KR20230031258A - Film formation apparatus and embedding processing apparatus - Google Patents

Abstract

The present invention provides an embedding processing apparatus that performs embedding processing for good adhesion of an electrode exposed surface of an electronic component to a protection sheet, and a film forming apparatus that performs a film forming process on the embedded electronic component. The film forming apparatus (7) according to an embodiment comprises an embedding processing unit (1) and a film forming processing unit (3), wherein the embedding processing unit (1) comprises: a chamber (10) with an interior that can be vacuumed; a sheet pressing body (120) installed in the chamber (10) and located on an opposite side from an electronic component (60) with a protection sheet (61) interposed therebetween; a component pressing body (130) installed in the chamber (10) and located on an opposite side from the protection sheet (61) with the electronic component (60) interposed therebetween; a sheet side elastic body (121) installed on the sheet pressing body (120) and having a flat sheet opposing surface (121a) facing the protection sheet (61); a flat component opposing surface (131a) installed on the component pressing body (130) and facing the electronic component (60); and a driving mechanism (132) relatively moving the sheet pressing body (120) and the component pressing body (130) such that the electronic component (60) and the protective sheet (61) press each other in between the sheet opposing surface (121a) and the component opposing surface (131a).

Description

Film formation device and landfill processing device {FILM FORMATION APPARATUS AND EMBEDDING PROCESSING APPARATUS}

The present invention relates to a film forming apparatus for forming a film on an electronic component adhered to a protective sheet, and an embedding processing apparatus for embedding an electronic component on an adhesive surface of a protective sheet.

BACKGROUND OF THE INVENTION [0002] A wireless communication device represented by a mobile phone is equipped with a large number of electronic components such as semiconductor devices. Electronic components are conveyed from processing devices to processing devices in order to undergo various types of processing. As a representative example of the process, formation of an electromagnetic wave shielding film is given. The electromagnetic wave shield film suppresses the influence of electromagnetic waves on the inside and outside, such as leakage of electromagnetic waves to the outside, in order to prevent the influence on the communication characteristics. In general, an electronic component is formed by forming an external shape with a sealing resin, and in order to shield electromagnetic waves, a conductive electromagnetic shielding film is formed on the upper and side surfaces of the sealing resin (see Patent Document 1).

As a method of forming an electromagnetic shielding film, a plating method is known. However, since the plating method requires wet processes such as a pretreatment process, a plating treatment process, and a post-treatment process such as washing with water, an increase in the manufacturing cost of electronic parts cannot be avoided. Therefore, the sputtering method, which is a dry process, is attracting attention. In the sputtering method, an inert gas is introduced into a vacuum container in which a target is placed, and a voltage is applied. Then, ions of the inert gas converted into plasma collide with the target of the film forming material, and the particles ejected from the target are deposited on the electronic component. This deposited layer becomes an electromagnetic wave shielding film.

A film forming apparatus for realizing the sputtering method has a cylindrical chamber having a vacuum chamber inside, a rotary table accommodated in the chamber and having a rotation axis coaxial with the chamber, and film forming positions defined within the chamber. An electronic component is placed on a turntable, and the turntable is rotated in a circumferential direction to bring the electronic component to a film formation position, thereby forming an electromagnetic shielding film. In this way, rotational conveyance of electronic components also exists in the processing apparatus.

In transporting electronic components inside and outside such an apparatus, the electronic components receive an inertial force due to acceleration/deceleration, rotation, etc., and there is a possibility that the electronic components may overturn or come off from the film formation position. Therefore, the electronic component is bonded to the adhesive film, conveyed, and subjected to film formation of the electromagnetic wave shielding film. The electronic component can be restrained by the adhesive force against the inertial force and maintained in an appropriate position. Such an adhesive film is hereinafter referred to as a protective sheet.

The protective sheet not only improves the papermaking properties of the electronic parts, but also prevents particles of the electromagnetic shielding film from adhering to the electrodes during the film forming process, thereby maintaining insulation between the electrodes. Electrodes of electronic components are generally called solder ball bumps, and are formed by bonding spherical solder (solder balls) having a diameter of several tens of micrometers to several hundreds of micrometers to pad electrodes of electronic components. The electrodes are exposed from the electrode exposed surface of the electronic component and are arranged in a matrix (matrix) form.

These electrodes are embedded in an adhesive film having flexibility, and the exposed surfaces of the electrodes are brought into close contact with a protective sheet. The embedding of the electrode is performed by arranging and pressing the electronic component on the adhesive surface of the protective sheet. As a result, since the electrode and the exposed surface of the electrode are covered with the protective sheet, particles of the electromagnetic shielding film cannot enter between the exposed surface of the electrode and the protective sheet and do not reach the electrode.

International Publication No. 2013/035819 Japanese Patent Laid-Open No. 6-97268

As described above, in order to embed the electrodes of the electronic component in the protective sheet, even if the electronic component is pressed against the protective sheet, the surface of the protective sheet may not deform along the electrode surface and electrode exposed surface. Then, between the electrode exposed surface and the protective sheet, there is a risk that a gap that communicates to the outside or a void that does not communicate to the outside may be formed.

Particles of the electromagnetic shielding film enter the gap leading to the outside during the film forming process. If particles of the electromagnetic shielding film that have entered the gap adhere to cross-link between the electrodes, the insulation between the electrodes cannot be maintained.

In addition, when a void that does not communicate with the outside is generated, the adhesion between the electronic component and the protective sheet is lowered. For this reason, when the electronic component is transported between devices or within the film forming apparatus, the electronic component subjected to the inertial force is separated from the protective sheet, and as described above, between the electrode exposed surface and the protective sheet, to the outside. This causes a gap to pass through.

In order to prevent the entry of particles into the electromagnetic shielding film as described above, it is necessary that among a plurality of electrodes arranged in a matrix, between the outermost circumferential electrode and the outer edge of the electrode exposed surface is blocked with a protective sheet. . However, with recent advances in miniaturization of electronic components, not only the gap between the electrodes but also the distance from the outermost circumferential electrode to the outer edge of the exposed surface of the electrode has become extremely short. Then, since the area near the outer edge of the exposed surface of the electrode becomes small, it becomes difficult to ensure a close contact area by deforming the surface of the protective sheet so as to follow the surface of the electrode and the exposed surface of the electrode. For this reason, in the case of electronic components whose miniaturization has progressed, the problem of gaps and voids as described above is more likely to occur.

SUMMARY OF THE INVENTION The present invention has been proposed to solve the problems described above, and an object of the present invention is to provide an embedding treatment apparatus that performs an embedding treatment for bringing the electrode exposed surface of an electronic component into good contact with a protective sheet. Another object of the present invention is to provide a film forming apparatus that further performs a film forming process on an electronic component that has been subjected to an embedding process to bring the electrode exposed surface into close contact with the protective sheet.

In order to achieve the above object, the film forming apparatus of the present invention is a film forming apparatus for an electronic component in which an electrode exposed surface on which an electrode is formed is adhered to an adhesive surface of a protective sheet, wherein the electrode is embedded in the adhesive surface of the protective sheet. and a film formation process unit for forming a film on the electronic component in which the electrode is embedded in the protective sheet, wherein the embedding process unit includes a chamber capable of vacuuming the inside thereof, and installed in the chamber. a sheet pressing body positioned on the opposite side to the electronic component with the protective sheet interposed therebetween, and a component pressing body installed in the chamber and positioned on the opposite side to the protective sheet with the electronic component interposed therebetween; a sheet-side elastic body provided on the sheet pressing body and having a flat sheet facing surface facing the protective sheet; a flat component facing surface provided on the component pressing body and facing the electronic component; the sheet pressing body; and A drive mechanism for pressing the electronic component and the protective sheet against each other between the sheet facing surface and the component facing surface by relatively moving the component pressing body.

According to the embedding processing apparatus of the present invention, it is possible to perform the embedding processing to bring the electrode exposed surface of the electronic component into good adhesion to the protective sheet. Furthermore, according to the film forming apparatus of the present invention, a film forming process can be further performed on an electronic component that has been subjected to an embedding process to bring the electrode exposed surface into close contact with the protective sheet.

