JP2019091828A - Deposition device and embedding device - Google Patents

Abstract

To provide a deposition device capable of depositing while sticking an electronic component and a protective sheet well, without air bubbles getting in.SOLUTION: An electronic component 60 is placed in a deposition device, while standing an electrode 602 on the adhesive surface of a protective sheet 61. The deposition device includes an embedding part 1 and a deposition part. The embedding part 1 embeds the electrode 602 of the electronic component 60 in the adhesive surface of the protective sheet 61. The deposition part performs deposition of the electronic component 60 having the electrode 602 embedded in the protective sheet 61, by depositing a deposition material by sputtering. The embedding part 1 has at least a sealed space for confining the electronic component 60 and the component arrangement region out of the protective sheet 61, and a decompression part for decompressing the sealed space. After decompression by the decompression part, the embedding part 1 presses the electronic component 60 and the protective sheet 61 together.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a film forming apparatus for forming a film on an electronic component attached to a protective sheet, and an embedding processing apparatus for embedding the electronic component on the adhesive surface of the protective sheet.

  A large number of electronic components such as semiconductor devices are mounted on wireless communication devices represented by mobile phones. The electronic component is transported from the processing device to the processing device to undergo various processes. As a representative example of the treatment, the formation of an electromagnetic wave shielding film can be mentioned. The electromagnetic wave shielding film suppresses the influence of electromagnetic waves on the inside and the outside, such as leakage of electromagnetic waves to the outside, in order to prevent the influence on communication characteristics. In general, an electronic component is formed of a sealing resin and has an outer shape, and a conductive electromagnetic shielding film is provided on a top surface and a side surface of the sealing resin to shield electromagnetic waves (see Patent Document 1). .

  A plating method is known as a method of forming an electromagnetic wave shielding film. However, since the plating method requires a wet process such as a pretreatment process, a plating process, and a post-treatment process such as water washing, an increase in the manufacturing cost of the electronic component can not be avoided. Then, the sputtering method which is a dry process attracts attention. In the sputtering method, an inert gas is introduced into a vacuum vessel in which a target is disposed, and a DC voltage is applied. Then, the ions of the plasmatized inert gas collide with the target of the film forming material, and the particles knocked out of the target are deposited on the electronic component. This deposited layer becomes an electromagnetic shielding film.

  The film forming apparatus for realizing the sputtering method is a cylindrical chamber whose inside is a vacuum chamber, a rotary table housed in the chamber and having a rotation axis coaxial with the chamber, and a film forming position partitioned in the chamber Have. The electronic component is placed on the rotating table, and the rotating table is rotated along the circumferential direction, thereby causing the electronic component to reach the film forming position and forming an electromagnetic shielding film. Thus, there is also rotational transport of electronic components within the processing apparatus.

  In such transport of the electronic component inside and outside the apparatus, the electronic component may receive an inertial force due to acceleration / deceleration, rotation, etc., and the electronic component may fall over or fall off from the film formation position. Therefore, the electronic component is attached to the adhesive film, and is subjected to transport and film formation of an electromagnetic wave shielding film. The adhesive force against the inertial force can keep the electronic component in the proper position.

  Further, the adhesive film not only improves the stationary property of the electronic component, but also prevents the particles of the electromagnetic wave shielding film from adhering to the electrodes during the film forming process, and maintains the insulation between the electrodes. The electrode of the electronic component is generally called a solder ball bump, and is formed by bonding a spherical solder (solder ball) having a diameter of several tens of micrometers to several hundreds of micrometers to a pad electrode of the electronic component. That is, the electrode of the electronic component is embedded in the adhesive film having flexibility, and the electrode exposed surface on which the electrode is exposed is brought into close contact with the adhesive film. Thereby, since the electrode and the electrode exposed surface are covered with the adhesive film, the particles of the electromagnetic wave shielding film can not enter between the electrode exposed surface and the adhesive film, and do not reach the electrode.

International Publication No. 2013/035819 JP 6-97268 A

  When the electronic component is attached to the adhesive film, air bubbles may enter between the electrode exposed surface and the adhesive film. The entry of air bubbles leads to a decrease in the adhesion between the electronic component and the adhesive film. Then, in the worst case, when the electronic component is transported between the devices or in the film forming device, the electronic component which loses the inertial force peels off from the adhesive film, and between the electrode exposed surface and the adhesive film There is a gap leading to the electrode. At the time of film formation, particles of the electromagnetic wave shielding film enter through the gap and adhere to the electrode. If particles of the electromagnetic wave shielding film are attached to bridge the electrodes, insulation between the electrodes can not be maintained.

  In addition, as a technique of sticking an adhesive film, what presses an adhesive film and sticks with long members, such as a long roller and a row-like brush, is known (refer patent document 2). However, it is difficult to uniformly press the adhesive film against all of the plurality of electronic components and the plurality of electrodes of the electronic components with such a long member. Therefore, in a portion where the pressing is insufficient, a gap is generated between the electrode exposed surface and the adhesive film, and the entry of air bubbles can not be prevented.

  The present invention has been proposed to solve the above-mentioned problems, and it is possible to prevent the entry of air bubbles, and to form a film by closely adhering the electronic component and the protective sheet. It aims at providing an apparatus.

  In order to achieve the above object, the present invention is a film forming apparatus for an electronic component in which an electrode exposed surface on which an electrode is formed is adhered to an adhesive surface of a protective sheet, the adhesive surface of the protective sheet An embedding processing unit for embedding an electrode of an electronic component, and a film forming processing unit for forming a film forming material on the electronic component having the electrode embedded in the protective sheet, the embedding processing unit A flat surface opposite to the protective sheet sandwiching the electronic component and facing at least the electronic component, and a decompression unit that decompresses at least a space between the protective sheet and the flat surface; And a pressure adjusting unit configured to adjust the pressure of the space opposite to the flat surface with the protective sheet interposed therebetween, the pressure adjusting unit performing the pressure reduction after the pressure reduction of the space by the pressure reducing unit. In the maintained state, the protective sheet and the Than the space between the Tanmen the relatively large pressure of the opposite side of the space, said to align pressing the electronic component and the protective sheet, and wherein the flat surface as pawl

The embedding processing unit includes a mounting surface positioned opposite to the flat surface across the protective sheet;
There may be provided a mounting surface side air hole which is opened to the mounting surface and generates a negative pressure prior to the pressure reduction by the pressure reducing section to separate the protective sheet from the flat surface.

  The pressure adjusting unit includes the mounting surface-side air hole, and the mounting surface-side air hole is generated after the pressure reduction of the space by the pressure reducing unit and in the state where the pressure reduction is maintained, generation of positive pressure Instead, the protective sheet may be pressed against the electronic component stopped by the flat surface.

The embedding processing unit
A flat that opens as the depressurizing unit or separately from the depressurizing unit and generates negative pressure to suck the electronic component to the planar surface and attracts the protective sheet to the planar surface. You may make it have a surface side air hole.

  Further, in order to achieve the above object, the present invention is a film forming apparatus for an electronic component in which an electrode exposed surface on which an electrode is formed is attached to an adhesive surface of a protective sheet, wherein the adhesive surface of the protective sheet Plate mounting for attaching the protective sheet to the cooling plate in which an air hole penetrating through the front and back is provided in a region including the embedded processing portion in which the electrode of the electronic component is embedded and the region where the electronic component is arrayed Part, a film forming processing part for forming a film forming material on the electronic component of the protective sheet attached to the cooling plate, and the cooling plate and the protective sheet after passing through the film forming processing part And an exfoliation processing section for exfoliating the electronic component from the protective sheet whose adhesion to the cooling plate has been released. The embedding processing section sandwiches the electronic component. The flat surface opposite to the protective sheet and facing the electronic component, a first pressure reducing portion for decompressing a space between at least the protective sheet and the flat surface, and the protective sheet interposed therebetween And a pressure adjusting unit for adjusting the pressure of the space opposite to the flat surface, the pressure adjusting unit maintaining the reduced pressure after reducing the pressure of the space by the first pressure reducing unit. In the state, the pressure of the space opposite to the flat surface with the protective sheet interposed therebetween is made relatively larger than the space between the protective sheet and the flat surface, and the flat surface serves as a pawl. And the protective sheet, and the plate mounting portion is a second pressure reducing portion for reducing the pressure in the space between the region of the protective sheet on which the electronic component is arranged and the cooling plate. , And the second one After pressure reduction by the pressure unit, the protective sheet and the cooling plate are pressed against each other, and the plate releasing unit is a positive pressure generating hole for generating a positive pressure in the air hole of the cooling plate, and the positive pressure generation. While pressing a region of the protective sheet in which the electronic components are arranged in the protective sheet through the holes, a portion of the protective sheet which is out of the region in which the electronic components are arranged is held down to arrange the electronic components. And the fixing unit that releases the pressing after the separated area is separated from the cooling plate, and the peeling processing unit is a mounting unit that supports the electronic component attached to the protective sheet. A chuck which grips an end of the protective sheet, moves relative to the placing portion, and peels continuously toward the opposite end of the end, and the electronic component is peeled from the protective sheet And a fixing portion for fixing the position of the electronic component.

  Further, in order to achieve the above object, the present invention relates to an electronic component to which an exposed electrode surface formed with an adhesive surface of a protective sheet is attached, the electrode of the electronic component on the adhesive surface of the protective sheet. An embedded processing apparatus for embedding, comprising: a flat surface opposite to the protective sheet sandwiching the electronic component and facing the electronic component, and at least a space between the protective sheet and the flat surface The pressure reducing unit includes a pressure reducing unit configured to reduce the pressure, and a pressure adjusting unit configured to adjust the pressure of the space opposite to the flat surface with the protective sheet interposed therebetween, and the pressure adjusting unit is configured to reduce the pressure of the space by the pressure reducing unit. After that, in the state where the reduced pressure is maintained, the pressure of the space on the opposite side is made relatively larger than the space between the protective sheet and the flat surface, and the flat surface serves as a pawl. Push the parts and the protective sheet Only keying, characterized.

  According to the present invention, air bubbles are less likely to enter between the electronic component and the protective sheet, the adhesion between the electronic component and the protective sheet is improved, and the particles of the electromagnetic wave shielding film can be prevented from adhering to the electrode.

It is a side view which shows the electronic component by which the film-forming process was carried out. It is a side view which shows the state of the electronic component which receives the film-forming process. It is a disassembled perspective view which shows the state of an electronic component when receiving the film-forming process. It is a transition diagram showing the film-forming process flow of electronic parts. It is a block diagram showing composition of a film deposition system. It is a schematic diagram which shows the structure of an embedding | flush-mounting process part. It is the transition diagram which showed typically the state in each process of an embedding | flush-mounting process part. It is an enlarged view between the electronic components in an embedding | flush-mounting process part. It is a schematic diagram which shows the structure of a plate mounting part. It is the transition diagram which showed typically the state in each process of a plate mounting part. It is a schematic diagram which shows the structure of the film-forming process part. It is a schematic diagram which shows the structure of a plate releasing part. It is the transition diagram which showed the state in each process of a plate releasing part typically. It is a schematic diagram which shows the other structure of a plate releasing part. It is a schematic diagram which shows the further another structure of a plate releasing part. It is a schematic diagram which shows the structure of a peeling process part. It is a figure which shows the upper surface of the component-embedded sheet | seat in a peeling process part. It is the transition diagram which showed the state in each process of the peeling process part typically. It is a schematic diagram which shows the aspect which prevents floating of an electronic component. It is the photograph which image | photographed the electrode, after peeling an electronic component from a protection sheet by the peeling process part. It is a top view which shows the other aspect of the sheet | seat in which components were embedded in the peeling process part. It is a top view which shows the further another aspect of a component-embedded sheet | seat in a peeling process part. It is a top view which shows the further another aspect of a component-embedded sheet | seat in a peeling process part. It is a block diagram which shows the other structure of the film-forming apparatus. It is a schematic diagram which shows the structure of the conventional push-up apparatus. It is a schematic diagram which shows pushing up of an electronic component in the conventional pushing up apparatus. It is a photograph which shows the appearance of the electrode after the adhesive film reattaches to an electronic component.

(Electronic parts)
FIG. 1 is a side view showing a film-formed electronic component. As shown in FIG. 1, an electromagnetic wave shielding film 605 is formed on the surface of the electronic component 60. The electronic component 60 is a surface mounting component such as a semiconductor chip, a diode, a transistor, a capacitor, or a SAW filter. The semiconductor chip is an integrated circuit such as an IC or LSI in which a plurality of electronic elements are integrated. This electronic component has a substantially rectangular parallelepiped shape such as BGA, LGA, SOP, QFP, WLP, etc., and one surface thereof is an electrode exposed surface 601. The electrode exposed surface 601 is a surface on which the electrode 602 is exposed and that faces the mounting substrate and is connected to the mounting substrate. The electrode 602 is an electrode called a ball bump or a solder ball bump, and is formed by mounting a spherically shaped solder (solder ball) having a diameter of several tens μm to several hundreds μm on a pad electrode.

  The electromagnetic wave shielding film 605 shields an electromagnetic wave. The electromagnetic wave shielding film 605 is formed of, for example, a material such as Al, Ag, Ti, Nb, Pd, Pt, or Zr. The electromagnetic wave shielding film 605 may be formed of a magnetic material such as Ni, Fe, Cr, or Co. In addition, SUS, Ni, Ti, V, Ta or the like may be formed as a base layer of the electromagnetic wave shielding film 605, and SUS, Au or the like may be formed as a protective layer on the outermost surface.

  The electromagnetic wave shielding film 605 is formed on the top surface 603 and the side surface 604 of the electronic component 60, that is, the outer surface other than the electrode exposed surface 601. The top surface 603 is the surface opposite to the electrode exposed surface 601. The side surface 604 connects the top surface 603 and the electrode exposed surface 601, and the top surface 603 and the electrode exposed surface 601 are outer peripheral surfaces extending at different angles. In order to obtain the shielding effect of the electromagnetic wave blocking, the electromagnetic shielding film 605 may be formed at least on the top surface 603. On the side surface 604, a ground pin (not shown) is present. The formation of the electromagnetic wave shielding film 605 on the side surface is also for grounding the electromagnetic wave shielding film 605.

