JP5177909B2 - Board bonding equipment - Google Patents

Description

  The present invention relates to a substrate bonding apparatus for bonding a functional sheet or another substrate to a substrate such as a liquid crystal substrate or a plasma display substrate. The functional sheet includes a polarizing sheet, an antireflection film, an electromagnetic wave shielding film, an ultraviolet shielding film, and the like.

  As this kind of bonding apparatus, the present applicant has previously proposed a bonding apparatus according to Patent Document 1. There, the glass substrate and the functional film are adsorbed to the opposing surfaces of the adjustment table and the movable table, respectively, and the glass substrate is pressed against the functional film with an adhesive roller provided on the side of the adjustment table. To do. According to this bonding apparatus, since the glass substrate is inclined downward from the position where the glass substrate is pressed by the adhesive roller toward the front side in the traveling direction of the roller, the bonding can be performed while preventing air from biting into the bonding surface.

JP 2009-40617 A (paragraph number 0031, FIG. 8)

  According to the bonding apparatus of patent document 1, a glass substrate and a functional sheet can be bonded, preventing a bubble being confined by the bonding surface. In particular, glass substrates such as liquid crystal substrates and plasma display substrates are formed by the float glass method, and the surface accuracy of the plate surface is high, so that functional sheets can be bonded accurately. Moreover, since it bonds by pressing a glass substrate with an adhesion | attachment roller, a glass substrate can be pressed with a uniform pressing force in the center axis direction of an adhesion roller. However, although rarely, the bonding surface of the glass substrate or the functional sheet may be curved or undulated, and in such a case, the functional sheet cannot be adhered to the glass substrate and bonded. It can be bad. This is because the pressing force by the adhesive roller is uniform in the direction of the central axis of the roller, and cannot follow bending and undulation. Specifically, poor bonding often occurs when the depth of curvature or undulation exceeds 0.1 mm.

  The purpose of the present invention is to bond a bonding target such as a functional sheet even when the bonding surface of the substrate has a curved portion or swell, thus reducing the defective rate of the bonded product and increasing productivity. It is providing the board | substrate bonding apparatus which can be improved.

  The board | substrate bonding apparatus which concerns on this invention is the 1st workpiece | work W1 adsorbed and hold | maintained at the workpiece | work support structure 5, and the 2nd workpiece | work W2 adsorbed and hold | maintained at the movable table 3 through the predetermined bonding gap E. It is assumed that the first workpiece W1 is pressed against the second workpiece W2 by the roller mechanism 6 to perform bonding. The roller mechanism 6 includes a drive base 20 that reciprocates between the bonding start ends of the workpieces W1 and W2, and a roller support frame 21 that is supported by the drive base 20 so as to be movable up and down. 1 includes a main roller 22 that is rotatably supported by the motor, an intermediate roller 32 that supports two peripheral surfaces of the main roller 22, and a pressing structure that presses the main roller 22 via the intermediate roller 32 (FIG. 1). reference). The pressing structure includes a plurality of pressing tables 33 (see FIG. 4) arranged at regular intervals along the central axis of the main roller 22, and a plurality of correction rollers rotatably supported by the pressing tables 33. 34 and 35 and an air cylinder 36 provided between each pressing table 33 and the driving table 20. The main roller 22 is float-supported by a plurality of air cylinders 36 through correction rollers 34 and 35 and an intermediate roller 32.

  In the above-described substrate bonding apparatus, the pressing table 33, the correction roller 34 that circumscribes the peripheral surfaces of the intermediate rollers 32 at the same time, and the two correction rollers 35 that support the intermediate rollers 32 in cooperation with the correction rollers 34, Is provided.

  The adjusting table 40 that rotatably supports each correction roller 35 is guided and supported by the pressing table 33 so as to be able to contact and separate. An adjusting screw shaft 43 that adjusts the distance between the centers of the two correction rollers 35 is disposed between each adjusting table 40 and the pressing table 33.

