KR102649868B1 - Film formation apparatus and embedding processing apparatus - Google Patents

Abstract

The present invention provides an embedding processing device that performs an embedding process to ensure good adhesion of the exposed electrode surface of an electronic component to a protective sheet, and a film forming apparatus that performs a film forming process on the embedded electronic component. The purpose.
The film forming apparatus 7 according to the embodiment includes an embedding processing unit 1 and a film forming processing unit 3, wherein the embedding processing unit 1 includes a chamber 10 whose interior can be vacuumed, and the chamber 10. A sheet press body 120 is installed inside the chamber and is located on the opposite side from the electronic component 60 with the protection sheet 61 in between, and a sheet presser 120 is installed in the chamber 10 and protects the electronic component 60 with the electronic component 60 interposed therebetween. A component pressing body 130 located on the opposite side from the seat 61, and a sheet side elastic body 121 provided on the sheet pressing body 120 and having a flat sheet opposing surface 121a facing the protective sheet 61. By relatively moving the flat component opposing surface 131a, which is installed on the component pressing body 130 and faces the electronic component 60, and the sheet pressing body 120 and the component pressing body 130, the sheet opposing surface Between 121a and the component opposing surface 131a, there is a drive mechanism 132 that presses the electronic component 60 and the protective sheet 61 against each other.

Description

Film forming device and landfill processing device {FILM FORMATION APPARATUS AND EMBEDDING PROCESSING APPARATUS}

The present invention relates to a film forming device for forming a film on an electronic component adhered to a protective sheet, and an embedding processing device for embedding the electronic component in the adhesive surface of the protective sheet.

Wireless communication devices, such as mobile phones, are equipped with many electronic components such as semiconductor devices. Electronic components are transported from a processing device to another processing device to undergo various types of processing. A representative example of the process is the formation of an electromagnetic wave shield film. The electromagnetic wave shield film suppresses the influence of electromagnetic waves on the inside and outside, such as leakage of electromagnetic waves to the outside, in order to prevent the influence on communication characteristics. Generally, electronic components are made of a sealing resin, and in order to shield electromagnetic waves, a conductive electromagnetic wave shield film is formed on the top and side surfaces of the sealing resin (see Patent Document 1).

As a method of forming an electromagnetic wave shield film, the plating method is known. However, since the plating method requires wet processes such as a pretreatment process, a plating treatment process, and a post-treatment process such as water washing, an increase in the manufacturing cost of electronic components cannot be avoided. Therefore, sputtering, a dry process, is attracting attention. In the sputtering method, an inert gas is introduced into a vacuum container in which the target is placed, and a voltage is applied. Then, the ions of the inert gas converted into plasma collide with the target of the film forming material, and the particles ejected from the target are deposited on the electronic component. This sediment layer becomes an electromagnetic wave shield.

A film forming apparatus that implements a sputtering method has a cylindrical chamber with a vacuum chamber on the inside, a rotary table accommodated in the chamber and having a rotation axis coaxial with the chamber, and a film forming position defined within the chamber. An electronic component is placed on a rotary table, and the rotary table is rotated along the circumferential direction, so that the electronic component reaches the film deposition position and an electromagnetic wave shield film is deposited. In this way, rotational conveyance of electronic components exists even within the processing device.

When electronic components are transported inside or outside of such a device, the electronic components are subject to inertial forces due to acceleration/deceleration or rotation, and there is a risk that the electronic components may fall over or fall off from the film deposition position. Therefore, the electronic component is adhered to the adhesive film, transported, and receives the formation of an electromagnetic wave shield film. Electronic components can be stopped and maintained in an appropriate position by adhesive force against inertial force. This adhesive film is hereinafter referred to as a protective sheet.

The protective sheet not only improves the detergent properties of electronic components, but also prevents particles of the electromagnetic wave shield film from adhering to electrodes during film formation, and maintains insulation between electrodes. Electrodes of electronic components are generally called solder ball bumps, and are formed by joining spherical solder (solder balls) with a diameter of tens to hundreds of micrometers to pad electrodes of electronic components. The electrodes are exposed from the electrode-exposed surface of the electronic component and are arranged in a matrix.

These electrodes are embedded in a flexible adhesive film, and the exposed surface of the electrode is brought into close contact with the protective sheet. Embedding of the electrode is performed by placing the electronic component on the adhesive surface of the protective sheet and pressing it. As a result, since the electrode and the electrode exposed surface are covered with the protective sheet, particles of the electromagnetic wave shield film cannot enter between the electrode exposed surface and the protective sheet and do not reach the electrode.

International Publication No. 2013/035819 Japanese Patent Publication No. 6-97268

As described above, even if the electronic component is pressed against the protective sheet in order to embed the electrode of the electronic component in the protective sheet, there are cases where the surface of the protective sheet is not deformed along the surface of the electrode and the exposed surface of the electrode. Then, there is a risk that a gap leading to the outside or a gap not opening to the outside may be created between the electrode exposed surface and the protective sheet.

During the film forming process, particles of the electromagnetic wave shield film enter through the gap leading to the outside. If particles of the electromagnetic wave shield film that enter the gap adhere to bridge the gap between the electrodes, the insulation between the electrodes cannot be maintained.

Additionally, if a gap that does not lead to the outside is created, the adhesion between the electronic component and the protective sheet decreases. For this reason, when the electronic component is transported between devices or within the film forming apparatus, the electronic component subjected to the inertial force is peeled off from the protective sheet and exposed to the outside between the electrode exposed surface and the protective sheet, as described above. This causes a communication gap to form.

In order to prevent particles from entering the electromagnetic wave shield film as described above, it is necessary that the space between the outermost electrode among the plurality of electrodes arranged in a matrix and the outer edge of the electrode exposed surface is blocked by a protective sheet. . However, recent electronic components have been miniaturized, and not only the gap between electrodes but also the distance from the outermost electrode to the outer edge of the electrode exposed surface is becoming very short. Then, since the area near the outer edge of the electrode exposed surface becomes small, it becomes difficult to deform the surface of the protective sheet to follow the surface of the electrode and the electrode exposed surface to ensure a close contact area. For this reason, in the case of electronic components where miniaturization has progressed, problems with gaps and voids as described above are more likely to occur.

The present invention has been proposed to solve the above-described problems, and its purpose is to provide an embedding processing device that performs embedding treatment to ensure good adhesion of the electrode-exposed surface of an electronic component to a protective sheet. Another object of the present invention is to provide a film forming apparatus that further performs a film forming process on an embedded electronic component that ensures good adhesion of the electrode exposed surface to the protective sheet.

In order to achieve the above object, the film forming apparatus of the present invention is a film forming apparatus for an electronic component in which an electrode exposed surface on which an electrode is formed is adhered to the adhesive surface of a protective sheet, and the electrode is embedded in the adhesive surface of the protective sheet. an embedding processing unit that deposits a film forming material on the electronic component in which the electrode is embedded in the protective sheet, wherein the embedding processing unit includes a chamber whose interior can be vacuumed, and is installed within the chamber. a sheet press body located on a side opposite to the electronic component across the protective sheet; a component press body installed in the chamber and located on a side opposite to the protection sheet across the electronic component; a sheet side elastic body provided on the sheet press body and having a flat sheet opposing surface facing the protective sheet; a sheet side elastic body provided on the component pressing body and having a flat component opposing surface facing the electronic component; and It has a drive mechanism that causes the electronic component and the protection sheet to be pressed against each other between the sheet opposing surface and the component opposing surface by relatively moving the component pressing body.

According to the embedding treatment apparatus of the present invention, embedding treatment can be performed to ensure good adhesion of the electrode-exposed surface of the electronic component to the protective sheet. In addition, according to the film forming apparatus of the present invention, film forming treatment can be further performed on electronic components that have been subjected to an embedding treatment that ensures good adhesion of the electrode exposed surface to the protective sheet.

1 is a side view showing an electronic component that has been film-deposited.
Figure 2 is a side view showing the state of the electronic component after undergoing film forming processing.
Figure 3 is an exploded perspective view showing the state of the electronic component when subjected to a film forming process.
Figure 4 is a transition diagram showing the film forming process flow of an electronic component.
Figure 5 is a block diagram showing the configuration of a film forming apparatus.
Figure 6 is a schematic diagram showing the configuration of the landfill processing unit.
Figure 7 is a transition diagram schematically showing the state in each process of the landfill processing unit.
Figure 8 is a transition diagram schematically showing the state in each process of the landfill processing unit.
Figure 9 is a transition diagram showing the state of electronic components in the embedding processing unit.
Figure 10 is a diagram showing a state in which the protective sheet and the component-side elastic body are in contact.
Figure 11 is a schematic diagram showing the plate mounting portion.
Figure 12 is a schematic diagram showing a film forming processing unit.
Figure 13 is a schematic diagram showing the plate release part.
Figure 14 is a schematic diagram showing a peeling processing unit.

