KR102126489B1 - Film formation apparatus - Google Patents

Abstract

[Problem] A film forming apparatus capable of suppressing heating of an electronic component with a simple configuration is provided.
[Solutions] The film forming apparatus 7 uses a protective sheet 61 and a cooling plate 63 in which electronic components 60 are arranged. The film forming apparatus 7 is provided with a plate mounting part 2 and a film forming processing part 3. The plate mounting portion 2 adheres the protective sheet 61 to the cooling plate 63. The film forming processing unit 3 deposits a film forming material by sputtering on the electronic component 60 on the protective sheet 61 adhered to the cooling plate 63. The plate mounting portion 2 is configured to depressurize the closed space 24 and the closed space 24 that encloses the component arrangement area 615 and the cooling plate 63 in the electronic component 60 and the protective sheet 61. It has a depressurizing portion. And the plate mounting part 2 presses the protective sheet 61 and the cooling plate 63 to each other after the pressure reduction by the pressure reducing part.

Description

Film Forming Equipment{FILM FORMATION APPARATUS}

The present invention relates to a film forming apparatus.

A wireless communication device typified by a mobile phone is equipped with a large number of electronic components such as semiconductor devices. In order to prevent an electronic component from affecting communication characteristics, it is required to suppress the influence of electromagnetic waves on the inside and outside, such as leakage of electromagnetic waves to the outside. For this reason, electronic components having a shielding function against electromagnetic waves are used.

Generally, an electronic component is formed by mounting an element on an interposer substrate as a relay substrate for a mounting substrate and sealing the element with resin. By providing a conductive electromagnetic shielding film on the top and side surfaces of the sealing resin, an electronic component having a shielding function has been developed (see Patent Document 1).

Such an electromagnetic shielding film can be a laminated film of a plurality of types of metal materials. For example, an electromagnetic shielding film having a stacked structure in which a Cu film is formed after an SUS film is formed and an SUS film is formed thereon is also known.

In order to obtain a sufficient shielding effect in the electromagnetic shielding film, it is necessary to lower the electrical resistivity. For this reason, the electromagnetic shielding film is required to have a certain thickness. In semiconductor devices, it is generally believed that good shielding properties can be obtained if there is a film thickness of about 1 μm to 10 μm. It is known that in the electromagnetic shielding film having a stacked structure of SUS, Cu, and SUS, a good shielding effect can be obtained if the film thickness is about 1 μm to 5 μm.

Patent Document 1: International Publication No. 2013/035819

As a method for forming an electromagnetic shielding film, a plating method is known. However, since the plating method requires a wet process such as a pre-treatment step, a plating treatment step, and a post-treatment step such as washing with water, an increase in manufacturing cost of electronic components cannot be avoided.

So, the sputtering method which is a dry process attracts attention. As a film forming apparatus by the sputtering method, a plasma processing apparatus for forming a film using plasma has been proposed. The plasma processing apparatus introduces an inert gas into a vacuum container in which a target is placed, and applies a direct current voltage. The plasma-formed inert gas ions collide with the target of the film-forming material, and the material beaten from the target is deposited on the work to form a film.

A general plasma processing apparatus is used to form a film having a thickness of tens to hundreds of nanometers, which can be formed with a processing time of tens of seconds to several minutes. However, as described above, it is necessary to form a film having a micron level as the electromagnetic shielding film. The sputtering method is a technique of depositing particles of a film-forming material on a film-forming object to form a film, so the thicker the film to be formed, the longer it takes to form a film.

Therefore, in order to form the electromagnetic shielding film, processing time of tens of minutes to about an hour longer than that of a general sputtering method is required. For example, in the electromagnetic shielding film having a laminated structure of SUS, Cu, and SUS, a processing time of more than one hour may be required to obtain a film thickness of 5 μm.

Then, in the sputtering method using plasma, the package that is the exterior of the electronic component is continuously exposed to the heat of the plasma during this processing time. As a result, the package may be heated to around 200°C until a film having a thickness of 5 µm is obtained.

On the other hand, the heat-resistant temperature of the package is about 200°C for temporary heating of a few seconds to several tens of seconds, but when heating exceeds a few minutes, it is generally about 150°C. For this reason, it has been difficult to form a micron-level electromagnetic shielding film using a general plasma sputtering method.

To cope with this, it is conceivable to provide a plasma processing device with a cooling device for suppressing the temperature rise of the electronic component. In this case, the device configuration is complicated and large.

An object of the present invention is to provide a film forming apparatus capable of suppressing heating of an electronic component with a simple configuration.

In order to achieve the above object, the present invention is a film forming apparatus using a protective sheet and a cooling plate in which electronic components are arranged, the plate mounting portion for adhering the protective sheet to the cooling plate, and the electronic component on the cooling plate. A film-forming processing part for depositing a film-forming material by sputtering to form a film, the plate mounting part comprising: a pressing part for pressing the outer circumference of the protective sheet against the cooling plate, and the pressing part for cooling the outer circumference of the protective sheet by the cooling plate At the time of contacting with the protection sheet holding portion for holding the protection sheet so as to separate the cooling plate from the area where the electronic components are arranged in the protection sheet, and the outer peripheral portion of the protection sheet by the pressing portion Under pressure, the protective sheet has a depressurizing portion to depressurize the space between the cooling plate, and the protective sheet holding portion maintains the protective sheet under the depressurized space between the protective sheet and the cooling plate. It is characterized by being released.

The protective sheet holding portion has a flat surface having an air hole that separates the cooling sheet and the protective sheet by sucking the protective sheet on the opposite side to the cooling plate with the protective sheet interposed therebetween, and wherein the air hole is , The negative pressure may be maintained until the space between the protective sheet and the cooling plate is reduced to a predetermined pressure by the pressure reducing unit.

Having the air hole, further comprising a positive pressure portion for generating a positive pressure in the air hole, the air hole, after the pressure between the protective sheet and the cooling plate by the pressure reducing portion is reduced to a predetermined pressure, By changing from generating a negative pressure to generating a positive pressure, a pressing force directed to the cooling plate may be applied to the protective sheet.

The cooling plate has an air hole on the side of the plate penetrating both sides of the plate, and the depressurizing portion is disposed on an arrangement surface on which the cooling plate is disposed on the opposite side to the protective sheet with the cooling plate interposed therebetween. It may be formed, and may have an air hole on the side of the placement surface that generates a negative pressure, and the protective sheet may be drawn to the cooling plate through the air hole on the side of the placement surface and the air hole on the side of the plate.

The plate mounting portion may have a driving portion for approaching the protection sheet and the cooling plate, and the air hole may generate negative pressure before the protection sheet and the cooling plate approach.

According to the present invention, since the electronic component is transferred from the electronic component to the cooling plate, the electronic component is prevented from being filled with excessive heat during the film-forming process, and because the air bubbles are difficult to enter between the protective sheet and the cooling plate, both are in close contact with each other. The area of heat transfer from the part to the cooling plate is large. Therefore, heating of the electronic component can be suppressed.

1 is a side view showing an electronic component subjected to film formation.
2 is a side view showing a state of an electronic component subjected to a film forming process.
3 is an exploded perspective view showing a state of an electronic component when subjected to a film forming process.
4 is a transition diagram showing the flow of the deposition process of an electronic component.
5 is a block diagram showing the configuration of a film forming apparatus.
6 is a schematic view showing the structure of the embedding processing unit.
7 is a transition diagram schematically showing a state in each process of the embedding processing unit.
8 is an enlarged view of electronic components in the embedding processing unit.
9 is a schematic view showing the configuration of a plate mounting portion.
10 is a transition diagram schematically showing a state in each process of the plate mounting portion.
11 is a schematic diagram showing the configuration of a film forming processing unit.
It is a schematic diagram showing the structure of a plate release part.
13 is a transition diagram schematically showing the state in each process of the plate release section.
It is a schematic diagram showing another structure of a plate release part.
15 is a schematic diagram showing still another configuration of the plate release section.
16 is a schematic view showing the configuration of a peeling treatment section.
It is a figure which shows the upper surface of the component embedding completed sheet in a peeling process part.
18 is a transition diagram schematically showing the state in each step of the peeling treatment section.
19 is a schematic view showing an aspect of preventing the rise of an electronic component.
Fig. 20 is a photograph taken of an electrode after peeling an electronic component from a protective sheet by a peeling treatment section.
It is a top view which shows another aspect of a sheet|seat with a part embedded in a peeling processing part.
It is a top view which shows another aspect of a component embedded sheet in a peeling processing part.
23 is a plan view showing still another aspect of the component embedded sheet in the peeling treatment section.
24 is a block diagram showing another configuration of the film forming apparatus.
25 is a schematic diagram showing the configuration of a conventional lifting device.
26 is a schematic diagram showing the lifting of an electronic component in a conventional lifting device.
27 is a photograph showing the state of the electrode after the adhesive film is reattached to the electronic component.

(Electronic parts)

1 is a side view showing an electronic component subjected to film formation. As illustrated in FIG. 1, an electromagnetic shielding film 605 is formed on the surface of the electronic component 60. The electronic component 60 is a surface-mount component such as a semiconductor chip, diode, transistor, capacitor, or SAW filter. A semiconductor chip is an integrated circuit such as an IC or LSI in which a plurality of electronic devices are integrated. This electronic component has a substantially rectangular parallelepiped shape such as BGA, LGA, SOP, QFP, WLP, etc., and one surface is an electrode exposed surface 601. The electrode exposed surface 601 is a surface where the electrode 602 is exposed and faces the mounting substrate and is connected to the mounting substrate. The electrode 602 is an electrode called a ball bump or a solder ball bump, and is formed by mounting solder (solder balls) formed in a ball shape having a diameter of several tens to several hundreds of µm on a pad electrode.

The electromagnetic shielding film 605 shields electromagnetic waves. The electromagnetic shielding film 605 is formed of materials such as Al, Ag, Ti, Nb, Pd, Pt, and Zr. The electromagnetic shielding film 605 may be formed of a magnetic material such as Ni, Fe, Cr, or Co. Further, SUS, Ni, Ti, V, Ta, etc. may be formed as the underlying layer of the electromagnetic shielding film 605, and SUS, Au, etc. may be formed as the protective layer on the outermost surface.

The electromagnetic shielding film 605 is formed on the outer surface other than the upper surface 603 and the side surface 604 of the electronic component 60, that is, the electrode exposed surface 601. The upper surface 603 is a surface opposite to the electrode exposed surface 601. The side surface 604 connects the upper surface 603 and the electrode exposed surface 601, and is an outer peripheral surface extending at a different angle from the upper surface 603 and the electrode exposed surface 601. In order to obtain a shielding effect of electromagnetic shielding, the electromagnetic shielding film 605 may be formed on at least the upper surface 603. On the side 604, there is a ground pin outside the drawing. The formation of the electromagnetic shielding film 605 on the side surface is also for grounding the electromagnetic shielding film 605.

(When forming)

2 is a side view showing a state of an electronic component after being subjected to a film forming process. 3 is an exploded perspective view showing the state of the electronic component when subjected to the film forming process. 2 and 3, in the electronic component 60, the electrode 602 is embedded in the protective sheet 61 in advance, and the electrode exposed surface 601 is in close contact with the protective sheet 61. . By embedding the electrode 602 in the protective sheet 61, it is prevented that particles of the electromagnetic shielding film 605 reach the electrode 602. In addition, due to the close contact between the electrode exposed surface 601 and the protective sheet 61, particles of the electromagnetic shielding film 605 are also eliminated from entering between the electrode exposed surface 601 and the protective sheet 61, thereby preventing the electrode 602. On the other hand, the possibility of particles of the electromagnetic shielding film 605 reaching is lowered.

The protective sheet 61 is a synthetic resin having heat resistance such as PEN (polyethylene naphthalate) and PI (polyimide). One surface of the protective sheet 61 is an adhesive surface (adhesive layer) 611 having flexibility that the electrode 602 digs in and adhesion to which the electrode exposed surface 601 closely adheres. As the adhesive surface 611, a variety of adhesive materials such as silicone-based, acrylic-based resins, urethane resins, and epoxy resins are used.

The adhesive surface 611 includes an outer frame region 613 reaching a predetermined distance inward from the end of the protective sheet 61 and an inner frame region reaching a predetermined distance inward from the inner periphery of the outer frame region 613 ( 614) and a component arrangement area 615 inside the inner frame area 614. The electronic component 60 is bonded to the component arrangement area 615. The frame 62 of the frame shape is adhered to the outer frame region 613. The inner frame region 614 is a range where the protective sheet 61 is bent, and neither the frame 62 nor the electronic component 60 is adhered. In addition, the opposite surface of the adhesive surface 611 is the non-adhesive surface 612.

The protective sheet 61 is adhered to the cooling plate 63 through the adhesive sheet 64. The cooling plate 63 is formed of a metal, ceramic, resin, or other material having high thermal conductivity, such as SUS. The cooling plate 63 is a heat dissipation path that releases heat from electronic components and suppresses excessive heat storage. The adhesive sheet 64 has adhesiveness on both surfaces, and increases the adhesiveness between the protective sheet 61 and the cooling plate 63 to secure the heat transfer area to the cooling plate 63.

The height H1 from the surface of the component arrangement area 615 to the top surface of the frame 62 is the height H2 from the surface of the component arrangement area 615 to the upper surface 603 of the electronic component 60. Higher than that (see Fig. 4). Here, the height H1 is sometimes referred to as the thickness H1 for convenience, but it has the same meaning. In other words, if a flat plate is placed on the frame 62, the upper surface 603 of the electronic component 60 is less than the flat plate.

