JP6603522B2 - Support apparatus and support method - Google Patents

Support apparatus and support method Download PDF

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JP6603522B2
JP6603522B2 JP2015179965A JP2015179965A JP6603522B2 JP 6603522 B2 JP6603522 B2 JP 6603522B2 JP 2015179965 A JP2015179965 A JP 2015179965A JP 2015179965 A JP2015179965 A JP 2015179965A JP 6603522 B2 JP6603522 B2 JP 6603522B2
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adherend
sheet
support
adhesive sheet
sealed space
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JP2017055066A (en
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健 高野
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Lintec Corp
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Lintec Corp
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Priority to TW105121937A priority patent/TWI689035B/en
Priority to CN201610726153.3A priority patent/CN106531677B/en
Priority to KR1020160114919A priority patent/KR102501353B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

本発明は、支持装置および支持方法に関する。   The present invention relates to a support device and a support method.

従来、被着体を囲む密閉空間を形成可能に設けられ、被着体支持手段およびシート支持手段で被着体および接着シートを支持する支持装置が知られている（例えば、特許文献１参照）。   2. Description of the Related Art Conventionally, a support device that is provided so as to be able to form a sealed space surrounding an adherend and supports the adherend and the adhesive sheet with the adherend support means and the sheet support means is known (see, for example, Patent Document 1). .

特開２０１２−６００４７号公報JP 2012-60047 A

しかしながら、特許文献１に記載されたような従来の支持装置では、被着体支持手段とシート支持手段とを相対移動させる移動手段の他に、密閉空間を形成するための他の部材が必要となるので、装置の大型化や制御の複雑化を招来するという不都合がある。   However, in the conventional support apparatus as described in Patent Document 1, in addition to the moving means for relatively moving the adherend support means and the sheet support means, other members for forming a sealed space are required. Therefore, there is an inconvenience that the apparatus becomes large and the control becomes complicated.

本発明の目的は、装置の大型化や制御の複雑化を防止できる支持装置および支持方法を提供することにある。   An object of the present invention is to provide a support device and a support method that can prevent the apparatus from becoming large and complicated.

本発明の支持装置は、接着シートの外縁部を支持するシート支持手段と、被着体を支持する被着体支持手段と、離間接近する方向に前記シート支持手段および被着体支持手段を相対移動可能な移動手段と、前記シート支持手段および被着体支持手段の相対移動によって移動可能に設けられ、前記被着体に追従して移動することで、当該被着体を囲む密閉空間を形成可能な密閉空間形成手段とを備えていることを特徴とする。 The support device according to the present invention includes a sheet support unit that supports the outer edge portion of the adhesive sheet, an adherend support unit that supports the adherend, and the sheet support unit and the adherend support unit that are spaced apart from each other. A movable moving means, and a movable space provided by relative movement of the sheet supporting means and the adherend supporting means, and moving following the adherend to form a sealed space surrounding the adherend. It is characterized by comprising a possible closed space forming means.

本発明の支持装置は、前記密閉空間に流体を供給する流体供給手段を備えていることが好ましい。   The support device of the present invention preferably includes fluid supply means for supplying a fluid to the sealed space.

本発明の支持方法は、接着シートの外縁部をシート支持手段で支持するシート支持工程と、被着体を被着体支持手段で支持する被着体支持工程と、離間接近する方向に前記シート支持手段および被着体支持手段を相対移動させる移動工程と、前記移動工程の際に密閉空間形成手段が前記被着体に追従して移動することで、当該被着体を囲む密閉空間を形成する密閉空間形成工程とを備えていることを特徴とする。 The supporting method of the present invention includes the sheet supporting step of supporting the outer edge portion of the adhesive sheet by the sheet supporting means, the adherend supporting step of supporting the adherend by the adherend supporting means, and the sheet in a direction approaching and separating. a moving step of the support means and the adherend support means relatively moving, in Rukoto move closed space forming means during the moving step is to follow the adherend, an enclosed space surrounding the adherend And a sealed space forming step to be formed.

以上のような本発明によれば、密閉空間形成手段がシート支持手段および被着体支持手段の離間接近によって移動可能に設けられているため、移動手段の他に密閉空間を形成するための他の部材を設ける必要がなく、装置の大型化や制御の複雑化を防止することができる。   According to the present invention as described above, since the sealed space forming means is provided so as to be movable by approaching and separating the sheet support means and the adherend support means, in addition to the moving means, other means for forming a sealed space are provided. Therefore, it is possible to prevent the apparatus from being enlarged and complicated.

また、流体供給手段を設ければ、流体により被着体から接着シートを離間させた状態を維持することができるので、接着シートの未貼付部分が押圧される前に被着体に貼付してしまうことを防止することができる。   In addition, if the fluid supply means is provided, the state where the adhesive sheet is separated from the adherend by the fluid can be maintained, so that the adhesive sheet is stuck on the adherend before the unattached portion of the adhesive sheet is pressed. Can be prevented.