[Electronic parts]

FIG. 1 is a side view showing an electronic component 60 that has undergone a film deposition process. An electromagnetic wave shield film 605 is formed on the surface of the electronic component 60. Meanwhile, in FIG. 1, only the electromagnetic wave shield film 605 is shown in cross section. The electronic component 60 is a surface-mounted component such as a semiconductor chip, diode, transistor, condenser, or SAW filter. A semiconductor chip is an integrated circuit such as an IC or LSI that integrates a plurality of electronic elements. This electronic component 60 has a substantially rectangular parallelepiped shape such as BGA, LGA, SOP, QFP, or WLP, and one surface is an electrode exposure surface 601. The electrode exposed surface 601 is a surface on which the electrode 602 is exposed, faces the mounting substrate, and is connected to the mounting substrate. The electrode 602 is called a ball bump or solder ball bump, and is formed by mounting solder (solder balls) shaped into a sphere with a diameter of tens to hundreds of μm on a pad electrode.

The electromagnetic wave shield film 605 shields electromagnetic waves. The electromagnetic wave shield film 605 is formed of materials such as Al, Ag, Ti, Nb, Pd, Pt, and Zr, for example. The electromagnetic wave shield film 605 may be formed of a magnetic material such as Ni, Fe, Cr, or Co. Additionally, SUS, Ni, Ti, V, Ta, etc. may be formed as a base layer of the electromagnetic wave shield film 605, and SUS, Au, etc. may be formed as a protective layer on the outermost surface.

The electromagnetic wave shield film 605 is formed on the top surface 603 and the side surface 604 of the electronic component 60, that is, on the outer surface other than the electrode exposed surface 601. The upper surface 603 is a surface opposite to the electrode exposed surface 601. The side surface 604 is an outer peripheral surface that connects the upper surface 603 and the electrode exposed surface 601 and extends at a different angle from the upper surface 603 and the electrode exposed surface 601. In order to obtain a shield effect that blocks electromagnetic waves, the electromagnetic wave shield film 605 need only be formed on at least the upper surface 603. However, in order to obtain a good shielding effect, it is preferable that it is formed not only on the entire top surface 603 but also on the entire side surface 604. A ground pin (not shown) exists on the side 604. The formation of the electromagnetic wave shield film 605 on the side surface 604 is also due to the grounding of the electromagnetic wave shield film 605.

[Protection Sheet]

FIG. 2 is a side view showing the state of the electronic component 60 after receiving the film forming process. In FIG. 2, members other than the electronic component 60 are shown in cross section. Additionally, FIG. 3 is an exploded perspective view showing a state in which the electronic component 60 is supported when undergoing a film forming process. As shown in FIGS. 2 and 3, the electrode 602 of the electronic component 60 is embedded in the protective sheet 61 before the film forming process, and the electrode exposed surface 601 is in close contact with the protective sheet 61. there is. By embedding the electrode 602 in the protective sheet 61, particles of the electromagnetic wave shield film 605 are prevented from reaching the electrode 602. In addition, since the electrode exposed surface 601 and the protective sheet 61 are in close contact, there is no room for particles of the electromagnetic wave shield film 605 to enter between the electrode exposed surface 601 and the protective sheet 61, and the electrode ( The possibility that particles of the electromagnetic wave shield film 605 reach 602) is reduced.

The protective sheet 61 is made of heat-resistant synthetic resin such as PEN (polyethylene naphthalate) or PI (polyimide). One side of the protective sheet 61 is made of an adhesive surface (adhesive layer) 611 that has flexibility to allow the electrodes 602 to penetrate and adhesiveness to adhere the exposed electrode surface 601. As the adhesive surface 611, various adhesive materials such as silicone-based, acrylic-based resin, urethane resin, and epoxy resin are used.

The adhesive surface 611 includes an outer frame area 613 extending inward from the end of the protective sheet 61 to a predetermined distance, and an intermediate frame area extending inward from the inner periphery of the outer frame area 613 to a predetermined distance. It is divided into 614 and a parts arrangement area 615 inside the middle frame area 614. The electronic component 60 is adhered to the component arrangement area 615. A frame-shaped frame 62 is attached to the outer frame area 613. The middle frame area 614 is a range where the protective sheet 61 is bent, and neither the frame 62 nor the electronic component 60 is adhered. Meanwhile, the opposite side of the adhesive surface 611 is the non-adhesive surface 612.

The protective sheet 61 is adhered to the cooling plate 63 through an adhesive sheet 64. The cooling plate 63 is made of metal such as SUS, ceramics, resin, or other highly thermally conductive material. This cooling plate 63 is a heat dissipation furnace that radiates heat from the electronic component 60 and suppresses excessive heat storage. The adhesive sheet 64 has adhesiveness on both sides, improves adhesion between the protective sheet 61 and the cooling plate 63, and secures the heat transfer area to the cooling plate 63.

The height H1 from the surface of the component arrangement area 615 to the upper surface of the frame 62 is greater than the height H2 from the surface of the component arrangement area 615 to the upper surface 603 of the electronic component 60. High (see Figure 4). Meanwhile, the height H1 is the direction in which the electronic components 60 are pressed against the protective sheet 61, that is, the length in the direction perpendicular to the plane of the protective sheet 61, and is referred to as the thickness H1 for convenience. In some cases, it has the same meaning. In short, assuming that a flat plate is mounted on the frame 62, the upper surface 603 of the electronic component 60 falls short of the flat plate.

A guide part insertion hole 621 is formed through one end of the frame 62. The guide part insertion hole 621 has an opening such as an elongated oval, rectangle, or round circle along the end of the frame 62, and is formed through the surface bonded to the protective sheet 61 and the exposed surface opposite to it. It is done. That is, for example, by inserting a rod-shaped member into the guide portion insertion hole 621 and pressing the end of the protection sheet 61 (see FIG. 14), one end of the protection sheet 61 is peeled from the frame 62. there is.

A pusher insertion through hole 631 is formed in the cooling plate 63 and the adhesive sheet 64. The pusher insertion through hole 631 does not coincide with the guide part insertion hole 621 and is formed through a position blocked by the frame 62. When, for example, a rod-shaped member is inserted into the pusher insertion hole 631 and the frame 62 is pushed up with the tip of the rod-shaped member, the pusher insertion through hole 631 is raised so that the entire frame 62 is lifted in parallel. Multiple penetrations are formed. For example, if the frame 62 is a rectangular frame, pusher insertion holes 631 are located at the four corners or at the center of each side. From the viewpoint of maintaining the frame 62 parallel, the rod-shaped member preferably has a rectangular tip cross-section, that is, a thin plate shape or an L-shaped cross-section, etc. is preferred, but is not limited to this and has a round circular shape. It may have a tip cross section of . The pusher insertion through hole 631 has a corresponding rectangular shape, L-shape, or round circular shape.

In addition, the cooling plate 63 and the adhesive sheet 64 have fine air holes 632 at equal intervals throughout the range where the middle frame area 614 and the parts arrangement area 615 of the protection sheet 61 are adhered. Many of these have been formed. This air hole 632 has a microcylindrical shape or slit shape, for example. The air hole 632 is formed to uniformly apply negative or positive pressure to at least the component arrangement area 615 of the protective sheet 61 adhered to the cooling plate 63. The number, penetration formation interval, and penetration formation range of the air holes 632 are not limited to this. For example, even if they are formed only in the range corresponding to the component arrangement area 615, the cooling plate 63 and the adhesive sheet 64 ), the air holes 632 may be densely arranged in the center, while the air holes 632 may be arranged on the outer side in the genitals, or only one air hole 632 may be formed at a position corresponding to the center of the component arrangement area 615.

[Tabernacle process flow]

In the film formation process, the electromagnetic wave shield film 605 is formed through a component placement process, component embedding process, plate mounting process, film formation process, plate release process, and component peeling process, and the electronic components ( 60) is obtained.

FIG. 4 is a diagram illustrating the film forming process flow of the electronic component 60. As shown in FIG. 4, in the component placement process, the electrode exposed surface 601 of the electronic component 60 faces the component non-placement sheet 65 where the frame 62 is adhered to the protection sheet 61. In a visible state, the electronic components 60 are arranged in the component arrangement area 615. The protective sheet 61 in which the frame 62 is adhered and the electronic components 60 are arranged, but the electrodes 602 are not yet embedded, is called a component arrangement complete sheet 66.

