JP2003273200A - Device and method for stripping tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and a method for stripping a protective tape from a semiconductor wafer stably. <P>SOLUTION: The tape stripping device strips a protective tape from a semiconductor wafer after the protective tape 15 is pasted to a semiconductor wafer 11 and the back side of the semiconductor wafer is ground. The tape stripping device comprises a stage 12 for holding and securing the semiconductor wafer 1, a hole 12a formed in the stage, a finger 13 disposed in the hole and moving in the direction projecting from the semiconductor wafer holding face of the stage, and a strip roller 14 for pasting a strip tape 16 to the protective tape and then guiding the strip tape so as to strip the tape from the semiconductor wafer along with the strip tape. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape peeling apparatus and a tape peeling method for sticking a protective tape to a semiconductor wafer, grinding the back surface of the semiconductor wafer, and peeling the protective tape from the semiconductor wafer. is there.

[0002]

2. Description of the Related Art A conventional method of manufacturing a semiconductor device will be described below with reference to FIG. FIG. 5 is a cross-sectional view schematically showing a tape peeling device that peels a protective tape from a semiconductor wafer after backside grinding.

A semiconductor wafer 111 with bumps is prepared,
A protective tape 115 is adhered to the bump-formed surface of the wafer. Next, a backside grinding apparatus is prepared, and the suction surface of the vacuum suction disk of this backside grinding apparatus is brought into contact with the protective tape 115 to hold the bumped semiconductor wafer 111 by vacuum suction on the suction surface of the vacuum suction disk. Then, the back surface of the semiconductor wafer 111 with bumps is pressed against the front surface of the rotating grinding machine. Then, after the back surface of the semiconductor wafer 111 is ground for a predetermined time, the vacuum suction disk is moved upward in the back surface grinding device to remove the contact between the front surface of the rotary grinding machine and the back surface of the semiconductor wafer 111. Next, the semiconductor wafer 111 is removed from the vacuum suction board.

Thereafter, the tape peeling device shown in FIG. 5 is prepared. This tape peeling apparatus includes a stage 112 that holds a semiconductor wafer 111. This stage 112
Is provided with a finger 113 protruding in a rod shape, and this finger 113 is for peeling the protective tape from one end of the semiconductor wafer. Stage 11
A peeling roller 114 is arranged above the sheet 2. The peeling roller 114 is for peeling the protective tape by attaching the peeling tape 116 to the semiconductor wafer 111 held on the stage 112.

Next, the stage 11 of the tape peeling device
The semiconductor wafer 111 after the back surface grinding is fixed and held on the upper surface of 2. At this time, the protective tape 115 is positioned upward. Next, the protective tape 115 for the semiconductor wafer 111
By moving the peeling roller 114 above,
The peeling tape 116 is attached onto the protective tape 115.

Next, the peeling roller 116 uses the finger 1
By being located above 13, the peeling tape 116 is pushed upward and the protective tape 115 is peeled from one end of the semiconductor wafer. At the same time, by moving the peeling roller 114 upward, the peeling tape 116 is pulled up to completely peel the protective tape 115 on the semiconductor wafer. After that, the semiconductor wafer 111 is diced and divided into semiconductor chips.

It is also possible to peel the protective tape from the semiconductor wafer by using another tape peeling device. In another tape peeling device, a heater is embedded in the stage instead of the fingers in the tape peeling device of FIG. This heater is located below the semiconductor wafer, and the heater heats the semiconductor wafer to adjust the temperature of the semiconductor wafer and raises the temperature of the wafer to a temperature at which the protective tape is easily peeled off. Then, a peeling tape is attached onto the protective tape, and the protective tape is peeled from the semiconductor wafer by the same method as the tape peeling device of FIG.

[0008]

By the way, in the above-mentioned conventional tape peeling apparatus, when the position of mounting the semiconductor wafer 111 on the stage 112 is displaced, the force applied to the peeling tape 116 by the fingers 113 varies. . As a result, when the protective tape 115 is peeled from the wafer, the tape glue of the protective tape may remain on the wafer, the protective tape 115 may remain on the wafer without being peeled off, or the protective tape 115 may be broken. .

