JP6518579B2 - Sheet peeling apparatus and peeling method - Google Patents

Description

  The present invention relates to a sheet peeling apparatus and a peeling method.

  BACKGROUND Conventionally, there is known a sheet peeling apparatus which peels off an adhesive sheet attached to an adherend, folds the adhesive sheet and recovers it (see, for example, Patent Document 1).

JP, 2012-64850, A

  However, in the conventional sheet peeling apparatus as described in Patent Document 1, since the pressure bonding force is sequentially sequentially applied to the folded adhesive sheet, the processing capacity per unit time decreases. There is a disadvantage.

  An object of the present invention is to provide a sheet peeling apparatus and a peeling method capable of suppressing a decrease in throughput per unit time.

  In order to achieve the above object, a sheet peeling apparatus according to the present invention is a sheet peeling apparatus for peeling an adhesive sheet attached to an adherend, wherein the holding unit holds the adhesive sheet, and the holding unit holds the adhesive sheet. Tension applying means for applying tension to the adhesive sheet to separate the adhesive sheet from the adherend, and the adhesive sheet with a predetermined position in the plane of the adhesive sheet peeled off by the tension applying means as a bending portion Folding means for folding in two, the folding means comprising: a bending portion crimping means for crimping the bent portion; and an outer peripheral portion crimping means for crimping the opposing outer peripheral portions in the folded adhesive sheet. Is adopted, is adopted.

  Under the present circumstances, in the sheet peeling apparatus of this invention, it is preferable that the said tension provision means is provided with the guidance means to guide the said adhesive sheet so that the adhesive sheet peeled from the said to-be-adhered body will be folded in half.

  On the other hand, the sheet peeling method of the present invention is a sheet peeling method of peeling an adhesive sheet attached to an adherend, wherein a holding step of holding the adhesive sheet and tension on the adhesive sheet held in the holding step And a step of applying a tension to separate the adhesive sheet from the adherend, and folding the adhesive sheet in two with the predetermined position in the plane of the adhesive sheet separated in the tension applying step as a bending portion A folding step, and the folding step includes a bending portion crimping step of crimping the bent portion and an outer peripheral portion crimping step of crimping the opposing outer peripheral portions of the folded adhesive sheet. The process is adopted.

  According to the present invention as described above, since the folding means includes the bending portion crimping means and the outer peripheral portion crimping means, the crimping force is not applied to the entire folded adhesive sheet one by one sequentially. Since the said adhesive sheet can be folded, it can suppress that the processing capacity per unit time falls.

  Under the present circumstances, if a tension provision means is equipped with a guidance means, since the said adhesive sheet can be peeled from a to-be-adhered body, guiding the adhesive sheet so that it may be folded in half, the processing capacity per unit time falls. Can be further suppressed.

The side view of the sheet peeling apparatus which concerns on one Embodiment of this invention. (A)-(C) operation | movement explanatory drawing of a sheet peeling apparatus. (A)-(D) are operation explanatory drawings of a sheet peeling apparatus.

Hereinafter, an embodiment of the present invention will be described based on the drawings.
In the present embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. Do. Furthermore, in the present embodiment, when the direction is indicated on the basis of a front direction in FIG. 1 parallel to the Y axis, “upper” is the arrow direction of the Z axis, “lower” is the opposite direction, “Left” is the arrow direction of the X axis, “right” is the opposite direction, and “front” is the front direction in FIG. 1 parallel to the Y axis, “rear” is the opposite direction.

  In FIG. 1, a sheet peeling apparatus 10 is an apparatus for peeling an adhesive sheet AS attached to a semiconductor wafer (hereinafter may be simply referred to as a "wafer") WF as an adherend, and holds the adhesive sheet AS. Holding means 20, tensioning means 30 for applying tension to the adhesive sheet AS held by the holding means 20 to peel the adhesive sheet AS from the wafer WF, and the surface of the adhesive sheet AS peeled off by the tensioning means 30. The folding means 40 folds the adhesive sheet in two with the predetermined position in the inside as the bent portion AS1 (see FIG. 3A to FIG. 3D), and the recovery box 50 as a recovery means for recovering the adhesive sheet AS Is equipped.

  The holding means 20 sandwiches the tape supporting means 21 rotatably supporting the wound peeling tape PT and the peeling tape PT supported by the tape supporting means 21 with the tape supporting means 21 for the peeling. The feeding means 22 for applying a feeding force or winding force to the tape PT, the lead holding means 23 for holding the lead end of the peeling tape PT, and the lead holding means 23 help holding the peeling tape PT It comprises a holding assisting means 24, a pressing means 25 for pressing and sticking the peeling tape PT held by the lead holding means 23 to the adhesive sheet AS, and a cutting means 26 for cutting the peeling tape PT, and the peeling tape The adhesive sheet AS is held via the PT.

