TWI679293B - Film forming device - Google Patents

Abstract

The present invention provides a film forming apparatus capable of suppressing heating of electronic parts with a simple structure. The film forming apparatus uses a protective sheet in which electronic components are arranged, and a cooling plate. The film forming apparatus includes a plate mounting portion and a film forming processing portion. The board mounting part adheres the protection sheet to the cooling plate. The film forming processing section deposits a film forming material on an electronic component adhered to a protective sheet adhered to a cooling plate by sputtering to perform film formation. This board mounting portion has a sealed space for sealing the parts arranged in the electronic parts and the protective sheet, a closed space of the cooling plate, and a pressure reducing unit for reducing the pressure in the closed space. After the pressure is reduced by the pressure reducing portion, the plate mounting portion presses the protective sheet and the cooling plate against each other.

Description

Film forming device

The present invention relates to a film forming apparatus.

Wireless communication devices such as mobile phones are equipped with many electronic components such as semiconductor devices. In order to prevent the influence on communication characteristics, electronic components are required to suppress the influence of electromagnetic waves, such as leakage of electromagnetic waves to the outside, on the inside and outside. Therefore, an electronic component having a shielding function against electromagnetic waves is used.

Generally, an electronic component is formed by mounting a component on an interposer substrate which is a substrate for relaying to a package substrate, and sealing the component with a resin. An electronic component has been developed in which a shielding function is provided by providing a conductive electromagnetic wave shielding film on the upper surface and the side surface of this sealing resin (see Patent Document 1).

Such an electromagnetic wave shielding film can be a laminated film of a plurality of metal materials. For example, there is known an electromagnetic wave shielding film having a laminated structure in which a SUS film is first formed, a Cu film is formed on the SUS film, and then a SUS film is formed on the Cu film.

In order to obtain a sufficient shielding effect in an electromagnetic wave shielding film, it is necessary to reduce the resistivity. Therefore, the electromagnetic wave shielding film is required to have a certain thickness. In a semiconductor device, generally having a film thickness of about 1 μm to 10 μm, good shielding characteristics can be obtained. It is known that a good shielding effect can be obtained in the electromagnetic wave shielding film of the laminated structure of SUS, Cu, and SUS having a film thickness of about 1 μm to 5 μm.

[Prior Art Literature] [Patent Literature] Patent Literature 1: International Publication No. 2013/035819

[Problems to be Solved by the Invention] As a method for forming an electromagnetic wave shielding film, a plating method is known. However, the electroplating method requires a wet process such as a pre-treatment step, a plating treatment step, and a post-treatment step such as water washing. Therefore, an increase in the manufacturing cost of electronic parts cannot be avoided.

Therefore, a sputtering method as a dry step is attracting attention. As a film forming apparatus using a sputtering method, a plasma processing apparatus for forming a film using a plasma has been proposed. The plasma processing apparatus introduces an inert gas into a target-equipped vacuum container, and applies a DC voltage. The ions of the plasmad inert gas collide with the target of the film-forming material, and the material that has been ejected from the target is deposited on the workpiece to form a film.

A general plasma processing apparatus is used to form a film having a thickness of 10 nm to several hundreds nm that can be formed within a processing time of several tens of seconds to several minutes. However, as described above, as the electromagnetic wave shielding film, a film having a thickness of a micrometer order must be formed. The sputtering method is a technique for depositing particles of a film-forming material on a film-forming object to form a film. Therefore, the thicker the film to be formed, the longer it takes to form the film.

Therefore, in order to form the electromagnetic wave shielding film, a processing time of about several tens minutes to about one hour is required longer than a normal sputtering method. For example, in an electromagnetic wave shielding film having a laminated structure of SUS, Cu, and SUS, in order to obtain a film thickness of 5 μm, a processing time of more than one hour may be required.

Therefore, in the sputtering method using a plasma, during this processing time, the package as an outer package of the electronic component is continuously exposed to the heat of the plasma. As a result, the package may be heated to about 200 ° C. before a film having a thickness of 5 μm is obtained.

On the other hand, if it is temporarily heated for several seconds to several tens of seconds, the heat resistance temperature of the package is about 200 ° C. However, when it is heated for more than a few minutes, the heat resistance temperature of the package is usually about 150 ° C. Therefore, it is difficult to form a micron-level electromagnetic wave shielding film using a common plasma sputtering method.

In order to cope with this problem, it is considered that a plasma processing apparatus is provided with a cooling device for suppressing an increase in the temperature of electronic parts. In this case, the device structure is complicated and enlarged.

An object of the present invention is to provide a film forming apparatus capable of suppressing heating of electronic components with a simple structure.

[Technical Means for Solving the Problem] In order to achieve the above-mentioned object, the present invention is a film forming apparatus using a protective sheet in which electronic parts are arranged and a cooling plate, and includes a board mounting portion, and the protective sheet is adhered to the film. A cooling plate; and a film forming processing unit that deposits a film forming material on the electronic parts on the cooling plate to form a film by sputtering; the plate mounting portion includes a pressing portion and the protective sheet An outer peripheral portion of the protective sheet is pressed on the cooling plate; and a protective sheet holding portion is arranged to arrange the protective sheet in the protective sheet when the pressing portion causes the outer peripheral portion of the protective sheet to contact the cooling plate. The protection sheet is held so that the area of the electronic component is separated from the cooling plate; and the decompression section, in a state where the outer peripheral portion of the protection sheet has been pressed against the cooling plate by the pressing portion, The space between the protective sheet and the cooling plate is decompressed; in a state where the space between the protective sheet and the cooling plate has been decompressed, the protective sheet holding portion releases the protective sheet of Hold.

The protective sheet holding portion may include an air hole on the side opposite to the cooling plate across the protective sheet and including an air hole that sucks up the protective sheet to separate the cooling plate from the protective sheet. A flat surface, and the air hole maintains the negative pressure until the space between the protective sheet and the cooling plate is reduced to a preset pressure by the decompression section.

It may be further provided that a positive pressure portion is provided with the air hole, a positive pressure is generated in the air hole, and a space between the protective sheet and the cooling plate has been passed through the decompression portion. After the space is decompressed to a preset pressure, the air hole is changed from generating a negative pressure to generating a positive pressure, thereby applying a pressing force toward the cooling plate to the protective sheet.

The cooling plate may have plate-side air holes penetrating both surfaces of the plate, and the decompression portion may include a mounting surface on which the cooling plate is placed on a side opposite to the protective sheet through the cooling plate. Plate; and a mounting-surface-side air hole provided on the mounting surface to generate a negative pressure; the protective sheet-side air hole and the plate-side air hole attract the protective sheet to the mounting surface. Mentioned cooling plate.

The plate mounting portion may include a driving portion for bringing the protection sheet close to the cooling plate, and the air hole may generate a negative pressure from before the protection sheet comes close to the cooling plate.

[Effects of the Invention] According to the present invention, heat is transferred from the electronic component to the cooling plate, so that excessive heat blocking in the film formation process in the electronic component is suppressed, and it is difficult for air bubbles to enter between the protective sheet and the cooling plate. Since the two are in close contact, the heat transfer area from the electronic component to the cooling plate becomes large. Therefore, heating of the electronic component can be suppressed.

(Electronic component) FIG. 1 is a side view showing an electronic component subjected to a film forming process. As shown in FIG. 1, an electromagnetic wave shielding film 605 is formed on the surface of the electronic component 60. The electronic component 60 is a surface-mounted component such as a semiconductor wafer, a diode, a transistor, a capacitor, or a surface acoustic wave (Surface Acoustic Wave, SAW) filter. A semiconductor wafer is an integrated circuit such as an integrated circuit (IC) or a large scale integrated circuit (LSI) formed by integrating a plurality of electronic components. This electronic part has Ball Grid Array (BGA), Land Grid Array (LGA), Small Outline Package (SOP), Quad Flat Package (QFP), A substantially rectangular parallelepiped shape, such as a wafer level package (WLP), has one surface serving as an electrode exposure surface 601. The electrode exposed surface 601 is a surface where the electrode 602 is exposed and is opposed to the package substrate and connected to the package substrate. The electrode 602 is an electrode called a spherical bump or a solder ball bump, and is formed by mounting a spherical solder (solder ball) having a diameter of several tens μm to several hundreds μm on a pad electrode.

The electromagnetic wave shielding film 605 shields electromagnetic waves. The electromagnetic wave shielding film 605 is formed of a material such as Al, Ag, Ti, Nb, Pd, Pt, or Zr. The electromagnetic wave shielding film 605 may be formed of a magnetic material such as Ni, Fe, Cr, or Co. In addition, a film such as SUS, Ni, Ti, V, or Ta may be formed as a base layer of the electromagnetic wave shielding film 605, and a film such as SUS, Au may also be formed as a protective layer on the outermost surface.

The electromagnetic wave shielding film 605 is formed on the outer surface other than the top surface 603 and the side surface 604 of the electronic component 60, that is, the electrode exposure surface 601. The top surface 603 is a surface opposite to the electrode exposed surface 601. The side surface 604 is an outer peripheral surface that connects the top surface 603 and the electrode exposed surface 601 and is extended at an angle different from that of the top surface 603 and the electrode exposed surface 601. In order to obtain a shielding effect that blocks electromagnetic waves, the electromagnetic wave shielding film 605 may be formed on at least the top surface 603. There is a ground pin (not shown) on the side 604. The electromagnetic wave shielding film 605 for the side is also formed for grounding the electromagnetic wave shielding film 605.

(During Film Formation Process) FIG. 2 is a side view showing a state of the electronic component after the film formation process. In addition, FIG. 3 is an exploded perspective view showing a state of an electronic component when subjected to a film forming process. As shown in FIGS. 2 and 3, the electrode 602 of the electronic component 60 is embedded in the protective sheet 61 in advance, and the electrode exposed surface 601 is in close contact with the protective sheet 61. By embedding the electrode 602 in the protective sheet 61, particles of the electromagnetic wave shielding film 605 are prevented from reaching the electrode 602. In addition, due to the close contact between the electrode exposed surface 601 and the protective sheet 61, the room for the particles of the electromagnetic wave shielding film 605 to enter between the electrode exposed surface 601 and the protective sheet 61 is also lost, so that the particles of the electromagnetic wave shielding film 605 may reach the electrode 602. Sexual decline.

The protective sheet 61 is a heat-resistant synthetic resin such as polyethylene naphthalate (PEN) and polyimide (PI). One surface of the protective sheet 61 is an adhesive surface (adhesive layer) 611 having the flexibility of sinking the electrode 602 and the adhesion of the electrode exposed surface 601. As the adhesive surface 611, various materials having adhesiveness, such as silicone-based and acrylic resins, urethane resins, and epoxy resins can be used.

The adhesive surface 611 is divided into an outer frame region 613 that reaches a predetermined distance from the end portion of the protective sheet 61 toward the inside, a middle frame region 614 that reaches a predetermined distance from the inner periphery of the outer frame region 613 toward the inside, and a middle frame region The area 614 is the inner part arrangement area 615. The electronic component 60 is stuck in the component arrangement area 615. A frame-like frame 62 is stuck to the outer frame region 613. The middle frame region 614 is a range where warpage of the protective sheet 61 occurs, and neither the frame 62 nor the electronic components 60 are adhered. The opposite surface of the adhesive surface 611 is a non-adhesive surface 612.

The protective sheet 61 is adhered to the cooling plate 63 via an adhesive sheet 64. The cooling plate 63 is made of a metal such as SUS, ceramic, resin, or other material having high thermal conductivity. The cooling plate 63 is a heat dissipation passage that releases heat from the electronic components and suppresses excessive heat storage. Both sides of the adhesive sheet 64 have adhesiveness, improve the adhesion between the protective sheet 61 and the cooling plate 63, and ensure a heat transfer area toward the cooling plate 63.

The height H1 from the surface of the component arrangement region 615 to the upper end surface of the frame 62 is higher than the height H2 from the surface of the component arrangement region 615 to the top surface 603 of the electronic component 60 (see FIG. 4). In addition, the height H1 may be renamed to the thickness H1 for convenience, but the meaning is the same. In short, if the flat plate is placed on the frame 62, the top surface 603 of the electronic component 60 does not reach the flat plate.

A guide portion insertion hole 621 is continuously formed at one end portion of the frame 62. The guide-portion insertion hole 621 has long oval, rectangular, circular, and other openings along the end of the frame 62, and runs through the surface of the frame 62 that is adhered to the protective sheet 61 and its opposite exposed surface. That is, for example, if a rod-shaped member is inserted into the guide portion insertion hole 621 and the end portion of the protection sheet 61 is pressed (see (a) to (f) in FIG. 18), one end portion of the protection sheet 61 is removed from the frame 62. On peel.

A pusher insertion hole 631 is formed in the cooling plate 63 and the adhesive sheet 64. The push rod insertion hole 631 does not coincide with the guide portion insertion hole 621, and is provided at a position blocked by the frame 62. A plurality of push rod insertion holes 631 are provided in a manner such that if, for example, a rod-shaped member is inserted into the push rod insertion hole 631 and the frame 62 is pushed upward by the front end of the rod-shaped member, the frame 62 as a whole is raised in parallel. . For example, if the frame 62 is a rectangular frame, the push rod insertion holes 631 are located at four corners, or further located at the center of each side. From the viewpoint of maintaining the parallelism of the frame 62, the rod-shaped member desirably has a rectangular front end surface, that is, a thin plate shape or an L-shaped cross-section, etc., but is not limited thereto, and may have a circular shape. The front face of the shape. The push rod insertion hole 631 has a rectangular shape, an L shape, or a circular shape correspondingly.