1 is a side view illustrating an electronic component subjected to a film forming process.
Fig. 2 is a side view showing a state of an electronic component after undergoing a film forming process.
Fig. 3 is an exploded perspective view showing the state of an electronic component when subjected to a film forming process.
4 is a transition diagram showing a flow of a film formation process of an electronic component.
5 is a block diagram showing the configuration of a film forming apparatus.
6 is a schematic diagram showing the configuration of an embedding processing unit.
7 is a transition diagram schematically showing states in each step of the landfill processing unit.
8 is a transition diagram schematically showing states in each step of the landfill processing unit.
9 is a transition diagram showing states of electronic components in the landfill processing unit.
10 is a view showing a state in which the protective sheet and the part-side elastic body are in contact.
11 is a schematic diagram showing a plate mounting portion.
12 is a schematic diagram showing a film formation processing unit.
13 is a schematic diagram showing a plate release unit.
14 is a schematic diagram showing a peeling processing unit.

[Electronic parts]

1 is a side view showing an electronic component 60 subjected to a film forming process. On the surface of the electronic component 60, an electromagnetic wave shielding film 605 is formed. Meanwhile, in FIG. 1, only the electromagnetic shielding film 605 is shown in cross section. The electronic component 60 is a surface-mounted component such as a semiconductor chip, diode, transistor, capacitor, or SAW filter. A semiconductor chip is an integrated circuit such as an IC or LSI in which a plurality of electronic elements are integrated. This electronic component 60 has a substantially rectangular parallelepiped shape, such as BGA, LGA, SOP, QFP, WLP, etc., and one surface becomes the electrode exposure surface 601. The electrode exposed surface 601 is a surface on which the electrode 602 is exposed and faces the mounting substrate and is connected to the mounting substrate. The electrode 602 is called a ball bump or a solder ball bump, and is formed by mounting a solder (solder ball) formed into a sphere with a diameter of several tens of micrometers to several hundreds of micrometers on a pad electrode.

The electromagnetic wave shielding film 605 shields electromagnetic waves. The electromagnetic shielding film 605 is made of a material such as Al, Ag, Ti, Nb, Pd, Pt, or Zr. The electromagnetic shielding film 605 may be formed of a magnetic material such as Ni, Fe, Cr, or Co. Further, SUS, Ni, Ti, V, Ta, or the like may be formed as a base layer of the electromagnetic shielding film 605, or SUS, Au, or the like may be formed as a protective layer on the outermost surface.

The electromagnetic shielding film 605 is formed on the upper surface 603 and the side surface 604 of the electronic component 60 , that is, on the outer surface other than the electrode exposed surface 601 . The upper surface 603 is a surface opposite to the electrode exposed surface 601 . The side surface 604 is an outer circumferential surface that connects the upper surface 603 and the electrode exposed surface 601 and extends at a different angle from the upper surface 603 and the electrode exposed surface 601 . In order to obtain a shielding effect that blocks electromagnetic waves, the electromagnetic shielding film 605 only needs to be formed on at least the upper surface 603 . However, in order to obtain a good shielding effect, it is preferable to form not only the entire upper surface 603 but also the entire side surface 604 . On the side surface 604, a ground pin (not shown) exists. The formation of the electromagnetic shielding film 605 on the side surface 604 is also due to the grounding of the electromagnetic shielding film 605 .

[Protection Sheet]

2 is a side view showing the state of the electronic component 60 after undergoing a film forming process. In FIG. 2, members other than the electronic component 60 are shown in cross section. 3 is an exploded perspective view showing a mode in which the electronic component 60 is supported when undergoing a film forming process. 2 and 3, the electrode 602 of the electronic component 60 is buried in the protective sheet 61 before the film formation process, and the electrode exposed surface 601 is in close contact with the protective sheet 61. there is. By embedding the electrode 602 in the protective sheet 61 , particles of the electromagnetic wave shielding film 605 are prevented from reaching the electrode 602 . In addition, since the electrode exposed surface 601 and the protective sheet 61 are in close contact, there is no room for particles of the electromagnetic shielding film 605 to enter between the electrode exposed surface 601 and the protective sheet 61, and the electrode ( The possibility of particles of the electromagnetic shielding film 605 reaching 602 is reduced.

The protective sheet 61 is a heat-resistant synthetic resin such as PEN (polyethylene naphthalate) or PI (polyimide). One surface of the protective sheet 61 is made of an adhesive surface (adhesive layer) 611 having flexibility through which the electrode 602 penetrates and adhesiveness through which the electrode exposed surface 601 adheres closely. As the adhesive face 611, various adhesive materials such as silicone resin, acrylic resin, urethane resin, and epoxy resin are used.

The adhesive surface 611 includes an outer frame region 613 extending inwardly from the end of the protective sheet 61 to a predetermined distance, and an intermediate frame region extending inwardly a predetermined distance from the inner periphery of the outer frame region 613. 614 and a component arrangement area 615 inside the middle frame area 614. The electronic component 60 is adhered to the component arrangement area 615 . A frame 62 in the shape of a frame is adhered to the outer frame region 613 . The intermediate frame region 614 is a range where the protective sheet 61 is bent, and neither the frame 62 nor the electronic component 60 is adhered. On the other hand, the opposite side of the adhesive surface 611 is a non-adhesive surface 612 .

The protective sheet 61 is adhered to the cooling plate 63 via the adhesive sheet 64 . The cooling plate 63 is made of a metal such as SUS, ceramics, resin, or other material with high thermal conductivity. This cooling plate 63 is a heat dissipation furnace that releases heat from the electronic component 60 and suppresses excessive heat storage. The adhesive sheet 64 has adhesiveness on both sides, enhances the adhesion between the protective sheet 61 and the cooling plate 63, and secures a heat transfer area to the cooling plate 63.

The height H1 from the surface of the parts arrangement area 615 to the top surface of the frame 62 is greater than the height H2 from the surface of the parts arrangement area 615 to the top surface 603 of the electronic component 60. high (see Fig. 4). On the other hand, the height H1 is the length in the direction in which the electronic components 60 are pressed against the protective sheet 61, that is, in the direction perpendicular to the plane of the protective sheet 61, and is referred to as the thickness H1 for convenience. In some cases, they mean the same thing. In short, if a flat plate is mounted on the frame 62, the upper surface 603 of the electronic component 60 does not reach the flat plate.

A through-hole 621 for inserting a guide is formed through one end of the frame 62 . The guide portion insertion hole 621 has an opening of a long ellipse, rectangle, round circle, etc. along the end of the frame 62, and is formed through the surface adhered to the protective sheet 61 and the opposite exposed surface. has been That is, when, for example, a rod-shaped member is inserted into the guide portion insertion hole 621 and the end of the protection sheet 61 is pressed (see Fig. 14), one end of the protection sheet 61 is detached from the frame 62. there is.

A pusher insertion hole 631 is formed in the cooling plate 63 and the adhesive sheet 64 . The pusher insertion hole 631 does not coincide with the guide portion insertion hole 621 and is penetrated at a position blocked by the frame 62 . The pusher insertion hole 631 is so that, for example, a rod-shaped member is inserted into the pusher insertion hole 631 and the frame 62 is pushed up by the tip of the rod-shaped member so that the entire frame 62 is lifted in parallel. Multiple penetrations are formed. For example, if the frame 62 is a frame body having a rectangular shape, pusher insertion holes 631 are located at four corners or at the center of each side. From the viewpoint of keeping the frame 62 parallel, the rod-shaped member preferably has a rectangular end surface, that is, a thin plate shape or an L-shaped cross section is preferable, but it is not limited to this, but a round circular shape may have a front end of The pusher insertion hole 631 correspondingly has a rectangular shape, an L-shape, or a round circular shape.

In addition, in the cooling plate 63 and the adhesive sheet 64, fine air holes 632 are formed at equal intervals throughout the area where the middle frame region 614 and the parts arrangement region 615 of the protective sheet 61 are bonded. Many of these are formed. This air hole 632 is, for example, a minute cylindrical shape or a slit shape. The air holes 632 are formed to uniformly apply negative or positive pressure to at least the component arrangement region 615 of the protective sheet 61 adhered to the cooling plate 63 . The number of air holes 632, the space between them, and the range of penetrations are not limited thereto. For example, the cooling plate 63 and the adhesive sheet 64 may be formed only in a range corresponding to the parts arrangement area 615. The air holes 632 may be densely arranged at the center of ), while the outside may be arranged in the sexual organs, or only one may be formed at a position corresponding to the center of the parts arrangement region 615.