(During film formation)
FIG. 2 is a side view showing the state of the electronic component after the film formation process. FIG. 3 is an exploded perspective view showing the state of the electronic component when it is subjected to a film forming process. As shown in FIGS. 2 and 3, in the electronic component 60, the electrode 602 is embedded in the protective sheet 61 in advance, and the electrode exposed surface 601 is in close contact with the protective sheet 61. By embedding the electrode 602 in the protective sheet 61, the particles of the electromagnetic wave shielding film 605 are prevented from reaching the electrode 602. Further, due to the close contact between the electrode exposed surface 601 and the protective sheet 61, there is no room for the particles of the electromagnetic wave shielding film 605 to enter between the electrode exposed surface 601 and the protective sheet 61, and the particles of the electromagnetic wave shielding film 605 can extend over the electrode 602. It is reducing sex.

  The protective sheet 61 is a heat-resistant synthetic resin such as PEN (polyethylene naphthalate) or PI (polyimide). One surface of the protective sheet 61 is a pressure-sensitive adhesive surface (pressure-sensitive adhesive layer) 611 having a flexibility in which the electrode 602 bites in and an adhesive property with which the electrode exposed surface 601 adheres. As the adhesive surface 611, various materials having adhesiveness are used, such as silicone resins and acrylic resins, as well as urethane resins and epoxy resins.

  The adhesive surface 611 has an outer frame region 613 extending from the end of the protective sheet 61 to a predetermined distance inward, a middle frame region 614 extending from the inner periphery of the outer frame region 613 to a predetermined distance inward, and an inner side than the middle frame region 614 Is divided into the component arrangement area 615 of FIG. The electronic component 60 is attached to the component array area 615. A frame-shaped frame 62 is attached to the outer frame area 613. The middle frame region 614 is a range in which bending of the protective sheet 61 occurs, and neither the frame 62 nor the electronic component 60 is attached. The opposite surface of the adhesive surface 611 is a non-adhesive surface 612.

  The protective sheet 61 is attached to the cooling plate 63 via the adhesive sheet 64. The cooling plate 63 is formed of a metal such as SUS, ceramics, a resin, or another material having high thermal conductivity. The cooling plate 63 is a heat radiation path for dissipating heat of the electronic component and suppressing excessive heat storage. The adhesive sheet 64 has adhesiveness on both sides, enhances the adhesion between the protective sheet 61 and the cooling plate 63, and secures a heat transfer area to the cooling plate 63.

  The height H1 from the surface of the component array area 615 to the upper end surface of the frame 62 is higher than the height H2 from the surface of the component array area 615 to the top surface 603 of the electronic component 60. The height H1 may be rephrased as the thickness H1 for the sake of convenience, but has the same meaning. In short, if a flat plate is placed on the frame 62, the top surface 603 of the electronic component 60 has not reached the flat plate.

  At one end of the frame 62, a guide insertion hole 621 is formed. The guide portion insertion hole 621 has an opening such as a long oval, a rectangle, or a round circle along the end of the frame 62, and is pierced through the surface to be attached to the protective sheet 61 and the opposite exposed surface. ing. That is, for example, when a rod-like member is inserted into the guide portion insertion hole 621 and the end of the protective sheet 61 is pushed (see FIG. 18), one end of the protective sheet 61 is peeled off from the frame 62.

  A pusher insertion hole 631 is formed in the cooling plate 63 and the adhesive sheet 64. The pusher insertion hole 631 does not coincide with the guide portion insertion hole 621, and is penetratingly provided at a position closed by the frame 62. For example, when a rod-like member is inserted into the pusher insertion hole 631 and the frame 62 is pushed up by the tip of the rod-like member, a plurality of pusher insertion holes 631 are penetrated so as to lift the entire frame 62 in parallel. For example, if the frame 62 is a frame having a rectangular outer shape, the pusher insertion holes 631 are located at the four corners or at the center of each side. From the viewpoint of maintaining the parallelism of the frame 62, it is desirable that the rod-like member have a rectangular tip end face, that is, a thin plate shape or an L-shaped cross section is desirable. You may have. The pusher insertion hole 631 correspondingly has a rectangular shape, an L shape or a round shape.

  Further, in the cooling plate 63 and the adhesive sheet 64, a large number of fine air holes 632 are formed at equal intervals all over the range to which the middle frame area 614 and the component array area 615 of the protective sheet 61 adhere. The air hole 632 has, for example, a minute cylindrical shape or a slit shape. The air holes 632 are provided in order to apply negative pressure or positive pressure through the air holes 632 to at least the component array area 615 of the protective sheet 61 stuck to the cooling plate 63. The number of air holes 632 and the distance between the air holes 632 and the distance between the air holes 632 are not limited to the above. For example, even if the air holes 632 are provided only in the range corresponding to the component placement area 615 The air holes 632 may be densely arranged, while the outer side may be sparsely arranged, or only one may be provided at a position corresponding to the center of the component placement area 615.

(Deposition process flow)
In the film forming process, the electronic component 60 is formed into an electromagnetic shielding film 605 and separated into individual pieces through a component mounting step, a component embedding step, a plate mounting step, a film forming step, a plate removing step and a component peeling step. Is obtained.

  FIG. 4 is a diagram showing a film forming process flow of the electronic component. As shown in FIG. 4, in the component placing step, the component arrangement is performed in a state where the electrode exposed surface 601 of the electronic component 60 is opposed to the component non-placement sheet 65 in which the frame 62 is adhered to the protective sheet 61. The electronic component 60 is arranged in the region 615. The frame 62 is attached to the protective sheet 61 and the electronic component 60 is further arranged, but a state in which the electrode 602 is not embedded yet is referred to as a component mounted sheet 66.

  In the component embedding step, the electrode 602 is embedded in the protective sheet 61 with respect to the component-placed sheet 66, and the electrode exposed surface 601 is in close contact with the protective sheet 61. The state in which the electrode 602 is embedded in the protective sheet 61 is referred to as a component embedded sheet 67 regardless of whether the electromagnetic wave shielding film 605 is formed or not formed. In the plate mounting step, the component-embedded sheet 67 is brought into close contact with the cooling plate 63 via the adhesive sheet 64. The state in which the cooling plate 63 is mounted is referred to as a component mounting plate 68.

  In the film forming step, particles of the electromagnetic wave shield film 605 are deposited from the top surface 603 side of the electronic component 60 to form the electromagnetic wave shield film 605 on the electronic component 60. At this time, the electrode 602 of the electronic component 60 is buried in the protective sheet 61, and the electrode exposed surface 601 is in close contact with the protective sheet 61, and particles of the electromagnetic wave shielding film 605 are prevented from adhering to the electrode 602. Ru.

  In the plate releasing step, the cooling plate 63 is removed and returned to the form of the component-embedded sheet 67. Then, in the component peeling step, the electronic component 60 is peeled off from the protective sheet 61 and separated into the component non-placement sheet 65 and the individual electronic components 60. Also, in preparation for reuse of the frame 62, the protective sheet 61 is peeled off from the frame 62. Thus, the film forming process is completed.

(Deposition apparatus)
Among the film forming process flows described above, FIG. 5 shows a film forming apparatus which is responsible for the component embedding process, the plate mounting process, the film forming process, the plate releasing process, and the component peeling process. As shown in FIG. 5, the film forming apparatus 7 includes an embedding processing unit 1, a plate mounting unit 2, a film forming processing unit 3, a plate releasing unit 4, and a peeling processing unit 5. The respective units are connected by the transport unit 73, members necessary in each process are inserted, and the members processed in each process are discharged. The transport unit 73 is, for example, a conveyor, and may be a transport table movable along a linear track by a ball screw or the like.

  In addition, the film forming apparatus 7 includes a CPU, a ROM, and the like that control operation timings of the components included in the embedding processing unit 1, the plate mounting unit 2, the film forming processing unit 3, the plate releasing unit 4 and the peeling processing unit 5. A control unit 74 such as a computer or a microcomputer having a RAM and a signal transmission circuit is accommodated. Further, a pneumatic circuit 75 for supplying a positive pressure or a negative pressure to the embedding processing unit 1, the plate mounting unit 2, the film forming processing unit 3, the plate releasing unit 4 and the peeling processing unit 5 is accommodated. The control unit 74 also controls the solenoid valve in the pneumatic circuit 75 to switch between negative pressure generation, negative pressure release, positive pressure generation and positive pressure release.

(Embedded processor)
The embedding processing unit 1 responsible for the component embedding process will be described. FIG. 6 is a schematic view showing the configuration of the embedding processing unit 1. The component placement completed sheet 66 is input to the embedding processing unit 1. The embedding processing unit 1 draws the protective sheet 61 toward the electronic component 60 while pressing the electronic component 60 and presses the protective sheet 61 against the electronic component 60. Thereby, the embedding processing unit 1 causes the electrode 602 of the electronic component 60 to bite into the protective sheet 61, and further brings the electrode exposed surface 601 into close contact with the protective sheet 61.

  As shown in FIG. 6, the embedding processing unit 1 includes a ceiling 11 and a mounting table 12. Both the ceiling portion 11 and the mounting table 12 are blocks having internal spaces 111 and 121. The ceiling portion 11 and the mounting table 12 are disposed to face each other, and have flat surfaces 112 and 122 parallel to each other on the opposite side. Both flat surfaces 112 and 122 have the same size and shape as the part mounted sheet 66 or are wider than the part mounted sheet 66. The mounting table 12 is stationary. On the other hand, the ceiling portion 11 can be moved up and down with respect to the mounting table 12. The ceiling portion 11 approaches the mounting table 12 at least to the distance of the thickness H1 of the frame 62 of the component mounted sheet 66.

  The component mounted sheet 66 is mounted on the mounting table 12. The flat surface 122 of the mounting table 12 is a mounting surface of the component mounted sheet 66. The flat surface 122 comprises an adhesive non-slip member. Further, on the flat surface 122 of the mounting table 12, a large number of air holes 123 communicating with the internal space 121 are provided. The penetrating range of the air holes 123 is a range of the same size and shape as the inner side of the frame 62 of the part mounted sheet 66 or at least the same size and shape of the part arrangement region 615. The position at which the air hole 123 penetrates is a position facing the inner area of the frame 62 or a position facing the component arrangement area 615 when the component mounted sheet 66 is placed on the mounting table 12.

  In the internal space 121 of the mounting table 12, an air pressure supply hole 124 is further provided at a location different from the flat surface 122. The air pressure supply hole 124 is connected to a pneumatic circuit 75 including a compressor, a negative pressure supply pipe, a positive pressure supply pipe, and the like (not shown). Therefore, positive pressure or negative pressure is selectively generated in the air hole 123 through the air pressure supply hole 124 and the internal space 121. The air hole 123, the air pressure supply hole 124, and the air pressure circuit 75 function as a pressure adjustment unit.

  Further, on the flat surface 122 of the mounting table 12, a pusher insertion hole 125 penetrating the mounting table 12 is opened. The pusher insertion hole 125 is provided outside the penetration range of the air hole 123. In detail, the penetrating position of the pusher insertion hole 125 is a position which is closed by the frame 62 while avoiding the guide insertion hole 621 of the frame 62 when the component mounted sheet 66 is placed. The pusher 13 is inserted into the pusher insertion hole 125. The pusher 13 can be projected and retracted from the flat surface 122 of the mounting table 12. When the pusher 13 protrudes from the pusher insertion hole 125, the pusher 13 separates the component-mounted sheet 66 from the mounting table 12, lifts it in parallel, and is installed with rigidity and the number and arrangement intervals to support. For example, when the outer shape of the frame 62 is rectangular, the rods are arranged corresponding to the corners of the frame 62.

  Next, a large number of air holes 113 communicating with the internal space 111 are also provided through the flat surface 112 of the ceiling portion 11. The penetration range of the air holes 113 is the same size and shape as the inside of the frame 62 of the part mounted sheet 66 or at least the same size and shape as the part arrangement area 615, and extends over the entire part arrangement area 615. The position where the air hole 113 penetrates is a position facing the inner region of the frame 62 or a position facing the component arrangement region when the component mounted sheet 66 is placed on the mounting table 12.

  In the internal space 111 of the ceiling portion 11, an air pressure supply hole 114 is provided at a location different from the flat surface 112. The air pressure supply hole 114 is connected to a pneumatic circuit 75 including a compressor, a negative pressure supply pipe, and the like (not shown). Therefore, negative pressure is generated in the air hole 113 through the air pressure supply hole 114 and the internal space 111. The air hole 113, the air pressure supply hole 114, and the air pressure circuit 75 function as a pressure reducing unit.

  Further, on the flat surface 112 of the ceiling portion 11, an O-ring 115 is installed along the frame 62 of the component mounted sheet 66 mounted on the mounting table 12 so as to surround the through hole of the air hole 113.

  FIG. 7 shows the flow of the operation of such an embedding processing unit 1. FIG. 7 is a transition diagram schematically showing the state of each process of the embedding processing unit 1. First, as shown in (a) of FIG. 7, the component placed sheet 66 is loaded into the embedding processing unit 1. The ceiling portion 11 is sufficiently separated from the mounting table 12, and the pusher has its tip protruding from the flat surface 122 of the mounting table 12. In the loading of the component placed sheet 66, the frame 62 of the component placed sheet 66 is aligned with the pusher, and the component placed sheet 66 is supported by the pusher.

  Next, as shown in (b) of FIG. 7, the pusher 13 is retracted into the pusher insertion hole 125. Thus, the part mounted sheet 66 is lowered onto the flat surface 122 of the mounting table 12. In addition, the ceiling portion 11 is moved toward the mounting table 12. The flat surface 112 of the ceiling portion 11 and the flat surface 122 of the mounting table 12 sandwich the frame 62 on which the components have been placed. The height H1 from the surface of the component array area 615 to the upper end surface of the frame 62 is higher than the height H2 from the surface of the component array area 615 to the top surface 603 of the electronic component 60. Therefore, when the frame 62 is sandwiched, the top surface 603 of the electronic component 60 does not reach the flat surface 112 of the ceiling portion 11. Therefore, the component array area 615 on which the electronic component 60 is mounted is enclosed in the sealed space 14 surrounded by the flat surface 112 of the ceiling portion 11, the protective sheet 61, and the frame 62 and sealed by the O-ring 115.