In the component embedding process, the electrode 602 is embedded in the protection sheet 61 of the component placement sheet 66, and the electrode exposed surface 601 is brought into close contact with the protection sheet 61. Regardless of whether the electromagnetic wave shield film 605 is formed or not, the protective sheet 61 in which the electrodes 602 are embedded is called a component-embedded sheet 67. In the plate mounting process, the component embedded sheet 67 is brought into close contact with the cooling plate 63 through the adhesive sheet 64. The cooling plate 63 in a state in which this component-embedded sheet 67 is in close contact is called the component mounting plate 68.

In the film forming process, particles of the electromagnetic wave shield film 605 are deposited from the upper surface 603 side of the electronic component 60 to form the electromagnetic wave shield film 605 on the electronic component 60 . At this time, the electrode 602 of the electronic component 60 is buried in the protection sheet 61. Additionally, the electrode exposed surface 601 is in close contact with the protective sheet 61. For this reason, particles of the electromagnetic wave shield film 605 are prevented from adhering to the electrode 602.

In the plate release process, the cooling plate 63 is removed and returned to the form of the component embedded sheet 67. Then, in the component peeling process, the electronic component 60 is peeled from the protective sheet 61 and separated into the non-component sheet 65 and the individual electronic components 60. Additionally, in preparation for reuse of the frame 62, the protective sheet 61 is peeled from the frame 62. With the above, the film forming process is completed.

[Tabernacle device]

Among the above film forming process flows, the film forming apparatus 7 responsible for the component embedding process, plate mounting process, film forming process, plate releasing process, and component peeling process is shown in FIG. 5 . The film forming apparatus 7 is provided with an embedding processing unit 1, a plate mounting unit 2, a film forming processing unit 3, a plate releasing unit 4, and a peeling processing unit 5. Each part is connected by a conveyance unit 73, members required for each process are input, and members that have been processed in each process are discharged. The conveyance unit 73 may be, for example, a conveyor or a conveyance table movable along a straight path using a ball screw or the like.

In addition, the film forming apparatus 7 controls the operation timing of each component included in the embedding processing unit 1, the plate mounting unit 2, the film forming processing unit 3, the plate releasing unit 4, and the peeling processing unit 5. A control unit 74 such as a computer or microcomputer having a CPU, ROM, RAM, and signal transmission circuit is accommodated. Additionally, a pneumatic pressure circuit 75 that supplies positive or negative pressure to the embedding processing unit 1, plate mounting unit 2, film forming processing unit 3, plate releasing unit 4, and peeling processing unit 5 is accommodated. The control unit 74 also controls the electromagnetic valve in the pneumatic pressure circuit 75 and switches between negative pressure generation, negative pressure release, positive pressure generation, and positive pressure release.

[Landfill processing department]

(composition)

The landfill processing unit 1, which is responsible for the parts landfill process, will be described. Figure 6 is a schematic diagram showing the configuration of the landfill processing unit 1. The component arrangement completed sheet 66 is input into the embedding processing unit 1. The embedding processing unit 1 sandwiches the component arrangement sheet 66 between the sheet press body 120 and the component press body 130 in a vacuum and presses the electronic component 60 against the protection sheet 61 . As a result, the embedding processing unit 1 embeds the electrode 602 of the electronic component 60 in the protection sheet 61 and brings the electrode exposed surface 601 into close contact with the protection sheet 61 .

As shown in FIG. 6 , the embedding processing unit 1 is provided with a chamber 10, a sheet press body 120, and a component press body 130. The chamber 10 is a container whose interior can be vacuumed. The chamber 10 includes a cover portion 11 and an arrangement portion 12 that are opposed to each other. The cover portion 11 is a box-shaped member with an opening at the bottom toward the placement portion 12 and an internal space 111 in which the component placement sheet 66 to be embedded is formed. The arrangement portion 12 is a rectangular parallelepiped-shaped member. The opening of the cover portion 11 and the vicinity of the edge portion of the mounting portion 12 have opposing surfaces 11a and 12a facing each other and arranged in parallel.

A sealing member 115 such as an O-ring is provided on the opposing surface 11a of the cover portion 11. The cover portion 11 is installed to be movable in directions approaching and away from the placement portion 12 by a driving mechanism such as an air pressure or hydraulic cylinder (not shown). As a result, the cover portion 11 is in a closed position where the opposing surface 11a and the opposing surface 12a of the arrangement portion 12 come into contact with each other through the sealing member 115, thereby sealing the internal space 111. And, by separating the opposing surface 11a from the opposing surface 12a of the arrangement portion 12, the internal space 111 moves between the opening positions where the interior space 111 is opened to the atmosphere.

In the placement portion 12, a pusher insertion through hole 12b, which is a through hole, is formed. The position of the pusher insertion hole 12b is a position corresponding to the frame 62 of the component-placed sheet 66 mounted on the sheet pressing body 120. A pusher 13, which will be described later, is inserted into the pusher insertion hole 12b. A sealing member 12c, such as an O-ring or packing, is provided between the pusher 13 and the inside of the pusher insertion hole 12b to seal the pusher 13 so that it can slide.

Additionally, an exhaust hole 12d is formed in the arrangement portion 12. The exhaust hole 12d is connected to the pneumatic pressure circuit 75. The pneumatic pressure circuit 75 allows the internal space 111 of the sealed chamber 10 to be depressurized through the exhaust hole 12d.

The sheet press body 120 is a member installed in the chamber 10 and located on the opposite side from the electronic component 60 with the protection sheet 61 interposed therebetween. In this embodiment, the sheet press body 120 is a plate fixed on the placing portion 12. The surface of the sheet press body 120 facing the component-placed sheet 66 is a flat surface 120a. The area of the flat surface 120a is larger than the area of the component arrangement sheet 66. On the other hand, a plurality of guide pins (not shown) are installed on the flat surface 120a, and the guide pins contact the outer edge of the frame 62, thereby preventing the component arrangement sheet 66 from being misaligned.

Additionally, a sheet side elastic body 121 is provided on the flat surface 120a. The sheet-side elastic body 121 is an elastically deformable sheet and has a flat sheet opposing surface 121a facing the component-placed sheet 66. For example, rubber such as silicone rubber can be used as the sheet side elastic body 121. On the other hand, the sheet side elastic body 121 may be an elastic body made of a material that achieves the effect of elastic deformation described later. For example, various materials such as urethane rubber, nitrile rubber, ethylene rubber, fluorine rubber, and HANENITE can be applied. Flat means that the electronic components 60 of the component placement sheet 66 can be pressed evenly, and minor irregularities or surface roughness are permitted. In this embodiment, the surface of the sheet side elastic body 121 opposite to the sheet opposing surface 121a is adhered to the flat surface 120a of the sheet press body 120 using an adhesive or the like. For the sheet side elastic body 121, the area of the sheet opposing surface 121a may be larger than the area of the component arrangement area 615.

As shown in Fig. 6, the height, or thickness Ts, of the sheet side elastic body 121 is thicker than the thickness Te of the electrode 602 (see Figs. 1 and 2). Additionally, the hardness of the sheet side elastic body 121 is preferably Shore A15 or higher and Shore A50 or lower. A component-placed sheet 66 is disposed on the sheet opposing surface 121a of the sheet side elastic body 121. At this time, as described above, the guide pin provided on the flat surface 120a of the sheet press body 120 contacts the outer edge of the frame 62. On the other hand, as a method of fixing the component arrangement completed sheet 66 to the sheet side elastic body 121, a mechanical chuck, a vacuum chuck, or an electrostatic chuck may be used.

The sheet press body 120 and the sheet side elastic body 121 are formed with pusher insertion holes 120b and 121b, respectively, which are through holes through which the pusher 13 is inserted. As a result, the pusher 13 that advances and retreats within the pusher insertion holes 12b, 120b, and 121b can appear and retract from the sheet opposing surface 121a of the sheet side elastic body 121. When the pusher 13 protrudes from the pusher insertion hole 121b, it separates the component-placed sheet 66 from the sheet side elastic body 121, lifts it parallel to the sheet opposing surface 121a, and supports it. They are installed with acceptable rigidity, number, and arrangement spacing. For example, when the outer shape of the frame 62 is rectangular, pusher insertion through holes 12b, 120b, and 121b are formed corresponding to each corner of the frame 62, and the pusher 13 is disposed at each.

The pusher 13 is a rod-shaped member installed to be able to advance and retreat within the pusher insertion holes 12b, 120b, and 121b using a drive mechanism (not shown). The drive mechanism is comprised of, for example, a cam mechanism. That is, the rear end of the pusher 13 serves as a cam follower. The cam follower follows the peripheral surface of the oval-shaped cam. The cam is axially supported by a rotation motor and can rotate in the circumferential direction. When the rotation motor drives and the cam rotates, the cam follower moves up the bulge of the cam, pushes the pusher 13 up, and the tip of the pusher 13 protrudes from the pusher insertion hole 121b.

