JP5427307B1 - Mounting device - Google Patents

Abstract

Provided is a mounting device capable of mounting a wafer on a ring frame to which a dicing tape is stuck with a simple configuration.
A mount device includes an upper container and a lower container, the upper container and the lower container are configured to be relatively movable, and the container is sealed when the upper container and the lower container are close to each other. A vacuum vessel sealed by a seal member 32 and an elevating stage 11 placed on the lower vessel 10 so as to be movable up and down and on which a wafer is placed are provided. A separation seal member 31 is disposed on the mounting portion on which the ring frame to which the dicing tape of the lower container 10 is attached is disposed, and the upper container 20 is disposed with a pressing mechanism that presses the ring frame against the separation seal member 31. The An upper hermetic chamber and a lower hermetic chamber are formed which are divided by a dicing tape by the separation seal member 31 and the pressing mechanism to maintain airtightness, respectively, and the dicing tape is attached to the wafer by the differential pressure between the upper airtight chamber and the lower airtight chamber .
[Selection] Figure 1

Description

  The present invention relates to a mounting apparatus for mounting a wafer on a ring frame.

  The dicing process of dividing the wafer into one chip is performed after the wafer is mounted on the ring frame. A dicing tape is used for mounting on the ring frame. In a general mounting method, a wafer is disposed at the center of an annular ring frame, and a dicing tape is attached to the ring frame and the wafer, and a roller is used for attachment.

  However, in recent years, the wafer has been made thinner, and when a roller is used, the wafer may be damaged by the pressing force of the roller. Therefore, a mounting apparatus that does not use a roller has been proposed (for example, Patent Document 1, 2).

  In Patent Document 1, a mechanism for continuously supplying an adhesive tape between upper and lower cylinders and sealing between the upper and lower cylinders, and a slide table mechanism for placing a wafer and a mount frame on the lower cylinder and fitting them in a sealed manner, An adhesive device having a mechanism for adjusting the pressure of the upper and lower cylinders is disclosed. In this apparatus, the wafer is mounted on the mount frame such that the adhesive tape is brought into close contact with the mount frame surface on the sliding table by the pressure difference between the upper and lower cylinders.

  Moreover, in patent document 2, while forming the 1st decompression chamber and the 2nd decompression chamber which were divided by the elastic sheet facing each other, the internal pressure of both decompression chambers can be controlled, and the first decompression chamber has an adhesive. A ring frame holding part that holds the ring frame with the tape attached with the non-adhesive surface thereof close to the elastic sheet, and the substrate is brought close to the adhesive surface of the adhesive tape attached to the ring frame. An adhesive tape pasting device provided with a substrate holding part to hold is disclosed. In this apparatus, after decompressing both decompression chambers to a predetermined pressure, only the pressure in the second decompression chamber is controlled to approach the atmospheric pressure, and the substrate is mounted on the ring frame.

JP 59-113637 A Japanese Patent Laid-Open No. 10-233430

  In Patent Document 1, since a wafer is placed in the center of the opening of the mount frame, a long adhesive tape is attached to these, and then the adhesive tape is cut and mounted, the dicing tape is applied. A wafer cannot be mounted on a ring frame.

  In Patent Document 2, an elastic sheet and a mechanism for holding the elastic sheet are necessary, and a substrate holding mechanism that supports the substrate so that the substrate does not fall when the pressure is reduced is required, which complicates the configuration of the apparatus. .

  The present invention has been made in view of the above matters, and an object of the present invention is to provide a mounting device capable of mounting a wafer on a ring frame to which a dicing tape is attached with a simple configuration.

The mounting device according to the present invention includes:
A vacuum container having an upper container and a lower container, the upper container and the lower container being configured to be relatively movable, and sealed by a container sealing seal member when the upper container and the lower container are close to each other;
An elevating stage disposed on the lower container so as to be movable up and down and on which a wafer is placed,
A separation seal member is disposed on the mounting portion on which the ring frame to which the dicing tape of the lower container is attached is disposed,
The upper container is provided with a pressing mechanism that presses the ring frame against the separation seal member,
The pressing mechanism includes a pressing member that contacts and presses the ring frame, and an extendable actuator.
When the actuator extends, the pressing member presses the ring frame against the separation seal member, and the ring frame comes into close contact with the separation seal member, so that the dicing tape , the ring frame, and the An upper hermetic chamber and a lower hermetic chamber that are divided by a separation seal member to maintain airtightness are formed, and the dicing tape is attached to the wafer by a differential pressure between the upper hermetic chamber and the lower airtight chamber.
It is characterized by that.