  When the component array area 615 is confined in the sealed space 14, negative pressure is generated in the air holes 123 of the mounting table 12 as shown in FIG. 7C, and the protective sheet 61 is sucked to the flat surface 122. Subsequently, as shown in (d) of FIG. 7, a negative pressure is also generated in the air holes 113 of the ceiling portion 11 to decompress the sealed space 14 in which the component array area 615 is confined. The degree of pressure reduction is preferably close to vacuum, with the pressure exerted by both air holes 113 and 123 being the same. The reason that the air holes 123 of the mounting table 12 precede the generation of the negative pressure is that the protective sheet 61 is attracted to the mounting table 12 so that the air pressure on the upper side of the protective sheet 61 in the pressure reduction process of the enclosed space 14. Is excessive with respect to the air pressure on the lower side, and thereby, the electronic component 60 is suppressed from rushing to the flat surface 112 of the ceiling portion 11. At this stage, the electronic component 60 is placed on the protective sheet 61 in a state where the electrode 602 is not embedded in the adhesive surface 611 of the protective sheet 61, so between the electrode exposed surface 601 and the adhesive surface 611 There is a gap, and this gap is also depressurized.

  When the depressurization is completed, as shown in (e) of FIG. 7, the air hole 123 on the mounting table 12 side is gradually changed from negative pressure to positive pressure while maintaining the negative pressure on the ceiling 11 side, and the mounting table The twelve air holes 123 are converted to positive pressure. The electronic component 60 and the protective sheet 61 are gently sucked up to the flat surface 112 of the ceiling 11 and pushed up gently. The electronic component 60 is pressed against the flat surface 112 of the ceiling portion 11 to be stopped. On the other hand, since the adhesive surface 611 has flexibility, the protective sheet 61 is further attracted to the flat surface 112 even after the electronic component 60 is stopped, and is further pushed up toward the flat surface 112.

  Then, the electrode 602 of the electronic component 60 is buried in the protective sheet 61, more specifically, the adhesive surface 611 of the protective sheet 61, and the electrode exposed surface 601 of the electronic component 60 is in close contact with the protective sheet 61. At this time, the flat surface 112 of the ceiling portion 11 includes the component array region 615 and makes the component array region 615 flat. In other words, the component array area 615 is not curved. Therefore, insufficient embedding of the electrode 602 or poor adhesion of the electrode exposed surface 601 at the end of the component array region 615 can be prevented.

  The process of bringing the electrode exposed surface 601 into close contact with the protective sheet 61 is performed under a reduced pressure environment, and there is no or very little air in the enclosed space. Therefore, the possibility that air bubbles intrude between the electrode exposed surface 601 and the protective sheet 61 is low.

  Furthermore, FIG. 8 is an enlarged view between the electronic components 60 in the embedding processing unit 1. As shown in FIG. 8, the positive pressure generated by the mounting table 12 pushes up at least the component array area 615 of the protective sheet 61 without unevenness. Then, the flexible protective sheet 61 is further pushed toward the flat surface 112 of the ceiling portion 11 without being blocked by the electronic component 60 at each gap between the adjacent electronic components 60. Then, the adhesive surface 611 of the protective sheet 61 is raised to the lower side of the electronic component 60 and the protective sheet 61 is also in close contact with the lower side of the electronic component 60. Therefore, the particles of the electromagnetic wave shielding film 605 can be more reliably prevented from entering between the electrode exposed surface 601 and the protective sheet 61.

  When the electrode 602 of the electronic component 60 is embedded in the protective sheet 61 and the electrode exposed surface 601 and the lower side surface of the electronic component 60 are in close contact with the protective sheet 61, the pusher 13 is pushed as shown in FIG. It is moved in the axial direction along the insertion hole 125 so as to reappear from the flat surface 122 of the mounting table 12. At the same time, the ceiling 11 is separated from the mounting table 12 at the same speed as the advancing speed of the pusher 13. Finally, as shown in (g) of FIG. 7, the pusher 13 is stopped, and the ceiling portion 11 is released from the mounting table 12 to release the sandwiching of the component-embedded sheet 67. Thereby, the embedding of the electronic component 60 into the protective sheet 61 by the embedding processing unit 1 is completed.

  The negative pressure on the side of the ceiling 11 and the positive pressure on the side of the mounting table 12 are shown in FIG. 7 (g) after the adhesion of the electrode exposed surface 601 of the electronic component 60 to the protective sheet 61 in FIG. It may be released before the ceiling 11 is raised. As for the negative pressure on the side of the ceiling 11, when the ceiling 11 is released immediately before the ceiling 11 is lifted in FIG. 7 (g), the electronic component 60 is stabilized on the protective sheet 60 when the pusher 13 is lifted in FIG. 7 (f). Because it can be retained.

  As described above, the ceiling portion 11 and the mounting table 12 are fixed portions sandwiching the component mounted sheet 66 by sandwiching the frame 62 from both sides. Further, the ceiling portion 11, the protective sheet 61, and the frame 62 define an enclosed space 14 that encloses the component array area 615. The O-ring 115 enhances the reliability of the sealed space 14 by sealing. Furthermore, the ceiling portion 11 and the air holes 113 of the mounting table 12 are pressure reducing portions that reduce the pressure of the sealed space 14.

  Then, the flat surface 122 of the mounting table 12 is a mounting surface of the component mounted sheet 66. The air hole 123 opened in the flat surface 122 of the mounting table 12 generates a negative pressure prior to the pressure reduction of the enclosed space 14 and prevents the electronic component 60 from rushing to the flat surface 112 of the ceiling portion 11. Together with the prevention means and the negative pressure of the ceiling portion 11, the component arrangement region 615 is pressed against the flat surface 112 of the ceiling portion 11 by positive pressure to become a pressing means for embedding the electrode 602 of the electronic component 60.

  Further, the flat surface 112 of the ceiling portion 11 is a flattening means that makes the component array region 615 flat and enhances the embedding effect of the electrode 602 and the adhesion effect of the electrode exposed surface 601. The air holes 113 opened in the flat surface 112 of the ceiling portion 11, together with the positive pressure of the mounting table 12, press the component array region 615 against the flat surface 112 of the ceiling portion 11 to make the electrode 602 of the electronic component 60. In combination with the suction means for burying the protective sheet 61 and the positive pressure of the mounting table 12, the protective sheet 61 is suctioned into the gap between the electronic components 60 to form a side lower coating means for closely contacting the lower side of the electronic components 60.

  As described above, the embedding processing unit 1 embeds the electrode 602 of the electronic component 60 on the adhesive surface 611 of the protective sheet 61, but a pressure reducing unit that decompresses the space including the electronic component 60 and the component array region 615 I had to have. Then, after depressurization, the electronic component 60 and the protective sheet 61 were pressed against each other. As a result, air bubbles do not enter between the electronic component 60 and the protective sheet 61 and the adhesion does not become insufficient, and the possibility that a gap is generated between the electronic component 60 and the protective sheet 61 is reduced. It is possible to prevent the particles from adhering to the electrode 602.

  Further, the embedding processing unit 1 is provided with a pressure adjusting unit that adjusts the pressure of the space on the opposite side of the flat surface 112 of the ceiling portion 11 and the flat surface 112 with the protective sheet 61 interposed therebetween. The flat surface 112 is opposite to the protective sheet 61 with the electronic component 60 interposed therebetween and faces the electronic component 60. Also, for example, the air hole 123, the air pressure supply hole 124, and the air pressure circuit 75 are examples of the pressure adjustment unit. The pressure adjusting unit is configured to set the pressure in the space between the mounting table 12 and the protective sheet 61, that is, the pressure in the space opposite to the flat surface 112 with the protective sheet 61 interposed, rather than the space between the protective sheet 61 and the flat surface 112. Relatively large.

  As a result, the electronic component 60 and the protective sheet 61 are directed to the flat surface 112, and the flat surface 112 is restrained so that the electronic component 60 and the protective sheet 61 are pressed against each other. Therefore, the component array region 615 of the protective sheet 61 follows the flatness, and the electrode exposed surface 601 of the electronic component 60 and the protective sheet 61 are pressed against each other in parallel. Therefore, there is no more room for air bubbles to enter.

  The thickness of the electronic component 60 and the protective sheet 61 is not uniform, and variations exist. The pressure difference between the pressure of the sealed space 14 and the pressure between the mounting table 12 and the protective sheet 61 can apply a force that uniformly presses the electronic component 60 and the protective sheet 61 regardless of the variation of the thickness. A sufficient pressing force can be reliably provided between each of the plurality of electrodes 602 of the electronic component 60 and the adhesive surface 611 of the protective sheet 61, and each electrode 602 of each electronic component 60 can be embedded in the protective sheet 61. it can.

  In addition, the embedding processing unit 1 has a flat surface 122 of the mounting table 12, that is, a mounting surface positioned opposite to the flat surface 112 with the protective sheet 61 interposed therebetween. Then, an air hole 123 is formed in the mounting table 12 so as to open on the mounting surface and generate a negative pressure prior to depressurization to separate the protective sheet 61 from the flat surface 112. Thus, the electronic component 60 can be suppressed from being damaged by vigorously pushing the electronic component onto the flat surface 112 during decompression.

  Although the air holes 113 of the ceiling 11 and the air holes 123 of the mounting table 12 which press the electronic component 60 and the protective sheet 61 together are used as the pressure reducing portion, a third air hole is separately formed in the sealed space 14. A negative pressure may be generated in the air hole 3 to reduce the pressure.

  In addition, the air holes 123 on the side of the mounting table 12 turn to generation of positive pressure after pressure reduction, and further press the protective sheet 61 against the electronic component 60 stopped by the flat surface 112. As a result, the adhesive surface 611 rises along with the protective sheet 61 in the gap between the electronic components 60, and the lower side of the electronic component 60 can also be covered with the protective sheet 61. Therefore, a gap can be reliably prevented from being generated between the electrode exposed surface 601 and the protective sheet 61. Further, even in the case of an electronic component such as SOP or QFP having a thin plate-like electrode at the lower part of the side surface, the electrode 602 can be covered with the protective sheet 61 to prevent the particles of the electromagnetic wave shielding film 605 from adhering. The membrane device 7 can be applied.

  In the present embodiment, a negative pressure is generated in the ceiling portion 11 and a positive pressure is generated in the mounting table 12 on the opposite side to the ceiling portion 11 with the protective sheet 61 interposed therebetween. First, in order to press the electronic component 60 and the protective sheet 61 to each other, secondly, the adhesive surface 611 is raised in the gap between the electronic components 60 to cover the lower side surface.

  However, in order to achieve the pressing of the electronic component 60 and the protective sheet 61, a differential pressure of this size is not essential. The differential pressure with which the electrode 602 of the electronic component 60 is embedded in the protective sheet 61 corresponds to the flexibility of the protective sheet 61, and the negative pressure on the mounting table 12 side is not changed even if the mounting table 12 side is changed to a positive pressure. You may make it weaken rather than the negative pressure of the ceiling part 11 side. That is, relatively large means that the negative pressure on the side of the ceiling 11 is negative and the pressure on the mounting table 12 is positive including the atmospheric pressure, and the negative pressure of the mounting table 12 is higher than the negative pressure on the side of the ceiling 11 What is necessary is just to be able to produce the differential pressure | voltage which can embed the electrode 602 in the protective sheet 61 by the ceiling part 11 side and the mounting base 12 side including the case where it is lower than atmospheric pressure.

  However, the electronic component 60 and the protective sheet are produced by the differential pressure between the negative pressure on the side of the ceiling 11 and the pressure generated on the mounting table 12 opposite to the ceiling 11 with the protective sheet 61 interposed therebetween. In the case of pressing 61, since a large pressing force can be applied, it is ensured that a sufficient pressing force is provided between each of the plurality of electrodes 602 of the plurality of electronic components 60 and the adhesive surface 611 of the protective sheet 61. And each electrode 602 of each electronic component 60 can be embedded in the protective sheet 61.

  Although the protective sheet 61 is pushed up by the differential pressure, the amount of pushing up of the component array area 615 is determined by the flat surface 112. That is, since the amount of deformation of the protective sheet 61 is defined by the flat surface 112, the push-up force due to the differential pressure is also applied to the gap between the electronic components 60 in the component array area 615. At this time, since the gap between the electronic components 60 is not in contact with the flat surface 112, a decompressed space exists above the gap. Therefore, the adhesive surface 611 of the gap portion as well as the protective sheet 61 is raised due to the differential pressure, and the lower side of the electronic component 60 can also be covered with the protective sheet 61.

  Therefore, in the present embodiment, in order to cover the lower side surface of the electronic component 60, a negative pressure is generated in the ceiling portion 11, a positive pressure is generated in the mounting table 12, and the component array region 615 is flat on the ceiling portion 11. It was made to press on the surface 112. However, depending on the flexibility of the protective sheet 61, the pressure-sensitive adhesive surface 611 may be between the electronic components 60 even if it is not a differential pressure between the pressure close to the vacuum on the ceiling 11 side and the pressure above the mounting table 12 side. Can be raised in the gap of Therefore, in order to cover the lower part of the side surface of the electronic component 60, it is desirable to turn the mounting table 12 side to a positive pressure, but it is not essential to adjust the mounting table 12 side to a positive pressure. That is, it is sufficient if the differential pressure can be adjusted according to the flexibility of the protective sheet 61. Depending on the flexibility of the protective sheet 61, the negative pressure is reduced even if the pressure on the mounting table 12 side is not extended to the atmospheric pressure after the pressure reduction is completed You may

  Further, the electromagnetic wave shielding film 605 described later can improve the shielding performance by connecting to the ground wiring of the electronic component 60. The ground wiring is a wiring for releasing unnecessary electromagnetic waves to the outside, and is generally formed on the side surface of the electronic component 60. It is necessary to avoid interfering with the connection between the electromagnetic wave shielding film 605 and the ground wiring by the bumps of the adhesive surface 611 reaching the lower side of the electronic component 60.

  The embedded processing unit 1 adjusts the pressure on the side of the ceiling 11 and the side of the mounting table 12 independently to create a desired differential pressure, and thus adjusts the height of the ridge reaching the lower portion of the side surface of the electronic component 60 , And can be uniformly controlled on the lower side of the electronic component 60. That is, by bringing the lower side of the side into close contact with the protective sheet 61, the gap reaching the electrode 602 is sealed more securely, or the electronic component 60 is an SOP or QFP or the like, and the electrode at the lower side is embedded in the protective sheet 61 It can be made the state where the ground wiring was exposed without the protection sheet 61 reaching the ground wiring of 604.

