JP6554369B2 - Support apparatus and support method - Google Patents

Description

  The present invention relates to a support device and a support method.

  DESCRIPTION OF RELATED ART Conventionally, when sticking an adhesive sheet to a to-be-adhered body, the supporting apparatus which supports the said adhesive sheet and a to-be-adhered body in the state which made the adhesive sheet separate from a to-be-adhered body is known. .

JP 2014-27081 A

  However, in the conventional supporting device as described in Patent Document 1, the adhesive sheet is separated from the adherend too much before pressing the adhesive sheet to the adherend, and extra tension is applied to the adhesive sheet. There is a disadvantage that the adhesive sheet is attached to the adherend, or a wrinkle is formed on the adhesive sheet and the adhesive sheet is attached to the adherend.

  An object of the present invention is a supporting device and a supporting method capable of preventing an adhesive sheet from being applied with excessive tension and being attached to an adherend, and preventing an adhesive sheet from being formed with wrinkles and being attached to an adherend It is to provide.

  The support device according to the present invention includes a sheet support means for supporting an outer edge portion of an adhesive sheet, an adherend support means for supporting an adherend, and a member including at least the adhesive sheet and the sheet support means. Sealed space forming means capable of forming a sealed space surrounding an adherend supported by a support means, fluid supply means for supplying a fluid to the sealed space, and the adhesive sheet being the adherend by the supplied fluid And a regulating means for regulating separation from a predetermined distance from a predetermined distance.

In the support device of the present invention, the restriction means includes an abutting member capable of coming into contact with the adhesive sheet, and a temperature control means for heating or cooling the adhesive sheet via the abutting member. preferable.
In the supporting device of the present invention, the restricting means is provided so as to be movable relative to the contact sheet in the surface direction with respect to the contact sheet capable of contacting the adhesive sheet and the adhesive sheet, It is preferable to provide a circulation means.

  The supporting method of the present invention includes a step of supporting the outer edge portion of the adhesive sheet by the sheet supporting means, a step of supporting the adherend by the adherend supporting means, and a member including at least the adhesive sheet and the sheet supporting means. The step of forming a sealed space surrounding the adherend supported by the adherend support means, the step of supplying a fluid to the sealed space, and the adhesive sheet from the adherend by the supplied fluid And d) regulating the separation from the distance.

  According to the present invention as described above, since the adhesive sheet is restricted from being separated from the adherend by a predetermined distance, it is possible to prevent the adhesive sheet from being too far from the adherend. It is possible to prevent excessive tension from being applied to the adhesive sheet and attached to the adherend, or wrinkles formed on the adhesive sheet and attached to the adherend.

Moreover, if a temperature control means is provided, the temperature of the said adhesive sheet can be adjusted so that an adhesive sheet can be affixed on a to-be-adhered body favorably.
Further, by providing the control means with the circulation means, it is possible to prevent the adhesive sheet from being rubbed by the contact member when the contact member is moved relative to the adhesive sheet.

BRIEF DESCRIPTION OF THE DRAWINGS The side view of the sheet sticking apparatus which concerns on one Embodiment of this invention. Operation | movement explanatory drawing of a sheet sticking apparatus. The side view of the sheet sticking apparatus concerning the modification of the present invention.

Hereinafter, an embodiment of the present invention will be described based on the drawings.
In the present embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. To do. Furthermore, in the present embodiment, when the direction is indicated on the basis of a front direction in FIG. 1 parallel to the Y axis, “upper” is the arrow direction of the Z axis, “lower” is the opposite direction, “Left” is the arrow direction of the X axis, “right” is the opposite direction, and “front” is the front direction in FIG. 1 parallel to the Y axis, “rear” is the opposite direction.