An upper air supply line for supplying air to the upper airtight chamber;
An upper intake line for taking in air from the upper airtight chamber;
A lower air supply line for supplying air to the lower airtight chamber;
A lower intake line for taking in air from the lower airtight chamber;
A control device for controlling the air supply amount and the intake air amount,
Based on the control of the control device, the chamber pressure of the upper hermetic chamber and the lower hermetic chamber is changed,
It is preferable that the chamber pressure of the upper hermetic chamber is made higher than the chamber pressure of the lower hermetic chamber, the dicing tape is deformed in a convex shape toward the wafer, and the dicing tape is attached to the wafer.

  Further, it is preferable that the control device controls the height of the elevating stage according to a deformation amount of the dicing tape based on a chamber pressure of the upper hermetic chamber and the lower hermetic chamber.

  In the mounting apparatus according to the present invention, a wafer can be mounted on a ring frame to which a dicing tape is attached with a simple configuration.

It is a schematic block diagram of a mounting apparatus. It is the perspective view which showed the internal structure of the upper container and was seen from diagonally downward. It is the perspective view which showed the internal structure of the lower container and was seen from diagonally upward. It is a figure explaining operation | movement of a mounting apparatus. It is a figure explaining operation | movement of a mounting apparatus. It is a figure explaining operation | movement of a mounting apparatus. It is a figure explaining operation | movement of a mounting apparatus. It is a figure explaining operation | movement of a mounting apparatus. It is a figure explaining operation | movement of a mounting apparatus. It is a figure explaining operation | movement of a mounting apparatus. It is a schematic block diagram of the mounting apparatus which concerns on another form.

  The configuration of the mounting apparatus 1 according to the present embodiment will be described with reference to FIGS. As shown in FIG. 1, the mounting device 1 includes a lower container 10, an elevating stage 11, an upper container 20, an actuator 21 having a pressing member 22, a separation seal member 31, a container sealing seal member 32, a lower air supply line 51, and an upper part. An air supply line 52, a lower intake line 61, an upper intake line 62 and a control device 70 are provided.

  The lower container 10 has a bottomed cylindrical shape with an opening on the upper container 20 side. An end surface of the lower container 10 facing the upper container 20 projects toward the center. This protruding part functions as a mounting surface on which the ring frame is mounted. A separation seal member 31 is installed at a portion where the ring frame is placed. The separation seal member 31 is formed in an annular shape corresponding to the shape of the ring frame. The separation seal member 31 is made of a material that can adhere to the ring frame even when the ring frame is uneven, such as an elastic resin such as rubber. In addition, the opening part of the lower container 10 is larger than the raising / lowering stage 11, and it is comprised so that the raising / lowering stage 11 can pass.

  Further, on the upper surface of the lower container 10, a container hermetic seal member 32 is installed to maintain airtightness in a space surrounded by the lower container 10 and the upper container 20 when the lower container 10 and the upper container 20 are close to each other. . The container sealing seal member 32 is installed at a location where the annular end surface of the upper container 20 abuts. The container hermetic seal member 32 is made of a material such as an elastic resin such as rubber that allows the lower container 10 and the upper container 20 to be in close contact with each other so that the space surrounded by the lower container 10 and the upper container 20 can be sealed.

  The lower container 10 is provided with an elevating stage 11 that can be raised and lowered. The elevating stage 11 is for placing a wafer on the upper surface, and has a locking portion 11a that keeps the position of the placed wafer constant. In addition, the latching | locking part 11a may protrude from the raising / lowering stage 11, and the pin which can be stored in the raising / lowering stage 11 may be sufficient. The elevating stage 11 moves up and down by driving a driving device (not shown). A seal member (not shown) is disposed at the sliding portion between the elevating stage 11 and the lower container 10, and the airtightness in the lower container 10 is maintained.

  Further, the lower container 10 includes a pressure gauge 41 for measuring a chamber pressure of a lower hermetic chamber AL1, which will be described later, a lower air supply line 51 for supplying air or an inert gas to the lower hermetic chamber AL1, and an atmosphere or air from the lower hermetic chamber AL1. A lower intake line 61 for sucking inert gas is connected. Valves 53 and 63 are installed in the lower supply line 51 and the lower intake line 61, respectively.