[Film formation process flow]

In the film formation process, the electromagnetic shield film 605 is formed through a component placement process, a component embedding process, a plate mounting process, a film formation process, a plate release process, and a component separation process, and the electronic component separated into pieces ( 60) is obtained.

4 is a diagram showing a film formation process flow of the electronic component 60 . As shown in FIG. 4 , in the component placement process, the electrode exposed surface 601 of the electronic component 60 faces the component non-placement sheet 65 to which the frame 62 adheres to the protective sheet 61. In the viewing state, the electronic components 60 are arranged in the component arranging area 615 . The protective sheet 61 in which the frame 62 is adhered and the electronic components 60 are arranged, but the electrodes 602 are not yet buried, is referred to as a component-placed sheet 66 .

In the component embedding step, the electrode 602 is embedded in the protective sheet 61 on the component placed sheet 66, and the electrode exposed surface 601 is brought into close contact with the protective sheet 61. Regardless of whether the electromagnetic shielding film 605 is formed or not, the protective sheet 61 in which the electrodes 602 are embedded is referred to as a component embedded sheet 67 . In the plate mounting step, the parts embedded sheet 67 is brought into close contact with the cooling plate 63 via the adhesive sheet 64 . The cooling plate 63 in a state in which the components embedded sheet 67 is in close contact with each other is referred to as a component mounting plate 68 .

In the film forming process, particles of the electromagnetic wave shielding film 605 are deposited from the upper surface 603 side of the electronic component 60 to form the electromagnetic shielding film 605 on the electronic component 60 . At this time, the electrode 602 of the electronic component 60 is buried in the protective sheet 61 . In addition, the electrode exposed surface 601 is in close contact with the protective sheet 61 . For this reason, particles of the electromagnetic shielding film 605 are prevented from adhering to the electrode 602 .

In the plate release process, the cooling plate 63 is removed and returned to the form of the parts embedded sheet 67 . Then, in the component peeling step, the electronic component 60 is peeled from the protective sheet 61 and separated into the component non-placement sheet 65 and individual electronic components 60 . Further, in preparation for reuse of the frame 62, the protective sheet 61 is peeled from the frame 62. With the above, the film forming process ends.

[Deposition device]

Among the above film formation process flow, FIG. 5 shows the film formation apparatus 7 that takes charge of the parts embedding process, the plate mounting process, the film formation process, the plate releasing process, and the parts separation process. The film forming apparatus 7 includes an embedding unit 1 , a plate mounting unit 2 , a film forming unit 3 , a plate releasing unit 4 and a peeling unit 5 . Each part is connected by the conveyance part 73, the member necessary for each process is put in, and the member processed in each process is discharged. The conveyance unit 73 is, for example, a conveyor, and may be a conveyance table movable along a straight track with a ball screw or the like.

In addition, in the film forming apparatus 7, the operation timing of each component included in the embedding processing unit 1, the plate mounting unit 2, the film forming processing unit 3, the plate release unit 4, and the peeling unit 5 is controlled. A control unit 74 such as a computer or a microcomputer having a CPU, ROM, RAM, and a signal transmission circuit to be used is accommodated. In addition, a pneumatic circuit 75 for supplying positive or negative pressure to the embedding unit 1, the plate mounting unit 2, the film forming unit 3, the plate releasing unit 4, and the peeling unit 5 is accommodated. The controller 74 also controls solenoid valves in the pneumatic circuit 75 to switch negative pressure generation, negative pressure release, positive pressure generation, and positive pressure release.

[Landfill processing unit]

(composition)

The embedding processing unit 1 in charge of the component embedding process will be described. 6 is a schematic diagram showing the configuration of the landfill processing unit 1. As shown in FIG. A component placement sheet 66 is loaded into the embedding processing unit 1 . The embedding processing unit 1 presses the electronic component 60 against the protection sheet 61 by sandwiching the component placement sheet 66 between the sheet pressing body 120 and the parts pressing body 130 in a vacuum. In this way, the embedding processing unit 1 embeds the electrode 602 of the electronic component 60 in the protective sheet 61 and further brings the electrode exposed surface 601 into close contact with the protective sheet 61 .

As shown in FIG. 6 , the embedding processing unit 1 includes a chamber 10, a sheet pressing body 120, and a parts pressing body 130. The chamber 10 is a container capable of vacuuming the inside. The chamber 10 includes a cover portion 11 and a placement portion 12 disposed opposite to each other. The cover part 11 is a box-shaped member in which a bottom portion facing the placement part 12 is opened and an internal space 111 in which a component placement sheet 66 to be embedded is received is formed. The placement unit 12 is a rectangular parallelepiped member. The opening of the cover section 11 and the vicinity of the edge of the mounting section 12 face each other and become opposite surfaces 11a and 12a arranged in parallel.

A sealing member 115 such as an O-ring is provided on the opposing surface 11a of the cover portion 11 . The cover portion 11 is installed so as to be movable in a direction approaching and away from the placing portion 12 by a drive mechanism such as an air pressure or a hydraulic cylinder (not shown). In this way, the cover part 11 is in a closed position where the inner space 111 is sealed by the opposing surface 11a of the cover part 11 and the opposing surface 12a of the mounting part 12 being matched via the sealing member 115. and the open position in which the inner space 111 is opened to the atmosphere by separating the opposing surface 11a from the opposing surface 12a of the mounting portion 12.

A pusher insertion through hole 12b as a through hole is formed in the placement portion 12 . The position of the pusher insertion hole 12b is a position corresponding to the frame 62 of the component placed sheet 66 mounted on the sheet pressing body 120 . A pusher 13 described later is inserted through the pusher insertion hole 12b. Between the pusher 13 and the inside of the pusher insertion hole 12b, a sealing member 12c such as an O-ring and packing that seals the pusher 13 in a sliding manner is provided.

In addition, an exhaust hole 12d is formed in the mounting portion 12 . The exhaust hole 12d is connected to the pneumatic circuit 75. By means of the pneumatic circuit 75, the pressure in the inner space 111 of the sealed chamber 10 is enabled through the exhaust hole 12d.

The sheet pressing body 120 is a member installed in the chamber 10 and located on the opposite side to the electronic component 60 with the protection sheet 61 interposed therebetween. In this embodiment, the sheet pressing body 120 is a plate fixed on the mounting portion 12 . The surface facing the component placement sheet 66 in the sheet pressing body 120 is the flat surface 120a. The area of the flat surface 120a has a size greater than or equal to the area of the component placement sheet 66 . On the other hand, a plurality of guide pins (not shown) are provided on the flat surface 120a, and when the guide pins come into contact with the outer periphery of the frame 62, displacement of the parts placed sheet 66 is prevented.

In addition, the sheet-side elastic body 121 is provided on the flat surface 120a. The sheet-side elastic body 121 is a sheet that elastically deforms, and has a flat sheet facing surface 121a that opposes the component-placed sheet 66 . For example, rubber such as silicone rubber can be used as the seat side elastic body 121 . On the other hand, the sheet-side elastic body 121 may be any elastic body made of a material capable of obtaining an action effect by elastic deformation described later. For example, materials made of various materials such as urethane rubber, nitrile rubber, ethylene rubber, fluororubber, and HANENITE can be applied. To be flat, it is sufficient to be flat enough to uniformly press the electronic component 60 of the component-arranged sheet 66, and minute irregularities and surface roughness are permitted. In this embodiment, the surface of the sheet-side elastic body 121 opposite to the sheet facing surface 121a is bonded to the flat surface 120a of the sheet pressing body 120 with an adhesive or the like. The sheet-side elastic body 121 only needs to have the area of the sheet facing surface 121a larger than the area of the parts arrangement region 615 .

As shown in FIG. 6 , the height, that is, the thickness Ts, of the sheet-side elastic body 121 is greater than the thickness Te of the electrode 602 (see FIGS. 1 and 2 ). The hardness of the sheet-side elastic body 121 is preferably Shore A15 or more and Shore A50 or less. On the sheet facing surface 121a of the sheet side elastic body 121, a component placed sheet 66 is disposed. At this time, as described above, the guide pin provided on the flat surface 120a of the sheet pressing body 120 is in contact with the outer edge of the frame 62 . On the other hand, as a method of fixing the component-placed sheet 66 to the sheet-side elastic body 121, a mechanical chuck, a vacuum chuck, or an electrostatic chuck may be used.

