CN109778124A - Film formation device and embedment processing unit - Google Patents

Film formation device and embedment processing unit Download PDF

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Publication number
CN109778124A
CN109778124A CN201811344888.5A CN201811344888A CN109778124A CN 109778124 A CN109778124 A CN 109778124A CN 201811344888 A CN201811344888 A CN 201811344888A CN 109778124 A CN109778124 A CN 109778124A
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CN
China
Prior art keywords
screening glass
electronic component
flat surface
coldplate
pressure
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CN201811344888.5A
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Chinese (zh)
Inventor
西垣寿
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Publication of CN109778124A publication Critical patent/CN109778124A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The present invention, which provides a kind of film formation device and embedment processing unit, bubble, to be entered, and electronic component and screening glass can be made to touch well to carry out film process.In film formation device, stands electrode on the bonding plane of screening glass and load electronic component.In this film formation device, including embedment processing unit and film process portion.Being embedded to processing unit will be in the bonding plane of the electrode embedment screening glass of electronic component.Film process portion has been embedded in the electronic component in screening glass for electrode, is formed a film and sputtering to accumulate filmogen.The relief portion that this embedment processing unit at least includes the confined space in the arrangements of components region in enclosed electronic component and screening glass and depressurized to confined space.Moreover, embedment processing unit presses electronic component mutually with screening glass after the decompression using relief portion.

Description

Film formation device and embedment processing unit
Technical field
The present invention relates to a kind of in the film formation device to form a film on electronic component on the protection sheet and the general of being stuck Electronic component is embedded to the embedment processing unit in the bonding plane of screening glass.
Background technique
In the wireless communication machine using cell phone as representative, there are many electronic components such as semiconductor device for carrying.Electricity Sub- part is transported to pass through various processing from processing unit towards processing unit.As the typical example of processing, electricity can be enumerated The formation of magnetic wave screened film.In order to prevent for the influence of communication characteristic, electromagnetic shielding film inhibits electromagnetic wave letting out towards the outside The electromagnetic waves such as leakage are for inside and outside influence.In general, electronic component is formed by sealing resin to form shape, in order to cover electromagnetism Wave, in the top surface of this sealing resin and the electromagnetic shielding film (referring to patent document 1) of side setting electric conductivity.
Forming method as electromagnetic shielding film, it is known to galvanoplastic.But galvanoplastic need pre-treatment step, electricity Plating step and the wet types step such as post-processing step as washing, therefore not can avoid the manufacturing cost of electronic component Rising.Therefore, it is just attracting attention as the sputtering method of dry type step.In sputtering method, introduce inert gas into configured with target Vacuum tank in, and apply DC voltage.Then, the ion collision filmogen of plasmarized inert gas Target, and make by from the build-up of particles got in target on electronic component.This stack layer becomes electromagnetic shielding film.
Realize that the film formation device of sputtering method includes: the internal columned chamber for becoming vacuum chamber, is housed in chamber And with the rotary shaft coaxial with this chamber turntable and in chamber it is divided at film location.Electronic component is loaded On a spinstand, it and rotates turntable circumferentially, reaches electronic component at film location, and make electromagnetism Wave screened film film forming.In this way, there is also the rotation of electronic component conveyings in processing unit.
In the conveying of such outer electronic component in the device, there are electronic components due tos acceleration and deceleration or rotation etc. by Inertia force generates the reverse of electronic component or from the worry to fall off on film location.Therefore, electronic component is secured at viscous On film, transported and the film forming of electromagnetic shielding film.Electronic component can be kept by resisting the adhesion strength of inertia force On in place.
In addition, adhesive film not only promotes the obstruction of electronic component, but also electromagnetic shielding film is prevented in film process Particle attachment on the electrode, maintain interelectrode insulation.The electrode of electronic component is usually known as soldered ball convex block person, passes through The spherical solder (soldered ball) that diameter is tens μm~several hundred μm is bonded on the pad electrode of electronic component and is formed.That is, For the electrode of the adhesive film embedded electronic component with flexibility, and the electrode exposed surface for exposing electrode is closely contacted on adhesion On film.Electrode and electrode exposed surface are coated by adhesive film as a result, therefore the particle of electromagnetic shielding film cannot be introduced into electrode exposing Between face and adhesive film, without reaching in electrode.
[existing technical literature]
[patent document]
Patent document 1: No. 2013/035819 bulletin of International Publication No.
Patent document 2: Japanese Patent Laid-Open 6-97268 bulletin
Summary of the invention
[problem to be solved by the invention]
When electronic component to be pasted on adhesive film, there are bubbles to enter the load between electrode exposed surface and adhesive film Sorrow.The entrance of bubble will lead to electronic component and the adhesion of adhesive film declines.Then, in a worst case scenario, when filling When transporting electronic component when transporting electronic component between setting or in film formation device, the electronic component of the inertia force that never can resist is from viscous Remove on film, the gap for leading to electrode is generated between electrode exposed surface and adhesive film.In film process, electromagnetic wave shielding The particle of film enters from the gap, and adheres on the electrode.If side of the particle of electromagnetic shielding film to build bridge between electrode Formula attachment, then be unable to maintain that interelectrode insulating properties.
In addition, as the technology for pasting adhesive film, it is known to utilize the component of the strips such as brush of the roller or column-shaped of strip Adhesive film is pressed to carry out stickup person (referring to patent document 2).However, it is very difficult to using the component of such strip to multiple electronics zero All electrodes of the multiple electrodes of part and electronic component equably press adhesive film.Therefore, on pressing insufficient position, Gap is generated between electrode exposed surface and adhesive film, the entrance of bubble can not be prevented.
The present invention is proposed to solve project as described, its purpose is to provide a kind of film formation device and is buried Enter processing unit, can prevent bubble enter be implemented to the electronic component of film process and paste it screening glass between, and make electricity Sub- part touches well with screening glass.
[technical means to solve problem]
In order to reach the purpose, the present invention is a kind of to be secured at protection for the electrode exposed surface for being formed with electrode The film formation device of electronic component on the bonding plane of piece, comprising: processing unit is embedded to, described in the electrode embedment by the electronic component In the bonding plane of screening glass；And film process portion, the electronics zero being embedded in for the electrode in the screening glass Part makes filmogen form a film；The embedment processing unit includes flat surface, is located at across the electronic component and the screening glass Opposite side, and it is opposite with the electronic component；Relief portion at least carries out the space between the screening glass and the flat surface Decompression；And pressure adjustment unit, it is adjusted to across the screening glass and the pressure in the space of the flat surface opposite side；Its In, the pressure adjustment unit is behind the decompression using the space of the relief portion, and the state that the decompression is maintained Under, make the pressure in the space of the opposite side relatively than the pressure in the space between the screening glass and the flat surface Greatly, and using the flat surface press the electronic component mutually with the screening glass.
Also it can be set to the embedment processing unit and include mounting surface, be located at across the screening glass and the flat surface phase It tosses about；And
Surface side airport is loaded, in the mounting surface upper opening, and generates and bears before the decompression using the relief portion Pressure, separate the screening glass from the flat surface.
Also can be set to the pressure adjustment unit includes mounting surface side airport, and mounting surface side airport is in benefit After decompression with the space of the relief portion, and it is described decompression obtain maintenance in the state of, be transformed into generation positive pressure, thus The power for pressing the screening glass is assigned to the electronic component stopped by the flat surface.
Also it can be set to the embedment processing unit with flat surface side airport, described in the flat surface side airport is used as Relief portion, or the relief portion is different from the flat surface upper opening, adsorb negative pressure generation by the electronic component Attract the screening glass on the flat surface, and towards the flat surface.
In addition, in order to reach the purpose, the present invention is a kind of to be stuck for the electrode exposed surface for being formed with electrode The film formation device of electronic component on the bonding plane of screening glass, comprising: embedment processing unit buries the electrode of the electronic component In the bonding plane for entering the screening glass；The screening glass is pasted on coldplate by plate mounting portion, and the coldplate is including row Arrange the airport provided in the range of the region of the electronic component through table back；Film process portion, for being secured at The electronic component of the screening glass on the coldplate, makes filmogen form a film；Plate releasing portion is passing through the film forming After processing unit, the contiguity of the coldplate Yu the screening glass is released；And lift-off processing portion, from the contiguity with the coldplate The electronic component is peeled on the screening glass being released from；The embedment processing unit includes flat surface, is located at across described Electronic component and the screening glass opposite side, and it is opposite with the electronic component；First relief portion, at least to the screening glass with It is depressurized in space between the flat surface；And pressure adjustment unit, to opposite with the flat surface across the screening glass The pressure in the space of side is adjusted；Wherein, the pressure adjustment unit is in the space using first relief portion After decompression, and in the state that the decompression obtains maintenance, make across the space of the screening glass and the flat surface opposite side Pressure of the pressure relatively than the space between the screening glass and the flat surface is big, and using the flat surface as brake Press the electronic component mutually with the screening glass；The plate mounting portion is included to the arrangement institute in the screening glass The second relief portion that the space between the region of electronic component and the coldplate is depressurized is stated, and is subtracted using described second After the decompression of splenium, press the screening glass mutually with the coldplate；The plate releasing portion includes positive pressure and generates hole, makes Positive pressure is generated in the airport of the coldplate；And fixed part, hole is being generated in the screening glass by the positive pressure Arrange the electronic component region pressurizeed in a period of, first press in the screening glass from arranging the electronic component Region in the position that is detached from pressed described in releasing after the region for arranging the electronic component is left from the coldplate Pressure；The lift-off processing portion includes mounting portion, supports the electronic component being secured on the screening glass；Collet is held The end for holding the screening glass is relatively moved relative to the mounting portion, and is carried out continuously stripping towards the opposite end of the end From；And fixed part, when the electronic component is removed from the screening glass, the position of the fixed electronic component.
In addition, in order to reach the purpose, the present invention is a kind of to be stuck for the electrode exposed surface for being formed with electrode The electrode of the electronic component is embedded to burying in the bonding plane of the screening glass by the electronic component on the bonding plane of screening glass Enter processing unit, comprising: flat surface, be located at across the electronic component and the screening glass opposite side, and with the electronics zero Part is opposite；Relief portion at least depressurizes the space between the screening glass and the flat surface；And pressure adjustment unit, It is adjusted to across the screening glass and the pressure in the space of the flat surface opposite side；Wherein, the pressure adjustment unit exists After decompression using the space of the relief portion, and it is described decompression obtain maintenance in the state of, make the sky of the opposite side Between pressure of the pressure relatively than the space between the screening glass and the flat surface it is big, and the flat surface is made Press the electronic component mutually with the screening glass for brake.
[The effect of invention]
According to the present invention, bubble, which is difficult to enter, is implemented between the electronic component of film process and screening glass, electronic component Become good with the adhesion of screening glass.
Detailed description of the invention
Fig. 1 is the side view for indicating the electronic component through film process.
Fig. 2 is the side view for indicating the state of the electronic component by film process.
Fig. 3 is the exploded perspective view of the state of electronic component when indicating by film process.
Fig. 4 is the transition figure for indicating the film-forming process process of electronic component.
Fig. 5 is the block diagram for indicating the structure of film formation device.
Fig. 6 is the schematic diagram for indicating the structure of embedment processing unit.
(a) to (g) in Fig. 7 is the transition figure for schematically showing the state of embedment processing unit in each step.
Fig. 8 is the enlarged drawing between the electronic component being embedded in processing unit.
Fig. 9 is the schematic diagram of the structure of display plate mounting portion.
(a) to (e) in Figure 10 is the transition figure for schematically showing the state of plate mounting portion in each step.
Figure 11 A and Figure 11 B are the schematic diagrames for indicating the structure in film process portion.
Figure 12 is the schematic diagram of the structure of display plate releasing portion.
(a) to (e) in Figure 13 is the transition figure for schematically showing the state of plate releasing portion in each step.
Figure 14 is the schematic diagram of another structure of display plate releasing portion.
Figure 15 is the schematic diagram of display plate releasing portion and then another structure.
Figure 16 is the schematic diagram for indicating the structure in lift-off processing portion.
Figure 17 is the figure for the upper surface that the part for indicating in lift-off processing portion has been embedded to piece.
(a) to (f) in Figure 18 is the transition figure for schematically showing the state of lift-off processing portion in each step.
Figure 19 is the schematic diagram for indicating to prevent the form of the floating of electronic component.
Figure 20 be electrode photograph after removing electronic component from screening glass by lift-off processing portion it is resulting Photo.
Figure 21 is to indicate that in lift-off processing portion part has been embedded to the top view of another form of piece.
Figure 22 is to indicate that in lift-off processing portion part has been embedded to the top view of piece and then another form.
Figure 23 is to indicate that in lift-off processing portion part has been embedded to the top view of piece and then another form.
Figure 24 is the block diagram for indicating another structure of film formation device.
Figure 25 is the schematic diagram for indicating the structure of existing upper ejection device.
Figure 26 is the schematic diagram for indicating the upper top of electronic component in existing upper ejection device.
Figure 27 is the photo for indicating the appearance of the electrode after adhesive film is attached on electronic component again.
