CN102005395B - Vacuum mounting method and device - Google Patents
Vacuum mounting method and device Download PDFInfo
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- CN102005395B CN102005395B CN 201010180889 CN201010180889A CN102005395B CN 102005395 B CN102005395 B CN 102005395B CN 201010180889 CN201010180889 CN 201010180889 CN 201010180889 A CN201010180889 A CN 201010180889A CN 102005395 B CN102005395 B CN 102005395B
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Abstract
The invention provides a mounting part in simple construction capable of well mounting a cutting belt even though a waver is very thin. In an airtight chamber capable of forming a vacuum environment and also being open for the atmosphere, a mounting part (130) of any shape selected from a slice shape, a film shale and a belt shape and a part to be mounted (200) are separated off by a micro clearance to be opposite with each other. At the state, the airtight chamber is separated into mutually independent two chambers (C1,C2) by the mounting part (13). In the two chambers, the first chamber (C2) of the part to be mounted is at the reduced pressure state and the pressure of another second chamber (C1) is higher than that of the first chamber (C2). Using the pressure difference of two chambers, the mounting part (13) is pressed and mounted at the side of the part to be mounted (200).
Description
Technical field
The present invention relates to the mounted member of arbitrary shape in sheet, membranaceous, the band shape under the state of vacuum decompression, mount as workpiece by the vacuum mounting method on the mounted member and device.As workpiece, such as the plate-shaped member that is semiconductor wafer, liquid crystal glass, solar cell, printed base plate etc.As mounted member; representational have cutting belt (DC band) on the one side that before cutting, mounts the plate-shaped members such as semiconductor wafer in the operation, chip attachment film (DAF) band, grinding back surface with protection (BG) band, protection solar cell, liquid crystal with the film of glass, printed base plate, sheet material etc., its kind is not limit.
Background technology
For example, in semiconductor wafer manufacturing process, after the front operation that wafer has been implemented exposure-diffusion-etching etc. is processed, wafer is cut into chip size.
Among Fig. 4 (1), expression when mounting cutting belt 2 on the wafer 1, a representational example before.The face (the following side among Fig. 4 (1)) of the circuit formation side of wafer 1 in advance protected band (BG band) 4 is covered with.Boundary belt 4 is used for preventing that wafer from producing warpage because of slimming in manufacturing process.
Forming on the face (upper face side among Fig. 4 (1)) of face opposition side with circuit of wafer 1, mount cutting belt 2.Cutting belt 2 mounting on the wafer 1 is performed such: with the plus-pressure of roller 5 keeping circular cutting belt 2 (the seeing Fig. 5) crimping of tension force to mount on the one side of wafer 1 by circular cutting rack 3.Then, peel off boundary belt 4, shown in Fig. 4 (2), carry out cutting action with cutter 6.The 400th, work supporting block.
Fig. 5 forms the floor map that the face side is seen the state of Semiconductor bonding on cutting belt 2 after the cutting from the circuit of semiconductor chip.
When mounting cutting belt on the wafer with this roller pressuring method, owing to be the plus-pressure that wafer is applied machinery, so, can expect that wafer can produce the damage of cracking, crackle etc.Especially in recent years, because wafer is reduced to 50 μ m even the such as thin as a wafer change of 10 μ m from 350 μ m thickness, so the cutting belt attaching method that carries out with the roller pressuring method is difficult to reply.
For this reason, in recent years, propose to change the pressuring method of machinery, and utilized the little vacuum of damage/atmospheric pressure differential the mounted member of band etc. to be mounted mode on the workpiece (by mounted member) of wafer etc.For example, the disclosed technology of patent documentation 1 to 3 (TOHKEMY 2006-310338, TOHKEMY 2005-129678 communique, TOHKEMY 2005-26377 communique) is, with flexure strip airtight space is divided into upper space and lower space, on elasticity is unilateral, by orientation tool mounting wafer, the such mounted member of configuration cuts band above this flexure strip, make upper space become vacuum, lower space becomes atmospheric state, utilize its pressure reduction, make flexure strip and wafer servo-actuated in the cutting belt side, wafer is mounted on the cutting belt.
In addition, for example the disclosed technology of TOHKEMY 2005-135931 communique is, at vacuum chamber, plate object (workpiece: by mounted member) and band (mounted member) are disposed in opposite directions, by the 1st elastomer, with push part (piston) supporting plate object, utilize the vacuum environment of above-mentioned vacuum chamber and at the atmospheric pressure reduction of this vacuum chamber opposition side effect, this push part is pushed away toward the top, like this, plate object and band are crimped on the 2nd elastomer, band is mounted on the plate-shaped member.
[patent documentation]
[patent documentation 1]: TOHKEMY 2006-310338
[patent documentation 2]: TOHKEMY 2005-129678 communique
[patent documentation 3]: TOHKEMY 2005-26377 communique
[patent documentation 4]: TOHKEMY 2005-135931 communique
Summary of the invention
Above-mentioned utilizes pressure official post flexure strip servo-actuated, with workpiece mount with on mode in, must have special-purpose flexure strip at sealed chamber, and, on elasticity is unilateral, the work-piece locating tool that has descended very large time that the workpiece location and installation of wafer etc. is used need to be arranged.In addition, utilizing pressure differential, with the push part of piston etc. workpiece and band be crimped in the mode on the elastomer, owing to adopt the mechanical plus-pressure that has utilized piston, so, dual elastomeric construction that must configuration buffering usefulness.
Vacuum mounting device provided by the invention and method; do not need above-mentioned dedicated elas-tic sheet, dual elastomeric construction; can mount band (DC band, DAF band, BG band) vacuum on the wafer of the such fragility of MEMS (Micro Electro Mechanical System Micro Electro Mechanical System) wafer, high protruding wafer, the compound semiconductor of as thin as a wafer wafer, 3 dimension structures; in addition, also can corresponding solar cell, printed base plate, liquid crystal be with the diaphragm of glass, sealing resin film etc.