Pusher insertion holes 120b and 121b, which are through holes through which the pusher 13 is inserted, are formed in the seat press body 120 and the seat side elastic body 121, respectively. This allows the pusher 13 to advance and retreat in the pusher insertion holes 12b, 120b and 121b from the seat facing surface 121a of the seat side elastic body 121. When the pusher 13 protrudes from the pusher insertion hole 121b, it separates the part-placed sheet 66 from the sheet-side elastic body 121, lifts it parallel to the sheet facing surface 121a, and supports it. They are installed with sufficient rigidity, number and arrangement intervals. For example, when the frame 62 has a rectangular shape, pusher insertion through-holes 12b, 120b, and 121b are formed corresponding to respective corners of the frame 62, and the pusher 13 is disposed in each corner.

The pusher 13 is a rod-shaped member installed so as to be able to advance and retreat within the pusher insertion holes 12b, 120b, and 121b by a drive mechanism (not shown). The drive mechanism is constituted by, for example, a cam mechanism. That is, the rear end of the pusher 13 serves as a cam follower. The cam follower follows the circumferential surface of the oval cam. The cam is axially supported by the rotary motor and is rotatable in the circumferential direction. When the rotary motor drives and the cam rotates, the cam follower raises the bulge of the cam, pushes up the pusher 13, and the tip of the pusher 13 protrudes from the pusher insertion hole 121b.

The component pressing body 130 is a member installed in the chamber 10 and located on the opposite side to the protection sheet 61 with the electronic component 60 interposed therebetween. The surface facing the electronic component 60 in the component pressing body 130 is the flat surface 130a. The flat surface 130a has a size larger than that of the component arrangement area 615 . The component pressing body 130 of this embodiment is a conical body with the flat surface 130a as the bottom surface. That is, the component pressing body 130 has a shape extending toward the flat surface 130a side with the center on the opposite side to the flat surface 130a as a vertex.

The component pressing body 130 is installed so as to be movable by the driving mechanism 132 in the direction of approaching and separating from the component placement sheet 66 . The drive mechanism 132 is, for example, a pneumatic or hydraulic cylinder, and the drive shaft 132a passes through a through hole formed in the ceiling of the cover portion 11 airtightly with a sealing member 132b such as an O-ring. there is. The drive shaft 132a is connected to the apex of the vertebrae of the component pressing body 130 .

In addition, a part-side elastic body 131 is provided on the flat surface 130a. The component-side elastic body 131 is an elastically deformable sheet, and has a flat component facing surface 131a that opposes the component-placed sheet 66 . For example, silicone rubber or the like can be used as the part-side elastic body 131 . Materials applicable as the part-side elastic body 131 are the same as those of the sheet-side elastic body 121 . To be flat, it is sufficient to be flat enough to uniformly press the electronic component 60 of the component-arranged sheet 66, and minute irregularities and surface roughness are permitted. In this embodiment, the part-side elastic body 131 is bonded to the entire flat surface 130a of the part pressing body 130 with an adhesive or the like on the side opposite to the part facing surface 131a. The area of the component-side elastic body 131 may be larger than the area of the component array region 615 .

If the adhesive force between the part facing surface 131a and the adhesive surface 611 of the protective sheet 61 is Fa, and the adhesive force between the electrode exposed surface 601 and the adhesive surface of the protective sheet 61 is Fb, then Fa <Fb. For this reason, even if the protective sheet 61 comes into contact with the component facing surface 131a, it is easily peeled off from the component facing surface 131a while maintaining adhesion to the electrode exposed surface 601. Moreover, the surface roughness Ra (arithmetic mean roughness) of the component facing surface 131a is 1.6 or more and 25 or less. As a result, the component facing surface 131a is easily separated from the upper surface 603 of the electronic component 60 . However, since slipping in the direction parallel to the upper surface 603 of the electronic component 60 is unlikely to occur on the component facing surface 131a, the displacement of the electronic component 60 in the plane direction of the protective sheet 61 is difficult to occur.

(movement)

The operation flow of the embedding processing unit 1 will be described with reference to FIGS. 7 to 10 . 7 and 8 are transition diagrams schematically showing the state of the landfill processing unit 1 in each process. 9 is a transition diagram showing the state of the electronic component 60 in the embedding processing unit 1 . 10 is a view showing a state in which the protective sheet 61 and the part-side elastic body 131 are in contact.

First, as shown in (a) of FIG. 7, the cover part 11 is sufficiently spaced from the placement part 12, and the front end of the pusher 13 is the seat facing surface 121a of the seat side elastic body 121. ) protrudes from it. In this state, the component placement sheet 66 is put into the embedding unit 1 . As for the injected component arrangement sheet 66, the frame 62 is supported by the pusher 13.

As shown in (b) of FIG. 7 , when the pusher 13 is retracted into the pusher insertion holes 12b, 120b, and 121b, the part-placed sheet 66 is moved to the sheet facing surface of the sheet-side elastic body 121. It is tangent to (121a). At this time, the guide pins contact the outer edge of the component placement sheet 66 .

As shown in (c) of FIG. 7 , when the cover part 11 is moved toward the placing part 12 to the closed position, the opposite surface 11a of the cover part 11 and the placing part 12 face each other. The faces 12a match through the sealing member 115 . As a result, the parts placed sheet 66 is trapped in the inner space 111 sealed by the sealing member 115 .

Then, negative pressure is generated in the exhaust hole 12d of the placement section 12 to depressurize the inside of the interior space 111 where the parts placed sheet 66 is trapped, thereby evacuating. In this step, as shown in (a) of FIG. 9, the electronic component 60 is placed on the protective sheet 61 in a state in which the electrode 602 is not embedded in the adhesive surface 611 of the protective sheet 61. , a gap exists between the electrode exposed surface 601 and the adhesive surface 611, and this gap is also reduced in pressure.

As shown in (a) of FIG. 8, the component pressing body 130 is moved toward the sheet pressing body 120, and the component facing surface 131a of the component side elastic body 131 is attached to the electronic component 60. pressurize Then, the electrode 602 of the electronic component 60 is embedded in the adhesive face 611 of the protective sheet 61 . And, as shown in (b) of FIG. 9, by deforming the sheet-side elastic body 121 together with the protective sheet 61 to sink, the surface of the electrode 602 and the electrode exposed surface 601 around it , the surface of the electrode 602 and the electrode exposed surface 601 are brought into close contact with the protective sheet 61 . For this reason, insufficient embedment of the electrode 602 to the protective sheet 61 at the end of the parts arrangement area 615 and insufficient adhesion of the electrode exposed surface 601 to the protective sheet 61 are prevented from occurring.

Adhesion between the electrode exposed surface 601 and the protective sheet 61 is performed under a reduced pressure environment as described above, and there is no or very little air in the sealed internal space 111 . Therefore, the possibility of air bubbles entering between the electrode exposed surface 601 and the protective sheet 61 is reduced. In addition, since the component pressing body 130 is a conical body that extends from the driving shaft 132a to the flat surface 130a, the pressure from the driving shaft 132a is not concentrated in the center and is uniformly distributed on the flat surface 130a. do. For this reason, the pressure of the drive shaft 132a does not concentrate and bend in the center like a flat plate, and all the electronic components 60 are equally pressed.

On the other hand, with the electronic component 60 pressed in this way, as shown in FIG. 9(b), the protective sheet 61 right below sinks together with the sheet side elastic body 121. For this reason, the protective sheet 61 around the electronic component 60 under pressure once rises toward the component facing surface 131a of the component-side elastic body 131 .

Next, as shown in (b) of FIG. 8, by moving the component pressing body 130 in a direction away from the sheet pressing body 120, the component side elastic body 131 is separated from the electronic component 60. let it Then, as shown in (c) of FIG. 9, as the sheet-side elastic body 121 returns to its original shape, the raised portion of the protection sheet 61 returns to its original flat surface. For this reason, while the adhesion of the protective sheet 61 to the electrode exposed surface 601 is ensured, the protective sheet 61 does not adhere to the lower part of the side surface 604 of the electronic component 60 . For this reason, in the subsequent film formation step, the electromagnetic wave shielding film 605 can be formed up to the bottom of the side surface 604 of the electronic component 60, and electromagnetic waves incident from the side surface can be shielded satisfactorily. .