[explanation of symbol]
1: embedment processing unit
11: top
111: inner space
112: flat surface
113: airport
114: air pressure supply hole
115:O type circle
12: mounting table
121: inner space
122: flat surface
123: airport
124: air pressure supply hole
125: push rod insertion hole
13: push rod
14: confined space
2: plate mounting portion
21: top
211: inner space
212: flat surface
213: airport
214: air pressure supply hole
215:O type circle
22: mounting table
221: opening
222: edge
223: air pressure supply hole
224: push rod insertion hole
23: push rod
24a: confined space
24b: confined space
3: film process portion
31: chamber
311: processing position
312: at film location
32: sampling room
33: lattice
34: turntable
35: surface treating part
36: sputtering source
361: target
4: plate releasing portion
41: top
411: inner space
412: flat surface
413: airport
414: air pressure supply hole
415:O type circle
42: mounting table
421: opening
422: edge
423: air pressure supply hole
424: push rod insertion hole
43: push rod
44: grip block
45: confined space
5: lift-off processing portion
51: mounting table
511: flat surface
512: inner space
513: airport
514: air pressure supply hole
52: collet
53: guide portion
54: sheet material retainer 55: part retainer 60: electronic component
60a: removing starting end
601: electrode exposed surface
602: electrode
603: top surface
604: side
605: electromagnetic shielding film
61: screening glass
611: bonding plane
612: non-adhesive face
613: outer frame region
614: middle frame region
615: arrangements of components region
62: frame
621: guide portion insertion hole
622: notch
63: coldplate
631: push rod insertion hole
632: airport
64: adhesive sheet
65: part does not load piece
66: part has loaded piece
67: part has been embedded to piece
68: part board mounting
7: film formation device
71: transfer portion
73: conveying unit
74: control unit
75: pneumatic circuit
8: shank
9: adhesive film
91: removing position
92: attachment area again
93: residue
94: gap
H2: height
H1: height (thickness)
Specific embodiment
(electronic component)
Fig. 1 is the side view for indicating the electronic component through film process.As shown in Figure 1, on the surface of electronic component 60 Form electromagnetic shielding film 605.Electronic component 60 is semiconductor chip, diode, transistor, capacitor or surface acoustic wave The surface encapsulations parts such as (Surface Acoustic Wave, SAW) filter.Semiconductor chip is by multiple electronic component collection At integrated circuit made of change (Integrated Circuit, IC) or large scale integrated circuit (Large Scale Integrated circuit, LSI) etc. integrated circuits.This electronic component have ball grid array (Ball Grid Array, BGA), land grid array (Land Grid Array, LGA), small outline packages (Small Outline Package, SOP), Flat-four-side encapsulates the big of (Quad Flat Package, QFP), wafer-class encapsulation (Wafer Level Package, WLP) etc. Rectangular shape is caused, becomes electrode exposed surface 601 on one side.Electrode exposed surface 601 is that electrode 602 exposes, opposite with package substrate Come the face connecting with package substrate.Electrode 602 is known as the electrode of spherical protrusions or soldered ball convex block, is to be formed as diameter Tens μm~several hundred μm of spherical solder (soldered ball) is mounted on pad electrode and is formed.
605 electromagnetic wave shielding of electromagnetic shielding film.Electromagnetic shielding film 605 is such as Al, Ag, Ti, Nb, Pd, Pt, Zr Material is formed.Electromagnetic shielding film 605 can also be formed by magnetic materials such as Ni, Fe, Cr, Co.Alternatively, it is also possible to be formed The film of SUS, Ni, Ti, V, Ta etc. as electromagnetic shielding film 605 basal layer, alternatively, it is also possible to form the film of SUS, Au etc. As the protective layer of most surface.
Electromagnetic shielding film 605 is formed in the top surface 603 and side 604 of electronic component 60, i.e., other than electrode exposed surface 601 Outer surface on.Top surface 603 is the face opposite with electrode exposed surface 601.Side 604 is by top surface 603 and electrode exposed surface 601 Connection, with the angle extended outer peripheral surface different from top surface 603 and electrode exposed surface 601.In order to obtain the screen for blocking electromagnetic wave Effect is covered, as long as electromagnetic shielding film 605 is at least formed on top surface 603.There are the grounding leads outside figure on side 604 Foot (ground pin).For side electromagnetic shielding film 605 formation also for electromagnetic shielding film 605 ground connection.
(when film process)
Fig. 2 is the side view of the state of the electronic component after indicating by film process.In addition, Fig. 3 be indicate by The exploded perspective view of the state of electronic component when film process.As shown in Figures 2 and 3, the electrode 602 of electronic component 60 quilt in advance It is embedded in screening glass 61, in addition, electrode exposed surface 601 is closely contacted on screening glass 61.By towards the electrode 602 in screening glass 61 It is embedded, and the particle of electromagnetic shielding film 605 is prevented to reach in electrode 602.In addition, passing through electrode exposed surface 601 and protection The contiguity of piece 61, the leeway that the particle of electromagnetic shielding film 605 enters between electrode exposed surface 601 and screening glass 61 are also lost, And the particle of electromagnetic shielding film 605 is made to reach decline a possibility that in electrode 602.
Screening glass 61 is polyethylene naphthalate (Polyethylene naphthalate, PEN), polyimides (Polyimide, PI) etc. has the synthetic resin of heat resistance.The one side of screening glass 61 becomes the softness fallen into electrode 602 The bonding plane (adhesion coating) 611 for the adherence that property and electrode exposed surface 601 are touched.As bonding plane 611, silicon can be used Ketone system, acrylic acid series resin and carbamate resins, epoxy resin etc. have cementability a variety of materials.
Bonding plane 611 be divided into outer frame region 613 until inwards reaching predetermined distance from the end of screening glass 61, Middle frame region 614,614 inside of Ji Bizhong frame region until inwards reaching predetermined distance from the inner circumferential of outer frame region 613 Arrangements of components region 615.Electronic component 60 is secured in arrangements of components region 615.Frame-shaped is pasted in outer frame region 613 Frame 62.Middle frame region 614 is to generate the range of the warpage of screening glass 61, neither pastes frame 62 nor pastes electronic component 60.In addition, the opposing face of bonding plane 611 is non-adhesive face 612.
Screening glass 61 is adhered on coldplate 63 via adhesive sheet 64.Coldplate 63 by the metals such as SUS, ceramics, resin, Or the high material of other thermal conductivity is formed.This coldplate 63 is to release the heat of electronic component, inhibits the heat dissipation of excessive accumulation of heat Channel.The two sides of adhesive sheet 64 has adherence, improves the adhesion of screening glass 61 and coldplate 63, and ensures towards coldplate 63 In heat transfer area.
Height H1 ratio until from the surface in arrangements of components region 615 to the upper surface of frame 62 is from arrangements of components region Height H2 high until 615 surface to the top surface of electronic component 60 603 (referring to Fig. 4).In addition, there is also for convenience and incite somebody to action Height H1 renames as the case where thickness H1, but meaning is identical.In short, if being set as plate being placed on person on frame 62, electronics The top surface 603 of part 60 does not reach this plate.
Guide portion insertion hole 621 has been provided in the one end of frame 62.Guide portion insertion hole 621 along frame 62 end Opening with long ellipse, rectangle, circle etc., the face being pasted on screening glass 61 and its opposite exposing through frame 62 Face and provide.If that is, for example rod member is inserted into guide portion insertion hole 621, and pressing the end of screening glass 61 (referring to figure (a) to (f) in 18), then the one end of screening glass 61 is removed from frame 62.
Push rod (pusher) insertion hole 631 is formed on coldplate 63 and adhesive sheet 64.Push rod insertion hole 631 and guidance Portion's insertion hole 621 is inconsistent, provides on the position blocked by frame 62.Multiple push rod insertion holes 631 are provided as follows: If will be in such as rod member insertion push rod insertion hole 631, and by the front end of rod member come upward push framework 62, then frame 62 entirety rise in parallel.For example, if frame 62 be shape be rectangle framework, push rod insertion hole 631 be located at quadrangle or into And it is located at each side center.For maintaining the parallel viewpoint of frame 62, preferably rod member has rectangular-shaped front end Face, i.e. preferably thin plate or section L shape etc., but not limited to this, it is possible to have the front end face of round. Push rod insertion hole 631 correspondingly has rectangular-shaped, L-shaped or round.
In turn, on coldplate 63 and adhesive sheet 64, in middle frame region 614 and the arrangements of components region for pasting screening glass 61 Fine airport 632 there are many being formed to the whole region equal intervals of 615 range.This airport 632 is for example, small Cylindrical shape or slit-shaped.In order to pass through airport 632 equably at least the zero of the screening glass 61 being pasted on coldplate 63 Part arranges region 615 and assigns negative pressure or positive pressure, and is provided with this airport 632.The quantity of this airport 632 or provide interval and Providing range, it's not limited to that, can also be with for example, it is also possible to be provided only in the range corresponding with arrangements of components region 615 Airport 632 is densely configured at the center of coldplate 63 and adhesive sheet 64, on the other hand, is sparsely configured on the outside, in addition, One can also be only arranged on position corresponding with the center in arrangements of components region 615.
(film-forming process process)
In film-forming process, step, plate installation steps, film formation step, plate removal are embedded to by part mounting step, part Step and part strip step, and obtain and be formed with electromagnetic shielding film 605 and the separated electronic component 60 at monolithic.
Fig. 4 is the figure for indicating the film-forming process process of electronic component.As shown in figure 4, making electricity in part mounting step The part that the electrode exposed surface 601 and frame 62 of sub- part 60 have been adhered on screening glass 61 does not load the opposite state of piece 65 Under, electronic component 60 is arranged in arrangements of components region 615.It will be pasted with frame 62 on screening glass 61, and then be arranged with Electronic component 60, but electrode 602 is not yet known as part by inbuilt state and has loaded piece 66.
In part embedment step, piece 66 is loaded for part, electrode 602 has been embedded in screening glass 61, and make electrode Exposed surface 601 is closely contacted on screening glass 61.No matter formation and not formed electromagnetic shielding film 605 are buried electrode 602 State in screening glass 61 is known as part and has been embedded to piece 67.In plate installation steps, part is made to be embedded to piece 67 via adhesion Piece 64 and be closely contacted on coldplate 63.The state for being equipped with this coldplate 63 is known as part board mounting 68.
In film formation step, accumulate the particle of electromagnetic shielding film 605 from 603 side of the top surface of electronic component 60, And electromagnetic shielding film 605 is formed on electronic component 60.At this point, the electrode 602 of electronic component 60 is buried in screening glass 61, In addition, electrode exposed surface 601 is closely contacted on screening glass 61, and the particle of electromagnetic shielding film 605 is prevented to be attached to electrode 602 On.
It is released in step in plate, unloads coldplate 63, and revert to the form that part has been embedded to piece 67.Then, in part In strip step, electronic component 60 is peeled from screening glass 61, and is separated into part and is not loaded piece 65 and each electronic component 60. In addition, screening glass 61 is peeled from frame 62, in case frame 62 reuses.Terminate film process in the above manner.
(film formation device)
Part embedment step in film-forming process process more than undertaking, plate installation steps, film formation step, plate release step Rapid and part strip step film formation device is shown in Figure 5.As shown in figure 5, film formation device 7 includes: embedment processing unit 1, plate peace Dress portion 2, film process portion 3, plate releasing portion 4 and lift-off processing portion 5.It is connected between each portion by conveying unit 73, puts into each step In required component, and be discharged complete in each step processing component.Conveying unit 73 is, for example, conveyer, is also possible to Pass through the transport table movable along rectilinear orbit such as ball screw.
In addition, containing the control unit 74 of computer or microcomputer etc. in film formation device 7, there is central processing unit (Central Processing Unit, CPU), read-only memory (Read Only Memory, ROM), random access memory (Random Access Memory, RAM) and signal sending circuit, to control embedment processing unit 1, plate mounting portion 2, at film forming The action moment (timing) of each composition element included by reason portion 3, plate releasing portion 4 and lift-off processing portion 5.In turn, it contains Pneumatic circuit 75 supplies positive pressure to embedment processing unit 1, plate mounting portion 2, film process portion 3, plate releasing portion 4 and lift-off processing portion 5 Or negative pressure.Control unit 74 also controls the solenoid valve in pneumatic circuit 75, and just to generation negative pressure, releasing negative pressure, generation Pressure and releasing positive pressure switch over.
(embedment processing unit)
The embedment processing unit 1 for undertaking part embedment step is illustrated.Fig. 6 is the structure for indicating embedment processing unit 1 Schematic diagram.Part has been loaded in the investment embedment processing unit 1 of piece 66.Being embedded to processing unit 1 will when stopping electronic component 60 Screening glass 61 is attracted on electronic component 60, in addition, by the pressing of screening glass 61 on electronic component 60.It is embedded to processing unit 1 as a result, It falls into the electrode 602 of electronic component 60 in screening glass 61, and then is closely contacted on electrode exposed surface 601 on screening glass 61.
As shown in fig. 6, this embedment processing unit 1 includes top 11 and mounting table 12.Top 11 is to have together with mounting table 12 There is the block of inner space 111, inner space 121.Top 11 and mounting table 12 configure in opposite directions, have in opposite sides and are parallel to each other Flat surface 112, flat surface 122.The size and shape of two flat surfaces (112,122) and part have loaded that piece 66 is identical or ratio It is wide that part has loaded piece 66.The position of mounting table 12 is motionless.On the other hand, top 11 is relative to 12 liftable of mounting table.Top Until 11 have loaded the distance of the thickness H1 of the frame 62 of piece 66 at least close to mounting table 12 to part.
Part is placed in this mounting table 12 has loaded piece 66.The flat surface 122 of mounting table 12 becomes part and has loaded piece 66 mounting surface.This flat surface 122 includes the anti-slip component with adhesion strength.In addition, being passed through on the flat surface 122 of mounting table 12 Equipped with many airports 123 for leading to inner space 121.The range that provides of airport 123 is that size and shape have been carried with part It sets the identical range in inside of the frame 62 of piece 66 or at least size and shape is identical as arrangements of components region 615.When by zero Part has loaded piece 66 when being placed in mounting table 12, and the position that provides of airport 123 is opposite with the region of the inside of frame 62 Position or the position opposite with arrangements of components region 615.This airport 123 is functioned as mounting surface side airport.
In the inner space of mounting table 12 121, on the position different from flat surface 122 and then air pressure supply has been provided Hole 124.The pneumatic circuit 75 comprising compressor, negative pressure feeding pipe, positive pressure supply pipe etc. outside air pressure supply hole 124 and figure connects It connects.Therefore, by air pressure supply hole 124 and inner space 121, and positive pressure or negative pressure are selectively generated in airport 123. Airport 123, air pressure supply hole 124 and pneumatic circuit 75 are functioned as pressure adjustment unit.
In turn, on the flat surface 122 of mounting table 12, the push rod insertion hole 125 through mounting table 12 is open.Push rod insert The providing outside range of airport 123 is arranged in hole 125.Specifically, when part, which has loaded piece 66, to be placed, push rod insert The position that provides in hole 125 is the guide portion insertion hole 621 for avoiding frame 62, and the position blocked by frame 62.Push rod 13 is inserted In this push rod insertion hole 125.Push rod 13 can haunt from the flat surface 122 of mounting table 12.This push rod 13 from push rod that ought insert When through-hole 125 is prominent, so that part has been loaded piece 66 and separated from mounting table 12, and can lift in parallel, the degree that supports it is rigid Property, quantity and configuration space are arranged.If such as the shape of frame 62 is rectangle, corresponds to each angle of frame 62 and configures stick Body.
Then, many airports 113 towards inner space 111 are also provided on the flat surface 112 at top 11.Air To be size and shape loaded the identical range in the inside of frame 62 of piece 66 or at least big with part to the range that provides in hole 113 Small and shape is identical as arrangements of components region 615, and whole throughout arrangements of components region 615.Part piece 66 has been loaded into when When being placed in mounting table 12, the position that provides of airport 113 is the position opposite with the region of the inside of frame 62 or with zero Part arranges the opposite position in region 615.This airport 113 is functioned as flat surface side airport.