The component pressing body 130 is a member installed in the chamber 10 and located on the opposite side from the protection sheet 61 with the electronic component 60 interposed therebetween. The surface of the component pressing body 130 facing the electronic component 60 is a flat surface 130a. The flat surface 130a has a size equal to or larger than the component arrangement area 615. The component pressing body 130 of this embodiment is a vertebrae with the flat surface 130a as its bottom surface. That is, the component pressing body 130 has a shape expanded toward the flat surface 130a, with the center on the opposite side from the flat surface 130a as the vertex.

The component pressing body 130 is installed to be movable in directions approaching and away from the component arrangement sheet 66 by the drive mechanism 132 . The drive mechanism 132 is, for example, a pneumatic or hydraulic cylinder, and its drive shaft 132a penetrates the through hole formed in the ceiling of the cover portion 11 airtightly by a sealing member 132b such as an O-ring. there is. The drive shaft 132a is connected to the apex of the vertebral body of the component pressing body 130.

Additionally, a component-side elastic body 131 is provided on the flat surface 130a. The component-side elastic body 131 is an elastically deformable sheet and has a flat component opposing surface 131a facing the component-placed sheet 66. For example, silicone rubber or the like can be used as the part-side elastic body 131. The material applicable to the part-side elastic body 131 is the same as that of the sheet-side elastic body 121. Flat means that the electronic components 60 of the component placement sheet 66 can be pressed evenly, and minor irregularities or surface roughness are permitted. In this embodiment, the part-side elastic body 131 has a surface opposite to the component opposing surface 131a adhered to the entire flat surface 130a of the component pressing body 130 with an adhesive or the like. The area of the component-side elastic body 131 may be larger than the area of the component arrangement area 615.

If the adhesive force between the component opposing surface 131a and the adhesive surface 611 of the protective sheet 61 is Fa, and the adhesive force between the electrode exposed surface 601 and the adhesive surface 61 of the protective sheet 61 is Fb, then Fa <Fb. For this reason, even if the protection sheet 61 comes into contact with the component opposing surface 131a, it is likely to peel off from the component opposing surface 131a while maintaining adhesion to the electrode exposed surface 601. Additionally, the component opposing surface 131a has a surface roughness Ra (arithmetic mean roughness) of 1.6 or more and 25 or less. As a result, the component opposing surface 131a is likely to peel off from the upper surface 603 of the electronic component 60. However, since it is difficult for the component opposing surface 131a to slip in a direction parallel to the upper surface 603 of the electronic component 60, the electronic component 60 is misaligned in the plane direction of the protection sheet 61. is difficult to occur.

(movement)

The flow of operation of such an embedding processing unit 1 will be described with reference to FIGS. 7 to 10. 7 and 8 are transition diagrams schematically showing the states in each process of the landfill processing unit 1. FIG. 9 is a transition diagram showing the state of the electronic component 60 in the embedding processing unit 1. FIG. 10 is a diagram showing a state in which the protection sheet 61 and the component-side elastic body 131 are in contact with each other.

First, as shown in (a) of FIG. 7, the cover portion 11 is sufficiently spaced apart from the placement portion 12, and the tip of the pusher 13 is aligned with the seat opposing surface 121a of the seat side elastic body 121. ) protrudes from the In this state, the component arrangement completed sheet 66 is put into the embedding processing section 1. The frame 62 of the loaded component arrangement sheet 66 is supported by the pusher 13.

As shown in (b) of FIG. 7, when the pusher 13 is retracted into the pusher insertion holes 12b, 120b, and 121b, the component arrangement completed sheet 66 is placed on the sheet opposing surface of the sheet side elastic body 121. It touches (121a). At this time, the guide pin contacts the outer edge of the component arrangement completed sheet 66.

As shown in (c) of FIG. 7, when the cover part 11 is moved toward the placement part 12 to the closed position, the opposing surface 11a of the cover part 11 and the placement part 12 face each other. The surfaces 12a meet through the sealing member 115. As a result, the component arrangement sheet 66 is trapped in the internal space 111 sealed by the sealing member 115.

Then, negative pressure is generated in the exhaust hole 12d of the placement unit 12 to reduce the pressure in the internal space 111 in which the component placement sheet 66 is confined, thereby creating a vacuum. At this stage, as shown in (a) of FIG. 9, the electronic component 60 is attached to the protective sheet 61 without the electrode 602 embedded in the adhesive surface 611 of the protective sheet 61. Since it is disposed, a gap exists between the electrode exposed surface 601 and the adhesive surface 611, and this gap is also reduced in pressure.

As shown in (a) of FIG. 8, the component pressing body 130 is moved toward the sheet pressing body 120, and the component opposing surface 131a of the component side elastic body 131 is pressed to the electronic component 60. pressure. Then, the electrode 602 of the electronic component 60 is embedded in the adhesive surface 611 of the protective sheet 61. And, as shown in (b) of FIG. 9, by deforming the sheet side elastic body 121 to sink together with the protective sheet 61, the surface of the electrode 602 and the electrode exposed surface 601 around it are The surface of the electrode 602 and the electrode exposed surface 601 are in close contact with the protective sheet 61. For this reason, insufficient embedding of the electrode 602 in the protective sheet 61 at the end of the component arrangement area 615 and insufficient adhesion of the electrode exposed surface 601 to the protective sheet 61 are prevented.

The electrode exposed surface 601 and the protective sheet 61 are brought into close contact with each other in a reduced pressure environment as described above, and there is no or very little air in the sealed internal space 111. Therefore, the possibility of air bubbles entering between the electrode exposed surface 601 and the protective sheet 61 is reduced. In addition, since the component pressing body 130 is a cone body that extends from the drive shaft 132a to the flat surface 130a, the pressure from the drive shaft 132a is not concentrated in the center but is uniformly distributed over the flat surface 130a. do. For this reason, the pressure of the drive shaft 132a is not concentrated at the center and does not bend like a flat plate, and all electronic components 60 are pressed equally.

On the other hand, as shown in (b) of FIG. 9, the electronic component 60 pressed in this way causes the protective sheet 61 immediately below to sink together with the sheet side elastic body 121. For this reason, the protective sheet 61 around the pressed electronic component 60 rises once toward the component opposing surface 131a of the component-side elastic body 131.

Next, as shown in (b) of FIG. 8, the component pressing body 130 is moved in a direction away from the sheet pressing body 120 to separate the component side elastic body 131 from the electronic component 60. I order it. Then, as shown in Figure 9(c), as the sheet side elastic body 121 returns to its original shape, the raised portion of the protective sheet 61 returns to its original flat surface. For this reason, while close contact of the protection sheet 61 with the electrode exposed surface 601 is ensured, the protection sheet 61 is not in close contact with the lower side 604 of the electronic component 60. For this reason, in the subsequent film formation process, the electromagnetic wave shield film 605 can be formed up to the lower part of the side surface 604 of the electronic component 60, and electromagnetic waves such as those incident from the side side can be effectively shielded. .

On the other hand, as shown in FIG. 10, there are cases where the adhesive surface 611 reaches the component opposing surface 131a of the component-side elastic body 131 due to the elevation of the protective sheet 61. Even in this case, as the sheet-side elastic body 121 returns to its original shape after the compression is released, the protective sheet 61 returns to its original shape, so it is likely to peel off from the component-side elastic body 131. In addition, the adhesive force Fa between the component opposing surface 131a of the component-side elastic body 131 and the adhesive surface 611 of the protective sheet 61 is determined by the adhesive force Fa between the electrode exposed surface 601 of the electronic component 60 and the protective sheet. Since the adhesive force Fb with the adhesive surface 611 of (61) is smaller, the adhesive surface 611 of the protective sheet 61 maintains adhesion to the electrode exposed surface 601 and the component-side elastic body 131. It becomes easier to peel off from the.

Additionally, the component opposing surface 131a has a surface roughness Ra (arithmetic mean roughness) of 1.6 or more and 25 or less. For this reason, when the component pressing body 130 releases the pressure on the electronic component 60, the component opposing surface 131a of the component-side elastic body 131 becomes prone to peeling off from the electronic component 60.

As described above, when the electrode 602 of the electronic component 60 is embedded in the protective sheet 61 and the electrode exposed surface 601 of the electronic component 60 is in close contact with the protective sheet 61, the pneumatic circuit 75 ) is stopped from the exhaust hole 12d, thereby releasing the vacuum in the chamber 10. At the same time, the pusher 13 is moved in the axial direction along the pusher insertion holes 12b, 120b, and 121b to protrude from the sheet opposing surface 121a of the sheet side elastic body 121 again.