On the other hand, as shown in Fig. 10, there are cases where the adhesive face 611 reaches the component facing surface 131a of the component side elastic body 131 due to the elevation of the protective sheet 61. Even in this case, since the protective sheet 61 returns to its original shape as the sheet-side elastic body 121 returns to its original shape after releasing the pressure, it is likely to peel off from the part-side elastic body 131. In addition, the adhesive force Fa between the component facing surface 131a of the component-side elastic body 131 and the adhesive surface 611 of the protective sheet 61 is between the electrode exposed surface 601 of the electronic component 60 and the protective sheet Since it is smaller than the adhesive force (Fb) of (61) to the adhesive surface 611, the adhesive surface 611 of the protective sheet 61 maintains adhesion to the electrode exposed surface 601, while maintaining the adhesion to the part-side elastic body 131. It becomes more easily peeled off from.

Moreover, the surface roughness Ra (arithmetic mean roughness) of the component facing surface 131a is 1.6 or more and 25 or less. For this reason, when the component pressing body 130 releases the pressurization with respect to the electronic component 60, the component facing surface 131a of the component side elastic body 131 becomes easy to peel from the electronic component 60.

As described above, when the electrode 602 of the electronic component 60 is embedded in the protective sheet 61 and the electrode exposed surface 601 of the electronic component 60 adheres to the protective sheet 61, the pneumatic circuit 75 ) stops the pressure reduction from the exhaust hole 12d, and the vacuum in the chamber 10 is released. At the same time, the pusher 13 is moved in the axial direction along the pusher insertion holes 12b, 120b, and 121b to protrude again from the seat facing surface 121a of the seat side elastic body 121.

Then, as shown in (c) of FIG. 8 , the cover part 11 is moved in a direction to separate it from the placement part 12 . Finally, the pusher 13 is stopped, and the cover part 11 is stopped at a position away from the placement part 12. In this way, embedding of the electronic component 60 in the protective sheet 61 by the embedding processing unit 1 is completed.

On the other hand, release of the pressurization of the electronic component 60 by the component pressing body 130 needs to be performed before releasing the vacuum in the chamber 10 . If the vacuum in the chamber 10 is released before the pressurization of the electronic component 60 is released, the surroundings become atmospheric pressure with the protective sheet 61 raised as described above. Then, when the adhesive face 611 of the protection sheet 61 is attached to the side surface 604 of the electronic component 60 or the component facing surface 131a of the component-side elastic body 131, This is because the adhered state is fixed by the ambient atmospheric pressure, and the peeling is no longer possible.

[Plate mounting part]

Next, the plate mounting portion 2 that takes charge of the plate mounting process will be described. 11(a) and 11(b) are schematic diagrams showing the plate mounting portion 2. As shown in FIG. The cooling plate 63 to which the adhesive sheet 64 has been adhered in advance and the parts embedded sheet 67 created in the embedding processing unit 1 are loaded into the plate mounting unit 2 . The plate mounting portion 2 presses the parts-embedded sheet 67 against the cooling plate 63 and pulls the parts-embedded sheet 67 to the cooling plate 63, via the adhesive sheet 64. The parts embedded sheet 67 is brought into close contact with the cooling plate 63 .

The plate mounting portion 2 includes a ceiling portion 21 and a mounting table 22 . The ceiling portion 21 and the mounting table 22 are disposed opposite to each other. On the other hand, the ceiling portion 21 is capable of moving up and down relative to the mounting table 22 . The ceiling portion 21 is a block having an internal space 211 and has a flat surface 212 on a surface facing the mounting table 22 . Placement table 22 has a bottomed cup shape. The opening 221 of the mounting table 22 faces the ceiling 21 .

In this mounting table 22, its edge 222 supports the cooling plate 63, and the opening 221 is blocked by the cooling plate 63. The side of the cooling plate 63 opposite to the side to which the adhesive sheet 64 is adhered comes into contact with the edge portion 222 . Further, the parts embedded sheet 67 is placed on the cooling plate 63 facing the adhesive sheet 64 . An air pressure supply hole 223 is formed through the bottom of the mounting table 22 . The pneumatic supply hole 223 is connected to the pneumatic circuit 75.

Further, a pusher insertion hole 224 penetrating the placing table 22 is formed through the edge portion 222 of the placing table 22 . The pusher 23 is inserted into this pusher insertion hole 631 and hermetically sealed by a sealing member such as an O-ring. This pusher 23 penetrates the placement table 22, the cooling plate 63, and the adhesive sheet 64, and is capable of appearing and retracting.

A plurality of air holes 213 leading to the inner space 211 are formed through the flat surface 212 of the ceiling portion 21 . An air pressure supply hole 214 is formed through the interior space 211 of the ceiling portion 21 at a location different from that of the flat surface 212 . The air pressure supply hole 214 is connected to the air pressure circuit 75 .

Further, on the flat surface 212 of the ceiling portion 21, along the frame 62 of the parts-embedded sheet 67 mounted on the mounting table 22, an O-ring enclosing the through-formation range of the air hole 213 is provided. The sealing member 215 of the back is provided. That is, the outer periphery of the flat surface 212 of the ceiling portion 21 presses the frame 62 via the sealing member 215 and presses the outer periphery of the protective sheet 61 against the cooling plate 63 .

As shown in FIG. 11(a), in the plate mounting unit 2, the cooling plate 63 is mounted on the edge 222 of the mounting table 22, and the parts-embedded sheet is placed on the pusher 23. In the state in which the frame 62 of (67) is supported, the ceiling portion 21 is lowered, negative pressure is generated in the interior space 211, and the electronic component 60 is drawn to the flat surface 212. When the pusher 23 and the ceiling 21 are lowered and the frame 62 is pressed against the adhesive sheet 64 via the protective sheet 61, the cooling plate 63 and the protective sheet 61 to which the adhesive sheet 64 is installed are pressed. ), a closed space is formed between them.

As shown in (b) of FIG. 11, while maintaining the negative pressure in the ceiling 21, negative pressure is also generated in the mounting table 22, and then the negative pressure in the ceiling 21 is gradually changed to a positive pressure. Then, the parts-embedded sheet 67 is pressed against the adhesive sheet 64 adhered to the cooling plate 63 and mounted thereon.

[Film Formation Processing Unit]

Next, the film formation processor 3 in charge of the film formation process will be described. 12(a) and 12(b) are schematic diagrams showing the film forming processing unit 3. As shown in FIG. The film forming unit 3 forms an electromagnetic wave shield film 605 on each electronic component 60 on the component mounting plate 68 by sputtering. As shown in (a) of FIG. 12 , the film forming processing unit 3 has a chamber 31 and a load lock chamber 32 . The chamber 31 is a cylindrical vacuum chamber whose diameter is enlarged in the radial direction rather than the axial direction. The inside of the chamber 31 is partitioned into a plurality of fan-shaped sections by partitions 33 extending along the radial direction. A processing position 311 and a film forming position 312 are assigned to some fan-shaped zones.

The partition portion 33 extends from the ceiling surface of the chamber 31 toward the floor surface, but falls short of the floor surface. A rotary table 34 is installed in the space on the floor side where there is no partition 33 . The rotary table 34 is a conveying device that conveys the cooling plate 63 . On this cooling plate 63, an electronic component 60 embedded in a protective sheet 61 is mounted. The rotary table 34 has a disk shape coaxial with the chamber 31 and rotates in the circumferential direction. The component mounting plate 68 put into the chamber 31 from the load-lock chamber 32 is placed on the rotary table 34 and rotates in a circumferential trajectory while moving to a processing position 311 and a film forming position 312 ) cycle.

On the other hand, in order to maintain the position of the component mounting plate 68 relative to the rotation table 34, the rotation table 34 includes, for example, a component mounting plate such as a groove, a hole, a protrusion, a jig, a holder, a mechanical chuck, or an adhesive chuck. A retaining means for holding (68) is provided.

A surface treatment unit 35 is installed at the treatment position 311 . In the surface treatment unit 35, a process gas such as argon gas is introduced, and a high-frequency voltage is applied to convert the process gas into plasma to generate electrons, ions, radicals, and the like. For example, this surface treatment part 35 is a tubular electrode opened on the rotary table 34 side, and a high frequency voltage is applied by the RF power supply.