本発明の一実施形態に係るシート貼付装置の側面図。The side view of the sheet sticking apparatus which concerns on one Embodiment of this invention. シート貼付装置の動作説明図。Operation | movement explanatory drawing of a sheet sticking apparatus.

以下、本発明の一実施形態を図面に基づいて説明する。
なお、本実施形態におけるＸ軸、Ｙ軸、Ｚ軸は、それぞれが直交する関係にあり、Ｘ軸およびＹ軸は、所定平面内の軸とし、Ｚ軸は、前記所定平面に直交する軸とする。さらに、本実施形態では、Ｙ軸と平行な図１中手前方向から観た場合を基準とし、方向を示した場合、「上」がＺ軸の矢印方向で「下」がその逆方向、「左」がＸ軸の矢印方向で「右」がその逆方向、「前」がＹ軸と平行な図１中手前方向で「後」がその逆方向とする。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis that is orthogonal to the predetermined plane. To do. Furthermore, in the present embodiment, when viewed from the front side in FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis and “down” is the opposite direction, “ The “left” is the arrow direction of the X axis, “right” is the opposite direction, “front” is the front direction in FIG. 1 parallel to the Y axis, and “rear” is the opposite direction.

図１において、シート貼付装置１０は、接着シートＡＳの外縁部を支持するシート支持手段２０と、被着体としての半導体ウエハ（以下、単に「ウエハ」という場合がある）ＷＦを支持する被着体支持手段３０と、離間接近する方向にシート支持手段２０および被着体支持手段３０を相対移動可能な移動手段４０と、移動手段４０の相対移動によって移動可能に設けられ、さらにウエハＷＦとも相対移動することで、当該ウエハＷＦを囲む密閉空間ＳＰを形成可能な密閉空間形成手段５０と、シート支持手段２０に支持された接着シートＡＳをウエハＷＦに押圧して貼付する押圧手段６０と、密閉空間ＳＰに流体としての気体を供給する流体供給手段７０と、供給された流体により接着シートＡＳがウエハＷＦから所定の距離よりも離間することを規制する規制手段８０と、密閉空間ＳＰの圧力を検知する圧力センサやロードセル等の圧力検知手段９０とを備えている。なお、接着シートＡＳは、予めフレーム部材としてのリングフレームＲＦの開口部を閉塞するように、接着面ＡＳ１が当該リングフレームＲＦに貼付されている。また、本発明の支持装置１０Ａは、シート支持手段２０と、被着体支持手段３０と、移動手段４０と、密閉空間形成手段５０と、流体供給手段７０と、規制手段８０と、圧力検知手段９０とで構成される。   In FIG. 1, a sheet sticking apparatus 10 includes a sheet support means 20 that supports an outer edge portion of an adhesive sheet AS, and an adhesion that supports a semiconductor wafer (hereinafter, simply referred to as “wafer”) WF as an adherend. The body support means 30, the moving means 40 capable of relatively moving the sheet support means 20 and the adherend support means 30 in the direction of approaching, and the relative movement of the moving means 40 are provided, and further relative to the wafer WF. By moving, a sealed space forming means 50 capable of forming a sealed space SP surrounding the wafer WF, a pressing means 60 for pressing and sticking the adhesive sheet AS supported by the sheet support means 20 to the wafer WF, and a sealed The fluid supply means 70 that supplies a gas as a fluid to the space SP, and the adhesive sheet AS is separated from the wafer WF by a predetermined distance by the supplied fluid. Includes a regulating means 80 for regulating, the pressure sensing means 90 such as a pressure sensor or a load cell for detecting the pressure of the closed space SP and. Note that the adhesive sheet AS1 is attached to the ring frame RF so that the opening of the ring frame RF as a frame member is closed in advance. Further, the supporting device 10A of the present invention includes a sheet supporting unit 20, an adherend supporting unit 30, a moving unit 40, a sealed space forming unit 50, a fluid supplying unit 70, a regulating unit 80, and a pressure detecting unit. 90.

シート支持手段２０は、環状に形成され、減圧ポンプや真空エジェクタ等の図示しない減圧手段によってリングフレームＲＦを吸着保持可能な支持面２１Ａを有する外側テーブル２１を備えている。   The sheet support means 20 includes an outer table 21 that is formed in an annular shape and has a support surface 21A that can hold the ring frame RF by suction using pressure reduction means (not shown) such as a pressure reduction pump or a vacuum ejector.

被着体支持手段３０は、減圧ポンプや真空エジェクタ等の図示しない減圧手段によってウエハＷＦを吸着保持可能な支持面３１Ａと、下面３１Ｂから凹んだ凹部３１Ｃとが設けられた内側テーブル３１を備えている。   The adherend support means 30 includes an inner table 31 provided with a support surface 31A capable of attracting and holding the wafer WF by a decompression means (not shown) such as a decompression pump or a vacuum ejector, and a recess 31C recessed from the lower surface 31B. Yes.

