to improve the peelability.

[Other embodiments]
The present invention is not limited to the above embodiments, and includes the following aspects. For example, the component-side elastic body 131 may be omitted. In this case, the flat surface 130a of the component pressing member 130 functions as the component facing surface 131a. In this case also, the surface of the flat surface 130a may be roughened or roughened so as to be easily separated from the adhesive surface 611 of the protective sheet 61 and the top surface 603 of the electronic component 60. FIG. Also, a material that can be easily peeled off, such as a peeling sheet, may be attached to the flat surface 130a.

A known mechanism can be applied to the drive mechanism of the cover part 11 and the drive mechanism 132 of the component pressurizing body 130, and is not limited to the above mechanism. For example, a linear guide may be applied in which a slider moves along a rail as the ball screw rotates. Moreover, the sheet pressurizing member 120 and the component pressurizing member 130 need only be able to press the electronic component 60 and the protective sheet 61 against each other by relative movement. Therefore, the drive mechanism 132 may be provided in at least one of the sheet pressurizing body 120 and the component pressurizing body 130, or may be provided in both of them. In other words, the sheet pressurizing body 120 and the part pressurizing body 130 include not only members that pressurize the object to be pressurized by moving, but also members that pressurize the object to be pressurized by reaction while standing still. be

The configurations of the plate mounting section 2, the film forming processing section 3, the plate releasing section 4, and the peeling processing section 5 are not limited to the above embodiments. In other words, any apparatus may be used as long as it can perform plate mounting, film formation, plate release, and component separation. For example, the plate mounting section 2 may be a device that mounts the cooling plate 63 on the protective sheet 61 by applying pressure with a pressure body, like the embedding processing section 1 . The peeling processing unit 5 may be a mechanism that pushes up the electronic component 60 through the protective sheet 61 with a pin and removes the electronic component 60 from the protective sheet 61 by picking up means such as a nozzle. Moreover, the film forming apparatus 7 may be provided with a transfer section for carrying out the component mounting process. The transfer section is in charge of the component placement process, and transfers the electronic components 60 from the tray on which the electronic components 60 before the film forming process are placed to the component non-mounted sheet 65 .

In addition, although the film forming apparatus 7 is provided with the embedding processing section 1, the plate mounting section 2, the film forming processing section 3, the plate releasing section 4, and the peeling processing section 5, each of these sections is configured as an independent device. , may be systematized. That is, the embedding processing section 1 may be an independent embedding processing apparatus, the plate mounting section 2 may be an independent plate mounting apparatus, and the film forming processing section 3 may be an independent film forming processing apparatus. The plate releasing unit 4 may be an independent plate releasing device, and the stripping unit 5 may be an independent stripping device.

Although the embodiment of the present invention and the modification of each part have been described above, the embodiment and the modification of each part are presented as an example and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, replacements, and modifications can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims.

1 embedding processing unit 2 plate mounting unit 3 film forming processing unit 4 plate releasing unit 5 peeling processing unit 7 film forming apparatus 10, 31 chamber 11 cover units 11a, 12a facing surface 12 mounting units 12b, 120b, 121b, 224, 424, 631 Pusher insertion holes 12c, 115, 132b, 215, 415 Sealing member 12d Exhaust holes 13, 23, 43 Pushers 21, 41 Ceiling parts 22, 42, 51 Mounting tables 24b, 45 Closed space 32 Load lock chamber 33 Partition Part 34 Rotary table 35 Surface treatment part 36 Sputter source 44 Clamping block 52 Chuck 53 Guide part 54 Sheet stopper 55 Component stopper 60 Electronic component 61 Protection sheet 62 Frame 63 Cooling plate 64 Adhesive sheet 65 Non-component sheet 66 Component already placed sheet 67 Component-embedded sheet 68 Component-mounting plate 73 Conveying unit 74 Control unit 75 Pneumatic circuits 111, 512, 211, 411 Internal space 120 Sheet pressure bodies 120a, 130a, 212, 412, 511 Flat surface 121 Sheet-side elastic body 121a Seat facing surface 130 Component pressing member 131 Component side elastic body 131a Component facing surface 132 Drive mechanism 132a Drive shafts 213, 413, 513, 632 Air holes 214, 223, 414, 423, 514 Air pressure supply holes 221, 421 Opening 222, 422 Edge portion 311 Processing position 312 Film formation position 361 Target 601 Electrode exposed surface 602 Electrode 603 Top surface 604 Side surface 605 Electromagnetic wave shielding film 611 Adhesive surface 612 Non-adhesive surface 613 Outer frame area 614 Middle frame area 615 Parts arrangement area 621 Guide part insertion hole

Claims (7)

A film forming apparatus for an electronic component in which an electrode exposed surface on which an electrode is formed is attached to the adhesive surface of a protective sheet,
an embedding processing unit that embeds the electrode in the adhesive surface of the protective sheet;
a film-forming processing unit that forms a film of a film-forming material on the electronic component in which the electrode is embedded in the protective sheet;
with
The embedding processing unit
a chamber whose interior can be evacuated;
a sheet pressurizing body provided in the chamber and located on the opposite side of the electronic component with the protective sheet interposed therebetween;
a component presser provided in the chamber and located on the side opposite to the protective sheet with the electronic component interposed therebetween;
a sheet-side elastic body provided on the sheet pressurizing body and having a flat sheet-facing surface facing the protective sheet;
a flat component facing surface provided on the component pressurizing body and facing the electronic component;
a drive mechanism that presses the electronic component against the protective sheet between the sheet facing surface and the component facing surface by relatively moving the sheet pressing body and the component pressing body;
A film forming apparatus, comprising: The film formation processing unit includes a chamber into which a sputtering gas is introduced,
a sputtering source provided in the chamber for depositing a film-forming material by sputtering to form a film;
a cooling plate on which the electronic component embedded in the protective sheet is mounted;
a conveying device for conveying the cooling plate;
2. The film forming apparatus according to claim 1, further comprising: 3. The film forming apparatus according to claim 1, wherein the sheet-side elastic body is thicker than the electrode and has a hardness of Shore A50 or less. Let Fa be the adhesive force between the component facing surface and the adhesive surface of the protective sheet,
Assuming that the adhesive force between the electrode exposed surface and the adhesive surface of the protective sheet is Fb,
Fa<Fb
4. The film forming apparatus according to any one of claims 1 to 3, characterized in that: 5. The film forming apparatus according to claim 1, wherein the component facing surface has a surface roughness of 1.6 or more and 25 or less. 6. The film forming apparatus according to claim 1, wherein the component pressing member is provided with a component-side elastic body having the component facing surface. An embedding processing device for embedding an electrode formed on an electrode exposed surface of an electronic component in the adhesive surface of the protective sheet,
a chamber whose interior can be evacuated;
a sheet pressurizing body provided in the chamber and located on the opposite side of the electronic component with the protective sheet interposed therebetween;
a component presser provided in the chamber and located on the side opposite to the protective sheet with the electronic component interposed therebetween;
a sheet-side elastic body provided on the sheet pressurizing body and having a flat sheet-facing surface facing the protective sheet;
a flat component facing surface provided on the component pressurizing body and facing the electronic component;
a drive mechanism that presses the electronic component against the protective sheet between the sheet facing surface and the component facing surface by relatively moving the sheet pressing body and the component pressing body;
An implant processing device comprising:

Images