TWI741866B - Device for pasting wafer template and operation method thereof - Google Patents

Abstract

A device for pasting wafer template and operation method thereof. The device includes a box body, a door, a driving assembly, a joint base, and a positioning base. The box body has a chamber and an opening communicating with the chamber which communicates with a pumping device. The door is pivotally disposed on the box body. The driving assembly includes a driving element and a moving element, wherein the driving element drives the moving element to move along an axis. The joint base for engaging a chemical-mechanical polishing head is connected to the moving element. The positioning base is disposed at a bottom face of the chamber. The positioning base has a cavity which has an upper cavity section and a lower cavity section communicating with each other. The lower cavity section is under the upper cavity section and is for accommodating the wafer template. The width of the upper cavity section is enlarged from bottom up. The wafer template can be pasted on the chemical-mechanical polishing head through the operation method for improving the pasting quality.

Description

Apparatus for attaching wafer carrier and its operation method

The present invention is related to chemical mechanical polishing of wafers; in particular, it refers to a laminating device for wafer carriers for chemical mechanical polishing.

Wafers are cut from ingots. Before semiconductor components are fabricated on the wafer, the surface of the wafer is usually polished to flatten the surface of the wafer to facilitate subsequent manufacturing processes. A commonly used polishing technique is chemical mechanical polishing, in which a wafer is fixed on a chemical mechanical polishing head through a wafer carrier, and the chemical mechanical polishing head is used to press the wafer against a polishing pad for polishing. The wafer carrier has an adhesive layer, and the wafer carrier is attached to the chemical mechanical polishing head with the adhesive layer.

The flatness of the wafer after chemical mechanical polishing depends on the quality of the wafer carrier. In the past, the wafer carrier was manually applied by the operator. With the cleanliness of the operating environment and the difference caused by the operation of the personnel, It may cause poor bonding uniformity or uneven quality, such as the formation of air bubbles between the adhesive layer and the chemical mechanical polishing head, or the offset of the bonding position, resulting in local or overall flatness of the polished wafer The problem of deterioration affects the flatness performance of the entire wafer.

In view of this, the purpose of the present invention is to provide a wafer carrier attaching device and an operating method thereof, which can improve the quality of wafer carrier attaching.

In order to achieve the above objective, the present invention provides a wafer carrier attaching device for attaching a wafer carrier to a chemical mechanical polishing head. The attaching device includes a box, a box door, and a drive. Assembly, a coupling seat and a positioning seat, wherein the box body has a chamber and an opening communicating with the chamber, the chamber has a bottom surface, and the chamber communicates with an air extraction device; the box door is pivoted on The box body is used to close the opening; the drive assembly is disposed on the box body, the drive assembly includes a drive piece and a moving piece, the moving piece is located in the chamber, the drive piece is connected to the moving piece and drives the movement The part approaches or is far away from the bottom surface of the chamber along an axial direction; the coupling seat is connected to the moving part and is for coupling with the chemical mechanical polishing head; the positioning seat is arranged on the bottom surface of the chamber and is located below the coupling seat, The positioning seat has a ring wall, and the ring wall surrounds to form a pocket; the pocket has a connected lower slot section and an upper slot section, the lower slot section is located below the upper slot section and is used for placing the wafer carrier, the The groove width of the upper groove section gradually expands from bottom to top.

The operation method of the wafer carrier attaching device provided by the present invention includes the following steps:

Open the box door, place the chemical mechanical polishing head in the chamber of the box body, the chemical mechanical polishing head has a coupling groove, and the coupling groove faces the coupling seat;

The driving member drives the moving member to move down, so that the coupling seat is coupled to the coupling groove;

The driving part drives the moving part to move upward to lift the chemical mechanical polishing head upward;

Placing the wafer carrier in the lower slot section of the pocket of the positioning seat, the wafer carrier having an adhesive layer facing upward;

Close the box door, and start the pumping device to pump air to the chamber;

After the pressure in the chamber is lower than a predetermined pressure, the driving member drives the moving member to move down, so as to drive the chemical mechanical polishing head to move down into the tank, and the driving member is used for a predetermined period of time. Provide the following amount of pressure so that the bottom surface of the chemical mechanical polishing head presses down against the adhesive layer of the wafer carrier;

After the predetermined period of time, the driving member releases the amount of down force;

The pressure of the chamber is increased, the door of the box is opened, and the coupling seat should be moved away from the coupling groove of the chemical mechanical polishing head.