  In FIG. 1, a sheet sticking apparatus 10 includes a sheet support means 20 for supporting an outer edge portion of an adhesive sheet AS, and an adherend for supporting a semiconductor wafer (hereinafter may be simply referred to as a "wafer") WF as an adherend. Sealed space forming means 40 capable of forming a sealed space SP surrounding the wafer WF supported by the adherend support means 30 by a member including the body support means 30, at least the adhesive sheet AS and the sheet support means 20; Fluid supply means 50 for supplying gas as a fluid to the substrate, restricting means 60 for restricting the adhesion sheet AS to be separated from the wafer WF by a supplied fluid by a predetermined distance, and adhesion controlled by the restriction means 60 A pressing means 70 for pressing and sticking the sheet AS to the wafer WF, a pressure sensor for detecting the pressure of the sealed space SP, and a pressure detecting means 80 such as a load cell It is provided. In the adhesive sheet AS, the adhesive surface AS1 is attached to the ring frame RF in advance so as to close the opening of the ring frame RF as a frame member. Further, the support device 10A of the present invention includes a sheet support means 20, an adherend support means 30, a sealed space forming means 40, a fluid supply means 50, a regulating means 60, and a pressure detection means 80. The

  The sheet support means 20 includes an outer table 21 that is formed in an annular shape and has a support surface 21A that can hold the ring frame RF by suction using pressure reduction means (not shown) such as a pressure reduction pump or a vacuum ejector.

  The adherend support means 30 includes an inner table 32 supported by an output shaft 31A of a linear motor 31 as a drive device. The inner table 32 includes a support surface 32A capable of attracting and holding the wafer WF by a decompression unit (not shown) such as a decompression pump or a vacuum ejector, and a recess 32C recessed from the lower surface 32B.

  The closed space forming means 40 is supported by the lower case 41 having the recess 41A in which the inner table 32 is disposed, the upper surface of the recess 32C and the upper surface of the recess 41A, and biases the lower case 41 toward the inner table 32 side. A coil spring 42 as biasing means, a rubber packing 43 as sealing means for preventing fluid from leaking between the outer table 21 and the lower case 41, a fluid from between the output shaft 31A and the lower case 41 And a rubber packing 44 as a sealing means for preventing leakage.

  The fluid supply means 50 is connected to the sealed space SP via a pipe 51A connected to the outer table 21 and supplies pressure to the sealed space SP with pressure means 51 such as a pressure pump or a turbine, and a pressure reducing pump or release A pressure reducing means (not shown) such as a valve is provided.

  The restricting means 60 is supported by a linear motion motor 62 as a driving device supported by the slider 61A of the linear motor 61 as a driving device and an output shaft 62A of the linear motion motor 62 and can be in contact with the adhesive sheet AS. A contact member 63, a coil heater provided inside the contact member 63 for heating the adhesive sheet AS via the contact member 63, an infrared heater, and a temperature control means 64 such as the heating side of a heat pipe Yes.

  The pressing means 70 includes a bracket 73 supported by the output shaft 72A of the linear motion motor 72 as a drive device supported by the contact member 63 via the bracket 71, and a pressing member rotatably supported by the bracket 73. The pressing roller 74 is provided.

In the sheet sticking apparatus 10 described above, a procedure for sticking the adhesive sheet AS to the wafer WF will be described.
First, with respect to the sheet sticking apparatus 10 in the state shown by the solid line in FIG. 1 in which each member is arranged at the initial position, a transfer means (not shown) such as an operator or an articulated robot is placed on the support surface 32A. Then, the adherend support means 30 drives a decompression means (not shown), and holds and holds the wafer WF by the support surface 32A. Then, when the conveyance means (not shown) places the ring frame RF at a predetermined position on the support surface 21A with the adhesive sheet AS upward, the sheet support means 20 drives the decompression means (not shown), and the ring frame RF is supported by the support surface 21A. Adsorb and hold. Next, the restricting means 60 drives the linear motion motor 62 to lower the contact member 63 to a predetermined position above the adhesive sheet AS, as shown by the two-dot chain line in FIG.