Furthermore, in the cooling plate 63 and the adhesive sheet 64, a large number of fine air holes 632 are formed at regular intervals throughout the entire range of the middle frame region 614 and the component arrangement region 615 of the adhesive protection sheet 61. This air hole 632 is, for example, a minute cylindrical shape or a slit shape. This air hole 632 is provided to uniformly apply negative pressure or positive pressure to at least the part arrangement area 615 of the protective sheet 61 adhered to the cooling plate 63 through the air hole 632. The number of the air holes 632, the space between the air holes 632, and the space between the air holes 632 are not limited to this. For example, the air holes 632 may be provided only within a range corresponding to the parts arrangement area 615. On the other hand, the air holes 632 are arranged sparsely on the outside, and only one may be provided at a position corresponding to the center of the parts arrangement area 615.

(Film-forming process) In the film-forming process, an electromagnetic wave shielding film 605 is formed and passed through a part mounting step, a part embedding step, a board mounting step, a film forming step, a board removing step, and a part peeling step. Electronic parts 60 separated into a single piece.

FIG. 4 is a diagram showing a film forming process flow of an electronic component. As shown in FIG. 4, in the component mounting step, the electronic components 60 are arranged in a state where the electrode exposed surface 601 of the electronic component 60 and the component unmounted piece 65 whose frame 62 is adhered to the protective sheet 61 face each other. In the part arrangement area 615. A state in which the frame 62 is adhered to the protective sheet 61 and the electronic components 60 are arranged, but the electrode 602 has not been buried is referred to as a component-mounted sheet 66.

In the component embedding step, the electrode 602 is embedded in the protective sheet 61 with respect to the component-mounted sheet 66, and the electrode exposed surface 601 is in close contact with the protective sheet 61. Regardless of whether the electromagnetic wave shielding film 605 is formed or not, the state in which the electrode 602 is buried in the protective sheet 61 is referred to as a part-embedded sheet 67. In the board mounting step, the component-embedded sheet 67 is closely adhered to the cooling plate 63 via the adhesive sheet 64. The state in which this cooling plate 63 is mounted is referred to as a component mounting plate 68.

In the film forming step, particles of the electromagnetic wave shielding film 605 are deposited from the top surface 603 side of the electronic component 60, and the electromagnetic wave shielding film 605 is formed on the electronic component 60. At this time, the electrode 602 of the electronic component 60 is buried in the protective sheet 61, and the electrode exposed surface 601 is in close contact with the protective sheet 61 to prevent particles of the electromagnetic wave shielding film 605 from adhering to the electrode 602.

In the plate releasing step, the cooling plate 63 is detached and restored to the form in which the parts are embedded in the sheet 67. Then, in the component peeling step, the electronic component 60 is peeled from the protective sheet 61 and separated into a component non-mounting sheet 65 and each electronic component 60. In addition, the protective sheet 61 is peeled from the frame 62 in preparation for reuse of the frame 62. The film formation process is completed in the above manner.

(Film Forming Apparatus) A film forming apparatus that performs the above-mentioned part embedding step, board mounting step, film forming step, board releasing step, and part peeling step in the film forming process flow is shown in FIG. 5. As shown in FIG. 5, the film forming apparatus 7 includes an embedding processing section 1, a board mounting section 2, a film forming processing section 3, a board release section 4, and a peeling processing section 5. Each part is connected by the conveying part 73, the components required in each step are put in, and the components which have completed the processing in each step are discharged. The transfer unit 73 is, for example, a conveyor, and may be a transfer table movable along a linear track by a ball screw or the like.

In addition, a control unit 74 such as a computer or a microcomputer is housed in the film forming apparatus 7 and includes a central processing unit (CPU), a read only memory (ROM), and a random access memory ( Random Access Memory (RAM) and a signal transmission circuit for controlling the timing of operation of each constituent element included in the embedding processing section 1, the board mounting section 2, the film forming processing section 3, the board release section 4, and the peeling processing section 5 ( timing). Further, a pneumatic circuit 75 is housed, and a positive pressure or a negative pressure is supplied to the embedding processing section 1, the board mounting section 2, the film forming processing section 3, the board release section 4, and the peeling processing section 5. The control unit 74 also controls the solenoid valve in the pneumatic circuit 75, and switches between generation of negative pressure, release of negative pressure, generation of positive pressure, and release of positive pressure.

(Embedding Processing Unit) The embedding processing unit 1 that performs the steps of embedding parts will be described. FIG. 6 is a schematic diagram showing a configuration of the embedding processing unit 1. The component placement sheet 66 is put into the processing unit 1. The embedding processing section 1 attracts the protective sheet 61 to the electronic part 60 while blocking the electronic part 60, and presses the protective sheet 61 on the electronic part 60. Thereby, the embedding processing unit 1 sinks the electrode 602 of the electronic component 60 into the protective sheet 61, and further brings the electrode exposed surface 601 into close contact with the protective sheet 61.

As shown in FIG. 6, the embedded processing unit 1 includes a top portion 11 and a mounting table 12. The top portion 11 and the mounting table 12 are blocks having an internal space 111 and an internal space 121 together. The top portion 11 is disposed to face the mounting table 12 and has a flat surface 112 and a flat surface 122 parallel to each other on the opposite sides. The size and shape of the two flat surfaces 112 and 122 are the same as or larger than the part-mounted sheet 66. The position of the mounting table 12 does not move. On the other hand, the top portion 11 can be raised and lowered with respect to the mounting table 12. The top portion 11 is at least close to the distance from the mounting table 12 to the thickness H1 of the frame 62 of the component mounting sheet 66.

The component mounting sheet 66 is placed on the mounting table 12. The flat surface 122 of the mounting table 12 becomes a mounting surface of the component mounting sheet 66. The flat surface 122 includes a non-slip member having an adhesive force. In addition, a plurality of air holes 123 leading to the internal space 121 are continuously formed on the flat surface 122 of the mounting table 12. The range of the air holes 123 is the same as the size and shape of the inside of the frame 62 of the component mounting sheet 66, or at least the same as the size and shape of the component arrangement area 615. When the part placement sheet 66 has been placed on the placement table 12, the position where the air holes 123 are arranged is a position facing the area inside the frame 62 or a position facing the part arrangement area 615.

The internal space 121 of the mounting table 12 is further provided with an air pressure supply hole 124 at a position different from the flat surface 122. The air pressure supply hole 124 is connected to a air pressure circuit 75 including a compressor, a negative pressure supply pipe, and a positive pressure supply pipe (not shown). Therefore, a positive pressure or a negative pressure is selectively generated in the air hole 123 through the air pressure supply hole 124 and the internal space 121. The air hole 123, the air pressure supply hole 124, and the air pressure circuit 75 function as a pressure adjustment unit.

Furthermore, on the flat surface 122 of the mounting table 12, a push rod insertion hole 125 penetrating through the mounting table 12 is opened. The push-rod insertion hole 125 is disposed outside the continuous range of the air hole 123. In detail, when the component mounting sheet 66 has been placed, the position where the push rod insertion hole 125 is inserted is a position blocked by the frame 62 without the guide portion insertion hole 621 of the frame 62. The push rod 13 is inserted into the push rod insertion hole 125. The push rod 13 can be moved in and out from the flat surface 122 of the mounting table 12. The push rod 13 is provided with the rigidity, the number, and the arrangement interval that separates the part-mounting piece 66 from the mounting base 12 when it has protruded from the push-rod insertion hole 125, and can be lifted and supported in parallel. . For example, if the outer shape of the frame 62 is rectangular, a rod is arranged corresponding to each corner of the frame 62.

Then, a plurality of air holes 113 leading to the inner space 111 are also provided on the flat surface 112 of the top portion 11. The range of the air holes 113 is the same as the size and shape of the inside of the frame 62 of the part placement sheet 66, or at least the same as the size and shape of the parts arrangement area 615 and the entire part arrangement area 615. When the component mounting sheet 66 has been placed on the mounting table 12, the position where the air holes 113 are arranged is a position opposed to the area inside the frame 62 or a position opposed to the component arrangement area 615.

An air pressure supply hole 114 is continuously formed in the internal space 111 of the top portion 11 at a position different from the flat surface 112. The air pressure supply hole 114 is connected to a air pressure circuit 75 including a compressor, a negative pressure supply pipe, and the like (not shown). Therefore, a negative pressure is generated in the air hole 113 through the air pressure supply hole 114 and the internal space 111. The air hole 113, the air pressure supply hole 114, and the air pressure circuit 75 function as a pressure reduction unit.

Further, on the flat surface 112 of the top portion 11, an O-ring 115 surrounding a continuous range of the air hole 113 is provided along the frame 62 of the component placement sheet 66 placed on the placement table 12.

(A) to (g) in FIG. 7 show a flow of the operation of the embedding processing unit 1. (A)-(g) in FIG. 7 is a transition diagram which shows typically the state of the embedding processing part 1 in each step. First, as shown in FIG. 7 (a), the component placement sheet 66 is put into the processing unit 1. The top portion 11 is sufficiently separated from the mounting table 12, and the push rod 13 first projects the front end from the flat surface 122 of the mounting table 12. When the component placement sheet 66 is put in, the frame 62 of the component placement sheet 66 is aligned with the push rod 13, and the component placement sheet 66 is supported on the push rod 13.

Then, as shown in FIG. 7 (b), the push rod 13 is moved backward into the push rod insertion hole 125. As a result, the component placement sheet 66 is lowered onto the flat surface 122 of the placement table 12. In addition, the top portion 11 is moved toward the mounting table 12. The flat surface 112 of the top portion 11 and the flat surface 122 of the mounting table 12 sandwich the frame 62 of the component placement sheet 66. The height H1 from the surface of the component arrangement region 615 to the upper end surface of the frame 62 is higher than the height H2 from the surface of the component arrangement region 615 to the top surface 603 of the electronic component 60. Therefore, when the frame 62 has been sandwiched, the top surface 603 of the electronic component 60 does not reach the flat surface 112 of the top 11. Therefore, in the closed space 14 surrounded by the flat surface 112 of the top portion 11, the protection sheet 61, and the frame 62 and sealed by the O-ring 115, the component arrangement region 615 on which the electronic component 60 is mounted is enclosed.

When the component arrangement region 615 is enclosed in the closed space 14, as shown in FIG. 7C, a negative pressure is generated in the air hole 123 of the mounting table 12, and the protective sheet 61 is adsorbed on the flat surface 122. Then, as shown in (d) of FIG. 7, a negative pressure is also generated in the air hole 113 of the top portion 11, and the closed space 14 in which the component arrangement region 615 is enclosed is decompressed. The degree of pressure reduction is preferably such that the pressure reached by the two air holes 113 and 123 is the same and is close to the vacuum. The reason why the air hole 123 of the mounting table 12 first generates negative pressure is that by first adsorbing the protective sheet 61 on the mounting table 12, the pressure on the lower side of the protective sheet 61 is suppressed relative to the upper side during the decompression of the closed space 14. The air pressure becomes too high, and thus the electronic component 60 swiftly protrudes toward the flat surface 112 of the top portion 11. In addition, at this stage, the electronic component 60 is placed on the protective sheet 61 in a state where the electrode 602 is not buried in the adhesive surface 611 of the protective sheet 61. Therefore, there is a gap between the electrode exposed surface 601 and the adhesive surface 611. This gap is also decompressed.

When the decompression is completed, as shown in FIG. 7 (e), the air hole 123 on the mounting table 12 side is gradually changed from the negative pressure to the positive pressure while the negative pressure on the top 11 side is maintained, and the The air hole 123 of the mounting table 12 is converted into a positive pressure. The electronic component 60 and the protective sheet 61 are slowly sucked upward toward the flat surface 112 of the top portion 11 and are slowly pushed upward. The electronic component 60 is blocked by being pressed by the flat surface 112 of the top portion 11. On the other hand, since the protective sheet 61 has the flexibility of the adhesive surface 611, even after the electronic component 60 has been blocked, it is further attracted toward the flat surface 112, and further pushed upward toward the flat surface 112.

Then, the electrode 602 of the electronic component 60 is buried in the protective sheet 61, and more specifically, is buried in the adhesive surface 611 of the protective sheet 61, and the electrode exposed surface 601 of the electronic component 60 is in close contact with the protective sheet 61. At this time, the flat surface 112 of the top portion 11 includes the part arrangement area 615, and the part arrangement area 615 is made flat accordingly. In other words, the part arrangement region 615 is not bent. Therefore, it is possible to prevent insufficient embedding of the electrode 602 or insufficient adhesion of the electrode exposed surface 601 to the end of the component arrangement region 615.

The adhesion process between the electrode exposed surface 601 and the protective sheet 61 is performed under a reduced pressure environment, and there is no air in the closed space, or the air becomes very small. Therefore, the possibility that air bubbles penetrate between the electrode exposed surface 601 and the protective sheet 61 is reduced.

Further, FIG. 8 is an enlarged view of the electronic components 60 embedded in the processing unit 1. As shown in FIG. 8, the positive pressure generated in the mounting table 12 pushes at least the part arrangement area 615 of the protective sheet 61 evenly upward. Then, in each gap between the adjacent electronic components 60, the protective sheet 61 having flexibility is pushed into the flat surface 112 of the top portion 11 without being blocked by the electronic components 60. Then, the adhesive surface 611 of the protective sheet 61 bulges until it reaches the lower part of the side surface of the electronic component 60, and the protective sheet 61 is also in close contact with the lower part of the side surface of the electronic component 60. Therefore, it is possible to more reliably prevent particles of the electromagnetic wave shielding film 605 from entering between the electrode exposed surface 601 and the protective sheet 61.

If the electrode 602 of the electronic component 60 is embedded in the protective sheet 61, and the electrode exposed surface 601 of the electronic component 60 and the lower part of the side surface are closely adhered to the protective sheet 61, as shown in (f) of FIG. 13 moves in the axial direction along the push rod insertion hole 125 and appears again from the flat surface 122 of the mounting table 12. At the same time, the top portion 11 is separated from the mounting table 12 at a speed equal to the forward speed of the push rod 13. Finally, as shown in (g) of FIG. 7, the push rod 13 is stopped, and the top portion 11 is further separated from the mounting table 12, thereby releasing the sandwiching of the embedded piece 67. This completes the embedding of the electronic component 60 into the protective sheet 61 by the embedding processing unit 1.