The effect of the present invention is that the wafer carrier is pasted in the evacuated chamber, which can effectively prevent bubbles from being generated when the wafer carrier is pasted, thereby effectively improving the quality of wafer carrier pasting. The upper groove section of the positioning seat has a guiding function, so that the chemical mechanical polishing head can be accurately positioned on the wafer carrier.

In order to explain the present invention more clearly, the preferred embodiments are described in detail in conjunction with the drawings as follows. Please refer to FIG. 1 to FIG. 10, which is a wafer carrier attaching device 100 according to the first preferred embodiment of the present invention. The attaching device 100 includes a box body 10, a box door 26, a drive assembly 28, and a Combining seat 38 and a positioning seat 46, in which:

The box body 10 has a cavity 12 inside, an outer side 14 of the box 10 has an opening 142 communicating with the cavity 12, and the outer side 14 optionally has a sealing ring 16 surrounding the opening 142. The cavity 12 has a bottom surface 122, and the bottom surface 122 is recessed to form a positioning hole 122a. The box body 10 is connected with an exhaust pipe 18 which communicates with the chamber 12 and is connected to an exhaust device (not shown in the figure). The exhaust device may be, for example, a vacuum pump. A fastener 20 (refer to FIG. 2) is pivoted on one side of the box body 10, and the fastener 20 can be pulled by the user. Two observation windows 22 are provided on the top of the box body 10 for the user to observe the situation in the chamber 12. The observation window 22 can also be one. A pressure gauge 24 is provided on the box body 10, and the pressure gauge 24 is in communication with the chamber 12 for observing the pressure in the chamber 12.

The box door 26 is located outside the opening 142 to close or open the opening 142. The box door 26 has two opposite sides. One side is pivotally connected to the box body 10, and the other side is provided with a hook 262 (refer to Figure 2 ). The user can pull the fastener 20 to buckle the hook 262 so that the box door 26 is tightly leaned against the outer side surface 14 of the box body 10 to close the opening 142.

The driving assembly 28 is arranged on the box body 10. The driving assembly 28 includes a driving member 30 and a moving member 32. The driving member 30 is arranged on the top of the box body 10. In this embodiment, the driving member 30 is a pneumatic cylinder, but this is not the case. For limitation, it can also be a motor. The moving part 32 is connected to the driving part 30 and passes through the box body 10 and is located in the chamber 12. The moving part 32 is elongated. The rod 34 is connected between the driving member 30 and the coupling post 36, and the coupling post 36 has a flange 362. The driving member 30 can drive the moving member 32 to approach or move away from the bottom surface 122 of the chamber 12 along an axial direction i.

The coupling base 38 is connected to the moving part 32, and the coupling base 38 is used for coupling with a chemical mechanical polishing head 200 shown in FIGS. 11 and 12. In this embodiment, the coupling base 38 is rotatable along the axial direction i, and the coupling base 38 is provided with at least one holding portion 40 for a person to rotate the coupling base 38. The coupling seat 38 has a connecting pipe 42 and a plate body 44. The connecting pipe 42 has a shaft hole 422. The bottom end of the connecting pipe 42 is detachably connected to the plate body 44. 424 is located on the periphery of the shaft hole 422 and communicates with the shaft hole 422. The coupling column 36 of the moving member 32 passes through the connecting pipe 42 and the flange 362 is located in the ring groove 424. The outer edge of the disc body 44 has a plurality of locking blocks 442, and the four holding parts 40 are located on the top of the disc body 44.