  Next, when the adherend support means 30 drives the linear motion motor 31 and raises the inner table 32 to the closed space forming position shown by the two-dot chain line in FIG. 1, the lower case 41 connected by the coil spring 42. At the same time, the rubber packing 43 first abuts on the lower surface of the outer table 21 and the inner table 32 ascends by a predetermined amount even after the abutment. Thus, the lower case 41 is urged upward by the inner table 32 rising by a predetermined amount via the coil spring 42, and the rubber packing 43 is crushed by a predetermined amount to form the sealed space SP. In this case, the sealed space SP is formed by the adhesive sheet AS, the ring frame RF, the sheet support means 20 and the sealed space forming means 40. At this time, the distance between the upper surface of the wafer WF and the adhesive surface AS1 of the adhesive sheet AS is maintained without contact. Next, when the fluid supply means 50 drives the pressurizing means 51 to supply gas to the enclosed space SP, the inside of the enclosed space SP is pressurized, and as shown in FIG. The adhesive sheet AS is regulated so as not to swell any more by contacting the lower surface. Next, the adherend support means 30 drives the linear motion motor 31, and as shown in FIG. 2, the inner table 32 is raised until the upper surface of the wafer WF is flush with the upper surface of the ring frame RF. Then, the control means 60 drives the temperature control means 64 to heat the adhesive sheet AS, and the pressing means 70 drives the linear motion motor 72, and as shown by the solid line in FIG. And at least one of the ring frame RF.

  Thereafter, the restricting means 60 drives the linear motor 61 to move the pressing roller 74 to the left as indicated by the two-dot chain line in FIG. As a result, the pressure roller 74 pushes out the gas between the adhesive sheet AS and the wafer WF, and presses and adheres the adhesive sheet AS to the wafer WF. When the adhesive sheet AS is attached, the non-adhered portion on the left side of the pressure roller 74 in the adhesive sheet AS is restricted by the contact member 63 from being separated from the wafer WF by a predetermined distance. It does not stick to the wafer WF prior to the movement of 74.

  When adhesion of the adhesive sheet AS to the wafer WF is completed, the fluid supply means 50 drives the pressure reducing means (not shown) to make the pressure of the enclosed space SP atmospheric pressure, and then the regulating means 60 and the pressing means 70 The driving motors 62 and 72 are driven to return the contact member 63 and the pressing roller 74 to the initial positions. Next, after the adherend support means 30 drives the linear motor 31 to return the inner table 32 and the lower case 41 to the initial positions, the sheet support means 20 and the adherend support means 30 are not shown in the figure. Stop driving. Then, after an operator or a conveying means (not shown) conveys the integrated object in which the wafer WF and the ring frame RF are integrated to the next process via the adhesive sheet AS, the same operation is repeated thereafter.

  According to the embodiment as described above, since the adhesive sheet AS is restricted from being separated from the wafer WF by a predetermined distance, it is possible to prevent the adhesive sheet AS from being too far from the wafer WF. It is possible to prevent unnecessary tension from being applied to the adhesive sheet AS and to be attached to the wafer WF, and a wrinkle to be formed on the adhesive sheet AS to be attached to the wafer WF.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, A person skilled in the art can make various modifications in material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description in the name of the member from which the limitation of some or all of the limitations such as is removed is included in the invention.

For example, the sheet support means 20 may be configured to hold the ring frame RF or the adhesive sheet AS with chuck means such as a mechanical chuck or a chuck cylinder, Coulomb force, adhesive, adhesive, magnetic force, Bernoulli adsorption, driving equipment, or the like. There may be no configuration to hold.
The sheet support means 20 may directly support the adhesive sheet AS by the support surface 21A when the adhesive sheet AS is not attached to the ring frame RF, in which case the adhesive sheet AS, the sheet support means 20 and the closed space formation A closed space SP is formed by means 40.
The sheet support means 20 adheres a band-like adhesive sheet substrate to the ring frame RF and then makes the adhesive sheet substrate into a predetermined shape by cutting means such as a cutting blade, a laser cutter, a heat cutter, an air cutter or a compressed water cutter. It may be cut.
The sheet support means 20 may be formed integrally with the adherend support means 30.

The adherend support means 30 may be configured to hold the wafer WF by a chuck means such as a mechanical chuck or a chuck cylinder, a Coulomb force, an adhesive, an adhesive, a magnetic force, Bernoulli adsorption, a driving device, or the like. It does not have to be.
The adherend support means 30 may be in any state as long as the adhesive sheet AS is not in contact with the wafer WF at a stage before the adhesive sheet AS is attached to the wafer WF by the pressing roller 74. The top surface of the WF may be higher or lower than the top surface of the ring frame RF.
The inner table 32 may have no recess 32 </ b> C, and the coil spring 42 may be supported on the lower surface 32 </ b> B of the inner table 32.