A guide part insertion hole 621 is formed through one end of the frame 62. The guide insertion hole 621 has an opening such as an ellipse, a rectangle, a round circle, etc. along the end of the frame 62, and a surface that adheres to the protective sheet 61 of the frame 62 and vice versa. It is formed through piercing. That is, for example, a rod-like member is inserted into the guide insertion hole 621, and when the end of the protective sheet 61 is pressed (see FIG. 18), one end of the protective sheet 61 is peeled from the frame 62. .

A pusher insertion hole 631 is formed in the cooling plate 63 and the adhesive sheet 64. The pusher insertion hole 631 does not coincide with the guide insertion hole 621, and is formed through the position closed by the frame 62. When a rod-shaped member is inserted into the pusher insertion hole 631, for example, and the frame 62 is pushed up from the tip of the rod-shaped member, the pusher insertion hole 631 is formed through a plurality of holes so that the entire frame 62 is lifted in parallel. do. For example, if the frame 62 is a rectangular frame, pusher insertion holes 631 are located at four corners or additionally at the center of each side. From the viewpoint of maintaining the parallelity of the frame 62, it is preferable that the rod-shaped member has a rectangular front end surface, that is, a thin plate shape or a cross-section L-shaped shape, but is not limited to this, and has a round circular front end face. May be. The pusher insertion hole 631 correspondingly has a rectangular, L-shaped or rounded circular shape.

Moreover, the cooling plate 63 and the adhesive sheet 64 have minute air holes 632 at equal intervals throughout the range where the inner frame region 614 and the component arrangement region 615 of the protective sheet 61 are bonded. Many are formed. The air holes 632 are, for example, micro-cylindrical or slit-shaped. The air hole 632 is provided to apply a negative pressure or a positive pressure without staining through the air hole 632 to at least the component arrangement area 615 of the protective sheet 61 adhered to the cooling plate 63. The number of the air holes 632, the through-forming interval and the through-forming range are not limited to this, and even if only the range corresponding to the component arrangement area 615 is formed, for example, the cooling plate 63 and the adhesive sheet 64 ) The air hole 632 may be densely arranged at the center, while the outer side may be sparsely arranged, or only one may be formed at a position corresponding to the center of the component arrangement area 615.

(Deposition process flow)

In the film forming process, an electromagnetic shielding film 605 is formed and individually separated electronic parts 60 are obtained through a part placement process, a part embedding process, a plate mounting process, a film forming process, a plate removal process and a part peeling process. have.

4 is a view illustrating a process flow of forming an electronic component. As shown in FIG. 4, in the component placement step, the electrode exposed surface 601 of the electronic component 60 faces the component unplaced sheet 65 with the frame 62 adhered to the protective sheet 61. In this state, the electronic components 60 are lined up in the component arrangement area 615. Although the frame 62 is adhered to the protective sheet 61 and the electronic components 60 are arranged, the state in which the electrodes 602 are not yet buried is referred to as the component placement complete sheet 66.

In the component embedding step, the electrode 602 is embedded in the protective sheet 61 with respect to the component placement completed sheet 66, and the electrode exposed surface 601 is brought into close contact with the protective sheet 61. Regardless of whether the electromagnetic shielding film 605 is formed or not, the state in which the electrode 602 is buried in the protective sheet 61 is referred to as a component embedding completed sheet 67. In the plate mounting process, the component embedded sheet 67 is brought into close contact with the cooling plate 63 through the adhesive sheet 64. The state in which the cooling plate 63 is mounted is called a component mounting plate 68.

In the film forming step, particles of the electromagnetic shielding film 605 are deposited from the upper surface 603 side of the electronic component 60 to form the electromagnetic shielding film 605 on the electronic component 60. At this time, the electrode 602 of the electronic component 60 is buried in the protective sheet 61, and the electrode exposed surface 601 is in close contact with the protective sheet 61, so that the particles of the electromagnetic shielding film 605 Is prevented from being attached to the electrode 602.

In the plate release step, the cooling plate 63 is removed and returned to the form of the component embedded sheet 67. Then, in the component peeling step, the electronic component 60 is peeled off from the protective sheet 61 and separated into a component unplaced sheet 65 and individual electronic components 60. In addition, in preparation for reuse of the frame 62, the protective sheet 61 is peeled off from the frame 62. The film forming process is completed by the above.

(Film forming device)

5 shows a film forming apparatus in charge of a part embedding process, a plate mounting process, a film forming process, a plate release process, and a part peeling process in the above-described film forming process flow. As shown in FIG. 5, the film-forming apparatus 7 is equipped with the embedding processing part 1, the plate mounting part 2, the film-forming processing part 3, the plate release part 4, and the peeling processing part 5. Between each part, it is connected by the conveyance part 73, and the member required in each process is input, and the member which completed the process in each process is discharged. The conveying section 73 is, for example, a conveyor, and may be a conveying table that can move along a linear track with a ball screw or the like.

In addition, the film forming apparatus 7 controls the operation timing of each component provided by the embedding processing unit 1, the plate mounting unit 2, the film forming processing unit 3, the plate releasing unit 4, and the peeling processing unit 5. A control unit 74 such as a computer or microcomputer having a CPU, ROM, RAM, and signal transmission circuit is accommodated. Moreover, the pneumatic circuit 75 for supplying a positive pressure or a negative pressure to the buried processing section 1, the plate mounting section 2, the film formation processing section 3, the plate release section 4 and the peeling processing section 5 is accommodated. The control unit 74 also controls the solenoid valve in the pneumatic circuit 75 to switch negative pressure generation, negative pressure release, positive pressure generation, and positive pressure release.

(Embedded processing part)

The landfill processing unit 1 in charge of the parts embedding process will be described. 6 is a schematic diagram showing the configuration of the embedding processing unit 1. A part placement complete sheet 66 is put into the buried processing section 1. The embedding processing unit 1 pulls the protective sheet 61 close to the electronic component 60 while restraining the electronic component 60 and presses the protective sheet 61 against the electronic component 60. Thereby, the buried processing part 1 makes the electrode 602 of the electronic component 60 dig into the protective sheet 61, and also makes the electrode exposed surface 601 adhere to the protective sheet 61.

As shown in Fig. 6, this buried processing unit 1 includes a ceiling portion 11 and a placing table 12. The ceiling 11 and the placing table 12 are blocks having inner spaces 111 and 121 together. The ceiling portion 11 and the placing table 12 are disposed opposite to each other and have flat surfaces 112 and 122 parallel to each other. Both flat surfaces 112 and 122 have the same size and size as the component placement complete sheet 66 or are wider than the component placement complete sheet 66. The placing table 12 is non-moving. On the other hand, the ceiling part 11 can be elevated with respect to the placing table 12. The ceiling 11 at least approaches the placement table 12 to a thickness H1 of the frame 62 of the component placement completed sheet 66.

A part placement complete sheet 66 is loaded on the placing table 12. The flat surface 122 of the placing table 12 serves as a placement surface of the component placement complete sheet 66. The flat surface 122 is made of a non-slip member having adhesive force. In addition, a plurality of air holes 123 through the inner space 121 are formed through the flat surface 122 of the placing table 12. The through hole forming range of the air hole 123 is a range of the same size as the inside of the frame 62 of the component placement completed sheet 66, or is at least the same size as the component arrangement area 615. The through hole forming position of the air hole 123 faces the area inside the frame 62 or faces the component arrangement area 615 when the part placement complete sheet 66 is placed on the placing table 12. Location.

In the interior space 121 of the placing table 12, an air pressure supply hole 124 is further formed through a portion different from the flat surface 122. The pneumatic supply hole 124 is connected to the pneumatic circuit 75 including a compressor, a negative pressure supply pipe, a constant pressure supply pipe, and the like outside the drawing. Therefore, a positive pressure or a negative pressure is selectively generated in the air hole 123 through the air pressure supply hole 124 and the internal space 121. The air hole 123, the air pressure supply hole 124, and the air pressure circuit 75 function as a pressure adjusting section.

In addition, a pusher insertion hole 125 penetrating the placing table 12 is opened on the flat surface 122 of the placing table 12. The pusher insertion hole 125 is formed outside the through-forming range of the air hole 123. Specifically, the through-forming position of the pusher insertion hole 125 is closed by the frame 62, avoiding the guide insertion hole 621 of the frame 62 when the component placement complete sheet 66 is loaded. It is a position. The pusher 13 is inserted through the pusher insertion hole 125. The pusher 13 can be brought out from the flat surface 122 of the placing table 12. When the pusher 13 protrudes from the pusher insertion hole 125, the part placement completed sheet 66 is spaced apart from the placing table 12, and the rigidity, number, and arrangement can be lifted and supported in parallel. It is installed at intervals. For example, if the outer shape of the frame 62 is rectangular, a bar body is disposed in correspondence with each corner of the frame 62.

Subsequently, a plurality of air holes 113 through the inner space 111 are also formed through the flat surface 112 of the ceiling 11. The through hole forming range of the air hole 113 is a range of the same size as the inside of the frame 62 of the part placement completed sheet 66, or at least the same size as the part arrangement area 615, and the parts arrangement It spans the entire area 615. The through hole forming position of the air hole 113 is a position facing the inner region of the frame 62 when the component placement completed sheet 66 is placed on the placing table 12, or facing the component arrangement region 615 It is a location to do.

In the interior space 111 of the ceiling portion 11, an air pressure supply hole 114 is formed through a portion different from the flat surface 112. The pneumatic supply hole 114 is connected to the pneumatic circuit 75 including a compressor outside the drawing, a negative pressure supply pipe, and the like. Therefore, negative pressure is generated in the air hole 113 through the air pressure supply hole 114 and the inner space 111. The air hole 113, the air pressure supply hole 114, and the air pressure circuit 75 function as a pressure reducing unit.

Moreover, on the flat surface 112 of the ceiling portion 11, along the frame 62 of the component placement complete sheet 66 carried on the placing table 12, the O-ring surrounds the through-forming range of the air hole 113. 115 is installed.

7 shows the flow of the operation of the embedding processing unit 1. 7 is a transition diagram schematically showing a state in each process of the embedding processing unit 1. First, as shown in Fig. 7(a), the component placement completed sheet 66 is put into the embedding processing unit 1. The ceiling portion 11 is sufficiently spaced from the placing table 12, and the pusher 13 protrudes the tip from the flat surface 122 of the placing table 12. When the part placement complete sheet 66 is put in, the frame 62 of the part placement complete sheet 66 is aligned with the pusher 13 so that the part placement complete sheet 66 is supported by the pusher 13.

Subsequently, as shown in Fig. 7(b), the pusher 13 is retracted into the pusher insertion hole 125. Accordingly, the component placement completed sheet 66 descends to the flat surface 122 of the placement table 12. Also, the ceiling 11 is moved toward the placement table 12. Then, the frame 62 of the component placement complete sheet 66 is sandwiched between the flat surface 112 of the ceiling 11 and the flat surface 122 of the placing table 12. The height H1 from the surface of the component arrangement area 615 to the top surface of the frame 62 is the height H2 from the surface of the component arrangement area 615 to the upper surface 603 of the electronic component 60. Higher than that. Therefore, when the frame 62 is fitted, the upper surface 603 of the electronic component 60 is less than the flat surface 112 of the ceiling 11. Therefore, the electronic component 60 is loaded in the closed space 14 surrounded by the flat surface 112 of the ceiling 11, the protective sheet 61, and the frame 62, and sealed by the O-ring 115. The component arrangement area 615 is confined.

When the component arrangement area 615 is confined in the closed space 14, as shown in FIG. 7(c), negative pressure is generated in the air hole 123 of the placing table 12, and the protective sheet 61 is placed. Pull it to the flat surface 122. Subsequently, as shown in FIG. 7( d), negative pressure is also generated in the air hole 113 of the ceiling portion 11 to decompress the closed space 14 in which the component arrangement area 615 is confined. The degree of decompression is preferably the same as that of the pressure of both air holes 113 and 123 and close to the vacuum. The air hole 123 of the placing table 12 is generating negative pressure in advance, and the protective sheet 61 is depressurized in the process of depressurizing the closed space 14 by pulling the protective sheet 61 onto the placing table 12. ) In order to suppress that the air pressure at the lower side becomes excessive with respect to the air pressure at the upper side, and accordingly, the electronic component 60 dashes to the flat surface 112 of the ceiling portion 11. In addition, in this step, the electronic component 60 has the electrode exposed surface 601 because the electrode 602 is disposed on the protective sheet 61 without being buried in the adhesive surface 611 of the protective sheet 61. ) And a gap exist between the adhesive surface 611, and this gap is also depressurized.

When the depressurization is completed, as shown in FIG. 7(e), while maintaining the negative pressure on the ceiling 11 side, the air hole 123 on the placing table 12 side is gradually changed from negative pressure to positive pressure, and placed The air hole 123 of the stage 12 is switched to a positive pressure. The electronic component 60 and the protective sheet 61 are gently sucked up on the flat surface 112 of the ceiling 11, and are also gently pushed up. The electronic component 60 is pressed against the flat surface 112 of the ceiling 11 to be restrained. On the other hand, the protective sheet 61, because the adhesive surface 611 has flexibility, is pulled further into the flat surface 112 even after the electronic component 60 is restrained, and is further pushed up toward the flat surface 112 I will go.

Then, the electrode 602 of the electronic component 60 is buried in the adhesive sheet 611 of the protective sheet 61, more specifically, the protective sheet 61, and also the electrode exposed surface 601 of the electronic component 60 ) Is in close contact with the protective sheet 61. At this time, the flat surface 112 of the ceiling portion 11 includes a component arrangement area 615 and makes the component arrangement area 615 flatten. In other words, the component arrangement area 615 is not curved. For this reason, it is prevented that an insufficient burying of the electrode 602 or insufficient adhesion of the electrode exposed surface 601 at the end of the component arrangement area 615 is prevented.