In addition, as long as the negative pressure on the top 11 side and the positive pressure on the mounting table 12 side are adhered to the protective sheet 61 from the electrode exposed surface 601 of the electronic component 60 in (e) in FIG. 7 to (g) in FIG. 7 ) In the period until the top 11 is raised. When the negative pressure on the top 11 side is released immediately before the top 11 is raised in (g) of FIG. 7, the electronic component 60 can be stabilized when the pusher 13 in (f) of FIG. 7 is raised. It is preferably held on the protective sheet 61.

In this manner, the top portion 11 and the mounting table 12 serve as fixing portions for sandwiching the component mounting pieces 66 by sandwiching the frame 62 from both sides. In addition, the top portion 11 and the protective sheet 61 and the frame 62 form a closed space 14 that encloses the component arrangement area 615. The O-ring 115 is sealed to improve the reliability of the closed space 14. Furthermore, the air hole 113 of the top part 11 becomes a decompression part which decompresses the closed space 14.

The flat surface 122 of the mounting table 12 is a mounting surface for the component mounting sheet 66. The air hole 123 opened on the flat surface 122 of the mounting table 12 becomes an anti-collision member and a pressing member which first generates a negative pressure when the closed space 14 is decompressed, and prevents the electronic component 60 from moving toward the top 11 The flat surface 112 of the protrusion protrudes, and the pressing member interacts with the negative pressure of the top portion 11 through the positive pressure to press the part arrangement region 615 on the flat surface 112 of the top portion 11 and embed the electrode 602 of the electronic component 60.

In addition, the flat surface 112 of the top portion 11 becomes a flattening member that flattens the component arrangement region 615 to improve the embedding effect of the electrode 602 and the adhesion effect of the electrode exposed surface 601. The air hole 113 opened on the flat surface 112 of the top portion 11 becomes an upper suction member and a side lower covering member that interact with the positive pressure of the mounting table 12 by negative pressure to arrange the parts. The region 615 is pressed on the flat surface 112 of the top portion 11 and the electrode 602 of the electronic component 60 is embedded. The side lower covering member interacts with the positive pressure of the mounting table 12 to suck the protective sheet 61 upward between the electronic components 60. The protective sheet 61 is brought into close contact with the lower portion of the side surface of the electronic component 60 in the gap between the two.

In this manner, the embedding processing unit 1 has the electrode 602 of the electronic component 60 embedded in the adhesive surface 611 of the protective sheet 61, but has a pressure reducing unit that decompresses the space including the electronic component 60 and the component arrangement region 615. After the pressure is reduced, the electronic component 60 and the protective sheet 61 are pressed against each other. Thereby, there is no case where air bubbles enter between the electrode exposed surface 601 of the electronic component 60 and the protective sheet 61 and become inadequate, and there is a concern that a gap may be generated between the electrode exposed surface 601 of the electronic component 60 and the protective sheet 61, and the possibility of It is avoided that particles of the electromagnetic wave shielding film 605 adhere to the electrode 602.

The embedding processing unit 1 includes a flat surface 112 of the top portion 11 and a pressure adjustment unit that adjusts a pressure in a space on the side opposite to the flat surface 112 via the protective sheet 61. The flat surface 112 is located on the side opposite to the protective sheet 61 via the electronic component 60 and faces the electronic component 60. In addition, for example, the air hole 123, the air pressure supply hole 124, and the air pressure circuit 75 are examples of a pressure adjustment unit. This pressure adjustment unit causes the pressure between the mounting table 12 and the protective sheet 61, that is, the space on the opposite side of the protective sheet 61 and the flat surface 112 to be relatively greater than the pressure of the space between the protective sheet 61 and the flat surface 112.

As a result, the electronic component 60 and the protective sheet 61 are directed toward the flat surface 112, the flat surface 112 becomes a brake, and the electronic component 60 and the protective sheet 61 are pressed against each other. Therefore, the component arrangement region 615 of the protective sheet 61 follows the flat, and the electrode exposed surface 601 of the electronic component 60 and the protective sheet 61 are pressed against each other in a state where they have become parallel. Therefore, the room for air bubbles to enter is further lost.

The thickness of the electronic component 60 and the protective sheet 61 are not the same, and there are variations. Regardless of this thickness deviation, the pressure difference between the pressure in the closed space 14 and the pressure between the mounting table 12 and the protective sheet 61 can give the electronic components 60 and the protective sheet 61 a mutual pressing force without omission. A sufficient pressing force is surely given between each of the plurality of electrodes 602 of the plurality of electronic components 60 and the adhesive surface 611 of the protective sheet 61, and each electrode 602 of each electronic component 60 can be buried in the protective sheet 61.

In addition, the embedding processing unit 1 has a flat surface 122 of the mounting table 12, that is, a mounting surface on the opposite side to the flat surface 112 via the protective sheet 61. Then, an air hole 123 which is opened on the mounting surface and generates a negative pressure before the decompression of the closed space 14 to separate the protective sheet 61 from the flat surface 112 is formed in the mounting table 12. As a result, it is possible to prevent the electronic component 60 from being damaged due to the rapid advancement of the electronic component toward the flat surface 112 during the decompression of the closed space 14.

The air hole 113 of the top portion 11 and the air hole 123 of the mounting table 12 that press the electronic component 60 and the protective sheet 61 against each other are used as the pressure reducing portion. However, a third air hole may be separately formed in the closed space 14 to make this 3 Negative pressure is generated in the air hole to reduce the pressure.

In addition, the air hole 123 on the mounting table 12 side is reduced to generate a positive pressure after the closed space 14 has been decompressed, and the protective sheet 61 is further pressed toward the electronic component 60 blocked by the flat surface 112. As a result, the protective sheet 61 bulges together with the adhesive surface 611 in the gap between the electronic components 60, and the lower portion of the side of the electronic component 60 may be covered with the protective sheet 61. Therefore, it is possible to reliably prevent a gap from being generated between the electrode exposed surface 601 and the protective sheet 61. In addition, even for electronic parts such as SOP and QFP having thin plate-shaped electrodes on the lower side of the side, the electrode 602 is covered with the protective sheet 61 to prevent the particles of the electromagnetic wave shielding film 605 from adhering, and this film forming apparatus 7 can be applied.

In this embodiment, a negative pressure is generated in the top portion 11, and a positive pressure is generated in the mounting table 12 on the side opposite to the top portion 11 via the protective sheet 61. Firstly, the electronic component 60 and the protective sheet 61 are pressed against each other, and secondly, the adhesive surface 611 is raised in a gap between the electronic components 60 to cover the lower portion of the side surface of the electronic component 60.

However, in order to press the electronic component 60 and the protective sheet 61 against each other, a differential pressure of the above-mentioned magnitude is not necessary. The differential pressure in which the electrode 602 of the electronic component 60 is embedded in the protective sheet 61 corresponds to the softness of the protective sheet 61. Even if the side of the mounting table 12 is not converted into a positive pressure, the negative pressure ratio on the mounting table 12 side can be made. The negative pressure on the top 11 side weakens. That is, the relatively large pressure includes a case where the pressure on the top 11 side is negative and the mounting table 12 is a positive pressure including atmospheric pressure, and a case where the negative pressure on the mounting table 12 is higher than the negative pressure on the top 11 side but lower than the atmospheric pressure. As far as the top 11 side and the mounting table 12 side are concerned, it is only necessary to produce a differential pressure capable of embedding the electrode 602 in the protective sheet 61.

However, when the electronic component 60 and the protective sheet 61 are pressed by a differential pressure between the negative pressure on the top 11 side and the atmospheric pressure or a pressure exceeding the atmospheric pressure generated in the mounting table 12 on the side opposite to the top 11 across the protective sheet 61, Since a large pressing force is applied, a sufficient pressing force can be reliably given between each of the plurality of electrodes 602 of the plurality of electronic components 60 and the adhesive surface 611 of the protective sheet 61, and each electrode of each electronic component 60 can be applied. 602 is buried in the protective sheet 61.

In addition, although the protective sheet 61 is pushed up by the differential pressure, the amount of pushing up of the component arrangement area 615 is determined by the flat surface 112. That is, the amount of deformation of the protective sheet 61 is defined by the flat surface 112. Therefore, the upward thrust generated by the differential pressure is also applied to the protective sheet 61 located in the gap between the electronic components 60 in the component arrangement area 615. At this time, since the protective sheet 61 located in the gap between the electronic components 60 is not in contact with the flat surface 112, there is a decompression space above it. Therefore, the protection sheet 61 bulges together with the adhesive surface 611 of the gap portion by differential pressure, and the lower part of the side of the electronic component 60 can also be covered by the protection sheet 61.

Therefore, in this embodiment, in order to cover the lower part of the side of the electronic component 60, a negative pressure is generated in the top portion 11, a positive pressure is generated in the mounting table 12, and the component arrangement region 615 is pressed against the flat surface 112 of the top portion 11. . However, due to the flexibility of the protective sheet 61, there may be a case where the adhesive surface 611 can be applied to the electronic component 60 even if it is not a differential pressure between the pressure near the vacuum on the top 11 side and the atmospheric pressure on the mounting table 12 side or a pressure exceeding atmospheric pressure. The gap between the bulges. Therefore, in order to cover the lower portion of the side surface of the electronic component 60, it is desirable to change the mounting table 12 side to a positive pressure, but it is not necessary to adjust the mounting table 12 side to a positive pressure. That is, the differential pressure may be adjusted in accordance with the flexibility of the protective sheet 61. Due to the softness of the protective sheet 61, even after the pressure reduction on the top 11 side is completed, the pressure on the mounting table 12 side does not reach atmospheric pressure. Can reduce negative pressure.

In addition, an electromagnetic wave shielding film 605 described later can be connected to a ground wiring of the electronic component 60 to improve shielding performance. This ground wiring is a wiring for emitting unnecessary electromagnetic waves to the outside, and is usually formed on the side of the electronic component 60. It is necessary to prevent the connection of the electromagnetic wave shielding film 605 and the ground wiring from being hindered by the swell of the adhesive surface 611 reaching the lower portion of the side surface of the electronic component 60.

This embedding processing unit 1 can independently adjust the pressure on the top 11 side and the mounting table 12 side to produce a desired differential pressure. Therefore, the height of the bulge reaching the lower portion of the side of the electronic component 60 can be adjusted, and the electronic component 60 can be adjusted. The lower part of the side controls the height of the ridges to be the same. That is, the gaps reaching the electrodes 602 can be more reliably sealed by closely contacting the lower portion of the side surface to the protective sheet 61, or when the electronic component 60 is SOP or QFP, etc., the lower electrode of the side portion can be buried in the protective sheet 61 And the protection sheet 61 does not reach the ground wiring on the side surface 604 and the ground wiring is exposed.

In addition, a known mechanism can be applied to the movement mechanism of the top 11 and the movement mechanism of the putter 13. The present invention is not limited by the mechanism of the mechanism.

For example, a ball screw extending the shaft from the top 11 toward the mounting table 12 and a rail guide extending from the top 11 toward the mounting table 12 are connected to the top 11. The top portion 11 moves along the guide rail toward the mounting table in accordance with the rotation direction of the screw shaft. The ball screw and the rail guide are extended so that the top portion 11 approaches the distance from the mounting table 12 to the thickness H1 of the frame 62 of the component mounting sheet 66. In addition, the top 11 and the mounting table 12 may be moved relative to each other. Therefore, the top 11 and the mounting table 12 are not limited to those who move. The mounting table 12 may be moved, and both the top 11 and the mounting table 12 may be moved. .

In addition, the rear end portion of the push rod 13 becomes a cam follower. The cam follower is driven on the peripheral surface of the oval cam. The camshaft is supported by a rotary motor and can rotate in the circumferential direction. When the rotary motor is driven and the cam is rotated, the cam follower raises the bulging portion of the cam, the push rod 13 is pushed upward, and the front end of the push rod 13 protrudes from the insertion hole.

Furthermore, as a method for fixing the component mounting sheet 66, the frame 62 is sandwiched between the top part 11 and the mounting table 12, and the closed space 14 is formed by the top part 11 and the protection sheet 61 and the frame 62. Both positive pressure and negative pressure are selectively generated in the hole 123, but it is not limited thereto. For example, one or both of the top 11 and the mounting table 12 may be cup-shaped, and the component mounting sheet 66 may be accommodated in the internal space formed by the top 11 and the mounting table 12. It may also include a block which sandwiches the frame 62 from both sides, and the component mounting sheet 66 may be clamped by the block. In this case, the height of the frame 62 is not limited. Both the through-hole for generating a negative pressure and the through-hole for generating a positive pressure may be formed on the flat surface 122 of the mounting table 12.

(Board Mounting Section) Next, the board mounting section 2 that is responsible for the board mounting step will be described. FIG. 9 is a schematic diagram showing a configuration of the board mounting portion 2. The embedded sheet 67 produced by the embedding processing section 1 and the cooling plate 63 to which the adhesive sheet 64 has been pasted are put into the plate mounting section 2. The plate mounting portion 2 presses the embedded component piece 67 on the cooling plate 63, and also attracts the embedded component piece 67 to the cooling plate 63, so that the embedded component piece 67 is in close contact with the adhesive piece 64 via the adhesive piece 64. On the cooling plate 63.

As shown in FIG. 9, the board mounting portion 2 includes a top portion 21 and a mounting table 22. The top portion 21 is disposed to face the mounting table 22. The position of the mounting table 22 does not move. On the other hand, the top portion 21 can be raised and lowered with respect to the mounting table 22. The top portion 21 is at least close to the distance from the mounting table 22 to the thickness H1 of the frame 62 of the part-embedded piece 67.