The positioning seat 46 is disposed on the bottom surface 122 of the chamber 12 and located below the coupling seat 38. In this embodiment, the positioning seat 46 is detachable from the bottom surface 122 of the chamber 12. Please refer to Figures 7-9. The positioning seat 46 has a ring wall 48 surrounding the ring wall 48 to form a pocket 50. The pocket 50 has a connected lower slot segment 502 and an upper slot segment 504, and the lower slot segment 502 is located in the upper slot. Below the section 504, the groove width of the upper groove section 504 gradually expands from bottom to top. In this embodiment, the groove wall 504a of the upper groove section 504 is a tapered surface, and an extension line 504b of the groove wall forms an included angle θ with the groove bottom 50a of the receiving groove 50, and the included angle θ is 50 to 85 degrees. The ring wall 48 has a plurality of cut grooves 52, and the cut grooves 52 communicate with the receiving groove 50, and the cut grooves 52 may be one, two or three. The bottom of the positioning seat 46 is provided with a positioning block 54 for extending into the positioning hole 122 a on the bottom surface 122 of the chamber 12 so that the positioning seat 46 can be located at a predetermined position in the chamber 12. The positioning block 54 may be cylindrical and abut against the hole wall of the positioning hole 122a.

Please cooperate with FIG. 11 and FIG. 12, the top of the chemical mechanical polishing head 200 has a coupling groove, and the opening and the inner shape of the coupling groove 202 are matched with the disc body 44 of the coupling base 38 and slightly larger than the disc body 44, so that the coupling base 38 The disc body 44 can be inserted into the coupling groove 202 to form a fit. In this embodiment, a loose fit is taken as an example, but it is not limited to this.

Hereinafter, please refer to FIGS. 13 to 19 to describe the operation method of the pasting device 100 of this embodiment.

Please cooperate with FIG. 13, open the door 26, place the chemical mechanical polishing head 200 in the chamber 12 of the cabinet 10, and the coupling groove 202 of the chemical mechanical polishing head 200 faces the coupling seat 38. In this embodiment, the user can place the chemical mechanical polishing head 200 in the pocket 50 of the positioning seat 46. In one embodiment, before placing the chemical mechanical polishing head 200 into the chamber 12, the positioning seat 46 can be taken out of the chamber 12 first, and then the chemical mechanical polishing head 200 can be placed on the bottom surface 122 of the chamber 12.

Please cooperate with FIG. 14 to control the driving member 30 to drive the moving member 32 to move down, so that the coupling base 38 is combined with the coupling groove 202, and the coupling base 38 and the coupling groove 202 are loosely fitted. In this embodiment, the user can rotate the disc body 44 by grasping the grip 40 by hand, so that the position of the locking block 442 of the disc body 44 corresponds to the opening 202a of the coupling groove 202, and after the disc body 44 enters the coupling groove 202 , And then rotate the disc body 44 so that the locking block 442 is locked in the coupling groove 202.

Then, the driving member 30 can be controlled to drive the moving member 32 to move upward, so as to lift the chemical mechanical polishing head 200 upward.

15-17, the wafer carrier 300 is placed in the lower groove section 502 of the receiving groove 50 of the positioning base 46, and the wafer carrier 300 has an adhesive layer 302 facing upward. In this embodiment, the wafer carrier includes a sheet-shaped carrier 304 and a stop ring 306 coupled to the periphery of the bottom surface of the carrier 304, and an adhesive layer 302 is provided on the top surface of the carrier 304. The range surrounded by the stop ring 306 is provided for wafers (not shown). Before placing the wafer carrier 300, a backing plate 56 and a cushioning pad 58 can be placed in the lower slot section 502 of the container 50. The backing plate 56 can be made of plastic or Teflon. The buffer pad 58 is disposed on the backing plate 56. The shape and thickness of the buffer pad 58 can be the same as those of the wafer. The buffer pad 58 is made of a soft material, such as silicone. A gasket 60 can be further provided on the periphery of the cushion 58. The gasket 60 is located on the cushion plate and surrounds the cushion 58. The thickness of the gasket 60 is smaller than the thickness of the cushion 58. The thickness of the washer 60 may be the same as that of the stop ring 306. After the wafer carrier 300 is placed in the lower groove section 502 of the receiving groove 50, the stop ring 306 will abut against the washer 60, and the bottom surface of the carrier 304 abuts against the top surface of the cushion 58. Since the cut groove 52 is in communication with the lower groove section 502 and the lower groove section 504 of the tank 50, when the backing plate 56 is inserted, air can be discharged from the cut groove 52, so that the backing plate 56 is placed on the groove bottom 50a evenly.

In this embodiment, the positioning seat 46 is taken out of the chamber 12, so that the wafer carrier 300 is placed in the lower slot section 502 of the pocket 50 of the positioning seat 46 outside the box body 10, and then the wafer carrier 300 is provided. The positioning seat 46 is placed on the bottom surface 122 of the chamber 12. In an embodiment, the positioning seat 46 may not be taken out, and the backing plate 56, the cushioning pad 58, the gasket 60 and the wafer carrier 300 may be directly placed in the chamber 12.