  A publicly known mechanism can be applied to the operation mechanism of the ceiling portion 11 and the operation mechanism of the pusher 43, and the present invention is not limited to the mechanism of the mechanism.

  For example, the ceiling portion 11 is connected to a ball screw whose axis is extended in a direction from the ceiling portion 11 to the mounting table 12 and a rail guide extending in a direction from the ceiling portion 11 to the mounting table 12. The ceiling portion 11 moves toward the mounting table along the rail in accordance with the rotation direction of the screw shaft. The ball screw and the rail guide extend such that the ceiling portion 11 approaches the mounting table 12 up to the distance of the thickness H1 of the frame 62 of the component mounted sheet 66 in the ceiling portion 11. The ceiling 11 and the mounting table 12 may be moved relative to each other. Therefore, the mounting table 12 may be moved without being limited to the ceiling 11 moving, and the ceiling 11 and the mounting table 12 may be moved. Both may move.

  Further, the rear end portion of the pusher 13 is a cam follower. The cam follower follows the circumferential surface of the oval cam. The cam is pivotally supported by the rotary motor and is rotatable in the circumferential direction. When the rotary motor is driven and the cam rotates, the cam follower climbs the bulging portion of the cam, the pusher 13 is pushed up, and the tip of the pusher 13 protrudes from the insertion hole.

  Furthermore, as a method of fixing the part mounted sheet 66, the frame 62 is sandwiched by the ceiling part 11 and the mounting table 12, and the sealed space 14 is defined by the ceiling part 11, the mounting table 12 and the frame 62, Although both the positive pressure and the negative pressure are selectively generated in the air holes 123 of the mounting table 12, the invention is not limited thereto. For example, one or both of the ceiling portion 11 and the mounting table 12 may be cup-shaped, and the component mounted sheet 66 may be accommodated in an internal space defined by the ceiling portion 11 and the mounting table 12. It is possible to provide a block body for holding the frame 62 from both sides, and hold the component mounted sheet 66 by the block body. In this case, the height of the frame 62 does not matter. Both a through hole for generating a negative pressure and a through hole for generating a positive pressure may be formed on the flat surface 122 of the mounting table 12.

(Plate attachment part)
Next, the plate mounting unit 2 responsible for the plate mounting process will be described. FIG. 9 is a schematic view showing the configuration of the plate mounting unit 2. The component mounting completed sheet 67 created by the embedding processing unit 1 and the cooling plate 63 to which the adhesive sheet 64 is previously attached are put into the plate mounting unit 2. The plate mounting unit 2 presses the component-embedded sheet 67 against the cooling plate 63 and draws the component-embedded sheet 67 against the cooling plate 63 to cool the component-embedded sheet 67 via the adhesive sheet 64. Close to 63.

  As shown in FIG. 9, the plate mounting unit 2 includes a ceiling 21 and a mounting table 22. The ceiling portion 21 and the mounting table 22 are disposed to face each other. The mounting table 22 is stationary. On the other hand, the ceiling portion 21 can move up and down with respect to the mounting table 22. The ceiling portion 21 approaches the mounting table 22 at least to the distance of the thickness H1 of the frame 62 of the component-embedded sheet 67.

  The ceiling portion 21 is a block having an internal space 211 and has a flat surface 212 on the surface facing the mounting table 22. The mounting table 22 has a bottomed cup shape. The opening 221 of the mounting table 22 faces the ceiling 21. The flat surface 212 of the ceiling portion 21 has the same size and shape as the component-embedded sheet 67 or is wider than the component-embedded sheet 67. On the other hand, the opening 221 of the mounting table 22 has an inclusive area of the component array region 615 or more and the middle frame region 614 or less. The edge 222 around the opening 221 of the mounting table 22 has a width equal to or greater than the width of the frame 62.

  In the mounting table 22, the edge 222 supports the cooling plate 63, and the opening 221 is closed by the cooling plate 63. The surface of the cooling plate 63 opposite to the surface to which the adhesive sheet 64 is attached abuts on the edge 222. Further, the component-embedded sheet 67 is placed on the cooling plate 63 so as to face the adhesive sheet 64. At the bottom of the mounting table 22, an air pressure supply hole 223 is penetratingly provided. The air pressure supply hole 223 is connected to a pneumatic circuit 75 including a compressor, a negative pressure supply pipe, and the like (not shown). Therefore, a negative pressure is generated in the air holes 632 of the cooling plate 63 placed close to the opening 221. The adhesive sheet 64 may be attached in advance to the non-adhesive surface 612 of the protective sheet 61 before being introduced into the plate mounting portion 2.

  Further, a pusher insertion hole 224 penetrating through the mounting table 22 is provided at an edge portion 222 of the mounting table 22. The penetrating position of the pusher insertion hole 224 coincides with the pusher insertion hole 631 of the cooling plate 63, and when the component-embedded sheet 67 is placed, the frame 62 avoids the guide insertion hole 621 and the frame 62 It is a position closed by. The pusher 23 is inserted into the pusher insertion hole 631. The pusher 23 can penetrate through the mounting table 22, the cooling plate 63 and the adhesive sheet 64.

  The pushers 23 are installed with such rigidity, number and positional relationship that they can support the component-embedded sheet 67 away from the cooling plate 63 in parallel in a state where the pushers 23 project from the cooling plate 63. For example, when the outer shape of the frame 62 is rectangular, it is arranged as a rod body corresponding to each corner of the frame 62. The pusher insertion holes 631 are also provided corresponding to the number and positional relationship of the pushers 23.

  Next, on the flat surface 212 of the ceiling portion 21, a large number of air holes 213 communicating with the internal space 211 are provided. The penetrating range of the air holes 213 is a range of the same size and shape as the inner side of the frame 62 of the component-embedded sheet 67 or at least the same size and shape of the component array area 615. The penetrating position of the air hole 213 is a position where the component array area 615 is covered when the component embedded sheet 67 is placed on the mounting table 22.

  In the internal space 211 of the ceiling portion 21, an air pressure supply hole 214 is provided at a location different from the flat surface 212. The air pressure supply hole 214 is connected to a pneumatic circuit 75 including a compressor, a positive pressure supply pipe, a negative pressure supply pipe, and the like (not shown). Therefore, positive pressure and negative pressure are selectively generated in the air hole 213 through the air pressure supply hole 214 and the internal space 211. That is, the internal space 211 of the ceiling portion 21, the flat surface 212, the air hole 213, the air pressure supply hole 214 and the air pressure circuit 75 have the function as a protective sheet holding portion and the function as a positive pressure portion. When a negative pressure is generated in the hole 213, the function of the protective sheet holding portion is exhibited. When the pneumatic circuit 75 generates a positive pressure in the air hole 213, the function of the positive pressure portion is exhibited.

  Further, on the flat surface 212 of the ceiling portion 21, an O-ring 215 surrounding the penetrating range of the air hole 213 is installed along the frame 62 of the component embedded sheet 67 placed on the mounting table 22. That is, the outer peripheral portion of the flat surface 212 of the ceiling portion 21 presses the frame 62 through the O-ring 215 to press the outer peripheral portion of the protective sheet 61 against the cooling plate 63. That is, the ceiling portion 21 has a function as a pressing portion that presses the outer peripheral portion of the protective sheet 61 against the cooling plate 63.

  FIG. 10 shows the flow of the operation of such a plate mounting unit 2. FIG. 10 is a transition diagram schematically showing the state of each step of the plate mounting unit 2. First, as shown in (a) of FIG. 10, the ceiling portion 21 is first separated from the mounting table 22. The cooling plate 63 is mounted on the mounting table 22 in advance. The pusher 23 penetrates the mounting table 22, the cooling plate 63 and the adhesive sheet 64 and protrudes toward the ceiling portion 21. In this state, the frame 62 of the component-embedded sheet 67 is aligned with the pusher 23, and the component-embedded sheet 67 is supported by the pusher 23. Then, the ceiling 21 is lowered toward the pusher 23, and the frame 62 of the component-embedded sheet 67 is sandwiched between the ceiling 21 and the pusher 23.

  At this time, the height H1 from the surface of the component array region 615 to the upper surface of the frame 62 is higher than the height H2 from the surface of the component array region 615 to the top surface 603 of the electronic component 60. Therefore, when the frame 62 is sandwiched, the top surface 603 of the electronic component 60 does not reach the flat surface 212 of the ceiling portion 21. Therefore, at least the component array area 615 is confined in the enclosed space 24 a defined by the ceiling portion 21, the protective sheet 61 and the frame 62 and sealed by the O-ring 215.

  When the component array area 615 is confined in the enclosed space 24 a, negative pressure is generated on the flat surface 212 of the ceiling portion 21. The electronic component 60 is attracted to the flat surface 212. The component-embedded sheet 67 is distorted in the middle frame region 614 and is attracted to the flat surface 212 while the entire region of the component array region 615 is flat. Therefore, the component array region 615 is not bent to be curved, and the embedded electrode 602 is not detached from the protective sheet 61. It is preferable that the pressure be gradually lowered on the flat surface 212 of the ceiling portion 21 so as to generate negative pressure so that the electronic component 60 does not rush vigorously toward the flat surface 212. The magnitude of the negative pressure at this time is preset in the control unit 74. It is preferable that the pressure be close to a vacuum (0 atm) in consideration of the relationship with the pressure reduction of the enclosed space 24b described later.

  Next, as shown in (b) of FIG. 10, the pusher 23 and the ceiling portion 21 are lowered toward the mounting table 22 at a constant velocity. Then, the area of the frame 62 of the component-embedded sheet 67 is brought into contact with the adhesive sheet 64 on the cooling plate 63. Furthermore, the area of the frame 62 is attached to the adhesive sheet 64 by moving and pressing the ceiling portion 21 toward the mounting table 22. When the area of the frame 62 of the component-embedded sheet 67 is brought into contact with the adhesive sheet 64 on the cooling plate 63, the negative pressure of the ceiling 21 is maintained, and the component-embedded sheet 67 is the ceiling The component array area 615 is not in contact (separated) with the adhesive sheet 64 because it is attracted to the flat surface 212 of 21.

  Here, when the negative pressure is not generated in the ceiling portion 21, the component embedded sheet 67 contacts the adhesive sheet 64 in the presence environment of air. Then, air bubbles may enter between the component-embedded sheet 67 and the adhesive sheet 64. When air bubbles enter, the heat insulation area reaching the cooling plate 63 is reduced, and the heat radiation effect of the electronic component 60 at the time of film formation is reduced. However, in the plate mounting portion 2, in the presence environment of air, since the component-embedded sheet 67 is lifted in the direction away from the adhesive sheet 64, the entry of air bubbles is prevented.

  When the frame 62 is in close contact with the adhesive sheet 64 via the protective sheet 61, that is, when the frame 62 is pressed, it is defined by the protective sheet 61, the cooling plate 63 and the frame 62, and the non-adhesive surface 612 of the protective sheet 61 and the cooling plate 63 The adhesive sheet 64 side is confined in the sealed space 24b. When the sealed space 24b is formed, as shown in (c) of FIG. 10, while the negative pressure of the ceiling portion 21 is maintained, the negative pressure is also generated on the mounting table 22. In other words, the pressure in the sealed space 24 b is reduced under a state in which the outer circumferential portion (outer frame region 613) of the protective sheet 61 is pressed by the ceiling portion 21. The sealed space 24 b between the cooling plate 63 on which the adhesive sheet 64 is installed and the protective sheet 61 is depressurized through the air holes 632 of the cooling plate 63 and the air holes 632 of the adhesive sheet 64. At this time, the negative pressure generated on the mounting table 22 is a negative pressure that is slightly closer to the atmospheric pressure than the negative pressure generated on the ceiling 21, and the size is such that the suction of the electronic component 60 onto the ceiling 21 can be maintained. Good. This negative pressure is preset in the control unit 74.

  When the depressurization of the sealed space 24b between the cooling plate 63 on which the adhesive sheet 64 is installed and the protective sheet 61 to a preset negative pressure is completed, as shown in (d) of FIG. The negative pressure of the ceiling portion 21 is gradually changed to a positive pressure while maintaining the negative pressure. In other words, the holding of the protective sheet 61 by the ceiling portion 21 is released under the state where the pressure reduction of the sealed space 24 b is maintained. The component-embedded sheet 67 is gently sucked down toward the adhesive sheet 64 and pushed down, and the component-embedded sheet 67 is pressed against the adhesive sheet 64 attached to the cooling plate 63. The component-embedded sheet 67 is attached to the cooling plate 63 via the adhesive sheet 64.

  When the negative pressure on the mounting table 22 side and the negative pressure on the ceiling portion 21 side are the same or substantially the same, the protective sheet 61 is elastically shrunk and the protective sheet 61 contacts the adhesive sheet 64. Therefore, the negative pressure on the mounting table 22 side may be the same as or substantially the same as the negative pressure on the ceiling 21 side, and after contact, the negative pressure on the ceiling 21 side may be gradually changed to a positive pressure.

  Finally, as shown in (e) of FIG. 10, the ceiling part 21 is moved away from the mounting table 22 to overlap the component-embedded sheet 67, the adhesive sheet 64, and the cooling plate 63. Release the pinch. Thus, the production of the component mounting plate 68 including the electronic component 60, the protective sheet 61, the adhesive sheet 64, and the cooling plate 63 is completed. The positive pressure generated in the ceiling portion 21 and the negative pressure generated in the mounting portion 22 may be released while the ceiling portion 21 is pulled away from the mounting table 22.

  That is, the ceiling portion 21, the pusher 23, and the mounting table 22 serve as a drive unit for causing the component embedded sheet 67 and the cooling plate 63 to approach each other. The ceiling portion 21 and the mounting table 22 serve as a fixing portion for sandwiching the component-embedded sheet 67 and the cooling plate 63, and also serve as a pressing portion for pressing the frame 62 and the cooling plate 63 into close contact. Further, the air pressure supply hole 223 of the mounting table 22 is a pressure reducing portion that reduces the pressure in the sealed space 24 b between the component embedded sheet 67 and the cooling plate 63. Further, the air holes 213 of the ceiling portion 21 are pressure reducing portions for reducing the pressure of the sealed space 24 a between the flat surface 212 of the ceiling portion 21 and the component embedded sheet 67.