To achieve these goals, the substantially following formation of technical scheme of the present invention.
(1) vacuum mounting method, it is characterized in that, have following steps: at the sealed chamber that can form vacuum environment and atmosphere opening, mount the in opposite directions configuration that separated by mounted member with gap of object the mounted member of arbitrary shape in sheet, membranaceous, the band shape with as it, under this state, via above-mentioned mounted member this sealed chamber is separated into two separate chambers; Make the above-mentioned Room the 1st by mounted member that disposing among above-mentioned two chambers become decompression state, make the pressure of the above-mentioned Room the 1st of pressure ratio of the opposing party Room the 2nd high; Utilize the pressure differential of these two chambers, above-mentioned mounted member crimping is mounted on by the mounted member side.
(2) as a preferred implementation, provide following vacuum mounting method.
Vacuum mounting method is characterized in that, adopts placement equipment body, cover and pressure control mechanism; Above-mentioned placement equipment body has parts installation portion and position control mechanism, above-mentioned parts installation portion is in opposite directions state ground installation the mounted member of arbitrary shape in the sheet that is being supported by skirt, membranaceous, the band shape with as what it mounted object by mounted member, above-mentioned position control mechanism makes above-mentioned mounted member and separated the position of controlling these parts under the minim gap ground state in opposite directions at above-below direction by mounted member; Above-mentioned cover, can be openedly and closedly be that sealed chamber is closed with the space of above-mentioned parts installation portion, inner face has sealing ring; Above-mentioned pressure control mechanism is controlled the pressure of above-mentioned sealed chamber; Above-mentioned vacuum mounting method has following steps: with above-mentioned pressure control mechanism above-mentioned sealed chamber decompression is become vacuum environment; Under above-mentioned vacuum environment, using rheme puts controlling organization and makes above-mentioned mounted member and separated minim gap ground in opposite directions by mounted member, under this state, the above-mentioned skirt of above-mentioned mounted member is joined with the sealing ring that is located at above-mentioned cover inner face, via this mounted member above-mentioned sealed chamber is separated into by these two chambers, Room the 2nd of the inner face side of Room the 1st of mounted member installation side and above-mentioned cover; Keep and disposing above-mentionedly by the decompression state of the above-mentioned Room the 1st of mounted member among above-mentioned two chambers, make the opposing party's the pressure of the above-mentioned Room the 1st of pressure ratio of above-mentioned Room the 2nd high; Utilize the pressure differential of these two chambers, above-mentioned mounted member crimping is mounted on by the mounted member side.
(3) in addition, the device as being used for above-mentioned vacuum mounting method has proposed following apparatus.
The vacuum mounting device has: by mounted member installation portion, mounted member installation portion, two Room separating mechanism and pressure control mechanisms; Above-mentionedly be used for to be installed by mounted member by the mounted member installation portion; Above-mentioned mounted member installation portion be used for to be installed the mounted member of sheet, membranaceous, the arbitrary shape of band shape; Above-mentioned two Room separating mechanisms, at the sealed chamber that can form vacuum environment and atmosphere opening, make and above-mentionedly separated minim gap ground in opposite directions by mounted member and above-mentioned mounted member, under this state, via above-mentioned mounted member this sealed chamber is separated into two separate chambers, and, make the above-mentioned Room the 1st that is arranged in these two chambers by mounted member; Above-mentioned pressure control mechanism after vacuum state is reduced pressure in above-mentioned two chambers, makes the pressure height of the above-mentioned Room the 1st of pressure ratio of the Room the 2nd in above-mentioned two chambers, and mineralization pressure is poor; Utilize this pressure differential, above-mentioned mounted member crimping is mounted by the mounted member side.
As a preferred implementation of this vacuum plant, for example be: above-mentioned mounted member is kept by skirt; The installation portion tegmentum parts of above-mentioned mounted member cover via seal member from the top; Inner face at above-mentioned cover is provided with sealing ring, and when above-mentioned cover was being closed the state of installation portion of above-mentioned mounted member, the sealing ring was located at the top position in opposite directions with the above-mentioned skirt of above-mentioned mounted member; Above-mentioned two Room separating mechanisms have position control mechanism, this position control mechanism makes and is above-mentionedly being kept predetermined minim gap ground upward direction to move by mounted member and above-mentioned mounted member, and the top and above-mentioned sealing ring of the above-mentioned skirt of above-mentioned mounted member is joined; Above-mentioned two Room separating mechanisms are configured to, and join by this skirt and above-mentioned sealing ring, form at the inner face of above-mentioned cover and between above the above-mentioned mounted member and above-mentioned Room the 2nd independently, above-mentioned Room the 1st.
The invention effect
According to vacuum mounting method of the present invention and device, utilize the pressure differential (draught head) of vacuum/atmospheric pressure or vacuum/forced air, directly make mounted member pressure reduction servo-actuated and mount by on the mounted member (workpiece), so, do not need mechanically to pressurize, under vacuum environment, can realize little load, undamaged vacuum mounts.In addition, owing to make mounted member pressure reduction servo-actuated, so, do not need dedicated elas-tic sheet, dual elastomeric construction in the technology before, can realize simple vacuum mounting method.
Description of drawings
Fig. 1 is the profile of unitary construction of the vacuum mounting device of expression the present invention the 1st embodiment.
Fig. 2 (a) is the key diagram of one of the vacuum attachment process of the expression vacuum mounting device that adopts present embodiment example.
Fig. 2 (b) is the key diagram of one of the vacuum attachment process of the expression vacuum mounting device that adopts present embodiment example.
Fig. 2 (c) is the key diagram of one of the vacuum attachment process of the expression vacuum mounting device that adopts present embodiment example.
