CN112786497B - Inverted vacuum wafer film pasting device - Google Patents
Inverted vacuum wafer film pasting device Download PDFInfo
- Publication number
- CN112786497B CN112786497B CN202110235041.9A CN202110235041A CN112786497B CN 112786497 B CN112786497 B CN 112786497B CN 202110235041 A CN202110235041 A CN 202110235041A CN 112786497 B CN112786497 B CN 112786497B
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- vacuum cavity
- wafer
- film
- cavity
- vacuum
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- 238000001179 sorption measurement Methods 0.000 claims abstract description 30
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 52
- 229910052742 iron Inorganic materials 0.000 claims description 26
- 238000007789 sealing Methods 0.000 claims description 8
- 210000001503 joint Anatomy 0.000 claims description 4
- 241000252254 Catostomidae Species 0.000 claims description 2
- 239000010408 film Substances 0.000 description 40
- 238000000034 method Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
Abstract
The invention relates to a film sticking device for a flip vacuum wafer, which comprises an upper vacuum cavity (1) and a lower vacuum cavity (2), wherein the upper vacuum cavity (1) and the lower vacuum cavity (2) are respectively and independently connected with vacuum sucking equipment, an adsorption structure for adsorbing a circuit board surface of a wafer (3) is arranged in the upper vacuum cavity (1), a film for sticking the film is tensioned through a tensioning structure, a supporting structure is arranged in the lower vacuum cavity (2), the tensioning structure is fixed on the supporting structure, a driving structure for driving the supporting structure to move up and down is arranged below a supporting table in the lower vacuum cavity (2), after the tensioning structure is installed in place, the lower surface of the film on the tensioning structure is communicated with the cavity of the lower vacuum cavity (2), and meanwhile the supporting structure and the tensioning structure isolate the upper vacuum cavity (1) from the lower vacuum cavity (2). Compared with the prior art, the invention has the advantages of avoiding the risk of twice overturning the wafer by 180 degrees, no bubble in film sticking and the like.
Description
Technical Field
The invention relates to a wafer film sticking device, in particular to a flip vacuum wafer film sticking device.
Background
In the wafer manufacturing process, it is often necessary to attach a thin film to the non-circuit board (back) side of the wafer. The existing film pasting mode is as follows: the wafer circuit board surface (front surface) is placed downwards, the film is covered on the upper surface (namely the back surface) of the wafer, and then the film is pasted by roller rolling.
This approach has the following drawbacks:
1. in a full-automatic production line, the circuit board faces upwards in the wafer blue when the wafer is input, and the circuit board faces upwards after the film pasting is completed, so that the wafer needs to be overturned for at least 2 times in the whole film pasting process, the falling risk exists in the overturning process, and the safety of the wafer is reduced;
2. when the film is rolled by the roller, the wafer is stressed to be concave downwards, and the film is adhered to the upper surface, so that an air cavity is easily formed between the wafer and the film, and after the film is adhered, air is sealed between the wafer and the film to form air bubbles; in addition, rolling the film with rollers has the risk of crushing the wafer.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a flip-chip vacuum wafer film sticking device.
The aim of the invention can be achieved by the following technical scheme:
the device comprises an upper vacuum cavity and a lower vacuum cavity, wherein the upper vacuum cavity and the lower vacuum cavity are respectively and independently connected with vacuum sucking equipment, an adsorption structure for adsorbing a circuit board surface of a wafer is arranged in the upper vacuum cavity, a film for sticking the film is tensioned through a tensioning structure, a supporting structure is arranged in the lower vacuum cavity, the tensioning structure is fixed on the supporting structure, a driving structure for driving the supporting structure to move up and down is arranged below a supporting table in the lower vacuum cavity, after the tensioning structure is installed in place, the lower surface of the film on the tensioning structure is communicated with a cavity of the lower vacuum cavity, and meanwhile the upper vacuum cavity and the lower vacuum cavity are isolated by the supporting structure and the tensioning structure;
when the wafer is pasted with a film, the upper vacuum cavity and the lower vacuum cavity are in butt joint, the upper vacuum cavity and the lower vacuum cavity are respectively vacuumized through a vacuuming device, the pressure in the lower vacuum cavity is larger than that in the lower vacuum cavity, a film on the tensioning structure is upwards rolled up, the driving structure drives the supporting structure to move upwards, and the film is attached to the lower surface of the wafer.
Preferably, the inner vacuum areas of the upper vacuum cavity and the lower vacuum cavity are cylindrical, have the same diameter and are larger than the diameter of the wafer.
Preferably, the adsorption structure comprises a vacuum adsorption structure.