Then, as shown in (c) of FIG. 8, the cover part 11 is moved in a direction to separate it from the placement part 12. Finally, the pusher 13 is stopped, and the cover part 11 is stopped at a position away from the placement part 12. As a result, embedding of the electronic component 60 into the protection sheet 61 by the embedding processing unit 1 is completed.

On the other hand, it is necessary to release the pressure on the electronic component 60 by the component pressurizing body 130 before releasing the vacuum in the chamber 10. If the vacuum in the chamber 10 is released before releasing the pressurization of the electronic component 60, the surroundings become atmospheric pressure with the protection sheet 61 raised as described above. Then, when the adhesive surface 611 of the protective sheet 61 is attached to the side 604 of the electronic component 60, or when it is attached to the component opposing surface 131a of the component-side elastic body 131, This is because the attached state becomes fixed due to the surrounding atmospheric pressure, making it impossible to peel.

[Plate mounting part]

Next, the plate mounting unit 2, which is responsible for the plate mounting process, will be described. Figure 11(a) and Figure 11(b) are schematic diagrams showing the plate mounting portion 2. The cooling plate 63 to which the adhesive sheet 64 is previously attached and the component embedding sheet 67 created in the embedding processing unit 1 are placed in the plate mounting unit 2. The plate mounting unit 2 presses the component-embedded sheet 67 against the cooling plate 63 and pulls the component-embedded sheet 67 to the cooling plate 63, through the adhesive sheet 64. The component embedded sheet 67 is brought into close contact with the cooling plate 63.

The plate mounting portion 2 is provided with a ceiling portion 21 and a placement table 22. The ceiling portion 21 and the placement table 22 are arranged to face each other. Meanwhile, the ceiling portion 21 is capable of being raised and lowered relative to the placement table 22 . The ceiling portion 21 is a block with an internal space 211 and has a flat surface 212 on the side facing the placement table 22. The placement table 22 has a cup shape with a bottom. The opening 221 of the placement table 22 faces the ceiling 21.

In this placement table 22, the edge portion 222 supports the cooling plate 63, and the opening 221 is closed by the cooling plate 63. The side of the cooling plate 63 opposite to the side to which the adhesive sheet 64 is adhered is in contact with the edge portion 222. Additionally, the fully embedded component sheet 67 is placed on the cooling plate 63 while facing the adhesive sheet 64 . An air pressure supply hole 223 is formed through the bottom of the placement table 22. The air pressure supply hole 223 is connected to the air pressure circuit 75.

Additionally, a pusher insertion hole 224 that penetrates the placing table 22 is formed in the edge portion 222 of the placing table 22. The pusher 23 is inserted into this pusher insertion hole 631 and is airtightly sealed with a sealing member such as an O-ring. This pusher 23 is capable of penetrating the placement table 22, the cooling plate 63, and the adhesive sheet 64 to emerge and retract.

A plurality of air holes 213 leading to the internal space 211 are formed through the flat surface 212 of the ceiling portion 21 . An air pressure supply hole 214 is formed through the internal space 211 of the ceiling portion 21 at a different location from the flat surface 212. The air pressure supply hole 214 is connected to the air pressure circuit 75.

Additionally, on the flat surface 212 of the ceiling portion 21, an O-ring surrounds the through-forming area of the air hole 213 along the frame 62 of the component-embedded sheet 67 mounted on the placement table 22. A sealing member 215 such as the like is provided. That is, the outer peripheral portion of the flat surface 212 of the ceiling portion 21 presses the frame 62 through the sealing member 215, and the outer peripheral portion of the protective sheet 61 presses the cooling plate 63.

As shown in (a) of FIG. 11, this plate mounting portion 2 mounts the cooling plate 63 on the edge portion 222 of the placement table 22, and inserts the component into the pusher 23. With the frame 62 of 67 supported, the ceiling portion 21 is lowered, negative pressure is generated in the internal space 211, and the electronic component 60 is pulled to the flat surface 212. When the pusher 23 and the ceiling portion 21 are lowered and the frame 62 is pressed against the adhesive sheet 64 through the protective sheet 61, the cooling plate 63 on which the adhesive sheet 64 is installed and the protective sheet 61 ) A closed space is formed between them.

As shown in FIG. 11 (b), while maintaining the negative pressure in the ceiling portion 21, negative pressure is also generated in the placement table 22, and then the negative pressure in the ceiling portion 21 is gradually changed to positive pressure. Then, the component embedded sheet 67 is pressed and mounted on the adhesive sheet 64 attached to the cooling plate 63.

[Tabernacle Processing Department]

Next, the film forming processing unit 3, which is responsible for the film forming process, will be described. FIG. 12(a) and FIG. 12(b) are schematic diagrams showing the film forming processing unit 3. The film formation processing unit 3 forms an electromagnetic wave shield film 605 on each electronic component 60 on the component mounting plate 68 by sputtering. As shown in (a) of FIG. 12, this film forming processing unit 3 has a chamber 31 and a load lock chamber 32. The chamber 31 is a cylindrical vacuum chamber whose diameter is enlarged in the radial direction rather than in the axial direction. The inside of the chamber 31 is divided into a plurality of fan-shaped partitions by partitions 33 extending along the radial direction. A processing position 311 and a deposition position 312 are assigned to some fan-shaped partitions.

The partition portion 33 extends from the ceiling of the chamber 31 toward the floor, but is short of the floor. A rotary table 34 is installed in the space on the floor side without the partition portion 33. The rotary table 34 is a conveyance device that conveys the cooling plate 63. Electronic components 60 embedded in the protection sheet 61 are mounted on this cooling plate 63 . The rotary table 34 has a disk shape coaxial with the chamber 31 and rotates in the circumferential direction. The component mounting plate 68 loaded into the chamber 31 from the load lock chamber 32 is placed on the rotary table 34 and moves circumferentially in a circumferential trajectory, at the processing position 311 and the film forming position 312. ) circulates.

Meanwhile, in order to maintain the position of the component mounting plate 68 with respect to the rotation table 34, the rotation table 34 includes a component mounting plate such as a groove, hole, protrusion, jig, holder, mechanical chuck, or adhesive chuck. A holding means for maintaining (68) is installed.

A surface treatment unit 35 is installed at the treatment position 311. This surface treatment unit 35 introduces a process gas such as argon gas, turns the process gas into plasma by applying a high-frequency voltage, and generates electrons, ions, radicals, etc. For example, this surface treatment portion 35 is a cylindrical electrode opened on the rotary table 34 side, and a high-frequency voltage is applied by an RF power source.

A target 361 constituting the sputter source 36 is installed at the film forming position 312, and sputter gas, which is an inert gas such as argon gas, is introduced. The sputter source 36 applies power to the target 361 to turn the sputter gas into plasma, causes the generated ions, etc. to collide with the target 361, and emits particles. The target 361 contains the material of the electromagnetic wave shield film 605. That is, particles of the electromagnetic shield film 605 are ejected from the target 361, and the ejected particles of the electromagnetic shield film 605 are deposited on the electronic component 60 on the rotary table 34.

These deposition positions 312 are installed at two locations, for example. The target material for each film formation position 312 may be the same material, or may be used as a different material to form the laminated electromagnetic wave shield film 605. As a power source for applying power to the sputter source 36 at each deposition position 312, a known power source such as a DC power source, a DC pulse power source, or an RF power source can be used. In addition, the power source that applies power to the sputter source 36 may be installed for each sputter source 36, or a common power source may be converted to a switch and used.

In this film formation processing unit 3, the surface of the electronic component 60 is cleaned and roughened by etching or ashing at the processing position 311 to improve the adhesion of the electromagnetic wave shield film 605 to the electronic component 60. By raising the temperature and depositing the particles of the target 361 on the electronic component 60 at the film deposition position 312, the electromagnetic wave shield film 605 is formed on the electronic component 60. Since the electrode 602 is embedded in the protective sheet 61 and the exposed electrode surface 601 is in close contact with the protective sheet 61, particles of the electromagnetic wave shield film 605 are prevented from adhering to the electrode 602. Additionally, particles of the electromagnetic wave shield film 605 are prevented from entering between the electrode exposed surface 601 and the protective sheet 61. Additionally, the heat of the electronic component 60 is transferred to the cooling plate 63, and excessive heat storage of the electronic component 60 is suppressed.