  The work support structure 5 includes a plurality of suction tables 13 that suck and hold the lower surface of the first work W1 and an operation device 14 that switches the posture of each suction table 13. Each suction table 13 is operated to be switched by the operation device 14 to move the first work W1 directly to the second work W2 via a predetermined bonding gap E, and to move from the operation position to a roller mechanism. 6 can be displaced to a standby position for retreating outside the movement locus (see FIG. 5). Prior to the roller mechanism 6 moving from the bonding start end toward the bonding end, the first workpiece W1 is bonded to the second workpiece W2 while the suction tables 13 are sequentially switched from the operating position to the standby position.

  Another substrate bonding apparatus according to the present invention is configured such that the first work W1 sucked and held by the work support structure 5 and the second work W2 sucked and held by the movable table 3 are passed through a predetermined bonding gap E. It is premised on a substrate laminating apparatus that performs laminating by pressing the first work W1 against the second work W2 with the roller mechanism 6. As shown in FIG. 7, the roller mechanism 6 includes a driving base 20 that reciprocates between the bonding end of the workpieces W <b> 1 and W <b> 2 and a roller support frame 21 that is supported by the driving base 20 so as to be movable up and down. And a main roller 22 pivotally supported by the roller support frame 21 and a pressing structure for pressing the main roller 22. The pressing structure is provided between the pressing table 33, the two correction rollers 55 and 55 that are rotatably supported by the pressing table 33, and the pressing table 33 and the driving table 20. And a plurality of air cylinders 36 that push up toward the main roller 22. The main roller 22 is floatingly supported by an air cylinder 36 through correction rollers 55 and 55.

  In the board | substrate bonding apparatus of this invention, the main roller 22 was pressed with the press structure via the intermediate roller 32, and it was made to bond both workpiece | work W1 * W2. Further, the pressing base 33 (see FIG. 4), the correction rollers 34 and 35, and the air cylinder 36 constitute a pressing structure, and the main roller 22 is composed of a plurality of air cylinders 36, the correction rollers 34 and 35, and the intermediate rollers. 32 to float and support. As described above, when the main roller 22 is indirectly floated and supported, and each pressing base 33 is pushed up and biased by the air cylinder 36, the pressing force on the roller peripheral surface of the main roller 22 is different in the central axis direction. The air cylinder 36 supporting the table 33 can be lifted and lowered slightly to absorb the change in pressing force.

  For example, if the bonding surfaces of both the workpieces W1 and W2 are curved, the pressing force of the roller peripheral surface facing the curved portion is reduced, but at the same time the pressing force is reduced, the nearest pressing base 33 is moved to the air. It is pushed up slightly by the cylinder 36 and presses the main roller 22 locally. Thereby, the roller peripheral surface of the main roller 22 can be bent and deformed following the curved shape, so that both the workpieces W1 and W2 can be brought into close contact with each other. Moreover, since the press stand 33 is arrange | positioned at fixed intervals along the center axis | shaft of the main roller 22, not only the center part of the bonding surface of both workpiece | work W1 * W2 but the whole bonding surface can be pressed equally. . Therefore, even when there exists a curved part and a wave | undulation on a bonding surface, both workpiece | work W1 * W2 can be bonded appropriately, the defect rate of a bonding product can be reduced, and productivity can be improved.

  According to the pressing structure in which the left and right intermediate rollers 32 are supported by the central correction roller 34 and the left and right correction rollers 35, the left and right intermediate rollers 32 can be stably supported by the minimum correction rollers 34 and 35. . Therefore, the manufacturing cost of the substrate bonding apparatus can be reduced by avoiding unnecessarily complicated pressing structures. In addition, since the main roller 22 is pressed by the three correction rollers 34 and 35 via the intermediate roller 32, the pushing force by the air cylinder 36 can be reliably transmitted to the main roller 22 without waste.

  In the pressing structure, when the adjustment screw shaft 43 provided between the adjusting table 40 and the pressing table 33 that supports the second rollers 35 is operated so that the distance between the centers of the second rollers 35 can be adjusted, The deflection in the central axis direction of the main roller 22 can be corrected. Therefore, the pressing force in the central axis direction by the main roller 22 at the time of bonding can be made uniform. In addition, the adjustment work by the adjustment screw shaft 43 is performed in advance before starting the bonding.