The closed space forming means 40 may fix the position of the lower case 41 and move the outer table 21 to form the closed space SP, or move both the outer table 21 and the lower case 41 to move the closed space SP. An SP may be formed.
The closed space forming means 40 may move the lower case 41 by a driving device different from the linear motion motor 31. In this case, the biasing means may be omitted.
The biasing means may be constituted by an elastic member such as rubber or resin or a drive device.
The sealing means may or may not be composed of other members such as resin packing and metal packing.
The lower case 41 may have no recess 41 </ b> A, and the coil spring 42 may be supported on the upper surface of the lower case 41.
The sealed space forming means employs an inner table whose upper surface can come into contact with the lower surface of the sheet support means 20 or an inner table in which the lower case 41 is integrated. The part can be substituted for the above-mentioned enclosed space formation means 40. In this case, the adhesive sheet AS, the sheet support means 20 and the adherend support means 30 form a closed space SP.
The sealed space forming means employs an inner table having a standing portion that rises upward outside the wafer WF and supports the adhesive sheet AS, so that the standing portion of the inner table is sealed with the sheet support means 20 and the sealed portion. It can be used instead of the space forming means 40. In this case, since the adherend support means also supports the adhesive sheet AS, the sealed space SP is formed by the adhesive sheet AS and the adherend support means (including the sheet support means).

The fluid supply means 50 may discharge the fluid from the closed space SP based on the detection result of the pressure detection means 80 so that the pressure in the closed space SP becomes constant.
The fluid supplied by the fluid supply means 50 may be a gas such as air, a single gas and a mixed gas, a liquid such as water or oil, or a gel-like body.
When the pressure roller 74 moves and the adhesive sheet AS is attached to the wafer WF, the volume of the enclosed space SP decreases and the pressure in the enclosed space SP increases, so an extra tension is applied to the adhesive sheet AS. Since the fluid supply means 50 is attached to the wafer WF, the fluid supply means 50 drives the decompression means (not shown) based on the detection result of the pressure detection means 80 so that the pressure in the enclosed space SP becomes smaller than a predetermined value. You may make it do. Thereby, a wrinkle can be prevented from approaching the rear end part (left end part) in the sticking direction of the adhesive sheet AS.

The restricting means 60 is provided as a contact member which can be moved relative to the adhesive sheet AS in the surface direction relative to the adhesive sheet AS as shown in FIG. 3 instead of the contact member 63. It is also possible to provide a transfer means 65 for moving the belt 65E. The revolving means 65 is supported by the frame 65B supported by the output shaft 62A of the linear motor 62 via the bracket 65A, the drive pulley 65C supported by the frame 65B and driven by a drive device (not shown), and the frame 65B. And a driven pulley 65D that freely rotates and a belt 65E that is wound around the driving pulley 65C and the driven pulley 65D. The temperature adjustment means 64 provided inside the frame 65B allows the adhesive sheet AS to pass through the belt 65E. It is the structure which heats. In this case, there may not be any drive device for driving the drive pulley 65C.
The restricting means 60 fixes the positions of the contact member 63 and the turning means 65, and moves the sheet support means 20, the adherend support means 30 and the sealed space forming means 40, and the adhesive sheet AS is attached to the wafer WF. It may be stuck, or both may be moved to stick the adhesive sheet AS to the wafer WF.
The restricting means 60 may restrict the adhesive sheet AS from being separated from the wafer WF by air spraying from a predetermined distance.
The temperature adjusting means 64 may be a cooling means such as a Peltier element or a cooling side of a heat pipe, or may include both a heating means and a cooling means.
The temperature adjusting means 64 may irradiate the adhesive sheet AS with ultraviolet rays, infrared rays, X-rays, microwaves, and the like, and can be appropriately selected according to the characteristics, composition, configuration, and the like of the adhesive sheet AS.
The temperature control means 64 may or may not heat or cool the fluid supplied by the fluid supply means 50.