Meanwhile, this film forming unit 3 forms a film on the electronic component 60 using a sputtering method, but the film forming method is not limited to this. For example, the film forming unit 3 may be a device that forms the electromagnetic wave shield film 605 on the electronic component 60 by vapor deposition, spray coating, or application.

[Plate release part]

Next, the plate release unit 4, which is responsible for the plate release process, will be described. Figure 13(a) and Figure 13(b) are schematic diagrams showing the plate release portion 4. A component mounting plate 68 on which an electromagnetic wave shield film 605 is formed on the electronic component 60 is inserted into the plate release unit 4. The plate release unit 4 peels the component embedded sheet 67 from the cooling plate 63 as the first process for obtaining the individual electronic components 60 .

As shown in (a) of FIG. 13, the plate release portion 4 is provided with a ceiling portion 41 and a placement table 42. The ceiling portion 41 and the placement table 42 are arranged to face each other. Meanwhile, the ceiling portion 41 is capable of being raised and lowered relative to the placement table 42 . The ceiling portion 41 is a block with an internal space 411, and has a flat surface 412 on the side facing the placement table 42. The placement table 42 has a cup shape with a bottom, and the opening 421 faces the ceiling portion 41.

In this placement table 42, the edge portion 422 supports the component mounting plate 68, and the opening 421 is closed by the component mounting plate 68. The edge portion 422 is in contact with the cooling plate 63. An air pressure supply hole 423 is formed through the bottom of the placement table 42. The air pressure supply hole 423 is connected to the air pressure circuit 75.

In addition, a pusher insertion hole 424 that penetrates the placing table 42 is formed in the edge portion 422 of the placing table 42. The pusher 43 is inserted into this pusher insertion hole 424 and is airtightly sealed with a sealing member such as an O-ring. The pusher 43 moves in the axial direction so that the tip of the pusher 43 can protrude to a position higher than the frame 62 of the component mounting plate 68 mounted on the placement table 42.

Additionally, a pair of support blocks 44 are arranged on both sides of the placement table 42. The clamping block 44 inserts only the cooling plate 63 among the component mounting plates 68 mounted on the placement table 42. The clamping blocks 44 are capable of contacting and separating from each other with the cooling plate 63 as the center.

Next, a plurality of air holes 413 leading to the internal space 411 are formed through the flat surface 412 of the ceiling portion 41. An air pressure supply hole 414 is formed through the internal space 411 of the ceiling portion 41 at a different location from the flat surface 412. An air pressure circuit 75 is connected to the air pressure supply hole 414.

Additionally, on the flat surface 412 of the ceiling portion 41, an O-ring, etc., surround the penetrating area of the air hole 413 along the frame 62 of the component mounting plate 68 mounted on the placement table 42. A sealing member 415 is installed.

In this plate release unit 4, the component mounting plate 68 to which the cooling plate 63 is attached is placed on the placement table 42. As shown in (a) of FIG. 13, the ceiling portion 41 is lowered toward the placement table 42, and the flat surface 412 of the ceiling portion 41 is brought into contact with the frame 62 of the component mounting plate 68. I order it. As shown in (b) of FIG. 13, negative pressure is generated in the sealed internal space 411 of the ceiling portion 41, and positive pressure is generated in the placement table 42. As a result, a force sufficient to separate the component arrangement area 615 from the cooling plate 63 acts on the component arrangement area 615, and the component arrangement area 615 is separated from the cooling plate 63.

When the component arrangement area 615 is separated from the cooling plate 63, the outer frame area 613 to which the frame 62 is adhered is moved by the movement of the ceiling portion 41 as the pusher 43 advances, and the cooling plate ( 63), and the entire protective sheet 61 is peeled off from the cooling plate 63.

[Peeling processing unit]

Additionally, the peeling processing unit 5 responsible for the component peeling process will be described. Figure 14(a) and Figure 14(b) are schematic diagrams showing the peeling processing unit 5. The component-embedded sheet 67 from which the cooling plate 63 has been removed is input into the peeling processing unit 5 via the plate release unit 4, and the individual electronic components 60 are peeled from the protective sheet 61. .

This peeling processing unit 5 includes a placement table 51 on which the embedded component sheet 67 is placed, a chuck 52 that holds the protection sheet 61 and moves continuously, and a protection sheet 61 ), a guide portion 53 that hooks the end of the chuck 52 to create a trigger for gripping the protective sheet 61, a sheet stopper 54 that creates a starting point for peeling the protective sheet 61, and an electronic component 60. ) is provided with a component stopper (55) that prevents the device from lifting.

The placement table 51 has a flat surface 511 on which the component-embedded sheet 67 is placed. The component embedded sheet 67 is placed with the electronic component 60 facing the flat surface 511, the upper surface 603 of the electronic component 60 is in contact with the placement surface, and the protective sheet 61 is facing upward. It is placed as follows.

This placement table 51 is a block having an internal space 512. A plurality of air holes 513 are formed through the flat surface 511 of the placement table 51 in the area facing the component arrangement area 615. The air hole 513 is in communication with the internal space 512 of the mounting table 51. An air pressure supply hole 514 is formed through the internal space 512 of the placement table 51 at a different location from the flat surface 511. The air pressure supply hole 514 is connected to the air pressure circuit 75.

The chuck 52 is a pair of blocks with opposing grip surfaces. A pair of blocks can be contacted and separated. This chuck 52 is supported on a moving device movable in the horizontal and vertical directions, and is held against the flat surface 511 along the protective sheet 61 mounted on the flat surface 511 of the placing table 51. It moves continuously at an angle of attack of 45 degrees.

The sheet stopper 54 is a roller that has a cylindrical shape with a long axis crossing one side of the protective sheet 61 and is rotatable. This sheet stopper 54 maintains a constant height based on the flat surface 511 of the placement table 51, stays directly below the chuck 52, and moves the placement table 51 along a direction perpendicular to the long axis. Terminates the protective sheet 61 disposed on.

The component stopper 55 is a roller that has a cylindrical shape with a long axis that crosses at least the entire component arrangement area 615 of the protective sheet 61 and is rotatable about its axis. This component stopper 55 is arranged to enable access to and separation from the sheet stopper 54.

The guide portion 53 is disposed at a position having a common axis with the guide portion insertion hole 621 of the frame 62. The tip of the guide portion 53 faces the guide portion insertion hole 621 of the frame 62. This guide portion 53 is movable in the axial direction, protrudes toward the end of the protection sheet 61, pushes the end of the protection sheet 61 toward the chuck 52, and pushes the end of the protection sheet 61 toward the chuck 52. It advances within the guide portion insertion hole 621 of the frame 62 until it touches the chuck 52. This guide portion 53 peels off one side of the protective sheet 61 by pushing up.

In this peeling processing unit 5, as shown in (a) of FIG. 14, the component-embedded sheet 67 is placed with the upper surface 603 of the electronic component 60 in contact with the flat surface 511. It is placed on the placement table (51). Negative pressure is generated in the air hole 513 of the placement table 51, and the electronic component 60 is suction-fixed to the flat surface 511. The guide portion 53 moves upward in the axial direction, pushes the end of the protection sheet 61 away from the frame 62, peels the end of the protection sheet 61, and moves the end of the protection sheet 61 toward the chuck 52. induce.

When the end of the protection sheet 61 touches the chuck 52, the pair of blocks is closed, as shown in (b) of FIG. 14, and the end of the protection sheet 61 is held by the chuck 52. do. When the chuck 52 grips the end of the protective sheet 61, the component stopper 55 is moved to bring the component stopper 55 and the sheet stopper 54 closer to a distance less than the length of the electronic component 60. .

The chuck 52 is pulled up while the chuck 52 and the sheet stopper 54 are moved along the protective sheet 61. Then, the protection sheet 61 is pulled up on the chuck 52 starting from the sheet stopper 54, and the electronic component 60 is peeled from the protection sheet 61 starting from the sheet stopper 54. As a result, all electronic components 60 are peeled from the protective sheet 61 and arranged on the flat surface 511 of the placement table 51 . In this way, the electronic component 60 peeled from the protective sheet 61 is recovered.

(action effect)

(1) This embodiment is a film forming device 7 for an electronic component 60 in which an electrode exposed surface 601 on which an electrode 602 is formed is adhered to an adhesive surface 611 of a protective sheet 61, For the embedding processing unit 1 that embeds the electrode 602 in the adhesive surface 611 of the protective sheet 61, and the electronic component 60 in which the electrode 602 is embedded in the protective sheet 61, a film forming material is applied. It is provided with a film forming processing unit 3 that forms a film.