  The upper container 20 is configured to be movable up and down by a drive device (not shown). It has a bottomed cylindrical shape with an opening on the lower container 10 side. When the lower container 10 is lowered, the annular lower surface of the upper container 20 is configured to come into contact with the container hermetic seal member 32 installed in the lower container 10.

  An actuator 21 having a pressing member 22 and capable of extending and contracting in the vertical direction is installed in the internal space of the upper container 20. The actuator 21 pushes down the pressing member 22 and presses the ring frame arranged in the lower container 10 against the separation seal member 31. Here, six actuators 21 are installed at equal intervals along the separation seal member 31. Examples of the actuator 21 include those using a power source such as an air cylinder, a hydraulic cylinder, and a servo motor.

  The pressing member 22 is preferably formed in an annular shape corresponding to the shape of the ring frame so that the ring frame and the separation seal member 31 are in close contact with each other when the ring frame is pressed. Further, the surface of the pressing member 22 that contacts the ring frame is preferably made of an elastic resin or the like so as to suppress deformation of the ring frame when the ring frame is pressed.

  Further, the upper container 20 includes a pressure gauge 42 for measuring a chamber pressure of an upper hermetic chamber AL2, which will be described later, an upper air supply line 52 for supplying air or an inert gas to the upper hermetic chamber AL2, and an atmosphere or air from the upper hermetic chamber AL2. An upper intake line 62 for sucking inert gas is connected. Valves 54 and 64 are installed in the upper air supply line 52 and the upper intake line 62, respectively.

  The control device 70 controls the operation of the upper container 20, the actuator 21, and the lifting stage 11. Further, the control device 70 controls the opening and closing of the valves 53, 54, 63, and 64, and controls the supply and intake of the air in the lower airtight chamber AL1 and the upper airtight chamber AL2.

  Subsequently, a mounting operation by the mounting apparatus 1 will be described. In addition, about the following operation | movement, all shall be performed based on control of the control apparatus 70. FIG.

  First, as shown in FIG. 4, the upper container 20 is raised, and the wafer W is placed on the upper surface of the elevating stage 11 in a state where the upper container 20 and the lower container 10 are separated from each other. Further, a ring frame RF having a dicing tape DT attached thereto is placed on the upper surface of the lower container 10. The ring frame RF is placed in contact with the separation seal member 31. The ring frame RF is placed so that the adhesive surface of the dicing tape DT faces the lifting stage 11. The mounting of the wafer W and the ring frame RF may be configured to be performed by a robot hand or the like.

  Subsequently, as shown in FIG. 5, the upper container 20 is lowered. The annular lower surface of the upper container 20 abuts on the container sealing seal member 32, the container sealing seal member 32 is pressed by the upper container 20 and the lower container 10, and the container sealing seal member 32 comes into close contact with the upper container 20 and the lower container 10. . Thereby, the space enclosed by the upper container 20 and the lower container 10 is sealed, and airtightness is maintained.

  Further, as shown in FIG. 6, the actuator 21 is driven and the pressing member 22 is lowered to press the ring frame RF against the separation seal member 31. When the ring frame RF is in close contact with the separation seal member 31, the dicing tape DT, the ring frame RF, the lower seal chamber 31 surrounded by the separation seal member 31 and the lower container 10, the dicing tape DT, the ring frame RF, and the separation seal member. An upper airtight chamber AL2 surrounded by 31 and the upper container 20 is formed. Thereby, the lower hermetic chamber AL1 and the upper hermetic chamber AL2 can control the chamber pressure independently of each other.

  Subsequently, as shown in FIG. 7, the valves 63 and 64 are opened, and the interiors of the lower airtight chamber AL1 and the upper airtight chamber AL2 are sucked, and the lower airtight chamber AL1 and the upper airtight chamber AL2 are in a vacuum state. . At this time, in order to suppress the deformation of the dicing tape DT due to the pressure difference, intake is performed so that the chamber pressures of the lower hermetic chamber AL1 and the upper hermetic chamber AL2 are maintained at the same pressure. The control of the lower hermetic chamber AL1 and the upper hermetic chamber AL2 is performed by feeding back the chamber pressure measured by the pressure gauges 41 and 42, and the controller 70 controls the opening and closing of the valves 63 and 64.