  The flat surface 212 of the ceiling portion 21 holds the component embedded sheet 67 by generating a negative pressure prior to the pressure reduction between the component embedded sheet 67 and the cooling plate 63, and the component embedded The separation means for preventing air bubbles from entering between the sheet 67 and the cooling plate 63 and the suction by the negative pressure of the mounting table 22 cool the component embedded sheet 67 by the positive pressure as a positive pressure part. It becomes a pressing means to be in close contact with the plate 63. The mounting table 22 serves as a suction unit that brings the component-embedded sheet 67 into close contact with the cooling plate 63 by the negative pressure in combination with the pressing of the ceiling portion 21 by the positive pressure.

  As described above, the plate mounting unit 2 sticks the protective sheet 61 in which the electrodes 602 of the electronic component 60 are embedded to the cooling plate 63. The plate mounting portion 2 has a ceiling portion 21 as a pressing portion that presses the outer peripheral portion of the frame 62 etc. of the protective sheet 61 against the cooling plate 63, and reduces the pressure between the component array area 615 and the cooling plate 63. And a decompression unit. In addition, the plate mounting unit 2 presses the protective sheet 61 and the cooling plate 63 with the adhesive sheet 64 in a state where the pressure is reduced by the pressure reducing unit. Accordingly, air bubbles can be prevented from entering between the protective sheet 61 and the cooling plate 63, and the heat transfer area to the cooling plate 63 can be sufficiently secured.

Further, the plate mounting portion 2 sucks the protective sheet 61 by negative pressure on the flat surface 212 of the ceiling portion 21, that is, on the opposite side to the cooling plate 63 with the protective sheet 61 interposed therebetween. It was made to have the air hole 213 made to estrange. The flat surface 212 having the air holes 213 serves as a protective sheet holding portion, and when the pressing portion brings the outer peripheral portion of the protective sheet 61 into contact with the cooling plate 63, an area where the electronic components 60 of the protective sheet 61 are arranged. To hold the protective sheet 61 apart from the cooling plate 63. And
A negative pressure is maintained until the pressure between the component-embedded sheet 67 and the cooling plate 63 by the pressure reducing section is reduced, and the holding is released under the reduced pressure state. As a result, the situation in which the protective sheet 61 and the cooling plate 63 stick in an incompletely decompressed state can be prevented, and the possibility of air bubbles entering between the protective sheet 61 and the cooling plate 63 is further reduced. A sufficient heat transfer area to 63 can be secured.

  The air hole 213 opened in the flat surface 212 of the ceiling 21 is before the pusher 23 descends and the ceiling 21 abuts on the mounting table 22 via the frame 62 of the component-embedded seat 67, that is, the component The negative pressure is generated before the space between the cooling plate 63 provided with the adhesive sheet 64 and the protective sheet 61 is formed at the latest before the embedded sheet 67 and the cooling plate 63 approach. . Thus, when the protective sheet 61 and the cooling plate 63 are set in the plate mounting portion 2, the protective sheet 61 can be prevented from being accidentally stuck to the cooling plate 63.

  Further, the plate mounting portion 2 has a flat surface 212 of the ceiling portion 21. The flat surface 212 is opposite to the cooling plate 63 with the protective sheet 61 interposed therebetween and faces the electronic component 60. The air holes 213 for keeping the cooling plate 63 and the protective sheet 61 apart are kept open on the flat surface 212 until the pressure reduction between the component-embedded sheet 67 and the cooling plate 63 is completed. As a result, the protective sheet 61 can be made to conform flatly without bending and bending the protective sheet 61 due to the pressure difference between the front and back of the protective sheet 61 during decompression, and the electronic component 60 is a protective sheet during plate attachment 61 can be prevented from peeling off.

  The air hole 213 on the side of the ceiling portion 21 serves as a positive pressure portion, and after the pressure between the component-embedded sheet 67 and the cooling plate 63 reaches a predetermined set value, negative pressure generation switches to positive pressure generation to protect The sheet 61 is pressed against the cooling plate 63. That is, the air holes 213 hold the protective sheet 61 away from the cooling plate 63, and the depressurizing portion for depressurizing the sealed space 24a and the pressing means for the protective sheet 61 and the cooling plate 63 as a positive pressure portion for generating positive pressure. It also serves as However, the air holes provided in other members may perform the functions of separation, pressure reduction, and adhesion.

  For example, as in the present embodiment, air holes 632 are provided in the cooling plate 63. The plate mounting unit 2 has a mounting table 22 on which the cooling plate 63 is mounted to generate a negative pressure. Then, the protective sheet 61 may be attracted to the cooling plate 63 through the mounting table 22 on which the cooling plate 63 is mounted and the air holes 632 of the cooling plate 63.

  The operating mechanism of the ceiling 21 and the operating mechanism of the pusher may be any known mechanism, and the present invention is not limited to the mechanism.

  For example, a ball screw whose axis is extended in the direction from the ceiling 21 to the mounting table 22 and a rail guide extending in the direction from the ceiling 21 to the mounting table 22 are connected to the ceiling 21. In this case, the ceiling portion 21 moves toward the mounting table 22 along the rail in accordance with the rotational direction of the screw shaft. The ball screw and the rail guide extend such that the ceiling portion 21 approaches the mounting table 22 up to the distance of the thickness H1 of the frame 62 of the component mounted sheet 66 in the ceiling portion 21.

  Further, the rear end portion of the pusher 13 is a cam follower. The cam follower follows the circumferential surface of the oval cam. The cam is pivotally supported by the rotary motor and is rotatable in the circumferential direction. When the rotary motor is driven and the cam rotates, the cam follower climbs the bulging portion of the cam, and the pusher 13 is pushed up.

  Furthermore, as a method of defining the closed space 24a and the closed space 24b, the component embedding sheet 67 and the cooling plate 63 are not used as one element of the definition means, but may be defined by the ceiling portion 21 and the mounting table 22. Good. For example, in one space defined by the ceiling portion 21 and the mounting table 22 such that one or both of the ceiling portion 21 and the mounting table 22 have a cup shape and the part mounting completed sheet 66 and the cooling plate 63 are included. Alternatively, the front and back of the component mounted sheet 66 may be partitioned by the ceiling portion 21 and the mounting table 22. However, in this case, it is desirable that the ceiling portion 21 be provided with a side wall extending toward the mounting table 22 while surrounding the flat surface 212 in which the air hole 213 is opened. The side wall is in close contact with the flat surface of the mounting table 22 to define one sealed space. The O-ring 215 is installed on the end face of the side wall.

(Deposition processing unit)
Next, the film formation processing unit 3 responsible for the film formation process will be described. FIG. 11 is a schematic view showing the configuration of the film formation processing unit 3. The film formation processing unit 3 forms an electromagnetic wave shielding film 605 on each electronic component 60 on the component mounting plate 68 by sputtering. As shown in FIG. 11, the film formation processing unit 3 has a chamber 31 and a load lock chamber 32. The chamber 31 is a cylindrical vacuum chamber radially expanded in diameter than in the axial direction. The inside of the chamber 31 is divided into a plurality of fan-shaped sections by a dividing section 33 extended along the radial direction. A processing position 311 and a deposition position 312 are assigned to some of the fan-shaped sections.

  The dividing portion 33 extends from the ceiling surface to the bottom surface of the chamber 31 but has not reached the bottom surface. A rotary table 34 is installed in the bottom side space without the dividing portion 33. The rotary table 34 has a disk shape coaxial with the chamber 31 and rotates in the circumferential direction. The component mounting plate 68 introduced from the load lock chamber 32 into the chamber 31 is mounted on the rotary table 34, and travels around the processing position 311 and the film forming position 312 while circularly moving along the locus of the circumference.

  In order to maintain the position of the component mounting plate 68 relative to the rotary table 34, the rotary table 34 holds a component mounting plate 68 such as a groove, a hole, a protrusion, a jig, a holder, a mechanical chuck or an adhesive chuck. Holding means are provided.

  A surface treatment unit 35 is installed at the treatment position 311. The surface treatment unit 35 is supplied with a process gas such as argon gas, and converts the process gas into a plasma by applying a high frequency voltage to generate electrons, ions, radicals and the like. For example, the surface treatment unit 35 is a cylindrical electrode opened on the rotary table 34 side, and a high frequency voltage is applied by an RF power supply.

  A target 361 constituting a sputtering source 36 is disposed at the film forming position 312, and a sputtering gas, which is an inert gas such as argon gas, is introduced. The sputtering source 36 applies power to the target 361 to plasmatize the sputtering gas, and causes generated ions and the like to collide with the target to knock out particles. The target 361 is made of the material of the electromagnetic wave shielding film 605. That is, particles of the electromagnetic wave shielding film 605 are knocked out from the target 361, and the particles of the electromagnetic wave shielding film 605 which are knocked out are deposited on the electronic component 60 on the rotary table 34.

  For example, two film forming positions 312 are provided. The target material of each film forming position 312 may be the same material, or may be a different material, and may form a laminated electromagnetic shielding film 605. A known power source such as a DC power source, a DC pulse power source, an RF power source, or the like can be applied as a power source for applying power to the sputtering source 36 at each film forming position 312. Further, a power source for applying power to the sputtering source 36 may be provided for each sputtering source 36, or a common power source may be switched by a switch and used.

  In such a film forming processing unit 3, the electronic component 60 is cleaned and roughened by etching or ashing at the processing position 311 to enhance the adhesion of the conductive shield film to the electronic component 60, Further, particles of the target 361 are deposited on the electronic component 60 at the film forming position 312, whereby the conductive shield film is formed on the electronic component 60. Since the electrode 602 is embedded in the protective sheet 61 and the electrode exposed surface 601 is in close contact with the protective sheet 61, the particles of the electromagnetic wave shielding film 605 are prevented from adhering to the electrode 602, and the electrode exposed surface 601 and the protective sheet The particles of the electromagnetic wave shielding film 605 are prevented from entering between them. Furthermore, the heat of the electronic component 60 is transferred to the cooling plate 63, and the excessive heat storage of the electronic component 60 is suppressed.

  Although the film formation processing unit 3 forms a film on the electronic component 60 using the sputtering method, the film formation method is not limited to this. For example, the film formation processing unit 3 may form the electromagnetic wave shielding film 605 on the electronic component 60 by vapor deposition, spray coating, application, or the like.

(Plate release part)
Next, the plate releasing unit 4 responsible for the plate releasing process will be described. FIG. 12 is a schematic view showing the configuration of the plate releasing unit 4. After the electromagnetic wave shielding film 605 is formed on the plate releasing unit 4, the component mounting plate 68 is inserted. The plate releasing unit 4 peels off the component-embedded sheet 67 from the cooling plate 63 as a first step for obtaining the individual electronic components 60.

  As shown in FIG. 12, the plate releasing unit 4 includes a ceiling 41 and a mounting table 42. The ceiling portion 41 and the mounting table 42 are disposed to face each other. The mounting table 42 is stationary. On the other hand, the ceiling portion 41 can move up and down with respect to the mounting table 42. The ceiling portion 41 approaches the mounting table 42 at least to a distance of the thickness H1 of the frame 62 of the component mounting plate 68.

  The ceiling portion 41 is a block having an internal space 411, and has a flat surface 412 on the surface facing the mounting table 42. The mounting table 42 has a cup shape with a bottom, and the opening 421 faces the ceiling 41. The flat surface 412 of the ceiling portion 41 has the same size and shape as the component mounting plate 68 or is wider than the component mounting plate 68. On the other hand, the opening 421 of the mounting table 42 has an inclusive area of the component array region 615 or more and the middle frame region 614 or less. The edge 422 around the opening 421 of the mounting table 42 has a width equal to or greater than the width of the frame 62.

  In the mounting table 42, the edge 422 supports the component mounting plate 68, and the opening 421 is closed by the component mounting plate 68. The cooling plate 63 side abuts on the edge 422. At the bottom of the mounting table 42, an air pressure supply hole 423 is penetrated. The air pressure supply hole 423 is connected to a pneumatic circuit 75 including a compressor, a positive pressure supply pipe, and the like (not shown). Therefore, a positive pressure is generated in the air hole 632 of the component mounting plate 68 placed by closing the opening 421.

  Further, at the edge 422 of the mounting table 42, a pusher insertion hole 424 penetrating the mounting table 42 is provided. The penetrating position of the pusher insertion hole 424 matches the pusher insertion hole 631 of the cooling plate 63, and when the component mounting plate 68 is placed, the guide portion insertion hole 621 of the frame 62 is avoided and the frame 62 is closed. Position. The pusher 43 is inserted into the pusher insertion hole 424. The pusher 43 axially moves the tip of the component mounting plate 68 mounted on the mounting table 42 higher than the frame 62 so as to project the tip thereof.

  The pusher 43 peels off the component embedded sheet 67 from the cooling plate 63 against the adhesive force between the outer frame area 613 and the adhesive sheet 64, and separates the component embedded sheet 67 from the cooling plate 63 to embed the component. The sheet 67 is installed with sufficient rigidity, number and positional relationship so that it can be lifted and supported in parallel. For example, when the outer shape of the frame 62 is rectangular, it is arranged as a rod body corresponding to each corner of the frame 62. The pusher insertion holes 424 are also provided corresponding to the number and positional relationship of the pushers 43.

  In addition, a pair of holding blocks 44 are disposed on both sides of the mounting table 42. The holding block 44 holds only the cooling plate 63 among the component mounting plates 68 placed on the mounting table 42. That is, the pair of holding blocks 44 is disposed at the same height as the cooling plate 63 placed on the mounting table 42 and has the same thickness as the cooling plate 63. The sandwiching blocks 44 can be brought into contact with or separated from each other about the cooling plate 63. However, the clamping block 44 is immobile in the direction in which the ceiling portion 41 and the mounting table 42 are arranged.

  Next, on the flat surface 412 of the ceiling portion 41, a large number of air holes 413 communicating with the internal space 411 are provided. The penetrating range of the air holes 413 is a range of the same size and shape as the inner side of the frame 62 of the protective sheet 61 or at least the same size and shape of the component array area 615. The penetrating position of the air hole 413 is a position where the component array area 615 is covered when the component mounting plate 68 is placed on the mounting table 42.