A target 361 constituting the sputtering source 36 is installed at the film formation position 312, and a sputtering gas that is an inert gas such as argon gas is introduced. The sputter source 36 applies electric power to the target 361 to turn the sputter gas into plasma, and causes generated ions or the like to collide with the target 361 to eject particles. The target 361 includes the material of the electromagnetic shielding film 605 . That is, particles of the electromagnetic wave shielding film 605 are ejected from the target 361, and the particles of the electromagnetic shielding film 605 ejected are deposited on the electronic component 60 on the rotary table 34.

This film formation position 312 is provided in two places, for example. The target material for each film formation position 312 may be the same material or a different material to form the laminated electromagnetic shielding film 605 . As a power supply for applying power to the sputter source 36 at each film formation position 312, a well-known power supply such as a DC power supply, a DC pulse power supply, or an RF power supply can be applied. In addition, the power source for applying electric power to the sputter source 36 may be provided for each sputter source 36, or a common power source may be switched to a switch and used.

In such a film forming unit 3, at the processing position 311, cleaning and roughening the surface of the electronic component 60 by etching or ashing are performed to improve the adhesion of the electromagnetic wave shielding film 605 to the electronic component 60. The electromagnetic wave shielding film 605 is formed on the electronic component 60 by raising the target 361 and depositing the particles of the target 361 on the electronic component 60 at the film forming position 312 . Since the electrode 602 is buried in the protective sheet 61 and the electrode exposed surface 601 is in close contact with the protective sheet 61, adhesion of particles of the electromagnetic shielding film 605 to the electrode 602 is prevented. In addition, entry of particles of the electromagnetic wave shielding film 605 between the electrode exposed surface 601 and the protective sheet 61 is prevented. In addition, the heat of the electronic component 60 is transferred to the cooling plate 63, and excessive heat storage of the electronic component 60 is suppressed.

On the other hand, this film-forming processing unit 3 forms a film on the electronic component 60 using a sputtering method, but the film-forming method is not limited to this. For example, the film forming unit 3 may be a device that forms the electromagnetic shielding film 605 on the electronic component 60 by vapor deposition, spray coating, application, or the like.

[Plate release part]

Next, the plate release part 4 which takes charge of the plate release process is demonstrated. 13(a) and 13(b) are schematic diagrams showing the plate release part 4. As shown in FIG. The component mounting plate 68 on which the electromagnetic wave shielding film 605 is formed on the electronic component 60 is put into the plate release unit 4 . The plate release unit 4 peels the component embedded sheet 67 from the cooling plate 63 as a first step for obtaining each electronic component 60 .

As shown in (a) of FIG. 13 , the plate release portion 4 includes a ceiling portion 41 and a mounting table 42 . The ceiling portion 41 and the mounting table 42 are disposed opposite to each other. On the other hand, the ceiling portion 41 can move up and down relative to the mounting table 42 . The ceiling portion 41 is a block having an internal space 411 and has a flat surface 412 on a surface facing the mounting table 42 . The placing table 42 has a cup shape with a bottom, and an opening 421 faces the ceiling portion 41 .

In this placement table 42, the edge 422 supports the component mounting plate 68, and the opening 421 is closed by the component mounting plate 68. The edge portion 422 is in contact with the cooling plate 63 . An air pressure supply hole 423 is formed through the bottom of the mounting table 42 . The air pressure supply hole 423 is connected to the air pressure circuit 75 .

Further, a pusher insertion hole 424 penetrating the placing table 42 is formed through the edge portion 422 of the placing table 42 . A pusher 43 is inserted into this pusher insertion hole 424 and hermetically sealed by a sealing member such as an O-ring. The pusher 43 moves in the axial direction so that the tip of the component mounting plate 68 mounted on the mounting table 42 is higher than the frame 62 so as to be able to protrude.

In addition, a pair of clamping blocks 44 are disposed on both sides of the pedestal 42 . The holding block 44 holds only the cooling plate 63 among the component mounting plates 68 mounted on the placing table 42 . The clamping blocks 44 can contact and separate from each other around the cooling plate 63 .

Next, a plurality of air holes 413 leading to the inner space 411 are formed through the flat surface 412 of the ceiling portion 41 . An air pressure supply hole 414 is formed through the interior space 411 of the ceiling portion 41 at a location different from that of the flat surface 412 . An air pressure circuit 75 is connected to the air pressure supply hole 414 .

Further, on the flat surface 412 of the ceiling portion 41, along the frame 62 of the component mounting plate 68 mounted on the mounting table 42, an O-ring or the like that surrounds the through-forming range of the air hole 413 The sealing member 415 of is installed.

In such a plate release part 4, the component mounting plate 68 to which the cooling plate 63 is attached is placed on the mounting table 42. As shown in (a) of FIG. 13, the ceiling portion 41 is lowered toward the mounting table 42, and the flat surface 412 of the ceiling portion 41 is brought into contact with the frame 62 of the component mounting plate 68. let it As shown in (b) of FIG. 13 , negative pressure is generated in the sealed inner space 411 of the ceiling 41 and positive pressure is generated in the mounting table 42 . As a result, a force sufficient to separate the component array region 615 from the cooling plate 63 is applied to the component array region 615 , and the component array region 615 is separated from the cooling plate 63 .

When the parts arrangement area 615 is detached from the cooling plate 63, the outer frame area 613 to which the frame 62 is attached is moved by the movement of the ceiling portion 41 accompanying the advance of the pusher 43. 63), and the entire protective sheet 61 is peeled off from the cooling plate 63.

[Exfoliation processing unit]

In addition, the peeling processing part 5 which takes charge of a component peeling process is demonstrated. 14(a) and 14(b) are schematic diagrams showing the peeling processing unit 5. As shown in FIG. The component embedded sheet 67 from which the cooling plate 63 has been removed via the plate release unit 4 is put into the peeling unit 5, and individual electronic components 60 are peeled from the protective sheet 61. .

This peeling unit 5 includes a mounting table 51 on which the parts-embedded sheet 67 is placed, a chuck 52 that continuously moves by gripping the protective sheet 61, and a protective sheet 61 ), a guide part 53 that creates a trigger for the chuck 52 to grip the protective sheet 61, a sheet stopper 54 that creates a peeling starting point for the protective sheet 61, and an electronic component 60 ) is provided with a parts stopper 55 that prevents lifting.

The placing table 51 has a flat surface 511 on which the parts embedded sheet 67 is placed. The component embedded sheet 67 faces the electronic component 60 on the flat surface 511, the upper surface 603 of the electronic component 60 is brought into contact with the placement surface, and the protective sheet 61 faces upward. are placed by

This placement table 51 is a block having an inner space 512 . A plurality of air holes 513 are formed through the flat surface 511 of the mounting table 51 in an area facing the component arrangement area 615 . The air hole 513 communicates with the inner space 512 of the placing table 51 . An air pressure supply hole 514 is formed through the inner space 512 of the mounting table 51 at a location different from that of the flat surface 511 . The air pressure supply hole 514 is connected to the air pressure circuit 75 .

The chuck 52 is a pair of blocks with gripping surfaces facing each other. A pair of blocks can be contacted and separated. The chuck 52 is supported by a moving device that is movable in the horizontal and vertical directions, and moves against the flat surface 511 along the protective sheet 61 mounted on the flat surface 511 of the mounting table 51. It moves continuously at an angle of attack of 45 degrees.

The sheet stopper 54 is a roller that has a cylindrical body shape with a long axis crossing one side of the protective sheet 61 and is axially rotatable. The sheet stopper 54 maintains a constant height with respect to the flat surface 511 of the mounting table 51, and maintains a position just below the chuck 52, so that the sheet stopper 54 moves along the direction orthogonal to the long axis of the mounting table 51. Terminate the protective sheet 61 disposed on.

The parts stopper 55 is a roller that has a cylindrical shape with a long axis that crosses at least the entire parts arrangement region 615 of the protection sheet 61 and is axially rotatable. This part stopper 55 is arranged so that it can approach and separate from the sheet stopper 54.

The guide portion 53 is disposed at a position having a common axis with the guide portion insertion hole 621 of the frame 62 . The front end of the guide portion 53 faces the guide portion insertion hole 621 of the frame 62 . This guide portion 53 is movable in the axial direction, protrudes toward the end of the protection sheet 61, pushes the end of the protection sheet 61 toward the chuck 52, and pushes the end of the protection sheet 61 up. It advances through the guide portion insertion hole 621 of the frame 62 until it touches the chuck 52 . This guide part 53 peels off one side of the protection sheet 61 by pushing up.