Further, in the other tape peeling device, the heater is arranged in the stage located below the semiconductor wafer. Therefore, in the portion near the end of the semiconductor wafer, the temperature of the wafer is lowered by heat radiation, the protective tape cannot be stably peeled, and the peeling of the protective tape may become unstable. Also, if the wafer temperature is raised too high in consideration of heat radiation from the portion near the edge of the semiconductor wafer, the protective tape can be peeled off well at the edge of the semiconductor wafer, but the wafer temperature rises at the center of the semiconductor wafer. Passage of the protective tape may cause residual tape to remain.

The present invention has been made in consideration of the above circumstances, and an object thereof is to provide a tape peeling device and a tape peeling method capable of stably peeling a protective tape from a semiconductor wafer.

[0011]

In order to solve the above problems, a tape peeling apparatus according to the present invention protects a semiconductor wafer from the semiconductor wafer after a protective tape is attached to the semiconductor wafer and the back surface of the semiconductor wafer is ground. A tape peeling device for peeling a tape, a stage for fixing and holding a semiconductor wafer, a hole provided in the stage, and a hole arranged in the hole and moving in a direction projecting from a semiconductor wafer holding surface of the stage. A peeling tape is provided, which includes a finger and a peeling tape that is attached to the protective tape, and then guides the peeling tape together with the peeling tape so as to peel the protective tape from the semiconductor wafer. On the protective tape and then move the fingers in the direction to project from the semiconductor wafer holding surface of the stage. By pushing up the release tape in the vicinity of Movement, characterized by separating the protective tape from one end of the semiconductor wafer.

According to the above tape peeling device, when the protective tape is peeled from the semiconductor wafer, the fingers are moved in a direction projecting from the semiconductor wafer holding surface of the stage to push up the peeling tape, thereby protecting the end portion of the semiconductor wafer. The tape is peeled off. Therefore, even if the position of mounting the semiconductor wafer on the stage is deviated, the problem that the protective tape is not peeled off and remains on the wafer as in the conventional technique does not occur, and the semiconductor tape is wound on the end portion of the semiconductor wafer. The protective tape can be reliably and stably removed.

A tape peeling apparatus according to the present invention is a tape peeling apparatus for peeling a protective tape from a semiconductor wafer after applying a protective tape to the semiconductor wafer and grinding the back surface of the semiconductor wafer. A stage for fixing and holding the first stage, and a first stage provided inside the stage and arranged below the semiconductor wafer held by the stage.
Heater and a second heater provided in the stage and arranged below one end of the semiconductor wafer held by the stage, and a peeling tape is attached to the protective tape, and then the protective tape is used together with the semiconductor tape. A stripping roller that guides the stripping tape to strip from the wafer,
When peeling the protective tape from the semiconductor wafer using the peeling tape with the guide of the peeling roller,
The central part of the semiconductor wafer is heated to the first temperature by the heater and the end part of the semiconductor wafer is heated to the second temperature higher than the first temperature by the second heater.

According to the above tape peeling apparatus, when the protective tape is peeled from the semiconductor wafer, the temperature of the wafer edge is higher than that of the wafer central portion by the second heater, so that the wafer is near the wafer edge. It is possible to suppress a decrease in wafer temperature due to heat radiation. Therefore, the protective tape can be stably peeled off without causing problems such as the protective tape remaining on the wafer without being peeled off.

In the tape peeling device according to the present invention, it is preferable that the first temperature is 40 ° C. or higher and 45 ° C. or lower and the second temperature is 45 ° C. or higher and 50 ° C. or lower.

Further, the tape peeling apparatus according to the present invention includes a drive mechanism for moving the peeling roller on the surface of the protective tape along the surface and then in a direction away from the surface of the semiconductor wafer. It is also possible.

In the tape peeling apparatus according to the present invention, the peeling tape roll around which the peeling tape is wound to supply the peeling tape and the peeling tape after being attached to the protective tape are wound up. It is preferable to further include a winding roll.

Further, the tape peeling apparatus according to the present invention may further include a first heater provided in the stage and arranged below the semiconductor wafer held by the stage.

Further, the tape peeling apparatus according to the present invention can further include a second heater provided in the stage and arranged below one end of the semiconductor wafer held by the stage.