The top portion 21 is a block having an internal space 211, and has a flat surface 212 on a surface facing the mounting table 22. The mounting table 22 has a bottomed cup shape. The opening 221 of the mounting table 22 faces the top 21. The flat surface 212 of the top portion 21 has the same size and shape as the embedded part 67 or is wider than the embedded part 67. On the other hand, the opening 221 of the mounting table 22 has an area including a part arrangement area 615 or more and a middle frame area 614 or less. An edge portion 222 of the mounting table 22 surrounding the opening 221 has a width equal to or greater than the width of the frame 62.

In this mounting table 22, the edge portion 222 supports the cooling plate 63, and the opening 221 is closed by the cooling plate 63. The surface of the cooling plate 63 opposite to the surface to which the adhesive sheet 64 is adhered abuts on the edge portion 222. Further, the component-embedded sheet 67 and the adhesive sheet 64 face each other and are placed on the cooling plate 63. An air pressure supply hole 223 is continuously formed in the bottom of the mounting table 22. The air pressure supply hole 223 is connected to a air pressure circuit 75 including a compressor, a negative pressure supply pipe, and the like (not shown). Therefore, a negative pressure is generated in the air hole 632 of the cooling plate 63 placed to block the opening 221. That is, the opening 221 functions as an air hole on the mounting surface side. In addition, the adhesive sheet 64 may be adhered to the non-adhesive surface 612 of the protective sheet 61 before being put into the board mounting portion 2.

Further, a pusher insertion hole 224 penetrating the mounting table 22 is formed in an edge portion 222 of the mounting table 22. The position of the push-rod insertion hole 224 is consistent with the push-rod insertion hole 631 of the cooling plate 63. When a part 67 is placed on one side, the guide insertion hole 621 of the frame 62 is avoided. And the position blocked by the frame 62. The push rod 23 is inserted into the push rod insertion hole 224. The push rod 23 can pass through the mounting table 22, the cooling plate 63, and the adhesive sheet 64.

The push rod 23 is provided with rigidity, the number, and the arrangement interval to the extent that the component-embedded pieces 67 are separated from the cooling plate 63 and can be supported in parallel in a state where they have protruded from the cooling plate 63. For example, when the outer shape of the frame 62 is rectangular, it is arrange | positioned as a rod body corresponding to each corner of the frame 62. The push rod insertion holes 224 are also provided corresponding to the number and positional relationship of the push rods 23.

Then, a plurality of air holes 213 leading to the internal space 211 are provided on the flat surface 212 of the top portion 21. The range of the air holes 213 is the same in size and shape as the inside of the frame 62 of the part-embedded sheet 67, or at least the same in size and shape as the parts arrangement area 615. When the part-embedded piece 67 has been placed on the mounting table 22, the position where the air holes 213 are arranged is the position covered by the part arrangement area 615 (see (a) in FIG. 10).

In the internal space 211 of the top portion 21, a pressure supply hole 214 is continuously formed in a portion different from the flat surface 212. The air pressure supply hole 214 is connected to a air pressure circuit 75 including a compressor, a positive pressure supply pipe, a negative pressure supply pipe, and the like (not shown). Therefore, a positive pressure and a negative pressure are selectively generated in the air hole 213 through the air pressure supply hole 214 and the internal space 211. That is, the internal space 211, the flat surface 212, the air hole 213, the air pressure supply hole 214, and the air pressure circuit 75 of the top portion 21 have a function as a protective sheet holding portion and a function as a positive pressure portion. When the air pressure circuit 75 generates a negative pressure in the air hole 213, it functions as a protective sheet holding portion, and when the air pressure circuit 75 generates a positive pressure in the air hole 213, it functions as a positive pressure portion.

Further, an O-ring 215 is provided on the flat surface 212 of the top portion 21 along the frame 62 of the component-embedded piece 67 placed on the mounting table 22 so as to surround the continuous range of the air hole 213. That is, the outer peripheral portion of the flat surface 212 of the top portion 21 presses the frame 62 via the O-ring 215 and presses the outer peripheral portion of the protective sheet 61 against the cooling plate 63. That is, the top portion 21 functions as a pressing portion that presses the outer peripheral portion of the protective sheet 61 against the cooling plate 63.

(A) to (e) in FIG. 10 show a flow of operations of such a board mounting portion 2. (A) to (e) in FIG. 10 are transition diagrams schematically showing states of the board mounting portion 2 in each step. First, as shown in FIG. 10 (a), the top portion 21 is first separated from the mounting table 22. A cooling plate 63 is placed on the mounting table 22 in advance. In addition, first, the push rod 23 penetrates the cooling plate 63 and the adhesive sheet 64 and protrudes toward the top portion 21. In this state, the frame 62 of the part-embedded sheet 67 is aligned with the pusher 23, and the part-embedded sheet 67 is supported by the pusher 23. Then, the top portion 21 is lowered toward the push rod 23, and the frame 62 of the embedded piece 67 is sandwiched between the top portion 21 and the push rod 23.

At this time, the height H1 from the surface of the component arrangement region 615 to the upper surface of the frame 62 is higher than the height H2 from the surface of the component arrangement region 615 to the top surface 603 of the electronic component 60. Therefore, when the frame 62 has been sandwiched, the top surface 603 of the electronic component 60 does not reach the flat surface 212 of the top 21. Therefore, at least the component arrangement area 615 is enclosed in the closed space 24 a formed by the top portion 21, the protection sheet 61, and the frame 62 and sealed by the O-ring 215.

When the component arrangement area 615 is enclosed in the closed space 24 a, a negative pressure is generated in the flat surface 212 of the top portion 21. The electronic component 60 is attracted to the flat surface 212. The part-embedded piece 67 generates strain in the middle frame area 614, and the entire area of the part arrangement area 615 is attracted to the flat surface 212 in a flat state. Therefore, the parts arrangement region 615 does not flex like a bend, and the buried electrode 602 does not detach from the protective sheet 61. In addition, on the flat surface 212 of the top portion 21, in order not to cause the electronic component 60 to protrude toward the flat surface 212 swiftly, it is preferable to gradually reduce the pressure to generate a negative pressure. The magnitude of the negative pressure at this time is set in the control unit 74 in advance. Considering the relationship with the decompression of the closed space 24b described later, a pressure close to vacuum (zero air pressure) is preferred.

Then, as shown in FIG. 10 (b), the push rod 23 and the top portion 21 are lowered toward the mounting table 22 at an equal speed. Then, the area of the frame 62 in which the component is embedded in the sheet 67 is brought into contact with the adhesive sheet 64 on the cooling plate 63. Further, by moving the top portion 21 toward the mounting table 22 and pressing, the area of the frame 62 is adhered to the adhesive sheet 64. At the point when the area of the frame 62 of the part embedded sheet 67 has been brought into contact with the adhesive sheet 64 on the cooling plate 63, the negative pressure of the top part 21 is maintained, and the part embedded sheet 67 is attracted to the flatness of the top part 21. The surface 212 is not in contact with the adhesive sheet 64 (separated state).

Here, when a negative pressure is not generated in the top portion 21, the part-embedded sheet 67 contacts the adhesive sheet 64 in the presence of air. Therefore, there is a concern that air bubbles enter between the embedded sheet 67 and the adhesive sheet 64. When bubbles enter, the heat transfer area reaching the cooling plate 63 decreases, and the heat radiation effect of the electronic component 60 during film formation decreases. However, in this board mounting portion 2, in the presence of air, the component-embedded sheet 67 is raised in a direction away from the adhesive sheet 64, so the entry of air bubbles is prevented.

When the frame 62 is in close contact with the adhesive sheet 64 via the protective sheet 61, the non-adhesive surface 612 of the protective sheet 61 and the adhesive sheet 64 side of the cooling plate 63 are sealed and formed by the protective sheet 61 and the cooling plate 63 and the frame 62. Enclosed space 24b. When the closed space 24 b is formed, as shown in FIG. 10 (c), the negative pressure is also generated in the mounting table 22 while the negative pressure of the top portion 21 is maintained. In other words, the closed space 24 b is decompressed in a state where the outer peripheral portion (outer frame region 613) of the protective sheet 61 has been pressed by the top portion 21. Through the air holes 632 of the cooling plate 63 and the air holes 632 of the adhesive sheet 64, the closed space 24 b between the cooling plate 63 and the protective sheet 61 provided with the adhesive sheet 64 is decompressed. That is, in the plate mounting portion 2, the air holes 632 of the cooling plate 63 and the air holes 632 of the adhesive sheet 64 function as plate-side air holes. At this time, the negative pressure generated in the mounting table 22 is a negative pressure slightly closer to the atmospheric pressure than the negative pressure generated in the top portion 21, and it is preferable to set the size to maintain the adsorption of the electronic component 60 to the top portion 21. This negative pressure is set in the control section 74 in advance.

When the decompression of the sealed space 24b between the cooling plate 63 and the protective sheet 61 provided with the adhesive sheet 64 toward the negative pressure set in advance is completed, as shown in (d) of FIG. In a negative pressure state, the negative pressure of the top portion 21 is gradually changed to a positive pressure. In other words, the holding of the protective sheet 61 using the top portion 21 is released while the decompression of the closed space 24b is maintained. The component embedded sheet 67 is slowly attracted and lowered toward the adhesive sheet 64. In addition, the component embedded sheet 67 is pressed downward, and the component embedded sheet 67 is pressed against the adhesive sheet 64 adhered to the cooling plate 63. The component-embedded sheet 67 is mounted on the cooling plate 63 via the adhesive sheet 64.

In addition, when the negative pressure on the mounting table 22 side and the negative pressure on the top 21 side are set to be the same or substantially the same, the protective sheet 61 elastically contracts, and the protective sheet 61 contacts the adhesive sheet 64. Therefore, the negative pressure on the mounting table 22 side may be the same as or substantially the same as the negative pressure on the top 21 side, and the negative pressure on the top 21 side may be gradually changed to a positive pressure after having been brought into contact.

Finally, as shown in (e) of FIG. 10, the top portion 21 is moved to be separated from the mounting table 22, thereby removing the clamp after the embedded parts 67, the adhesive sheet 64, and the cooling plate 63 have overlapped. Into. This completes the production of the component mounting board 68 including the electronic component 60, the protective sheet 61, the adhesive sheet 64, and the cooling plate 63. In addition, the positive pressure generated in the top portion 21 and the negative pressure generated in the mounting table 22 may be released within a period during which the top portion 21 is separated from the mounting table 22.

That is, the top portion 21, the push rod 23, and the mounting table 22 are driving portions for bringing the component-embedded pieces 67 and the cooling plate 63 closer. The top portion 21 and the mounting table 22 serve as fixing portions for sandwiching the embedded parts 67 and the cooling plate 63, and also serve as pressing portions for pressing the frame 62 and the cooling plate 63 to bring them into close contact. In addition, the air pressure supply hole 223 of the mounting table 22 serves as a pressure reduction section that decompresses the closed space 24 b between the component-embedded piece 67 and the cooling plate 63. In addition, the air hole 213 of the top portion 21 serves as a pressure reducing portion that decompresses the closed space 24 a between the flat surface 212 of the top portion 21 and the component-embedded piece 67.

The flat surface 212 of the top portion 21 becomes an isolating member and a pressing member that generates a negative pressure before the decompression between the part-embedded sheet 67 and the cooling plate 63, thereby maintaining the part-embedded sheet 67, and prevent air bubbles from entering between the part-embedded sheet 67 and the cooling plate 63. The pressing member serves as a positive pressure part and interacts with the suction using the negative pressure of the mounting table 22 to make the part buried by the positive pressure. The insert sheet 67 is in close contact with the cooling plate 63. In addition, the mounting table 22 is an adsorption member that causes the component-embedded piece 67 to closely contact the cooling plate 63 by the negative pressure and the pressing by the positive pressure of the top portion 21.

In this way, the board mounting portion 2 adheres the protective sheet 61 in which the electrode 602 of the electronic component 60 is embedded to the cooling plate 63. This plate mounting portion 2 has a top portion 21 as a pressing portion that presses an outer peripheral portion such as the frame 62 of the protective sheet 61 against the cooling plate 63, and also has a pressure reduction function for reducing the space between the parts arrangement area 615 and the cooling plate 63. Decompression section. In addition, in a state where the decompression by the decompression section is performed, the plate mounting section 2 presses the protective sheet 61 and the cooling plate 63 to each other via the adhesive sheet 64. This prevents the air bubbles from entering between the protective sheet 61 and the cooling plate 63 and allows them to be in close contact with each other, and the heat transfer area to the cooling plate 63 can be sufficiently secured.

In addition, the plate mounting portion 2 has air on the flat surface 212 of the top portion 21, that is, the side opposite to the cooling plate 63 via the protection sheet 61, and sucks the protection sheet 61 upward by negative pressure to separate the cooling plate 63 from the protection sheet 61.孔 213。 Hole 213. The flat surface 212 having the air hole 213 serves as a protective sheet holding portion, so that when the pressing portion brings the outer peripheral portion of the protective sheet 61 into contact with the cooling plate 63, the area where the electronic parts 60 are arranged in the protective sheet 61 and the cooling plate 63 separate the way to hold the protective sheet 61. In addition, the negative pressure is maintained before the pressure is reduced between the component-embedded pieces 67 and the cooling plate 63 by the pressure reducing unit, and the holding is released when the pressure has been reduced. This can prevent the sticking of the protection sheet 61 and the cooling plate 63 in a state where the decompression is not completed, further reduce the worry of air bubbles entering between the protection sheet 61 and the cooling plate 63, and sufficiently ensure that Heat transfer area.

In addition, before the air hole 213 opened on the flat surface 212 of the top portion 21 descends from the pusher 23 and the top portion 21 abuts on the mounting table 22 via the frame 62 of the part-embedded sheet 67, the part is embedded from the sheet. Before the 67 and the cooling plate 63 approach, a negative pressure is generated at the latest from the time before the space between the cooling plate 63 and the protection sheet 61 provided with the adhesive sheet 64 is formed. This can prevent the protective sheet 61 from sticking to the cooling plate 63 by mistake before the pusher 23 provided with the protective sheet 61 (the component-embedded sheet 67) starts to descend.