移動手段４０は、出力軸４１Ａで内側テーブル３１を支持する駆動機器としての直動モータ４１を備えている。   The moving means 40 includes a linear motion motor 41 as a driving device that supports the inner table 31 with an output shaft 41A.

密閉空間形成手段５０は、内側テーブル３１が配置される凹部５１Ａを備えた下ケース５１と、凹部３１Ｃの上面と凹部５１Ａの上面とに支持され、下ケース５１を内側テーブル３１側に付勢する付勢手段としてのコイルばね５２と、外側テーブル２１と下ケース５１との間から流体が漏れることを防止するシール手段としてのゴムパッキン５３と、出力軸４１Ａと下ケース５１との間から流体が漏れることを防止するシール手段としてのゴムパッキン５４とを備えている。   The sealed space forming means 50 is supported by the lower case 51 having a recess 51A in which the inner table 31 is disposed, the upper surface of the recess 31C and the upper surface of the recess 51A, and biases the lower case 51 toward the inner table 31. Fluid flows from between the coil spring 52 as urging means, rubber packing 53 as sealing means for preventing fluid from leaking between the outer table 21 and the lower case 51, and between the output shaft 41A and the lower case 51. A rubber packing 54 is provided as sealing means for preventing leakage.

押圧手段６０は、ブラケット６１に支持された駆動機器としての直動モータ６２の出力軸６２Ａに支持されたブラケット６３と、ブラケット６３に回転可能に支持された押圧部材としての押圧ローラ６４とを備えている。   The pressing means 60 includes a bracket 63 supported by an output shaft 62A of a linear motor 62 as a drive device supported by the bracket 61, and a pressing roller 64 as a pressing member rotatably supported by the bracket 63. ing.

流体供給手段７０は、外側テーブル２１に接続された配管７１Ａを介して密閉空間ＳＰに接続され、密閉空間ＳＰに気体を供給する加圧ポンプやタービン等の加圧手段７１と、減圧ポンプや解放弁等の図示しない減圧手段とを備えている。   The fluid supply means 70 is connected to the sealed space SP via a pipe 71A connected to the outer table 21, and a pressurizing means 71 such as a pressure pump or a turbine for supplying gas to the sealed space SP, a pressure reducing pump or a release. Pressure reducing means (not shown) such as a valve.

規制手段８０は、駆動機器としてのリニアモータ８１のスライダ８１Ａに支持された駆動機器としての直動モータ８２と、ブラケット６１を支持するとともに、直動モータ８２の出力軸８２Ａに支持され、接着シートＡＳに当接可能な当接部材８３と、当接部材８３の内部に設けられ、当該当接部材８３を介して接着シートＡＳを加熱するコイルヒータ、赤外線ヒータ、ヒートパイプの加熱側等の温度調節手段８４とを備えている。   The regulating means 80 supports a linear motion motor 82 as a driving device supported by a slider 81A of a linear motor 81 as a driving device, a bracket 61, and is supported by an output shaft 82A of the linear motion motor 82, and is an adhesive sheet. A contact member 83 that can contact the AS, and a temperature of a coil heater, an infrared heater, a heat pipe heating side, etc. that are provided inside the contact member 83 and heat the adhesive sheet AS through the contact member 83 Adjusting means 84.

以上のシート貼付装置１０において、ウエハＷＦに接着シートＡＳを貼付する手順を説明する。
先ず、各部材が初期位置に配置された図１中実線で示す状態のシート貼付装置１０に対し、作業者または多関節ロボット等の図示しない搬送手段が、ウエハＷＦを支持面３１Ａ上の所定位置に載置すると、被着体支持手段３０が図示しない減圧手段を駆動し、支持面３１ＡでウエハＷＦを吸着保持する。そして、図示しない搬送手段が接着シートＡＳを上側にしてリングフレームＲＦを支持面２１Ａ上の所定位置に載置すると、シート支持手段２０が図示しない減圧手段を駆動し、支持面２１ＡでリングフレームＲＦを吸着保持する。次いで、規制手段８０が直動モータ８２を駆動し、図１中二点鎖線で示すように、当接部材８３を接着シートＡＳの上方である所定の位置にまで下降させる。 In the sheet sticking apparatus 10 described above, a procedure for sticking the adhesive sheet AS to the wafer WF will be described.
First, with respect to the sheet pasting apparatus 10 in the state indicated by the solid line in FIG. 1 in which each member is arranged at the initial position, a transfer means (not shown) such as an operator or an articulated robot moves the wafer WF to a predetermined position on the support surface 31A. Then, the adherend support means 30 drives a decompression means (not shown), and holds and holds the wafer WF by the support surface 31A. Then, when the conveying means (not shown) places the ring frame RF at a predetermined position on the support surface 21A with the adhesive sheet AS on the upper side, the sheet support means 20 drives the decompression means (not shown), and the ring surface RF is supported by the support surface 21A. Adsorb and hold. Next, the regulating means 80 drives the linear motion motor 82 to lower the contact member 83 to a predetermined position above the adhesive sheet AS, as indicated by a two-dot chain line in FIG.