  When the work support structure 5 is configured by a plurality of suction tables 13 and an operation device 14 that switches the posture of each suction table 13, the posture of each suction table 13 corresponds to the roller mechanism 6 moving closer. Both workpieces W1 and W2 can be prepared while sequentially switching to the standby position. The 1st work W1 at the time of pasting is pushed up with main roller 22, and is stuck to 2nd work W2. However, the face wall of the first workpiece W1 located closer to the bonding end than the main roller 22 is still adsorbed by the suction table 13 and faces the second workpiece W2 with the bonding gap E in between. Therefore, the 1st work W1 will be pasted to the 2nd work W2 in the state where it inclined down toward the pasting end (Drawing 5), and forcedly pushes out the air between the pasting surfaces with main roller 22. However, both works W1 and W2 can be properly bonded to the end.

  In another substrate bonding apparatus according to the present invention, a pressing structure is formed by a pressing table 33, two correction rollers 55 and 55 supported by the pressing table 33, an air cylinder 36 that pushes up each pressing table 33, and the like. The main roller 22 is directly supported by the correction rollers 55 and 55. Thus, when the main roller 22 is directly supported by the pair of correction rollers 55 and 55, the intermediate roller 32 can be omitted and the structure of the substrate bonding apparatus can be simplified. In addition, since the central portion of the main roller 22 that is easily deformed and deformed is supported by the correction rollers 55 and 55, the center portions of the bonding surfaces of both the workpieces W1 and W2 are curved. Work W1 and W2 can be appropriately bonded.

It is a vertical front view which shows the principal part structure of the roller mechanism which concerns on this invention. It is a top view of a substrate bonding apparatus. It is a vertical front view of a substrate bonding apparatus. It is a vertical side view of a substrate bonding apparatus. It is a vertical front view of the board | substrate bonding apparatus which shows a bonding middle state. It is sectional drawing which shows notionally the bonding apparatus which concerns on another Example of this invention. It is a vertical front view which shows the roller mechanism which concerns on another Example of this invention.

(Example) FIGS. 1-5 shows the Example of the board | substrate bonding apparatus which concerns on this invention. 2 and 3, the substrate bonding apparatus includes a bonding frame 2 that is fixed to the upper part of the machine base 1, a movable table 3 that is swingably supported by the bonding frame 2, and the inside of the bonding frame 2. It is comprised with the adjustment stand 4 arrange | positioned by this, the workpiece support structure 5 supported by the adjustment stand 4, and the roller mechanism 6 grade | etc.,. The bonding frame 2 is formed in a hollow box shape that opens upward.

  The movable table 3 is connected to the bonding frame 2 via a shaft 7 and can swing and open around the shaft 7. Specifically, the movable table 3 is swung around the shaft 7 with an air cylinder (not shown), so that the table surface faces the upper opening surface of the bonding frame 2 (state shown in FIG. 3). And a standby position (state shown in FIG. 2) inverted 180 degrees from the bonding position. On the table surface of the movable table 3, a rectangular box-shaped suction chamber 10 that opens downward is provided.

  The adsorption chamber 10 is connected to a vacuum pump (vacuum source) through a passage (not shown), and a breathable silk screen 11 is stretched on the opening surface. With the movable table 3 opened to the standby position, the second workpiece W2 is placed on the silk screen 11 and positioned, and vacuum pressure is applied to the suction chamber 10 to hold the second workpiece W2 by suction. can do.

  The adjusting table 4 can be displaced by the alignment device 8 in the front-rear direction, the left-right direction, and the turning direction, thereby adjusting the position, thereby positioning the first work W1 supported by the work support structure 5 with respect to the second work W2. it can. In this embodiment, the first workpiece W1 is made of a glass substrate (substrate) such as a liquid crystal substrate or a plasma display substrate, and the second workpiece W2 is a functionality such as a polarizing sheet, an antireflection film, an electromagnetic wave shielding film, or an ultraviolet shielding film. It consists of a sheet. A transparent adhesive layer is formed on the bonding surface of the second workpiece W2. In each drawing, the workpieces W1 and W2 are expressed with exaggerated thickness so that they can be clearly seen.