In such a peeling processing unit 5, as shown in FIG. 14(a), the component embedded sheet 67 is removed in a state where the upper surface 603 of the electronic component 60 is brought into contact with the flat surface 511. It is placed on the pedestal 51. A negative pressure is generated in the air hole 513 of the mounting table 51 to fix the electronic component 60 to the flat surface 511 by suction. The guide part 53 moves upward in the axial direction, pushes the end of the protection sheet 61 in a direction away from the frame 62, peels the end of the protection sheet 61, and moves toward the chuck 52. induce

When the edge of the protection sheet 61 touches the chuck 52, as shown in FIG. do. When the chuck 52 grips the end of the protective sheet 61, the part stopper 55 is moved, and the part stopper 55 and the sheet stopper 54 are brought closer to a distance less than the length of the electronic part 60. .

The chuck 52 is pulled up while moving the chuck 52 and the sheet stopper 54 along the protective sheet 61 . Then, the protective sheet 61 is pulled up by the chuck 52 with the sheet stopper 54 as the starting point, and the electronic component 60 is peeled from the protective sheet 61 with the sheet stopper 54 as the starting point. By this, all the electronic components 60 are peeled off from the protective sheet 61 and arranged on the flat surface 511 of the mounting table 51 . In this way, the electronic component 60 peeled from the protective sheet 61 is recovered.

(action effect)

(1) This embodiment is a film forming apparatus 7 for an electronic component 60 in which an electrode exposed surface 601 on which an electrode 602 is formed is adhered to an adhesive surface 611 of a protective sheet 61, For the embedding processing unit 1 that embeds the electrode 602 in the adhesive surface 611 of the protective sheet 61 and the electronic component 60 in which the electrode 602 is embedded in the protective sheet 61, a film forming material is applied. A film forming processing unit 3 for forming a film is provided.

The embedding processing unit 1 includes a chamber 10 capable of vacuuming the inside, and a sheet pressure installed in the chamber 10 and located on the opposite side of the electronic component 60 with a protective sheet 61 interposed therebetween. It is installed in the sieve 120, the chamber 10, and the parts pressing body 130 located on the opposite side of the protection sheet 61 with the electronic component 60 interposed therebetween, and the sheet pressing body 120, , the sheet-side elastic body 121 having a flat sheet facing surface 121a facing the protective sheet 61, and a flat component facing surface 131a provided on the component pressing body 130 and facing the electronic component 60 ), and the sheet pressing body 120 and the parts pressing body 130 are moved relative to each other, between the sheet facing surface 121a and the parts facing surface 131a, the electronic component 60 and the protection sheet 61 are mutually It has a drive mechanism 132 for pressing.

For this reason, when the electronic component 60 is pressed against the protective sheet 61, the sheet-side elastic body 121 elastically deforms, so that the protective sheet 61 runs along the surface of the electrode 602 and the electrode exposed surface 601. It deforms and adheres. That is, when the protective sheet 61 is supported by a hard plate or the like, there is a limit to the amount of deformation of the protective sheet 61 alone. On the other hand, in the present embodiment, since the protective sheet 61 is supported by the sheet-side elastic body 121, the sinking thickness of the electrode 602 can be deepened, and the protective sheet 61 extends to the electrode 602. It becomes easy to deform along the surface of the electrode and the irregularities of the electrode exposed surface 601. Therefore, the occurrence of gaps or voids between the surface of the protective sheet 61 and the electrode 602 and the electrode exposed surface 601 can be suppressed, the protective sheet 61 can be brought into close contact, and electromagnetic wave shielding is prevented from the gap during film formation. Particles of the film 605 are prevented from entering. Further, when relying on the deformation of only the protective sheet 61, high pressure is required to press against the protective sheet 61, but in this embodiment, since the sheet-side elastic body 121 is deformed, relatively low-pressure driving is required. Even if it is the mechanism 132, it can be easily deformed, and miniaturization of the entire device is possible.

Thus, even when the distance Wb from the electrode 602 at the outermost periphery to the outer edge of the electrode exposed surface 601 (see FIG. 2) is narrow, for example, the protective sheet 61 is connected to the surface of the electrode 602. It can adhere to the electrode exposed surface 601. In addition, the protective sheet 61 needs to be relatively thin so that the heat accumulated in the electronic component 60 during film formation can be easily released to the film formation processing unit 3 side by thermal conduction. However, when the protective sheet 61 is thin, the buffering property is weak, and the amount of deformation becomes even smaller. For this reason, the electrode 602 protruding from the electrode exposed surface 601 by several tens of μm to several hundreds of μm cannot be absorbed only by deformation of the protective sheet 61, and the protective sheet 61 covers the surface of the electrode 602 and the exposed electrode. It is difficult to deform to follow face 601. In this embodiment, since the amount of deformation of the protection sheet 61 can be ensured by deformation of the sheet-side elastic body 121 as described above, generation of gaps and voids can be suppressed.

Further, since the deformation of the sheet-side elastic body 121 is elastic deformation, the electronic component 60 and the protective sheet 61 are pressed against each other, and the sheet facing surface 121a is deformed to sink, and then the pressing is released. It returns to its original flat shape. Then, even when the protection sheet 61 comes into contact with the side surface 604 of the electronic component 60 due to sinking, the protection sheet 61 returns to its original shape together with the sheet-side elastic body 121, so that the side surface ( 604) can be prevented. Thus, the formation of the electromagnetic shielding film 605 is not hindered by the protective sheet 61 attached to the side surface 604, and the lack of film formation of the electromagnetic shielding film 605 on the side surface 604 and the connection with the ground wiring Poor connection can be prevented. Further, even when the protective sheet 61 is deformed until it comes into contact with the component facing surface 131a, it is prevented from adhering to the component facing surface 131a by returning to its original shape together with the sheet-side elastic body 121. .

(2) The film formation processing unit 3 includes a chamber 31 into which a sputtering gas is introduced, a sputter source 36 installed in the chamber 31 and depositing a film formation material by sputtering to form a film, and a protective sheet 61 It has a cooling plate 63 on which the electronic component 60 embedded in ) is mounted, and a conveying device for conveying the cooling plate 63.

As described above, since the sheet-side elastic body 121 deforms, the protective sheet 61 can be deformed so as to follow the surface of the electrode 602 and the electrode exposed surface 601, so that the protective sheet 61 is made thin. Thus, the heat of the electronic component 60 can be easily released to the cooling plate 63, and the heat dissipation effect can be enhanced.

(3) The thickness Ts of the sheet-side elastic body 121 is larger than the thickness Te of the electrode 602, and the hardness is Shore A15 or more and Shore A50 or less. For this reason, the sheet-side elastic body 121 has a suitable thickness so that the electrode 602 sinks and deforms together with the protective sheet 61. In addition, the protective sheet 61 is deformed along the surface of the electrode 602 and the electrode exposed surface 601, returns to its original shape, and has a desirable hardness so that it can be peeled off from the side surface 604 or the component facing surface 131a. have More specifically, if the hardness of the sheet-side elastic body 121 is smaller than Shore A15, it is difficult for the sheet-side elastic body 121 to be deformed by being pressed during embedding of the electronic component 60. ), it becomes difficult for the protective sheet 61 to return to its original shape. For this reason, when the protective sheet 61 contacts the component-side elastic body 131 or the side surface 604 of the electronic component 60, it becomes difficult to peel off. In this embodiment, since the hardness of the sheet-side elastic body 121 is Shore A15 or more, even in such a case, the protective sheet 61 is easily peeled off. On the other hand, if the hardness of the sheet-side elastic body 121 is greater than Shore A50, the sheet-side elastic body 121 becomes difficult to deform even when pressurized when the electronic component 60 is embedded, and the sheet-side elastic body 121 together with the protective sheet ( 61) becomes difficult to deform. For this reason, when the distance Wb from the electrode 602 at the outermost periphery to the outer edge of the electrode exposed surface 601 is narrow, the protective sheet 61 is applied to the surface of the electrode 602 and the electrode exposed surface 601. It becomes difficult to adhere. In this embodiment, since the hardness of the sheet-side elastic body 121 is Shore A50 or less, the protective sheet 61 is deformed and easily adheres to the surface of the electrode 602 and the electrode exposed surface 601 .