次に、移動手段４０が直動モータ４１を駆動し、図１中二点鎖線で示す密閉空間形成位置にまで内側テーブル３１を上昇させると、コイルばね５２によって連結された下ケース５１も同時に上昇し、先ずゴムパッキン５３が外側テーブル２１の下面に当接し、当該当接後も内側テーブル３１が所定量上昇する。これにより、下ケース５１がコイルばね５２を介して、所定量上昇する内側テーブル３１によって上方に付勢され、ゴムパッキン５３が所定量押し潰されて密閉空間ＳＰが形成される。この場合、接着シートＡＳ、リングフレームＲＦ、シート支持手段２０および密閉空間形成手段５０で密閉空間ＳＰが形成される。このとき、ウエハＷＦの上面と接着シートＡＳの接着面ＡＳ１とは、接触することのない間隔が維持されるようになっている。次に、流体供給手段７０が加圧手段７１を駆動し、密閉空間ＳＰに気体を供給すると、密閉空間ＳＰ内が加圧され、図２に示すように、接着シートＡＳが当接部材８３の下面に当接し、当該接着シートＡＳがそれ以上膨らまないように規制される。次いで、移動手段４０が直動モータ４１を駆動し、図２に示すように、ウエハＷＦの上面がリングフレームＲＦの上面と同じ高さとなるまで、内側テーブル３１を上昇させる。そして、規制手段８０が温度調節手段８４を駆動し、接着シートＡＳを加熱するとともに、押圧手段６０が直動モータ６２を駆動し、図２中実線で示すように、押圧ローラ６４で接着シートＡＳおよびリングフレームＲＦの少なくとも一方を押圧する。   Next, when the moving means 40 drives the linear motion motor 41 and raises the inner table 31 to the sealed space forming position shown by the two-dot chain line in FIG. 1, the lower case 51 connected by the coil spring 52 also rises at the same time. First, the rubber packing 53 comes into contact with the lower surface of the outer table 21, and the inner table 31 rises by a predetermined amount even after the contact. As a result, the lower case 51 is biased upward by the inner table 31 rising by a predetermined amount via the coil spring 52, and the rubber packing 53 is crushed by a predetermined amount to form a sealed space SP. In this case, the sealed space SP is formed by the adhesive sheet AS, the ring frame RF, the sheet support means 20 and the sealed space forming means 50. At this time, the upper surface of the wafer WF and the adhesive surface AS1 of the adhesive sheet AS are maintained at a distance without contact. Next, when the fluid supply means 70 drives the pressurizing means 71 to supply gas to the sealed space SP, the inside of the sealed space SP is pressurized, and the adhesive sheet AS is attached to the contact member 83 as shown in FIG. The adhesive sheet AS is regulated so as not to swell any more by contacting the lower surface. Next, the moving means 40 drives the linear motion motor 41, and as shown in FIG. 2, the inner table 31 is raised until the upper surface of the wafer WF is flush with the upper surface of the ring frame RF. Then, the regulating means 80 drives the temperature adjusting means 84 to heat the adhesive sheet AS, and the pressing means 60 drives the linear motion motor 62, and the adhesive sheet AS is pressed by the pressing roller 64 as shown by the solid line in FIG. And at least one of the ring frames RF is pressed.

その後、規制手段８０がリニアモータ８１を駆動し、図２中二点鎖線で示すように、押圧ローラ６４を左方に移動させる。これにより、押圧ローラ６４が接着シートＡＳとウエハＷＦとの間の気体を追い出すようにして、当該ウエハＷＦに接着シートＡＳを押圧して貼付する。この接着シートＡＳの貼付の際、接着シートＡＳにおける押圧ローラ６４よりも左側の未貼付部分は、当接部材８３によってウエハＷＦから所定の距離よりも離間することが規制されているため、押圧ローラ６４の移動よりも先にウエハＷＦに貼付してしまうことはない。   Thereafter, the regulating means 80 drives the linear motor 81 to move the pressing roller 64 to the left as shown by the two-dot chain line in FIG. As a result, the pressure roller 64 pushes out the gas between the adhesive sheet AS and the wafer WF, and presses and adheres the adhesive sheet AS to the wafer WF. When the adhesive sheet AS is applied, the non-attached portion on the left side of the pressure roller 64 in the adhesive sheet AS is restricted from being separated from the wafer WF by a predetermined distance by the contact member 83. There is no sticking to the wafer WF prior to the movement of 64.