In the inner space 111 at top 11, air pressure supply hole 114 has been provided on the position different from flat surface 112. Air pressure supply hole 114 is connect with the pneumatic circuit 75 comprising compressor, negative pressure feeding pipe etc. outside figure.Therefore, it is supplied by air pressure To hole 114 and inner space 111, and negative pressure is generated in airport 113.Airport 113, air pressure supply hole 114 and air pressure are returned Road 75 is functioned as relief portion (the first relief portion).
In turn, on the flat surface 112 at top 11, the frame of piece 66 has been loaded along the part being placed in mounting table 12 62, it is provided with the O-ring 115 for providing range for surrounding airport 113.
(a) to (g) in Fig. 7 indicates the process of the movement of such embedment processing unit 1.(a) to (g) in Fig. 7 is signal Property indicate the transition figure of embedment processing unit 1 state in each step.Firstly, part has been carried as shown in (a) in Fig. 7 It sets in the investment embedment processing unit 1 of piece 66.Top 11 is sufficiently separated from mounting table 12, and push rod 13 first makes front end from mounting table 12 Flat surface 122 it is prominent.When investment part has loaded piece 66, the frame 62 for making part load piece 66 is directed at push rod 13, and Make part load piece 66 to be supported on push rod 13.
Then, as shown in (b) in Fig. 7, make push rod 13 towards retreating in push rod insertion hole 125.Part has loaded piece as a result, 66 drop on the flat surface 122 of mounting table 12.In addition, keeping top 11 mobile towards mounting table 12.Moreover, passing through the flat of top 11 The flat surface 122 of smooth face 112 and mounting table 12 sandwiches the frame 62 that part has loaded piece 66.From arrangements of components region 615 Height H1 until surface to the upper surface of frame 62 is than the surface from arrangements of components region 615 to the top surface of electronic component 60 Height H2 high until 603.Therefore, when having sandwiched frame 62, the top surface 603 of electronic component 60 does not reach the flat surface at top 11 112.Therefore, it surrounds, and has been sealed by O-ring 115 closed with screening glass 61 and frame 62 in the flat surface 112 by top 11 The arrangements of components region 615 for being loaded with electronic component 60 is enclosed in space 14.
If arrangements of components region 615 is enclosed in confined space 14, as shown in (c) in Fig. 7, make the sky of mounting table 12 Negative pressure is generated in stomata 123, and screening glass 61 is adsorbed on flat surface 122.Then, as shown in (d) in Fig. 7, make top Negative pressure is also generated in 11 airport 113, and the confined space 14 for being sealed with arrangements of components region 615 is depressurized.Decompression Degree preferably two airports (113,123) pressure achieved is identical, and close to vacuum.The airport of mounting table 12 123 are the reason of taking the lead in generating negative pressure: by the way that first screening glass 61 is adsorbed in mounting table 12, and inhibiting in confined space 14 Decompression process in screening glass 61 downside air pressure relative to the air pressure of upside become it is excessive and thus electronic component 60 towards top The flat surface 112 in portion 11 is rapidly advanced by leaps and bounds.In addition, in this stage, electronic component 60 is not embedded in screening glass 61 with electrode 602 Bonding plane 611 in state be positioned on screening glass 61, therefore between existing between electrode exposed surface 601 and bonding plane 611 Gap, this gap are also depressurized.
If decompression is completed, as shown in (e) in Fig. 7, at the top of maintenance in the state of the negative pressure of 11 sides, make mounting table 12 The airport 123 of side gradually changes from negative pressure towards positive pressure, and the airport of mounting table 12 123 is converted into positive pressure.Electronics zero Part 60 and screening glass 61 are slowly inhaled upwards by the flat surface 112 towards top 11, in addition, by slowly pushing up.Electronic component 60 are pressed and be blocked by the flat surfaces 112 at top 11.On the other hand, screening glass 61 due to bonding plane 611 have flexibility, because Even if this is also further attracted towards flat surface 112 after electronic component 60 has been blocked, in addition, by towards flat surface 112 into one Step pushes up.
Then, the electrode 602 of electronic component 60 is embedded in screening glass 61, is more specifically embedded in the bonding plane of screening glass 61 In 611, in turn, the electrode exposed surface 601 of electronic component 60 is closely contacted on screening glass 61.At this point, the flat surface 112 at top 11 wraps Region containing arrangements of components 615, and keep arrangements of components region 615 and then flat.In other words, arrangements of components region 615 will not be bent. It is therefore prevented that generating embedded insufficient or electrode exposed surface 601 the contiguity of electrode 602 not in the end in arrangements of components region 615 Foot.
This electrode exposed surface 601 and the contiguity process of screening glass 61 carry out under reduced pressure atmosphere, without sky in confined space Gas or air become considerably less.Therefore, between bubble intrusion electrode exposed surface 601 and screening glass 61 a possibility that, is lower.
In turn, Fig. 8 is the enlarged drawing between the electronic component 60 being embedded in processing unit 1.As shown in figure 8, being produced in mounting table 12 Raw positive pressure equably pushes up in at least arrangements of components region 615 of screening glass 61.Then, between adjacent electronic component 60 Each gap in, with flexibility screening glass 61 not by electronic component 60 stop and by the flat surface 112 into one towards top 11 Step push-in.Then, the protuberance of bonding plane 611 of screening glass 61 is until the side lower for reaching electronic component 60, screening glass 61 Also it is closely contacted on the side lower of electronic component 60.Therefore, it can more reliably prevent the particle of electromagnetic shielding film 605 from entering electrode Between exposed surface 601 and screening glass 61.
If the electrode 602 of electronic component 60 is embedded in screening glass 61, in addition, the electrode exposed surface of electronic component 60 601 are closely contacted on screening glass 61 with side lower, then as shown in (f) in Fig. 7, push rod 13 are made to exist along push rod insertion hole 125 It moves in axis direction, and occurs again from the flat surface of mounting table 12 122.Meanwhile with equal with the forward speed of push rod 13 Speed leaves top 11 from mounting table 12.Finally, stopping push rod 13 as shown in (g) in Fig. 7, further make top 11 leave from mounting table 12, thus release part and have been embedded to sandwiching for piece 67.The electronics zero of embedment processing unit 1 is utilized as a result, Part 60 is completed towards the embedment in screening glass 61.
In addition, as long as the negative pressure of 11 side of top and the positive pressure of 12 side of mounting table are in the electronic component 60 from (e) in Fig. 7 It is released in a period of until increase top 11 ?.About the negative pressure of 11 side of top, if being released before increase top 11, in Fig. 7 (f) electronic component 60 can be stably maintained on screening glass 61 when the rising of the push rod 13 in, therefore preferably.
In this way, top 11 and mounting table 12 become and sandwich part and sandwiching frame 62 from two sides and loaded consolidating for piece 66 Determine portion.In addition, top 11 and screening glass 61 and frame 62 form the confined space 14 in enclosed arrangements of components region 615.O-ring 115 improve the reliability of confined space 14 by sealing.In turn, the airport 113 at top 11 become to confined space 14 into The relief portion of row decompression.
Moreover, the flat surface 122 of mounting table 12 becomes the mounting surface that part has loaded piece 66.In the flat surface of mounting table 12 The airport 123 of 122 upper openings becomes following anticollision component and pressing component, and the anticollision component is in confined space 14 Decompression when take the lead in generating negative pressure, and prevent electronic component 60 from advancing by leaps and bounds towards the flat surface 112 at top 11, the pressing component passes through Positive pressure and mutually work with the negative pressure at top 11 and on the flat surface 112 at top 11 and bury the pressing of arrangements of components region 615 If the electrode 602 of electronic component 60.
Keep arrangements of components region 615 and then flat in addition, the flat surface 112 at top 11 becomes, and improves burying for electrode 602 If the planarizing unit of effect, the contiguity effect of electrode exposed surface 601.In the airport of 112 upper opening of flat surface at top 11 113 become following upper suction component and side lower cladding parts, the upper suction component by negative pressure with mounting table 12 just The mutual electrode that arrangements of components region 615 is pressed and on the flat surface 112 at top 11 and buries electronic component 60 that works of pressure 602, the side lower cladding parts and the positive pressure of mounting table 12 mutually work and screening glass 61 are drawn to electronic component upwards In gap between 60 and make the contiguity of screening glass 61 until the side lower of electronic component 60.
In this way, the electrode 602 of electronic component 60 is embedded in the bonding plane 611 of screening glass 61 by embedment processing unit 1, but have There is the relief portion depressurized to the space comprising electronic component 60 and arrangements of components region 615.Moreover, making electricity after decompression Sub- part 60 is mutually pressed with screening glass 61.There is no electrode exposed surface 601 and protection that bubble enters electronic component 60 as a result, Become the insufficient situation of contiguity between piece 61, between generating between the electrode exposed surface 601 and screening glass 61 of electronic component 60 The worry of gap declines, and the particle that can avoid electromagnetic shielding film 605 is attached to the state of affairs on electrode 602.
In addition, the flat surface 112 of embedment processing unit 1 including top 11 and to opposite with flat surface 112 across screening glass 61 The pressure adjustment unit that the pressure in the space of side is adjusted.Flat surface 112 is located at opposite with screening glass 61 across electronic component 60 Side, and it is opposite with electronic component 60.In addition, such as airport 123, air pressure supply hole 124 and pneumatic circuit 75 are pressure adjustment The example in portion.This pressure adjustment unit makes between mounting table 12 and screening glass 61, i.e., across screening glass 61 and 112 opposite side of flat surface Space pressure of the pressure relatively than the space between screening glass 61 and flat surface 112 it is big.
Make electronic component 60 and screening glass 61 towards flat surface 112 as a result, flat surface 112 is made to become brake and make electricity Sub- part 60 is mutually pressed with screening glass 61.Therefore, the arrangements of components region 615 of screening glass 61 is and then flat, electronic component 60 Electrode exposed surface 601 pressed each other in the state of having become parallel with screening glass 61.Therefore, the leeway that bubble enters Further lose.
The thickness of electronic component 60 and screening glass 61 is simultaneously different, and there are deviations.No matter the deviation of this thickness, confined space The differential pressure of pressure between 14 pressure and mounting table 12 and screening glass 61 can be to 61 exhaustive of electronic component 60 and screening glass Ground assigns the power that mutually presses, thus can respective multiple electrodes 602 and screening glass 61 to multiple electronic components 60 adhesion Sufficient pressing force is certainly assigned between face 611, each electrode 602 of each electronic component 60 can be embedded in screening glass 61.
In addition, embedment processing unit 1 has the flat surface 122 of mounting table 12, that is, it is located at across screening glass 61 and flat surface 112 The mounting surface of opposite side.Moreover, negative pressure will be generated to make to protect in this mounting surface upper opening, and before the decompression of confined space 14 Bluff piece 61 is formed in mounting table 12 from the airport 123 separated on flat surface 112.It is can inhibit as a result, because to confined space The case where electronic component rapidly advances by leaps and bounds towards flat surface 112 and electronic component 60 is caused to damage in 14 progress decompression processes.
By the airport of the airport 113 at the top 11 for pressing electronic component 60 and screening glass 61 mutually and mounting table 12 123 are used as relief portion, but third airport can also be additionally formed in confined space 14, make to generate in this third airport negative Pressure is to be depressurized.
In addition, the airport 123 of 12 side of mounting table is transformed into generation positive pressure after confined space 14 has been depressurized, and court Screening glass 61 is further pressed by the electronic component 60 that flat surface 112 stops.It is protected in the gap between electronic component 60 as a result, Piece 61 swells together with bonding plane 611, and the side lower of electronic component 60 can also be coated by screening glass 61.It therefore, can be certain Ground prevents from generating gap between electrode exposed surface 601 and screening glass 61.In addition, even there is thin plate in side lower The electronic components such as the SOP or QFP of electrode can prevent the particle of electromagnetic shielding film 605 also by 61 jacketed electrode 602 of screening glass Attachment, and this film formation device 7 can be applied.
In addition, in the present embodiment, making to generate negative pressure in top 11, making across screening glass 61 and 11 opposite side of top Positive pressure is generated in mounting table 12.It is in order to press electronic component 60 and screening glass 61 mutually, followed by order to make to adhere first The side lower for carrying out overlay electronic part 60 is swelled in gap between electronic component 60 in face 611.
But electronic component 60 and screening glass 61 are pressed mutually in order to reach, the differential pressure of the size is simultaneously nonessential.It will The differential pressure that the electrode 602 of electronic component 60 is embedded in screening glass 61 corresponds to the flexibility person of screening glass 61, even if not making to carry It sets 12 side of platform and is transformed into positive pressure, the negative pressure of 12 side of mounting table can also be made to weaken than the negative pressure of 11 side of top.That is, so-called opposite Greatly, include the case where that 11 side of top is negative pressure and mounting table 12 is the negative pressure ratio top of the positive pressure comprising atmospheric pressure and mounting table 12 The negative pressure of 11 side of portion is high, but the case where force down than atmosphere, can will as long as producing for 11 side of top and 12 side of mounting table Electrode 602 is embedded in the differential pressure in screening glass 61.
But, when by the negative pressure of 11 side of top with make to produce in the mounting table 12 of screening glass 61 and 11 opposite side of top The differential pressure of raw atmospheric pressure or superatmospheric pressure can apply big pressing to press electronic component 60 and when screening glass 61 Power, therefore can certainly be assigned between the respective multiple electrodes 602 to multiple electronic components 60 and the bonding plane 611 of screening glass 61 Sufficient pressing force is given, and each electrode 602 of each electronic component 60 can be embedded in screening glass 61.
In addition, though pushing up screening glass 61 by differential pressure, but the upper pushing volume in arrangements of components region 615 is by flat surface 112 determine.That is, the deflection of screening glass 61 is provided by flat surface 112, therefore the lifting force as caused by differential pressure also applies In screening glass 61 into the gap between the electronic component 60 for being located at arrangements of components region 615.At this point, between electronic component 60 Gap in screening glass 61 do not contacted with flat surface 112, therefore there is pressure reduction space above it.Therefore, screening glass 61 with The bonding plane 611 of gap portion is swelled by differential pressure together, and the side lower of electronic component 60 is also that can be wrapped by screening glass 61 The person of covering.