  In the internal space 411 of the ceiling portion 41, an air pressure supply hole 414 is provided at a location different from the flat surface 412. The air pressure supply hole 414 is connected to a pneumatic circuit 75 including a compressor, a negative pressure supply pipe, and the like (not shown). Therefore, negative pressure is generated in the air hole 413 through the air pressure supply hole 414 and the internal space 411.

  Further, on the flat surface 412 of the ceiling portion 41, an O-ring 415 surrounding the penetrating range of the air hole 413 is installed along the frame 62 of the component mounting plate 68 mounted on the mounting table 42. The peripheral edge of the flat surface 412 of the ceiling portion 41 facing the frame 62 functions as a fixing portion for pressing a portion out of the component array area 615 where the electronic components 60 in the protective sheet 61 are arrayed. The fixing portion presses the protective sheet 61 over the entire area of the peripheral edge facing the frame 62, that is, the frame 62 is pressed over the entire area, but it is not necessary to press over the entire area. There may be no place.

  FIG. 13 shows the flow of the operation of such a plate releasing unit 4. FIG. 13 is a transition diagram schematically showing the state of each step of the plate releasing unit 4. First, as shown in (a) of FIG. 13, the ceiling portion 41 is separated from the mounting table 42, and the pusher 43 is buried in the pusher insertion hole 424 of the mounting table 42. Then, the component mounting plate 68 is mounted on the mounting table 42. When the component mounting plate 68 is placed, the cooling plate 63 is fixed by the holding block 44.

  Next, as shown in FIG. 13B, the ceiling 41 is lowered toward the mounting table 42, and the flat surface 412 of the ceiling 41, that is, the fixing portion is brought into contact with the frame 62 of the component mounting plate 68. . At this time, the height H1 from the surface of the component array region 615 to the upper surface of the frame 62 is higher than the height H2 from the surface of the component array region 615 to the top surface 603 of the electronic component 60. Therefore, when the frame 62 is sandwiched, the top surface 603 of the electronic component 60 does not reach the flat surface 412 of the ceiling portion 41. Therefore, at least the component array area 615 is confined in the enclosed space 45 defined by the ceiling 41, the protective sheet 61 and the frame 62 and sealed by the O-ring 415.

  When the component array area 615 is confined in the sealed space 45, as shown in FIG. 13C, a negative pressure is generated in the ceiling portion 41, and a positive pressure is generated in the mounting table 42. As a result, in the component array area 615 inside the frame 62, a force to be sucked up by the flat surface 412 of the ceiling 41 and a force to push up in the direction toward the flat surface 412 of the ceiling 41 away from the mounting table 42 work. The suction force and the push-up force exert a sufficient force on the component array region 615 to separate the component array region 615 from the cooling plate 63, and the component array region 615 is peeled off from the cooling plate 63. The magnitudes of the negative pressure of the ceiling portion 41 and the positive pressure of the mounting table 42 at this time are set in the control unit 74 in advance.

  Since the protective sheet 61 is flat without distortion when the component array area 615 separates, the momentum of the component array area 615 toward the flat surface 412 of the ceiling 41 is small, and the electronic component 60 is peeled off from the protective sheet 61 or The electronic component 60 is prevented from jumping out of the protective sheet 61. Even if the component array area 615 is vigorously peeled off, the flat surface 412 of the ceiling portion 41 abuts, and the electronic component 60 is stopped by the flat surface 412, so the electronic component 60 is peeled off from the protective sheet 61 or protected. The risk of falling off the seat 61 is reduced.

  In order to further increase the effect of reducing the risk of peeling or falling off of the electronic component 60 from the protective sheet 61, the top surface 603 of the electronic component 60 and the flat surface are in a state before the protective sheet 61 is peeled from the cooling plate 63. It is preferable that the distance between it and 412 be as small as possible. Therefore, the distance between the top surface 603 and the flat surface 412 of the electronic component 60 may be set to the minimum necessary distance for peeling the protective sheet 61 from the cooling plate 63.

  In addition, for example, the air from the one end of the cooling plate 63 is positively directed to the other end of the cooling plate 63 so that the air holes 632 in which the positive pressure acts on the plurality of air holes 632 of the cooling plate 63 gradually increase. Of the mounting table 42 so that the air holes 632 to which pressure is applied are increased, or the range of the air holes 632 to which positive pressure is applied stepwise from the central air holes 632 to the outer peripheral side. A plurality of systems for generating positive pressure may be provided by dividing the space in the opening 421 into a plurality of spaces. By doing this, it is possible to prevent the component array region 615 from being peeled off from the cooling plate 63 at once, and it is possible to suppress the electronic component 60 from rushing to the flat surface 412 of the ceiling portion 41.

  In addition, when the component array region 615 is peeled off, the electronic component 60 abuts on the flat surface 412 of the ceiling portion 41, and only the middle frame region 614 of the protective sheet 61 bends, and at least the component array region 615 maintains a flat shape. In other words, if the flat surface 412 of the ceiling portion 41 is absent, the protective sheet 61 bends so as to curl air. Then, the electronic component 60 may be peeled off from the protective sheet 61. However, since the component array region 615 is maintained flat, peeling of the electronic component 60 is suppressed.

  When the component array area 615 is separated from the cooling plate 63, as shown in FIG. 13D, the pusher 43 is inserted into the pusher insertion hole 424 of the mounting table 42, the pusher insertion hole 424 of the cooling plate 63, and the pusher insertion of the adhesive sheet 64. The frame 62 is contacted via the protective sheet 61 through the holes 424. Then, the pusher 43 is further advanced, and at the same time, the ceiling portion 41 is separated from the mounting table 42 at the same speed as the pusher 43. Since the cooling plate 63 is held by the holding block 44 and fixed in position, the outer frame area 613 to which the frame 62 is attached is also peeled off from the cooling plate 63, and the entire protective sheet 61 is peeled off from the cooling plate 63.

  At this time, the positive pressure of the mounting table 42 and the negative pressure of the ceiling portion 41 are maintained. Therefore, the situation where the component array area 615 hangs down toward the cooling plate 63 by its own weight and is re-adhered is suppressed. Further, since the positive pressure of the mounting table 42 is maintained, peeling of the outer frame area 613 to which the frame 62 is attached from the cooling plate 63 is also assisted.

  Finally, as shown in (e) of FIG. 13, by stopping the pusher 43 and moving the ceiling portion 41 further away from the mounting table 42, the clamping on the component-embedded sheet 67 is released, and cooling is performed. The peeling of the protective sheet 61 from the plate 63 is completed. Note that the positive pressure of the mounting table 42 and the negative pressure of the ceiling portion 41 may be released during this time.

  That is, the ceiling portion 41 is a fixing portion that holds down the frame 62 positioned out of the component array area 615. Further, the air pressure supply holes 423 of the mounting table 42 become positive pressure generating holes, press the component arrangement region 615 through the air holes 632 of the cooling plate 63, and peel the component arrangement region 615 from the cooling plate 63 before the frame 62. It becomes a pressurizing means. The air holes 413 in the ceiling portion 41 become negative pressure generating holes, and suction means for suctioning the component array area 615 and assisting peeling from the cooling plate 63.

  Further, the flat surface 412 of the ceiling portion 41 serves as a stopping means for suppressing the peeling and falling off of the electronic component 60 from the protective sheet 61 when the component array area 615 is peeled off. It is a flattening means which suppresses that the component 60 peels off from the protective sheet 61. The pusher 43 is a push-up means for peeling the frame 62 from the cooling plate 63 after the part array area 615 is peeled off.

  Thus, the plate releasing unit 4 removes the cooling plate 63 after the film forming process. The plate releasing unit 4 includes a mounting table 42 having a positive pressure generating hole whose air pressure supply hole 423 is an example, and a fixing unit whose ceiling 41 is an example. The positive pressure generating hole faces the cooling plate 63 to generate positive pressure. While the positive pressure of the mounting table 42 pressurizes the component array region 615, the fixing portion holds down a portion out of the component array region 615 of the protective sheet 61, for example, the frame 62. After leaving the cooling plate 63, the pressing is released.

  Thus, when the component array area 615 is peeled off, the protective sheet 61 is maintained flat, so that the component array area 615 is prevented from jumping up due to the reaction of the protective sheet 61 returning to flat. Therefore, it is suppressed that the electronic component 60 peels off from the protective sheet 61 and falls off.

  More specifically, when positive pressure is supplied from a plurality of air holes 632 provided in a range corresponding to the middle frame area 614 and the part array area 615 in the cooling plate 63, the protective sheet 61 is cooled by the positive pressure. It begins to peel off from 63. The peeling part of the protective sheet 61 produced thereby is gradually expanded and connected starting from the point at which peeling starts as a starting point by the continuously supplied positive pressure, and spread outward. Finally, the peeling portion reaches the boundary between the outer frame region 613 which is the inner peripheral edge of the frame 62 pressed by the fixing portion and the middle frame region 614, and the component array region 615 of the protection sheet 61 and the middle frame region 614 completely separates from the cooling plate 63. At this time, the boundary between the outer frame region 613 and the middle frame region 614, which the peeled portion of the protective sheet 61 finally reaches, is held down by the flat surface 412 as the fixing portion via the frame 62, Even if the parts array area 615 and the middle frame area 614 peel off, the protective sheet 61 is prevented from jumping up.

  Moreover, since the outer frame region 613 is held down by the flat surface 412 as the fixing portion via the frame 62, positive pressure is prevented from leaking out between the protective sheet 61 and the cooling plate 63. The entire component array area 615 can be peeled off reliably and stably. It can suppress that the electronic component 60 peels off from the protective sheet 61, and falls off by these things.

  In addition, the plate releasing unit 4 has the flat surface 412 of the ceiling portion 41 separated from the protective sheet 61 on the side of the ceiling portion 41, that is, opposite to the cooling plate 63 with the protective sheet 61 interposed therebetween. The flat surface 412 holds the bulge of the component array area 615 while the component array area 615 is pressurized. Thus, the component array region 615 can be made flat, and the electronic component 60 can be more reliably prevented from peeling off. Further, since the flat surface 412 restrains the electronic component 60 even if the component array region 615 jumps up, it is possible to further suppress the electronic component 60 from peeling off from the protective sheet 61.

  In addition, the plate releasing portion 4 has a negative pressure generating hole for generating a negative pressure so as to face the protective sheet 61. As an example, the air hole 413 which generates a negative pressure on the flat surface 412 of the ceiling portion 41 is provided. The air holes 413 suck the protective sheet 61 together with the pressure applied to the component arrangement area 615 by the air holes 632. For this reason, the protection sheet 61 can be peeled off from the cooling plate 63 with the help of the pressure applied to the component array region 615, and peeling errors are less likely to occur.

  Further, the plate releasing unit 4 was provided with the pusher 43. The pusher 43 advances into the cooling plate 63 after the component array area 615 is separated from the cooling plate 63, and pushes up a pressed portion such as the frame 62 in a direction away from the cooling plate 63. Thus, after the component array area 615 is peeled off, the entire protective sheet 61 can be peeled off. In addition, the fixing | fixed part which makes the ceiling part 41 an example should just be spaced apart from the protection sheet 61 with advancing of the pusher 43, when releasing pressing.

  A known mechanism may be adopted as the operation mechanism of the ceiling portion 41, the operation mechanism of the holding block 44, and the operation mechanism of the pusher 43, and the present invention is not limited to the mechanism mechanism.

  For example, a ball screw whose axis is extended in a direction from the ceiling 41 to the mounting table 42 and a rail guide extending in the direction from the ceiling 41 to the mounting table 42 are connected to the ceiling 41. In this case, the ceiling portion 41 moves toward the mounting table 42 along the rail in accordance with the rotation direction of the screw shaft. The ball screw and the rail guide extend such that the ceiling portion 41 approaches the mounting table 42 up to the distance of the thickness H1 of the frame 62 of the component mounted sheet 66.

  Further, on the further outside of the holding block 44, the circumferential surface of the oval cam is brought into contact with the pair of holding blocks 44 individually. The cam is pivotally supported by the rotary motor and is rotatable in the circumferential direction. When the rotary motor is driven, the cam rotates, and the bulging portion of the cam abuts on the holding block 44, the holding block 44 is pushed in the direction of the cooling plate 63 and holds the cooling plate 63.

  Further, the rear end portion of the pusher 43 is a cam follower. The cam follower follows the circumferential surface of the oval cam. The cam is pivotally supported by the rotary motor and is rotatable in the circumferential direction. When the rotary motor is driven and the cam rotates, the cam follower climbs the bulging portion of the cam, and the pusher 43 is pushed up.

  Further, the plate releasing unit 4 peels the protective sheet 61 from the cooling plate 63 by generating a positive pressure on the mounting table 42. The flat surface 412 of the ceiling portion 41 is an additional function of making the peeled protective sheet 61 flat, and the air holes 413 opened in the flat surface 412 of the ceiling portion 41 also assist the pressurization by the mounting table 42. It is an additional function. Therefore, as shown in FIG. 14, the ceiling portion 41 may have a rectangular cylindrical shape that brings the opening edge into contact with the frame 62, and the flat surface 412 may be omitted. Further, as shown in FIG. 15, the air holes 413 may be omitted from the flat surface 412 of the ceiling portion 41.

(Peeling processing unit)
Finally, the peeling processing unit 5 responsible for the component peeling process will be described. FIG. 16 is a schematic view showing the configuration of the peeling processing unit 5. The part embedded sheet 67 from which the cooling plate 63 has been removed via the plate releasing part 4 is put into the peeling processing part 5, and the individual electronic parts 60 are peeled from the protective sheet 61 as the final stage. In addition, the peeling process part 5 may be called a peeling process apparatus, when it isolate | separates from the film-forming apparatus 7. FIG.

  As shown in FIG. 16, the peeling processing unit 5 includes a mounting table 51 on which the component-embedded sheet 67 is mounted, a chuck 52 that holds the protective sheet 61 and moves continuously, and a protective sheet 61. It has a guide part 53 which creates an opportunity for the chuck 52 to grip the protective sheet 61 by hooking the end, a sheet stopper 54 which forms a peeling base point of the protective sheet, and a component stopper 55 which prevents the electronic component 60 from floating. ing.