  The work support structure 5 includes two square box-like suction tables 13 that open upward, and an air cylinder (operator) 14 that moves each suction table 13 up and down between an operating position and a standby position. . The suction table 13 that is long in the front and rear direction is connected to a vacuum pump (vacuum source) through a passage (not shown), and an open silk screen 15 is stretched on the opening surface (see FIG. 5). . The first work W1 can be sucked and held by placing the first work W1 on the both silk screens 15 in a temporarily positioned state and applying a vacuum pressure to the suction table 13. In this state, the position of the adjustment table 4 is adjusted by the alignment device 8.

  In the state where the suction table 13 is switched to the operating position, as shown in FIG. 3, the first workpiece W1 can be opposed to the second workpiece W2 vertically with a predetermined bonding gap E therebetween. In the state where the suction table 13 is switched to the standby position, the suction table 13 can be retracted below the movement locus of the roller mechanism 6. The suction table 13 on the left side as viewed in FIG. 5 is switched to the standby position, and the suction table 13 on the right side as viewed in FIG. 5 is switched to the operating position. The bonding gap E is adjusted according to the difference in thickness or elastic modulus between the workpieces W1 and W2, but is usually selected within a range of 0.1 to 5 mm.

  The roller mechanism 6 includes a front and rear drive base 20, a roller support frame 21 supported by the drive base 20 so as to be movable up and down, a main roller 22 rotatably supported by the roller support frame 21, and a main roller 22. A pair of intermediate rollers 32 and 32 to be supported, and a pressing structure for floatingly supporting the main roller 22 via the intermediate rollers 32 and 32 are configured. The main roller 22 is a multi-layer rubber roller in which a rubber layer is formed on the peripheral surface of the metal roller. Each intermediate roller 32 is arranged so as to circumscribe two places on the lower peripheral surface of the main roller 22, and both ends thereof are rotatably supported by the roller support frame 21. The intermediate roller 32 is formed of a metal cylinder for weight reduction, and its diameter is set smaller than the diameter of the main roller 22.

  As shown in FIG. 3, the drive base 20 is guided by a guide rail 23 disposed on the inner bottom of the bonding frame 2 so as to be freely slidable and reciprocated by an endless belt 25 that is reciprocally driven by the power of the step motor 24. Accompanying, it can reciprocate between the pasting end from the pasting end of both works W1 and W2. Reference numeral 26 denotes a guide pulley. As shown in FIG. 4, a bracket 27 projects from the lower part of the roller support frame 21, and a slide bush 28 fixed to the bracket 27 is guided by a guide shaft 29 erected on the drive base 20 so as to be movable up and down.

  The pressing structure pushes up the five pressing tables 33 arranged along the central axis of the main roller 22, the three correction rollers 34, 35, 35 supported by the pressing tables 33, and the pressing tables 33. It consists of five air cylinders 36 to be operated. As shown in FIG. 1, a pair of front and rear brackets 39 project from the left and right centers of the upper surface of the pressing table 33, and the brackets 39 rotatably support the correction roller 34 via a shaft 37. . A pair of left and right adjustment bases 40 are arranged on the left and right sides of the upper surface of the pressing base 33 with a bracket 39 interposed therebetween, and the left and right correction rollers 35 are pivoted by brackets 41 provided on these adjustment bases 40. A shaft is rotatably supported via 38. The correction rollers 34 and 35 are rubber rollers, respectively. The diameters of the rollers 34 and 35 are the same and are set to be smaller than the diameter of the intermediate roller 32.