Fig. 2 (d) is the key diagram of one of the vacuum attachment process of the expression vacuum mounting device that adopts present embodiment example.
Fig. 2 (e) is the key diagram of one of the vacuum attachment process of the expression vacuum mounting device that adopts present embodiment example.
Fig. 2 (f) is the key diagram of one of the vacuum attachment process of the expression vacuum mounting device that adopts present embodiment example.
Fig. 3 is the profile of the cover (loam cake) of the vacuum mounting device that adopts in the Another Application example of expression above-described embodiment.
Fig. 4 is the key diagram that represents one of cutting action example before.
Fig. 5 forms the floor map that the face side is seen the Semiconductor bonding state on cutting belt after the cutting from the circuit of semiconductor chip.
Fig. 6 is the profile of unitary construction of the vacuum mounting device of expression the present invention the 2nd embodiment.
[explanation of Reference numeral]
11... cover, 12... vacuum plant body, 124... vacuum cup (by the mounted member installation portion), 125... position control mechanism, 130... mounted member, 131... skirt, 133... mounted member installation portion (ring-type keeper), 200... by mounted member (workpiece), 50... vacuum piping system (vacuum degree regulating system), 60... atmosphere opening piping system (atmosphere opening velocity-controlled system), 70... pressurized air system pipe arrangement, 80... vacuum piping system (vacuum degree regulating system)
Embodiment
Below, with reference to the description of drawings embodiments of the invention.
Fig. 1 is the sectional arrangement drawing of the vacuum mounting device of one embodiment of the invention (the 1st embodiment).Fig. 2 (a)～(f) is the key diagram of one of the vacuum attachment process of the expression vacuum mounting device that adopts present embodiment example.
At this, the structure of body 12 sides is described at first.
In the central authorities of pallet 121, guarantee for the common spaces that form sealed chamber S1 of aftermentioned lid 11.In this space, have: be used for to keep by the vacuum cup of mounted member (below be called workpiece) 200 (by the mounted member installation portion: the workpiece installation portion) 124; The position control mechanism (elevating mechanism) 125 that vacuum cup 124 is moved towards above-below direction; The mounted member installation portion 133 of the mounted member 130 of sheet, membranaceous, band shape arbitrary shape be used for to be installed.As the workpiece installation portion, also can replace vacuum cup 124 with electrostatic chuck, mechanical type sucker.
Mounted member 130 can adopt the various shapes of coincideing with the shape of workpiece 200.In the present embodiment, as an example, workpiece 200 is circular wafers, and mounted member 130 is that one side has the cutting belt of cementability, is with 130 to be circular, is being supported by the skirt 131 that is located at its periphery.
As vacuum cup 124 and the mounted member installation portion 133 of workpiece installation portion, be configured in the top of pallet 121, mounted member installation portion 133 is positioned at upside, and vacuum cup 124 is positioned at downside.When mounted member 130 and workpiece 200 were installed on separately the installation portion, mounted member 130 and workpiece 200 were disposing opposite to each other at above-below direction.
The installation portion 133 of mounted member 130 by ring-type keeper with the level consist of (below, sometimes also the mounted member installation portion is called " ring-type keeper 133 "), this ring-type keeper can be chimeric with the ring-type stand section 132 that is formed on top pallet 121 inner peripheral peripheries up or down.The skirt 131 of mounted member 130 is entrenched on the stage portion of this ring-type keeper 133, and like this, mounted member 130 just is installed in the center upper portion space of body 12.In the bottom of ring-type keeper 133 (mounted member installation portion), set the air channel 133a that a plurality of formation vacuum are used along Zhou Fangxiang.
Be provided with a plurality of guide holes 134 in the bottom surface of ring-type stand section 132, be fixed wtih pilot pin 135 at ring-type keeper 133, pilot pin can be chimeric with above-mentioned guide hole 134 slidably at above-below direction.
Upper-lower position controlling organization (elevating mechanism) 125 has the upper board 125a of fixed bearing vacuum cup 124, intermediate plate 125b and the lower panel 125c of in-built having heaters 136.These plates be stromatolithic structure (3 layers of structure) by bolt in conjunction with.These panel laminates mechanically are combined with lifting pallet 141 by plate supporting member 140.
Be provided with the hole 144 that sleeve that lifting uses is installed usefulness in the bottom center of lifting pallet 141, the guiding sleeve 142 of elevating mechanism is fixed in this hole 144.
The screw rod 143 of the elevating mechanism that is driven by the servo motor (not shown) rotatably is threadedly engaged with guiding sleeve 142.Vacuum cup 124 and panel laminate (125a, 125b, 125c) when screw rod 143 turns, rise integratedly with lifting pallet 141, when screw rod 143 counter-rotating, carry out down maneuver.
When body 12 is closed by aftermentioned cover (loam cake) 11, the inner space of the inner space of cover 11 and body 12 (vacuum cup 124, panel laminate (125a, 125b, 125c), and the receiving space of lifting pallet 141) remains airtight conditions by sealing ring 160～163 grades.
Be the peripheral part of the upper board 125a of elevating mechanism 125 at the upper-lower position controlling organization, be provided with the holding section 170 that lifting is used.When upper-lower position controlling organization (elevating mechanism) 125 rises, lifting is joined below predetermined lifting position and ring-type keeper (mounted member installation portion) 133 with holding section 170, and the mounted member 130 with ring-type keeper 133 and the skirt 131 chimeric with it is lifted.
This lifting can be regulated with the face that joins below of ring-type keeper 133, be the overhead height of holding section 170 with holding section 170.For example, holding section 170 is become stacked, regulate the lamination number, just can change overhead height.Holding section 170 also can change overhead height with thread mechanism, in addition, also can change the overhead height position with other suitable mechanism.By the adjusting of above-mentioned overhead height, change this holding section 170 to distance (climb) L that joins with ring-type keeper 133, like this, can at random regulate the required minim gap G of 200 of mounted member 130 and workpiece.