(4) The adhesive force between the component facing surface 131a and the protective sheet 61 is Fa, and the adhesive force between the electrode exposed surface 601 of the electronic component 60 and the adhesive surface 611 of the protective sheet 61 is Let's say Fb, then Fa<Fb. For this reason, even when the protective sheet 61 is in contact with the component facing surface 131a, it becomes easy to peel while maintaining the adhesion to the electrode exposed surface 601. This maintains the state in which the protection sheet 61 is adhered to the component facing surface 131a and adheres in contact with the side surface 604 or the like of the electronic component 60, thereby preventing occurrence of a location where no film is formed.

(5) The surface roughness Ra (arithmetic average roughness) of the component facing surface 131a is 1.6 or more and 25 or less. For this reason, adhesion to the electronic component 60 is prevented, and when the pressing is released, the electronic component 60 is prevented from following and floating away.

(6) In the component press body 130, a component side elastic body 131 having a component facing surface 131a is provided. For this reason, peelability when the protection sheet 61 is in contact with the component facing surface 131a can be improved.

[Other Embodiments]

The present invention is not limited to the above embodiments, but also includes the following aspects. For example, the part-side elastic body 131 may be omitted. In this case, the flat surface 130a of the component pressing body 130 functions as the component facing surface 131a. Even in this case, in order to facilitate peeling from the adhesive surface 611 of the protective sheet 61 and the upper surface 603 of the electronic component 60, the surface of the flat surface 130a may be uneven or roughened. good night. Alternatively, a material that is easy to peel, such as a release sheet, may be attached to the flat surface 130a.

A well-known mechanism can be applied to the drive mechanism of the cover part 11 and the drive mechanism 132 of the component pressing body 130, and it is not limited to the above mechanism. For example, a linear guide in which a slider moves along a rail in response to rotation of a ball screw may be applied. Moreover, the sheet pressing body 120 and the parts pressing body 130 should just be able to mutually press the electronic component 60 and the protection sheet 61 by relative movement. For this reason, even if the drive mechanism 132 is provided in at least one of the sheet press body 120 and the parts press body 130, it may be installed in both. That is, the sheet pressing body 120 and the part pressing body 130 include not only members that press by moving with respect to the pressing target, but also members that press against the pressing target by reaction in a stationary state.

The configuration of the plate attaching unit 2, the film forming unit 3, the plate releasing unit 4 and the peeling unit 5 is not limited to the above-described configuration. That is, these may be devices capable of performing plate mounting, film formation, plate removal, and component peeling. For example, the plate mounting unit 2 may be a device that attaches the cooling plate 63 to the protective sheet 61 by pressing it with a pressing body, like the embedding processing unit 1 . The peeling unit 5 may be a mechanism that pushes the electronic component 60 up through the protective sheet 61 with pins and separates the electronic component 60 from the protective sheet 61 with a pick-up means such as a nozzle. good night. In addition, the film forming apparatus 7 may be provided with a transfer unit in charge of the component arrangement process. The transfer unit is in charge of the component placement process, and transfers the electronic component 60 from the tray on which the electronic component 60 before the film forming process is placed to the component non-placement sheet 65.

In addition, the film forming apparatus 7 is a device provided with an embedding processing unit 1, a plate mounting unit 2, a film forming processing unit 3, a plate releasing unit 4, and a peeling unit 5, but each of these parts is independent. It may be configured as a device and systemized. That is, the landfill processing unit 1 may be an independent landfill processing device, the plate mounting unit 2 may be an independent plate mounting device, the film forming processing unit 3 may be an independent film forming processing device, and the plate releasing unit 4 may be an independent plate mounting device. It may be a releasing device, and the peeling processing unit 5 may be an independent peeling processing device.

As mentioned above, although the embodiment of this invention and the modified example of each part were described, this embodiment and the modified example of each part are presented as an example, and limiting the scope of the invention is not intended. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and variations thereof are included in the scope and gist of the invention, and are included in the invention described in the claims.

1: landfill processing part 2: plate mounting part
3: film forming unit 4: plate release unit
5: peeling unit 7: film forming device
10, 31: chamber 11: cover part
11a, 12a: Opposite surface 12: Placement part
12b, 120b, 121b, 224, 424, 631: pusher insertion through hole
12c, 115, 132b, 215, 415: sealing member
12d: exhaust hole 13, 23, 43: pusher
21, 41: ceiling part 22, 42, 51: placement table
24b, 45: closed space 32: load lock room
33: compartment 34: rotary table
35: surface treatment unit 36: sputter source
44: nip block 52: chuck
53: guide part 54: seat stopper
55: parts stopper 60: electronic parts
61: protective sheet 62: frame
63: cooling plate 64: adhesive sheet
65: parts unplaced sheet 66: parts placement completed sheet
67: parts embedding completion sheet 68: parts mounting plate
73: transport unit 74: control unit
75: pneumatic circuit 111, 512, 211, 411: inner space
120: sheet press body
120a, 130a, 212, 412, 511: Flat surface 121: Seat side elastic body
121a: sheet facing surface 130: part pressing body
131: part-side elastic body 131a: part facing surface
132 drive mechanism 132a drive shaft
213, 413, 513, 632 air holes
214, 223, 414, 423, 514: air pressure supply hole
221, 421: opening 222, 422: edge
311: processing position 312: tabernacle position
361: target 601: electrode exposed surface
602: electrode 603: upper surface
604 side 605 electromagnetic shielding film
611: adhesive surface 612: non-adhesive surface
613 outer frame area 614 middle frame area
615 parts arrangement area 621 guide part insertion through hole

Claims (7)

A film forming apparatus for an electronic component in which an electrode exposed surface on which an electrode is formed is adhered to an adhesive surface of a protective sheet, comprising:
an embedding processing unit for embedding the electrode on the adhesive surface of the protective sheet;
A film formation processing unit that forms a film of a film formation material on the electronic component in which the electrode is embedded in the protective sheet.
to provide,
The landfill processing unit,
A chamber capable of vacuuming the inside;
a sheet pressing body installed in the chamber and located on the opposite side of the electronic component with the protective sheet interposed therebetween;
a component pressing body installed in the chamber and located on the opposite side of the protective sheet with the electronic component interposed therebetween;
a sheet-side elastic body provided on the sheet pressing body and having a flat sheet facing surface facing the protective sheet;
a flat component facing surface provided on the component pressing body and facing the electronic component;
A driving mechanism for pressing the electronic component and the protective sheet against each other between the sheet facing surface and the component facing surface by relatively moving the sheet pressing body and the parts pressing body.
A film forming apparatus characterized by having a. The method of claim 1, wherein the film forming unit comprises: a chamber into which a sputter gas is introduced;
a sputter source installed in the chamber and forming a film by depositing a film formation material by sputtering;
a cooling plate on which the electronic component embedded in the protective sheet is mounted;
Conveying device for conveying the cooling plate
A film forming apparatus characterized by having a. The film forming apparatus according to claim 1 or 2, wherein the thickness of the sheet-side elastic body is greater than the thickness of the electrode, and the hardness is equal to or less than Shore A50. The method of claim 1, wherein the adhesive force between the part facing surface and the adhesive surface of the protective sheet is Fa,
If the adhesive force between the electrode exposed surface and the adhesive surface of the protective sheet is Fb,
Fa<Fb
Characterized in that, the film forming apparatus. The film forming apparatus according to claim 1, wherein the surface facing the component has a surface roughness of 1.6 or more and 25 or less. The film forming apparatus according to claim 1, wherein the component pressing body is provided with a component-side elastic body having a surface facing the component. An embedding treatment device for embedding an electrode formed on an electrode exposed surface of an electronic component on an adhesive surface of a protective sheet, comprising:
A chamber capable of vacuuming the inside;
a sheet pressing body installed in the chamber and located on the opposite side of the electronic component with the protective sheet interposed therebetween;
a component pressing body installed in the chamber and located on the opposite side of the protective sheet with the electronic component interposed therebetween;
a sheet-side elastic body provided on the sheet pressing body and having a flat sheet facing surface facing the protective sheet;
a flat component facing surface provided on the component pressing body and facing the electronic component;
A driving mechanism for pressing the electronic component and the protective sheet against each other between the sheet facing surface and the component facing surface by relatively moving the sheet pressing body and the parts pressing body.
Characterized in that, the landfill treatment apparatus having a.

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