Therefore, in the present embodiment, in order to coat the side lower of electronic component 60, negative pressure is generated in top 11, Positive pressure is generated in mounting table 12, and by the pressing of arrangements of components region 615 on the flat surface 112 at top 11.But because of protection The flexibility of piece 61 and there is a situation where as follows: even if not being the big of pressure close to vacuum and 12 side of mounting table of 11 sides of top The differential pressure of air pressure or superatmospheric pressure, bonding plane 611 can also swell in the gap between electronic component 60.Therefore, For the side lower of overlay electronic part 60, it is generally desirable to so that 12 side of mounting table is transformed into positive pressure, but not necessarily will mounting 12 side of platform is adjusted to positive pressure.As long as that is, corresponding to the flexibility of screening glass 61 to adjust differential pressure, because of the softness of screening glass 61 Property, even if until so that the pressure of 12 side of mounting table is reached atmospheric pressure, can also weaken negative after the completion of the decompression of 11 side of top Pressure.
In addition, aftermentioned electromagnetic shielding film 605 can connect to improve shielding by the ground connection wiring with electronic component 60 Performance.This ground connection wiring is the wiring for releasing unwanted electromagnetic wave towards the outside, is generally formed in the side of electronic component 60 Face.Must avoid because reach electronic component 60 side lower bonding plane 611 protuberance due to interfere electromagnetic shielding film 605 with It is grounded the connection of wiring.
This embedment processing unit 1 can be independently adjustable the pressure of 11 sides of top and 12 side of mounting table to produce desired difference Pressure, therefore it is adjustable to the height of the protuberance of side lower up to electronic component 60, and can be in the side lower of electronic component 60 The height of the protuberance is controlled at the same.That is, can more reliably be sealed and being closely contacted on side lower on screening glass 61 The gap of electrode 602 is reached, or in the case where electronic component 60 is SOP or QFP etc., the electrode of side lower can be buried In screening glass 61, and becomes screening glass 61 and do not reach on the ground connection wiring of side 604 and make to be grounded the state that wiring exposes.
In addition, the motion mechanism at top 11 and the motion mechanism of push rod 13 can apply well known mechanism, the present invention is not by machine The mechanism of system limits.
For example, be connected on top 11 make axis from top 11 towards ball screw extended on the direction of mounting table 12, And from top 11 towards railing guide extended on the direction of mounting table 12.Direction of rotation of the top 11 according to screw shaft, edge Guide rail it is mobile towards mounting table.Ball screw and railing guide have loaded piece 66 close to mounting table 12 to part with top 11 Mode until the distance of the thickness H1 of frame 62 extends.In addition, if top 11 and mounting table 12 can be moved relatively, Therefore it is not limited to top 11 and carries out mobile person, mounting table 12 can also be made to be moved, top 11 and mounting can also be made Both platforms 12 are moved.
In addition, the rear end of push rod 13 becomes cam follower (cam follower).Cam follower is oval convex It is carried out on the periphery of wheel driven.Cam is supported on the shaft on rotation motor, can be rotated in a circumferential direction.If rotation motor is driven Dynamic, cam is rotated, then cam follower rises the bulge of cam, and push rod 13 is pushed upwardly, the front end of push rod 13 from Insertion hole is prominent.
In turn, the fixing means that piece 66 has been loaded as part sandwiches frame 62 by top 11 and mounting table 12, and Confined space 14 is formed by top 11 and screening glass 61 and frame 62, and makes selectivity in the airport 123 of mounting table 12 Ground generates both positive pressure and negative pressure, and but not limited to this.For example, it is also possible to by one of top 11 and mounting table 12 or both It is set as cup-shaped, part has been loaded into piece 66 and has been housed in the inner space formed by top 11 and mounting table 12.Also may include The block that frame 62 is sandwiched from two sides has loaded piece 66 by block come holding parts.In the case, the height of frame 62 is not Limit.The through hole two that the through hole for generating negative pressure can also be formed on the flat surface 122 of mounting table 12 and generate positive pressure Person.
(plate mounting portion)
Then, the plate mounting portion 2 for undertaking plate installation steps is illustrated.Fig. 9 is showing for the structure of display plate mounting portion 2 It is intended to.The coldplate 63 that the part as made by embedment processing unit 1 has been embedded to piece 67 and has been pasted with adhesive sheet 64 in advance is put into In plate mounting portion 2.Part has been embedded to the pressing of piece 67 on coldplate 63 by plate mounting portion 2, is inhaled in addition, part has been embedded to piece 67 It leads on coldplate 63, so that part has been embedded to piece 67 and be closely contacted on coldplate 63 via adhesive sheet 64.
As shown in figure 9, this plate mounting portion 2 includes top 21 and mounting table 22.Top 21 and mounting table 22 configure in opposite directions.It carries The position for setting platform 22 is motionless.On the other hand, top 21 is relative to 22 liftable of mounting table.Top 21 at least close to mounting table 22 to Until part has been embedded to the distance of the thickness H1 of the frame 62 of piece 67.
Top 21 is the block with inner space 211, has flat surface 212 on the face towards mounting table 22.Mounting Platform 22 has cup-shaped with the end.The opening 221 of mounting table 22 is towards top 21.The size and shape of the flat surface 212 at top 21 It has been embedded to that piece 67 is identical or to be embedded to piece 67 than part wide with part.On the other hand, the opening 221 of mounting table 22 has part Arrange 615 or more region, middle frame region 614 below includes area.The edge 222 of the circular opening 221 of mounting table 22 has The width more than width of frame 62.
In this mounting table 22, edge 222 supports coldplate 63, and opening 221 is blocked by coldplate 63.Coldplate 63 with The opposite face in face for being pasted with adhesive sheet 64 is connected on edge 222.In turn, part be embedded to piece 67 and adhesive sheet 64 it is opposite and It is placed on coldplate 63.Air pressure supply hole 223 has been provided in the bottom of mounting table 22.Outside air pressure supply hole 223 and figure Pneumatic circuit 75 comprising compressor, negative pressure feeding pipe etc. connects.Therefore, in occlusion of openings 221 come the coldplate 63 that loads Negative pressure is generated in airport 632.In addition, adhesive sheet 64 can also be pasted onto protection in advance before being put into plate mounting portion 2 In the non-adhesive face 612 of piece 61.
In turn, the push rod insertion hole 224 through mounting table 22 is provided in the edge of mounting table 22 222.Push rod insert Hole 224 provide position be it is consistent with the push rod insertion hole 631 of coldplate 63, be embedded to piece 67 when being placed with part in side When, avoid the guide portion insertion hole 621 of frame 62, and the position blocked by frame 62.Push rod 23 is inserted in this push rod insertion hole In 224.This push rod 23 can haunt through mounting table 22, coldplate 63 and adhesive sheet 64.
Push rod 23 is to make part be embedded to piece 67 and leave simultaneously from coldplate 63 in the state of prominent from coldplate 63 Rigidity, quantity and the configuration space of the degree that can be supported in parallel is arranged.If such as the shape of frame 62 is rectangle, is corresponded to It is configured in each angle of frame 62 as barred body.Push rod insertion hole 224 also corresponds to the quantity of push rod 23 and positional relationship is come Setting.
Then, many airports 213 led to toward inner space 211 are provided on the flat surface 212 at top 21.Airport To be size and shape be embedded to the identical range in the inside of frame 62 of piece 67 or at least size with part to 213 range that provides And shape is identical as arrangements of components region 615.When part being embedded to piece 67 being placed in mounting table 22, airport 213 The position that provides be the position (referring to Fig.1 0 in (a)) that arrangements of components region 615 is covered.
In the inner space 211 at top 21, air pressure supply hole 214 has been provided on the position different from flat surface 212. Air pressure supply hole 214 is connect with the pneumatic circuit 75 comprising compressor, positive pressure supply pipe, negative pressure feeding pipe etc. outside figure.Therefore, By air pressure supply hole 214 and inner space 211, and positive pressure and negative pressure are selectively generated in airport 213.That is, top 21 inner space 211, flat surface 212, airport 213, air pressure supply hole 214 and pneumatic circuit 75 has to be protected as screening glass The function and the function as positive splenium for holding portion.In the case where pneumatic circuit 75 makes to produce negative pressure in airport 213, play The function of screening glass maintaining part plays the function of positive splenium in the case where pneumatic circuit 75 makes to produce positive pressure in airport 213 Energy.
In turn, on the flat surface 212 at top 21, the frame of piece 67 has been embedded to along the part being placed in mounting table 22 62, it is provided with the O-ring 215 for providing range for surrounding airport 213.That is, the peripheral part of the flat surface 212 at top 21 is via O Type circle 215 and press frame 62, and by the peripheral part of screening glass 61 pressing on coldplate 63.That is, top 21 has conduct will The peripheral part of screening glass 61 presses the function of the press section on coldplate 63.
(a) to (e) in Figure 10 indicates the process of the movement of such plate mounting portion 2.(a) to (e) in Figure 10 is signal Property the state of display plate mounting portion 2 in each step transition figure.Firstly, making top 21 first as shown in (a) in Figure 10 It is left from mounting table 22.It is placed with coldplate 63 in advance in mounting table 22.In addition, first make push rod 23 through coldplate 63 and Adhesive sheet 64 and it is prominent towards top 21.In this case, the frame 62 for making part be embedded to piece 67 is directed at push rod 23, and by pushing away Bar 23 supports the part to be embedded to piece 67.Then, decline top 21 towards push rod 23, sandwich zero by top 21 and push rod 23 Part has been embedded to the frame 62 of piece 67.
At this point, height H1 ratio until from the surface in arrangements of components region 615 to the upper surface of frame 62 is from arrangements of components Height H2 high until the surface in region 615 to the top surface of electronic component 60 603.Therefore, when having sandwiched frame 62, electronics zero The top surface 603 of part 60 does not reach the flat surface 212 at top 21.Therefore, it is formed by top 21 and screening glass 61 and frame 62, and At least enclosed arrangements of components region 615 in the confined space 24a sealed by O-ring 215.
If arrangements of components region 615 is enclosed in confined space 24a, make to generate negative pressure in the flat surface 212 at top 21. Electronic component 60 is attracted on flat surface 212.Part has been embedded to piece 67 and has generated strain, arrangements of components in middle frame region 614 615 whole region of region is attracted on flat surface 212 in the state of and then flat.Therefore, arrangements of components region 615 is not It can be bent as bending, the electrode 602 being embedded in will not be detached from from screening glass 61.In addition, the flat surface at top 21 On 212, in order not to make electronic component 60 rapidly advance by leaps and bounds towards flat surface 212, so that pressure gradually declines to generate negative pressure and be Preferably.The size of negative pressure at this time is previously set in control unit 74.If considering the pass with the decompression of aftermentioned confined space 24b System, then be preferably close to the pressure of vacuum (zero air pressure).
Then, as shown in (b) in Figure 10, decline push rod 23 and top 21 towards mounting table 22 at equal speeds.And And the adhesive sheet 64 on the region contact coldplate 63 for the frame 62 for making part be embedded to piece 67.In turn, make top 21 towards mounting Platform 22 is mobile to be pressed, and thus the region of frame 62 is adhered on adhesive sheet 64.The part is set to be embedded to piece The time point of adhesive sheet 64 on the region contact coldplate 63 of 67 frame 62, the negative pressure at top 21 are maintained, and part is Embedment piece 67 is attracted on the flat surface 212 at top 21, therefore arrangements of components region 615 does not contact (separation with adhesive sheet 64 State).
Herein, when generating negative pressure not in top 21, in the part at ambient of depositing of air, to be embedded to the contact of piece 67 viscous Piece 64.Then, there are bubbles to enter the worry that part has been embedded between piece 67 and adhesive sheet 64.If bubble enters, reach The heat transfer area of coldplate 63 is reduced, the heat dissipation effect decline of the electronic component 60 when film forming.But in this plate mounting portion 2, Make part be embedded to piece 67 at ambient to rise towards the direction left from adhesive sheet 64 in depositing for air, thus bubble into Enter to be prevented from.
It is pressed against on adhesive sheet 64 if frame 62 touches via screening glass 61, the non-adhesive face of screening glass 61 612 are enclosed the confined space 24b formed by screening glass 61 and coldplate 63 and frame 62 with 64 side of adhesive sheet of coldplate 63 In.If forming confined space 24b, as shown in (c) in Figure 10, at the top of maintenance in the state of 21 negative pressure, make mounting table Also negative pressure is generated in 22.In other words, in the state that the peripheral part of screening glass 61 (outer frame region 613) is pressed by top 21, Confined space 24b is depressurized.By the airport 632 of the airport 632 of coldplate 63 and adhesive sheet 64, and to being provided with Confined space 24b between the coldplate 63 and screening glass 61 of adhesive sheet 64 is depressurized.At this point, make to generate in mounting table 22 Negative pressure be than making in top 21 negative pressure that generates slightly close to the negative pressure of atmospheric pressure, and be set as to maintain electronic component 60 for The size of the absorption at top 21 is advisable.This negative pressure is previously set in control unit 74.
If the court for the confined space 24b being provided between the coldplate 63 of adhesive sheet 64 and screening glass 61 is previously set negative The decompression of pressure is completed, then as shown in (d) in Figure 10, in the state of maintaining the negative pressure of mounting table 22, makes the negative pressure at top 21 Gradually it is changing into positive pressure.In other words, it in the state that the decompression of confined space 24b has obtained maintenance, releases and utilizes top 21 Screening glass 61 holding.Part has been embedded to piece 67 and has slowly been attracted decline towards adhesive sheet 64, in addition, part has been embedded to piece 67 It is pressed downwards, part has been embedded to piece 67 and has been pressed against on the adhesive sheet 64 being adhered on coldplate 63.Moreover, part has been embedded to piece 67 are mounted on coldplate 63 via adhesive sheet 64.
In addition, if the negative pressure of 22 side of mounting table and the negative pressure of 21 side of top are set as same or about, screening glass 61 carry out elastic shrinkage, and screening glass 61 contacts adhesive sheet 64.Accordingly it is also possible to be set as and top by the negative pressure of 22 side of mounting table The negative pressure of 21 sides is same or about, and after having contact, and the negative pressure of 21 sides of top is made gradually to be changing into positive pressure.
Finally, keeping top 21 mobile in a manner of separating from mounting table 22 as shown in (e) in Figure 10, thus releasing Made part be embedded to piece 67 it is Chong Die with adhesive sheet 64 and coldplate 63 after sandwich.It as a result, include electronic component 60, screening glass 61, the part board mounting 68 of adhesive sheet 64 and coldplate 63 completes.In addition, making the positive pressure generated in top 21 and making As long as the negative pressure generated in mounting table 22 releases in a period of separating top 21 from mounting table 22.