The adhesion process between the electrode exposed surface 601 and the protective sheet 61 is performed under a reduced pressure environment, and there is no or very little air in the closed space. Therefore, the possibility of air bubbles entering between the electrode exposed surface 601 and the protective sheet 61 is lowered.

Moreover, FIG. 8 is an enlarged view between the electronic components 60 in the embedding processing unit 1. As shown in FIG. 8, the static pressure generated in the placing table 12 evenly pushes at least the component arrangement area 615 of the protective sheet 61. Then, the flexible protective sheet 61 is pushed toward the flat surface 112 of the ceiling 11 without being blocked by the electronic component 60 in each gap between adjacent electronic components 60. do. Then, the adhesive surface 611 of the protective sheet 61 is raised until it reaches the lower side of the electronic component 60, and the protective sheet 61 is also in close contact with the lower side of the electronic component 60. Therefore, it is possible to more reliably prevent particles of the electromagnetic shielding film 605 from entering between the electrode exposed surface 601 and the protective sheet 61.

When the electrode 602 of the electronic component 60 is buried in the protective sheet 61, and the electrode exposed surface 601 and the lower side of the electronic component 60 are in close contact with the protective sheet 61, FIG. 7(f) As shown in ), the pusher 13 is moved axially along the pusher insertion hole 125 to reappear from the flat surface 122 of the placing table 12. At the same time, the ceiling 11 is placed away from the placing table 12 at a constant speed and a constant speed of the pusher 13. Finally, as shown in Fig. 7(g), the pusher 13 is stopped, and the ceiling 11 is released from the placing table 12, thereby releasing the insertion of the part reclamation completion sheet 67. do. Thereby, embedding of the electronic component 60 into the protective sheet 61 by the embedding processing unit 1 is completed.

In addition, the negative pressure on the ceiling portion 11 side and the positive pressure on the placement table 12 side, in FIG. 7(e), the close contact of the electrode exposed surface 601 of the electronic component 60 with the protective sheet 61 is completed. Then, it may be released for a while until the ceiling 11 is raised in FIG. 7(g). As for the negative pressure on the ceiling portion 11 side, when the ceiling portion 11 is released immediately before rising in Fig. 7(g), the electronic component 60 is lifted when the pusher 13 in Fig. 7(f) rises. It is preferable because it can be stably maintained on the protective sheet 61.

In this way, the ceiling portion 11 and the placing table 12 are fixed to the part placement complete sheet 66 by sandwiching the frame 62 on both sides. In addition, the ceiling portion 11, the protective sheet 61, and the frame 62 partition the enclosed space 14 that confines the component arrangement area 615. The O-ring 115 increases the reliability of the closed space 14 by sealing. In addition, the air hole 113 of the ceiling portion 11 serves as a depressurizing portion for depressurizing the closed space 14.

Then, the flat surface 122 of the placing table 12 serves as a placement surface of the component placement complete sheet 66. The air hole 123 opening on the flat surface 122 of the placing table 12 generates negative pressure prior to decompression of the closed space 14, so that the electronic component 60 is flat on the ceiling 11 Anti-collision means to prevent the rush to 112, the negative pressure of the ceiling portion 11 and the pressure of the component arrangement area 615 by the positive pressure against the flat surface 112 of the ceiling portion 11, the electrode of the electronic component 60 It becomes a pressing means for embedding 602.

In addition, the flat surface 112 of the ceiling portion 11 serves as a flattening means to flatten the component arrangement area 615 to increase the buried effect of the electrode 602 and the adhesion effect of the electrode exposed surface 601. The air hole 113 opening on the flat surface 112 of the ceiling portion 11 engages with the positive pressure of the placing table 12 to apply the component arrangement area 615 to the flat surface 112 of the ceiling portion 11 by negative pressure. Suction means for burying the electrode 602 of the electronic component 60 by pressing, the static pressure of the placing table 12, and the protective sheet 61 being sucked up in the gap between the electronic components 60 to thereby electronic component 60 It becomes the side lower covering means to adhere to the lower side of the side.

As described above, the embedding processing unit 1 embeds the electrode 602 of the electronic component 60 on the adhesive surface 611 of the protective sheet 61, but includes the electronic component 60 and the component arrangement area 615. It was provided with a depressurizing portion for depressurizing the space. And after decompression, the electronic component 60 and the protective sheet 61 were pressed against each other. Accordingly, air bubbles do not enter the gap between the electrode exposed surface 601 of the electronic component 60 and the protective sheet 61, resulting in insufficient adhesion, and the electrode exposed surface 601 of the electronic component 60 and the protective sheet ( The possibility that a gap occurs between 61) decreases, so that a situation in which particles of the electromagnetic shielding film 605 adhere to the electrode 602 can be avoided.

In addition, the buried processing unit 1 was provided with a pressure adjusting unit that adjusts the pressure in the space opposite to the flat surface 112 with the flat surface 112 of the ceiling portion 11 and the protective sheet 61 interposed therebetween. . The flat surface 112 is positioned opposite the protective sheet 61 with the electronic component 60 interposed therebetween, and faces the electronic component 60. Further, for example, the air hole 123, the air pressure supply hole 124, and the air pressure circuit 75 are examples of the pressure adjusting section. The pressure adjusting unit is disposed between the placing table 12 and the protective sheet 61, that is, the protective sheet 61 and the flat surface 112, rather than the space between the protective sheet 61 and the flat surface 112. Increased the pressure in the opposite space relatively.

Accordingly, the electronic component 60 and the protective sheet 61 were directed to the flat surface 112, and the flat surface 112 was used as a brake so that the electronic component 60 and the protective sheet 61 were pressed against each other. Therefore, the component arrangement area 615 of the protective sheet 61 is flattened, and is pressed against each other in a state where the electrode exposed surface 601 of the electronic component 60 and the protective sheet 61 are parallel. Therefore, there is no more room for air bubbles.

The thickness of the electronic component 60 and the protective sheet 61 is not uniform and there are variations. The pressure difference between the pressure in the closed space 14 and the pressure between the placing table 12 and the protective sheet 61 is equal to every corner of the electronic component 60 and the protective sheet 61 regardless of variations in thickness. Since the pressing force can be applied, a sufficient pressing force can be reliably applied between the plurality of electrodes 602 of each of the plurality of electronic components 60 and the adhesive surface 611 of the protective sheet 61, Each electrode 602 of each electronic component 60 can be embedded in the protective sheet 61.

In addition, the buried processing unit 1 had a flat surface 122 of the placing table 12, that is, a protective sheet 61 interposed therebetween, so as to have a placement surface located opposite to the flat surface 112. Then, an air hole 123 that is opened to the placement surface and spaces the protective sheet 61 away from the flat surface 112 by generating a negative pressure prior to decompression of the closed space 14 is formed in the placement table 12. . Accordingly, the electronic component 60 can be prevented from being damaged by the electronic component rushing to the flat surface 112 while the closed space 14 is depressurized.

The air hole 113 of the ceiling 11 and the air hole 123 of the placing table 12, which press the electronic components 60 and the protective sheet 61 against each other, were used as the depressurization portion, but the closed space 14 was used. Alternatively, a third air hole may be formed, and negative pressure may be generated in the third air hole to reduce pressure.

In addition, the air hole 123 on the side of the placing table 12 changes to the generation of static pressure after the closed space 14 is depressurized, and protects the electronic component 60 against the flat surface 112. 61). Accordingly, the adhesive surface 611 is raised together with the protective sheet 61 in the gap between the electronic components 60, and the lower side of the electronic component 60 can also be covered with the protective sheet 61. Therefore, it is possible to reliably prevent a gap from being generated between the electrode exposed surface 601 and the protective sheet 61. Further, even in electronic components such as SOP or QFP having a thin plate-shaped electrode on the lower side, the electrode 602 is covered with a protective sheet 61 to prevent the particles of the electromagnetic shielding film 605 from adhering. It is possible to apply the film forming apparatus 7.

Further, in the present embodiment, a negative pressure is generated in the ceiling portion 11, and a positive pressure is generated in the placing table 12 opposite to the ceiling portion 11 with the protective sheet 61 interposed therebetween. First, in order to press the electronic component 60 and the protective sheet 61 to each other, secondly, the adhesive surface 611 is raised in the gap between the electronic components 60 to cover the lower side of the electronic component 60. .

However, in order to achieve pressing of the electronic component 60 and the protective sheet 61 to each other, a differential pressure of this size is not essential. The differential pressure at which the electrode 602 of the electronic component 60 is buried in the protective sheet 61 follows the flexibility of the protective sheet 61, and even if the placement table 12 side is not changed to a static pressure, the placement table 12 ) The negative pressure on the side may be made weaker than the negative pressure on the ceiling 11 side. That is, relatively large, the case where the ceiling 11 side is negative pressure and the placing table 12 is a static pressure containing atmospheric pressure, and the placing table 12 has a higher negative pressure than the ceiling 11 side, but is higher than the atmospheric pressure. Including the low case, it is only necessary to be able to create a differential pressure that can embed the electrode 602 in the protective sheet 61 by the side of the ceiling 11 and the side of the placing table 12.

Even so, the electronic components (by the differential pressure between the negative pressure on the ceiling 11 side and the atmospheric pressure or pressure exceeding the atmospheric pressure generated in the placing table 12 on the opposite side of the ceiling 11 with the protective sheet 61 interposed therebetween. When the 60 and the protective sheet 61 are pressed, since a large pressing force can be applied, the plurality of electrodes 602 of each of the plurality of electronic components 60 and the adhesive surface 611 of the protective sheet 61 Sufficient pressing force can be reliably provided between, and each electrode 602 of each electronic component 60 can be embedded in the protective sheet 61.

In addition, the protective sheet 61 is pushed up by the differential pressure, and the pushing amount of the component arrangement area 615 is determined by the flat surface 112. That is, since the amount of deformation of the protective sheet 61 is defined as the flat surface 112, the pushing force due to the differential pressure is located in the gap between the electronic components 60 of the component arrangement area 615, 61 ). At this time, since the protective sheet 61 positioned in the gap between the electronic components 60 does not contact the flat surface 112, a pressure-reducing space is present thereon. For this reason, the adhesive surface 611 of the gap portion together with the protective sheet 61 is raised by the differential pressure, so that the lower side of the electronic component 60 can be covered with the protective sheet 61 as well.

Therefore, in the present embodiment, in order to cover the lower side of the electronic component 60, a negative pressure is generated in the ceiling portion 11 and a positive pressure is generated in the placing table 12, so that the component arrangement area 615 is placed in the ceiling portion 11 ) Was pressed against the flat surface 112. However, depending on the flexibility of the protective sheet 61, even if it is not a differential pressure between the pressure close to the vacuum on the ceiling 11 side and the atmospheric pressure or pressure exceeding the atmospheric pressure on the placing table 12 side, the adhesive surface 611 is electronic In some cases, the gap between the parts 60 can be raised. Therefore, in order to cover the lower part of the side surface of the electronic component 60, it is preferable to change the placement table 12 side to a positive pressure, but it is not essential to adjust the placement table 12 side to a static pressure. That is, it is sufficient that the differential pressure can be adjusted according to the flexibility of the protective sheet 61, and depending on the flexibility of the protective sheet 61, after completion of the depressurization of the ceiling 11 side, the pressure on the placing table 12 side to atmospheric pressure Even if it is not crazy, the negative pressure may be reduced.

In addition, the shield performance can be improved by connecting the electromagnetic shielding film 605 to be described later with the ground wiring of the electronic component 60. The ground wiring is a wiring for pushing unnecessary electromagnetic waves to the outside, and is generally formed on the side surface of the electronic component 60. It is necessary to avoid interfering the connection between the electromagnetic wave shield film 605 and the ground wiring by the bulging of the adhesive surface 611 reaching the lower side of the electronic component 60.

Since the embedding processing unit 1 can independently adjust the pressure on the ceiling 11 side and the placing table 12 side to generate a desired differential pressure, the height of the ridge to the lower side of the electronic component 60 Can be adjusted, and can be uniformly controlled to the lower side of the electronic component 60. That is, by closely adhering the lower side to the protective sheet 61, the gap leading to the electrode 602 is more reliably sealed, or when the electronic component 60 is SOP or QFP, the electrode at the lower side is protected from the protective sheet 61. While buried in ), the ground wiring of the side surface 604 can be exposed without the protective sheet 61 affecting it.

In addition, a known mechanism can be applied to the mechanism of the ceiling 11 and the mechanism of the pusher 43, and the present invention is not limited to the mechanism of the mechanism.

For example, the ceiling portion 11 is connected to a ball screw having an axis extending in the direction from the ceiling portion 11 toward the placing table 12 and a rail guide extending in a direction from the ceiling portion 11 toward the placing table 12. have. The ceiling part 11 moves along the rails toward the arrangement according to the rotational direction of the screw shaft. As for the ceiling part 11, the ball screw and the rail guide are extended so that the ceiling part 11 may be close to the mounting table 12 to the distance of the thickness H1 of the frame 62 of the component placement complete sheet 66. In addition, since the ceiling portion 11 and the placing table 12 need only be relatively movable, it is not limited to moving the ceiling portion 11, and the placing table 12 may be moved. Both of the placing tables 12 may be moved.

In addition, the rear end of the pusher 13 is a cam ball. The cam ball follows the circumferential surface of the oval cam. The cam is pivotally supported by the rotating motor, and is capable of rotating in the circumferential direction. When the rotation motor is driven and the cam rotates, the cam hole rises up the bulging portion of the cam, the pusher 13 is pushed up, and the tip of the pusher 13 protrudes from the insertion hole.