ウエハＷＦに接着シートＡＳの貼付が完了すると、流体供給手段７０が図示しない減圧手段を駆動し、密閉空間ＳＰの圧力を大気圧とした後、押圧手段６０および規制手段８０が直動モータ６２、８２およびリニアモータ８１を駆動し、押圧ローラ６４および当接部材８３を初期位置に復帰させる。次いで、移動手段４０が直動モータ４１を駆動し、内側テーブル３１および下ケース５１を初期位置に復帰させた後、シート支持手段２０および被着体支持手段３０が図示しない減圧手段の駆動を停止する。そして、作業者または図示しない搬送手段が、接着シートＡＳを介してウエハＷＦとリングフレームＲＦとが一体化された一体物を次工程に搬送した後、以降上記同様の動作が繰り返される。   When the adhesion of the adhesive sheet AS to the wafer WF is completed, the fluid supply means 70 drives a decompression means (not shown) to set the pressure of the sealed space SP to atmospheric pressure, and then the pressing means 60 and the regulation means 80 are the linear motion motor 62, 82 and the linear motor 81 are driven, and the pressing roller 64 and the contact member 83 are returned to the initial positions. Next, after the moving means 40 drives the linear motion motor 41 to return the inner table 31 and the lower case 51 to the initial positions, the sheet support means 20 and the adherend support means 30 stop driving the decompression means (not shown). To do. Then, after an operator or a conveying means (not shown) conveys the integrated object in which the wafer WF and the ring frame RF are integrated to the next process via the adhesive sheet AS, the same operation is repeated thereafter.

以上のような実施形態によれば、密閉空間形成手段５０がシート支持手段２０および被着体支持手段３０の離間接近によって移動可能に設けられているため、移動手段４０の他に密閉空間ＳＰを形成するための他の部材を設ける必要がなく、装置の大型化や制御の複雑化を防止することができる。   According to the embodiment as described above, since the sealed space forming means 50 is provided so as to be movable by separating and approaching the sheet support means 20 and the adherend support means 30, the sealed space SP is provided in addition to the moving means 40. It is not necessary to provide another member for forming, and the enlargement of the apparatus and the complicated control can be prevented.

以上のように、本発明を実施するための最良の構成、方法等は、前記記載で開示されているが、本発明は、これに限定されるものではない。すなわち、本発明は、主に特定の実施形態に関して特に図示され、かつ説明されているが、本発明の技術的思想および目的の範囲から逸脱することなく、以上述べた実施形態に対し、形状、材質、数量、その他の詳細な構成において、当業者が様々な変形を加えることができるものである。また、上記に開示した形状、材質などを限定した記載は、本発明の理解を容易にするために例示的に記載したものであり、本発明を限定するものではないから、それらの形状、材質などの限定の一部もしくは全部の限定を外した部材の名称での記載は、本発明に含まれる。   As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

例えば、シート支持手段２０は、メカチャックやチャックシリンダ等のチャック手段、クーロン力、接着剤、粘着剤、磁力、ベルヌーイ吸着、駆動機器等でリングフレームＲＦや接着シートＡＳを保持する構成でもよいし、保持する構成がなくてもよい。
シート支持手段２０は、接着シートＡＳがリングフレームＲＦに貼付されていない場合、接着シートＡＳを支持面２１Ａで直接支持してもよく、この場合、接着シートＡＳ、シート支持手段２０および密閉空間形成手段５０で密閉空間ＳＰが形成される。
シート支持手段２０は、帯状の接着シート基材をリングフレームＲＦに貼付した後、当該接着シート基材を切断刃、レーザカッター、熱カッター、エアカッター、圧縮水カッター等の切断手段で所定形状に切断してもよい。 For example, the sheet support means 20 may be configured to hold the ring frame RF or the adhesive sheet AS with chuck means such as a mechanical chuck or a chuck cylinder, Coulomb force, adhesive, adhesive, magnetic force, Bernoulli adsorption, driving equipment, or the like. There may be no configuration to hold.
When the adhesive sheet AS is not attached to the ring frame RF, the sheet support means 20 may directly support the adhesive sheet AS with the support surface 21A. In this case, the adhesive sheet AS, the sheet support means 20, and the sealed space formation The sealed space SP is formed by the means 50.
The sheet support means 20 affixes the band-shaped adhesive sheet base material to the ring frame RF, and then forms the adhesive sheet base material into a predetermined shape by a cutting means such as a cutting blade, a laser cutter, a heat cutter, an air cutter, or a compressed water cutter. It may be cut.

被着体支持手段３０は、メカチャックやチャックシリンダ等のチャック手段、クーロン力、接着剤、粘着剤、磁力、ベルヌーイ吸着、駆動機器等でウエハＷＦを保持する構成でもよいし、保持する構成がなくてもよい。
内側テーブル３１は、凹部３１Ｃがなく、当該内側テーブル３１の下面３１Ｂにコイルばね５２が支持されていてもよい。 The adherend support means 30 may be configured to hold the wafer WF by a chuck means such as a mechanical chuck or a chuck cylinder, a Coulomb force, an adhesive, an adhesive, a magnetic force, Bernoulli adsorption, a driving device, or the like. It does not have to be.
The inner table 31 may have no recess 31 </ b> C, and the coil spring 52 may be supported on the lower surface 31 </ b> B of the inner table 31.