The board mounting portion 2 has a flat surface 212 on the top portion 21. This flat surface 212 is located on the side opposite to the cooling plate 63 via the protective sheet 61 and faces the electronic component 60. An air hole 213 that separates the cooling plate 63 from the protection plate 61 before the decompression between the component-embedded piece 67 and the cooling plate 63 ends, opens on this flat surface 212. Therefore, during the decompression process, the protection sheet 61 will not be bent and flexed due to the pressure difference between the front and back of the protection sheet 61, which can make the protection sheet 61 follow flat, and can prevent the electronic parts 60 from protecting The state of peeling on the sheet 61.

The air hole 213 on the top 21 side serves as a positive pressure part. After the pressure between the part-embedded piece 67 and the cooling plate 63 has reached a predetermined set value, the pressure is changed from a negative pressure to a positive pressure, and the cooling plate 63 Press the protective sheet 61. That is, the air hole 213 serves as an isolation and holding portion of the protection sheet 61 and the cooling plate 63, a pressure reducing portion that decompresses the closed space 24a, and a positive pressure portion that generates a positive pressure, and also serves as the Press the part. However, the functions of the isolating member, the decompression member, and the close contact member may be realized by air holes provided in other members.

For example, as in this embodiment, an air hole 632 is first provided in the cooling plate 63. The plate mounting section 2 includes a mounting table 22 on which the cooling plate 63 is mounted and a negative pressure is generated. Further, the protection sheet 61 may be attracted to the cooling plate 63 through the mounting table 22 on which the cooling plate 63 is placed and the air holes 632 of the cooling plate 63.

In addition, the movement mechanism of the top 21 and the movement mechanism of the putter only need to adopt a well-known mechanism, and the present invention is not limited by the mechanism of the mechanism.

For example, a ball screw extending the shaft from the top 21 toward the mounting table 22 and a rail guide extending from the top 21 toward the mounting table 22 are connected to the top 21. In this case, the top portion 21 moves toward the mounting table 22 along the guide rail in accordance with the rotation direction of the screw shaft. The ball screw and the rail guide are extended so that the top portion 21 approaches the distance from the mounting table 22 to the thickness H1 of the frame 62 of the part-embedded piece 67.

In addition, the rear end portion of the push rod 23 becomes a cam follower. The cam follower is driven on the peripheral surface of the oval cam. The camshaft is supported by a rotary motor and can rotate in the circumferential direction. When the rotary motor is driven and the cam is rotated, the cam follower raises the bulging portion of the cam, and the push rod 23 is pushed upward.

Furthermore, as a method for forming the closed space 24a and the closed space 24b, the embedded parts 67 and the cooling plate 63 may not be formed as one element of the forming member, but may be formed by the top portion 21 and the mounting table 22. For example, one or both of the top portion 21 and the mounting table 22 may be cup-shaped, and may be accommodated in a space formed by the top portion 21 and the mounting table 22 so as to include the embedded parts 67 and the cooling plate 63. Inside, the front and back of the component-embedded piece 67 are divided by the top portion 21 and the mounting table 22. However, in this case, it is desirable that the top portion 21 is a side wall extending up from the flat surface 212 surrounding the opening of the air hole 213 toward the mounting table 22. This side wall is in close contact with the flat surface of the mounting table 22 to form a closed space. The O-ring 215 is first disposed on an end surface of the side wall.

(Film Forming Process Section) Next, the film forming process section 3 that performs a film forming step will be described. 11A and 11B are schematic diagrams showing a configuration of the film formation processing section 3. The film formation processing unit 3 forms an electromagnetic wave shielding film 605 on each electronic component 60 on the component mounting board 68 by sputtering. As shown in FIGS. 11A and 11B, the film formation processing unit 3 includes a chamber 31 and a load-lock chamber 32. The chamber 31 is a cylindrical vacuum chamber whose diameter is enlarged toward the radial direction closer to the axial direction. The inside of the chamber 31 is partitioned into a plurality of fan-shaped regions by partitions 33 extending in the radial direction. The processing position 311 and the film formation position 312 are allocated to a part of a fan-shaped area.

The partition 33 extends from the top surface to the bottom surface of the chamber 31, but does not reach the bottom surface. A turntable 34 is provided in the bottom surface-side space without the partition 33. The turntable 34 has a disc shape coaxial with the chamber 31 and rotates in a circumferential direction. The component mounting plate 68 introduced into the chamber 31 from the sampling chamber 32 is placed on the turntable 34, and while rotating around the circular track, it surrounds the processing position 311 and the film forming position 312.

In addition, in order to maintain the position of the component mounting plate 68 with respect to the rotary table 34, the rotary table 34 is provided with a holding component mounting plate 68 such as a groove, a hole, a protrusion, a clamp, a holder, a mechanical chuck, or an adhesive chuck, for example. Holding parts.

A surface processing unit 35 is provided at the processing position 311. A process gas such as argon is introduced into the surface treatment unit 35, and the process gas is plasmatized by the application of a high-frequency voltage to generate electrons, ions, and radicals. For example, the surface treatment section 35 is a cylindrical electrode opened on the turntable 34 side, and a high-frequency voltage is applied by a radio frequency (RF) power source.

At the film formation position 312, a target 361 constituting the sputtering source 36 is provided, and a sputtering gas is introduced as an inert gas such as argon. The sputtering source 36 applies electric power to the target 361 to plasmatize the sputtering gas, and collide the generated ions and the like with the target to eject particles. The target 361 includes a material of the electromagnetic wave shielding film 605. That is, the particles of the electromagnetic wave shielding film 605 are ejected from the target 361, and the particles of the electromagnetic wave shielding film 605 that have been ejected are deposited on the electronic component 60 on the turntable 34.

For example, the film forming position 312 is provided at two locations. The target material of each film formation position 312 may be the same material or different materials to form the laminated electromagnetic wave shielding film 605. As a power source for applying power to the sputtering source 36 of each film formation position 312, for example, a well-known power source such as a direct current (DC) power source, a DC pulse power source, or an RF power source can be applied. In addition, a power source for applying power to the sputtering source 36 may be provided for each sputtering source 36, or a common power source may be switched and used by a switcher.

In such a film forming processing unit 3, the electronic component 60 is etched or the ashed surface is cleaned and roughened at the processing position 311 to improve the adhesion of the electromagnetic wave shielding film 605 to the electronic component 60. The particles of the target 361 are deposited on the electronic component 60 at the film formation position 312, and an electromagnetic wave shielding film 605 is formed on the electronic component 60. The electrode 602 is buried in the protective sheet 61, and the electrode exposed surface 601 is in close contact with the protective sheet 61, so that particles of the electromagnetic wave shielding film 605 are prevented from adhering to the electrode 602, and particles of the electromagnetic wave shielding film 605 are prevented from entering the electrode exposed surface 601 and Protective sheet 61. Furthermore, the heat of the electronic component 60 is conducted to the cooling plate 63, and excessive heat storage of the electronic component 60 is suppressed.

In addition, the film formation processing unit 3 is a person who forms a film on the electronic component 60 by a sputtering method, but the film formation method is not limited to this. For example, the film formation processing unit 3 may form the electromagnetic wave shielding film 605 on the electronic component 60 by vapor deposition, spray coating, coating, or the like.

(Board Release Unit) Next, the board release unit 4 that performs the board release process will be described. FIG. 12 is a schematic diagram showing a configuration of the board release section 4. After the electromagnetic wave shielding film 605 is formed, the component mounting plate 68 is put into the plate release portion 4. As a first step for obtaining each electronic component 60, the board release portion 4 peels off the component-embedded piece 67 from the cooling plate 63.

As shown in FIG. 12, the plate release portion 4 includes a top portion 41 and a mounting base 42. The top portion 41 is disposed to face the mounting table 42. The position of the mounting table 42 does not move. On the other hand, the top 41 can be raised and lowered with respect to the mounting table 42. The top portion 41 is at least close to the distance from the mounting table 42 to the thickness H1 of the frame 62 of the component mounting plate 68.

The top portion 41 is a block having an internal space 411 and has a flat surface 412 on a surface facing the mounting table 42. The mounting table 42 has a bottomed cup shape, and the opening 421 faces the top 41. The flat surface 412 of the top portion 41 has the same size and shape as the component mounting plate 68 or is wider than the component mounting plate 68. On the other hand, the opening 421 of the mounting table 42 has an area including a part arrangement area 615 or more and a middle frame area 614 or less. An edge portion 422 of the mounting table 42 surrounding the opening 421 has a width equal to or greater than the width of the frame 62.

In this mounting table 42, the edge portion 422 supports the component mounting plate 68, and the opening 421 is closed by the component mounting plate 68. The cooling plate 63 side is in contact with the edge portion 422. An air pressure supply hole 423 is continuously formed in the bottom of the mounting table 42. The air pressure supply hole 423 is connected to a air pressure circuit 75 including a compressor, a positive pressure supply pipe, and the like, not shown in the figure. Therefore, a positive pressure is generated in the air hole 632 of the component mounting plate 68 which is blocked by the opening 421.

Further, a pusher insertion hole 424 penetrating the mounting table 42 is provided in an edge portion 422 of the mounting table 42. The position of the push rod insertion hole 424 is consistent with the push rod insertion hole 631 of the cooling plate 63. When the component mounting plate 68 is placed on one side, the guide portion insertion hole 621 of the frame 62 is avoided, and The position where the frame 62 is blocked. The push rod 43 is inserted into the push rod insertion hole 424. The push rod 43 moves in the axial direction so that the front end may protrude to a position higher than the frame 62 of the component mounting plate 68 already placed on the mounting table 42.

The push rod 43 peels off the component mounting plate 68 from the cooling plate 63 to resist the adhesive force of the outer frame region 613 and the adhesive sheet 64, isolates the component mounting plate 68 from the cooling plate 63, and can lift and support the component mounting in parallel The degree of rigidity, the number, and the positional relationship of the plates 68 are set. For example, when the outer shape of the frame 62 is rectangular, it is arrange | positioned as a rod body corresponding to each corner of the frame 62. The push rod insertion holes 424 are also provided corresponding to the number and positional relationship of the push rods 43.

In addition, a pair of clamping blocks 44 are arranged on both sides of the mounting table 42. The clamping block 44 clamps only the cooling plate 63 of the component mounting plate 68 placed on the mounting table 42. That is, the pair of clamping blocks 44 are arranged at the same height as the cooling plate 63 placed on the mounting table 42 and have the same thickness as the cooling plate 63. The clamping blocks 44 can be brought into contact with and separated from each other with the cooling plate 63 as the center. However, the clamping block 44 does not move in a direction in which the top portion 41 is aligned with the mounting table 42.

Then, a plurality of air holes 413 leading to the inner space 411 are provided on the flat surface 412 of the top 41. The range in which the air holes 413 extend is the same size and shape as the inside of the frame 62 of the protective sheet 61, or at least the same size and shape as the parts arrangement area 615. When the component mounting plate 68 has been placed on the mounting table 42, the position where the air holes 413 are arranged is the position covered by the component arrangement area 615.

In the internal space 411 of the top portion 41, a pressure supply hole 414 is continuously formed in a portion different from the flat surface 412. The air pressure supply hole 414 is connected to a air pressure circuit 75 including a compressor, a negative pressure supply pipe, and the like (not shown). Therefore, a negative pressure is generated in the air hole 413 through the air pressure supply hole 414 and the internal space 411.

Furthermore, on the flat surface 412 of the top portion 41, an O-ring 415 is provided along the frame 62 of the component mounting plate 68 placed on the mounting table 42 so as to surround the entire range of the air holes 413. In addition, an edge portion facing the frame 62 in the flat surface 412 of the top portion 41 functions as a fixing portion that presses a portion of the protective sheet 61 that is separated from the component arrangement area 615 where the electronic components 60 are arranged. This fixing portion presses the protective sheet 61 over the entire area of the edge portion facing the frame 62, that is, presses the frame 62 over the entire area, but it is not necessary to press over the entire area, and there may be a part where it is not pressed.

(A) to (e) in FIG. 13 show a flow of operations of such a board release unit 4. (A) to (e) in FIG. 13 are transition diagrams schematically showing the states of the board release unit 4 in each step. First, as shown in FIG. 13 (a), the top portion 41 is separated from the mounting base 42, and the push rod 43 is first buried in the push rod insertion hole 424 of the mounting base 42. Then, the component mounting plate 68 is placed on the mounting table 42. When the component mounting plate 68 is placed, the cooling plate 63 is first fixed by the clamping block 44.

Next, as shown in FIG. 13 (b), the top portion 41 is lowered toward the mounting table 42, and the flat surface 412 of the top portion 41, that is, the fixed portion is brought into contact with the frame 62 of the component mounting plate 68. At this time, the height H1 from the surface of the component arrangement region 615 to the upper surface of the frame 62 is higher than the height H2 from the surface of the component arrangement region 615 to the top surface 603 of the electronic component 60. Therefore, when the frame 62 has been sandwiched, the top surface 603 of the electronic component 60 does not reach the flat surface 412 of the top 41. Therefore, at least the component arrangement area 615 is enclosed in the closed space 45 formed by the top portion 41, the protection sheet 61, and the frame 62 and sealed by the O-ring 415.

When the parts arrangement area 615 is enclosed in the closed space 45, as shown in FIG. 13 (c), a negative pressure is generated in the top portion 41 and a positive pressure is generated in the mounting table 42. Accordingly, a force sucked upward toward the flat surface 412 of the top portion 41 and a force pushed away from the mounting table 42 and pushed upward toward the flat surface 412 facing the top portion 41 act on the component arrangement region 615 inside the frame 62. By this upward suction and upward thrust, a force sufficient to peel off the component arrangement region 615 from the cooling plate 63 acts on the component arrangement region 615, and the component arrangement region 615 peels off from the cooling plate 63. The magnitude of the negative pressure of the top portion 41 and the positive pressure of the mounting table 42 at this time are set in the control unit 74 in advance.