Preferably, the vacuum adsorption structure comprises an adsorption plate, the adsorption plate is fixed in the upper vacuum cavity, a plurality of vacuum suckers are distributed on the adsorption execution surface of the adsorption plate, when film pasting is carried out, the circuit board surface of the wafer is attached to the adsorption execution surface of the adsorption plate and the wafer is in a horizontal state, and the non-circuit board surface of the wafer faces downwards to the lower vacuum cavity.
Preferably, the tensioning structure comprises a circular ring iron frame, the film is tensioned on the circular ring iron frame, and the diameter of a hollow area of the circular ring iron frame is larger than that of the wafer.
Preferably, the supporting structure comprises a cylindrical ring, the cylindrical ring is supported and driven by the driving structure, the circular ring iron frame is placed on the upper surface of the cylindrical ring, and a circle of flange which protrudes upwards and is used for clamping the circular ring iron frame is arranged on the edge of the upper surface of the cylindrical ring.
Preferably, the height of the flange is not greater than the thickness of the annular iron frame.
Preferably, the outer wall surface of the cylindrical ring is sealed with the inner wall surface of the lower vacuum cavity through a first sealing piece, and the outer wall surface of the circular ring iron frame is sealed with the flange through a second sealing piece.
Preferably, the driving structure comprises a linear motor, and the linear motor is connected with the supporting structure.
Preferably, a fixing bracket for fixing the lower vacuum cavity is arranged outside the lower vacuum cavity.
Compared with the prior art, the invention has the following advantages:
according to the wafer sticking method, the wafer disc is adsorbed in the upper vacuum cavity, so that the non-circuit board surface of the wafer faces downwards, and then the film is enabled to bulge upwards by controlling the pressure difference between the upper vacuum cavity and the lower vacuum cavity, so that the wafer sticking is realized.
Drawings
FIG. 1 is a schematic diagram of a flip-chip vacuum wafer film laminating apparatus according to the present invention;
in the figure, 1 is an upper vacuum cavity, 2 is a lower vacuum cavity, 3 is a wafer, 4 is a lower vacuum interface, and 5 is a fixed bracket.
Detailed Description
The invention will now be described in detail with reference to the drawings and specific examples. Note that the following description of the embodiments is merely an example, and the present invention is not intended to be limited to the applications and uses thereof, and is not intended to be limited to the following embodiments.
Examples
As shown in fig. 1, this embodiment provides a flip-chip vacuum wafer film sticking device, which includes an upper vacuum chamber 1 and a lower vacuum chamber 2, the upper vacuum chamber 1 and the lower vacuum chamber 2 are respectively provided with an upper vacuum interface and a lower vacuum interface 4, the upper vacuum interface and the lower vacuum interface 4 are respectively and independently connected with a vacuum suction device, and a fixing bracket 5 for fixing a lower vacuum chamber 2 is arranged outside the lower vacuum chamber 2. The inner vacuum areas of the upper vacuum cavity 1 and the lower vacuum cavity 2 are cylindrical, have the same diameter and are larger than the diameter of the wafer 3.
An adsorption structure for adsorbing the circuit board surface of the wafer 3 is arranged in the upper vacuum cavity 1, and the adsorption structure comprises a vacuum adsorption structure. Specifically, in this embodiment, the vacuum adsorption structure includes an adsorption plate, the adsorption plate is fixed in the upper vacuum chamber 1, a plurality of vacuum chucks are distributed on an adsorption execution surface of the adsorption plate, when film pasting is performed, a circuit board surface of the wafer 3 is attached to the adsorption execution surface of the adsorption plate, the wafer 3 is in a horizontal state, and a non-circuit board surface of the wafer 3 faces downwards to the lower vacuum chamber 2.
The film for sticking the film is tensioned through a tensioning structure, a supporting structure is arranged in the lower vacuum cavity 2, the tensioning structure is fixed on the supporting structure, a driving structure for driving the supporting structure to move up and down is arranged below a supporting table in the lower vacuum cavity 2, after the tensioning structure is installed in place, the lower surface of the film on the tensioning structure is communicated with the cavity of the lower vacuum cavity 2, and meanwhile the supporting structure and the tensioning structure isolate the upper vacuum cavity 1 from the lower vacuum cavity 2;
when the wafer 3 is subjected to film pasting, the upper vacuum cavity 1 and the lower vacuum cavity 2 are in butt joint, vacuum is respectively sucked to the upper vacuum cavity 1 and the lower vacuum cavity 2 through vacuum sucking equipment, the pressure in the lower vacuum cavity 2 is higher than that in the lower vacuum cavity 2, a film on the tensioning structure is upwards bulged, the driving structure drives the supporting structure to move upwards, and the film is attached to the lower surface of the wafer 3.
The tensioning structure comprises a circular ring iron frame, the thin film is tensioned on the circular ring iron frame, the diameter of a hollow area of the circular ring iron frame is larger than that of the wafer 3, and the circular ring iron frame is used for tensioning the thin film in advance.