移動手段４０は、押圧ローラ６４でウエハＷＦに接着シートＡＳを貼付する前の段階において、当該ウエハＷＦに接着シートＡＳが当接しない状態とすればどんな状態としてもよく、例えば、ウエハＷＦの上面がリングフレームＲＦの上面よりも高くなる状態としてもよいし、低くなる状態としてもよい。
移動手段４０は、内側テーブル３１の位置を固定しておき外側テーブル２１を移動させてもよいし、外側テーブル２１および内側テーブル３１の両方を移動させてもよい。 The moving means 40 may be in any state as long as the adhesive sheet AS is not in contact with the wafer WF before the adhesive sheet AS is attached to the wafer WF by the pressing roller 64. May be higher than the upper surface of the ring frame RF, or may be lower.
The moving means 40 may move the outer table 21 with the position of the inner table 31 fixed, or may move both the outer table 21 and the inner table 31.

密閉空間形成手段５０は、下ケース５１の位置を固定しておき外側テーブル２１を移動させて密閉空間ＳＰを形成してもよいし、外側テーブル２１および下ケース５１の両方を移動させて密閉空間ＳＰを形成してもよい。
付勢手段は、ゴムや樹脂等の弾性部材や駆動機器等で構成してもよい。
シール手段は、樹脂パッキンや金属パッキン等の他の部材で構成してもよいし、なくてもよい。
下ケース５１は、凹部５１Ａがなく、当該下ケース５１の上面にコイルばね５２が支持されていてもよい。 The sealed space forming means 50 may fix the position of the lower case 51 and move the outer table 21 to form the sealed space SP, or move both the outer table 21 and the lower case 51 to move the sealed space SP. An SP may be formed.
The biasing means may be constituted by an elastic member such as rubber or resin, a driving device, or the like.
The sealing means may or may not be composed of other members such as resin packing and metal packing.
The lower case 51 may have no recess 51 </ b> A, and the coil spring 52 may be supported on the upper surface of the lower case 51.

押圧手段６０は、ブレード材、ゴム、樹脂、スポンジ等による押圧部材を採用することができ、エア噴き付けにより押圧する構成も採用することができる。
他の装置で接着シートＡＳをウエハＷＦに押圧して貼付する場合、本発明において押圧手段６０は、なくてもよい。 As the pressing means 60, a pressing member made of a blade material, rubber, resin, sponge, or the like can be adopted, and a configuration of pressing by air spraying can also be adopted.
When the adhesive sheet AS is pressed and stuck to the wafer WF with another apparatus, the pressing means 60 may not be provided in the present invention.

流体供給手段７０は、圧力検知手段９０の検知結果を基に密閉空間ＳＰから流体を排出し、密閉空間ＳＰの圧力が一定になるようにしてもよい。
流体供給手段７０が供給する流体は、大気、単体ガスおよび混合ガス等の気体であってもよいし、水やオイル等の液体、ジェル状体等であってもよい。
押圧ローラ６４が移動して接着シートＡＳがウエハＷＦに貼付されると、密閉空間ＳＰの体積が減少し、密閉空間ＳＰ内の圧力が上昇するため、当該接着シートＡＳに余計な張力が付与されてウエハＷＦに貼付されるので、流体供給手段７０は、圧力検知手段９０の検知結果を基にして図示しない減圧手段を駆動し、密閉空間ＳＰ内の圧力が所定値よりも大きくならいように調整するようにしてもよい。これにより、接着シートＡＳにおける貼付方向後端部（左端部）に皺が寄せられることを防止することができる。
本発明において流体供給手段７０は、なくてもよい。 The fluid supply means 70 may discharge the fluid from the sealed space SP based on the detection result of the pressure detecting means 90 so that the pressure in the sealed space SP becomes constant.
The fluid supplied by the fluid supply means 70 may be a gas such as the atmosphere, a single gas, or a mixed gas, or may be a liquid such as water or oil, a gel-like body, or the like.
When the pressing roller 64 is moved and the adhesive sheet AS is attached to the wafer WF, the volume of the sealed space SP decreases and the pressure in the sealed space SP increases, so that extra tension is applied to the adhesive sheet AS. Therefore, the fluid supply means 70 drives the decompression means (not shown) based on the detection result of the pressure detection means 90 and adjusts so that the pressure in the sealed space SP does not become larger than a predetermined value. You may make it do. Thereby, a wrinkle can be prevented from approaching the rear end part (left end part) in the sticking direction of the adhesive sheet AS.
In the present invention, the fluid supply means 70 may be omitted.