Then, the box door 26 can be closed, and the air extraction device can be activated to extract air from the chamber 12.

Please cooperate with FIGS. 18-19. After the pressure in the chamber 12 is lower than a predetermined pressure, the driving member 30 is controlled to drive the moving member 32 to move down, so as to drive the chemical mechanical polishing head 200 to move down into the receiving slot 50 of the positioning seat 46 In a predetermined period of time, the driving member 30 provides a pressure amount to make the bottom surface of the chemical mechanical polishing head 200 press down against the adhesive layer 302 of the wafer carrier 300. When the chemical mechanical polishing head 200 moves downward into the tank 50, if there is residual air between the chemical mechanical polishing head 200 and the adhesive layer 302, it can also be discharged from the slot 52.

In this embodiment, the predetermined pressure is 20 mm-Hg. The amount of down force provided by the driving member 30 is 0.4Mpa. The predetermined time period can be 2 minutes. In practice, the amount of down force can be 0.1 MPa to 0.45 Mpa, and the range of the corresponding predetermined time period can be 1 to 3 minutes. The predetermined time period is inversely proportional to the amount of down force.

Since the coupling seat 38 and the coupling groove 202 of the chemical mechanical polishing head 200 are loosely fitted, the chemical mechanical polishing head 200 may be off-side and located directly above the groove wall 504a of the upper groove section 504. At this time, as shown in FIG. 19, when the chemical mechanical polishing head 200 moves down into the tank 50, the chemical mechanical polishing head 200 will be guided by the groove wall 504a of the upper groove section 504 and displaced laterally to enter the lower groove section 502 . In this way, the purpose of positioning is achieved.

Due to the low pressure in the chamber 12, when the chemical mechanical polishing head 200 abuts against the adhesive layer 302 of the wafer carrier 300, it can effectively avoid the presence of air between the bottom surface of the chemical mechanical polishing head 200 and the adhesive layer 302. Air bubbles are generated. By setting the buffer pad 58 as a buffer when the chemical mechanical polishing head 200 is pressed down, the bonding effect can be better.

After the chemical mechanical polishing head 200 is pressed down for the predetermined period of time, the driving member 30 is controlled to release the amount of pressing force.

Then, the vacuum can be broken to increase the pressure of the chamber 12, and the box door 26 can be opened, and the coupling seat 38 can be moved away from the coupling groove 202 of the chemical mechanical polishing head 200. For example, the angle of the disc body 44 of the coupling seat 38 can be rotated first, so that the clamping block 442 corresponds to the opening of the coupling groove 202, and then the driving member 30 is controlled to drive the coupling seat 38 to move upward, and the wafer carrier can be removed from the positioning seat 46 and pasted. A chemical mechanical polishing head 200 with 300 (refer to FIG. 20).

In addition, the chemical mechanical polishing head 200 can also be heated to a predetermined temperature. The predetermined temperature can be 40 to 80°C. At this time, since the temperature of the chemical mechanical polishing head 200 is higher than room temperature, the adhesive layer 302 can be changed. It is soft and has sufficient reaction speed to allow air to escape and avoid bubbles. Exceeding the predetermined temperature may cause damage to the carrier 304.

In another embodiment, the plate 44 of the coupling seat 38 can also be matched with the shape of the opening and the inside of the coupling groove 202, and can be fixedly combined. When the chemical mechanical polishing head 200 is slightly offset to the upper groove of the positioning seat 46 When the groove wall of the section 504 is above the groove wall, the groove wall of the upper groove section 504 of the positioning seat 46 can still guide the chemical mechanical polishing head 200 into the lower groove section 502.