The embedding processing unit 1 includes a chamber 10 whose interior can be vacuumed, and a sheet pressurizing device installed within the chamber 10 and located on the opposite side from the electronic component 60 with the protection sheet 61 interposed therebetween. A sieve 120, a component pressing body 130 installed in the chamber 10 and located on the opposite side from the protection sheet 61 with the electronic component 60 interposed therebetween, and a sheet pressing body 120 are provided. , a sheet side elastic body 121 having a flat sheet opposing surface 121a facing the protective sheet 61, and a flat component opposing surface 131a provided on the component pressing body 130 and facing the electronic component 60. ) and the sheet pressing body 120 and the component pressing body 130 are moved relative to each other, between the sheet opposing surface 121a and the component opposing surface 131a, the electronic component 60 and the protective sheet 61 are pressed against each other. It has a driving mechanism 132 for pressing.

For this reason, when the electronic component 60 is pressed against the protective sheet 61, the sheet-side elastic body 121 is elastically deformed, so that the protective sheet 61 moves along the surface of the electrode 602 and the electrode exposed surface 601. It is transformed and adheres tightly. That is, when the protective sheet 61 is supported by a hard plate or the like, there is a limit to the amount of deformation of the protective sheet 61 alone. On the other hand, in the present embodiment, since the protective sheet 61 is supported by the sheet side elastic body 121, the thickness into which the electrode 602 sinks can be increased, and the protective sheet 61 is connected to the electrode 602. It becomes easy to deform along the irregularities of the surface and the electrode exposed surface 601. Therefore, the occurrence of gaps or voids between the protective sheet 61 and the surface of the electrode 602 and the electrode exposed surface 601 can be suppressed, the protective sheet 61 can be brought into close contact, and electromagnetic waves can be shielded from the gap during film formation. Particles of the film 605 are prevented from entering. In addition, when relying on deformation of only the protective sheet 61, high pressure is required to compress the protective sheet 61, but in the present embodiment, since the sheet side elastic body 121 is deformed, a relatively low pressure drive is required. Even the mechanism 132 can be easily modified, making it possible to miniaturize the entire device.

As a result, for example, even when the distance Wb (see FIG. 2) from the outermost electrode 602 to the outer edge of the electrode exposed surface 601 is narrow, the protective sheet 61 is connected to the surface of the electrode 602. It can be brought into close contact with the electrode exposed surface 601. Additionally, the protective sheet 61 needs to be relatively thin so that the heat accumulated in the electronic component 60 during film formation can be easily dissipated to the film forming unit 3 side through heat conduction. However, when the protective sheet 61 is thin, the cushioning properties are weak and the amount of deformation becomes much smaller. For this reason, the electrode 602 that protrudes from the electrode exposed surface 601 by tens of μm to hundreds of μm cannot be absorbed simply by deforming the protective sheet 61, and the protective sheet 61 exposes the surface of the electrode 602 and the electrode. It is difficult to deform it to follow the plane 601. In this embodiment, by deforming the sheet side elastic body 121 as described above, the amount of deformation of the protective sheet 61 can be ensured, and thus the occurrence of gaps and voids can be suppressed.

In addition, since the deformation of the sheet side elastic body 121 is elastic deformation, the electronic component 60 and the protective sheet 61 are pressed against each other, and the sheet opposing surface 121a is deformed to sink, and then the pressing is released. Returns to its original flat shape. Then, even when the protection sheet 61 is in contact with the side 604 of the electronic component 60 due to sinking, the protection sheet 61 returns to its original shape together with the sheet side elastic body 121, thereby causing the side ( 604) can be prevented. As a result, the formation of the electromagnetic wave shield film 605 is not hindered by the protective sheet 61 attached to the side 604, and the lack of film formation of the electromagnetic wave shield film 605 on the side 604 and the ground wiring are prevented. Connection failure can be prevented. Furthermore, even when the protective sheet 61 is deformed until it comes into contact with the component opposing surface 131a, it returns to its original shape together with the sheet side elastic body 121, thereby preventing it from coming into close contact with the component opposing surface 131a. .

(2) The film formation processing unit 3 includes a chamber 31 into which sputter gas is introduced, a sputter source 36 installed in the chamber 31 and depositing a film forming material by sputtering to form a film, and a protection sheet 61. It has a cooling plate 63 on which the electronic component 60 embedded in ) is mounted, and a transport device for transporting the cooling plate 63.

As described above, by deforming the sheet side elastic body 121, the protective sheet 61 can be deformed to follow the surface of the electrode 602 and the electrode exposed surface 601, so that the protective sheet 61 can be made thin. As a result, the heat of the electronic component 60 can be easily dissipated to the cooling plate 63, and the heat dissipation effect can be improved.

(3) The thickness Ts of the sheet side elastic body 121 is thicker than the thickness Te of the electrode 602, and the hardness is Shore A15 or more and Shore A50 or less. For this reason, the sheet side elastic body 121 has a desirable thickness so that the electrode 602 sinks and deforms together with the protective sheet 61. In addition, the protective sheet 61 is deformed to follow the surface of the electrode 602 and the electrode exposed surface 601, returns to its original shape, and has a desirable hardness so that it can be peeled off from the side 604 or the component opposing surface 131a. has More specifically, if the hardness of the seat side elastic body 121 is less than Shore A15, it becomes difficult to restore the seat side elastic body 121 that has been deformed by pressure during embedding of the electronic component 60, and the seat side elastic body 121 ), it becomes difficult for the protective sheet 61 to return to its original shape. For this reason, when the protective sheet 61 comes into contact with the component-side elastic body 131 or the side 604 of the electronic component 60, it becomes difficult to peel off. In the present embodiment, the hardness of the sheet side elastic body 121 is Shore A15 or higher, so even in this case, the protective sheet 61 is prone to peeling. On the other hand, if the hardness of the sheet side elastic body 121 is greater than Shore A50, it becomes difficult for the sheet side elastic body 121 to deform even when pressed when embedding the electronic component 60, and the protective sheet ( 61) becomes difficult to transform. For this reason, when the distance Wb from the outermost electrode 602 to the outer edge of the electrode exposed surface 601 is narrow, the protective sheet 61 is applied to the surface of the electrode 602 and the electrode exposed surface 601. It becomes difficult to adhere closely. In this embodiment, since the hardness of the sheet side elastic body 121 is Shore A50 or less, the protective sheet 61 is likely to deform and come into close contact with the surface of the electrode 602 and the electrode exposed surface 601.

(4) Let the adhesive force between the component opposing surface 131a and the protective sheet 61 be Fa, and the adhesive force between the electrode exposed surface 601 of the electronic component 60 and the adhesive surface 611 of the protective sheet 61. If Fb, then Fa<Fb. For this reason, even when the protective sheet 61 is in contact with the component opposing surface 131a, it is easy to peel off while maintaining adhesion to the electrode exposed surface 601. As a result, the protective sheet 61 is maintained attached to the component opposing surface 131a, and is adhered in contact with the side surface 604 of the electronic component 60, thereby preventing the occurrence of areas where film is not formed.

(5) The surface roughness Ra (arithmetic mean roughness) of the component opposing surface 131a is 1.6 or more and 25 or less. For this reason, adhesion to the electronic component 60 is prevented and the electronic component 60 is prevented from following and lifting when the pressure is released.

(6) The component pressing body 130 is provided with a component-side elastic body 131 having a component opposing surface 131a. For this reason, the peelability when the protective sheet 61 is in contact with the component opposing surface 131a can be improved.

[Other Embodiments]

The present invention is not limited to the above-described embodiments, and also includes the following aspects. For example, the part-side elastic body 131 may be omitted. In this case, the flat surface 130a of the component pressing body 130 functions as the component opposing surface 131a. In this case as well, in order to facilitate peeling from the adhesive surface 611 of the protective sheet 61 and the upper surface 603 of the electronic component 60, the surface of the flat surface 130a may be uneven or roughened. good night. Additionally, a material that is easy to peel, such as a release sheet, may be attached to the flat surface 130a.

The driving mechanism of the cover portion 11 and the driving mechanism 132 of the component pressing body 130 can be any known mechanism and are not limited to the above-described mechanisms. For example, a linear guide in which a slider moves along a rail according to the rotation of the ball screw may be applied. Additionally, the sheet press body 120 and the component press body 130 just need to be able to press the electronic component 60 and the protection sheet 61 against each other by relative movement. For this reason, the drive mechanism 132 may be installed on at least one of the sheet press body 120 and the component press body 130, or may be installed on both sides. That is, the sheet press body 120 and the component press body 130 include not only members that press by moving with respect to the press target, but also members that press by reaction while stationary with respect to the press target.