In addition, holding section 170 joins with ring-type keeper 133 after (engaging), when workpiece 200 and mounted member 130 further rise by elevating mechanism 125, because holding section 170 and ring-type keeper 133 are keeping fastening state, so, workpiece 200 and mounted member 130 are keeping predetermined minim gap G (among the figure in order to chart conveniently, clearance G is recognized easily, in fact, this clearance G for example is part grade～millimetre-sized close gap, in addition, this gap size is not limited to above-mentioned size) up direction move, finally, be urged above the skirt 131 on the sealing ring that is located at cover 11 inboards (O shape ring) 118, vertical motion stops.Among the figure, under this state, make keeping predetermined minim gap G between workpiece 200 and the mounted member 130 and mounted member 130 as the servo-actuated partition wall of pressure reduction, the inside sealed chamber S1 of vacuum mounting device separated having formed upper chamber (Room the 2nd) C1 and these 2 chambers of C2, lower chamber (Room the 1st) (seeing Fig. 2 (d)).Upper chamber C1 is formed by the space 111c between the inner face of mounted member 130 and cover 11.Lower chamber C2 is formed by the inner space (receiving space of vacuum cup 124, panel laminate (125a, 125b, 125c), lifting pallet 141) of the body 12 that is covered with by mounted member 130.
Upper chamber C1 and lower chamber C2 are separate airtight spaces.
That is, above-mentioned mounted member 130 rises, and skirt 131 joins with sealing ring 118, has consisted of Room 2 and has formed mechanism's (two Room separating mechanisms).
Formed through hole 171 at top pallet 121.This through hole 171 is used for the sealed chamber S1 decompression that is formed by cover 11 and body 12 is become vacuum state.Through hole 171 is being connected with vacuum system pipe arrangement 80.
Be provided with vacuum pump 82, open and close valve 83, vacuum gauge 84 at vacuum system pipe arrangement 80.Above-mentioned vacuum pump 82 is with the frequency changer 81 of conversion driving frequency, and the rotating speed with frequency changer 81 control vacuum pumps 82 can change vacuum degree at any time.
Vacuum system pipe arrangement 80 by branch's pipe arrangement 85, open and close valve 86, flow control valve 87, can switch to atmospheric condition from vacuum state.
On the upper board 125a and intermediate plate 125b of position control mechanism 125, disposing equably a plurality of through holes 126 for vacuum cup 124.Vacuum cup 124 is made of the porous plate of minute aperture.
A plurality of through holes 126 communicate with the through hole 126a of central authorities by the radial access 127 that is located at intermediate plate 125b bottom surface, by be located at center through hole 128 on the lower panel 125c, be located at plate 125c bottom path 128a, be located at the through hole 129 on plate supporting member 140, lifting pallet 141 and the web 150, be connected with the vacuum source (not shown) that vacuum cup is used.
The through hole 128 of intermediate plate 125b and lower panel 125c also is used as the path of the electric power supply line 137 of heater 136.The path of electric power supply line 137 is made of through hole 128, the path 138 that is located at intermediate plate 125b bottom surface, the through hole 139 that is located on lifting pallet 141 and the web 150.
Below, cover 11 is described.
On cover 11, the central portion of face (following) has formed multistage step recess 111 within it.Step recess 111 is from the inboard towards the outside, and diameter step by step (at least 4 grades) increases.The 1st step 111a of diameter minimum is used for the inner face of cover 11 and is installed between porous plate 90 on the cover 11 top, keeps certain space 112.The 2nd step 111b is used for installing above-mentioned porous plate 90.Porous plate 90 is provided with a plurality of hole 90a for vacuum exhaust, importing atmosphere.
The 3rd step 111c of step recess 111 is when forming chamber C1 and two chambers of lower chamber C2 by mounted member 130 separation that are installed in body 12 sides, for the space of guaranteeing as upper chamber C1.Around the 3rd step 111c, be provided with the endless groove 117 that O shape ring usefulness is installed, the O shape ring 118 as sealing ring is installed in this endless groove 117.
When mounted member 130 moved to top by position control mechanism 125, final and O shape ring 118 joined.
Outermost the 4th step 111d of step recess 111 is when mounted member 130 moves to top by position control mechanism 125, as the space that receives mounted member 130.
As mentioned above, the workpiece of body 12 sides is installed top and O shape with ring-type keeper (non-mounted member installation portion) 133 and is encircled 118 when joining, via mounted member 130, sealed chamber S1 is separated into upper chamber C1 and lower chamber C2 (seeing Fig. 2 (d), (e)).
Step recess 111 is that the hole by circle consists of in the present embodiment, and still, its shape is also unrestricted, also can be tetragonal hole, polygonal hole.
Be provided with for vacuum exhaust, import the center through hole 119 of atmosphere at the central portion of cover 111, connecting shared (dual-purpose) pipe arrangement 40 that is used for vacuum exhaust, imports atmosphere at this through hole 119.On this shared pipe arrangement 40, by each open and close valve (53,63,73) switchably branch connecting vacuum system pipe arrangement 50, atmosphere opening system pipe arrangement 60 and pressurized air system pipe arrangement 70.
Be provided with vacuum pump 52, open and close valve 53, vacuum gauge 54 at vacuum system pipe arrangement 50.Above-mentioned vacuum pump 52 is with the frequency changer 51 of conversion driving frequency, and the rotating speed with frequency changer 51 control vacuum pumps 52 can change vacuum degree at any time.
Be provided with flow control valve 61, tiny flow quantity control valve 62 and open and close valve 63 at atmosphere opening system pipe arrangement 60, utilizable flow control valve 61 and tiny flow quantity control valve 62 come the Gas regulation breakaway speed.