In a second preferred embodiment, the operation method of the application device 100 is substantially the same as that of the first embodiment. The difference is that the predetermined period of time during which the chemical mechanical polishing head 200 is pressed down can be a plurality of periods. It includes a first time period and a second time period. In the first time period, the amount of down force is a first down force, and in the second time period, the amount of down force is a second down force, wherein the second time period is greater than the first down force. Time period, and the second down force is greater than the first down force. In the first period, there is a shorter time and a smaller amount of down force, so that the air between the adhesive layer 302 and the chemical mechanical polishing head 200 is eliminated; in the second period, there is a longer time and a larger amount of down force. The purpose of the downward pressure is to allow the adhesive layer 302 to have enough time and pressure to closely adhere to the chemical mechanical polishing head 200; in this embodiment, the first period is 25 to 30 seconds, and the second period is 60 to 80 Second. The first down pressure is 0.1~0.2Mpa, and the second down pressure is 0.35~0.45Mpa.

Please refer to FIGS. 21 and 22, which are schematic diagrams of the sticking device of the third preferred embodiment of the present invention. It has substantially the same structure as that of the first embodiment. The difference is that the cushion 64 has an upper surface 642. 642 bulges upward from its peripheral part to the central part. In this embodiment, the height difference H between the central part and the peripheral part of the upper surface 642 is 5 to 200 μm. With the design that the central part of the cushion 64 is raised upwards, when the chemical mechanical polishing head 200 is pressed down, the power of the chemical mechanical polishing head 200 can first be concentrated on the central part of the adhesive layer 302, which is conducive to the air to the adhesive layer 302. Squeeze out the peripheral part to avoid air bubbles. The pasting device of this embodiment can also apply the operation methods of the above-mentioned embodiments.

Please refer to Figures 23 to 25, which are schematic diagrams of the application device of the fourth preferred embodiment of the present invention, based on the third embodiment. The difference is that the chemical mechanical polishing head 400 includes a top seat 402 and a flexible The top seat 402 has a coupling groove 402a, and an inflation nozzle 406 is provided on the top seat 402. The flexible plate 404 is combined with the bottom of the top seat 402 and forms a cavity 408 with the top seat 402. The cavity 408 Connecting to the gas nozzle 406, the bottom surface 404a of the flexible plate 404 constitutes the bottom surface of the chemical mechanical polishing head 400. The cavity 408 can be inflated through the inflation nozzle 406, so that the flexible plate 404 protrudes downward. In addition, the plate body 662 of the coupling seat 66 has a groove 662 a to accommodate the inflation nozzle 406.

The operation method of the sticking device of this embodiment includes before placing the chemical mechanical polishing head 400 into the chamber 408, inflating the chamber 408 through the inflating nozzle 406, so that the lower surface 404a of the flexible plate 404 protrudes downward . Preferably, after the lower surface 404a of the flexible plate 404 protrudes, the height difference H between the central part and the peripheral part thereof is 5 to 200 μm.

Then, when the bottom surface of the chemical mechanical polishing head 400 is pressed against the adhesive layer 302 of the wafer carrier 300, the central part of the lower surface 404a of the flexible board 404 first contacts the adhesive layer 302 of the wafer carrier 300 The central part, and then gradually contact the adhesive layer 302 of the wafer carrier 300 from the central part of the lower surface 404a to the peripheral part of the lower surface 404a, which is good for squeezing air to the peripheral part of the adhesive layer 302. In this embodiment, with the design that the central part of the buffer pad 64 protrudes upwards, the central part of the flexible board 404 and the central part of the adhesive layer 302 can be more surely attached to avoid the generation of air bubbles.

The chemical mechanical polishing head 400 and the bonding base 66 of this embodiment can also be applied to the first and second embodiments.

According to the above, the present invention can effectively avoid air bubbles when the wafer carrier 300 is laminated by attaching the wafer carrier 300 in the evacuated chamber 12, thereby effectively improving the wafer carrier 300 quality. It is worth mentioning that the upper groove section 504 of the positioning seat 46 has a guiding function, so that the chemical mechanical polishing head can be accurately positioned on the wafer carrier 300.

The above are only the preferred and feasible embodiments of the present invention. Any equivalent changes made by applying the specification of the present invention and the scope of the patent application should be included in the patent scope of the present invention.