  Each adjustment table 40 is guided by a guide groove 42 provided on the pressing table 33 so as to be slidable in the left and right directions. By rotating the adjustment screw shaft 43 provided between the adjustment table 40 and the pressing table 33, the adjustment tables 40 are simultaneously operated. Can move closer or move away at the same time. A right-hand thread is formed on one side of the adjusting screw shaft 43, and a left-hand thread is formed on the other side. Each adjustment base 40 is formed with a female screw 44 that meshes with the adjustment screw shaft 43. By operating the adjustment screw shaft 43 and changing the position of the adjustment base 40, the distance between the centers of the right and left correction rollers 35 and 35 can be adjusted, and at the same time, the three correction rollers 34 and 35 and the intermediate roller 32 can be adjusted. The circumscribed position can be changed. Thus, by changing the circumscribed position of the correction rollers 34 and 35 and the intermediate roller 32, the deflection in the central axis direction of the main roller 22 is corrected, and the pressing force in the central axis direction by the main roller 22 is made uniform. it can. Adjustment work by the adjustment screw shaft 43 is performed before the bonding work, and is rarely readjusted during the bonding work.

  The central correction roller 34 circumscribes the lower peripheral surfaces of the two intermediate rollers 32 simultaneously. The left and right correction rollers 35 circumscribe the lower peripheral surface of each intermediate roller 32 and support the intermediate roller 32 in cooperation with the previous correction roller 34. In order to press the main roller 22 evenly, the left and right intermediate rollers 32 and the left and right correction rollers 35 are symmetrical with respect to each other with the vertical line connecting the centers of the main roller 22 and the center correction roller 34 as the axis of symmetry. It is arranged. When the main roller 22 rotates in the counterclockwise direction, the two intermediate rollers 32 rotate in the clockwise direction, and the three correction rollers 34, 35, and 35 rotate in the same direction as the main roller 22.

  The air cylinder 36 includes a cylinder chamber 47 having a circular cross section formed on the upper surface side of the drive base 20, a piston body 48 that moves up and down in the cylinder chamber 47, and the like. When pressurized air is applied to the cylinder chamber 47, the piston body 48 rises and the main roller 22 can be pushed up. The upper end of the piston body 48 is fixed to the lower surface of the pressing table 33. Reference numeral 49 denotes an end cap that closes the upper opening of the cylinder chamber 47.

  Bonding of both the works W1 and W2 is performed as follows. After placing the first work W1 on the upper surface of the drive base 20 below the bonding start end of both the works W1 and W2 and raising the pair of suction tables 13 to the operating position, temporarily positioning them. Then, the vacuum pressure is applied to the inside of the suction table 13 to hold the first work W1 by suction. Similarly, after placing the second workpiece W2 on the suction chamber 10 of the opened movable table 3 and positioning it with a positioning jig, a vacuum pressure is applied to the suction chamber 10 to hold the second workpiece W2 by suction. In this state, the movable table 3 is swung to the bonding position so that both the workpieces W1 and W2 face up and down, and the position of the first workpiece W1 is adjusted by the alignment device 8, and both the workpieces W1 and W2 are adjusted. Is precisely positioned.

  Next, pressurized air is supplied to the air cylinder 36, and the bonding start ends of both the workpieces W <b> 1 and W <b> 2 are pressed by the main roller 22. In this pressed state, the drive base 20 is moved toward the bonding end side at a constant speed, and both the workpieces W1 and W2 are bonded. At this time, before the roller mechanism 6 moves toward the bonding end, the left and right suction tables 13 are sequentially lowered to the standby position.

  Until the right suction table 13 is lowered to the standby position toward FIG. 5, the first work W <b> 1 is sucked by the suction table 13, and therefore the first work W <b> 1 is as shown in FIG. 5. In a state of being elastically deformed into a gentle S shape, it is inclined downward toward the bonding end. Therefore, both work W1 * W2 can be bonded, forcing the air between bonding surfaces to the main roller 22 and extruding. In the state where the right suction table 13 is lowered to the standby position toward FIG. 5, the bonding end side of the first workpiece W1 bends downward due to its own weight, so that air is applied to the bonding surface as in the previous bonding state. It is possible to paste properly until the end while preventing pinching.