On pressurized air system pipe arrangement 70, be provided with air potential source (compressor) 71, pressure control part 72, open and close valve 74, flow control valve 73.
Below, with reference to Fig. 2 (a)～(f), the action (attachment process) of present embodiment is described.
At first, shown in Fig. 2 (a), in atmospheric environment, make cover 11 become out state, workpiece (wafer) 200 is placed on the vacuum cup (adsorption element) 124.Under this state, drive the vacuum source of vacuum cup system, workpiece 200 is by vacuum cup 124 vacuum suction.
Then, shown in Fig. 2 (b), the skirt 131 of mounted member 130 is entrenched on the ring-type keeper 133, thereby mounted member 130 is installed.That is, mounted member 130 be installed in the sealed chamber top of body 12 with state in opposite directions as its workpiece (by mounted member) 200 that mounts object.
Then, shown in Fig. 2 (c), cover 11 is covered on body 12, with the closed upper part of body 12, thereby between cover 11 and body 12, guarantee sealed chamber S1.Under this state, drive vacuum pump (pressure control mechanism) 82, thereby above-mentioned sealed chamber is remained vacuum state.
At this moment, in order not affect sucker to the absorption of workpiece, make the vacuum degree of vacuum cup 124 higher than the vacuum degree of sealed chamber S1.The vacuum degree of sealed chamber can be set as various values according to various workpiece, when adopting cutting belt, for example is 20Pa.
Then, under vacuum environment, when making workpiece 200 direction move up with position control mechanism 125, workpiece 200 and mounted member 130 between the position of required minim gap G is arranged, lifting with holding section 170 with install ring-type keeper 133 that mounted member uses below join, and then when continuing to make workpiece 200 with position control mechanism 125 direction move up, mounted member 130 and workpiece 200 lift toward the top while keeping minim gap G to be stuck section 170, finally, the sealing ring 118 of top and cover 11 sides of the skirt 131 of mounted member 130 joins.Under this state, the vertical motion of position control mechanism 125 stops.Under this state, the sealed chamber S1 that is formed by cover 11 and body 12, shown in Fig. 2 (d), by mounted member 130, namely the partition wall of mounted member 130 as the pressure reduction follow-up type, be separated into Room the 1st (lower chamber) C2 of workpiece installation side and Room the 2nd of cover 11 inner face side (upper chamber) such 2 chambers of C1.
Under this state, close vacuum system pipe arrangement 53, shown in Fig. 2 (e), make the open and close valve 63 that is located on the atmosphere opening system pipe arrangement 60 become out state, upper chamber C1 side is via flow control valve 61 and tiny flow quantity control valve 62 interim ground or become quickly and be atmospheric pressure, on the other hand, lower chamber C2 side maintenance vacuum state.
Like this, produce pressure differential between upper chamber C1, lower chamber C2, by this pressure differential, mounted member 130 is crimped and mounts workpiece 200 sides, has eliminated clearance G.For the elongation of the mounted member 130 that as far as possible suppresses to cause because of pressure differential, clearance G is preferably as far as possible little.This mounts lower chamber C2 side and is keeping vacuum state to carry out, so, in vacuum environment, carry out.
Carried out after this mounts, the vacuum suction of vacuum cup 124 stops (towards atmosphere opening).
Then, shown in Fig. 2 (f), when upper-lower position controlling organization 125 dropped to initial position, in it descended the way, ring-type keeper 133 was landed on the bottom surface of ring-type stand section 132 with mounted member 130.Mounted member 130 becomes the state that is mounted on the workpiece 200.Under this state, lower chamber C2 also with upper chamber C1 similarly towards atmosphere opening, and, cover 11 is opened, take out workpiece.
According to present embodiment, under high vacuum, utilize draught head that mounted member (band, film, sheet material) is mounted on the workpiece (wafer, substrate etc.), needn't use such before pressure reduction with the dedicated elas-tic sheet of employing, but mounted member just can be mounted as the pressure reduction follower direct and little load.Especially, compare with backer roll mode before, have the following advantages.
Can be without cracking, bubble-freely band is mounted as thin as a wafer on the wafer (for example 10 μ m).
Can not damaged, bubble-freely band is mounted on the movable part of MEMS wafer.
Can not damaged, bubble-freely band is mounted on the protruding wafer of height.
Even to the fragile wafer of compound semiconductor, also can not damaged, bubble-freely mount band.
(application examples)
Below, the application examples of present embodiment is described.
As Fig. 2 (d), after having carried out Room 2 separation of upper chamber C1, lower chamber C2, the atmosphere opening speed control of carrying out upper chamber C1 with atmosphere opening velocity-controlled system (atmosphere opening system pipe arrangement 60) in the aforementioned embodiment, but, also can change at any time control vacuum degree with vacuum regulating system (vacuum system pipe arrangement 50).In addition, also atmosphere opening velocity-controlled system and vacuum regulating system can be combined, carry out multistage pressure differential control.In addition, according to product, also can use pressurized air system pipe arrangement 70 to import compression gas-pressure and supply with control, concavo-convex even the surface of workpiece has by they are combined, also can improve adhesion and mounted member is mounted on the workpiece (without bubble).Especially, so that Room 2 can freely change any Vacuum Pressure (or pressurization) and time respectively up and down, just can freely control mounting of the power that mounts that is suitable for workpiece most thereby only press with gas.
In addition; also can pass through support plate 125a; with heater 136 (for example Max200 ℃) heated parts 200; this heating and the above-mentioned vacuum of utilizing pressure differential mounted combine, thus sealing resin film (such as the such heat-resistant resin film of EVA resin), nurse tree membrane of lipoprotein thermo-compressed on the workpiece of solar cell etc.
Fig. 3 represents the cover that adopts in another embodiment of the present invention, and the structure of body 12 sides is identical with previous embodiment, and its explanation is omitted.