The tape peeling method according to the present invention is a tape peeling method in which a protective tape is attached to a semiconductor wafer, the back surface of the semiconductor wafer is ground, and then the protective tape is peeled from the semiconductor wafer. A semiconductor wafer is fixed and held on the protective tape, and a peeling roller is moved along the surface of the protective tape to attach the peeling tape to the protective tape, and to project from the semiconductor wafer holding surface of the stage. Move the fingers to push up the peeling tape near the semiconductor wafer to peel the protective tape from one end of the semiconductor wafer, and move the peeling roller away from the surface of the semiconductor wafer to completely peel the protective tape. It is characterized by doing.

The tape peeling method according to the present invention is a tape peeling method in which a protective tape is attached to a semiconductor wafer, the back surface of the semiconductor wafer is ground, and then the protective tape is peeled from the semiconductor wafer. By fixing and holding the semiconductor wafer to, heating the central portion of the semiconductor wafer to a first temperature by the first heater, and moving the peeling roller on the surface of the protective tape along the surface,
A peeling tape is attached to the protective tape, the fingers are moved in a direction projecting from the semiconductor wafer holding surface of the stage, and the peeling tape is pushed up in the vicinity of the semiconductor wafer to peel the protective tape from one end of the semiconductor wafer. The protective tape is completely peeled off by moving the peeling roller away from the surface of the protective tape.

Further, in the tape peeling method according to the present invention, when heating to the first temperature, it is possible to heat the end portion of the semiconductor wafer to the second temperature higher than the first temperature by the second heater. is there.

The tape peeling method according to the present invention is a tape peeling method in which a protective tape is attached to a semiconductor wafer, the back surface of the semiconductor wafer is ground, and then the protective tape is peeled from the semiconductor wafer. The semiconductor wafer is fixedly held on the semiconductor wafer, and the central portion of the semiconductor wafer is heated to the first temperature by the first heater, and the end portion of the semiconductor wafer is heated to the second temperature higher than the first temperature by the second heater. Then, by moving the peeling roller on the surface of the protective tape along the surface, the peeling tape is attached to the protective tape, and by moving the peeling roller in a direction away from the surface of the semiconductor wafer, the protective tape Is peeled off.

In the tape peeling method according to the present invention, it is preferable that the first temperature is 40 ° C. or higher and 45 ° C. or lower and the second temperature is 45 ° C. or higher and 50 ° C. or lower.

[0025]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 are views for explaining the method for manufacturing a semiconductor device according to the first embodiment of the present invention. 1A is a cross-sectional view schematically showing a tape peeling device that peels a protective tape from a semiconductor wafer after backside grinding, and FIG. 1B is a tape peeling device shown in FIG. 1A. It is a top view which shows a stage. Figure 2
2A is a protective tape that is attached to the front surface of the semiconductor wafer when the back surface of the semiconductor wafer shown in FIG. 2B is ground. FIG. 2B is a cross-sectional view showing a semiconductor wafer on which the back surface is ground. 2C is a cross-sectional view showing a state in which the protective tape shown in FIG. 2A is attached to the surface of the semiconductor wafer shown in FIG. 2B. FIG. 3 is a cross-sectional view showing a state in which a semiconductor wafer having the protective tape shown in FIG. 2C attached thereto is ground by a backside grinding device.

First, the semiconductor wafer 11 shown in FIG.
To prepare. This semiconductor wafer has a plurality of semiconductor chips (not shown), and bumps 19 are formed on the surface of each of these semiconductor chips.

Next, the protective tape 15 shown in FIG.
To prepare. This protective tape 15 is the base film 1
The intermediate film 15b is arranged between the 5a and the adhesive material 15c. The intermediate film 15b is pressed and deformed. The base film 15a of the protective tape 15 is a polyester plastic film and has a high hardness that hardly deforms even when pressed.
The intermediate film 15b is a polyester plastic film, but has a feature that it is easily deformed by pressing. The adhesive material 15c is applied to the intermediate film 15b with a predetermined thickness.