  In this embodiment, the main roller 22 is indirectly supported by the correction rollers 34, 35, and 35 as a set via the intermediate roller 32. Further, the correction rollers 34, 35, and 35 are arranged at five locations in the central axis direction of the main roller 22, and the pressing table 33 is constantly pushed up and biased by the air cylinder 36, thereby pressing the main roller 22 and the intermediate roller 32. Floating support was provided by the structure. When the main roller 22 is pushed up and biased by the five correction rollers 34, 35, and 35 through the intermediate roller 32 in this way, the pressing force on the roller peripheral surface of the main roller 22 differs in the central axis direction. Each pressing base 33 can be lifted and lowered slightly to absorb the change in pressing force.

  For example, if the bonding surfaces of both the workpieces W1 and W2 are curved, the pressing force on the roller peripheral surface of the main roller 22 facing the curved portion decreases, and at the same time, the air cylinder 36 of the nearest pressing table 33 The push-up reaction force decreases. At this time, since an equal pressure is applied to all the air cylinders 36, the air cylinders 36 where the push-up reaction force is reduced slightly increase until the push force (push-up reaction force) reaches a predetermined value. It is pushed up to compensate for the decrease in the pressing force on the peripheral surface of the main roller 22. As a result, the roller peripheral surface of the main roller 22 follows the curved portion and bends and deforms, so that both the workpieces W1 and W2 can be brought into close contact with each other. Therefore, even when a bonding surface has a curved part or a wave | undulation, generation | occurrence | production of a bonding defect can be prevented and productivity of a bonding product can be improved.

  FIG. 6 shows another embodiment of the substrate bonding apparatus. There, the silk screen 50 is stretched on the opening surface of the bonding frame 2, and the first work W <b> 1 is supported by the silk screen 50 and the suction table 13 disposed on the lower surface thereof. In this case, a vacuum pressure is applied to the inside of the bonding frame 2 to suck and hold the first work W1 supported by the silk screen 50 and the suction table 13. For this purpose, the suction table 13 is formed in a flat plate shape, and a group of suction holes are formed on the plate surface. The adjustment of the bonding gap E in this embodiment can be performed on the movable table 3 side, or the entire bonding frame 2 can be moved up and down by an elevating mechanism. When the first workpiece W1 is supported by a silk screen, not only the first workpiece W1 is a glass substrate, but also a functional sheet having no self-holding property, there is room for generating wrinkles by supporting it evenly. It can be adsorbed and retained in the absence of water.

  FIG. 7 shows still another embodiment of the substrate bonding apparatus. There, it differs from the previous embodiment in that the two peripheral surfaces of the main roller 22 are directly supported by two correction rollers 55 and 55 provided on the pressing table 33. The length of the correction roller 55 in the axial direction is set to be equal to or less than half the length of the intermediate roller 32 and supports the central portion of the main roller 22 in the axial direction. Thus, when the main roller 22 is directly supported by the pair of correction rollers 55 and 55, the intermediate roller 32 can be omitted and the structure of the substrate bonding apparatus can be simplified. In addition, since the central portion of the main roller 22 that is easily deformed and deformed is supported by the correction rollers 55 and 55, the workpieces W1 and W2 are brought into close contact when the central portion of the bonding surface is curved. Can be made. However, compared with the pasting apparatus of the previous embodiment, the length of the correction rollers 34 and 35 is large and the number of arranged rollers is small, so there is a limit to the area that can be corrected and the size of the curved portion that can be corrected. Since others are the same as the previous embodiment, the same reference numerals are assigned to the same members, and descriptions thereof are omitted.

  In the above embodiment, the main roller 22 is composed of a rubber roller in which a rubber layer is formed on the peripheral surface of the metal roller, but it is not necessary, and the main roller 22 can be formed of a roller formed entirely of rubber. If necessary, the main roller 22 can be formed of a plastic roller. The correction rollers 34 and 35 need only support two peripheral surfaces of each intermediate roller 32. If necessary, two or more peripheral surfaces of each intermediate roller 32 are supported by three or more correction rollers 34 and 35. be able to.