The difference of present embodiment and previous embodiment is, cover is divided into exterior lateral area 11a and medial region 11b, and the medial region 11b that is positioned at chamber C1 top is made of transparent panel.In addition, be positioned at porous plate 90 under the transparent panel 11b ' also consist of with transparent material.
According to present embodiment, in the vacuum attachment process, can monitor the mounted member of band etc. is mounted process on the workpiece, can in technical process, confirm the state of product.
Below, with Fig. 6 another embodiment of the present invention (the 2nd embodiment) is described.Fig. 6 is the profile of unitary construction of the vacuum mounting device of expression another embodiment of the present invention.The difference of present embodiment and aforementioned the 1st embodiment mainly is upper-lower position controlling organization (elevating mechanism) difference of workpiece, and other part is identical with the 1st embodiment.Among the figure, the key element part same or identical with the 1st embodiment is marked with the same tag.
The upper-lower position controlling organization 125 of above-mentioned the 1st embodiment, by the screw rod 143 of servo motor driven and the guiding sleeve 142 that engages with this screw flight as elevating mechanism, carry out the Position Control that the workpiece installation portion is the above-below direction of vacuum cup 124.And the upper-lower position controlling organization 125 in the present embodiment ', be to utilize the sealed chamber S1 of workpiece to be installed and to be located at pressure reduction between the operating pressure chamber S2 of lower panel 125c downside, vacuum cup 124 is moved towards above-below direction.
Specifically, keeping disposing dual the 1st, the 2nd bellows (302,303) under the three ply board structure (upper board 125a, intermediate plate 125b, lower panel 125c) identical with the 1st embodiment of vacuum cup 124.The 1st bellows 302, the one end by sealing ring 305 and lower panel 125c below in conjunction with, the other end is by the top combination of sealing ring 306 with web 150.Be positioned at the 2nd bellows 303 in its outside, the one end by sealing ring 307 and lower panel 125c below in conjunction with, the other end is by the top combination of sealing ring 308 with web 150.Operating pressure chamber S2 is formed by the sealed chamber 301 between the 1st bellows 302 and the 2nd bellows 303.Can select from vacuum pump 52 Vacuum Pressure, from the atmospheric pressure of atmosphere opening section (507), among the forced air of air potential source (compressor) 513 any, via the operating pressure feed system 504 that is located at the external pressure introduction part 503 on the web 150 and is being connected with it, supply to operating pressure chamber S2.
The pressure feed source of operating pressure feed system 504 branches into 3, is connected with open and close valve via vacuum system pipe arrangement 501 for one to be connected with vacuum pump 52.Vacuum pump 52 in the 1st embodiment, via open and close valve 53 and vacuum system pipe arrangement 50, only is connected with Room the 2nd (upper chamber) C1 of cover 11 inner face side.And in the present embodiment, as mentioned above, also be connected with operating pressure chamber S2.Another is connected with air source via Atmosphere System pipe arrangement 508, open and close valve 505, flow control valve 506 and tiny flow quantity control valve 507.Another, is connected with air potential source 513 again via open and close valve 510, flow control valve 511, pressure control part 512 via compression system pipe arrangement 509.
The inner space 300 of the 1st bellows 302, via being located at center through hole 128,128a on the lower panel 125c, being located at the center through hole 128 on the web 150, be connected with a plurality of through holes 126 and 127 of vacuum cup 124 usefulness that in the 1st embodiment, also describe.In addition, be connected with the vacuum source (not shown) that vacuum cup is used.
In the present embodiment, surround this position control mechanism 125 ' the 2nd bellows 303 around cylinder frame 304 via seal member 311 and 312 between top pallet 121 and web 150.Between the medial surface of the lateral surface of the 2nd bellows 303 and cylinder frame 304, formed the sealed chamber S3 that is communicated with the sealed chamber S1 of workpiece installation portion.
Below, illustrate to have above-mentioned position control mechanism 125 ' the action (attachment process) of the 2nd embodiment.With the 1st embodiment similarly, also use Fig. 2 (a)～(f) that its action is described.
In the present embodiment, at first, when being placed on the vacuum cup 124, make in advance standby of vacuum pump 52,82 running to workpiece (wafer) 200.Illustrated open and close valve 53, the 63,74,83,86,502,505, the 510th, the state of closing in advance.
Under this state, shown in Fig. 2 (a), under atmospheric environment, make cover 11 become out state, workpiece (wafer) 200 is placed on the vacuum cup (adsorption element) 124.Under this state, drive the vacuum source (not shown) of vacuum cup system, workpiece 200 is by vacuum cup 124 vacuum suction.
Then, only open the open and close valve 502 of vacuum piping system, because operating pressure chamber S2 is in vacuum state (negative pressure), so, plate structure 125 (125a, 125b, the 125c) of vacuum cup 124 and maintenance vacuum cup 124 are decline states, under this state, shown in Fig. 2 (b), mounted member 130 is placed on the top of workpiece 200.Described in this placement as the 1st embodiment skirt 131 of mounted member 130 is entrenched on the ring-type keeper 133 and finishes.
Then, shown in Fig. 2 (c), lid body 11 is covered on body 12, the top of body 12 is closed, like this, between cover 11 and body 12, guarantee sealed chamber S1.Under this state, drive vacuum pump 82, above-mentioned sealed chamber S1 remains vacuum state.
As mentioned above, make the vacuum degree of vacuum cup 124 higher than the vacuum degree of sealed chamber S1.