Then, the semiconductor wafer 1 shown in FIG.
The protective tape 15 shown in FIG. 2A is adhered to the surface on which the bump 19 of No. 1 is formed. Intermediate film 1 of protective tape 15
Since 5b is easily deformed by pressing as described above, the adhesive material 15c of the protective tape 15 and the surface of the bumped semiconductor wafer are brought into close contact with each other without a gap. As a result, FIG.
As shown in (c), the surface of the semiconductor wafer 11 having bumps is protected by the protective tape 15.

After this, the back surface grinding apparatus shown in FIG. 3 is prepared. This backside grinding device is equipped with a vacuum suction board 17,
The vacuum suction board 17 vacuum-sucks the protective tape 15 attached to the semiconductor wafer 11, thereby fixing and holding the semiconductor wafer when the back surface of the semiconductor wafer is ground. The suction surface of the vacuum suction board 17 is provided with a plurality of suction holes. A vacuum pipe is provided inside the vacuum suction board 17, and one side of the vacuum pipe is connected to the suction hole.
The other side of the vacuum piping is evacuated by a vacuum evacuation mechanism such as a vacuum pump. Further, the back surface grinding apparatus is provided with a disk-shaped rotary grinding machine 18 formed by abrasive grains of about 2000 to 4000 as a rotary grinding mechanism, and the rotary grinding machine 18 is supported by a rotary shaft 18a. . The rotary shaft 18a is connected to, for example, a motor (not shown) as a rotary mechanism, and the rotary shaft 18a is rotated by this motor as shown by an arrow to rotate the rotary grinding machine 18.
Is designed to rotate. In addition, the rotary grinder 18
The operations of the vacuum suction board 17 and the vacuum suction board 17 are controlled by a controller (not shown).

Next, the vacuum suction disk 1 of this back surface grinding apparatus
The suction surface of 7 is brought into contact with the protective tape 15 to hold the bumped semiconductor wafer 11 by vacuum suction on the suction surface of the vacuum suction disk. Then, the back surface of the semiconductor wafer 11 with bumps is pressed against the surface of the rotary grinding machine 18 supported by the rotary shaft 18a and rotating in the direction of the arrow.

Next, after the back surface of the semiconductor wafer 11 is ground for a predetermined time, the vacuum suction disk 17 is moved upward in the back surface grinding device to remove the contact between the surface of the rotary grinding machine 18 and the back surface of the semiconductor wafer 11. Next, the semiconductor wafer 11 is removed from the vacuum suction board 17.

Thereafter, the tape peeling device shown in FIG. 1 is prepared. This tape peeling apparatus includes a stage 12 that holds a semiconductor wafer 11. The stage 12 is for fixing the semiconductor wafer 11 by an electrostatic chuck method. On the stage 12, rod-shaped fingers 13 that are vertically movable are arranged as indicated by an arrow 21 shown in FIG. The finger 13 is movable up and down along a hole 12a provided in the stage 12. Various types of movable mechanisms (not shown) for the fingers 13 can be used, and for example, a stepping motor can also be used. Further, a peeling roller 14 is arranged above the stage 12. This peeling roller 14
Is to attach the peeling tape 16 to the protective tape on the semiconductor wafer 11 held on the stage 12, and then to guide the peeling tape so as to peel the protective tape together with the peeling tape. The arrow 22
A drive mechanism (not shown) is used to move the members 24 to 24. Various driving mechanisms can be used. By moving the peeling roller 14 in this manner, the peeling tape 16 can be attached onto the protective tape 15 of the semiconductor wafer 11, and then the protective tape 15 can be peeled from the semiconductor wafer together with the peeling tape 16.
Further, in the vicinity of the stage 12, a peeling tape roll 25 around which the peeling tape 16 is wound and a winding roll 26 for winding the peeling tape 16 are arranged. The take-up roll 26 is adapted to rotate by a rotating mechanism (not shown).

Next, the stage 12 of the tape peeling device
The semiconductor wafer 11 after the back surface is ground is fixed and held by the electrostatic chuck. At this time, the protective tape 15 is positioned upward.

Next, the protective tape 1 for the semiconductor wafer 11
The peeling tape 16 is attached onto the protective tape 15 by moving the peeling roller 14 as indicated by the arrow 22 on the sheet 5.