In addition, as a fixing method of the component placement completed sheet 66, the frame 62 is fitted between the ceiling portion 11 and the placing table 12, and the ceiling portion 11, the protective sheet 61, and the frame 62 are inserted. Although the closed space 14 was partitioned, both positive pressure and negative pressure were selectively generated in the air hole 123 of the placing table 12, but it is not limited to these. For example, even if one or both of the ceiling portion 11 and the placing table 12 are cup-shaped, and the part placement complete sheet 66 is accommodated in the interior space divided into the ceiling portion 11 and the placing table 12, good. A block body for sandwiching the frame 62 from both sides may be provided, and the component placement completed sheet 66 may be pinched by the block body. In this case, the height of the frame 62 does not matter. The flat surface 122 of the placing table 12 may be formed with both through holes for generating negative pressure and through holes for generating positive pressure.

(Plate mounting part)

Next, the plate mounting portion 2 in charge of the plate mounting process will be described. 9 is a schematic view showing the configuration of the plate mounting portion 2. The plate mounting portion 2 is fed with a cooling plate 63 to which the component embedding completed sheet 67 prepared in the embedding processing portion 1 and the adhesive sheet 64 are previously adhered. The plate mounting portion 2 is pressed through the pressure-sensitive adhesive sheet 64 by pressing the component-embedded sheet 67 to the cooling plate 63 and pulling the component-embedded sheet 67 to the cooling plate 63. The component filling completion sheet 67 is brought into close contact with the cooling plate 63.

As shown in Fig. 9, the plate mounting portion 2 includes a ceiling portion 21 and a placing table 22. The ceiling part 21 and the placing table 22 are arranged opposite. The placing table 22 is floating. On the other hand, the ceiling portion 21 can be elevated with respect to the placing table 22. The ceiling portion 21 is close to the placing table 22 at least to a distance of the thickness H1 of the frame 62 of the component embedded sheet 67.

The ceiling portion 21 is a block having an inner space 211 and has a flat surface 212 on a surface facing the placing table 22. The placing table 22 has a bottomed cup shape. The opening 221 of the placing table 22 is directed to the ceiling portion 21. The flat surface 212 of the ceiling portion 21 is the same size as the component embedded sheet 67 or is wider than the embedded element sheet 67. On the other hand, the opening 221 of the placing table 22 has an inclusion area of the component arrangement area 615 or more and the inner frame area 614 or less. The edge 222 around the opening 221 of the placing table 22 has a width greater than or equal to the width of the frame 62.

In this placing table 22, the edge 222 supports the cooling plate 63, and the opening 221 is closed with the cooling plate 63. In the cooling plate 63, the surface opposite to the surface to which the pressure-sensitive adhesive sheet 64 is adhered contacts the edge 222. Moreover, the component embedded sheet 67 is placed on the cooling plate 63 facing the adhesive sheet 64. An air pressure supply hole 223 is formed through the bottom of the placing table 22. The pneumatic supply hole 223 is connected to the pneumatic circuit 75 including a compressor outside the drawing, a negative pressure supply pipe, and the like. Therefore, a negative pressure is generated in the air hole 632 of the cooling plate 63 disposed by closing the opening 221. That is, the opening 211 functions as an air hole on the arrangement surface side. In addition, the adhesive sheet 64 may be previously adhered to the non-adhesive surface 612 of the protective sheet 61 before being put into the plate mounting portion 2.

Moreover, a pusher insertion hole 224 penetrating the placing table 22 is formed at the edge 222 of the placing table 22. The through-forming position of the pusher insertion hole 224 coincides with the pusher insertion hole 631 of the cooling plate 63, and when the part embedding completion sheet 67 is loaded, the guide insertion hole of the frame 62 It is a position to avoid the 621 and to be occluded by the frame 62. A pusher 23 is inserted through the pusher insertion hole 224. The pusher 23 is allowed to appear through the placing table 22, the cooling plate 63, and the adhesive sheet 64.

The pusher 23 is installed in a stiffness, number, and positional relationship so as to be able to support the parts embedded in the seat 67 from the cooling plate 63 in parallel while protruding from the cooling plate 63. have. For example, if the outer shape of the frame 62 is rectangular, it is arranged as a bar body in correspondence with each corner of the frame 62. The pusher insertion hole 224 is also provided corresponding to the number and positional relationship of the pusher 23.

Subsequently, a plurality of air holes 213 through the inner space 211 are formed through the flat surface 212 of the ceiling portion 21. The through hole forming range of the air hole 213 is a range of the same size as the inside of the frame 62 of the part embedded sheet 67, or at least the same size as the part arranging area 615. The through hole forming position of the air hole 213 is a position where the component arrangement area 615 is covered when the component embedded sheet 67 is placed on the placing table 22 (see FIG. 10(a) ).

In the inner space 211 of the ceiling portion 21, an air pressure supply hole 214 is formed through the flat surface 212 and other portions. The pneumatic supply hole 214 is connected to the pneumatic circuit 75 including a compressor, a positive pressure supply pipe, a negative pressure supply pipe, and the like outside the drawing. Therefore, positive pressure and negative pressure are selectively generated in the air hole 213 through the air pressure supply hole 214 and the inner space 211. That is, the inner space 211, the flat surface 212, the air hole 213, the air pressure supply hole 214, and the pneumatic circuit 75 of the ceiling portion 21 function as a protective sheet holding portion and a function as a static pressure portion Have When the pneumatic circuit 75 generates negative pressure in the air hole 213, the function of the protective sheet holding portion is exerted, and when the pneumatic circuit 75 generates positive pressure in the air hole 213, the function of the positive pressure portion is exerted do.

Moreover, on the flat surface 212 of the ceiling portion 21, along the frame 62 of the component embedded sheet 67 loaded on the placing table 22, the O-ring surrounds the through-forming range of the air hole 213 215 is installed. That is, the outer peripheral portion of the flat surface 212 of the ceiling portion 21 presses the frame 62 through the O-ring 215, and presses the outer peripheral portion of the protective sheet 61 against the cooling plate 63. That is, the ceiling portion 21 has a function as a pressing portion for pressing the outer peripheral portion of the protective sheet 61 against the cooling plate 63.

10 shows the flow of operation of the plate mounting portion 2. 10 is a transition diagram schematically showing a state in each process of the plate mounting portion 2. First, as shown in Fig. 10 (a), first, the ceiling portion 21 is placed away from the placing table 22. A cooling plate 63 is previously arranged on the placing table 22. Further, the pusher 23 is drilled through the cooling plate 63 and the adhesive sheet 64, and protrudes toward the ceiling 21. In this state, the frame 62 of the part embedding complete sheet 67 is fitted to the pusher 23 so that the part embedding completed sheet 67 is supported by the pusher 23. Then, the ceiling portion 21 is lowered toward the pusher 23, and the frame 62 of the component embedded sheet 67 is sandwiched between the ceiling portion 21 and the pusher 23.

At this time, the height (H1) from the surface of the component arrangement area 615 to the top surface of the frame 62 is the height from the surface of the component arrangement area 615 to the upper surface 603 of the electronic component 60 ( H2). Therefore, when the frame 62 is fitted, the upper surface 603 of the electronic component 60 is less than the flat surface 212 of the ceiling portion 21. Accordingly, at least the component arrangement area 615 is confined in the closed space 24a, which is divided into the ceiling portion 21, the protective sheet 61, and the frame 62 and sealed by the O-ring 215.

When the component arrangement area 615 is confined in the closed space 24a, negative pressure is generated on the flat surface 212 of the ceiling portion 21. The electronic component 60 is sucked on the flat surface 212. The part reclamation complete sheet 67 is distorted in the inner frame region 614, and the entire part arrangement region 615 is sucked onto the flat surface 212 while being flattened. Therefore, the component arrangement region 615 is not bent to bend, and the buried electrode 602 is not separated from the protective sheet 61. Further, on the flat surface 212 of the ceiling portion 21, the electronic component 60 may be gradually reduced in pressure to generate negative pressure so that the electronic component 60 does not rush toward the flat surface 212. The magnitude of the negative pressure at this time is preset in the control section 74. Considering the relationship with the reduced pressure of the closed space 24b described later, it is preferable that the pressure is close to vacuum (0 atm).

Subsequently, as shown in Fig. 10(b), the pusher 23 and the ceiling portion 21 are lowered toward the placing table 22 at a constant speed. Then, the area of the frame 62 of the part embedded sheet 67 is brought into contact with the adhesive sheet 64 on the cooling plate 63. In addition, the area of the frame 62 is adhered to the pressure-sensitive adhesive sheet 64 by moving the ceiling portion 21 toward the placement table 22 and pressing it. At the time when the area of the frame 62 of the above-described component reclamation complete sheet 67 is brought into contact with the adhesive sheet 64 on the cooling plate 63, the negative pressure of the ceiling portion 21 is maintained, and the component reclamation complete sheet ( Since 67) is being pulled on the flat surface 212 of the ceiling portion 21, the component arrangement area 615 is non-contact (spaced) with respect to the adhesive sheet 64.

Here, in the case where the negative pressure is not generated in the ceiling portion 21, in the presence of air, the component reclamation complete sheet 67 comes into contact with the adhesive sheet 64. Then, there is a fear that air bubbles may enter between the component filling completion sheet 67 and the adhesive sheet 64. When air bubbles enter, the heat transfer area to the cooling plate 63 decreases, and the heat dissipation effect of the electronic component 60 during film formation decreases. However, in the plate mounting portion 2, in the presence of air, the part filling sheet 67 is raised in the direction away from the pressure-sensitive adhesive sheet 64, so that bubbles are prevented from entering.

When the frame 62 is in close contact with the pressure-sensitive adhesive sheet 64 through the protective sheet 61, that is, pressed, it is divided into a protective sheet 61, a cooling plate 63, and a frame 62, and The non-adhesive surface 612 and the adhesive sheet 64 side of the cooling plate 63 are locked in the closed space 24b. When the closed space 24b is formed, as shown in Fig. 10(c), while maintaining the negative pressure of the ceiling portion 21, negative pressure is also generated in the placing table 22. In other words, under the condition that the outer circumferential portion (outer frame region 613) of the protective sheet 61 is pressed by the ceiling portion 21, the closed space 24b is decompressed. Through the air hole 632 of the cooling plate 63 and the air hole 632 of the adhesive sheet 64, the closed space 24b between the cooling plate 63 on which the adhesive sheet 64 is installed and the protective sheet 61 ) Is depressurized. That is, the air hole 632 of the cooling plate 63 and the air hole 632 of the pressure-sensitive adhesive sheet 64 on the plate mounting portion 2 function as air holes on the plate side. At this time, the negative pressure generated on the placing table 22 is a negative pressure slightly closer to atmospheric pressure than the negative pressure generated on the ceiling portion 21, and may be of a size capable of maintaining the adsorption of the electronic component 60 to the ceiling portion 21. . This negative pressure is preset in the control section 74.

When the decompression of the closed space 24b between the cooling plate 63 on which the adhesive sheet 64 is installed and the protective sheet 61 to a predetermined negative pressure is completed, as shown in FIG. 10(d), the placing table ( While maintaining the negative pressure of 22), the negative pressure of the ceiling portion 21 is gradually changed to a positive pressure. In other words, the holding|maintenance of the protection sheet 61 by the ceiling part 21 is canceled|released in the state in which the pressure reduction of the closed space 24b was maintained. The part reclamation complete sheet 67 is gently sucked down toward the adhesive sheet 64, and further pushed down, so that the component reclamation complete sheet 67 is pressed against the adhesive sheet 64 adhered to the cooling plate 63 do. Then, the component filling completion sheet 67 is attached to the cooling plate 63 through the adhesive sheet 64.

In addition, when the negative pressure on the placing table 22 side and the negative pressure on the ceiling portion 21 side are the same or approximately the same, the protective sheet 61 elastically contracts, and the protective sheet 61 contacts the adhesive sheet 64. . Therefore, the negative pressure on the placing table 22 side may be the same or approximately the same as the negative pressure on the ceiling portion 21 side, and after contact, the negative pressure on the ceiling portion 21 side may be gradually changed to a positive pressure.

Finally, as shown in Fig. 10(e), by moving the ceiling portion 21 away from the placing table 22, the part filling complete sheet 67, the adhesive sheet 64 and the cooling plate 63 are moved. Release the overlapping after overlapping. Accordingly, the production of the component mounting plate 68 comprising the electronic component 60, the protective sheet 61, the adhesive sheet 64, and the cooling plate 63 is completed. The positive pressure generated in the ceiling portion 21 and the negative pressure generated in the placing table 22 may be released while the ceiling portion 21 is separated from the placing table 22.

That is, the ceiling part 21, the pusher 23, and the placing table 22 are the driving parts for approaching the component filling completion sheet 67 and the cooling plate 63. The ceiling part 21 and the placing table 22 serve as a fixing part for sandwiching the component reclamation complete sheet 67 and the cooling plate 63, and also as a pressing portion for compressing and pressing the frame 62 and the cooling plate 63. do. In addition, the air pressure supply hole 223 of the placing table 22 serves as a depressurizing portion that depressurizes the closed space 24b between the component embedded sheet 67 and the cooling plate 63. In addition, the air hole 213 of the ceiling portion 21 serves as a pressure-reducing portion that depressurizes the closed space 24a between the flat surface 212 of the ceiling portion 21 and the component embedded sheet 67.

The flat surface 212 of the ceiling portion 21 maintains the component reclamation complete sheet 67 by generating a negative pressure prior to decompression between the component reclamation completed sheet 67 and the cooling plate 63, and the component reclamation completed Isolation means for preventing air bubbles from entering between the sheet 67 and the cooling plate 63, the suction by the negative pressure of the placing table 22, and the positive pressure as a positive pressure part to cool the part embedded sheet 67 It becomes a press means for adhering to the plate 63. Then, the placing table 22 serves as a sucking means for bringing the component filling completion sheet 67 into close contact with the cooling plate 63 by negative pressure in addition to compression by the static pressure of the ceiling portion 21.