  The number of the pressing tables 33 and the air cylinders 36 is not limited to a large number, but it is preferable that at least three or more are arranged along the main roller 22. The suction table 13 does not need to be moved up and down between the operating position and the standby position, and can be switched between the operating position and the standby position by swinging the suction table 13 with the air cylinder 14. As the operation device 14, a fluid pressure cylinder other than an air cylinder, an electric cylinder, or the like can be applied.

2 Bonding frame 3 Movable table 5 Work support structure 6 Roller mechanism 10 Adsorption chamber 13 Adsorption table 20 Drive stand 21 Roller support frame 22 Main roller 32 Intermediate roller 33 Press stand 34 Correction roller 35 Correction roller 36 Air cylinder 40 Adjustment stand 43 Adjustment Screw shaft

Claims (5)

The first work (W1) sucked and held by the work support structure (5) and the second work (W2) sucked and held by the movable table (3) are connected to each other through a predetermined bonding gap (E). It is a substrate bonding apparatus that performs bonding by pressing the first work (W1) against the second work (W2) with the roller mechanism (6),
The roller mechanism (6) includes a drive base (20) that reciprocates between the bonding end of the workpieces (W1 and W2) and a roller support frame that is supported by the drive base (20) so as to be movable up and down. (21), a main roller (22) rotatably supported by a roller support frame (21), an intermediate roller (32) supporting two peripheral surfaces of the main roller (22), and a main roller ( And 22) a pressing structure for pressing the intermediate roller (32).
The pressing structure has a plurality of pressing tables (33) arranged at regular intervals along the central axis of the main roller (22), and a plurality of corrections rotatably supported by the pressing tables (33). A roller (34, 35), and an air cylinder (36) provided between each pressing table (33) and the driving table (20),
The substrate laminating apparatus, wherein the main roller (22) is a plurality of air cylinders (36), and is float-supported via the correction rollers (34, 35) and the intermediate roller (32).   On each pressing stand (33), a correction roller (34) circumscribing the peripheral surfaces of both intermediate rollers (32) simultaneously, and two corrections supporting each intermediate roller (32) in cooperation with the correction rollers (34) The board | substrate bonding apparatus of Claim 1 with which the roller (35) is provided. An adjustment table (40) that rotatably supports each correction roller (35) is supported and slidable by the pressing table (33) so as to be able to contact and separate.
The board | substrate bonding of Claim 2 by which the adjustment screw axis | shaft (43) which adjusts the center distance of both the correction | amendment rollers (35) is arrange | positioned between each adjustment stand (40) and a press stand (33). apparatus. The work support structure (5) includes a plurality of suction tables (13) for sucking and holding the lower surface of the first work (W1), and an operating device (14) for switching the posture of each suction table (13). Has been
Each suction table (13) is operated to be switched by the operating device (14), and the first work (W1) is directly opposed to the second work (W2) via a predetermined bonding gap (E). And can be displaced from the operating position to a standby position where the roller mechanism (6) retreats outside the movement locus,
Prior to the roller mechanism (6) moving from the bonding start end toward the bonding end, the first workpiece (W1) is switched to the second workpiece while sequentially switching each suction table (13) from the operating position to the standby position. The board | substrate bonding apparatus of Claim 2 or 3 bonded to (W2). The first work (W1) sucked and held by the work support structure (5) and the second work (W2) sucked and held by the movable table (3) are connected to each other through a predetermined bonding gap (E). It is a substrate bonding apparatus that performs bonding by pressing the first work (W1) against the second work (W2) with the roller mechanism (6),
The roller mechanism (6) includes a drive base (20) that reciprocates between the bonding end of the workpieces (W1 and W2) and a roller support frame that is supported by the drive base (20) so as to be movable up and down. (21), a main roller (22) rotatably supported by the roller support frame (21), and a pressing structure for pressing the main roller (22),
The pressing structure includes a pressing table (33), two correction rollers (55, 55) rotatably supported by the pressing table (33), and each pressing table (33) and driving table (20). A plurality of air cylinders (36) provided in between to push up each pressing platform (33) toward the main roller (22),
The board | substrate bonding apparatus characterized by the main roller (22) floatingly supporting via the correction | amendment roller (55 * 55) with the air cylinder (36).

Images