規制手段８０は、当接部材８３に代えて、接着シートＡＳに対してその面方向に相対移動可能に設けられ、接着シートＡＳに当接可能な当接部材としてのベルトを回行する回行手段を備えてもよい。回行手段は、直動モータ８２の出力軸８２Ａにブラケットを介して支持されたフレームと、フレームに支持され、図示しない駆動機器によって駆動される駆動プーリと、フレームに支持され、自由回転する従動プーリと、駆動プーリおよび従動プーリに掛け回されたベルトとを備え、フレームの内部に設けられた温度調節手段８４によって、ベルトを介して接着シートＡＳを加熱する構成となっている。この場合、駆動プーリを駆動する駆動機器はなくてもよい。
規制手段８０は、当接部材８３や回行手段の位置を固定しておき、シート支持手段２０、被着体支持手段３０、移動手段４０および密閉空間形成手段５０を移動させて接着シートＡＳをウエハＷＦに貼付してもよいし、両方を移動させて接着シートＡＳをウエハＷＦに貼付してもよい。
規制手段８０は、エア噴き付けにより接着シートＡＳがウエハＷＦから所定の距離よりも離間することを規制してもよい。
温度調節手段８４は、ペルチェ素子やヒートパイプの冷却側等の冷却手段であってもよいし、加熱手段と冷却手段との両方を備えてもよい。
温度調節手段８４は、接着シートＡＳに紫外線、赤外線、Ｘ線、マイクロ波等を照射してもよく、接着シートＡＳの特性、組成、構成等に応じて適宜選択することができる。
温度調節手段８４は、流体供給手段７０が供給する流体を加熱したり冷却したりしてもよいし、なくてもよい。
本発明において規制手段８０は、なくてもよい。 In place of the contact member 83, the regulating means 80 is provided so as to be relatively movable in the surface direction with respect to the adhesive sheet AS, and rotates the belt as the contact member that can contact the adhesive sheet AS. Means may be provided. The revolving means includes a frame supported by the output shaft 82A of the linear motor 82 via a bracket, a driving pulley supported by the frame and driven by a driving device (not shown), and a driven that is supported by the frame and freely rotates. A pulley and a belt wound around the driving pulley and the driven pulley are provided, and the adhesive sheet AS is heated via the belt by the temperature adjusting means 84 provided inside the frame. In this case, there may be no drive device for driving the drive pulley.
The restricting means 80 fixes the positions of the contact member 83 and the turning means, and moves the sheet supporting means 20, the adherend supporting means 30, the moving means 40, and the sealed space forming means 50 to move the adhesive sheet AS. The adhesive sheet AS may be attached to the wafer WF by moving both of them to the wafer WF.
The restricting means 80 may restrict the adhesive sheet AS from being separated from the wafer WF by a predetermined distance by air blowing.
The temperature adjusting means 84 may be a cooling means such as a Peltier element or a cooling side of a heat pipe, or may include both a heating means and a cooling means.
The temperature adjusting means 84 may irradiate the adhesive sheet AS with ultraviolet rays, infrared rays, X-rays, microwaves, and the like, and can be appropriately selected according to the characteristics, composition, configuration, and the like of the adhesive sheet AS.
The temperature adjusting means 84 may or may not heat the fluid supplied by the fluid supply means 70.
In the present invention, the restricting means 80 may be omitted.

本発明において圧力検知手段９０は、なくてもよい。
被着体の形状は、円形、楕円形、三角形以上の多角形、その他の形状であってもよい。
接着シートＡＳは、リングフレームＲＦに貼付されていなくてもよい。
フレーム部材は、リングフレームＲＦ以外に、環状でない（外周が繋がっていない）ものや、円形、楕円形、三角形以上の多角形、その他の形状であってもよい。環状でないフレーム部材の場合、その隙間を閉塞可能な閉塞部を支持面２１Ａに設ければよい。 In the present invention, the pressure detecting means 90 may be omitted.
The shape of the adherend may be a circle, an ellipse, a polygon more than a triangle, or other shapes.
The adhesive sheet AS may not be attached to the ring frame RF.
In addition to the ring frame RF, the frame member may be non-annular (the outer periphery is not connected), a circle, an ellipse, a polygon more than a triangle, or other shapes. In the case of a non-annular frame member, a closing portion that can close the gap may be provided on the support surface 21A.