The configuration of the plate mounting portion 2, the film forming portion 3, the plate releasing portion 4, and the peeling portion 5 are not limited to the above-mentioned embodiments. In other words, these can be devices that can perform plate mounting, film forming, plate release, and component peeling. For example, the plate mounting unit 2, like the embedding processing unit 1, may be a device that mounts the cooling plate 63 on the protection sheet 61 by pressing it with a pressurizing body. The peeling processing unit 5 may be a mechanism that pushes the electronic component 60 through the protective sheet 61 with a pin and removes the electronic component 60 from the protective sheet 61 with a pickup means such as a nozzle. good night. Additionally, the film forming apparatus 7 may be provided with a transfer unit responsible for the component placement process. The transfer unit is responsible for the component placement process and transfers the electronic components 60 from the tray on which the electronic components 60 before film forming processing are placed to the component non-placement sheet 65.

In addition, the film forming apparatus 7 is a device provided with an embedding processing unit 1, a plate mounting unit 2, a film forming processing unit 3, a plate release unit 4, and a peeling processing unit 5, but each of these units is independent. It may be configured as a device and systemized. That is, the embedding processing unit 1 may be an independent embedding processing device, the plate mounting portion 2 may be an independent plate mounting device, the film forming processing section 3 may be an independent film forming processing device, and the plate release portion 4 may be an independent plate. A release device may be sufficient, and the peeling processing unit 5 may be an independent peeling processing device.

Above, the embodiment of the present invention and the modified examples of each part have been described. However, this embodiment and the modified example of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention and are included in the invention described in the claims.

1: Landfill processing section 2: Plate mounting section
3: Film forming section 4: Plate release section
5: Stripping processing unit 7: Film forming device
10, 31: Chamber 11: Cover part
11a, 12a: opposing surface 12: placement portion
12b, 120b, 121b, 224, 424, 631: Pusher insertion through hole
12c, 115, 132b, 215, 415: sealing member
12d: exhaust hole 13, 23, 43: pusher
21, 41: ceiling part 22, 42, 51: placement table
24b, 45: closed space 32: load lock room
33: compartment 34: rotary table
35: Surface treatment unit 36: Sputter source
44: support block 52: chuck
53: Guide 54: Seat stopper
55: component stopper 60: electronic component
61: Protective sheet 62: Frame
63: cooling plate 64: adhesive sheet
65: Parts not placed sheet 66: Parts placed sheet
67: Parts embedded completion sheet 68: Parts mounting plate
73: transfer unit 74: control unit
75: Pneumatic circuit 111, 512, 211, 411: Internal space
120: Sheet press body
120a, 130a, 212, 412, 511: Flat surface 121: Sheet side elastic body
121a: Sheet opposing surface 130: Part press body
131: Part side elastic body 131a: Part opposing surface
132: Drive mechanism 132a: Drive shaft
213, 413, 513, 632: air hole
214, 223, 414, 423, 514: Air pressure supply hole
221, 421: opening 222, 422: edge portion
311: Processing position 312: Tabernacle position
361: Target 601: Electrode exposed surface
602: electrode 603: upper surface
604: side 605: electromagnetic wave shield
611: Adhesive side 612: Non-adhesive side
613: Outer frame area 614: Middle frame area
615: Part arrangement area 621: Guide insertion through hole

Claims (12)

A film forming device for an electronic component in which an electrode exposed surface on which an electrode is formed is adhered to the adhesive surface of a protective sheet, comprising:
an embedding processing unit that embeds the electrode in the adhesive surface of the protective sheet;
A film forming processing unit that forms a film forming material onto the electronic component in which the electrode is embedded in the protective sheet.
Equipped with
The landfill processing unit,
A chamber whose interior can be vacuumed,
a sheet press body installed in the chamber and positioned on an opposite side from the electronic component with the protection sheet interposed therebetween;
a component press body installed in the chamber and located on an opposite side of the protection sheet with the electronic component interposed therebetween;
a sheet side elastic body installed on the sheet press body, having a flat sheet opposing surface facing the protective sheet, and having a hardness of Shore A15 or more and Shore A50 or less;
a flat component opposing surface provided on the component pressing body and facing the electronic component;
A drive mechanism that presses the electronic component and the protection sheet against each other between the sheet opposing surface and the component opposing surface by relatively moving the sheet pressing body and the component pressing body.
A film forming device characterized by having a. A film forming device for an electronic component in which an electrode exposed surface on which an electrode is formed is adhered to the adhesive surface of a protective sheet, comprising:
an embedding processing unit that embeds the electrode in the adhesive surface of the protective sheet;
A film forming processing unit that forms a film forming material onto the electronic component in which the electrode is embedded in the protective sheet.
Equipped with
The landfill processing unit,
A chamber whose interior can be vacuumed,
a sheet press body installed in the chamber and positioned on an opposite side from the electronic component with the protection sheet interposed therebetween;
a component press body installed in the chamber and positioned on an opposite side of the protection sheet with the electronic component interposed therebetween;
a sheet side elastic body provided on the sheet pressing body and having a flat sheet opposing surface facing the protective sheet;
a flat component opposing surface provided on the component pressing body and facing the electronic component;
By moving the sheet press body and the component press body relative to each other, the electronic component placed on the protection sheet and the protection sheet are pressed against each other between the sheet opposing surface and the component opposing surface, so that the electronic component and the protective sheet are pressed together with the protective sheet. a drive mechanism that elastically deforms the sheet-side elastic body and raises the adhesive surface of the protective sheet around each of the electronic components to cover the exposed surface of the electrode of the electronic component;
The sheet-side elastic body, when pressing the electronic component and the protective sheet, deforms the protective sheet so that it follows the surface of the electrode and the exposed surface of the electrode of the electronic component, and returns to its original shape to protect the electronic component. A film forming device characterized by having a hardness that can be peeled off from the side. The film forming apparatus according to claim 2, wherein the sheet side elastic body has a hardness of Shore A15 or more and Shore A50 or less. The film forming apparatus according to claim 1 or 2, wherein the thickness of the sheet side elastic body is thicker than the thickness of the electrode. The method according to any one of claims 1 to 3, wherein the adhesive force between the opposing surface of the component and the adhesive surface of the protective sheet is Fa,
If the adhesive force between the exposed surface of the electrode and the adhesive surface of the protective sheet is Fb,
Fa<Fb
A tabernacle device, characterized in that. The film forming apparatus according to any one of claims 1 to 3, wherein the component opposing surface has a surface roughness (Ra) of 1.6 or more and 25 or less. The film forming apparatus according to any one of claims 1 to 3, wherein a component-side elastic body having the component opposing surface is provided on the component opposing surface. The film forming apparatus according to any one of claims 1 to 3, wherein the component pressing body is a vertebral body whose bottom surface is an opposing surface of the component. A film forming device for an electronic component in which an electrode exposed surface on which an electrode is formed is adhered to the adhesive surface of a protective sheet, comprising:
an embedding processing unit that embeds the electrode in the adhesive surface of the protective sheet;
A film forming processing unit that forms a film forming material onto the electronic component in which the electrode is embedded in the protective sheet.
Equipped with
The landfill processing unit,
A chamber whose interior can be vacuumed,
a sheet press body installed in the chamber and positioned on an opposite side from the electronic component with the protection sheet interposed therebetween;
a component press body installed in the chamber and located on an opposite side of the protection sheet with the electronic component interposed therebetween;
a sheet side elastic body provided on the sheet pressing body and having a flat sheet opposing surface facing the protective sheet;
a component-side elastic body installed on the component pressing body, facing the electronic component, and having a flat component opposing surface having a surface roughness of 1.6 or more and 25 or less;
By moving the sheet press body and the component press body relative to each other, the electronic component placed on the protection sheet and the protection sheet are pressed against each other between the sheet opposing surface and the component opposing surface, so that the electronic component and the protective sheet are pressed together with the protective sheet. A driving mechanism that elastically deforms the sheet-side elastic body and the component-side elastic body and causes the adhesive surface of the protective sheet around each of the electronic components to rise toward the component opposing surface to cover the electrode-exposed surface of the electronic component.
A film forming device characterized by having a. The method of claim 9, wherein the sheet-side elastic body is capable of being deformed so that the protective sheet follows the surface of the electrode and the exposed surface of the electrode of the electronic component, and can be peeled off from the side of the electronic component by returning to its original shape. A film forming device characterized by having hardness. The film forming apparatus according to claim 9, wherein the sheet side elastic body has a hardness of Shore A15 or more and Shore A50 or less. The method according to any one of claims 9 to 11, wherein the adhesive force between the opposing surface of the component and the adhesive surface of the protective sheet is Fa,
If the adhesive force between the exposed surface of the electrode and the adhesive surface of the protective sheet is Fb,
Fa<Fb
A tabernacle device, characterized in that.