  The mounting table 51 has a flat surface 511 on which the component embedded sheet 67 is mounted. The component-embedded sheet 67 is placed with the electronic component 60 directed to the flat surface 511, the top surface 603 of the electronic component 60 being in contact with the mounting surface, and the protective sheet 61 facing upward. The flat surface 511 is made of an adhesive non-slip member to improve the stability of the electronic component 60. The outer peripheral area of the flat surface 511 is dug down by one step at a depth corresponding to the height H1 from the surface of the component array region 615 to the end face of the frame 62 so that the frame 62 can be inserted. The electronic component 60 is placed on the flat surface 511 while maintaining the

  The mounting table 51 is a block having an internal space 512. In the flat surface 511 of the mounting table 51, a large number of air holes 513 are provided in a region facing the component array region 615. The air hole 513 communicates with the internal space 512 of the mounting table 51. In the internal space 512 of the mounting table 51, an air pressure supply hole 514 is provided at a location different from the flat surface 511. The air pressure supply hole 514 is connected to a pneumatic circuit 75 including a compressor, a negative pressure supply pipe, and the like (not shown). Therefore, negative pressure is generated in the air hole 513 through the air pressure supply hole 514 and the internal space 512.

  The chucks 52 are a pair of blocks having gripping surfaces facing each other. The pair of blocks can be separated and attached. The chuck 52 is supported by a movable device movable in the horizontal and vertical directions, and along the protective sheet 61 placed on the flat surface 511 of the mounting table 51, at an angle of attack of 45 degrees with respect to the flat surface 511 Move continuously. That is, the chuck 52 separates from the mounting table 51 while traversing the flat surface 511 of the mounting table 51 longitudinally. Continuous movement means moving at a constant speed, preferably without stopping on the way. The movement range of the chuck 52 is from the end of the protective sheet 61 where the trigger for gripping is created to the opposite end of the end.

  The sheet stopper 54 has a cylindrical shape with a long axis crossing one side of the protective sheet 61, and is a rotatable roller. The sheet stopper 54 can be formed of metal such as stainless steel. Further, the diameter of the sheet stopper 54 can be set to 5 mm to 10 mm if the length crossing the protective sheet 61 is about 200 mm to 300 mm. In this embodiment, a stainless steel cylinder having a diameter of 6 mm is used.

  The sheet stopper 54 keeps the height constant based on the flat surface 511 of the mounting table 51, maintains the position just below the chuck 52, and is a protective sheet 61 mounted on the mounting table 51 along the direction orthogonal to the long axis. Longitudinal. The arrangement height of the sheet stopper 54 matches the height of the electronic component 60 excluding the electrode 602 and the protective sheet 61. That is, the sheet stopper 54 travels while pressing the non-adhesive surface 612 of the protective sheet 61. The degree of pressing does not damage, scrape, or crush the electrode 602. The movement range of the sheet stopper 54 is to the opposite end of the protective sheet 61 between the guides 53, that is, based on the edge of the guide insertion hole 621 of the frame 62.

  The component stopper 55 has a cylindrical shape with a long axis that traverses at least the entire component array area 615 of the protective sheet 61, and is an axially rotatable roller. The component stopping roller 55 can be formed of metal such as stainless steel. The diameter of the component stopping roller 55 may be determined in consideration of the diameter of the sheet stopping roller 54 and the size of the electronic component 60, but if it is set smaller than the sheet stopping roller 54, the diameter is closer to the sheet stopping roller 54. Can be arranged. In this embodiment, a stainless steel cylinder having the same diameter as the sheet stopping roller 54 is used.

  The component stopper 55 is disposed to be close to and away from the sheet stopper 54. While the chuck 52 and the sheet stopper 54 move the mounting table 51 longitudinally, the component stopper 55 follows the sheet stopper 54 maintaining a fixed distance. The fixed distance is less than the length of the electronic component 60 stuck to the protective sheet 61 (the length in the moving direction of the component stopper 55). When the chuck 52 and the sheet stopper 54 are positioned at the end of the mounting table 51, the component stopper 55 takes a distance so as to be opposite to the sheet stopper 54 with the guide portion insertion hole 621 interposed therebetween.

  The guide portion 53 is disposed at a position where the axis is shared with the guide portion insertion hole 621 of the frame 62. The tip end of the guide portion 53 faces the guide portion insertion hole 621 of the frame 62. The guide portion 53 is movable in the axial direction, protrudes toward the end of the protective sheet 61, pushes up the end of the protective sheet 61 toward the chuck 52, and the frame 62 until the end of the protective sheet 61 reaches the chuck 52. The guide portion insertion hole 621 of the The guide portion 53 peels off one side of the protective sheet 61 by pushing up. Therefore, the guide portion insertion holes 621 have a pin shape, and are installed at a plurality of locations along one side of the protective sheet 61.

  For example, as shown in FIG. 17, the penetrating positions of the guide portion insertion holes 621 are positions spaced apart at equal intervals across the center of one side of the frame 62. The guide portion 53 is installed corresponding to the guide portion insertion hole 621, and the guide portion 53 is formed in a round bar shape. Then, the chuck 52 and the sheet stopper 54 are longitudinally cut in a direction orthogonal to one side of the frame 62, and the electronic component 60 is peeled off from the protective sheet 61.

  FIG. 18 shows the flow of the operation of such a peeling processing unit 5. FIG. 18 is a transition diagram schematically showing the state of the peeling processing unit 5 in each step. First, as shown in (a) of FIG. 18, the component embedded sheet 67 is placed on the mounting table 51 in a state where the top surface 603 of the electronic component 60 is in contact with the flat surface 511. That is, a reversing device is provided between the plate releasing unit 4 and the peeling processing unit 5 for vertically inverting the component embedded sheet 67 separated from the cooling plate 63 by the plate releasing unit 4, The finished sheet 67 is placed on the placement table 51 in a reversed state. A negative pressure is generated in the air hole 513 of the mounting table 51 to keep the electronic component 60 on the flat surface 511. The sheet stopper 54 is moved to the edge of the guide insertion hole 621 of the frame 62, and the chuck 52 is positioned directly above the guide insertion hole 621 of the frame 62. The component stopper 55 is opened with respect to the sheet stopper 54 and positioned outside the guide insertion hole 621 of the frame 62.

  As shown in (b) of FIG. 18, the guide portion 53 is moved axially upward. The guide portion 53 moves in the guide portion insertion hole 621 of the frame 62 and reaches the end of the protective sheet 61 stuck to the frame 62. The guide portion 53 further advances and projects the end of the protection sheet 61 in the direction away from the frame 62. Thus, the end of the protective sheet 61 starts to be peeled off by the guide portion 53. As the guide portion 53 further advances, the end of the protective sheet 61 is guided toward the chuck 52 while being nipped by the guide portion 53 and the sheet stopper 54. During the guidance of the end of the protective sheet 61 by the guide portion 53, the chuck 52 may also move toward the end of the protective sheet 61, and the end of the protective sheet 61 may be picked up.

  As shown in FIG. 18C, when the end of the protective sheet 61 reaches the chuck 52, the pair of blocks is closed and the chuck 52 grips the end of the protective sheet 61. When the chuck 52 grips the end of the protective sheet 61, as shown in (d) of FIG. 18, after the guide portion 53 is embedded in the guide portion insertion hole 621 of the frame 62, the component stopper 55 is moved to The stopper 55 and the sheet stopper 54 are brought close to a distance less than the length of the electronic component 60.

  As shown in (e) of FIG. 18, while moving the chuck 52 and the sheet stopper 54 along the protective sheet 61, the chuck 52 is pulled up. The end of the protective sheet 61 is gripped by the chuck 52, and the sheet stopper 54 travels on the protective sheet 61. Therefore, the protective sheet 61 is pulled up by the chuck 52 with the sheet stopper 54 as a base point and with the sheet stopper 54 as a base point. The electronic component 60 peels off from the protective sheet 61. When the peeled protective sheet 61 is kept in the vertical state and peeled, for example, the velocity components of the horizontal movement and the vertical movement of the chuck 52 may be kept the same. If both velocity components are the same, peeling can be performed continuously without stopping as long as the moving velocity does not stop as long as it does not stop, but both moving velocities may be maintained at a constant velocity.

  At this time, as shown in FIG. 19, peeling of the electronic component 60 from the protective sheet 61 proceeds, and only the end of the electronic component 60 is sandwiched between the sheet stopper 54 and the flat surface 511 of the mounting table 51. Then, the electronic component 60 tries to lift up so as to lift the peeling start end 60a. However, the component stopper 55 follows the sheet stopper 54. The component stopper 55 holds down the peeling start end 60 a side where the lifting is going to occur. Therefore, lifting up of the electronic component 60 is prevented, the gap 94 between the electrode 602 peeled off from the protective sheet 61 and the protective sheet 61 continues to exist, and the electronic component 60 does not reattach, and the mounting table 51 is flat. It is maintained on surface 511. Furthermore, since the sheet stopper 54 is a roller capable of axial rotation, the sheet stopper 54 is rotated when the electronic component 60 is pressed, and rubbing with the electronic component 60 is suppressed.

  The sheet stopper 54 travels while pressing the non-adhesive surface 611 of the protective sheet 61. Therefore, until the peeling of the electronic component 60 starts and only the end of the electronic component 60 being peeled is sandwiched between the sheet stopper 54 and the flat surface 511 of the mounting table 51, the sheet stopper 54 is also electronic The component 60 is prevented from following the peeled protective sheet 61. However, it is not essential that the sheet stopper 54 travels while pressing the non-adhesive surface 611 of the protective sheet 61 from the viewpoint of exhibiting the function of creating the base point of peeling by the sheet stopper 54. That is, the sheet stopper 54 may be moved at a position slightly away from the protective sheet 61.

  Then, as shown in (f) of FIG. 18, when the chuck 52 and the sheet stopper 54 completely cut the component array area 615 of the protection sheet 61, all the electronic components 60 are peeled off from the protection sheet 61 and the mounting table It aligns on a flat surface 511 of 51. By collecting the electronic component 60, the formation of the electromagnetic wave shielding film 605 in the film forming apparatus 7 is completed. The angle of attack at which the chuck 52 is separated from the mounting table 51 while the chuck 52 longitudinally cuts the flat surface 511 of the mounting table 51 is not limited to 45 degrees. The position of the chuck 52 may be fixed, and the protection sheet 61 may be peeled off by moving the mounting table 51 continuously, or even if both the chuck 52 and the mounting table 51 are movable. Good. That is, the chuck 52 and the mounting table 51 may move relative to each other.

  Here, FIG. 25 is a schematic view showing a configuration of a conventional push-up device. This push-up device is a device for peeling the electronic component 60 from the adhesive film 9 having flexibility and adhesiveness in the same manner as the protective sheet 61, and includes a pin body 8 movable in the axial direction. The adhesive film 9 to which the electronic component 60 is attached is set at the tip of the pin body 8. The pin body 8 pushes up the adhesive film 9 from the surface on the opposite side to the sticking surface of the electronic component 60. The pin body 8 deforms the adhesive film 9 into a mountain shape with the electronic component 60 to be peeled off at the top. Therefore, the adhesion area of the electronic component 60 and the adhesive film 9 is reduced, whereby the electronic component 60 is peeled off from the adhesive film 9.

  FIG. 26 is a schematic view showing how the electronic component 60 is peeled off by the push-up device. As shown in FIG. 26, a plurality of electronic components 60 are attached to the adhesive film 9 with a gap. From the viewpoint of production efficiency, the distance between the electronic components 60 to be attached to the adhesive film 9 is narrow. Therefore, when one electronic component 60 is pushed up, the distortion of the adhesive film 9 also spreads to the sticking area of the next electronic component 60. Then, while the object to be peeled is pushed up, a part of the adjacent electronic component 60 is peeled from the adhesive film 9 to generate a peeled portion 91. However, when the peeling of the object to be peeled is completed, the pin body 8 retracts in the axial direction, so that the bending of the adhesive film 9 is eliminated. Then, the adhesive film 9 reattaches to the peeling portion 91, and the reattachment portion 92 of the adhesive film 9 is generated on the electronic component 60.

  Then, FIG. 27 is a photograph showing the state of the electrode 602 after the adhesive film 9 is re-adhered to the electronic component 60, but as shown in FIG. The residue 93 of the adhesive film 9 may generate | occur | produce. The residue 93 of the adhesive film 9 may burn and carbonize at the time of reflow when mounting the electronic component 60, which may cause connection failure and the like.

  On the other hand, FIG. 20 is a photograph of the electrode 602 taken after the electronic component 60 is peeled off from the protective sheet 61 by the peeling processing unit 5. According to the peeling processing unit 5, the protection sheet 61 is always maintained flat by the sheet stopper 54, and once the protection sheet 61 is peeled off, the protection sheet 61 returns to the electronic component 60 and adheres again. Can be prevented. In addition, the electronic component 60 is fixed in position by the component stopper 55 and the air hole 513 of the mounting table 51, and can be prevented from floating so as to catch up with the protective sheet 61 and to be reattached. As a result, as shown in FIG. 20, no residue of the protective sheet 61 was found on the electrode 602 of the electronic component 60.

  As described above, the peeling processing unit 5 peels the electronic component 60 from the protective sheet 61 after the film formation by the film forming processing unit 3. The peeling processing unit 5 includes the mounting table 51, the chuck 52, and a fixing unit that fixes the position of the electronic component 60. The mounting table 51 supports the electronic component 60 attached to the protective sheet 61. The chuck 52 grips the end of the protective sheet 61, moves relative to the mounting table 51, and peels continuously toward the opposite end of the end. The fixing portion fixes the position of the electronic component 60 when the electronic component 60 is peeled off from the protective sheet 61. As a result, the electronic component 60 and the protective sheet 61 are not separated once after being peeled once, and generation of the residue 93 of the protective sheet 61 on the electronic component 60 can be suppressed.