Thus, the plate mounting part 2 adheres the protective sheet 61 in which the electrode 602 of the electronic component 60 is embedded to the cooling plate 63. The plate mounting portion 2 has a ceiling portion 21 as a pressing portion for pressing the outer circumferential portion of the protective sheet 61, such as the frame 62, against the cooling plate 63, and further includes a component arrangement area 615 and a cooling plate. It has a depressurizing portion for depressurizing the space between (63). In addition, the plate mounting portion 2 presses the protective sheet 61 and the cooling plate 63 against each other through the pressure-sensitive adhesive sheet 64 under reduced pressure by the pressure-reducing portion. Accordingly, the air bubbles can be brought into close contact between the protective sheet 61 and the cooling plate 63 without entering air bubbles, and the heat transfer area to the cooling plate 63 can be sufficiently secured.

Further, the plate mounting portion 2 sucks the protective sheet 61 by negative pressure on the opposite side to the cooling plate 63 with the flat surface 212 of the ceiling portion 21, that is, the protective sheet 61 interposed therebetween. An air hole 213 was provided to separate the cooling plate 63 and the protective sheet 61. The flat surface 212 having the air hole 213 is a protective sheet holding portion, and when the pressing portion contacts the outer peripheral portion of the protective sheet 61 with the cooling plate 63, the electronic components in the protective sheet 61 ( The protective sheet 61 is held so as to space the cooling plate 63 and the area where 60) is arranged. Then, the negative pressure is maintained until the pressure is reduced between the component filling completion sheet 67 and the cooling plate 63 by the pressure reducing unit, and the holding is released under the reduced pressure. Accordingly, it is possible to prevent a situation in which the protective sheet 61 and the cooling plate 63 are adhered in the incomplete state of reduced pressure, further reducing the possibility of air bubbles entering between the protective sheet 61 and the cooling plate 63, The heat transfer area to the cooling plate 63 can be sufficiently ensured.

In addition, the air hole 213 that opens on the flat surface 212 of the ceiling portion 21, the pusher 23 is lowered so that the ceiling portion 21 is placed through the frame 62 of the part reclamation complete sheet 67. Before contacting (22), i.e., before the part filling sheet 67 and the cooling plate 63 approach, even between the cooling plate 63 provided with the adhesive sheet 64 and the protective sheet 61 The negative pressure was created before the space was partitioned. Accordingly, before the pusher 23 on which the protective sheet 61 (part reclamation complete sheet 67) is set starts to descend, the protective sheet 61 is prevented from being incorrectly adhered to the cooling plate 63. can do.

In addition, the plate mounting portion 2 has a flat surface 212 of the ceiling portion 21. The flat surface 212 is positioned opposite the cooling plate 63 with the protective sheet 61 interposed therebetween, and faces the electronic component 60. The air hole 213 separating the cooling plate 63 and the protective sheet 61 until the end of decompression between the component filling completion sheet 67 and the cooling plate 63 is opened so as to be open on the flat surface 212 did. Accordingly, the protective sheet 61 can be flattened without bending and bending the protective sheet 61 by the pressure difference between the front and rear sides of the protective sheet 61 during depressurization, so that the electronic component 60 is protected while the plate is mounted. It is possible to prevent an occurrence of peeling from the sheet 61.

The air hole 213 on the side of the ceiling portion 21 is a positive pressure portion, and after the pressure between the component embedded sheet 67 and the cooling plate 63 reaches a predetermined set value, it changes from negative pressure generation to positive pressure generation. The protective sheet 61 was pressed against the cooling plate 63. In other words, the air hole 213 is a pressure-reducing portion for separating and retaining the protective sheet 61 from the cooling plate 63, a pressure-reducing portion for depressurizing the closed space 24a, and a static pressure portion for generating a static pressure. And the pressing means of the cooling plate 63. However, the functions of the isolation, decompression and contact means may be accomplished by air holes formed in separate members.

For example, as in the present embodiment, an air hole 632 is formed in the cooling plate 63. The plate mounting part 2 has a mounting table 22 on which the cooling plate 63 is arranged and which generates negative pressure. Then, the protective sheet 61 may be drawn to the cooling plate 63 through the placing table 22 on which the cooling plate 63 is disposed and the air hole 632 of the cooling plate 63.

In addition, a known mechanism may be employed as the operation mechanism of the ceiling portion 21 and the operation mechanism of the pusher, and the present invention is not limited to the mechanism of the mechanism.

For example, the ceiling portion 21 is connected with a ball screw extending its axis in the direction from the ceiling portion 21 toward the placing table 22 and a rail guide extending in the direction from the ceiling portion 21 toward the placing table 22 is connected. have. In this case, the ceiling part 21 moves toward the mounting table 22 along the rail in accordance with the rotational direction of the screw shaft. As for the ceiling part 21, the ball screw and the rail guide are extended so that the ceiling part 21 may be close to the mounting table 22 to the distance of the thickness H1 of the frame 62 of the component placement complete sheet 66.

In addition, the rear end of the pusher 13 is a cam ball. The cam ball follows the circumferential surface of the ovoid cam. The cam is pivotally supported by the rotating motor, and is capable of rotating in the circumferential direction. When the rotation motor is driven and the cam rotates, the cam ball rises up the bulge of the cam, and the pusher 13 is pushed up.

In addition, as the partitioning method of the closed space 24a and the closed space 24b, the part embedding completed sheet 67 and the cooling plate 63 are not used as elements of the partitioning means, and the ceiling 21 and the placing table 22 are used. ). For example, one or both of the ceiling portion 21 and the placing table 22 are cup-shaped, and are divided into the ceiling portion 21 and the placing table 22 so as to include a component embedded sheet 67 and a cooling plate 63. It may be accommodated in one space, and the front and rear surfaces of the component reclamation complete sheet 67 may be partitioned by the ceiling portion 21 and the placing table 22. However, in this case, the ceiling portion 21 is preferably installed with a side wall extending toward the placing table 22 while surrounding the flat surface 212 in which the air hole 213 is opened. This side wall is in close contact with the flat surface of the placing table 22 to partition one closed space. The O-ring 215 is provided on the end face of the side wall.

(Film forming processing unit)

Next, the film forming processing unit 3 in charge of the film forming process will be described. 11 is a schematic diagram showing the configuration of the film forming processing unit 3. The film forming processing unit 3 forms an electromagnetic shielding film 605 by sputtering on individual electronic components 60 on the component mounting plate 68. As shown in FIG. 11, this film forming processing part 3 has a chamber 31 and a load lock chamber 32. As shown in FIG. The chamber 31 is a circumferential vacuum chamber whose diameter is expanded in a radial direction rather than an axial direction. The interior of the chamber 31 is divided into a plurality of fan-shaped sections by a short-circuiting portion 33 formed along the radial direction. The processing position 311 and the film formation position 312 are assigned to some fan-shaped sections.

The short circuit part 33 extends from the ceiling surface of the chamber 31 toward the bottom surface, but is less than the bottom surface. A rotating table 34 is provided in the space on the bottom surface without the short circuit 33. The rotary table 34 has a disk shape coaxial with the chamber 31 and rotates in a circumferential direction. The component mounting plate 68 inserted into the chamber 31 from the load lock chamber 32 is disposed on the rotary table 34 and moves around the trajectory of the circumference, while processing positions 311 and film formation positions 312 Iterate over.

In addition, in order to maintain the position of the component mounting plate 68 relative to the rotary table 34, the rotary table 34 includes, for example, a component mounting plate such as a groove, hole, protrusion, jig, holder, mechanical chuck, or adhesive chuck. A holding means for holding 68) is provided.

The surface treatment part 35 is provided in the processing position 311. A process gas such as argon gas is introduced into the surface treatment unit 35, and the process gas is plasmad by application of a high-frequency voltage to generate electrons, ions, and radicals. For example, the surface treatment unit 35 is a cylindrical electrode opened on the side of the rotary table 34, and a high frequency voltage is applied by an RF power supply.

A target 361 constituting the sputter source 36 is provided at the film formation position 312, and a sputter gas, which is an inert gas such as argon gas, is introduced. The sputter source 36 applies electric power to the target 361, plasmas the sputter gas, and collides with generated ions and the like to strike the particles. The target 361 is made of an electromagnetic shielding film 605 material. That is, from the target 361, the particles of the electromagnetic shielding film 605 are beaten out, and the particles of the beaten electromagnetic shielding film 605 are deposited on the electronic component 60 on the rotating table 34.

This film formation position 312 is provided in two places, for example. The target material of each film formation position 312 may be the same material, or a different material may be used to form a laminated electromagnetic shielding film 605. As a power source that applies electric power to the sputter source 36 of each film formation position 312, a well-known thing such as a DC power source, a DC pulse power source, and an RF power source can be applied. In addition, a power source for applying electric power to the sputter source 36 may be provided for each sputter source 36, or a common power source may be switched to a switcher and used.

In the film forming processing unit 3, the electronic component 60 is cleaned and roughened by etching or ashing at the processing position 311 to improve the adhesion of the electromagnetic shielding film 605 to the electronic component 60. The electromagnetic shielding film 605 is formed on the electronic component 60 by increasing and depositing the particles of the target 361 on the electronic component 60 at the film formation position 312. Since the electrode 602 is buried in the protective sheet 61, and the electrode exposed surface 601 is in close contact with the protective sheet 61, it is prevented that particles of the electromagnetic shielding film 605 adhere to the electrode 602. In addition, particles of the electromagnetic shielding film 605 are prevented from entering between the electrode exposed surface 601 and the protective sheet 61. Moreover, the heat of the electronic component 60 is transferred to the cooling plate 63, so that excessive heat storage of the electronic component 60 is suppressed.

In addition, although this film-forming processing part 3 forms a film on the electronic component 60 using a sputtering method, the film-forming method is not limited to this. For example, the film forming processing unit 3 may form the electromagnetic shielding film 605 on the electronic component 60 by vapor deposition, spray coating and application.

(Plate release part)

Next, the plate release part 4 in charge of the plate release process will be described. 12 is a schematic view showing the configuration of the plate release section 4. After the electromagnetic shielding film 605 is formed in the plate releasing portion 4, the component mounting plate 68 is input. The plate releasing section 4 is the first step for obtaining the individual electronic components 60, and pulls off the component filling completion sheet 67 from the cooling plate 63.

As shown in FIG. 12, this plate release part 4 is provided with the ceiling part 41 and the placing table 42. As shown in FIG. The ceiling part 41 and the placing table 42 are arranged opposite. The placing table 42 is floating. On the other hand, the ceiling portion 41 can be elevated with respect to the placing table 42. The ceiling portion 41 approaches the placing table 42 at least to a distance of the thickness H1 of the frame 62 of the component mounting plate 68.

The ceiling portion 41 is a block having an inner space 411, and has a flat surface 412 on the surface facing the placing table 42. The placing table 42 has a bottomed cup shape, and the opening 421 is directed to the ceiling portion 41. The flat surface 412 of the ceiling portion 41 has the same size as the component mounting plate 68 or is wider than the component mounting plate 68. On the other hand, the opening 421 of the placing table 42 has an inclusive area of the component arrangement area 615 or more and the inner frame area 614 or less. The edge 422 around the opening 421 of the placing table 42 has a width greater than or equal to the width of the frame 62.

In this placing table 42, the edge 422 supports the component mounting plate 68, and the opening 421 is closed with the component mounting plate 68. The cooling plate 63 side abuts the edge 422. An air pressure supply hole 423 is formed through the bottom of the placing table 42. The pneumatic supply hole 423 is connected to the pneumatic circuit 75 including a compressor outside the drawing, a constant pressure supply pipe, and the like. Therefore, a static pressure is generated in the air hole 632 of the component mounting plate 68 disposed by closing the opening 421.

In addition, a pusher insertion hole 424 penetrating the placing table 42 is formed at the edge 422 of the placing table 42. The through-forming position of the pusher insertion hole 424 coincides with the pusher insertion hole 631 of the cooling plate 63, and when the component mounting plate 68 is loaded, the guide insertion hole of the frame 62 ( It is a position to avoid 621) and to be occluded by the frame 62. A pusher 43 is inserted through the pusher insertion hole 424. The pusher 43 moves in the axial direction so as to protrude the tip of the position roll higher than the frame 62 of the component mounting plate 68 loaded on the placing table 42.

The pusher 43 peels off the component filling complete sheet 67 from the cooling plate 63 against the adhesive force of the outer frame region 613 and the adhesive sheet 64 to cool the component filling complete sheet 67 It is isolated from the plate 63, and is installed in a rigidity, number, and positional relationship such that the part-embedded finished sheet 67 can be lifted and supported in parallel. For example, if the outer shape of the frame 62 is rectangular, it is arranged as a bar body in correspondence with each corner of the frame 62. The pusher insertion hole 424 is also provided in correspondence with the number and positional relationship of the pushers 43.

In addition, a pair of pinching blocks 44 are arranged on both sides of the placing table 42. The clamping block 44 only fits the cooling plate 63 among the component mounting plates 68 loaded on the placing table 42. That is, the pair of pinching blocks 44 are arranged at the same height as the cooling plates 63 disposed on the placing table 42 and have the same thickness as the cooling plates 63. In addition, the clamping block 44 can be separated from each other by contacting the cooling plate 63 as a center. However, the pinching block 44 is floating in the direction in which the ceiling portion 41 and the placing table 42 line up.