Part is set to be embedded to piece 67 and the close driving of coldplate 63 that is, top 21 and push rod 23 and mounting table 22 become Portion.Top 21 and mounting table 22, which become, sandwiches the fixed part that part has been embedded to piece 67 Yu coldplate 63, presses press box in addition, also becoming The press section that frame 62 touches the two with coldplate 63.Part has been buried in addition, the air pressure supply hole 223 of mounting table 22 becomes Enter the relief portion that the confined space 24b between piece 67 and coldplate 63 is depressurized.In addition, the airport 213 at top 21 becomes Relief portion (the second decompression that confined space 24a between piece 67 is depressurized has been embedded to the flat surface 212 and part at top 21 Portion).
The flat surface 212 at top 21 becomes following isolated part and pressing component, and the isolated part is prior to part Embedment piece 67 and coldplate 63 between decompression and generate negative pressure, thus keep part be embedded to piece 67, and prevent bubble into Enter part to be embedded between piece 67 and coldplate 63, the pressing component as positive splenium, by positive pressure with utilize mounting table The absorption of 22 negative pressure mutually works to make part be embedded to piece 67 and be closely contacted on coldplate 63.Moreover, mounting table 22 becomes logical It crosses negative pressure and mutually works with the pressing of the positive pressure using top 21 to make part be embedded to piece 67 and be closely contacted on coldplate 63 Adsorption element.
In this way, the screening glass 61 for the electrode 602 for being embedded with electronic component 60 is pasted on coldplate 63 by plate mounting portion 2. This plate mounting portion 2 has as the top that the peripheral parts such as the frame 62 of screening glass 61 are pressed to the press section on coldplate 63 21, in addition, having the relief portion depressurized to the space between arrangements of components region 615 and coldplate 63.In addition, carry out In the state of the decompression of relief portion, this plate mounting portion 2 keeps screening glass 61 mutual via adhesive sheet 64 with coldplate 63 Pressing.Bubble can not be made to enter between screening glass 61 and coldplate 63 and touch the two as a result, can be fully ensured towards cooling Heat transfer area in plate 63.
In addition, flat surface 212 of the plate mounting portion 2 at top 21 has that is, across screening glass 61 and 63 opposite side of coldplate Screening glass 61 is inhaled into the airport 213 for keeping coldplate 63 isolated with screening glass 61 upwards by negative pressure.With this airport 213 flat surface 212 is used as screening glass maintaining part, with make in press section the peripheral part of screening glass 61 contacted coldplate 63 when Between point, the mode for keeping the region of the arrangement electronic component 60 in screening glass 61 isolated with coldplate 63 keeps screening glass 61.Moreover, Part has been embedded to using relief portion depressurized between piece 67 and coldplate 63 before maintain negative pressure, what is depressurized It releases and keeps under state.The state of affairs that screening glass 61 and coldplate 63 are pasted in the state that decompression does not complete can be prevented as a result, it can The worry that bubble enters between screening glass 61 and coldplate 63 is further decreased, and is fully ensured towards the heat transfer in coldplate 63 Area.
In addition, the airport 213 in 212 upper opening of flat surface at top 21 declines from push rod 23 and top 21 is via part Before being embedded to the frame 62 of piece 67 and being connected in mounting table 22, i.e., piece 67 and coldplate 63 close to it have been embedded to from part Before, generate negative pressure before the space that formation is provided between the coldplate 63 of adhesive sheet 64 and screening glass 61 at the latest.As a result, It can prevent before the push rod 23 for being provided with screening glass 61 (part has been embedded to piece 67) is begun to decline, screening glass 61 is accidentally pasted onto cold But the state of affairs on plate 63.
In addition, plate mounting portion 2 has the flat surface 212 at top 21.This flat surface 212 is located at across screening glass 61 and cooling 63 opposite side of plate, and it is opposite with electronic component 60.Make before the decompression that part has been embedded between piece 67 and coldplate 63 terminates The airport 213 isolated with screening glass 61 of coldplate 63 is in this 212 upper opening of flat surface.It as a result, will not be because in decompression process Screening glass 61 table back pressure difference and cause screening glass 61 be bent and bend, screening glass 61 can be made and then flat, can be prevented The state of affairs that electronic component 60 is removed from screening glass 61 in plate installation process.
The airport 213 of this 21 side of top is used as positive splenium, has been embedded to the pressure between piece 67 and coldplate 63 in part After arrived regulation setting value, it is transformed into generation positive pressure from negative pressure is generated, and presses screening glass 61 towards coldplate 63.That is, this is empty Stomata 213 is isolated maintaining part, to the confined space 24a relief portion depressurized and is made as screening glass 61 and coldplate 63 The positive splenium that positive pressure generates, as the pressing component of screening glass 61 and coldplate 63.But it is also possible to by being arranged in other structures Airport on part realizes isolated part, decompression member and the function of touching component.
For example, airport 632 is first arranged on coldplate 63 as in the present embodiment.Plate mounting portion 2 has mounting cold But plate 63, and the mounting table 22 for generating negative pressure.Furthermore, it is also possible to mounting table 22 and coldplate by being placed with coldplate 63 63 airport 632, screening glass 61 is attracted on coldplate 63.
As long as the present invention is not in addition, the motion mechanism at top 21 and the motion mechanism of push rod are using well known mechanism It is limited by the mechanism of mechanism.
For example, be connected on top 21 make axis from top 21 towards ball screw extended on the direction of mounting table 22, And from top 21 towards railing guide extended on the direction of mounting table 22.In the case, top 21 is according to screw shaft Direction of rotation is moved along guide rail towards mounting table 22.Ball screw and railing guide are with top 21 close to mounting table 22 to zero Mode until part has been embedded to the distance of the thickness H1 of the frame 62 of piece 67 extends.
In addition, the rear end of push rod 23 becomes cam follower.Cam follower is enterprising in the periphery of oval cam Row is driven.Cam is supported on the shaft on rotation motor, can be rotated in a circumferential direction.If rotation motor is driven, cam is revolved Turn, then cam follower rises the bulge of cam, and push rod 23 is pushed upwardly.
In turn, part can not also be embedded to piece 67 by the forming method as confined space 24a and confined space 24b An element with coldplate 63 as forming member, and formed by top 21 with mounting table 22.For example, it is also possible to by top One of 21 and mounting table 22 or both are set as cup-shaped, be housed in a manner of being embedded to piece 67 and coldplate 63 comprising part by Top 21 and mounting table 22 are formed by a space, and then have been embedded to piece 67 to part by top 21 and mounting table 22 Table back divided.But in the case, preferably top 21, which erects, surrounds the flat surface that airport 213 is open 212, and towards the extended side wall of mounting table 22.This side wall and the flat surface of mounting table 22 touch, and form a confined space.It will O-ring 215 is first arranged on the end face of side wall.
(film process portion)
Then, the film process portion 3 for undertaking film formation step is illustrated.Figure 11 A and Figure 11 B are to indicate film process portion The schematic diagram of 3 structure.Film process portion 3 forms electricity by sputtering on each electronic component 60 on part board mounting 68 Magnetic wave screened film 605.As shown in FIG. Figure 11 A and 11 B, this film process portion 3 has chamber 31 and sampling room (load-lock) 32.Chamber 31 is towards the vacuum chamber for having carried out expanding cylindrical shape closer to radial direction than axis direction.Pass through in chamber 31 Multiple fan-shaped regions are separated into along the extended lattice 33 of radial direction.It handles position 311 and is assigned at film location 312 In the fan-shaped region of a part.
Lattice 33 extends from the top surface of chamber 31 towards bottom surface, but does not reach bottom surface.In the bottom surface side space of no lattice 33 In be provided with turntable 34.Turntable 34 has the disc-shape coaxial with chamber 31, is rotated in a circumferential direction.From taking The investment of specimen chamber 32 is positioned on turntable 34 to the part board mounting 68 in chamber 31, is circled round on one side with the track of circumference It is mobile, on one side around processing position 311 and at film location 312.
In addition, being for example provided on turntable 34 to maintain part board mounting 68 relative to the position of turntable 34 Slot, hole, protrusion, fixture, fixator, mechanical chuck or adhesion collet etc. keep the holding member of part board mounting 68.
Surface treating part 35 is provided on processing position 311.This surface treating part 35 is imported with the process gas such as argon gas, It is by the application of high frequency voltage that process gas is plasmarized, and generate electronics, ion and free radical etc..For example, this table Surface treatment portion 35 is the cylindrical electrode in 34 side opening of turntable, applies high frequency by radio frequency (Radio Frequency, RF) power supply Voltage.
It is provided with the target 361 for constituting sputtering source 36 at film location 312, and is imported with as inert gases such as argon gas Sputter gas.Sputtering source 36 applies electric power to target 361, keeps sputter gas plasmarized, and makes the collisions such as generated ion Target, and get particle.Target 361 includes the material of electromagnetic shielding film 605.That is, getting electromagnetic shielding film 605 from target 361 Particle, the build-up of particles for the electromagnetic shielding film 605 got is on the electronic component 60 on turntable 34.
Such as it is provided at two positions described at film location 312.Each target material at film location 312 can be set as identical Material, can be set to different materials also to form the electromagnetic shielding film 605 of stacking.To each splashing at film location 312 The power supply for penetrating the application of source 36 electric power for example can be using direct current (Direct Current, DC) power supply, the DC pulse power, RF power supply etc. Well-known power supply.In addition, the power supply for applying electric power to sputtering source 36 can be arranged for each sputtering source 36, also can use Switch switches over common power supply to use.
In such film process portion 3, processing position 311 on electronic component 60 is etched or using ashing table The cleaning in face and roughened, and electromagnetic shielding film 605 is improved for the adhesion of electronic component 60, in addition, in film forming position Setting makes the build-up of particles of target 361 on electronic component 60 on 312, electromagnetic shielding film 605 is thus formed on electronic component 60. Electrode 602 is embedded in screening glass 61, and electrode exposed surface 601 is closely contacted on screening glass 61, therefore prevents electromagnetic shielding film 605 particle is attached on electrode 602, in addition, the particle of electromagnetic shielding film 605 is prevented to enter electrode exposed surface 601 and protect Between bluff piece 61.In turn, the heat of electronic component 60 is conducted in coldplate 63, and the excessive accumulation of heat of electronic component 60 is pressed down System.
In addition, this film process portion 3 is to carry out film forming person on electronic component 60 using sputtering method, but film build method is not It is defined in this.For example, film process portion 3 can also make electromagnetic shielding film 605 in electronics by vapor deposition, spraying and coating etc. It forms a film on part 60.
(plate releasing portion)
Then, the plate releasing portion 4 for undertaking plate releasing step is illustrated.Figure 12 is the structure of display plate releasing portion 4 Schematic diagram.It, will be in 68 input board releasing portion 4 of part board mounting after forming electromagnetic shielding film 605.As each for obtaining The initial step of electronic component 60, plate releasing portion 4 peel part from coldplate 63 and have been embedded to piece 67.
As shown in figure 12, this plate releasing portion 4 includes top 41 and mounting table 42.Top 41 and mounting table 42 configure in opposite directions. The position of mounting table 42 is motionless.On the other hand, top 41 is relative to 42 liftable of mounting table.Top 41 is at least close to mounting table 42 Until the distance of the thickness H1 of the frame 62 of part board mounting 68.
Top 41 is the block with inner space 411, has flat surface 412 on the face towards mounting table 42.Mounting Platform 42 has cup-shaped with the end, and opening 421 is towards top 41.The size and shape and part of the flat surface 412 at top 41 are carried Plate 68 is identical or wider than part board mounting 68.On the other hand, the opening 421 of mounting table 42 have arrangements of components region 615 with Upper, middle frame region 614 below includes area.The edge 422 of the circular opening 421 of mounting table 42 have frame 62 width with On width.
In this mounting table 42, edge 422 supports part board mounting 68, and opening 421 is blocked by part board mounting 68.It is cooling 63 side of plate is connected on edge 422.Air pressure supply hole 423 has been provided in the bottom of mounting table 42.Air pressure supply hole 423 and figure are outer The pneumatic circuit 75 comprising compressor, positive pressure supply pipe etc. connect.Therefore, it is carried in occlusion of openings 421 come the part loaded Positive pressure is generated in the airport 632 of plate 68.
In turn, the push rod insertion hole 424 through mounting table 42 is provided in the edge of mounting table 42 422.Push rod insert Hole 424 provide position be it is consistent with the push rod insertion hole 631 of coldplate 63, when being placed with part board mounting 68 in side, Avoid the guide portion insertion hole 621 of frame 62, and the position blocked by frame 62.Push rod 43 is inserted in this push rod insertion hole 424 In.Push rod 43 is can make front end prominent towards the high position of the frame 62 of the part board mounting 68 than being placed in mounting table 42 Mode move in axial direction.
Push rod 43 is to resist the adhesion strength of outer frame region 613 and adhesive sheet 64 and by part board mounting 68 from coldplate 63 Peel, part board mounting 68 be isolated with coldplate 63, can lift in parallel and support the degree of part board mounting 68 rigidity, Quantity and positional relationship are arranged.If such as the shape of frame 62 be rectangle, correspond to frame 62 each angle and as barred body To configure.Push rod insertion hole 424 also corresponds to quantity and the positional relationship of push rod 43 to be arranged.
In addition, being configured with a pair of of grip block 44 in the two sides of mounting table 42.Grip block 44, which only sandwiches, is placed on mounting table 42 On part board mounting 68 in coldplate 63.That is, a pair of of configuration of grip block 44 with the coldplate 63 that is positioned in mounting table 42 In identical height, and there is thickness identical with coldplate 63.Moreover, grip block 44 can centered on coldplate 63 phase Mutually contact separation.But grip block 44 is motionless on the direction that top 41 is arranged with mounting table 42.
Then, many airports 413 towards inner space 411 are provided on the flat surface 412 at top 41.Airport 413 range that provides is size and shape range identical with the inside of frame 62 of screening glass 61 or at least size and shape It is identical as arrangements of components region 615.When part board mounting 68 is placed in mounting table 42, airport 413 provides position Setting is position that arrangements of components region 615 is covered.
In the inner space 411 at top 41, air pressure supply hole 414 has been provided on the position different from flat surface 412. Air pressure supply hole 414 is connect with the pneumatic circuit 75 comprising compressor, negative pressure feeding pipe etc. outside figure.Therefore, it is supplied by air pressure To hole 414 and inner space 411, and negative pressure is generated in airport 413.