  The fixing portion is, for example, the flat surface 511 of the mounting table 51 in which the component stopper 55 or the air hole 513 is provided. The component stopper 55 follows the sheet stopper 54 while maintaining a distance less than the length of the electronic component 60, and suppresses the floating of the electronic component 60. The mounting table 51 sucks the electronic component 60 and holds it up. However, as long as the mounting table 51 has a function as a fixing portion, suction by the air hole 513 may not be taken. For example, the mounting table 51 may be an adhesive chuck, an electrostatic chuck, or a mechanical chuck as long as the electronic component 60 can be fixed.

  Further, the guide portion 53 protruding toward the end of the protective sheet 61 is provided. Before gripping the end of the protective sheet 61, the chuck 52 is positioned at the tip of the guide 53. Then, the guide portion 53 is directed to the chuck 52 and guides the end portion of the protective sheet 61 to the guide portion 53. As a result, a trigger for gripping the chuck 52 can be created, and the possibility of a peeling error between the electronic component 60 and the protective sheet 61 can be reduced.

  In addition, the sheet stopper 54 is moved along with the chuck 52 along the protective sheet 61 to make a peeling start point. The sheet stopper 54 is located in the vicinity of the protruding end of the guide portion 53, and the end portion of the protective sheet 61 peeled off by the guide portion 53 is held together with the guide portion 53 and guided to the chuck 52. As a result, the chuck 52 can hold the end of the protective sheet 61 more reliably, and the possibility of peeling between the electronic component 60 and the protective sheet 61 can be reduced.

  Although the sheet stopper 54 has been described by way of example as a cylindrical body having an axis orthogonal to the moving direction of the sheet stopper 54, the sheet stopper 54 may be a plate or a block as long as it can travel while pressing the protective sheet 61. Good. The component stopper 55 has also been described as an example of a cylindrical body having an axis orthogonal to the moving direction of the component stopper 55, but may be a plate, a block or a brush. In the case where the component stopper 55 is a cylindrical body, the component stopper 55 is a roller capable of axial rotation, so it rotates when the electronic component 60 is pressed, and rubbing against the electronic component 60 is suppressed.

  A known mechanism may be adopted as the operation mechanism of the chuck 52, the operation mechanism of the sheet stopper 54, the operation mechanism of the component stopper 55, and the operation mechanism of the guide portion 53, and the present invention is limited to the mechanism mechanism. Absent.

  For example, the chuck 52 can adopt the following operation mechanism. That is, both blocks are supported by the base, and one block is stationary relative to the base. The other block is movable relative to one block. An oval cam abuts on the outside of the movable block. When this cam is rotated and the block reaches the long diameter range, the movable block is pushed by the cam and approaches the immobile block. In addition, a compression spring is provided between the pair of blocks to bias the pair of blocks in a direction to widen the space. When the cam is rotated and the block reaches the short diameter range, the movable block is separated from the immobile block by the biasing force of the compression spring.

  Further, for example, a ball screw and a rail extending at an angle of 45 degrees with respect to the flat surface 511 of the mounting table 51 are disposed, and a base of the chuck 52 is fixed to a slider of the ball screw and holds the rail. . When the screw shaft of the ball screw is axially rotated by the motor, the chuck 52 moves along the rail from one end of the mounting table 51 to the other end.

  Furthermore, with regard to the component stopper 55, a tension spring is interposed between the component stopper 55 and the base that supports the sheet stopper 54, and while urging both rollers closer together, an oval between the bases that support both the rollers 54 and 55 In the state where the cam of the shape of a circle is arranged and the major diameter range of the cam is in contact with the base, the both rollers are biased in the direction to separate the rollers against the biasing force of the tension spring.

  Further, the rear end portion of the guide portion 53 is a cam follower. The cam follower follows the circumferential surface of the oval cam. The cam is pivotally supported by the rotary motor and is rotatable in the circumferential direction. When the rotary motor is driven and the cam rotates, the cam follower climbs the bulging portion of the cam, and the guide portion 53 is pushed up.

  Further, the penetrating positions of the guide portion insertion holes 621 are positions spaced apart at equal intervals with respect to the center of one side of the frame 62. This makes it easy to peel off the entire side of the protective sheet 61. The guide portion 53 is installed corresponding to the guide portion insertion hole 621 and the guide portion 53 is formed in a round bar shape. Then, the chuck 52 and the sheet stopper 54 are longitudinally cut in the direction orthogonal to one side of the frame 62, and the electronic component 60 is peeled off from the protective sheet 61. The peeling process part 5 employ | adopts not only this but the guide part penetration hole and guide part of various shapes, Moreover, the peeling direction can also employ | adopt various directions.

  For example, as shown in FIG. 21, it is possible to adopt a guide portion 53 having a cross section such as a long rounded rectangle, an oval, a rectangle, etc. along one side of the frame 62 at the tip. According to the guide portion 53, the range in which the protective sheet 61 protrudes is wide, so the protective sheet 61 is easily turned and the end of the protective sheet 61 can easily reach the chuck 52. Further, as shown in FIG. 22, in place of the guide portion insertion hole 621, a notch 622 including an arrangement area of the guide portion 53 can be formed in the frame 62. Further, as shown in FIG. 23, the guide insertion hole 621 is disposed at the corner of the frame 62, and the chuck 52 and the sheet stopper 54 are moved diagonally with the corner of the frame 62 as the peeling start point. It may be made to exfoliate along the diagonal of protection sheet 61.

(Other embodiments)
The present invention is not limited to the above embodiment, but also includes the following aspects. That is, as shown in FIG. 24, the film forming apparatus 7 may further include a transfer unit 71 which performs a component mounting process. The transfer unit 71 performs a component mounting process, and transfers the electronic component 60 from the tray on which the electronic component 60 before the film forming process is mounted to the component non-placement sheet 65. For example, the tray and the component non-placement sheet 65 may be arranged side by side, and the transfer unit 71 may be a robot capable of moving the range including the tray and the component non-placement sheet 65 in the vertical and horizontal directions. For example, a vacuum chuck is provided at the end of the robot arm. The transfer unit 71 generates a negative pressure on the tray to hold the electronic component 60, and releases the negative pressure to vacuum break or air opening on the component non-mounting sheet 65, and the electronic component 60 is not mounted on the component. It arranges in the sheet 65.

  Although the film forming apparatus 7 includes the embedding processing unit 1, the plate mounting unit 2, the film forming processing unit 3, the plate releasing unit 4, and the peeling processing unit 5, these units are configured as independent devices, It may be systematized. That is, the embedding processing unit 1 may be an independent embedding processing apparatus, the plate mounting unit 2 may be an independent plate mounting apparatus, and the film forming processing unit 3 is an independent film forming processing apparatus. The plate releasing unit 4 may be an independent plate releasing device, and the peeling processing unit 5 may be an independent peeling processing device.

  In the above embodiment, the height H1 from the surface of the component array region 615 to the upper end face of the frame 62 is higher than the height H2 from the surface of the component array region 615 to the top surface of the electronic component 60. However, the present invention is not limited to this, and may be lower than the height H2. In this case, a region facing the component array region 615 in the flat surfaces 112, 212, 412 of the ceiling portions 11, 21, 41 is formed in a recess recessed by an amount that allows the difference between the height H1 and the height H2. The sealed spaces 14, 24a, 45 may be formed.

  As mentioned above, although the modification of an embodiment and each part of the present invention was explained, the modification of this embodiment or each part is shown as an example, and limiting the scope of an invention is not intended. These novel embodiments described above can be implemented in other various forms, and various omissions, substitutions, and modifications can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and the gist of the invention, and are included in the invention described in the claims.

DESCRIPTION OF SYMBOLS 1 embedding processing part 11 ceiling part 111 internal space 112 flat surface 113 air hole 114 air pressure supply hole 115 O ring 12 mounting base 121 internal space 122 flat surface 123 air hole 124 air pressure supply hole 125 pusher insertion hole 13 pusher 14 sealed space 2 Plate mounting portion 21 Ceiling portion 211 Internal space 212 Flat surface 213 Air hole 214 Air pressure supply hole 215 O ring 22 Mounting base 221 Opening 222 Edge 223 Air pressure supply hole 224 Pusher insertion hole 23 Pusher 24a Sealed space 24b Sealed space 3 Film forming process Unit 31 chamber 311 processing position 312 film forming position 32 load lock chamber 33 dividing unit 34 rotating table 35 surface processing unit 36 sputtering source 361 target 4 plate releasing unit 41 ceiling unit 411 internal space 412 flat surface 413 air hole 414 air pressure Supply hole 415 O-ring 42 Mounting table 421 Opening 422 Edge 423 Air pressure supply hole 424 Pusher insertion hole 43 Pusher 44 Holding block 45 Sealed space 5 Peeling processing unit 51 Mounting table 511 Flat surface 512 Internal space 513 Air hole 514 Air pressure supply hole 52 Chuck 53 Guide 54 Sheet retaining roller 55 Component retaining roller 60 Electronic component 60a Peeling start end 601 Electrode exposed surface 602 Electrode 603 Top surface 604 Side surface 605 Electromagnetic wave shield film 61 Protective sheet 611 Adhesive surface 612 Non adhesive surface 613 Outer frame area 614 Frame area 615 Parts array area 62 Frame 621 Guide part insertion hole 622 Notch 63 Cooling plate 631 Pusher insertion hole 632 Air hole 64 Adhesive sheet 65 Parts unplaced sheet 66 Part mounted sheet 67 Part embedded sheet 68 Part mounted plate 7 film deposition apparatus 71 transfer unit 73 transfer unit 74 control unit 75 pneumatic circuit

Claims (6)

A film forming apparatus for an electronic component in which an exposed electrode surface on which an electrode is formed is attached to an adhesive surface of a protective sheet,
An embedding processing unit for embedding an electrode of the electronic component on the adhesive surface of the protective sheet;
A deposition processing unit configured to deposit a deposition material on the electronic component in which the electrode is embedded in the protective sheet;
Equipped with
The embedding processing unit
A flat surface opposite to the protective sheet sandwiching the electronic component and facing the electronic component;
At least a pressure reducing section for reducing the pressure of the space between the protective sheet and the flat surface;
A pressure adjustment unit configured to adjust the pressure of the space opposite to the flat surface with the protective sheet interposed therebetween;
Have
The pressure adjustment unit is a pressure of the space on the opposite side of the space between the protective sheet and the flat surface in a state where the pressure reduction is maintained after the pressure reduction of the space by the pressure reduction unit. Of the electronic component and the protective sheet, with the flat surface as a stop.
A film forming apparatus characterized by The embedding processing unit
A mounting surface located opposite to the flat surface across the protective sheet;
A mounting surface-side air hole which opens in the mounting surface and generates a negative pressure prior to the pressure reduction by the pressure reducing portion to separate the protective sheet from the flat surface;
To have
The film-forming apparatus of Claim 1 characterized by the above-mentioned. The pressure adjustment unit includes the mounting surface side air hole,
The mounting surface side air hole is a state where the pressure reduction is maintained after the pressure reduction of the space by the pressure reducing portion, the generation of a positive pressure is shifted to the generation of a positive pressure, and the electronic component is stopped by the flat surface. Pressing the protective sheet,
The film-forming apparatus of Claim 2 characterized by the above-mentioned. The embedding processing unit
A flat that opens as the depressurizing unit or separately from the depressurizing unit and generates negative pressure to suck the electronic component to the planar surface and attracts the protective sheet to the planar surface. Having face side air holes,
The film-forming apparatus in any one of the Claims 1 thru | or 3 characterized by these. A film forming apparatus for an electronic component in which an exposed electrode surface on which an electrode is formed is attached to an adhesive surface of a protective sheet,
An embedding processing unit for embedding an electrode of the electronic component on the adhesive surface of the protective sheet;
A plate mounting portion for sticking the protective sheet to the cooling plate having air holes penetrating through the front and back in a range including an area in which the electronic components are arranged;
A film forming unit for forming a film forming material on the electronic component of the protective sheet attached to the cooling plate;
A plate releasing unit that releases the adhesion between the cooling plate and the protective sheet after passing through the film forming unit;
A peeling processing unit for peeling the electronic component from the protective sheet released from the close contact with the cooling plate;
Equipped with
The embedding processing unit
A flat surface opposite to the protective sheet sandwiching the electronic component and facing the electronic component;
A first depressurizing unit for depressurizing a space between at least the protective sheet and the flat surface;
A pressure adjustment unit configured to adjust the pressure of the space opposite to the flat surface with the protective sheet interposed therebetween;
Have
The pressure adjusting unit sandwiches the protective sheet more than a space between the protective sheet and the flat surface in a state in which the pressure is maintained after the depressurization of the space by the first depressurizing unit is maintained. The pressure in the space opposite to the flat surface is made relatively large, and the flat surface is used as a pawl to press the electronic component and the protective sheet together.
The plate mounting portion is
It has a second decompression unit that decompresses the space between the area where the electronic component is arranged in the protective sheet and the cooling plate,
After the pressure reduction by the second pressure reduction section, the protection sheet and the cooling plate are pressed against each other,
The plate releasing unit is
A positive pressure generating hole for generating a positive pressure in the air hole of the cooling plate;
While pressing the area where the electronic component is arranged in the protective sheet through the positive pressure generation hole, a portion of the protective sheet which is out of the area where the electronic component is arranged is held down, And a fixing portion for releasing the pressing after the area where the electronic component is arranged is separated from the cooling plate.
The peeling processing unit
A placement unit for supporting the electronic component attached to the protective sheet;
A chuck which grips an end of the protective sheet, moves relative to the placing portion, and peels continuously toward the opposite end of the end;
A fixing portion for fixing the position of the electronic component when the electronic component is peeled off from the protective sheet;
A film forming apparatus characterized by An embedding processing apparatus for embedding an electrode of the electronic component on the adhesive surface of the protective sheet with respect to the electronic component to which the electrode exposed surface on which the adhesive surface of the protective sheet is formed is attached,
A flat surface opposite to the protective sheet sandwiching the electronic component and facing the electronic component;
At least a pressure reducing section for reducing the pressure of the space between the protective sheet and the flat surface;
A pressure adjustment unit configured to adjust the pressure of the space opposite to the flat surface with the protective sheet interposed therebetween;
Have
The pressure adjustment unit is a pressure of the space on the opposite side of the space between the protective sheet and the flat surface in a state where the pressure reduction is maintained after the pressure reduction of the space by the pressure reduction unit. Of the electronic component and the protective sheet, with the flat surface as a stop.
An embedded processing apparatus characterized by