Next, the fingers 13 are moved upward to move the peeling tape 1 near the semiconductor wafer 11.
6 is pushed up and the protective tape 15 is peeled off from one end of the semiconductor wafer. At the same time, the peeling roller 14 is moved upward as shown by an arrow 23, so that the peeling tape 16 is pulled upward to raise the protective tape 1 on the semiconductor wafer.
5 is completely peeled off.

Then, while the peeling roller 14 is moved to the original position as shown by the arrow 24, the winding roll 26 is rotated to wind the peeling tape 16 to which the protective tape 15 is attached to the winding roll 26. Next, the semiconductor wafer 11 from which the protective tape has been peeled off is removed from the stage 12. Next, the semiconductor wafer is diced and divided into semiconductor chips.

According to the first embodiment described above, when the protective tape 15 is peeled from the semiconductor wafer 11, the fingers 13 are moved upward and the peeling tape is pushed up to peel the protective tape 15 from the end portion of the semiconductor wafer. is doing. Therefore, even if the position of mounting the semiconductor wafer on the stage is shifted, there is no problem that the protective tape is not peeled off and remains on the wafer as in the conventional technique.
The protective tape 15 wound around the edge of the semiconductor wafer can be reliably stripped off. In other words, it is possible to suppress variations in the force applied to the peeling tape by the fingers, and it is possible to reliably peel the protective tape from the semiconductor wafer.

FIG. 4 is a diagram for explaining the method of manufacturing a semiconductor device according to the second embodiment of the present invention.
(A) is sectional drawing which shows roughly the tape peeling apparatus which peels a protective tape from the semiconductor wafer after back surface grinding,
FIG. 4B is a plan view showing the stage of the tape peeling device shown in FIG.

Since the apparatus and method for attaching the protective tape to the semiconductor wafer 11 and grinding the back surface of the semiconductor wafer 11 are the same as those in the first embodiment, the description thereof will be omitted.
The process of peeling the protective tape from the semiconductor wafer after backside grinding will be described.

A tape peeling device shown in FIG. 4 is prepared. This tape peeling apparatus includes a stage 32 that holds the semiconductor wafer 11. The stage 32 fixes the semiconductor wafer 11 by an electrostatic chuck method. In the stage 32, a first heater 33 located below the fixed semiconductor wafer 11 is arranged. Also,
A second heater 34 located under one end of the fixed semiconductor wafer 11 is arranged in the stage 32. Various heaters can be used as the first and second heaters. Further, the peeling roller 14 is arranged above the stage 32. The peeling roller 14 is provided on the semiconductor wafer 11 held on the stage 32 to peel off the tape 1.
6 is attached, and then the protective tape is peeled off, and it moves on the semiconductor wafer as indicated by arrows 22 to 24. By moving the peeling roller 14 in this manner, the peeling tape 16 can be attached onto the protective tape 15 of the semiconductor wafer 11, and then the protective tape 15 can be peeled from the semiconductor wafer together with the peeling tape 16. In the vicinity of the stage 32, the peeling tape roll 25 and the peeling tape 16 around which the peeling tape 16 is wound.
A take-up roll 26 that winds up is disposed.

Next, the stage 32 of the tape peeling device described above.
Is heated to a predetermined temperature by the first and second heaters 33 and 34. Then, the semiconductor wafer 11 after the back surface grinding is fixed and held on the stage 32 by an electrostatic chuck. At this time, the protective tape 15 is positioned upward. Next, the central portion of the semiconductor wafer 11 is heated to about 40 ° C. to 45 ° C. by the first heater 33, and the end portion of the semiconductor wafer 11 is heated to 45 ° C. to 5 ° C. by the second heater 34.
It is heated to about 0 ° C.

Next, the protective tape 1 for the semiconductor wafer 11
The peeling tape 16 is attached onto the protective tape 15 by moving the peeling roller 14 as indicated by the arrow 22 on the sheet 5.

Next, the peeling roller 14 is moved upward as shown by the arrow 23, so that the peeling tape 16 is pulled up to peel the protective tape 15 on the semiconductor wafer together with the peeling tape 16. At this time, the protective tape 15 on the edge of the semiconductor wafer 11 is rotated by the second heater 34
C. to 50.degree. C., and the protective tape 15 at the center of the semiconductor wafer 11 is heated to 40.degree. C. by the first heater 33.
It is heated to about 45 ° C. By making the temperature of the protection tape at the edge of the wafer slightly higher than that at the center, the protection tape is easily peeled off.