[this invention] 100: Pasting device 10: Cabinet 12: Chamber 122: Bottom 122a: positioning hole 14: Outer side 142: Open 16: Sealing ring 18: Exhaust pipe 20: fasteners 22: Observation window 24: pressure gauge 26: box door 262: hook 28: drive components 30: Driver 32: Moving parts 34: putter 36: binding column 362: Flange 38: Combination seat 40: Grip 42: connecting pipe 422: Shaft hole 424: ring groove 44: Disc body 442: Card Block 46: positioning seat 48: Ring Wall 50: Tolerance 50a: bottom of the groove 502: lower slot section 504: upper slot section 504a: Groove wall 504b: extension cord 52: grooving 54: positioning block 56: Pad 58: cushion 60: Washer 64: cushion 642: upper surface 66: Combination seat 662: Disc body 662a: Groove 400: Chemical mechanical polishing head 402: Top Block 402a: Combination groove 404: Flexible board 404a: lower surface 406: Inflatable Mouth 408: Chamber 200: Chemical mechanical polishing head 202: Combination Groove 202a: opening 300: Wafer carrier 302: Adhesive layer 304: carrier 306: limit ring H: height difference i: axial θ: included angle

FIG. 1 is a perspective view of a wafer carrier attaching device according to the first preferred embodiment of the present invention. Figure 2 is a schematic diagram showing that the fastener is fastened to the hook. Figure 3 is an exploded perspective view of the wafer carrier attaching device of the above preferred embodiment. Figure 4 is a perspective view of the coupling base of the above preferred embodiment. Figure 5 is a top view of the coupling seat of the above preferred embodiment. Figure 6 is a cross-sectional view of Figure 5 in the direction of 6-6. Fig. 7 is a perspective view of the positioning base of the above-mentioned preferred embodiment. Figure 8 is a top view of the positioning seat of the above preferred embodiment. Figure 9 is a cross-sectional view of Figure 7 in the direction of 9-9. Figure 10 is a schematic diagram showing the internal configuration of the box of the pasting device. Figure 11 is a cross-sectional view of the chemical mechanical polishing head of the above preferred embodiment. Fig. 12 is a top view of the chemical mechanical polishing head of the above preferred embodiment. Figure 13 is a schematic diagram showing that the chemical mechanical polishing head is placed in the chamber. FIG. 14 is a schematic diagram showing that the bonding base is bonded to the bonding groove of the chemical mechanical polishing head. FIG. 15 is a schematic diagram showing that the wafer carrier is placed in the positioning seat. FIG. 16 is a schematic diagram showing that the wafer carrier is located in the positioning seat. FIG. 17 is a schematic diagram showing that the wafer carrier and the positioning seat are located under the chemical mechanical polishing head. FIG. 18 is a schematic diagram showing that the chemical mechanical polishing head is pressed against the wafer carrier. Fig. 19 is a schematic diagram showing that the upper groove section of the container guides the movement of the chemical mechanical polishing head. FIG. 20 is a schematic diagram of a wafer carrier attached to a chemical mechanical polishing head. FIG. 21 is a schematic diagram of the wafer carrier in the third preferred embodiment of the present invention being placed in the positioning seat. FIG. 22 is a schematic diagram showing that the chemical mechanical polishing head is pressed against the wafer carrier. Fig. 23 is a chemical mechanical polishing head according to the fourth preferred embodiment of the present invention. FIG. 24 is a schematic diagram showing that the bonding base is bonded to the bonding groove of the chemical mechanical polishing head. FIG. 25 is a schematic diagram showing that the chemical mechanical polishing head is pressed against the wafer carrier.

100: Pasting device

10: Cabinet

18: Exhaust pipe

22: Observation window

24: pressure gauge

26: box door

262: hook

28: drive components

30: Driver

Claims (25)