The pressing means 70 can adopt a pressing member made of a blade material, rubber, resin, sponge or the like, and can adopt a configuration of pressing by air spraying.
When the adhesive sheet AS is pressed and stuck to the wafer WF with another apparatus, the pressing means 70 may not be provided in the present invention.

In the present invention, the pressure detection means 80 may be omitted.
The shape of the adherend may be a circle, an ellipse, a polygon more than a triangle, or other shapes.
The adhesive sheet AS may not be attached to the ring frame RF.
Other than the ring frame RF, the frame member may have a non-annular shape (peripheral is not connected), a circular shape, an elliptical shape, a polygon having a triangle or more, or any other shape. In the case of a non-annular frame member, a closing portion that can close the gap may be provided on the support surface 21A.

  Further, the material, type, shape and the like of the adhesive sheet AS and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS may have a circular shape, an elliptical shape, a polygonal shape such as a triangle or a quadrangle, or any other shape, or may have an adhesive form such as pressure-sensitive adhesiveness or heat-sensitive adhesiveness. When the pressure sensitive adhesive sheet AS is employed, the temperature adjusting means 64 may or may not be provided. Such an adhesive sheet AS is, for example, a single layer having only an adhesive layer, an intermediate layer between the base sheet and the adhesive layer, a cover layer on the upper surface of the base sheet, etc. Three or more layers, or so-called double-sided adhesive sheet capable of peeling the substrate sheet from the adhesive layer may be used, and the double-sided adhesive sheet may be a single layer or a multilayer intermediate layer. It may be one having one or more layers without an intermediate layer. The adherend may be, for example, food, resin container, semiconductor wafer such as silicon semiconductor wafer or compound semiconductor wafer, circuit substrate, information recording substrate such as optical disk, glass plate, steel plate, pottery, wood plate or resin plate, etc. Any form of member, article or the like can also be targeted. In addition, the adhesive sheet AS is changed to a functional and practical reading, for example, an arbitrary label for information description, a label for decoration, a protective sheet, a dicing tape, a die attach film, a die bonding tape, a recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes and the like can be attached to any adherend as described above.

The means and steps in the present invention are not limited in any way as long as the operations, functions or steps described in the means and steps can be performed, and it is needless to say that the constitutions of only one embodiment shown in the above embodiment or The process is not limited at all. For example, the sheet supporting means is not limited as long as it can support the outer edge portion of the adhesive sheet, as long as it is within the technical scope in light of the technical common knowledge at the time of filing of the application (other means And description of the process is omitted).
Further, the drive device in the above-described embodiment includes a rotary motor, a linear motion motor, a linear motor, an electric device such as a single-axis robot and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder and a rotary cylinder. Besides being adoptable, it is also possible to adopt a combination of them directly or indirectly (some overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10A support apparatus 20 sheet support means 30 adherend support means 40 sealed space formation means 50 fluid supply means 60 regulation means 63 contact member 64 temperature control means 65 rotation means AS adhesive sheet SP sealed space WF wafer (adhered body)

Claims (4)

A sheet support means for supporting the outer edge of the adhesive sheet;
An adherend support means for supporting the adherend;
Sealed space forming means capable of forming a sealed space surrounding an adherend supported by the adherend support means by a member including at least the adhesive sheet and the sheet support means;
Fluid supply means for supplying fluid to the enclosed space;
A supporting device comprising: restricting means for restricting the separation of the adhesive sheet from the adherend by a supplied fluid.   The said regulation means is provided with the contact member which can contact | abut to the said adhesive sheet, and the temperature adjustment means which heats or cools the said adhesive sheet via the said contact member, The said adjustment means is characterized by the above-mentioned. The support device as described.   The restricting means includes an abutting member capable of abutting on the adhesive sheet, and a revolving means provided so as to be relatively movable in the surface direction with respect to the adhesive sheet and revolving the abutting member. The supporting device according to claim 1 or 2, characterized in that: Supporting an outer edge portion of the adhesive sheet by a sheet supporting means;
Supporting the adherend with adherend support means;
Forming a sealed space surrounding the adherend supported by the adherend support means with a member including at least the adhesive sheet and the sheet support means;
Supplying a fluid to the sealed space;
And d) restricting the separation of the adhesive sheet from the adherend by a supplied fluid.

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