Then, while moving the peeling roller 14 to the original position as indicated by the arrow 24, the winding roll 26 is rotated to wind the peeling tape 16 to which the protective tape 15 is attached to the winding roll 26. Next, the semiconductor wafer 11 from which the protective tape has been peeled off is removed from the stage 32. Next, the semiconductor wafer is diced and divided into semiconductor chips.

According to the second embodiment, when the protective tape 15 is peeled from the semiconductor wafer 11, the second heater 34 causes the protective tape 15 at the end of the wafer to have a higher temperature than the central portion of the wafer. As a result, it is possible to suppress a decrease in the wafer temperature due to heat radiation in the portion near the edge of the wafer. Therefore, the protective tape can be stably peeled off without causing problems such as the protective tape remaining on the wafer without being peeled off.

The present invention is not limited to the above embodiment, but can be implemented with various modifications. For example,
It is also possible to add the first heater 33 according to the second embodiment to the stage of the tape peeling apparatus according to the first embodiment, and the stage of the tape peeling apparatus according to the first embodiment. It is also possible to add the second heater 34 according to the second embodiment to the embodiment, and to add the second heater 34 according to the second embodiment to the stage of the tape peeling device according to the first embodiment. It is also possible to add two heaters 33 and 34 for implementation.

[0047]

As described above, according to the present invention, when the protective tape is peeled from the semiconductor wafer, the fingers are moved in a direction projecting from the semiconductor wafer holding surface of the stage to push up the peeling tape, whereby the semiconductor wafer The protective tape is peeled off from the end of the. Therefore, it is possible to provide a tape peeling device and a tape peeling method capable of stably peeling the protective tape from the semiconductor wafer.

[Brief description of drawings]

1A is a cross-sectional view schematically showing a tape peeling device for peeling a protective tape from a semiconductor wafer after backside grinding, and FIG. 1B is a stage of the tape peeling device shown in FIG. It is a top view shown.

2A is a protective tape attached to the front surface of the semiconductor wafer when grinding the back surface of the semiconductor wafer shown in FIG. 2B, and FIG. 2B is a cross-sectional view showing the semiconductor wafer whose back surface is ground. And (c) is a sectional view showing a state in which the protective tape shown in (a) is attached to the surface of the semiconductor wafer shown in (b).

FIG. 3 is a cross-sectional view showing a state in which a semiconductor wafer having the protective tape shown in FIG. 2 (c) attached thereto is ground by a backside grinding device.

4A is a cross-sectional view schematically showing a tape peeling device that peels a protective tape from a semiconductor wafer after backside grinding, and FIG. 4B shows a stage of the tape peeling device shown in FIG. It is a top view shown.

FIG. 5 is a cross-sectional view schematically showing a tape peeling device that peels a protective tape from a semiconductor wafer after backside grinding.

[Explanation of symbols]

11, 111 ... Semiconductor wafer 12, 32, 112 ... Stage 12a ... hole 13,113 ... fingers 14,114 ... Peeling roller 15,115 ... Protective tape 15a ... Base film 15b ... Intermediate film 15c ... Adhesive material 16,116 ... Release tape 17 ... Vacuum suction board 18 ... Rotary grinding machine 18a ... rotary shaft 19 ... Bump 21-24 ... Arrows 25 ... Peeling tape roll 26 ... Winding roll 33 ... First heater 34 ... Second heater

Claims (12)