In turn, on the flat surface 412 at top 41, along the frame for the part board mounting 68 being placed in mounting table 42 62, it is provided with the O-ring 415 for providing range for surrounding airport 413.In addition, in the flat surface 412 at top 41 with frame 62 Opposite edge part is as the position being detached from from the arrangements of components region 615 of arrangement electronic component 60 in pressing screening glass 61 Fixed part function.This fixed part presses screening glass 61 with the whole region of the edge part opposite with frame 62, i.e., with whole A region presses frame 62, but is not necessarily required to be pressed with whole region, and there may also be the portions that a part is not pressed Position.
(a) to (e) in Figure 13 indicates the process of the movement of such plate releasing portion 4.(a) to (e) in Figure 13 is signal Property the state of display plate releasing portion 4 in each step transition figure.Firstly, making top 41 from load as shown in (a) in Figure 13 It sets and is left on platform 42, in addition, being buried in push rod 43 in the push rod insertion hole 424 of mounting table 42.Then, by part board mounting 68 are positioned in mounting table 42.If loading part board mounting 68, first passes through grip block 44 and carry out dead plate 63.
Then, as shown in (b) in Figure 13, decline top 41 towards mounting table 42, and make the flat surface 412 at top 41, I.e. fixed part is connected on the frame 62 of part board mounting 68.At this point, upper from the surface in arrangements of components region 615 to frame 62 Height H1 until surface is than the height H2 high until from the surface in arrangements of components region 615 to the top surface of electronic component 60 603. Therefore, when having sandwiched frame 62, the top surface 603 of electronic component 60 does not reach the flat surface 412 at top 41.Therefore, by top 41 form with screening glass 61 and frame 62, and at least enclose arrangements of components region in the confined space 45 sealed by O-ring 415 615。
If arrangements of components region 615 is enclosed in confined space 45, as shown in (c) in Figure 13, make to produce in top 41 Raw negative pressure, and make to generate positive pressure in mounting table 42.The flat surface 412 towards top 41 is inhaled upwards as a result, power and from mounting table 42 On leave and acted on towards the power that pushes up of direction of the flat surface 412 towards top 41 frame 62 inside arrangements of components area In domain 615.Pass through suction on this and lifting force, it is sufficient to which the power that arrangements of components region 615 is removed from coldplate 63 acts on zero Part arranges in region 615, and arrangements of components region 615 is peeled off from coldplate 63.The negative pressure and mounting table 42 at top 41 at this time The size of positive pressure be previously set in control unit 74.
At the time point that arrangements of components region 615 is removed, screening glass 61 is flat without strain, therefore arrangements of components region 615 towards the flat surface 412 at top 41 the impetus it is small, and electronic component 60 is prevented to peel off from screening glass 61 or electronic component 60 states of affairs to fly out from screening glass 61.Just in case arrangements of components region 615 is rapidly peeled off, the flat surface 412 at top 41 also into Row control, electronic component 60 stops by flat surface 412, therefore electronic component 60 is peeled off from screening glass 61 or from screening glass 61 On the worry that falls off reduce.
Electronic component 60 is reduced from the removing on screening glass 61 or the effect of the worry to fall off, preferably to further increase Interval in the state of before screening glass 61 is removed from coldplate 63, between the top surface 603 and flat surface 412 of electronic component 60 It is minimum.Therefore, the interval between the top surface 603 and flat surface 412 of electronic component 60 is protected with being set to remove from coldplate 63 The necessary interval of the bottom line of bluff piece 61 is advisable.
In addition, also can with the airport 632 that multiple airports 632 relative to coldplate 63, positive pressure play a role by Gradually increased mode, such as the airport 632 that is played a role with positive pressure is from the end of the side of coldplate 63 towards the other side The increased mode in end or the range of the airport 632 to be played a role with positive pressure are from the airport 632 of centrally located side towards periphery Side periodically widened mode, is divided into multiple spaces etc. for the space in the opening 421 of mounting table 42, and multiple make is arranged The system that positive pressure generates.By that can press down so set, can prevent arrangements of components region 615 from peeling off from coldplate 63 quickly The flat surface 412 at electronic component 60 processed towards top 41 is rapidly advanced by leaps and bounds.
In addition, electronic component 60 is connected on the flat surface 412 at top 41 if arrangements of components region 615 is peeled off, protection Only middle frame region 614 is bent piece 61, and at least arrangements of components region 615 maintains flat condition.In other words, if the flat surface at top 41 412 are not present, then screening glass 61 is bent in a manner of including air and is curved.Then, electronic component 60 is generated from screening glass 61 The worry of upper peeling, but arrangements of components region 615 maintains flat condition, therefore the peeling of electronic component 60 is inhibited.
If arrangements of components region 615 is removed from coldplate 63, as shown in (d) in Figure 13, push rod 43 is made to pass through load Set the push rod insertion hole 424 of platform 42, the push rod insertion hole 631 of the push rod insertion hole 631 of coldplate 63 and adhesive sheet 64 and via Screening glass 61 and contact frame 62.Moreover, being advanced further push rod 43, while making top 41 with the speed equal with push rod 43 It is left from mounting table 42.Coldplate 63 is held by grip block 44 and position is motionless, therefore is pasted with the outer frame region of frame 62 613 also peel off from coldplate 63, and screening glass 61 is whole to be removed from coldplate 63.
At this point, the positive pressure of mounting table 42 and the negative pressure at top 41 are maintained.Therefore, arrangements of components region 615 is because of self weight And it hangs down towards coldplate 63, and the state of affairs adhered to again is inhibited.In addition, the positive pressure of mounting table 42 is maintained, thus Auxiliary sticking has the outer frame region 613 of frame 62 from the removing on coldplate 63.
Finally, stopping push rod 43 as shown in (e) in Figure 13, and make top 41 further to divide from mounting table 42 From mode it is mobile, the clamping for being thus embedded to piece 67 for part is released from, and screening glass 61 is complete from the removing on coldplate 63 At.As long as being released in addition, the positive pressure of mounting table 42 and the negative pressure at top 41 are interior during this period.
That is, top 41 becomes pressing is detached from the fixed part for carrying out frame 62 in place from arrangements of components region 615.In addition, The air pressure supply hole 423 of mounting table 42 becomes positive pressure and generates hole, and becomes the airport 632 by coldplate 63 to arrangements of components Region 615 is pressurizeed, and by arrangements of components region 615 than pressing member that frame 62 is peeled from coldplate 63 earlier.Top The airport 413 in portion 41 becomes negative pressure and generates hole, and becomes and attract arrangements of components region 615, helps from the stripping on coldplate 63 From adsorption element.
In addition, the flat surface 412 at top 41 becomes the electronic component 60 when arrangements of components region 615 being inhibited to remove from guarantor Removing on bluff piece 61 or the arresting part to fall off, and then becoming makes screening glass 61 follow flat and inhibit electronic component 60 from guarantor The planarizing unit peeled off on bluff piece 61.Push rod 43 becomes after arrangements of components region 615 has been peeled off, by frame 62 from coldplate The upper-top part peeled on 63.
In this way, plate releasing portion 4 unloads coldplate 63 after film formation step.This plate releasing portion 4 includes having air pressure The positive pressure of supply hole 423 as an example generates the mounting table 42 in hole and the fixed part by top 41 as an example.Positive pressure generates hole In face of coldplate 63, generate positive pressure.Fixed part is during the positive pressure of mounting table 42 pressurizes to arrangements of components region 615 It is interior, the position that the slave arrangements of components region 615 in screening glass 61 is detached from, such as frame 62 are first pressed, in arrangements of components region 615 After leaving from coldplate 63, pressing is released.
When arrangements of components region 615 is peeled off, screening glass 61 remains flat as a result, therefore avoids arrangements of components region 615 The state of affairs takeoff because screening glass 61 reverts to flat reaction.Therefore, electronic component 60 is inhibited to peel off from screening glass 61 And it falls off.
More specifically, if being arranged from coldplate 63 in model corresponding with middle frame region 614 and arrangements of components region 615 Multiple airports 632 in enclosing supply positive pressure, then screening glass 61 starts to remove from coldplate 63 because of the positive pressure.Thus institute Positive pressure of the stripping portion of the screening glass 61 of generation because continuing supply, and the position for starting removing is gradually expanded simultaneously as starting point Towards outer expandable after connection.Finally, this stripping portion reaches the outer frame region of the inward flange as the frame 62 pressed by fixed part 613 with the boundary portion of middle frame region 614, the arrangements of components region 615 of screening glass 61 and middle frame region 614 are complete from coldplate 63 It separates entirely.At this point, the boundary portion of the outer frame region 613 that eventually arrives at of the stripping portion of screening glass 61 and middle frame region 614 via Frame 62 and pressed by the flat surface 412 as fixed part, even if therefore preventing arrangements of components region 615 and middle frame region 614 It has been removed that, the case where thus screening glass 61 is also caused rapidly to takeoff.
Moreover, outer frame region 613 is pressed via frame 62 by the flat surface 412 as fixed part, positive pressure is thus prevented It leaks out, therefore 615 entirety of arrangements of components region can be peeled really and steadily between screening glass 61 and coldplate 63.By This, can inhibit electronic component 60 and peel off and fall off from screening glass 61.
In addition, plate releasing portion 4 is in 41 side of top, i.e., across screening glass 61 and 63 opposite side of coldplate, have with protection The flat surface 412 at the isolated top 41 of piece 61.In a period of arrangements of components region 615 is pressurized, this flat surface 412 is first pressed The swells in arrangements of components region 615.Arrangements of components region 615 is and then flat as a result, can more reliably prevent electronic component 60 It peels off.In addition, this flat surface 412 also stops electronic component 60, therefore can further press down just in case arrangements of components region 615 is takeoff Electronic component 60 processed is peeled off and is fallen off from screening glass 61.
In addition, there is plate releasing portion 4 negative pressure for generating negative pressure in the mode opposite with screening glass 61 to generate hole.As one Example is provided with the airport 413 for generating negative pressure on the flat surface 412 at top 41.As utilization airport 632 is for zero Part arranges the pressurization in region 615, this airport 413 attracts screening glass 61.Therefore, it can help for arrangements of components region 615 It pressurizes and peels screening glass 61 from coldplate 63, and be difficult to generate removing fault.
In addition, plate releasing portion 4 includes push rod 43.This push rod 43 has left from coldplate 63 in arrangements of components region 615 Afterwards, advance in coldplate 63, push up the position that frame 62 etc. is pressed towards the direction left from coldplate 63.By This can peel 61 entirety of screening glass after having peeled arrangements of components region 615.In addition, the fixation by top 41 as an example Portion is when releasing pressing, as long as separating from screening glass 61 with the advance of push rod 43.
In addition, as long as the motion mechanism of the motion mechanism at top 41, the motion mechanism of grip block 44 and push rod 43 is using public The mechanism known, the present invention are not limited by the mechanism of mechanism.
For example, be connected on top 41 make axis from top 41 towards ball screw extended on the direction of mounting table 42, And from top 41 towards railing guide extended on the direction of mounting table 42.In the case, top 41 is according to screw shaft Direction of rotation is moved along guide rail towards mounting table 42.Ball screw and railing guide are with top 41 close to mounting table 42 to zero Mode until the distance of the thickness H1 of the frame 62 of part board mounting 68 extends.
In addition, in the more lateral of grip block 44, first make the periphery of oval cam for a pair of of grip block 44 individually It abuts.Cam is supported on the shaft on rotation motor, can be rotated in a circumferential direction.If rotation motor is driven, cam is rotated, The bulge of cam knocks grip block 44, then grip block 44 is pushed towards the direction of coldplate 63, and clamps coldplate 63.
In addition, the rear end of push rod 43 becomes cam follower.Cam follower is enterprising in the periphery of oval cam Row is driven.Cam is supported on the shaft on rotation motor, can be rotated in a circumferential direction.If rotation motor is driven, cam is revolved Turn, then cam follower rises the bulge of cam, and push rod 43 is pushed upwardly.
In addition, this plate releasing portion 4 generates positive pressure in mounting table 42 by making and removes screening glass 61 from coldplate 63.Top The flat surface 412 in portion 41, which has, makes the screening glass 61 removed follow flat additional function, in addition, the flat surface at top 41 The airport 413 of 412 upper openings also has the additional function for helping the pressurization using mounting table 42.Therefore, as shown in figure 14, push up Portion 41 also can have the square tube shape for being connected to open edge on frame 62, and omit flat surface 412.In addition, such as Figure 15 It is shown, airport 413 can also be omitted from the flat surface 412 at top 41.
(lift-off processing portion)
Finally, being illustrated to the lift-off processing portion 5 for undertaking part strip step.Figure 16 indicates lift-off processing portion 5 The schematic diagram of structure.The part for having unloaded coldplate 63 via plate releasing portion 4 has been embedded to piece 67 and has put into lift-off processing portion 5 In, as terminal stage, each electronic component 60 is removed from screening glass 61.In addition, lift-off processing portion 5 is from film formation device In the case where being separated in 7, otherwise referred to as lift-off processing device.
As shown in figure 16, this lift-off processing portion 5 includes: mounting table 51, and mounting part has been embedded to piece 67；Collet 52 is held Screening glass 61 simultaneously continuously moves；Guide portion 53 tangles the end of screening glass 61 to produce collet 52 and hold screening glass 61 Chance；Sheet material retainer 54 manufactures the removing basic point of screening glass；And part retainer 55, prevent the floating of electronic component 60.
The flat surface 511 that there is mounting table 51 mounting part to be embedded to piece 67.Part, which has been embedded to piece 67, makes electronic component 60 Towards this flat surface 511, the top surface 603 of electronic component 60 is made to contact mounting surface, and makes screening glass 61 on to load.Flat surface 511 include the anti-slip component with adhesion strength, and the obstruction of electronic component 60 is promoted.In addition, the outer region of flat surface 511 with The height H1 until from the surface in arrangements of components region 615 to the end face of frame 62 is equivalent to subtract from arrangements of components region 615 Surface to the top surface of electronic component 60 603 until the depth of the resulting height of height H2 dug one section downwards so that frame Frame 62 enters, and in the state that screening glass 61 remains flat, electronic component 60 is positioned on flat surface 511.