At the time when the component arrangement area 615 is peeled off, the protection sheet 61 is flat without strain, so the momentum of the component arrangement area 615 toward the flat surface 412 of the top 41 is small, and the electronic part 60 is prevented from peeling off the protection sheet 61 or the electronic part 60 The state of flight from the protective sheet 61. In case the part arrangement area 615 peels off rapidly, the flat surface 412 of the top 41 is also controlled, and the electronic part 60 is blocked by the flat surface 412. Therefore, the electronic part 60 may peel off from the protective sheet 61 or fall off from the protective sheet 61 cut back.

In order to further improve the effect of reducing the fear of peeling or peeling of the electronic component 60 from the protective sheet 61, it is preferable that the top surface 603 and the flat surface 412 of the electronic component 60 are in a state before the protective sheet 61 is peeled from the cooling plate 63. The interval is extremely small. Therefore, the interval between the top surface 603 and the flat surface 412 of the electronic component 60 is preferably set to the minimum necessary interval for peeling the protective sheet 61 from the cooling plate 63.

In addition, the air holes 632 functioning as a positive pressure may be gradually increased with respect to the plurality of air holes 632 of the cooling plate 63, for example, the air holes 632 functioning as a positive pressure may extend from one end of the cooling plate 63. The openings 421 of the mounting table 42 are inserted into the openings 421 of the mounting table 42 in a manner that the portion increases toward the other end, or the range of the air holes 632 functioning as a positive pressure gradually expands from the air holes 632 on the center side toward the outer peripheral side. The space is divided into a plurality of spaces, etc., and a plurality of systems for generating positive pressure are provided. With this arrangement, the part arrangement area 615 can be prevented from peeling off from the cooling plate 63 at a time, and the electronic component 60 can be prevented from violently protruding toward the flat surface 412 of the top portion 41.

In addition, if the part arrangement area 615 is peeled off, the electronic component 60 abuts on the flat surface 412 of the top 41, and the protection sheet 61 is only bent in the middle frame area 614, and at least the part arrangement area 615 remains flat. In other words, if the flat surface 412 of the top portion 41 does not exist, the protective sheet 61 is bent so as to contain air. As a result, there is a concern that the electronic component 60 is peeled from the protective sheet 61, but the component arrangement region 615 is kept flat, so that the peeling of the electronic component 60 is suppressed.

When the part arrangement area 615 is peeled from the cooling plate 63, as shown in FIG. 13 (d), the push rod 43 is passed through the push rod insertion hole 424 of the mounting table 42 and the push rod insertion hole 631 of the cooling plate 63. And the pusher of the adhesive sheet 64 is inserted into the through hole 631 and contacts the frame 62 through the protective sheet 61. Then, the push rod 43 is further advanced, and at the same time, the top portion 41 is separated from the mounting base 42 at the same speed as the push rod 43. Since the cooling plate 63 is held in place by the clamping block 44, the outer frame region 613 to which the frame 62 is adhered is also peeled from the cooling plate 63, and the entire protective sheet 61 is peeled from the cooling plate 63.

At this time, the positive pressure of the mounting table 42 and the negative pressure of the top portion 41 are maintained. Therefore, the part arrangement region 615 hangs down on the cooling plate 63 due to its own weight, and the state where the part is again attached is suppressed. In addition, the positive pressure of the mounting table 42 is maintained, thereby also assisting the peeling of the outer frame region 613 to which the frame 62 is adhered from the cooling plate 63.

Finally, as shown in (e) of FIG. 13, the pusher 43 is stopped, and the top portion 41 is further moved away from the mounting table 42, and thereby the clamping of the part-embedded piece 67 is released, Peeling of the protective sheet 61 from the cooling plate 63 is completed. It should be noted that the positive pressure of the mounting table 42 and the negative pressure of the top portion 41 may be released within this period.

That is, the top portion 41 becomes a fixing portion that presses the frame 62 that has been disengaged from the parts arrangement region 615 and is in place. In addition, the air pressure supply hole 423 of the mounting table 42 becomes a positive pressure generation hole, and the part arrangement area 615 is pressurized by the air hole 632 of the cooling plate 63, and the part arrangement area 615 is removed from the cooling plate 63 earlier than the frame 62. The pressure parts are peeled off. The air hole 413 of the top portion 41 becomes a negative pressure generating hole, and becomes a suction member that attracts the part arrangement region 615 and helps to peel off from the cooling plate 63.

In addition, the flat surface 412 of the top portion 41 serves as a blocking member that prevents the electronic component 60 from peeling or falling off from the protective sheet 61 when the component arrangement area 615 is peeled off, and further becomes a flattening of the protective sheet 61 and suppresses the electronic component 60 from the protective sheet. 61 peeling flattening part. The push rod 43 becomes an upper member that has peeled the frame 62 from the cooling plate 63 after the part arrangement region 615 has been peeled.

In this manner, after the film-forming step has been performed, the plate release portion 4 removes the cooling plate 63. The plate release portion 4 includes a mounting table 42 having a positive pressure generating hole using the air pressure supply hole 423 as an example, and a fixing portion using the top portion 41 as an example. The positive pressure generating hole faces the cooling plate 63 to generate a positive pressure. During the period in which the part arrangement area 615 is pressurized by the positive pressure of the mounting table 42, the fixing portion first presses a part of the protection sheet 61 that is separated from the part arrangement area 615, such as the frame 62. After leaving on 63, release the pressure.

Thereby, the protection sheet 61 is kept flat when the part arrangement region 615 is peeled off, so that the situation in which the part arrangement region 615 jumps due to the protection sheet 61 returning to a flat reaction is avoided. Therefore, the electronic component 60 is suppressed from peeling off from the protective sheet 61 and falling off.

More specifically, when a positive pressure is supplied from the plurality of air holes 632 provided in the cooling plate 63 in a range corresponding to the middle frame region 614 and the parts arrangement region 615, the protective sheet 61 starts to cool from the positive pressure. The board 63 is peeled. The peeling portion of the protective sheet 61 thus generated is gradually expanded and connected to the outside with the starting point gradually peeled off due to the positive pressure of continued supply. Finally, the peeling portion reaches the boundary between the outer frame region 613 and the middle frame region 614 which is the inner edge of the frame 62 pressed by the fixing portion, and the part arrangement region 615 and the middle frame region 614 of the protective sheet 61 are completely removed from the cooling plate 63. Ground separation. At this time, the boundary portion of the outer frame region 613 and the middle frame region 614 that the peeling portion of the protective sheet 61 finally reaches is pressed by the flat surface 412 as a fixed portion via the frame 62, so that even the parts arrangement region 615 and the middle frame region 614 are prevented. It has been peeled off, which also causes the protective sheet 61 to jump rapidly.

In addition, the outer frame region 613 is pressed by the flat surface 412 as a fixing portion through the frame 62, thereby preventing the positive pressure from leaking between the protective sheet 61 and the cooling plate 63. Therefore, the entire part arrangement region 615 can be reliably and stably peeled off. under. This can prevent the electronic component 60 from peeling off from the protective sheet 61 and falling off.

In addition, the plate release portion 4 has a flat surface 412 of the top portion 41 separated from the protection sheet 61 on the top portion 41 side, that is, on the side opposite to the cooling plate 63 with the protection sheet 61 interposed therebetween. While the parts arrangement area 615 is being pressurized, this flat surface 412 first presses the bulged part of the parts arrangement area 615. As a result, the component arrangement region 615 is flat, and the electronic component 60 can be more reliably prevented from peeling off. In addition, if the part arrangement region 615 jumps up, the flat surface 412 also blocks the electronic component 60, so that the electronic component 60 can be further suppressed from peeling off and falling off from the protective sheet 61.

In addition, the plate release portion 4 has a negative pressure generating hole that generates a negative pressure so as to face the protective sheet 61. As an example, the flat surface 412 of the top portion 41 is provided with an air hole 413 for generating a negative pressure. As the part arrangement area 615 is pressurized by the air hole 632, the air hole 413 attracts the protective sheet 61. Therefore, the protection sheet 61 can be peeled off from the cooling plate 63 by applying pressure to the component arrangement region 615, and it is difficult to cause peeling errors.

The plate release unit 4 includes a pusher 43. This pusher 43 advances in the cooling plate 63 after the part arrangement area 615 has separated from the cooling plate 63, and pushes the pressed part such as the frame 62 in a direction away from the cooling plate 63. Thereby, after the part arrangement area 615 has been peeled off, the entire protective sheet 61 can be peeled off. In addition, when the fixed portion using the top portion 41 as an example is released, it may be separated from the protective sheet 61 as the pusher 43 advances.

In addition, the movement mechanism of the top 41, the movement mechanism of the clamping block 44, and the movement mechanism of the push rod 43 only need to adopt a well-known mechanism, and the present invention is not limited by the mechanism mechanism.

For example, a ball screw extending the shaft from the top 41 toward the mounting table 42 and a rail guide extending from the top 41 toward the mounting table 42 are connected to the top 41. In this case, the top portion 41 moves along the guide rail toward the mounting table 42 in the rotation direction of the screw shaft. The ball screw and the rail guide are extended so that the top portion 41 approaches the distance from the mounting table 42 to the thickness H1 of the frame 62 of the component mounting plate 68.

Further, on the outer side of the clamping block 44, the circumferential surface of the oval cam is first brought into contact with the pair of clamping blocks 44 individually. The camshaft is supported by a rotary motor and can rotate in the circumferential direction. When the rotary motor is driven and the cam rotates, the bulging portion of the cam hits the clamping block 44, and the clamping block 44 is pushed in the direction of the cooling plate 63 to clamp the cooling plate 63.

In addition, the rear end portion of the push rod 43 becomes a cam follower. The cam follower is driven on the peripheral surface of the oval cam. The camshaft is supported by a rotary motor and can rotate in the circumferential direction. When the rotary motor is driven and the cam is rotated, the cam follower raises the bulging portion of the cam, and the push rod 43 is pushed upward.

In addition, the plate release portion 4 releases the protective sheet 61 from the cooling plate 63 by generating a positive pressure on the mounting table 42. The flat surface 412 of the top portion 41 has the additional function of flattening the peeled protective sheet 61, and the air hole 413 opened in the flat surface 412 of the top portion 41 also has the additional function of helping to use the pressure of the mounting table 42. Therefore, as shown in FIG. 14, the top portion 41 may have a square tube shape with the opening edge abutting on the frame 62, and the flat surface 412 may be omitted. In addition, as shown in FIG. 15, the air hole 413 may be omitted from the flat surface 412 of the top portion 41.

(Peeling Processing Unit) Finally, the peeling processing unit 5 that performs the component peeling step will be described. FIG. 16 is a schematic diagram showing a configuration of the peeling processing section 5. The embedded sheet 67 in which the cooling plate 63 has been removed through the board release section 4 is put into the peeling processing section 5 and each electronic component 60 is peeled from the protective sheet 61 as a final stage. In addition, when the peeling processing part 5 is separated from the film-forming apparatus 7, it may be called a peeling processing apparatus.

As shown in FIG. 16, the peeling processing unit 5 includes a mounting table 51 on which the parts have been embedded in the sheet 67, a chuck 52 that holds the protection sheet 61 and moves continuously, and a guide part 53 that holds the protection sheet 61. The end portion creates an opportunity for the chuck 52 to hold the protective sheet 61; the sheet stopper 54 makes a peeling base point of the protective sheet; and the part stopper 55 prevents the electronic component 60 from floating.

The mounting table 51 includes a flat surface 511 on which the component-embedded piece 67 is mounted. The component-embedded sheet 67 orients the electronic component 60 toward the flat surface 511, the top surface 603 of the electronic component 60 contacts the mounting surface, and the protective sheet 61 faces upward. The flat surface 511 includes a non-slip member having an adhesive force, and the blocking property of the electronic component 60 is improved. In addition, the outer peripheral region of the flat surface 511 is obtained by subtracting the height H2 from the surface of the part arrangement region 615 to the top surface 603 of the electronic component 60 by the height H1 from the surface of the part arrangement region 615 to the end face of the frame 62. The depth of the height is dug down to allow the frame 62 to enter, and the electronic component 60 is placed on the flat surface 511 while the protection sheet 61 remains flat.

The mounting table 51 is a block having an internal space 512. On the flat surface 511 of the mounting table 51, a plurality of air holes 513 are continuously formed in a region facing the component arrangement region 615. The air hole 513 communicates with the internal space 512 of the mounting table 51. In the internal space 512 of the mounting table 51, a pressure supply hole 514 is continuously formed in a portion different from the flat surface 511. The air pressure supply hole 514 is connected to a air pressure circuit 75 including a compressor, a negative pressure supply pipe, and the like, not shown in the figure. Therefore, a negative pressure is generated in the air hole 513 through the air pressure supply hole 514 and the internal space 512.

The chuck 52 is a pair of blocks with the holding surfaces facing each other. A pair of blocks can be contacted and separated. The chuck 52 is supported by a moving device that is movable in the horizontal and vertical directions, and moves continuously along the protective sheet 61 placed on the flat surface 511 of the mounting table 51 at an angle of attack of 45 degrees with respect to the flat surface 511. That is, the chuck 52 moves away from the mounting table 51 while moving vertically on the flat surface 511 of the mounting table 51. The so-called continuous movement does not include stopping on the way, and ideally moves at a constant speed. The movement range of the chuck 52 is from the end of the protective sheet 61 which has been made a grip to the end opposite to this end.

The sheet stopper 54 is a cylindrical body having a long axis that traverses one side of the protective sheet 61 and is capable of rotating the shaft. The sheet stopper 54 may be formed of a metal such as stainless steel. When the length of the transverse protection sheet 61 is about 200 mm to 300 mm, the diameter of the sheet stopper 54 may be set to 5 mm to about 10 mm. In this embodiment, a cylindrical body made of stainless steel having a diameter of 6 mm is used.