[Claims] 1. A tape peeling device for sticking a protective tape to a semiconductor wafer, grinding the back surface of the semiconductor wafer, and then peeling the protective tape from the semiconductor wafer, the stage holding and holding the semiconductor wafer. A hole provided in this stage, a finger arranged in this hole and moving in a direction projecting from the semiconductor wafer holding surface of the stage, and a peeling tape attached to the protective tape, and thereafter, together with the peeling tape, the protective tape A peeling roller that guides the peeling tape so as to peel off the semiconductor wafer from the semiconductor wafer, and after the peeling tape is attached to the protective tape by the guide of the peeling roller, the fingers are projected from the semiconductor wafer holding surface of the stage. One side of the semiconductor wafer by pushing up the release tape near the semiconductor wafer by moving it in the direction A tape stripping device, which strips a protective tape from the tape. 2. A tape peeling device for peeling a protective tape from a semiconductor wafer after a protective tape is attached to the semiconductor wafer and the back surface of the semiconductor wafer is ground, the stage holding and holding the semiconductor wafer. A first heater provided in the stage and arranged below the semiconductor wafer held by the stage; and a first heater provided in the stage arranged under one end of the semiconductor wafer held by the stage A guide for the peeling roller, comprising: a second heater; and a peeling tape that adheres the peeling tape to the protective tape, and then guides the peeling tape together with the peeling tape so as to peel the protective tape from the semiconductor wafer. When peeling the protective tape from the semiconductor wafer using the peeling tape with
The tape peeling device is characterized in that the central portion of the semiconductor wafer is heated to a first temperature by the heater of (1) and the end portion of the semiconductor wafer is heated to a second temperature higher than the first temperature by the second heater. 3. The tape peeling device according to claim 2, wherein the first temperature is 40 ° C. or higher and 45 ° C. or lower and the second temperature is 45 ° C. or higher and 50 ° C. or lower. 4. A driving mechanism for moving the peeling roller on the surface of the protective tape along the surface, and then in a direction away from the surface of the semiconductor wafer. The tape peeling device according to claim 1. 5. A release tape roll around which the release tape is wound to supply the release tape, and a winding roll for winding up the release tape after being attached to the protective tape. The tape peeling device according to claim 1, wherein the tape peeling device is a tape peeling device. 6. The tape peeling device according to claim 1, further comprising a first heater provided in the stage and arranged below the semiconductor wafer held by the stage. 7. The method according to claim 1, further comprising a second heater provided inside the stage and arranged below one end of the semiconductor wafer held by the stage.
The tape peeling device described in 1. 8. A tape peeling method for peeling a protective tape from a semiconductor wafer after attaching a protective tape to the semiconductor wafer, grinding the back surface of the semiconductor wafer, and fixing the semiconductor wafer on a stage. The semiconductor tape is held and the peeling roller is moved along the surface of the protective tape to attach the peeling tape to the protective tape, and the fingers are moved in a direction projecting from the semiconductor wafer holding surface of the stage. The protective tape is peeled off from one end of the semiconductor wafer by pushing up the peeling tape in the vicinity of, and the protective tape is completely peeled off by moving the peeling roller away from the surface of the semiconductor wafer. Peeling method. 9. A tape peeling method for peeling a protective tape from a semiconductor wafer after attaching a protective tape to the semiconductor wafer, grinding the back surface of the semiconductor wafer, and fixing the semiconductor wafer on a stage. Hold and heat the central portion of the semiconductor wafer to the first temperature by the first heater, and move the peeling roller on the surface of the protective tape along the surface to attach the peeling tape to the protective tape. , Move the finger in the direction that projects from the semiconductor wafer holding surface of the stage and push up the peeling tape near the semiconductor wafer to peel the protective tape from one end of the semiconductor wafer and move the peeling roller in the direction away from the surface of the semiconductor wafer. A tape peeling method, wherein the protective tape is completely peeled by moving the tape. 10. The tape peeling method according to claim 9, wherein when heating to the first temperature, the end portion of the semiconductor wafer is heated to a second temperature higher than the first temperature by a second heater. . 11. A tape peeling method for peeling a protective tape from a semiconductor wafer after applying a protective tape to the semiconductor wafer, grinding the back surface of the semiconductor wafer, and fixing the semiconductor wafer on a stage. The surface of the protective tape is held by heating the central portion of the semiconductor wafer to a first temperature by the first heater and heating the end portion of the semiconductor wafer to a second temperature higher than the first temperature by the second heater. The peeling tape is adhered to the protective tape by moving the peeling roller along the surface, and the protective tape is peeled by moving the peeling roller in a direction away from the surface of the semiconductor wafer. Tape peeling method. 12. The tape peeling method according to claim 10, wherein the first temperature is 40 ° C. or higher and 45 ° C. or lower and the second temperature is 45 ° C. or higher and 50 ° C. or lower.