This mounting table 51 is the block with inner space 512.On the flat surface 511 of mounting table 51, arranged with part Multiple airports 513 have been provided in the opposite region of column region 615.The inner space 512 of airport 513 and mounting table 51 connects It is logical.In the inner space of mounting table 51 512, air pressure supply hole 514 has been provided on the position different from flat surface 511.Gas Pressure supply hole 514 is connect with the pneumatic circuit 75 comprising compressor, negative pressure feeding pipe etc. outside figure.Therefore, it is supplied by air pressure Hole 514 and inner space 512, and negative pressure is generated in airport 513.
Collet 52 is a pair of of the block for keeping gripping surface opposite.The accessible separation of a pair of of block.This collet 52 is by level Movable mobile device support on direction and vertical direction, along the screening glass 61 on the flat surface 511 for being placed on mounting table 51, It is continuously moved relative to flat surface 511 with 45 degree of the angle of attack.That is, 52 one side of collet is indulged on the flat surface 511 of mounting table 51 Offset is dynamic, leaves from mounting table 51 on one side.So-called continuous movement refers to and does not include stopping on the way, it is generally desirable to constant Speed is moved.Phase of the moving range of collet 52 from the end of the screening glass 61 of the chance for having produced gripping so far end Until opposite ends.
Sheet material retainer 54 is the cylindrical shape with the long axis on one side of cross-section screening glass 61, and can carry out axis rotation Roller.This sheet material retainer 54 can be formed by metals such as stainless steels.In addition, cross-section screening glass 61 length be 200mm~ In the case where 300mm or so, the diameter of sheet material retainer 54 can be set to the mm of 5mm~more than ten.In the present embodiment, it is set as straight The cylinder of the stainless steel of diameter 6mm.
This sheet material retainer 54 keeps height fixed on the basis of the flat surface 511 of mounting table 51, is maintaining collet 52 just It is dynamic to indulge offset along the direction orthogonal with long axis on the screening glass 61 being positioned in mounting table 51 for lower section.Sheet material retainer 54 That height is arranged is consistent with making electronic component 60 in addition to electrode 602 with screening glass 61 merge resulting height.That is, sheet material stops Dynamic portion 54 is moved when pressing the non-adhesive face 612 of screening glass 61.By the degree of pressing be set as not lesion electrode 602 or It does not rub and electrode 602 or does not crush the degree of electrode 602.The moving range of sheet material retainer 54 be by the edge of guide portion 53, That is the edge of the guide portion insertion hole 621 of frame 62 is set as basic point, until the opposite end of screening glass 61.
Part retainer 55 is the circle with the long axis of 615 whole region of at least arrangements of components region of cross-section screening glass 61 Cylindrical shape, and the roller of axis rotation can be carried out.Part retainer 55 can be formed by metals such as stainless steels.Part retainer 55 it is straight As long as diameter considers that the diameter of sheet material retainer 54 and the size of electronic component 60 determine, if but be set to than sheet material stop The small diameter in portion 54 can then be configured closer to sheet material retainer 54.In the present embodiment, diameter and sheet material retainer are set as The cylinder of 54 identical stainless steels.
This part retainer 55 in such a way that sheet material retainer 54 is close and separates can configure.Stop in collet 52 with sheet material Dynamic portion 54 indulged in mounting table 51 offset it is dynamic in a period of, part retainer 55 relative to sheet material retainer 54 be kept fixed away from From following.Length (the movement of part retainer 55 of the less than electronic component 60 being pasted on screening glass 61 of fixed distance Length on direction).When collet 52 and sheet material retainer 54 are located at the end of mounting table 51, part retainer 55 with relative to Sheet material retainer 54 is kept at a distance across the mode that guide portion insertion hole 621 is located at opposite bank.
Guide portion 53 configures on making axis position identical with the axis of guide portion insertion hole 621 of frame 62.Guide portion 53 Front end face to the guide portion insertion hole 621 of frame 62.This guide portion 53 is movable in axial direction, prominent towards the end of screening glass 61 Out, and towards collet 52 end for pushing up screening glass 61 upwards, before the end of screening glass 61 reaches collet 52, in drawing for frame 62 It leads in portion's insertion hole 621 and advances.This guide portion 53 passes through upper top peeling on one side by screening glass 61.Therefore, this guide portion is inserted Through-hole 621 has pin-shaped shape, is arranged along one side of screening glass 61 at multiple positions.
For example, as shown in figure 17, the position that provides of guide portion insertion hole 621 is set as the center across one side of frame 62 And equally spaced position.It is corresponding with this guide portion insertion hole 621 that guide portion 53 is set, in addition, guide portion 53 is formed as Pole shape.It is moved moreover, collet 52 is made to indulge offset on the direction orthogonal with one side of this frame 62 with sheet material retainer 54, and from Electronic component 60 is removed on screening glass 61.
(a) to (f) in Figure 18 indicates the process of the movement in such lift-off processing portion 5.(a) to (f) in Figure 18 is to show Indicate to meaning property the transition figure of the state of lift-off processing portion 5 in each step.Firstly, making electricity as shown in (a) in Figure 18 In the state that the top surface 603 of sub- part 60 contacts flat surface 511, part piece 67 is embedded to and has been positioned in mounting table 51.That is, Between plate releasing portion 4 and lift-off processing portion 5, being provided with has buried the part separated from coldplate 63 in plate releasing portion 4 Enter the inversion set that piece 67 inverts upside down, and part has been embedded to piece 67 and has been positioned in mounting table 51 in the state of being inverted On.Make to generate negative pressure in the airport 513 of mounting table 51, and electronic component 60 is first sucked on flat surface 511.Make sheet material stop Until portion 54 is moved to the edge of guide portion insertion hole 621 of frame 62, in addition, collet 52 is first made to be located at the guide portion of frame 62 The surface of insertion hole 621.Part retainer 55 first spaces out relative to sheet material retainer 54, and first makes part retainer 55 Positioned at 621 more lateral of guide portion insertion hole than frame 62.
As shown in (b) in Figure 18, make guide portion 53 towards movement on the upside of axis direction.Guide portion of the guide portion 53 in frame 62 It is moved in insertion hole 621, and reaches the end for the screening glass 61 being pasted on frame 62.Guide portion 53 is advanced further, and makes to protect The end of bluff piece 61 is prominent towards the direction left from frame 62.The end of screening glass 61 starts to shell because of guide portion 53 as a result, It falls.If guide portion 53 further moves ahead, the end of screening glass 61 is clamped by guide portion 53 and sheet material retainer 54, and by towards folder First 52 guidance.In addition, collet 52 can also be towards screening glass 61 when utilizing guide portion 53 to guide the end of screening glass 61 End is mobile, and meets the end of screening glass 61.
As shown in (c) in Figure 18, if the end of screening glass 61 reaches in collet 52, a pair of of block is closed, is passed through Collet 52 holds the end of screening glass 61.If collet 52 holds the end of screening glass 61, as shown in (d) in Figure 18, make Guide portion 53 it is mobile to make part retainer 55, and make part retainer 55 towards after burying in the guide portion insertion hole 621 of frame 62 With sheet material retainer 54 close to until at a distance from the length of less than electronic component 60.
As shown in (e) in Figure 18, move collet 52 along screening glass 61 with sheet material retainer 54, and collet 52 is hung It rises.The end of screening glass 61 is held by collet 52, in addition, sheet material retainer 54 moves on screening glass 61, therefore screening glass 61 It is that basic point is sling by collet 52 with sheet material retainer 54, electronic component 60 is that basic point is shelled from screening glass 61 with sheet material retainer 54 From.In the case where the screening glass 61 being stripped keeps plumbness to be removed, as long as such as the level of collet 52 is moved Velocity component that is dynamic and vertically moving remains identical.If move horizontally it is identical as the velocity component vertically moved, i.e., Just movement speed changes, as long as not stopping, removing will not stop and can be performed continuously, but move horizontally and vertically move Movement speed is advisable with maintaining into fixed speed.
At this point, as shown in figure 19, if the removing on the slave screening glass 61 of electronic component 60 carries out, and becoming only electronic component The state that 60 end is clamped by the flat surface 511 of sheet material retainer 54 and mounting table 51, then electronic component 60 will be to lift The mode of removing starting end 60a floats.But part retainer 55 follows sheet material retainer 54.The pressing of this part retainer 55 The side removing starting end 60a that will be floated.Therefore, the floating of electronic component 60 is prevented from, the electricity peeled off from screening glass 61 Gap 94 between pole 602 and screening glass 61 exists, and electronic component 60 will not adhere to again, and be maintained at mounting table 51 Flat surface 511 on.In turn, sheet material retainer 54 is due to being the roller that can carry out axis rotation, in the pressing of electronic component 60 Shi Jinhang rotation, the friction with electronic component 60 are inhibited.
In addition, sheet material retainer 54 is moved when pressing the non-adhesive face 612 of screening glass 61.Therefore, in electronics zero The removing of part 60 starts, and becomes the only end of electronic component 60 in stripping process by sheet material retainer 54 and mounting table 51 Before the state that flat surface 511 is clamped, anti-sheet material retainer 54 here also follows the screening glass 61 that electronic component 60 has been removed.But It is that for the viewpoint for making to produce the Function of basic point of removing using sheet material retainer 54, sheet material retainer 54 is not It must be moved when pressing the non-adhesive face 612 of screening glass 61.That is, also can be set to sheet material retainer 54 from screening glass It is moved on the position being slightly off on 61.
Moreover, as shown in (f) in Figure 18, when collet 52 and sheet material retainer 54 are by the arrangements of components area of screening glass 61 When domain 615 fully indulges disconnected, all electronic components 60 are removed from screening glass 61, and are arranged in the flat surface 511 of mounting table 51 On.By recycling this electronic component 60, and complete the formation of the electromagnetic shielding film 605 in film formation device 7.In addition, collet 52 is vertical disconnected by the flat surface 511 of mounting table 51, and the angle of attack left from mounting table 51 is not limited to 45 degree.Also it can be set to The position of collet 52 is fixed, and mounting table 51 continuously moves, and thus peels screening glass 61, also be can be set to collet 52 and is carried It is movable to set both platforms 51.That is, as long as collet 52 and mounting table 51 relatively carry out movement.
Herein, Figure 25 is the schematic diagram for indicating the structure of existing upper ejection device.Ejection device is from such as and screening glass on this The device of electronic component 60 is removed on the 61 identical adhesive films 9 like that with flexibility and adherence, including can be in axial direction Mobile shank 8.In the front end of shank 8, setting is pasted with the adhesive film 9 of electronic component 60.Shank 8 from electronic component 60 The top adhesive film 9 upwardly of adhesive face opposite side.Shank 8 is deformed into adhesive film 9 to be set as the electronic component 60 for removing object The mountain shape on vertex.Therefore, the adhered area of electronic component 60 and adhesive film 9 is reduced, and thus electronic component 60 is shelled from adhesive film 9 From.
Figure 26 is the schematic diagram indicated using the appearance of the removing of the electronic component 60 of ejection device on this.As shown in figure 26, Multiple electronic components 60 are arranged gap and are pasted on adhesive film 9.For the viewpoint of production efficiency, it is pasted on adhesive film 9 Electronic component 60 interval it is narrow.Therefore, if one electronic component 60 in top, the strain of adhesive film 9 also involve to phase upwards In the adhesive area of adjacent electronic component 60.Then, in a period of removing object by upward pushed up, in adjacent electronic component 60 In, a part is also removed from adhesive film 9 and generates removing position 91.But if the removing of removing object is completed, shank 8 It retreats in axial direction, therefore the flexure of adhesive film 9 is eliminated.Then, adhesive film 9 is attached to again on removing position 91, Attachment area 92 again of adhesive film 9 are generated in electronic component 60.
Then, Figure 27 is the photo for indicating the appearance of the electrode 602 after adhesive film 9 is attached to again on electronic component 60, As shown in figure 27, if adhesive film 9 adheres to again, the residue 93 of adhesive film 9 is generated in electrode 602 sometimes.Adhesive film 9 it is residual Slag 93 sometimes the reflow welding when being packaged to electronic component 60 (reflow) when burning and be carbonized, exist and cause bad connection Deng worry.
On the other hand, Figure 20 is after being removed electronic component 60 from screening glass 61 by lift-off processing portion 5 to electrode 602 carry out resulting photo of photographing.According to this lift-off processing portion 5, the flatness of screening glass 61 is begun by sheet material retainer 54 It is maintained eventually, screening glass 61 can prevent screening glass 61 to be back on electronic component 60 and adhere to again once removing.In addition, The position of electronic component 60 is fixed by part retainer 55 and the airport of mounting table 51 513, is also possible to prevent as catching up with Screening glass 61 and adhere to such float again.As a result, as shown in figure 20, not seeing guarantor on the electrode 602 of electronic component 60 The residue of bluff piece 61.
In this way, this lift-off processing portion 5 is by electronic component 60 from screening glass 61 after the film forming using film process portion 3 It peels.Fixed part of this lift-off processing portion 5 including mounting table 51, the position of collet 52 and fixed electronic component 60.Mounting table 51 Support the electronic component 60 being secured on screening glass 61.Collet 52 holds the end of screening glass 61, relative to mounting table 51 It makes a relative move, and is carried out continuously removing towards the opposite end of this end.When removing electronic component 60 from screening glass 61, Gu Determine portion to fix the position of electronic component 60.The case where electronic component 60 and screening glass 61 adhere to again Yi Dan peeled off as a result, It disappears, can inhibit the residue 93 for generating screening glass 61 in electronic component 60.
Fixed part be, for example, part retainer 55 or provide airport 513 mounting table 51 flat surface 511.Part Retainer 55 keeps the distance of length of less than electronic component 60 to follow relative to sheet material retainer 54, and pins electronic component 60 floating.Mounting table 51 adsorbs electronic component 60 and pins floating.But as long as mounting table 51 has the function as fixed part Can, then it can not also use the attraction using airport 513., can also for example, as long as mounting table 51 can fix electronic component 60 To be adhesion collet, electrostatic chuck or mechanical chuck.
In addition, including towards the end of screening glass 61 guide portion 53 outstanding.Collet 52 hold screening glass 61 end it Before, first it is located at the protrusion destination of guide portion 53.Moreover, this guide portion 53 guides screening glass 61 towards collet 52, towards collet 52 End.The chance that collet 52 is held can be produced as a result, can make the removing fault of electronic component 60 and screening glass 61 Possibility decline.
In addition, including the sheet material retainer 54 for being moved together along screening glass 61 with collet 52, and manufacturing the basic point of removing. Moreover, this sheet material retainer 54 is located near the protrusion destination of guide portion 53, guide portion 53 has been clamped together with guide portion 53 The end of the screening glass 61 peeled, and guided towards collet 52.Collet 52 can more reliably hold the end of screening glass 61 as a result, A possibility that removing of electronic component 60 and screening glass 61 can be made to make mistakes decline.