A wafer carrier attaching device for attaching a wafer carrier to a chemical mechanical polishing head. The attaching device includes: a box with a chamber and an opening communicating with the chamber, the chamber It has a bottom surface, and the chamber communicates with an air extraction device; a box door pivoted on the box body for closing the opening; a driving assembly disposed on the box body, the driving assembly including a driving part and a moving part The moving part is located in the chamber, the driving part is connected to the moving part and drives the moving part to approach or move away from the bottom surface of the chamber along an axial direction; a coupling seat is connected to the moving part and is supplied with the chemical The mechanical grinding head is combined; a positioning seat is arranged on the bottom surface of the chamber and located below the joint seat, the positioning seat has a ring wall, and the ring wall surrounds a pocket; the pocket has a connected lower groove section and An upper groove section, the lower groove section is located below the upper groove section and is used for placing the wafer carrier, the groove width of the upper groove section gradually expands from bottom to top; a backing plate and a cushioning pad, the backing plate is provided In the lower groove section of the receiving groove of the positioning seat, the cushion is arranged on the cushion plate; wherein, the cushion has an upper surface, and the upper surface protrudes upward from the peripheral part to the central part. The wafer carrier attaching device according to claim 1, wherein the groove wall of the upper groove section is a tapered surface. The wafer carrier attaching device according to claim 2, wherein an extension line of the groove wall of the upper groove section forms an included angle with the groove bottom of the receiving groove, and the included angle is 50 to 85 degrees. The wafer carrier attaching device according to claim 1, wherein the ring wall of the positioning seat has at least a cut groove communicating with the receiving groove. The wafer carrier attaching device according to claim 1, wherein the positioning seat is detachably provided on the bottom surface of the chamber. The wafer carrier attaching device according to claim 5, wherein the bottom surface of the cavity is recessed to form a positioning hole, the bottom of the positioning seat has a positioning block, and the positioning block extends into the positioning hole. The wafer carrier attaching device according to claim 1, wherein the height difference between the central part and the peripheral part of the upper surface is 5 to 200 μm. The wafer carrier attaching device according to claim 1, comprising a gasket disposed on the backing plate and surrounding the cushioning pad, and the thickness of the gasket is smaller than the thickness of the cushioning pad. The wafer carrier attaching device according to claim 1, wherein the coupling seat can be rotated along the axial direction. The wafer carrier attaching device according to claim 9, wherein the coupling base is provided with at least one holding portion for personnel to rotate the coupling base. A wafer carrier attaching device for attaching a wafer carrier to a chemical mechanical polishing head. The attaching device includes: a box with a chamber and an opening communicating with the chamber, the chamber It has a bottom surface, and the chamber communicates with an air extraction device; a box door pivoted on the box body for closing the opening; a driving assembly disposed on the box body, the driving assembly including a driving part and a moving part The moving part is located in the chamber, the driving part is connected to the moving part and drives the moving part to approach or move away from the bottom surface of the chamber along an axial direction; a coupling seat is connected to the moving part and is supplied with the chemical The mechanical grinding head is combined; a positioning seat is arranged on the bottom surface of the chamber and located below the joint seat, the positioning seat has a ring wall, and the ring wall surrounds a pocket; the pocket has a connected lower groove section and One on The groove section, the lower groove section is located below the upper groove section and is used for placing the wafer carrier, the groove width of the upper groove section gradually expands from bottom to top; wherein, the moving part has a flange; the coupling seat has A ring groove, the flange is located in the ring groove; wherein the coupling seat has a connecting tube and a disc body, the bottom end of the connecting tube is connected to the disc body, the connecting tube has a shaft hole, and the ring groove is located in the shaft hole The periphery is communicated with the shaft hole; the moving part has a cylindrical coupling column, the coupling column has the flange, the coupling column passes through the shaft hole and the flange is located in the ring groove. An operating method of a wafer carrier attaching device, wherein the attaching device is used for attaching a wafer carrier to a chemical mechanical polishing head, and the attaching device includes: a box with a chamber and An opening communicates with the chamber, the chamber has a bottom surface, and the chamber communicates with an air extraction device; a box door pivotally arranged on the box body for closing the opening; a driving assembly arranged on the box body, The driving assembly includes a driving part and a moving part, the moving part is located in the chamber, the driving part is connected to the moving part and drives the moving part to approach or move away from the bottom surface of the chamber in an axial direction; a coupling seat, Connected to the moving part and used to be combined with the chemical mechanical polishing head; a positioning seat disposed on the bottom surface of the chamber and located below the combining seat, the positioning seat having a ring wall, and the ring wall surrounds to form a pocket; The container has a connected lower groove section and an upper groove section, the lower groove section is located below the upper groove section and is used for placing the wafer carrier, and the groove