Subsequently, a plurality of air holes 413 through the inner space 411 are formed through the flat surface 412 of the ceiling portion 41. The through hole forming range of the air hole 413 is a range of the same size as the inside of the frame 62 of the protective sheet 61, or is at least the same size as the component arrangement area 615. The through hole forming position of the air hole 413 is a position where the component arrangement area 615 is covered when the component mounting plate 68 is placed on the placing table 42.

In the inner space 411 of the ceiling portion 41, an air pressure supply hole 414 is formed through the flat surface 412 and other portions. The pneumatic supply hole 414 is connected to the pneumatic circuit 75 including a compressor outside the drawing, a negative pressure supply pipe, and the like. Therefore, a negative pressure is generated in the air hole 413 through the air pressure supply hole 414 and the inner space 411.

Moreover, on the flat surface 412 of the ceiling portion 41, along the frame 62 of the component mounting plate 68 carried on the placing table 42, the O-ring surrounding the through-forming range of the air hole 413 ( 415) is installed. In addition, in the flat surface 412 of the ceiling portion 41, the periphery facing the frame 62 firmly presses a part of the protective sheet 61 away from the component arrangement area 615 in which the electronic components 60 are arranged. It functions as a fixing part. This fixing part presses the protective sheet 61 firmly across the periphery of the periphery facing the frame 62, that is, the frame 62 is pressed firmly throughout, but it is not necessary to press firmly across the whole, and in part A part that does not press firmly may be present.

13 shows the flow of the operation of the plate releasing portion 4. 13 is a transition diagram schematically showing a state in each process of the plate release section 4. First, as shown in Fig. 13(a), the ceiling portion 41 is dropped from the placing table 42, and the pusher 43 is buried in the pusher insertion hole 424 of the placing table 42. Then, the component mounting plate 68 is placed on the placing table 42. When the component mounting plate 68 is arranged, the cooling plate 63 is fixed with the clamping block 44.

Next, as shown in Fig. 13(b), the ceiling portion 41 is lowered toward the placing table 42, and the flat surface 412 of the ceiling portion 41 is attached to the frame 62 of the component mounting plate 68. That is, it makes the fixing part abut. At this time, the height (H1) from the surface of the component arrangement area 615 to the top surface of the frame 62 is the height from the surface of the component arrangement area 615 to the upper surface 603 of the electronic component 60 ( H2). Therefore, when the frame 62 is fitted, the upper surface 603 of the electronic component 60 is less than the flat surface 412 of the ceiling portion 41. Therefore, at least the component arrangement area 615 is confined in the closed space 45 divided by the ceiling portion 41, the protective sheet 61, and the frame 62 and sealed with the O-ring 415.

When the component arrangement area 615 is confined in the closed space 45, as shown in FIG. 13(c), a negative pressure is generated in the ceiling portion 41, and a positive pressure is generated in the placing table 42. Accordingly, in the component arrangement area 615 inside the frame 62, the force sucked up to the flat surface 412 of the ceiling portion 41 and the flat surface 412 of the ceiling portion 41 away from the placing table 42 The force that is pushed up in the direction of the direction acts. Due to the sucking force and the pushing force, a force sufficient to separate the component arrangement region 615 from the cooling plate 63 acts on the component arrangement region 615, so that the component arrangement region 615 is a cooling plate ( 63). At this time, the magnitude of the negative pressure of the ceiling portion 41 and the positive pressure of the placing table 42 is preset in the control portion 74.

At the time when the component array region 615 is peeled off, since the protective sheet 61 is flat without distortion, the momentum toward the flat surface 412 of the ceiling portion 41 is small, and the electronic component ( The situation where 60) is peeled off from the protective sheet 61, or the electronic component 60 sticks out of the protective sheet 61 is prevented. If the component arrangement area 615 is peeled off forcefully, the flat surface 412 of the ceiling portion 41 is on standby and the electronic component 60 is restrained by the flat surface 412, so that the electronic component 60 The fear of being peeled off from the protective sheet 61 or falling off from the protective sheet 61 is reduced.

In order to further increase the effect of reducing the fear of peeling or dropping of the electronic component 60 from the protective sheet 61, the electronic component 60 in the state before the protective sheet 61 is peeled from the cooling plate 63 It is preferable that the gap between the upper surface 603 and the flat surface 412 is as small as possible. Therefore, the distance between the upper surface 603 and the flat surface 412 of the electronic component 60 may be set to the minimum required space for peeling the protective sheet 61 from the cooling plate 63.

In addition, for the plurality of air holes 632 of the cooling plate 63, the positive pressure is applied, for example, from one end of the cooling plate 63 toward the other end so that the air holes 632 where the static pressure acts gradually increase. The opening of the placing table 42 is increased so that the working air hole 632 increases, or the range of the air hole 632 where the static pressure acts stepwise from the air hole 632 located at the center side to the outer circumferential side is increased. The space in 421) may be divided into a plurality of sections, and a plurality of systems generating static pressure may be provided. By doing this, it is possible to prevent the component arrangement area 615 from being peeled off from the cooling plate 63 at once, and to suppress the electronic component 60 from rushing to the flat surface 412 of the ceiling portion 41 forcefully. Can.

In addition, when the component arrangement area 615 is peeled off, the electronic component 60 abuts on the flat surface 412 of the ceiling portion 41, so that the protective sheet 61 is curved only by the inner frame region 614, and at least the component arrangement The region 615 maintains a flat shape. In other words, if the flat surface 412 of the ceiling portion 41 does not exist, the protective sheet 61 is curved to bend with air. Then, there is a fear that the electronic component 60 may peel off from the protective sheet 61, but the component arrangement area 615 maintains a flat shape, so that the peeling of the electronic component 60 is suppressed.

When the component arrangement area 615 is peeled from the cooling plate 63, as shown in FIG. 13(d), the pusher 43 is pushed through the pusher insertion hole 424 and the cooling plate 63 of the placing table 42. The frame 62 is brought into contact with the frame 62 through the pusher insertion hole 631 and the pusher insertion hole 631 of the adhesive sheet 64 through the protective sheet 61. Then, the pusher 43 is further advanced, and at the same time, the ceiling portion 41 is dropped from the placing table 42 at the same speed as the pusher 43. Since the cooling plate 63 is gripped by the clamping block 44 to be in a position-free position, the outer frame region 613 to which the frame 62 is adhered is also peeled off from the cooling plate 63, thereby protecting the sheet 61 The whole is peeled from the cooling plate (63).

At this time, the positive pressure of the placing table 42 and the negative pressure of the ceiling portion 41 are maintained. For this reason, the situation in which the component arrangement area 615 is dragged down toward the cooling plate 63 by self-weight and reattached is suppressed. In addition, by maintaining the static pressure of the placing table 42, peeling from the cooling plate 63 of the outer frame region 613 to which the frame 62 is adhered is also assisted.

Finally, as shown in Fig. 13(e), the pusher 43 is stopped to move the ceiling portion 41 further away from the placing table 42, so that the pinching of the part reclamation complete sheet 67 is prevented. It is released, and peeling of the protective sheet 61 from the cooling plate 63 is completed. Further, the positive pressure of the placing table 42 and the negative pressure of the ceiling portion 41 may be released therebetween.

That is, the ceiling portion 41 is a fixing portion that firmly presses the frame 62 positioned away from the component arrangement area 615. In addition, the air pressure supply hole 423 of the placing table 42 becomes a positive pressure generating hole, and presses the component arrangement area 615 through the air hole 632 of the cooling plate 63, thereby making the component arrangement area 615 ) As a pressing means for peeling off the cooling plate 63 before the frame 62. The air hole 413 of the ceiling portion 41 serves as a negative pressure generating hole, and sucks the component arrangement area 615 to serve as a sucking means to assist peeling from the cooling plate 63.

Further, the flat surface 412 of the ceiling portion 41 serves as a restraining means for suppressing peeling and dropping of the electronic component 60 from the protective sheet 61 when the component arrangement area 615 is peeled. The protective sheet 61 is flattened, and is used as a flattening means to suppress the electronic component 60 from peeling off the protective sheet 61. The pusher 43 serves as a lifting means for removing the frame 62 from the cooling plate 63 after the component arrangement area 615 is peeled off.

As described above, the plate releasing portion 4 is removed from the cooling plate 63 after the film-forming process. The plate releasing portion 4 was provided with a placing table 42 having a positive pressure generating hole, which uses the air pressure supply hole 423 as an example, and a fixing portion, which takes the ceiling 41 as an example. The static pressure generating hole faces the cooling plate 63 and generates a static pressure. The fixing part, while the static pressure of the placing table 42 presses the component arranging area 615, the part deviating from the component arranging area 615 in the protective sheet 61, for example, the frame 62 is pressed firmly, and the part After the arrangement area 615 was separated from the cooling plate 63, it was made to release the pressing firmly.

Accordingly, when the component array region 615 is peeled off, since the protective sheet 61 maintains flatness, the situation in which the component array region 615 bounces due to the reaction that the protection sheet 61 returns to flatness Can be avoided. Therefore, it is suppressed that the electronic component 60 peels off from the protective sheet 61 and falls off.

More specifically, when a positive pressure is supplied from a plurality of air holes 632 formed in a range corresponding to the inner frame region 614 and the component arrangement region 615 in the cooling plate 63, the positive pressure protects the sheet. 61 starts peeling from the cooling plate 63. The peeling portion of the protective sheet 61 thus formed is gradually expanded and connected to the starting point from the portion where peeling started, by the constant pressure supplied continuously, and widens to the outside. Finally, the peeling portion reaches the boundary between the outer frame region 613 and the inner frame region 614, which are the inner periphery of the frame 62, which is firmly pressed by the fixing portion, and the component arrangement region 615 of the protective sheet 61 ) And the inner frame region 614 are completely separated from the cooling plate 63. At this time, the boundary between the outer frame region 613 and the inner frame region 614, where the peeling portion of the protective sheet 61 finally reaches, is secured through the frame 62 by the flat surface 412 as a fixing portion. Because of the pressing, even if the component arrangement region 615 and the inner frame region 614 are peeled off, the protective sheet 61 is prevented from protruding prominently.

Moreover, the outer frame region 613 is firmly pressed through the frame 62 by the flat surface 412 as a fixing portion, thereby preventing the static pressure from leaking out between the protective sheet 61 and the cooling plate 63 Therefore, the entire component arrangement area 615 can be reliably and stably peeled off. Thereby, it can suppress that the electronic component 60 peels off from the protective sheet 61 and falls off.

In addition, the plate releasing portion 4 is a flat surface of the ceiling portion 41 spaced apart from the protective sheet 61, as opposed to the cooling plate 63, with the ceiling portion 41 side, that is, the protective sheet 61 interposed therebetween. 412). The flat surface 412 pressed the expansion of the component array region 615 firmly while the component array region 615 was being pressed. Accordingly, the component arrangement area 615 is flattened, and the electronic component 60 can be more reliably prevented from being peeled off. In addition, since the flat surface 412 restrains the electronic component 60 even if the component arrangement area 615 jumps, the electronic component 60 is further removed from the peeling off of the protective sheet 61 and falling off. You can.

In addition, the plate releasing portion 4 was provided with a negative pressure generating hole for generating negative pressure so as to face the protective sheet 61. As an example, an air hole 413 for generating a negative pressure is formed on the flat surface 412 of the ceiling portion 41. The air hole 413 pulls the protective sheet 61 together with the pressure on the component arrangement area 615 by the air hole 632. For this reason, the protective sheet 61 can be peeled off from the cooling plate 63 by assisting pressurization to the component arrangement area 615, and peeling misses are less likely to occur.

In addition, the plate release part 4 was provided with a pusher 43. The pusher 43, after the component arrangement area 615 is separated from the cooling plate 63, enters the inside of the cooling plate 63, and a tightly pressed portion such as the frame 62 is removed from the cooling plate 63. Push it up in the falling direction. Thereby, after peeling off the component arrangement|positioning area|region 615, the whole protective sheet 61 can be peeled off. In addition, the fixing part taking the ceiling part 41 as an example may be separated from the protection sheet 61 with the advancement of the pusher 43 when releasing the pressing firmly.

In addition, the operation mechanism of the ceiling portion 41, the operation mechanism of the clamping block 44 and the operation mechanism of the pusher 43 may be any known mechanism, and the present invention is not limited to the mechanism of the mechanism.

For example, the ceiling portion 41 is connected with a ball screw extending its axis in the direction from the ceiling portion 41 toward the placing table 42 and a rail guide extending in the direction from the ceiling portion 41 toward the placing table 42 is connected. have. In this case, the ceiling part 41 moves along the rail toward the mounting table 42 in accordance with the rotation direction of the screw shaft. The ceiling portion 41 extends the ball screw and rail guide so that the ceiling portion 41 approaches the placement table 42 up to the distance of the thickness H1 of the frame 62 of the component placement completed sheet 66.

Further, on the outer side of the clamping block 44, the circumferential surface of the egg-shaped cam is made to abut against the pair of clamping blocks 44 individually. The cam is pivotally supported by the rotating motor, and is capable of rotating in the circumferential direction. When the rotation motor is driven, the cam rotates, and when the bulging portion of the cam comes into contact with the clamping block 44, the clamping block 44 is pushed in the direction of the cooling plate 63 to grip the cooling plate 63. .

Moreover, the rear end of the pusher 43 is a cam ball. The cam ball follows the circumferential surface of the ovoid cam. The cam is pivotally supported by the rotating motor, and is capable of rotating in the circumferential direction. When the rotation motor is driven and the cam rotates, the cam ball rises up the bulge of the cam, and the pusher 43 is pushed up.