In addition, sheet material retainer 54 is by taking the cylinder with the axis orthogonal with the moving direction of this sheet material retainer 54 as an example It is illustrated, but as long as can move when pressing screening glass 61, is also possible to plate body or block.In addition, closing In part retainer 55, also said by taking the cylinder with the axis orthogonal with the moving direction of this part retainer 55 as an example It is bright but it is also possible to be plate body, block or brush.In the case where part retainer 55 is cylinder, due to being that can carry out axis The roller of rotation, therefore rotated in the pressing of electronic component 60, the friction with electronic component 60 is inhibited.
The motion mechanism of collet 52, the motion mechanism of sheet material retainer 54, the motion mechanism of part retainer 55 and guidance As long as the motion mechanism in portion 53 is not limited using well known mechanism, the present invention by the mechanism of mechanism.
For example, motion mechanism below can be used in collet 52.That is, two blocks are supported by pedestal, the block phase of side It is motionless that position is become for pedestal.The block of the other side becomes movable relative to the block of side.Oval cam is connected to change At the outside of movable block.If rotating this cam, block is overhang within the scope of major diameter, then becomes movable block by cam It pins and close to motionless block.In addition, compressed spring is arranged between a pair of of block, towards the direction at the interval for expanding a pair of of block Force.If rotating this cam, block is overhang within the scope of minor axis, then the power that the block for becoming movable is applied by compressed spring And it is left from motionless block.
In addition, for example be arranged relative to mounting table 51 flat surface 511 with the extended ball screw of 45 degree of angle with lead Rail, the pedestal of collet 52 is fixed on the saddle of this ball screw, in addition, holding guide rail.If the screw shaft of ball screw passes through Motor and carry out axis rotation, then until collet 52 is moved to the other end from one end of mounting table 51 along guide rail.
In turn, about part retainer 55, make extension spring between support part retainer 55 and sheet material retainer 54 Between pedestal, towards the direction force for keeping part retainer 55 close with sheet material retainer 54, and in support part retainer 55 and piece Elliptoid cam is configured between the pedestal of material retainer 54, in the state that the major diameter range of cam is connected on pedestal, is resisted Power that extension spring is applied and exert a force towards the direction for keeping part retainer 55 isolated with sheet material retainer 54.
In addition, the rear end of guide portion 53 becomes cam follower.Cam follower is on the periphery of oval cam It carries out driven.Cam is supported on the shaft on rotation motor, can be rotated in a circumferential direction.If rotation motor is driven, cam is carried out Rotation, then cam follower rises the bulge of cam, and guide portion 53 is pushed upwardly.
In addition, the position that provides of guide portion insertion hole 621 is set as dividing at equal intervals across the center on one side of frame 62 From position.It is easy integrally to peel the side of screening glass 61 as a result,.It is with this guide portion insertion hole 621 corresponding that guide portion is set 53, in addition, guide portion 53 is formed as pole shape.Moreover, make collet 52 and sheet material retainer 54 with one side of this frame 62 just It indulges and breaks on the direction of friendship, and remove electronic component 60 from screening glass 61.It's not limited to that in lift-off processing portion 5, can be used each The guide portion insertion hole and guide portion of kind shape, in addition, peeling direction can also use various directions.
For example, as shown in figure 21, can be used one side along frame 62 front end have long angle circle it is rectangular-shaped, oval, The guide portion 53 of the sections such as rectangle.According to this guide portion 53, the range outstanding of screening glass 61 is made to become larger, therefore screening glass 61 is easy It rolls, the end of screening glass 61 is accessible in collet 52.In addition, as shown in figure 22, can also be formed in frame 62 and include The notch 622 of the configuring area of guide portion 53 replaces guide portion insertion hole 621.In turn, as shown in figure 23, it can also will guide The configuration of portion's insertion hole 621 makes collet 52 and sheet material in the corner of frame 62, using the corner of this frame 62 as removing starting point Retainer 54 is removed towards diagonal movement along the diagonal line of screening glass 61.
(other embodiments)
The present invention is not limited to the embodiments, also include following form.That is, as shown in figure 24, film formation device 7 It can also in turn include the transfer portion 71 for undertaking part mounting step.Part mounting step is undertaken in transfer portion 71, by electronic component 60 do not load towards part from the pallet for being placed with the electronic component before film process 60 and shift on piece 65.As long as example, by pallet 65 arranged adjacent of piece is not loaded with part, and transfer portion 71 is set as can be in the range of not loading piece 65 comprising pallet and part Mobile robot in length and breadth.Such as vacuum collet is first equipped in the arm front end of robot.Transfer portion 71 makes to produce on pallet Negative pressure is given birth to keep electronic component 60, and is not loaded in part and releases negative pressure in vacuum breaking or atmosphere opening etc. on piece 65, And electronic component 60 is arranged in part and is not loaded on piece 65.
In addition, though film formation device 7 is set as to include embedment processing unit 1, plate mounting portion 2, film process portion 3, plate releasing The device in portion 4 and lift-off processing portion 5, but can also be constituted using each portion as independent device, and carry out systematization. That is, embedment processing unit 1 is also possible to independent embedment processing unit, plate mounting portion 2 is also possible to independent board mounting assembly, at Film process portion 3 is also possible to independent film process device, and plate releasing portion 4 is also possible to independent plate and releases device, at removing Reason portion 5 is also possible to independent lift-off processing device.
In addition, in said embodiment, it will be until from the surface in arrangements of components region 615 to the upper surface of frame 62 Height H1 is set as than the height H2 high person until from the surface in arrangements of components region 615 to the top surface of electronic component 60, but not It is defined in this, it can also be lower than height H2.In the case, as long as by the flat surface 112, flat at top 11, top 21, top 41 The region opposite with arrangements of components region 615 on smooth face 212, flat surface 412 is formed as only be recessed permissible height H1 and height The recess portion of the amount of the difference of H2 is spent, and confined space 14, confined space 24a, confined space 45 can be formed.
More than, the variation of embodiments of the present invention and each portion is illustrated, but the embodiment or each portion Variation be as an example come the person of prompt, it is not intended to limit the range of invention.These described new embodiments can be with Other various forms are implemented, and can carry out various omissions, substitutions and changes without departing from the spirit of the invention.These realities It applies mode or its deformation is included in the range or purport of invention, and include the invention recorded in the scope of the claims In.

Claims (6)

1. a kind of film formation device has been secured on the bonding plane of screening glass for the electrode exposed surface for being formed with electrode The film formation device of electronic component characterized by comprising
It is embedded to processing unit, the electrode of the electronic component is embedded in the bonding plane of the screening glass；And
Film process portion has been embedded in the electronic component in the screening glass for the electrode, filmogen is made to form a film；
The embedment processing unit includes
Flat surface is located at across the electronic component and the screening glass opposite side, and opposite with the electronic component；
Relief portion at least depressurizes the space between the screening glass and the flat surface；And
Pressure adjustment unit is adjusted to across the screening glass and the pressure in the space of the flat surface opposite side；
Wherein, the pressure adjustment unit is behind the decompression using the space of the relief portion, and the decompression is maintained In the state of, make the pressure in the space of the opposite side relatively than the space between the screening glass and the flat surface Pressure it is big, and press the electronic component mutually with the screening glass flat surface.
2. film formation device according to claim 1, which is characterized in that
The embedment processing unit includes
Mounting surface is located at across the screening glass and the flat surface opposite side；And
Surface side airport is loaded, generates negative pressure in the mounting surface upper opening, and before the decompression using the relief portion, is come Separate the screening glass from the flat surface.
3. film formation device according to claim 2, which is characterized in that
The pressure adjustment unit includes mounting surface side airport,
The mounting surface side airport is behind the decompression using the space of the relief portion, and described depressurize is maintained Under state, it is transformed into generation positive pressure, thus the electronic component stopped by the flat surface is assigned and presses the screening glass Power.
4. film formation device according to any one of claim 1 to 3, which is characterized in that
The embedment processing unit has flat surface side airport,
The flat surface side airport as the relief portion, or be different from the relief portion and in the flat surface upper opening, Be adsorbed on negative pressure generation the electronic component on the flat surface, and attracts the screening glass towards the flat surface.
5. a kind of film formation device has been secured on the bonding plane of screening glass for the electrode exposed surface for being formed with electrode The film formation device of electronic component characterized by comprising
It is embedded to processing unit, the electrode of the electronic component is embedded in the bonding plane of the screening glass；
The screening glass is pasted on coldplate by plate mounting portion, and the coldplate is in the area comprising arranging the electronic component The airport through table back is provided in the range of domain；
Film process portion makes into membrane material for the electronic component for the screening glass being secured on the coldplate Material film forming；
Plate releasing portion releases the contiguity of the coldplate Yu the screening glass behind the film process portion；And
Lift-off processing portion peels the electronic component from the screening glass that the contiguity with the coldplate has been released from；
The embedment processing unit includes
Flat surface is located at across the electronic component and the screening glass opposite side, and opposite with the electronic component；
First relief portion at least depressurizes the space between the screening glass and the flat surface；And
Pressure adjustment unit is adjusted to across the screening glass and the pressure in the space of the flat surface opposite side；
Wherein, the pressure adjustment unit and described is depressurized behind the decompression using the space of first relief portion To in the state of maintenance, make the pressure in the space across the screening glass Yu the flat surface opposite side relatively than the protection The pressure in the space between piece and the flat surface is big, and the flat surface is made the electronic component and institute as brake Screening glass is stated mutually to press；
The plate mounting portion includes between region and the coldplate to the arrangement electronic component in the screening glass The second relief portion that space is depressurized, and
After the decompression using second relief portion, press the screening glass mutually with the coldplate；
The plate releasing portion includes
Positive pressure generates hole, makes to generate positive pressure in the airport of the coldplate；And
Fixed part pressurizes to the region of the arrangement electronic component in the screening glass generating hole by the positive pressure In a period of, the position being detached from from the region for arranging the electronic component in the screening glass is first pressed, described in arrangement After the region of electronic component is left from the coldplate, the pressing is released；
The lift-off processing portion includes
Mounting portion supports the electronic component being secured on the screening glass；
Collet holds the end of the screening glass, relatively moves relative to the mounting portion, and towards the opposite end of the end It is carried out continuously removing；And
Fixed part, when the electronic component is removed from the screening glass, the position of the fixed electronic component.
6. a kind of embedment processing unit is the bonding plane for being secured at screening glass for the electrode exposed surface for being formed with electrode On electronic component, the embedment processing unit electrode of the electronic component being embedded in the bonding plane of the screening glass is special Sign is, comprising:
Flat surface is located at across the electronic component and the screening glass opposite side, and opposite with the electronic component；
Relief portion at least depressurizes the space between the screening glass and the flat surface；And
Pressure adjustment unit is adjusted to across the screening glass and the pressure in the space of the flat surface opposite side；
Wherein, the pressure adjustment unit is behind the decompression using the space of the relief portion, and the decompression is maintained In the state of, make the pressure in the space of the opposite side relatively than the space between the screening glass and the flat surface Pressure it is big, and press the electronic component mutually with the screening glass flat surface.
CN201811344888.5A 2017-11-15 2018-11-13 Film formation device and embedment processing unit Pending CN109778124A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111459328A (en) * 2020-03-30 2020-07-28 深圳市华星光电半导体显示技术有限公司 Cover plate attaching system, cover plate attaching method and touch display panel
CN112575297A (en) * 2019-09-27 2021-03-30 芝浦机械电子装置株式会社 Film forming apparatus and embedding processing apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112447475B (en) * 2019-09-05 2023-09-29 中微半导体设备(上海)股份有限公司 Plasma processing device with flexible dielectric sheet

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102005395A (en) * 2009-08-31 2011-04-06 日立设备工程股份有限公司 Vacuum mounting method and device
JP2017054891A (en) * 2015-09-08 2017-03-16 三井化学東セロ株式会社 Film for manufacturing electronic component, electronic component and manufacturing method for the same
CN109763105A (en) * 2017-11-10 2019-05-17 芝浦机械电子装置株式会社 Film formation device and part stripping off device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697268A (en) 1992-09-11 1994-04-08 Nitto Denko Corp Sticking device for adhesive tape on wafer
JP4559122B2 (en) 2004-05-25 2010-10-06 有限会社都波岐精工 Tape bonding apparatus and tape bonding method
JP4841355B2 (en) * 2006-08-08 2011-12-21 日東電工株式会社 Method for holding semiconductor wafer
JP4733069B2 (en) 2007-05-22 2011-07-27 リンテック株式会社 Sheet sticking device and sticking method
JP4723614B2 (en) * 2008-06-06 2011-07-13 リンテック株式会社 Sheet sticking device and sticking method
US8724288B2 (en) * 2008-08-27 2014-05-13 Ulvac, Inc. Electrostatic chuck and vacuum processing apparatus
JP2011071472A (en) * 2009-08-31 2011-04-07 Hitachi Setsubi Eng Co Ltd Vacuum sticking method and apparatus
KR101692126B1 (en) * 2009-12-18 2017-01-02 미쓰비시 타나베 파마 코퍼레이션 Novel antiplatelet agent
JP2013035819A (en) 2011-08-09 2013-02-21 Norimichi Kawashima Drug and method for using the same
US20180274085A1 (en) 2015-09-02 2018-09-27 Ulvac, Inc. Workpiece holding body and film-forming apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102005395A (en) * 2009-08-31 2011-04-06 日立设备工程股份有限公司 Vacuum mounting method and device
JP2017054891A (en) * 2015-09-08 2017-03-16 三井化学東セロ株式会社 Film for manufacturing electronic component, electronic component and manufacturing method for the same
CN109763105A (en) * 2017-11-10 2019-05-17 芝浦机械电子装置株式会社 Film formation device and part stripping off device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112575297A (en) * 2019-09-27 2021-03-30 芝浦机械电子装置株式会社 Film forming apparatus and embedding processing apparatus
CN112575297B (en) * 2019-09-27 2023-02-24 芝浦机械电子装置株式会社 Film forming apparatus and embedding processing apparatus
CN111459328A (en) * 2020-03-30 2020-07-28 深圳市华星光电半导体显示技术有限公司 Cover plate attaching system, cover plate attaching method and touch display panel

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JP7051379B2 (en) 2022-04-11
TWI669406B (en) 2019-08-21

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