  Thereafter, as shown in FIG. 8, in the initial stage of attachment, the atmosphere or inert gas is supplied only to the upper airtight chamber AL2. Since the chamber pressure of the upper hermetic chamber AL2 increases, the dicing tape DT is deformed in a convex shape toward the wafer W. Further, the dicing tape DT deformed into a convex shape is attached to the central portion of the wafer W by raising the elevating stage 11. Thereafter, the dicing tape DT is affixed radially from the center of the wafer W toward the outer periphery. In addition, the raising / lowering speed and height of the raising / lowering stage 11 are controlled by the control apparatus 70 according to the deformation amount of the dicing tape DT based on each chamber pressure of lower airtight chamber AL1 and upper airtight chamber AL2.

  At the end of the pasting, as shown in FIG. 9, as the elevating stage 11 is raised, the lower airtight chamber AL1 is also supplied with air or inert gas. As a result, the tension of the dicing tape DT is adjusted so that no load is applied to the device formed on the surface of the wafer W.

  After completion of the sticking, as shown in FIG. 10, the release of the pressure by the actuator 21, the upper container 20 is lifted, and the lift stage 11 is lowered. Then, the wafer W mounted on the ring frame RF is unloaded by a robot hand or the like.

  In this way, the dicing tape DT is stuck on the entire surface of the wafer W. Since no roller is used, the wafer W can be prevented from being damaged by the pressing force.

  In addition, since the dicing tape DT is sequentially attached radially from the central portion of the wafer W, it is possible to suppress bubbles from entering between the wafer W and the dicing tape DT.

  Further, the lower hermetic chamber AL1 and the upper hermetic chamber AL2 have high airtightness due to the separation seal member 31 and the pressing mechanism. Then, the chamber pressure in the lower airtight chamber AL1 and the upper airtight chamber AL2 is fed back, and the height of the elevating stage 11 is controlled based on the deformation amount of the dicing tape DT, so that the stress distribution on the inner surface of the wafer W is made uniform. The stress applied to the device formed on the wafer W can be affixed while maintaining the stress below the breakdown load.

  In the above description, the actuator 21 having the pressing member 22 is described as an example of the pressing mechanism. However, any mechanism can be used as long as it can maintain the airtightness of the lower airtight chamber AL1 and the upper airtight chamber AL2. May be. For example, as shown in FIG. 10, a mechanism for pressing the pressing member 22 by the elastic force of an elastic member such as a spring 23 may be used.

DESCRIPTION OF SYMBOLS 1 Mount apparatus 10 Lower container 11 Elevating stage 11a Locking part 20 Upper container 21 Actuator 22 Press member 23 Spring 31 Separation seal member 32 Container sealing seal member 41, 42 Pressure gauge 51 Lower supply line 52 Upper supply line 53, 54 Valve 61 Lower intake line 62 Upper intake line 63, 64 Valve 70 Control device AL1 Lower airtight chamber AL2 Upper airtight chamber W Wafer RF Ring frame DT Dicing tape

Claims (3)

A vacuum container having an upper container and a lower container, the upper container and the lower container being configured to be relatively movable, and sealed by a container sealing seal member when the upper container and the lower container are close to each other;
An elevating stage disposed on the lower container so as to be movable up and down and on which a wafer is placed,
A separation seal member is disposed on the mounting portion on which the ring frame to which the dicing tape of the lower container is attached is disposed,
The upper container is provided with a pressing mechanism that presses the ring frame against the separation seal member,
The pressing mechanism includes a pressing member that contacts and presses the ring frame, and an extendable actuator.
When the actuator extends, the pressing member presses the ring frame against the separation seal member, and the ring frame comes into close contact with the separation seal member, so that the dicing tape , the ring frame, and the An upper hermetic chamber and a lower hermetic chamber that are divided by a separation seal member to maintain airtightness are formed, and the dicing tape is attached to the wafer by a differential pressure between the upper hermetic chamber and the lower airtight chamber.
A mounting device characterized by that. An upper air supply line for supplying air to the upper airtight chamber;
An upper intake line for taking in air from the upper airtight chamber;
A lower air supply line for supplying air to the lower airtight chamber;
A lower intake line for taking in air from the lower airtight chamber;
A control device for controlling the air supply amount and the intake air amount,
Based on the control of the control device, the chamber pressure of the upper hermetic chamber and the lower hermetic chamber is changed,
The chamber pressure of the upper hermetic chamber is made higher than the chamber pressure of the lower hermetic chamber, the dicing tape is deformed in a convex shape toward the wafer, and the dicing tape is attached to the wafer.
The mounting apparatus according to claim 1, wherein: The control device controls the height of the elevating stage according to the deformation amount of the dicing tape based on the chamber pressure of the upper hermetic chamber and the lower hermetic chamber,
The mounting apparatus according to claim 2, wherein:

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