The supporting structure comprises a cylindrical ring, the cylindrical ring is supported and driven by the driving structure, a circular ring iron frame is placed on the upper surface of the cylindrical ring, and a circle of upward bulges are arranged on the edge of the upper surface of the cylindrical ring and used for clamping the flange of the cylindrical iron frame.
The height of the flange is not greater than the thickness of the circular iron frame.
The outer wall surface of the cylindrical ring is sealed with the inner wall surface of the lower vacuum cavity 2 through a first sealing piece, and meanwhile, the outer wall surface of the cylindrical iron frame is sealed with the flange through a second sealing piece. The arrangement of the seals enables the upper vacuum chamber 1 and the lower vacuum chamber 2 to be isolated when the tensioning arrangement is in place, so that a pressure differential can be created when a vacuum is drawn.
The driving structure comprises a linear motor, the linear motor is connected with the supporting structure, and in other embodiments, the linear motor can also adopt linear motion structures such as a ball screw and a cylinder, so that the supporting structure can be driven to move up and down along the inside of the lower vacuum cavity 2.
The invention relates to a vacuum wafer film sticking device for inverted installation, which comprises the following specific working principles: the circuit board surface of the wafer 3 is adsorbed on an adsorption plate in the upper vacuum cavity 1, a circular ring iron frame with a film attached in advance is placed on a circular ring, a flange on the circular ring is used for clamping the circular ring iron frame, meanwhile, a second sealing piece is used for sealing the flange and the circular ring iron frame, the upper vacuum cavity 1 is in butt joint with the lower vacuum cavity 2, the circular ring and the circular ring iron frame on the circular ring column isolate the upper vacuum cavity 1 from the lower vacuum cavity 2, the upper vacuum cavity 1 and the lower vacuum cavity 2 are respectively vacuumized, the pressure in the lower vacuum cavity 2 is controlled to be larger than the pressure in the upper vacuum cavity 1, the film on the circular ring iron frame is upwards bulged, then a driving structure is used for driving the circular ring to slide along the inner wall of the lower vacuum cavity 2 (similar to piston motion), and the film of the bulged ball is attached to the lower surface (namely, the non-circuit board surface) of the wafer 3, and the film pasting of the wafer 3 is completed.
According to the invention, the wafer 3 is adsorbed in the upper vacuum cavity 1, so that the non-circuit board surface of the wafer 3 faces downwards, and then the film is enabled to bulge upwards by controlling the pressure difference between the upper vacuum cavity 1 and the lower vacuum cavity 2, so that the film pasting of the wafer 3 is realized.
The above embodiments are merely examples, and do not limit the scope of the present invention. These embodiments may be implemented in various other ways, and various omissions, substitutions, and changes may be made without departing from the scope of the technical idea of the present invention.
Claims (7)
1. The device is characterized by comprising an upper vacuum cavity (1) and a lower vacuum cavity (2), wherein the upper vacuum cavity (1) and the lower vacuum cavity (2) are respectively and independently connected with a vacuum sucking device, an adsorption structure for adsorbing a circuit board surface of a wafer (3) is arranged in the upper vacuum cavity (1), a film for sticking the film is tensioned through a tensioning structure, a supporting structure is arranged in the lower vacuum cavity (2), the tensioning structure is fixed on the supporting structure, a driving structure for driving the supporting structure to move up and down is arranged below a supporting table in the lower vacuum cavity (2), the lower surface of the film on the tensioning structure is communicated with the cavity of the lower vacuum cavity (2) after the tensioning structure is installed in place, and the supporting structure and the tensioning structure isolate the upper vacuum cavity (1) from the lower vacuum cavity (2);
the vacuum adsorption structure comprises an adsorption plate, the adsorption plate is fixed in the upper vacuum cavity (1), a plurality of vacuum suckers are distributed on an adsorption execution surface of the adsorption plate, when film pasting is carried out, the circuit board surface of the wafer (3) is attached to the adsorption execution surface of the adsorption plate and the wafer (3) is in a horizontal state, and the non-circuit board surface of the wafer (3) faces downwards to the lower vacuum cavity (2);
when a wafer (3) is subjected to film pasting, the upper vacuum cavity (1) and the lower vacuum cavity (2) are in butt joint, vacuum is respectively sucked to the upper vacuum cavity (1) and the lower vacuum cavity (2) through a vacuum sucking device, the pressure in the lower vacuum cavity (2) is larger than the pressure in the upper vacuum cavity (1), a film on the tensioning structure is upwards rolled, the driving structure drives the supporting structure to move upwards, and the film is attached to the lower surface of the wafer (3);
the driving structure comprises a linear motor, and the linear motor is connected with the supporting structure.