The sheet stopper 54 maintains a fixed height with the flat surface 511 of the mounting table 51 as a reference, and maintains the protective sheet 61 placed on the mounting table 51 in a direction orthogonal to the long axis directly below the chuck 52. Move up and down. The arrangement height of the sheet stopper 54 is the same as the height obtained by combining the electronic component 60 other than the electrode 602 with the protective sheet 61. That is, the sheet stopper 54 moves while pressing the non-adhesive surface 612 of the protective sheet 61. The degree of pressing is set to such an extent that the electrode 602 is not damaged, the electrode 602 is not rubbed, or the electrode 602 is not crushed. The movement range of the sheet stopper 54 is to set the edge of the guide portion 53, that is, the edge of the guide portion insertion hole 621 of the frame 62 as a base point to the opposite end of the protective sheet 61.

The component stopper 55 is a cylindrical body having a long axis that traverses at least the entire area of the component arrangement region 615 of the protection sheet 61 and is capable of rotating the shaft. The component stopper 55 may be formed of a metal such as stainless steel. The diameter of the part stopper 55 may be determined by considering the diameter of the sheet stopper 54 and the size of the electronic component 60, but if it is set to a smaller diameter than the sheet stopper 54, it can be closer to the sheet stopper. The moving part 54 is arranged. In the present embodiment, a cylindrical body made of stainless steel having the same diameter as the sheet stopper 54 is used.

This part stopper 55 is arranged so as to be able to approach and separate from the sheet stopper 54. While the chuck 52 and the sheet stopper 54 are moving vertically on the mounting table 51, the component stopper 55 follows the sheet stopper 54 at a fixed distance. The fixed distance is less than the length of the electronic component 60 (the length in the moving direction of the component stopper 55) adhered to the protective sheet 61. When the chuck 52 and the sheet stopper 54 are located at the end of the mounting table 51, the component stopper 55 is kept at a distance from the sheet stopper 54 so as to be located on the opposite bank with the guide portion insertion hole 621 therebetween.

The guide portion 53 is arranged at the same position as the shaft of the guide portion insertion hole 621 of the frame 62. The front end of the guide portion 53 faces the guide portion insertion hole 621 of the frame 62. This guide portion 53 is movable in the axial direction, protrudes toward the end of the protection sheet 61, and pushes the end of the protection sheet 61 upward toward the chuck 52. Before the end of the protection sheet 61 reaches the chuck 52, The guide is inserted into the through hole 621 and advanced. This guide portion 53 lifts off one side of the protective sheet 61 by lifting. Therefore, the guide insertion hole 621 has a pin shape, and is provided at a plurality of locations along one side of the protective sheet 61.

For example, as shown in FIG. 17, the position where the guide-portion insertion hole 621 is provided is a position separated at equal intervals across the center of one side of the frame 62. A guide portion 53 is provided corresponding to this guide portion insertion hole 621, and the guide portion 53 is formed in a round rod shape. Then, the chuck 52 and the sheet stopper 54 are vertically moved in a direction orthogonal to one side of the frame 62, and the electronic component 60 is peeled from the protective sheet 61.

(A) to (f) in FIG. 18 show the flow of the operation of such a peeling processing unit 5. (A) to (f) in FIG. 18 are transition diagrams schematically showing the states of the peeling processing unit 5 in each step. First, as shown in FIG. 18 (a), in a state where the top surface 603 of the electronic component 60 is in contact with the flat surface 511, the component-embedded sheet 67 is placed on the mounting table 51. That is, an inversion device is provided between the plate releasing portion 4 and the peeling processing portion 5 to reverse the parts that have been separated from the cooling plate 63 in the plate releasing portion 4 by embedding the sheet 67 up and down, and to reverse the parts. The embedded sheet 67 is loaded on the mounting table 51 in a reversed state. A negative pressure is generated in the air hole 513 of the mounting table 51, and the electronic component 60 is sucked on the flat surface 511 first. The sheet stopper 54 is moved to the edge of the guide insertion hole 621 of the frame 62, and the chuck 52 is positioned directly above the guide insertion hole 621 of the frame 62. The component stopper 55 is first pulled apart from the sheet stopper 54, and the component stopper 55 is positioned outside the guide insertion hole 621 of the frame 62.

As shown in FIG. 18 (b), the guide portion 53 is moved upward in the axial direction. The guide portion 53 moves in the guide portion insertion hole 621 of the frame 62 and reaches the end portion of the protection sheet 61 adhered to the frame 62. The guide portion 53 is further advanced so that an end portion of the protection sheet 61 protrudes in a direction away from the frame 62. As a result, the end of the protective sheet 61 starts to peel off due to the guide portion 53. When the guide portion 53 advances further, the end portion of the protective sheet 61 is sandwiched by the guide portion 53 and the sheet stopper 54, and is guided toward the chuck 52. In addition, when the end portion of the protection sheet 61 is being guided by the guide portion 53, the chuck 52 may be moved toward the end portion of the protection sheet 61 to meet the end portion of the protection sheet 61.

As shown in FIG. 18 (c), when the end of the protection sheet 61 reaches the chuck 52, a pair of blocks are closed, and the end of the protection sheet 61 is held by the chuck 52. When the chuck 52 holds the end of the protection piece 61, as shown in FIG. 18 (d), the guide portion 53 is buried in the guide portion insertion hole 621 of the frame 62, and then the part stopper portion 55 is moved. Then, the component stopper 55 and the sheet stopper 54 are brought closer to a distance less than the length of the electronic component 60.

As shown in FIG. 18 (e), the chuck 52 and the sheet stopper 54 are moved along the protection sheet 61, and the chuck 52 is lifted. The end of the protection sheet 61 is held by the chuck 52, and the sheet stopper 54 moves on the protection sheet 61. Therefore, the protection sheet 61 is lifted by the chuck 52 with the sheet stopper 54 as a base point, and the electronic part 60 is peeled from the protective sheet 61 with the sheet stopper 54 as a base point. When the peeled protective sheet 61 is peeled while maintaining the vertical state, for example, the speed component of the horizontal movement and the vertical movement of the chuck 52 may be kept the same. If the speed components of the horizontal movement and the vertical movement are the same, even if the movement speed is changed, the peeling can be continuously performed as long as the stopping is not stopped, but the movement speeds of the horizontal movement and the vertical movement are preferably maintained at a fixed speed.

At this time, as shown in FIG. 19, if the peeling of the electronic component 60 from the protective sheet 61 proceeds, only the end of the electronic component 60 is sandwiched between the sheet stopper 54 and the flat surface 511 of the mounting table 51. State, the electronic component 60 is going to float up by lifting the peeling start end 60a. However, the component stopper 55 follows the sheet stopper 54. This part stopper 55 presses the side of the peeling start end 60a to be floated. Therefore, the electronic component 60 is prevented from floating, and the gap 94 between the electrode 602 and the protective sheet 61 that has been peeled off from the protective sheet 61 continues to exist. The electronic part 60 is not attached again and is maintained on the flat surface of the mounting table 51. 511 on. Further, since the sheet stopper portion 54 is a roller capable of rotating the shaft, the sheet stopper portion 54 is rotated when the electronic component 60 is pressed, and friction with the electronic component 60 is suppressed.

The sheet stopper 54 moves while pressing the non-adhesive surface 612 of the protective sheet 61. Therefore, until the peeling of the electronic component 60 starts, and only the end portion of the electronic component 60 in the peeling process is sandwiched between the sheet stopper 54 and the flat surface 511 of the mounting table 51, the sheet is prevented from stopping. The portion 54 also follows the peeled protective sheet 61 of the electronic component 60. However, from the viewpoint of exerting the function of producing the peeling base point by the sheet stopper 54, the sheet stopper 54 does not necessarily have to move while pressing the non-adhesive surface 612 of the protective sheet 61. In other words, the sheet stopper 54 may be moved at a position slightly separated from the protective sheet 61.

Further, as shown in FIG. 18 (f), when the chuck 52 and the sheet stopper 54 have completely cut off the component arrangement area 615 of the protective sheet 61, all the electronic components 60 are peeled from the protective sheet 61. And arranged on the flat surface 511 of the mounting table 51. By recovering this electronic component 60, the formation of the electromagnetic wave shielding film 605 in the film forming apparatus 7 is completed. In addition, the chuck 52 vertically cuts the flat surface 511 of the mounting table 51 and is not limited to an angle of attack of 45 degrees from the mounting table 51. The position of the chuck 52 may be fixed, and the mounting table 51 may be continuously moved to peel off the protective sheet 61, or both the chuck 52 and the mounting table 51 may be movable. That is, the chuck 52 and the mounting table 51 may be moved relatively.

Here, FIG. 25 is a schematic diagram showing a configuration of a conventional top-up device. This top-up device is a device which peels off the electronic component 60 from the adhesive film 9 which has flexibility and tackiness like the protective sheet 61, and includes the pin body 8 which can move to an axial direction. An adhesive film 9 to which the electronic component 60 is adhered is provided at the tip of the pin body 8. The pin body 8 presses the adhesive film 9 upward from the surface opposite to the adhesion surface of the electronic component 60. The pin body 8 deforms the adhesive film 9 into a mountain shape with the electronic component 60 to be peeled as a vertex. Therefore, the adhesion area between the electronic component 60 and the adhesive film 9 is reduced, so that the electronic component 60 is peeled from the adhesive film 9.

FIG. 26 is a schematic diagram showing a state of peeling of the electronic component 60 using the top device. As shown in FIG. 26, a plurality of electronic components 60 are provided with a gap and adhered to the adhesive film 9. From the viewpoint of production efficiency, the interval between the electronic components 60 adhered to the adhesive film 9 is narrow. Therefore, if one electronic component 60 is lifted upward, the strain of the adhesive film 9 also spreads to the adhesion area of the adjacent electronic component 60. Then, during the period when the peeling object is lifted upward, a part of the adjacent electronic component 60 is also peeled off from the adhesive film 9 to generate a peeling portion 91. However, when the peeling of the peeling object is completed, the pin body 8 is retracted in the axial direction, so that the deflection of the adhesive film 9 is eliminated. Then, the adhesive film 9 is adhered to the peeling part 91 again, and a re-attachment part 92 of the adhesive film 9 is generated in the electronic component 60.

Then, FIG. 27 is a photograph showing the state of the electrode 602 after the adhesive film 9 is attached to the electronic component 60 again. As shown in FIG. 27, if the adhesive film 9 is attached again, the adhesive film 9 may be generated in the electrode 602 in some cases. Residue 93. Residues 93 of the adhesive film 9 may be burned and carbonized during reflow when the electronic component 60 is packaged, which may cause poor connection and the like.

On the other hand, FIG. 20 is a photograph obtained by photographing the electrode 602 after the electronic component 60 is peeled from the protective sheet 61 by the peeling processing section 5. According to this peeling processing section 5, the flatness of the protective sheet 61 is always maintained by the sheet stopper 54. Once the protective sheet 61 is peeled off, the protective sheet 61 can be prevented from returning to the electronic component 60 and reattaching. In addition, the position of the electronic component 60 is fixed by the component stopper 55 and the air hole 513 of the mounting table 51, and it is also possible to prevent the floating from occurring if it catches up with the protection sheet 61 and attaches again. As a result, as shown in FIG. 20, no residue of the protective sheet 61 was observed on the electrode 602 of the electronic component 60.

In this way, after the film formation by the film formation processing section 3, the peeling processing section 5 peels off the electronic component 60 from the protective sheet 61. This peeling processing section 5 includes a mounting table 51, a chuck 52, and a fixing section that fixes the position of the electronic component 60. The mounting table 51 supports the electronic components 60 adhered to the protection sheet 61. The chuck 52 holds an end portion of the protection sheet 61 and relatively moves relative to the mounting table 51, and continuously peels off the protection sheet 61 toward the opposite end of the end portion. When the electronic component 60 is peeled from the protective sheet 61, the fixing portion fixes the position of the electronic component 60. This prevents the electronic component 60 and the protective sheet 61 from being attached again after peeling, and it is possible to suppress the occurrence of residues 93 of the protective sheet 61 in the electronic component 60.

The fixing portion is, for example, a component stopper 55 or a flat surface 511 of the mounting table 51 provided with an air hole 513. The component stopper 55 follows the electronic component 60 with a distance of less than the length of the electronic component 60 with respect to the sheet stopper 54 and presses the electronic component 60 upward. The mounting table 51 sucks the electronic component 60 and floats while holding it. However, as long as the mounting table 51 has a function as a fixing portion, suction by the air hole 513 may not be used. For example, the mounting table 51 may be an adhesive chuck, an electrostatic chuck, or a mechanical chuck as long as the electronic component 60 can be fixed.

In addition, it includes a guide portion 53 that protrudes toward an end portion of the protection sheet 61. The chuck 52 is located at the protruding destination of the guide portion 53 before holding the end portion of the protection sheet 61. This guide portion 53 faces the chuck 52 and guides the end of the protective sheet 61 toward the chuck 52. Thereby, an opportunity for holding the chuck 52 can be manufactured, and the possibility of erroneous peeling of the electronic component 60 and the protective sheet 61 can be reduced.

A sheet stopper 54 including a base point that moves along the protective sheet 61 together with the chuck 52 is manufactured. The sheet stopper portion 54 is located near the protruding destination of the guide portion 53, and grips the end portion of the protective sheet 61 from which the guide portion 53 has been peeled together with the guide portion 53, and guides it toward the chuck 52. Accordingly, the chuck 52 can more surely hold the end portion of the protection sheet 61, and the possibility of erroneous separation of the electronic component 60 and the protection sheet 61 can be reduced.