Moreover, this plate release part 4 peels the protective sheet 61 from the cooling plate 63 by generating a static pressure on the placing table 42. The flat surface 412 of the ceiling portion 41 is an additional function to flatten the peeled protective sheet 61, and the air hole 413 opened to the flat surface 412 of the ceiling portion 41 is also placed. It is an additional function to assist pressurization by (42). Therefore, as shown in FIG. 14, the ceiling part 41 has an angled cylindrical shape which makes the frame 62 contact the opening edge, and the flat surface 412 may be omitted. In addition, as shown in FIG. 15, the air hole 413 may be omitted from the flat surface 412 of the ceiling portion 41.

(Peeling processing unit)

Finally, the peeling treatment part 5 in charge of the part peeling process will be described. 16 is a schematic view showing the configuration of the peeling treatment section 5. In the peeling processing section 5, a component embedding completion sheet 67 in which the cooling plate 63 has been removed via the plate release section 4 is put in, and as a final step, individual electronic components 60 are protected from the protection sheet 61. ). Here, when the peeling processing part 5 is separated from the film forming apparatus 7, it may be called a peeling processing apparatus.

As shown in Fig. 16, the peeling treatment section 5 includes a placing table 51 on which a component embedded sheet 67 is disposed, and a chuck 52 that continuously moves by gripping the protective sheet 61. , A guide portion 53 that makes the beginning for the chuck 52 to grip the protective sheet 61 by hanging the end of the protective sheet 61, a sheet stopper 54 for creating a starting point for peeling of the protective sheet, and electronic components It is equipped with the component stopper 55 which prevents 60 from rising.

The placing table 51 has a flat surface 511 on which a component embedded sheet 67 is disposed. The component embedding completed sheet 67 faces the electronic component 60 with this flat surface 511, makes the upper surface 603 of the electronic component 60 contact the arrangement surface, and protects the sheet 61 from the top. Facing up. The flat surface 511 is made of a non-slip member having an adhesive force, and the stopability of the electronic component 60 is improved. In addition, the outer circumferential region of the flat surface 511 is the height of the component arrangement region 615 from the height H1 from the surface of the component arrangement region 615 to the end surface of the frame 62 so that the frame 62 enters. The electronic component 60 is further cut down to a depth corresponding to a height minus the height H2 from the surface to the upper surface 603 of the electronic component 60, and the protective sheet 61 is kept flat. It is disposed on the flat surface 511.

The placing table 51 is a block having an inner space 512. A plurality of air holes 513 are formed through the flat surface 511 of the placing table 51 in a region facing the component arrangement area 615. The air hole 513 communicates with the inner space 512 of the placing table 51. In the inner space 512 of the placing table 51, a pneumatic supply hole 514 is formed through the flat surface 511 and other portions. The pneumatic supply hole 514 is connected to the pneumatic circuit 75 including a compressor outside the drawing, a negative pressure supply pipe, and the like. Therefore, a negative pressure is generated in the air hole 513 through the air pressure supply hole 514 and the inner space 512.

The chuck 52 is a pair of blocks facing the gripping surface. The pair of blocks is made contact detachable. The chuck 52 is supported by a mobile device capable of moving in the horizontal direction and the vertical direction, and along the protective sheet 61 loaded on the flat surface 511 of the placing table 51 to the flat surface 511 With a 45 degree angle of attack. That is, the chuck 52 moves away from the placement table 51 while vertically moving the flat surface 511 of the placement table 51. The continuous movement does not include a stop in the middle, and preferably moves at a constant speed. The range of movement of the chuck 52 is from the end of the protective sheet 61 from which the grip was made, to the opposite end of the end.

The sheet stopper 54 has a long axis cylindrical body shape traversing one side of the protective sheet 61 and is a roller capable of rotating the shaft. The sheet stopper 54 can be formed of a metal such as stainless steel. In addition, the diameter of the sheet stopper 54 can be set to 5 mm to several tens of mm when the length traversing the protective sheet 61 is about 200 mm to 300 mm. In the present embodiment, a cylindrical body made of stainless steel having a diameter of 6 mm was used.

The seat stopper 54 maintains a constant height with respect to the flat surface 511 of the placing table 51, maintains just under the chuck 52, and is placed along the direction perpendicular to the long axis. The protective sheet 61 disposed in 51 is vertically moved. The arrangement height of the sheet stopper 54 coincides with the combined height of the electronic components 60 and the protective sheet 61 except for the electrode 602. That is, the seat stopper 54 travels while pressing the non-adhesive surface 612 of the protective sheet 61. The degree of pressure is such that the electrode 602 is not damaged, rubbed, or crushed. The movement range of the seat stopper 54 is right next to the guide portion 53, that is, from the edge of the guide insertion hole 621 of the frame 62, to the opposite end of the protective sheet 61.

The component stopper 55 has a cylindrical shape of a long axis that traverses at least the entire area of the component arrangement area 615 of the protective sheet 61, and is a roller capable of rotating the shaft. The component stopper 55 may be formed of a metal such as stainless steel. The diameter of the component stopper 55 may be determined in consideration of the diameter of the seat stopper 54 and the size of the electronic component 60. However, when the diameter of the component stopper 54 is set to a smaller diameter than the seat stopper 54, the diameter of the component stopper 54 is closer. It becomes possible to arrange it. In the present embodiment, a cylindrical body made of stainless steel having the same diameter as the seat stopper 54 is used.

The component stopper 55 is disposed so as to be accessible and spaced apart from the seat stopper 54. While the chuck 52 and the seat stopper 54 are vertically moving the placing table 51, the component stopper 55 follows and maintains a constant distance to the seat stopper 54. The constant distance is less than the length of the electronic component 60 (length in the moving direction of the component stopper 55) adhered to the protective sheet 61. When the chuck 52 and the seat stopper 54 are located at the end of the placing table 51, the component stopper 55 is an alternative to the seat stopper 54 with the guide insertion hole 621 therebetween (對岸) Distance to be located.

The guide 53 is disposed at a position where the guide insertion hole 621 of the frame 62 and the shaft are common. The leading end of the guide portion 53 faces the guide insertion hole 621 of the frame 62. The guide portion 53 can move in the axial direction, protrudes toward the end of the protective sheet 61, lifts the end of the protective sheet 61 toward the chuck 52, and ends of the protective sheet 61 The inside of the guide insertion hole 621 of the frame 62 is advanced until the chuck 52 is reached. This guide portion 53 peels off one side of the protective sheet 61 by lifting. For this reason, the guide insertion hole 621 has a pin shape and is formed in various places along one side of the protective sheet 61.

For example, as shown in FIG. 17, the position of the guide portion insertion hole 621 is formed at a regular interval between the centers of one side of the frame 62. The guide portion 53 is provided in correspondence with the guide portion insertion hole 621, and the guide portion 53 is formed in a round bar shape. Then, the chuck 52 and the sheet stopper 54 are vertically moved in a direction orthogonal to one side of the frame 62 to peel the electronic component 60 from the protective sheet 61.

18 shows the flow of the operation of the peeling treatment section 5. 18 is a transition diagram schematically showing a state in each step of the peeling treatment section 5. First, as shown in Fig. 18 (a), in a state in which the upper surface 603 of the electronic component 60 is brought into contact with the flat surface 511, the component embedding completed sheet 67 is placed on the placing table 51. To deploy. That is, between the plate release part 4 and the peeling processing part 5, an inverting device for vertically inverting the part filling completion sheet 67 separated from the cooling plate 63 in the plate release part 4 is provided, The component reclamation completed sheet 67 is placed on the placing table 51 in an inverted state. A negative pressure is generated in the air hole 513 of the placing table 51 so that the electronic component 60 is sucked into the flat surface 511. The seat stopper 54 is moved to the edge of the guide insertion hole 621 of the frame 62, and the chuck 52 is positioned just above the guide insertion hole 621 of the frame 62. The component stopper 55 is opened with respect to the seat stopper 54, and is positioned outside the guide portion insertion hole 621 of the frame 62.

As shown in Fig. 18(b), the guide portion 53 is moved upward in the axial direction. The guide part 53 moves inside the guide part insertion hole 621 of the frame 62, and reaches the end of the protective sheet 61 adhered to the frame 62. The guide portion 53 further advances and protrudes the end of the protective sheet 61 in a direction away from the frame 62. Accordingly, the end of the protective sheet 61 starts to be peeled off by the guide portion 53. When the guide portion 53 further proceeds, the end of the protective sheet 61 is guided toward the chuck 52 while being held by the guide portion 53 and the seat stopper 54. In addition, while inducing the end of the protective sheet 61 by the guide 53, the chuck 52 also moves toward the end of the protective sheet 61, even if it goes to meet the end of the protective sheet 61 good.

As shown in Fig. 18(c), when the end of the protective sheet 61 reaches the chuck 52, a pair of blocks are closed, and the tip of the protective sheet 61 is gripped by the chuck 52. When the chuck 52 grips the end of the protective sheet 61, as shown in Fig. 18(d), after the guide 53 is buried in the guide insertion hole 621 of the frame 62, The component stopper 55 is moved to bring the component stopper 55 and the seat stopper 54 closer to a distance less than the length of the electronic component 60.

18(e), the chuck 52 is pulled up while the chuck 52 and the sheet stopper 54 are moved along the protective sheet 61. Since the end of the protective sheet 61 is gripped by the chuck 52, and the seat stopper 54 is traveling on the protective sheet 61, the protective sheet 61 chucks the seat stopper 54 as a starting point. It is pulled up to 52, and the electronic component 60 peels off from the protective sheet 61 starting from the sheet stopper 54. When the peeled protective sheet 61 is maintained in a vertical state and peeled, for example, the horizontal and vertical movement speed components of the chuck 52 may be kept the same. If both speed components are the same, even if the movement speed is changed, peeling can be performed continuously without stopping unless the movement speed is changed, but both movement speeds may be maintained at a constant speed.

At this time, as shown in FIG. 19, peeling of the electronic component 60 from the protective sheet 61 proceeds, and only the ends of the electronic component 60 are attached to the seat stopper 54 and the placing table 51. When it is in the state of being fitted to the flat surface 511, the electronic component 60 is intended to rise to lift the end portion 60a to start peeling. However, the component stopper 55 is following the seat stopper 54. The component stopper 55 firmly presses the side of the peeling start end 60a to be raised. For this reason, the rise of the electronic component 60 is prevented, and the gap 94 between the electrode 602 and the protective sheet 61 peeled off the protective sheet 61 continues to exist, and the electronic component 60 is restarted. It is not attached and is held on the flat surface 511 of the placing table 51. Moreover, since the sheet stopper 54 is an axially rotatable roller, it rotates when the electronic component 60 is pressed firmly, so that grazing with the electronic component 60 is suppressed.

Further, the seat stopper 54 travels while pressing the non-adhesive surface 611 of the protective sheet 61. Therefore, peeling of the electronic component 60 begins, until only the ends of the electronic component 60 being peeled off are in a state of being fitted into the flat surface 511 of the seat stopper 54 and the placing table 51, The sheet stopper 54 also prevents the electronic component 60 from following the protective sheet 61 that has been peeled off. However, from the viewpoint of exerting the function of creating a starting point for peeling by the seat stopper 54, it is not essential that the seat stopper 54 travel while pressing the non-adhesive surface 611 of the protective sheet 61. . That is, the seat stopper 54 may be moved to a position slightly away from the protective sheet 61.

And, as shown in Fig. 18(f), when the chuck 52 and the seat stopper 54 completely terminate the component arrangement area 615 of the protective sheet 61, all the electronic components 60 are protected. It is peeled from the sheet 61 and lined up on the flat surface 511 of the placing table 51. When the electronic component 60 is recovered, the formation of the electromagnetic shielding film 605 in the film forming apparatus 7 is completed. In addition, while the chuck 52 terminates the flat surface 511 of the placing table 51, the angle of attack away from the placing table 51 is not limited to 45 degrees. The position of the chuck 52 is fixed, and the placing table 51 is continuously moved, so that the protective sheet 61 may be removed, and both the chuck 52 and the placing table 51 are movable. You may do so. That is, the chuck 52 and the placing table 51 need only be relatively moved.

Here, FIG. 25 is a schematic diagram showing the configuration of a conventional lifting device. This lifting device is a device for peeling the electronic component 60 from the adhesive film 9 having flexibility and adhesiveness similarly to the protective sheet 61, and is provided with a pin body 8 movable in the axial direction. At the tip of the pin body 8, an adhesive film 9 to which the electronic components 60 are adhered is set. The pin body 8 lifts the adhesive film 9 from the surface opposite to the adhesive surface of the electronic component 60. The pin body 8 deforms the adhesive film 9 into an acid shape with the electronic component 60 as a peak. Therefore, the adhesive area of the electronic component 60 and the adhesive film 9 decreases, and accordingly, the electronic component 60 peels from the adhesive film 9.

26 is a schematic diagram showing a state of peeling of the electronic component 60 by this pick-up device. 26, a plurality of electronic components 60 are bonded to the adhesive film 9 with a gap therebetween. From the viewpoint of production efficiency, the interval between the electronic components 60 adhered to the adhesive film 9 is narrow. Therefore, when one electronic component 60 is lifted, the distortion of the adhesive film 9 also spreads to the adhesive region of the neighboring electronic component 60. Then, while the object to be peeled is lifted up, a portion of the neighboring electronic component 60 is also peeled off from the adhesive film 9 and the peeling portion 91 is generated. However, when peeling of the peeling object is completed, the pin body 8 is retracted in the axial direction, so that the curvature of the adhesive film 9 is eliminated. Then, the adhesive film 9 is reattached to the peeling portion 91, and the reattachment portion 92 of the adhesive film 9 is generated in the electronic component 60.

Then, FIG. 27 is a photograph showing the state of the electrode 602 after the adhesive film 9 is reattached to the electronic component 60. As shown in FIG. 27, when the adhesive film 9 is reattached , The residue 93 of the adhesive film 9 may be generated in the electrode 602. The residue 93 of the pressure-sensitive adhesive film 9 may burn and carbonize during reflow when mounting the electronic component 60, and may lead to poor connection or the like.