Then, by the operating pressure of closing vacuum system open and close valve 502, open Atmosphere System open and close valve 505 or opening compression system open and close valve 510 is risen (perhaps after having opened Atmosphere System open and close valve 505, it is closed, open again the stage ground action pressure rise of compression system open and close valve 510) control, plate 125, vacuum cup 124 and workpiece 200 are pressed the pressure reduction with sealed chamber S1 to lift by the atmospheric pressure of the action S2 of balancing gate pit or forced air.Like this, workpiece 200 upward directions move and and mounted member 130 between have the position of required minim gap G, lifting install with holding section 170 and mounted member usefulness ring-type keeper 133 below join, and then with position control mechanism (pressure reduction elevating mechanism) 125 ' when continuing to make it to be moved upward, mounted member 130 and workpiece 200 are being stuck section 170 with keeping minim gap G and are lifting toward the top, finally, the sealing ring 118 of top and cover 11 sides of the skirt 131 of mounted member 130 joins.Under this state, position control mechanism 125 ' vertical motion stop.At this state, the sealed chamber S1 that is formed by cover 11 and body 12, shown in Fig. 2 (d), by mounted member 130, namely mounted member 130 as pressure reduction follow-up type partition wall, be separated into Room the 1st (lower chamber) C2 of workpiece installation side and Room the 2nd of cover 11 inner face side (upper chamber) two chambers of C1 (state of Fig. 2 (d)).
Action afterwards is identical with the 1st embodiment.
That is, first vacuum system pipe arrangement 53 cuts out, shown in Fig. 2 (e), the open and close valve 63 that is located on the atmosphere opening system pipe arrangement 60 is opened, upper chamber C1 side is by flow control valve 61 and tiny flow quantity control valve 62 interim ground or become atmospheric pressure quickly.On the other hand, lower chamber C2 side maintenance vacuum state.Perhaps, do not use atmosphere opening system pipe arrangement 60, but the open and close valve 73 of forced air press fit pipe system is opened, drive compression machine 71 makes chamber C1 side become the forced air pressure condition.Like this, produce pressure differential between upper chamber C1, the lower chamber C2, by this pressure differential, mounted member 130 is crimped and is mounted on workpiece 200 sides, has eliminated clearance G.
Carried out after this mounts, the vacuum suction of vacuum cup 124 stops (to atmosphere opening).
Then, shown in Fig. 2 (f), vacuum system open and close valve 83 is closed, Atmosphere System open and close valve 86 is opened, lower chamber C2 also with upper chamber C1 similarly to atmosphere opening.Under this state, close compression system pipe arrangement 510, open vacuum system open and close valve 502, vacuum cup 124 descends thus, and in it descended the way, ring-type keeper 133 was landed on the bottom surface of ring-type stand section 132 with mounted member 130.Mounted member 130 becomes the state that is mounted on the workpiece 200.After sucker 124 had dropped to the precalculated position, vacuum system open and close valve 502 was closed.At this state, cover 11 is opened, take out workpiece.
Present embodiment has the effect same with the 1st embodiment.
Claims (14)
1. vacuum mounting method is characterized in that having following steps:
At the sealed chamber that can form vacuum environment and atmosphere opening, the mounted member of arbitrary shape and mount being separated by mounted member with gap in opposite directions under the state of configuration of object as it in sheet, membranaceous, band shape is separated into two separate chambers to this sealed chamber via above-mentioned mounted member;
Make the above-mentioned Room the 1st by mounted member that disposing among above-mentioned two chambers become decompression state, make the pressure of the above-mentioned Room the 1st of pressure ratio of the opposing party Room the 2nd high;
Utilize the pressure differential of these two chambers, above-mentioned mounted member crimping is mounted on by the mounted member side.
2. vacuum mounting method as claimed in claim 1 is characterized in that, the formation of the pressure differential of above-mentioned two chambers is after being reduced pressure together in above-mentioned two chambers, forming vacuum, only makes above-mentioned Room the 2nd become atmospheric pressure or pressurized environment realizes.
3. vacuum mounting method as claimed in claim 1 is characterized in that, according to above-mentioned at least one by in the kind of mounted member and mounted member, shape, the thickness, controls changeably at least one in above-mentioned pressure differential and the above-mentioned gap.
4. vacuum mounting method as claimed in claim 1, it is characterized in that, when being separated above-mentioned gap and dispose in opposite directions by mounted member and above-mentioned mounted member, by the thickness of mounted member, regulate changeably above-mentioned by the position of the above-below direction of mounted member according to above-mentioned with position control mechanism with above-mentioned.
5. a vacuum mounting method is characterized in that, adopts placement equipment body, cover and pressure control mechanism;
Above-mentioned placement equipment body has parts installation portion and position control mechanism, above-mentioned parts installation portion is in opposite directions state ground installation the mounted member of arbitrary shape in the sheet that is being supported by skirt, membranaceous, the band shape with as what it mounted object by mounted member, above-mentioned position control mechanism makes above-mentioned mounted member and separated with gap the position of controlling these parts under in opposite directions the state at above-below direction by mounted member;
Above-mentioned cover, can be openedly and closedly be that sealed chamber is closed with the space of above-mentioned parts installation portion, inner face has sealing ring;
Above-mentioned pressure control mechanism is controlled the pressure of above-mentioned sealed chamber;
Above-mentioned vacuum mounting method has following steps:
With above-mentioned pressure control mechanism above-mentioned sealed chamber decompression is become vacuum environment;
Under above-mentioned vacuum environment, use rheme and put controlling organization under making above-mentioned mounted member and being separated with gap in opposite directions state by mounted member, the above-mentioned skirt of above-mentioned mounted member is joined with the sealing ring that is located at above-mentioned cover inner face, via this mounted member above-mentioned sealed chamber is separated into by these two chambers, Room the 2nd of the inner face side of Room the 1st of mounted member installation side and above-mentioned cover;
Keep and disposing above-mentionedly by the decompression state of the above-mentioned Room the 1st of mounted member among above-mentioned two chambers, make the opposing party's the pressure of the above-mentioned Room the 1st of pressure ratio of above-mentioned Room the 2nd high;
Utilize the pressure differential of these two chambers, above-mentioned mounted member crimping is mounted on by the mounted member side.