The sheet stopper 54 has been described using a cylindrical body having an axis orthogonal to the moving direction of the sheet stopper 54 as an example. However, the sheet stopper 54 may be moved while pressing the protective sheet 61. It is a plate or block. In addition, although the part stopper 55 was demonstrated using the cylindrical body which has an axis orthogonal to the moving direction of this part stopper 55 as an example, it can also be a plate-shaped body, a block, or a brush. When the component stopper 55 is a cylindrical body, since it is a roller capable of rotating a shaft, it rotates when the electronic component 60 is pressed, and friction with the electronic component 60 is suppressed.

As long as the operation mechanism of the chuck 52, the operation mechanism of the sheet stopper 54, the operation mechanism of the part stopper 55, and the operation mechanism of the guide 53 are well-known, the present invention is not limited by the mechanism.

For example, the chuck 52 may adopt the following operation mechanism. That is, the two blocks are supported by the base, and the block on one side becomes immobile with respect to the base. The block on the other side becomes movable relative to the block on one side. The oval cam abuts on the outside of the block that becomes movable. If this cam is rotated and the block hangs within the range of the long diameter, it will become a movable block that is held by the cam and approaches the immovable block. In addition, a compression spring is provided between the pair of blocks, and the biasing force is applied in a direction of increasing the distance between the pair of blocks. If this cam is rotated and the block dangles within the short-diameter range, the movable block becomes detached from the block which is immovable due to the force applied by the compression spring.

In addition, for example, a ball screw and a guide rail extending at an angle of 45 degrees with respect to the flat surface 511 of the mounting table 51 are provided. The base of the chuck 52 is fixed to the slider of the ball screw, and the guide rail is held. When the screw shaft of the ball screw is rotated by a motor, the chuck 52 moves from one end of the mounting table 51 to the other end along the guide rail.

Further, as for the part stopper 55, a tension spring is interposed between the base supporting the part stopper 55 and the sheet stopper 54 and applied in a direction to approach the part stopper 55 and the sheet stopper 54. An elliptical cam is arranged between the base of the support part stopper 55 and the sheet stopper 54 in a state in which the long diameter range of the cam abuts on the base, and resists the force applied by the tension spring. A force is applied in a direction to separate the component stopper 55 from the sheet stopper 54.

In addition, the rear end portion of the guide portion 53 becomes a cam follower. The cam follower is driven on the peripheral surface of the oval cam. The camshaft is supported by a rotary motor and can rotate in the circumferential direction. When the rotary motor is driven and the cam is rotated, the cam follower raises the bulging portion of the cam, and the guide portion 53 is pushed upward.

In addition, the position where the guide-portion insertion hole 621 is provided is a position separated at equal intervals across the center of one side of the frame 62. This makes it easy to peel off the entire edge of the protective sheet 61. A guide portion 53 is provided corresponding to this guide portion insertion hole 621, and the guide portion 53 is formed in a round rod shape. Then, the chuck 52 and the sheet stopper 54 are vertically cut in a direction orthogonal to one side of the frame 62, and the electronic component 60 is peeled from the protective sheet 61. The peeling treatment portion 5 is not limited to this, and various shapes of guide portion insertion holes and guide portions may be used. In addition, the peeling direction may adopt various directions.

For example, as shown in FIG. 21, the guide part 53 which has a long rectangular cross section, an ellipse, and a rectangular cross section at the front end along one side of the frame 62 may be used. According to this guide portion 53, since the range in which the protection sheet 61 protrudes is widened, the protection sheet 61 is easily rolled up, and the end of the protection sheet 61 easily reaches the chuck 52. In addition, as shown in FIG. 22, a cutout 622 including an arrangement region of the guide portion 53 may be formed in the frame 62 instead of the guide portion insertion hole 621. Further, as shown in FIG. 23, the guide insertion hole 621 may be disposed at a corner of the frame 62, and the corner of the frame 62 may be used as a peeling start point, so that the chuck 52 and the sheet stopper 54 face each other. Angular movement, peeling along the diagonal of the protective sheet 61.

(Other Embodiments) The present invention is not limited to the above-mentioned embodiments, and includes the following aspects. That is, as shown in FIG. 24, the film-forming apparatus 7 may further include the transfer part 71 which performs a component mounting process. The transfer unit 71 is responsible for a component mounting step, and transfers the electronic component 60 from the tray on which the electronic component 60 before the film forming process is placed to the component unmounted sheet 65. For example, it is sufficient to arrange the tray and the component non-mounting sheet 65 adjacently, and set the transfer section 71 as a robot that can move horizontally and vertically within a range including the tray and the component non-mounting sheet 65. A robot chuck is first provided with, for example, a vacuum chuck. The transfer unit 71 generates a negative pressure on the tray to hold the electronic component 60, releases the negative pressure in the vacuum failure or the atmospheric opening on the part unmounted sheet 65, and arranges the electronic part 60 on the part unmounted sheet 65. on.

In addition, although the film forming apparatus 7 is a device including an embedding processing section 1, a plate mounting section 2, a film forming processing section 3, a plate release section 4, and a peeling processing section 5, each of the sections may be used independently. The device is configured and systemized. That is, the embedding processing section 1 may be an independent embedding processing device, the board mounting section 2 may be an independent board mounting device, the film forming processing section 3 may be an independent film forming processing device, and the board releasing section 4 may also be It may be an independent board release device, and the peeling processing unit 5 may be an independent peeling processing device.

In the embodiment, the height H1 from the surface of the component arrangement region 615 to the upper end surface of the frame 62 is set to be higher than the height H2 from the surface of the component arrangement region 615 to the top surface of the electronic component 60. , But is not limited to this, and may be lower than the height H2. In this case, the areas facing the parts arrangement area 615 on the flat surface 112, the flat surface 212, and the flat surface 412 of the top 11, top 21, and top 41 may be formed by recessing only the difference between the allowable height H1 and the height H2. It is sufficient that the confined space 14, the confined space 24 a, and the confined space 45 can be formed.

As mentioned above, although the embodiment of this invention and the modification of each part were demonstrated, the said embodiment or the modification of each part is shown as an example, and it does not intend to limit the scope of the invention. These new embodiments can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments or modifications thereof are included in the scope or spirit of the invention, and are included in the invention described in the scope of patent application.

1‧‧‧ Buried Processing Department

11‧‧‧Top

111‧‧‧Internal space

112‧‧‧ flat surface

113‧‧‧air hole

114‧‧‧Air pressure supply hole

115‧‧‧O-ring

12‧‧‧mounting table

121‧‧‧ Internal space

122‧‧‧ flat surface

123‧‧‧air hole

124‧‧‧Air pressure supply hole

125‧‧‧Push rod through hole

13‧‧‧Put

14‧‧‧ Confined space

2‧‧‧ board mounting section

21‧‧‧Top

211‧‧‧Internal space

212‧‧‧ flat surface

213‧‧‧air hole

214‧‧‧Air pressure supply hole

215‧‧‧O-ring

22‧‧‧mounting table

221‧‧‧ opening

222‧‧‧Edge

223‧‧‧Air pressure supply hole

224‧‧‧Push rod insertion hole

23‧‧‧Put

24a‧‧‧Confined space

24b‧‧‧Confined space

3‧‧‧Film forming treatment department

31‧‧‧ chamber

311‧‧‧Processing position

312‧‧‧film forming position

32‧‧‧Sampling room

33‧‧‧ partition

34‧‧‧Turntable

35‧‧‧Surface treatment department

36‧‧‧Sputtering Source

361‧‧‧ target

4‧‧‧ Board release department

41‧‧‧Top

411‧‧‧Internal space

412‧‧‧ flat surface

413‧‧‧air hole

414‧‧‧Air pressure supply hole

415‧‧‧O-ring

42‧‧‧mounting table

421‧‧‧ opening

422‧‧‧Edge

423‧‧‧Air pressure supply hole

424‧‧‧Push rod insertion hole

43‧‧‧Put

44‧‧‧ clamping block

45‧‧‧ Confined space

5‧‧‧ Stripping Department

51‧‧‧mounting table

511‧‧‧ flat surface

512‧‧‧internal space

513‧‧‧air hole

514‧‧‧Air pressure supply hole

52‧‧‧Chuck

53‧‧‧Guide

54‧‧‧ Sheet stop roller (sheet stop)

55‧‧‧Part stop roller (part stop section)

60‧‧‧Electronic parts

60a‧‧‧ stripping start

601‧‧‧ electrode exposed surface

602‧‧‧ electrode

603‧‧‧Top

604‧‧‧ side

605‧‧‧electromagnetic wave shielding film

61‧‧‧protective film

611‧‧‧ Adhesive surface

612‧‧‧Non-adhesive surface

613‧‧‧Outer frame area

614‧‧‧Middle frame area

615‧‧‧Part arrangement area

62‧‧‧Frame

621‧‧‧ guide hole

622‧‧‧ incision

63‧‧‧ cooling plate

631‧‧‧Push rod through hole

632‧‧‧air hole

64‧‧‧ Adhesive sheet

65‧‧‧ Parts have not been placed

66‧‧‧ Parts have been placed

67‧‧‧ parts are buried

68‧‧‧Part mounting board

7‧‧‧Film forming device

71‧‧‧Transfer Department

73‧‧‧Transportation Department

74‧‧‧Control Department

75‧‧‧Pneumatic circuit

8‧‧‧ pin body

9‧‧‧ adhesive film

91‧‧‧ peeling part

92‧‧‧Reattachment site

93‧‧‧ residue

94‧‧‧ Clearance

H2‧‧‧ height

H1‧‧‧height (thickness)

FIG. 1 is a side view showing an electronic component subjected to a film forming process. FIG. 2 is a side view showing a state of an electronic component subjected to a film forming process. 3 is an exploded perspective view showing a state of an electronic component when subjected to a film forming process. FIG. 4 is a transition diagram showing a film forming process flow of an electronic component. FIG. 5 is a block diagram showing a configuration of a film forming apparatus. FIG. 6 is a schematic diagram showing a configuration of an embedded processing unit. (A) to (g) in FIG. 7 are transition diagrams schematically showing states of the embedding processing unit in each step. FIG. 8 is an enlarged view of electronic parts embedded in a processing unit. FIG. 9 is a schematic diagram showing a configuration of a board mounting portion. (A) to (e) in FIG. 10 are transition diagrams schematically showing states of the board mounting portion in each step. 11A and 11B are schematic diagrams showing a configuration of a film formation processing section. FIG. 12 is a schematic diagram showing a configuration of a board release section. (A) to (e) in FIG. 13 are transition diagrams schematically showing states of the board release section in each step. FIG. 14 is a schematic diagram showing another configuration of the board release section. FIG. 15 is a schematic diagram showing still another configuration of the board release section. FIG. 16 is a schematic diagram showing a configuration of a peeling processing section. FIG. 17 is a view showing an upper surface of a part-embedded sheet in a peeling processing section. FIG. (A) to (f) in FIG. 18 are transition diagrams schematically showing states of the peeling processing section in each step. FIG. 19 is a schematic diagram showing a form in which the electronic component is prevented from floating. FIG. 20 is a photograph obtained by photographing an electrode after peeling an electronic component from a protective sheet by a peeling processing unit. FIG. 21 is a plan view showing another embodiment of a part-embedded sheet in the peeling processing section. FIG. FIG. 22 is a plan view showing still another embodiment of a part-embedded sheet in the peeling processing section. FIG. FIG. 23 is a plan view showing still another embodiment of a part-embedded sheet in the peeling processing section. FIG. FIG. 24 is a block diagram showing another configuration of the film forming apparatus. FIG. 25 is a schematic diagram showing a configuration of a conventional top-up device. FIG. 26 is a schematic diagram showing the top of an electronic component in a conventional top device. FIG. 27 is a photograph showing a state of an electrode after the adhesive film is attached to the electronic component again.

Claims (5)

A film-forming device is a film-forming device using a protective sheet in which electronic parts are arranged, and a cooling plate, characterized in that it includes: a board mounting portion, and the protective sheet is adhered to the cooling plate; and The film processing unit deposits a film-forming material on the electronic parts on the cooling plate to form a film by sputtering. The plate mounting portion includes a pressing portion that presses an outer peripheral portion of the protection sheet on the cooling plate. The cooling plate; a protection sheet holding portion, so that when the pressing portion makes the outer peripheral portion of the protection sheet have contacted the cooling plate, the area where the electronic parts are arranged in the protection sheet The cooling sheet is separated to hold the protective sheet; and a decompression section, in a state where the outer peripheral portion of the protective sheet is pressed against the cooling sheet by the pressing part, The space between the cooling plates is decompressed; in a state where the space between the protection sheet and the cooling plate has been decompressed, the protection sheet holding portion releases the holding of the protection sheet. The film forming apparatus according to item 1 of the scope of patent application, wherein the protective sheet holding portion is provided on a side opposite to the cooling plate via the protective sheet, and includes a suction mechanism for generating a negative pressure upward. The protection sheet is a flat surface of an air hole separating the cooling plate from the protection sheet, and the air hole is located between the protection sheet and the cooling plate through the decompression section. The negative pressure is maintained until the space is decompressed to a preset pressure. The film forming apparatus according to item 2 of the scope of patent application, further comprising: a positive pressure portion having the air hole, and generating a positive pressure in the air hole, and the protection has been passed through the decompression portion. After the space between the sheet and the cooling plate is decompressed to a preset pressure, the air hole is changed from generating a negative pressure to generating a positive pressure, thereby giving the protective sheet a pressing force toward the cooling plate. pressure. The film forming device according to any one of claims 1 to 3, wherein the cooling plate has plate-side air holes penetrating both sides of the plate, and the decompression portion has a mounting surface, The cooling plate is placed on the side opposite to the protective sheet across the cooling plate; and an air hole on the placement surface side is provided on the placement surface and generates a negative pressure; The front-side air holes and the plate-side air holes attract the protection sheet to the cooling plate. The film forming apparatus according to item 2 of the scope of patent application, wherein the plate mounting portion has a driving portion that brings the protection sheet close to the cooling plate, and the air hole extends from the protection sheet to the A negative pressure is generated before the cooling plate approaches.