Meanwhile, FIG. 20 is a photograph of the electrode 602 after the electronic component 60 is peeled from the protective sheet 61 by the peeling processing unit 5. According to this peeling processing part 5, the protective sheet 61 is always maintained flat by the sheet stopper 54, and once the protective sheet 61 is peeled off, the electronic sheet 60 protects the protective sheet ( 61) can be prevented from returning and reattaching. In addition, the position of the electronic component 60 is fixed by the component stopper 55 and the air hole 513 of the placing table 51, and it is also possible to prevent the electronic component 60 from being floated to be reattached by being attached to the protective sheet 61. have. As a result, as shown in FIG. 20, the residue of the protective sheet 61 was not seen on the electrode 602 of the electronic component 60. As shown in FIG.

Thus, after the film formation by the film-forming processing part 3, this peeling-processing part 5 peels the electronic component 60 from the protective sheet 61. The peeling processing section 5 was provided with a fixing section for fixing the positions of the placing table 51, the chuck 52, and the electronic component 60. The placing table 51 supports the electronic component 60 adhered to the protective sheet 61. The chuck 52 grips the end of the protective sheet 61, moves relative to the placing table 51, and continuously peels toward the opposite end of the end. The fixing portion fixes the position of the electronic component 60 when the electronic component 60 is peeled from the protective sheet 61. Accordingly, once the electronic component 60 and the protective sheet 61 are peeled off, re-attachment is eliminated, and the occurrence of the residue 93 of the protective sheet 61 in the electronic component 60 can be suppressed. .

The fixing portion is, for example, a flat surface 511 of the placing table 51 through which the component stopper 55 or the air hole 513 is formed. The component stopper 55 follows the sheet stopper 54 while maintaining a distance less than the length of the electronic component 60, and suppresses the rise of the electronic component 60. The placement table 51 suppresses the electronic component 60 from being sucked and floats. However, the placement table 51 does not need to employ suction by the air hole 513 as long as it has a function as a fixing part. For example, the mounting table 51 may be an adhesive chuck, an electrostatic chuck, or a mechanical chuck as long as the electronic component 60 can be fixed.

In addition, a guide portion 53 protruding toward the end of the protective sheet 61 was provided. The chuck 52 is placed before the end of the protective sheet 61 is gripped, where the guide 53 is projected. And this guide portion 53 guides the end of the protective sheet 61 toward the chuck 52. Accordingly, it is possible to create a starting point for the chuck 52 to be gripped, and it is possible to reduce the possibility of peeling mismatch between the electronic component 60 and the protective sheet 61.

In addition, a sheet stopper 54 is provided along the chuck 52 to move along the protective sheet 61 to create a starting point for peeling. And this seat stopper 54 is located near the place where the guide portion 53 will protrude, and the end portion of the protective sheet 61 from which the guide portion 53 has been peeled is held together with the guide portion 53, and the chuck (52). Thereby, the chuck 52 can hold the end of the protective sheet 61 more reliably, and the possibility of peeling mismatch between the electronic component 60 and the protective sheet 61 can be reduced.

In addition, although the sheet stopper 54 was described as an example of a cylindrical body having an axis orthogonal to the moving direction of the sheet stopper 54, it is sufficient to be able to travel while pressing the protective sheet 61 firmly, and it is a plate-like body or a block body. It is also good. In addition, the component stopper 55 has also been described by taking a cylindrical body having an axis perpendicular to the moving direction of the component stopper 55 as an example, but may be a plate-like body, a block body, or a brush. When the component stopper 55 is a cylinder, it is a roller that can be rotated axially, so that it rotates when the electronic component 60 is pressed firmly, so that grazing with the electronic component 60 is suppressed.

As the operating mechanism of the chuck 52, the operating mechanism of the seat stopper 54, the operating mechanism of the component stopper 55, and the operating mechanism of the guide portion 53, a known mechanism may be employed, and the present invention is based on the mechanism of the mechanism. It is not limited.

For example, the following operation mechanism can be adopted for the chuck 52. That is, both blocks are supported on the base, and one block is in a position floating relative to the base. The other block is movable with respect to one block. An oval-shaped cam abuts outside the movable block. When the cam is rotated and the block reaches the long-diameter range, the movable block is pressed against the cam to approach the floating block. Further, a compression spring is provided between the pair of blocks, and is pushed in the direction of increasing the gap between the pair of blocks. When the cam is rotated and the block reaches the short diameter range, the movable block is moved away from the floating block by the pressing force of the compression spring.

Further, for example, a ball screw and a rail extending at an angle of 45 degrees with respect to the flat surface 511 of the placing table 51 are provided, and the base of the chuck 52 is fixed to the slider of this ball screw, and Gripping. When the screw shaft of the ball screw is axially rotated by the motor, the chuck 52 moves along the rail from one end of the placing table 51 to the other end.

Moreover, with respect to the component stopper 55, a tension spring is interposed between the component stopper 55 and the base that supports the seat stopper 54, so that the component stopper 55 and the seat stopper 54 are brought closer together. While being pushed, an elliptical cam is disposed between the base supporting the component stopper 55 and the seat stopper 54, and in the state where the long diameter range of the cam is in contact with the base, the component stopper against the pressing force of the tension spring ( 55) and the seat stopper 54 is pushed in the direction of dropping.

In addition, the rear end of the guide portion 53 is a cam ball. The cam ball follows the circumferential surface of the ovoid cam. The cam is pivotally supported by the rotating motor, and is capable of rotating in the circumferential direction. When the rotation motor is driven and the cam rotates, the cam hole rises the bulging portion of the cam, and the guide portion 53 is pushed up.

In addition, the penetration formation position of the guide part insertion hole 621 was made into the position spaced apart at equal intervals with the center of one side of the frame 62 interposed therebetween. Thereby, it becomes easy to peel off the whole side of the protective sheet 61. In correspondence with this guide insertion hole 621, the guide 53 is provided, and the guide 53 is formed in a round bar shape. Then, the chuck 52 and the sheet stopper 54 were terminated in a direction orthogonal to one side of the frame 62 to peel the electronic component 60 from the protective sheet 61. The peeling processing unit 5 is not limited to this, and various types of directions can be adopted for the guide portion insertion hole and the guide portion of various shapes, and also the peeling direction.

For example, as shown in FIG. 21, a guide portion 53 having a cross section such as a rectangle, ellipse, rectangle, etc. having an elongated round corner along one side of the frame 62 can be employed. According to this guide portion 53, since the range over which the protective sheet 61 projects is widened, the protective sheet 61 is easy to roll up, and the tip of the protective sheet 61 is easily reached by the chuck 52. do. In addition, as shown in FIG. 22, instead of the guide insertion hole 621, a cutout 622 including an arrangement area of the guide 53 may be formed in the frame 62. Furthermore, as shown in Fig. 23, the guide insertion hole 621 is disposed at the corner of the frame 62, and the chuck 52 and the sheet are turned diagonally toward the corner of the frame 62 as a peeling starting point. The stopper 54 may be moved and peeled along the diagonal line of the protective sheet 61.

(Other embodiments)

The present invention is not limited to the above-described embodiments, but also includes the following aspects. That is, as shown in FIG. 24, the film-forming apparatus 7 may further be provided with the transfer arrangement part 71 in charge of a component placement process. The transfer arrangement unit 71 is in charge of the component placement process, and replaces and transfers the electronic component 60 from the tray on which the electronic component 60 is placed before the film formation process to the component unplaced sheet 65. For example, if the tray and the part unplaced sheet 65 are lined up to be adjacent to each other, and the transfer arrangement part 71 is a robot capable of moving the range including the tray and the part unplaced sheet 65 vertically and horizontally good. A vacuum chuck, for example, is provided at the tip of the arm of the robot. The transfer arrangement unit 71 generates the negative pressure on the tray to hold the electronic component 60, releases the negative pressure on the component unplaced sheet 65 by vacuum breakage or atmospheric opening, and the like, thereby removing the electronic component 60 from the component. It is laid out on the unplaced sheet 65.

In addition, although the film-forming apparatus 7 was provided with the embedding processing part 1, the plate mounting part 2, the film-forming processing part 3, the plate release part 4, and the peeling processing part 5, each of these parts is independent. It may be configured as a device and systemized. That is, the buried processing unit 1 may be an independent buried processing unit, the plate mounting unit 2 may be an independent plate mounting unit, the film processing unit 3 may be an independent film processing unit, or the plate release unit 4 may be an independent plate. The release device may be used, or the peeling processing unit 5 may be an independent peeling processing device.

In addition, in the above embodiment, the height H1 from the surface of the component arrangement area 615 to the top surface of the frame 62 is from the surface of the component arrangement area 615 to the upper surface of the electronic component 60. Although it was supposed to be higher than the height H2, it is not limited to this, and may be lower than the height H2. In this case, the amount that allows the difference between the height H1 and the height H2 in the area facing the component arrangement area 615 on the flat surfaces 112, 212, 412 of the ceiling portions 11, 21, 41 It is only necessary to form in the recessed portion recessed as much as possible so that the closed spaces 14, 24a, and 45 can be formed.

Although the embodiments of the present invention and modifications of the parts have been described above, the embodiments and modifications of the parts are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments and variations thereof are included in the scope and gist of the invention and are included in the invention described in the claims.

1: landfill, 11: ceiling, 111: interior space, 112: flat surface, 113: air hole, 114: air pressure supply hole, 115: O-ring, 12: placing table, 121: interior space, 122: flat surface, 123: air hole, 124: pneumatic supply hole, 125: pusher insertion hole, 13: pusher, 14: enclosed space, 2: plate mount, 21: ceiling, 211: interior space, 212: flat surface, 213: air hole, 214: pneumatic supply hole, 215: O-ring, 22: placing table, 221: opening, 222: edge, 223: pneumatic supply hole, 224: pusher insertion hole, 23: pusher, 24a: sealed space, 24b: sealed space, 3: film formation processing unit, 31: chamber, 311: processing position, 312: film formation position, 32: load lock chamber, 33: short circuit, 34: rotary table, 35: surface treatment unit, 36: sputter source 361: target, 4: plate Release part, 41: ceiling part, 411: interior space, 412: flat surface, 413: air hole, 414: air pressure supply hole, 415: O-ring, 42: placing table, 421: opening, 422: edge, 423: air pressure supply Hole, 424: pusher insertion hole, 43: pusher, 44: pinching block, 45: enclosed space, 5: delamination section, 51: placing table, 511: flat surface, 512: inner space, 513: air hole, 514: air pressure Supply hole, 52: chuck, 53: guide, 54: seat stop roller, 55: component stop roller, 60: electronic component, 60a: peeling start end, 601: electrode exposed surface, 602: electrode, 603: top surface, 604: side surface, 605: electromagnetic shielding film, 61: protective sheet, 611: adhesive surface, 612: non-adhesive surface, 613: outer frame area, 614: inner frame area, 615: component arrangement area, 62: frame, 621 : Guide insertion hole, 622: Cutout, 63: Cooling plate, 631: Pusher insertion hole, 632: Air hole, 64: Adhesive sheet, 65: Unplaced sheet, 66: Part placement complete sheet, 67: Parts reclamation complete sheet, 68: Parts mounting plate, 7: Film-forming device, 71: Transfer placement part, 73: Transfer part, 74: Control part, 75: Pneumatic circuit

Claims (5)

A film forming apparatus using a protective sheet and a cooling plate in which electronic components are arranged,
A plate mounting portion for adhering the protective sheet to the cooling plate,
A film forming processing unit for depositing and depositing a film-forming material by sputtering on the electronic component on the cooling plate is provided,
The plate mounting portion,
And a pressing portion for pressing the outer peripheral portion of the protective sheet to the cooling plate,
A protection sheet holding unit for holding the protection sheet to separate the cooling plate from the region where the electronic component is arranged in the protection sheet when the pressing portion contacts the outer circumference of the protection sheet with the cooling plate;
Under the state in which the outer peripheral portion of the protective sheet is pressed against the cooling plate by the pressing portion, has a pressure reducing portion for depressurizing the space between the protective sheet and the cooling plate,
The protective sheet holding unit releases the holding of the protective sheet under a condition in which the space between the protective sheet and the cooling plate is depressurized. According to claim 1, wherein the protective sheet holding unit,
On the opposite side of the cooling plate with the protective sheet interposed therebetween, it has a flat surface with an air hole that sucks up the protective sheet to separate the cooling plate and the protective sheet;
The air hole maintains a negative pressure until the space between the protective sheet and the cooling plate is reduced to a predetermined pressure by the pressure reducing unit. The method according to claim 2, further comprising a positive pressure portion having the air hole and generating a positive pressure in the air hole,
In the air hole, the space between the protective sheet and the cooling plate is depressurized to a predetermined pressure by the depressurizing portion, and then is changed from a negative pressure to a positive pressure, thereby pressing against the protective sheet toward the cooling plate. A film forming apparatus, characterized in that to give. The cooling plate according to any one of claims 1 to 3, wherein the cooling plate has an air hole on the plate side penetrating both sides of the plate,
The decompression unit,
An arrangement surface for disposing the cooling plate on the opposite side to the protective sheet with the cooling plate interposed therebetween;
It is formed on the placement surface, and has an air hole on the placement surface side to generate a negative pressure,
The film forming apparatus, characterized in that the protective sheet is drawn to the cooling plate through the air hole on the side of the arrangement surface and the air hole on the side of the plate. According to claim 2 or claim 3, The plate mounting portion,
Has a driving portion for accessing the protective sheet and the cooling plate,
The air hole, the film forming apparatus, characterized in that to generate a negative pressure before the protective sheet and the cooling plate approaches.

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