6. vacuum mounting method as claimed in claim 5 is characterized in that, the formation of the pressure differential of above-mentioned two chambers is after being reduced pressure together in above-mentioned two chambers, forming vacuum, only makes above-mentioned Room the 2nd become atmospheric pressure or pressurized environment realizes.
7. such as claim 5 or 6 described vacuum mounting methods, it is characterized in that, according to above-mentioned at least one by in the kind of mounted member and mounted member, shape, the thickness, control changeably at least one in above-mentioned pressure differential and the above-mentioned gap.
8. such as claim 5 or 6 described vacuum mounting methods, it is characterized in that, with above-mentioned when being separated above-mentioned gap and dispose in opposite directions by mounted member and above-mentioned mounted member,, used rheme and put controlling organization and regulate changeably above-mentioned by the position of the above-below direction of mounted member by the thickness of mounted member according to above-mentioned.
9. vacuum mounting method as claimed in claim 7, it is characterized in that, with above-mentioned when being separated above-mentioned gap and dispose in opposite directions by mounted member and above-mentioned mounted member,, used rheme and put controlling organization and regulate changeably above-mentioned by the position of the above-below direction of mounted member by the thickness of mounted member according to above-mentioned.
10. a vacuum mounting device has: by mounted member installation portion, mounted member installation portion, two Room separating mechanism and pressure control mechanisms;
Above-mentionedly be used for to be installed by mounted member by the mounted member installation portion;
Above-mentioned mounted member installation portion be used for to be installed the mounted member of sheet, membranaceous, the arbitrary shape of band shape;
Above-mentioned two Room separating mechanisms, at the sealed chamber that can form vacuum environment and atmosphere opening, make under the above-mentioned state that is separated by mounted member and above-mentioned mounted member with gap in opposite directions, via above-mentioned mounted member this sealed chamber is separated into two separate chambers, and, make the above-mentioned Room the 1st that is arranged in these two chambers by mounted member;
Above-mentioned pressure control mechanism after vacuum state is reduced pressure in above-mentioned two chambers, makes the pressure height of the above-mentioned Room the 1st of pressure ratio of the Room the 2nd in above-mentioned two chambers, and mineralization pressure is poor;
Utilize this pressure differential, above-mentioned mounted member crimping is mounted by the mounted member side.
11. vacuum mounting device as claimed in claim 10 is characterized in that,
Above-mentioned mounted member is kept by skirt;
The installation portion tegmentum parts of above-mentioned mounted member cover via seal member from the top;
Inner face at above-mentioned cover is provided with sealing ring, and when above-mentioned cover was being closed the state of installation portion of above-mentioned mounted member, the sealing ring was located at the top position in opposite directions with the above-mentioned skirt of above-mentioned mounted member;
Above-mentioned two Room separating mechanisms have position control mechanism, this position control mechanism makes and is above-mentionedly being kept predetermined above-mentioned with gap upward direction to move by mounted member and above-mentioned mounted member, and the top and above-mentioned sealing ring of the above-mentioned skirt of above-mentioned mounted member is joined; Above-mentioned two Room separating mechanisms are configured to, and join by this skirt and above-mentioned sealing ring, form at the inner face of above-mentioned cover and between above the above-mentioned mounted member and above-mentioned Room the 2nd independently, above-mentioned Room the 1st.
12. such as claim 10 or 11 described vacuum mounting devices, it is characterized in that, above-mentioned two chambers with respectively independently, be connected with the vacuum pump that can change at any time the frequency changer of vacuum degree.
13. such as claim 10 or 11 described vacuum mounting devices, it is characterized in that, the supporting above-mentioned by the parts of mounted member installation portion in, be built-in be used to heating above-mentioned by the heater of mounted member.
14. vacuum mounting device as claimed in claim 12 is characterized in that, the supporting above-mentioned by the parts of mounted member installation portion in, be built-in be used to heating above-mentioned by the heater of mounted member.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-199693 | 2009-08-31 | ||
| JP2009199693 | 2009-08-31 | ||
| JP2010094523A JP2011071472A (en) | 2009-08-31 | 2010-04-16 | Vacuum sticking method and apparatus |
| JP2010-094523 | 2010-04-16 |
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| CN102005395A CN102005395A (en) | 2011-04-06 |
| CN102005395B true CN102005395B (en) | 2013-03-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010180889 Active CN102005395B (en) | 2009-08-31 | 2010-05-14 | Vacuum mounting method and device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5649125B2 (en) * | 2011-07-01 | 2015-01-07 | Ｎｅｃエンジニアリング株式会社 | Tape applicator |
| JP6099118B2 (en) * | 2012-04-26 | 2017-03-22 | Ｎｅｃエンジニアリング株式会社 | Sheet pasting system and sheet pasting method |
| KR102176972B1 (en) * | 2017-11-10 | 2020-11-10 | 시바우라 메카트로닉스 가부시끼가이샤 | Film formation apparatus and component peeling apparatus |
| JP7000129B2 (en) * | 2017-11-15 | 2022-01-19 | 芝浦メカトロニクス株式会社 | Film forming equipment |
| JP7051379B2 (en) * | 2017-11-15 | 2022-04-11 | 芝浦メカトロニクス株式会社 | Film forming equipment and embedding processing equipment |
| DE102019007194A1 (en) * | 2019-10-16 | 2021-04-22 | Vat Holding Ag | Adjustment device for the vacuum range with pressure measurement functionality |
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| JPS57128939A (en) * | 1981-02-02 | 1982-08-10 | Toshiba Mach Co Ltd | Vacuum chuck mechanism of wafer fixing apparatus |
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| CN102005395A (en) | 2011-04-06 |
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