また、本発明における接着シートＡＳおよび被着体の材質、種別、形状等は、特に限定されることはない。例えば、接着シートＡＳは、円形、楕円形、三角形や四角形等の多角形、その他の形状であってもよいし、感圧接着性、感熱接着性等の接着形態のものであってもよく、感圧接着性の接着シートＡＳが採用された場合、温度調節手段８４は、あってもよいし、なくてもよい。また、このような接着シートＡＳは、例えば、接着剤層だけの単層のもの、基材シートと接着剤層との間に中間層を有するもの、基材シートの上面にカバー層を有する等３層以上のもの、更には、基材シートを接着剤層から剥離することのできる所謂両面接着シートのようなものであってもよく、両面接着シートは、単層又は複層の中間層を有するものや、中間層のない単層又は複層のものであってよい。また、被着体としては、例えば、食品、樹脂容器、シリコン半導体ウエハや化合物半導体ウエハ等の半導体ウエハ、回路基板、光ディスク等の情報記録基板、ガラス板、鋼板、陶器、木板または樹脂板等、任意の形態の部材や物品なども対象とすることができる。なお、接着シートＡＳを機能的、用途的な読み方に換え、例えば、情報記載用ラベル、装飾用ラベル、保護シート、ダイシングテープ、ダイアタッチフィルム、ダイボンディングテープ、記録層形成樹脂シート等の任意の形状の任意のシート、フィルム、テープ等を前述のような任意の被着体に貼付することができる。   Further, the material, type, shape and the like of the adhesive sheet AS and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS may be a circle, an ellipse, a polygon such as a triangle or a quadrangle, or other shapes, or may be of an adhesive form such as pressure sensitive adhesive or heat sensitive adhesive, When the pressure sensitive adhesive sheet AS is employed, the temperature adjusting means 84 may or may not be provided. Such an adhesive sheet AS is, for example, a single layer having only an adhesive layer, an intermediate layer between the base sheet and the adhesive layer, a cover layer on the upper surface of the base sheet, etc. Three or more layers, or a so-called double-sided adhesive sheet that can peel the base sheet from the adhesive layer may be used. The double-sided adhesive sheet comprises a single-layer or multi-layer intermediate layer. It may be a single layer or a multilayer having no intermediate layer. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes and the like can be attached to any adherend as described above.

本発明における手段および工程は、それら手段および工程について説明した動作、機能または工程を果たすことができる限りなんら限定されることはなく、まして、前記実施形態で示した単なる一実施形態の構成物や工程に全く限定されることはない。例えば、シート支持手段は、接着シートの外縁部を支持可能なものであれば、出願当初の技術常識に照らし合わせ、その技術範囲内のものであればなんら限定されることはない（他の手段および工程についての説明は省略する）。
また、前記実施形態における駆動機器は、回動モータ、直動モータ、リニアモータ、単軸ロボット、多関節ロボット等の電動機器、エアシリンダ、油圧シリンダ、ロッドレスシリンダおよびロータリシリンダ等のアクチュエータ等を採用することができる上、それらを直接的又は間接的に組み合せたものを採用することもできる（実施形態で例示したものと重複するものもある）。 The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, the sheet supporting means is not limited as long as it can support the outer edge of the adhesive sheet in light of the technical common sense at the time of filing and is within the technical scope (other means). And description of the process is omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

１０Ａ 支持装置
２０ シート支持手段
３０ 被着体支持手段
４０ 移動手段
５０ 密閉空間形成手段
７０ 流体供給手段
ＡＳ 接着シート
ＳＰ 密閉空間
ＷＦ ウエハ（被着体） 10A support device 20 sheet support means 30 adherend support means 40 moving means 50 sealed space forming means 70 fluid supply means AS adhesive sheet SP sealed space WF wafer (adhered body)

Claims (3)

接着シートの外縁部を支持するシート支持手段と、
被着体を支持する被着体支持手段と、
離間接近する方向に前記シート支持手段および被着体支持手段を相対移動可能な移動手段と、
前記シート支持手段および被着体支持手段の相対移動によって移動可能に設けられ、前記被着体に追従して移動することで、当該被着体を囲む密閉空間を形成可能な密閉空間形成手段とを備えていることを特徴とする支持装置。 Sheet support means for supporting the outer edge of the adhesive sheet;
An adherend support means for supporting the adherend;
Moving means capable of relatively moving the sheet support means and the adherend support means in the direction of approaching and separating,
A sealed space forming means provided so as to be movable by relative movement of the sheet support means and the adherend support means, and capable of forming a sealed space surrounding the adherend by moving following the adherend; A support device comprising: 前記密閉空間に流体を供給する流体供給手段を備えていることを特徴とする請求項１に記載の支持装置。   The support device according to claim 1, further comprising a fluid supply unit configured to supply a fluid to the sealed space. 接着シートの外縁部をシート支持手段で支持するシート支持工程と、
被着体を被着体支持手段で支持する被着体支持工程と、
離間接近する方向に前記シート支持手段および被着体支持手段を相対移動させる移動工程と、
前記移動工程の際に密閉空間形成手段が前記被着体に追従して移動することで、当該被着体を囲む密閉空間を形成する密閉空間形成工程とを備えていることを特徴とする支持方法。 A sheet support step of supporting the outer edge of the adhesive sheet with a sheet support means;
An adherend support step for supporting the adherend with an adherend support means;
A moving step of relatively moving the sheet support means and the adherend support means in the direction of separating and approaching;
In Rukoto be moved following the adherend is sealed space forming means during said moving step, characterized in that it comprises a closed space forming a closed space surrounding the adherend Support method.
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