2. The flip-chip vacuum wafer film sticking device according to claim 1, wherein the inner vacuum areas of the upper vacuum cavity (1) and the lower vacuum cavity (2) are cylindrical, have the same diameter and are larger than the diameter of the wafer (3).
3. The flip vacuum wafer film sticking device according to claim 1, wherein the tensioning structure comprises a circular iron frame, the film is tensioned on the circular iron frame, and the diameter of a hollow area of the circular iron frame is larger than that of a wafer (3).
4. The flip vacuum wafer film sticking device according to claim 3, wherein the supporting structure comprises a cylindrical ring, the cylindrical ring is supported and driven by the driving structure, the circular ring iron frame is placed on the upper surface of the cylindrical ring, and a circle of upward protruding flanges for clamping the cylindrical iron frame are arranged on the edge of the upper surface of the cylindrical ring.
5. The apparatus of claim 4, wherein the flange is no greater than the thickness of the annular frame.
6. The flip-chip vacuum wafer film sticking device according to claim 4, wherein the outer wall surface of the cylindrical ring is sealed with the inner wall surface of the lower vacuum cavity (2) through a first sealing member, and the outer wall surface of the circular iron frame is sealed with the flange through a second sealing member.
7. The flip-chip vacuum wafer film sticking device according to claim 1, wherein a fixing bracket (5) for fixing the lower vacuum cavity (2) is arranged on the outer side of the lower vacuum cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110235041.9A CN112786497B (en) | 2021-03-03 | 2021-03-03 | Inverted vacuum wafer film pasting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110235041.9A CN112786497B (en) | 2021-03-03 | 2021-03-03 | Inverted vacuum wafer film pasting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112786497A CN112786497A (en) | 2021-05-11 |
| CN112786497B true CN112786497B (en) | 2023-12-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110235041.9A Active CN112786497B (en) | 2021-03-03 | 2021-03-03 | Inverted vacuum wafer film pasting device |
Country Status (1)
| Country | Link |
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| CN (1) | CN112786497B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113871340B (en) * | 2021-09-27 | 2022-11-25 | 东莞市译码半导体有限公司 | Novel wafer film pasting process |
| CN114783920B (en) * | 2022-06-22 | 2022-09-06 | 四川明泰微电子有限公司 | Wafer blue membrane overspeed device tensioner |
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| JPH0311749A (en) * | 1989-06-09 | 1991-01-21 | Fujitsu Ltd | Bonding of adhesive tape to semiconductor wafer |
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| JP2000349047A (en) * | 1999-06-01 | 2000-12-15 | Lintec Corp | Device and method for sticking adhesive material |
| CN1617320A (en) * | 2003-11-12 | 2005-05-18 | 日东电工株式会社 | Method and apparatus for joining adhesive tape to back face of semiconductor wafer |
| JP2009071145A (en) * | 2007-09-14 | 2009-04-02 | Hitachi Setsubi Eng Co Ltd | Method and device for sticking dicing tape on plate type member such as semiconductor wafer |
| KR20100117859A (en) * | 2009-04-27 | 2010-11-04 | 주식회사 휘닉스 디지탈테크 | Wafer mounting device and method there of |
| JP2011071472A (en) * | 2009-08-31 | 2011-04-07 | Hitachi Setsubi Eng Co Ltd | Vacuum sticking method and apparatus |
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| CN110154373A (en) * | 2019-05-14 | 2019-08-23 | 苏州美图半导体技术有限公司 | Vacuum laminator |
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| JP4540403B2 (en) * | 2004-06-16 | 2010-09-08 | 株式会社東京精密 | Tape sticking method and tape sticking apparatus |
| US7765682B2 (en) * | 2006-11-29 | 2010-08-03 | Adp Engineering Co., Ltd. | Apparatus for attaching substrates |
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2021
- 2021-03-03 CN CN202110235041.9A patent/CN112786497B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0311749A (en) * | 1989-06-09 | 1991-01-21 | Fujitsu Ltd | Bonding of adhesive tape to semiconductor wafer |
| JPH07125071A (en) * | 1993-11-02 | 1995-05-16 | Fuji Photo Film Co Ltd | Vacuum bonding apparatus |
| US6007654A (en) * | 1996-12-31 | 1999-12-28 | Texas Instruments Incorporated | Noncontact method of adhering a wafer to a wafer tape |
| JP2000349047A (en) * | 1999-06-01 | 2000-12-15 | Lintec Corp | Device and method for sticking adhesive material |
| CN1617320A (en) * | 2003-11-12 | 2005-05-18 | 日东电工株式会社 | Method and apparatus for joining adhesive tape to back face of semiconductor wafer |
| JP2009071145A (en) * | 2007-09-14 | 2009-04-02 | Hitachi Setsubi Eng Co Ltd | Method and device for sticking dicing tape on plate type member such as semiconductor wafer |
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| CN112786497A (en) | 2021-05-11 |
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