width of the upper groove section gradually expands from bottom to top; this operation The method includes the following steps: opening the door of the box, placing the chemical mechanical polishing head in the chamber of the box body, the chemical mechanical polishing head having a coupling groove facing the coupling seat; the driving member drives the movement Move down, so that the coupling seat is coupled to the coupling groove; the driving element drives the moving element to move up, so as to lift the chemical mechanical polishing head upward; The wafer carrier is placed in the lower slot section of the cavity of the positioning seat, the wafer carrier has an adhesive layer facing upwards; the box door is closed, and the air extraction device is activated to extract air from the chamber; After the pressure in the chamber is lower than a predetermined pressure, the driving member drives the moving member to move down to drive the chemical mechanical polishing head to move down into the tank, and the driving member provides for a predetermined period of time The lower pressure amount causes the bottom surface of the chemical mechanical polishing head to press down against the adhesive layer of the wafer carrier; after the predetermined period of time, the driving member releases the lower pressure amount; causes the pressure of the chamber to rise and open The door of the box and the combination seat should be moved away from the combination groove of the chemical mechanical polishing head. The operation method of the wafer carrier attaching device according to claim 12, wherein when the chemical mechanical polishing head is located directly above the groove wall of the upper groove section, and the chemical mechanical polishing head moves downward into the container At this time, the chemical mechanical polishing head will be guided by the groove wall of the upper groove section to move laterally to enter the lower groove section. The operating method of the wafer carrier attaching device according to claim 12, wherein when the chemical mechanical polishing head is placed in the chamber, the chemical mechanical polishing head is placed in the cavity of the positioning base. The operation method of the wafer carrier attaching device according to claim 12, wherein before placing the chemical mechanical polishing head into the chamber, the positioning seat is first taken out of the chamber; the chemical mechanical polishing head is upward After moving, place the positioning seat on the bottom surface of the chamber. The operation method of the wafer carrier attaching device according to claim 12, wherein the positioning base is taken out of the chamber, so that the wafer carrier is placed outside the box outside the lower groove of the receiving groove of the positioning base In the section, the positioning seat provided with the wafer carrier is placed on the bottom surface of the chamber. The operation method of the wafer carrier attaching device according to claim 12, wherein the predetermined pressure is 20 mm-Hg. The operating method of the wafer carrier attaching device according to claim 12, wherein the predetermined time period is 1 to 3 minutes. The operating method of the wafer carrier attaching device according to claim 12, wherein the predetermined time period includes a first time period and a second time period, and in the first time period, the amount of down force is a first time period Pressure, in the second period, the amount of down force is a second down force, wherein the second period is greater than the first period, and the second down force is greater than the first down force. The operating method of the wafer carrier attaching device according to claim 12, wherein the first down force is 0.1 to 0.25 Mpa, and the second down force is 0.35 to 0.45 Mpa. The operation method of the wafer carrier attaching device according to claim 12 includes heating the chemical mechanical polishing head to a predetermined temperature, and the predetermined temperature is 40 to 80°C. The operating method of the wafer carrier attaching device according to claim 12, wherein the chemical mechanical polishing head includes a top seat and a flexible plate, the top seat has the coupling groove, and the top seat is provided with an air filling nozzle The flexible plate is combined with the bottom of the top seat and forms a cavity with the top seat, the cavity is connected to the inflation nozzle, and the lower surface of the flexible plate constitutes the bottom surface of the chemical mechanical polishing head; the operation The method includes before placing the chemical mechanical polishing head into the chamber, inflating the chamber through the gas filling nozzle, so that the lower surface of the flexible plate protrudes downward; the bottom surface of the chemical mechanical polishing head is pressed down against When leaning against the adhesive layer of the wafer carrier, the central part of the lower surface of the flexible board first contacts the adhesive layer of the wafer carrier, and then from the central part of the lower surface to the peripheral part of the lower surface Gradually contact the adhesive layer of the wafer carrier. The operating method of the wafer carrier attaching device according to claim 22, wherein after the lower surface of the flexible board is protruded, the height difference between the central part and the peripheral part of the lower surface of the flexible board is 5 ~200μm. The operation method of the wafer carrier attaching device according to claim 12, wherein, before placing the wafer carrier in the lower slot section of the pocket of the positioning base, it includes: setting a backing plate on the positioning base The lower groove section of the containing groove, and a cushioning pad is arranged on the backing plate. The operation method of the wafer carrier attaching device according to claim 12, wherein, before placing the wafer carrier in the lower groove section of the receiving groove of the positioning base, it comprises: placing a washer on the backing plate And surrounding the cushion pad, the thickness of the washer is smaller than the thickness of the cushion pad.

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