The tape support means 21 is supported on the free end side of a pivoting arm 21B rotatable around a pivot shaft 21A and feeds out a pivoting arm 21B and a support roller 21C for supporting the wound peeling tape PT. And a spring 21D as biasing means for biasing in the direction of the means 22.
The feeding means 22 includes a feeding roller 22B driven by a rotation motor 22A as a driving device.
The lead holding means 23 is accommodated in the accommodation means 23C supported by the output shaft 23B of the linear motion motor 23A as a drive device, and through the suction holes 23E formed in the suction surface 23D which is the bottom surface of the accommodation means 23C. It is provided with suction means 23F such as a pressure reducing pump or a vacuum ejector which holds the peeling tape PT by suction.
The holding assisting means 24 is supported by the output shaft 24B of the linear motion motor 24A as a driving device, and includes an auxiliary roller 24C which brings the peeling tape PT into contact with the suction surface 23D.
The pressing means 25 is supported by a slider 25B of a linear motor 25A as a driving device housed in the housing means 23C, and is provided with a pressing head 25C provided to be able to protrude and retract from the bottom surface of the housing means 23C, a coil heater and a heat pipe And heating means 25D such as the heating side of the
The cutting means 26 is supported by a slider 26B of a linear motor 26A as a drive device housed in the housing means 23C, and is provided with a cutting blade 26C provided so as to be able to protrude and retract from the bottom surface of the housing means 23C.

The tension applying means 30 includes moving means 31 for moving the peeling tape PT and the wafer WF relative to each other, guiding means 32 for guiding the adhesive sheet AS peeled off from the wafer WF to be folded in two, and peeling from the wafer WF The adhesive sheet AS is pressed in the direction of the wafer WF, and the peeling tape PT and the adhesive sheet AS are held between the pressing means 33 and the pressing means 33 which restrict the wafer WF from moving in the peeling direction of the adhesive sheet AS. And a sandwiching means 34.
The moving means 31 is supported by a slider 31B of a linear motor 31A as a driving device, and includes a table 31D having a support surface 31C capable of attracting and holding the wafer WF by pressure reducing means (not shown) such as a pressure reducing pump and a vacuum ejector.
The guiding means 32 includes a guiding roller 32C supported by a slider 32B of a linear motor 32A as a driving device.
The pressing means 33 includes a rotating motor 33C as a driving device supported by a slider 33B of the linear motor 33A as a driving device, and a pressing roller 33D supported by an output shaft (not shown) of the rotating motor 33C. ing.
The pinching means 34 is supported by a support member 34C supported by an output shaft 34B of a linear motion motor 34A as a drive device, a pinch roller 34D supported by the support member 34C, and a support member 34C, and a cutting blade And a sheet support member 34E having a groove 34F formed therein for receiving the entry of 26C.

The folding means 40 includes a bending portion crimping means 41 for crimping the bending portion AS1, and an opposite end AS2 located on the opposite side of the bending portion AS1 as the opposing outer peripheral portion in the folded adhesive sheet AS (FIG. 3 (A ) To (D)) and an outer peripheral portion crimping means 42 for crimping each other.
The bending portion crimping means 41 is supported by a support frame 41C supported by a slider 41B of a linear motor 41A as a drive device and an output shaft 41E of a linear motion motor 41D as a drive device supported by the support frame 41C. A chuck member 41F, and a suction pad 41K supported by an output shaft 41H of a linear motion motor 41G as a driving device supported on the upper chuck member 41F and disposed in a hole 41J formed in the upper chuck member 41F; A lower chuck member 41L supported at the lower part of the support frame 41C, and a discharging means 41M provided on the upper surface and the left side of the lower chuck member 41L for discharging gas such as air or gas to discharge the adhesive sheet AS; Have. The suction pad 41 K is provided so as to be able to be held by suction by pressure reducing means such as a pressure reducing pump or a vacuum ejector not shown.
The outer peripheral portion pressure bonding means 42 is composed of the storage means 23 C of the holding means 20 and the sheet support member 34 E of the tension application means 30.

In the above-described sheet peeling apparatus 10, a procedure for peeling the adhesive sheet AS attached to the wafer WF will be described.
First, after the operator sets the peeling tape PT as indicated by the solid line in FIG. 1, each member stands by at the initial position. The sheet peeling device 10 indicated by the solid line in FIG. A signal of automatic operation start is inputted through the input means such as. Then, the holding unit 20 drives the suction unit 23F, and the suction surface 23D suctions and holds the peeling tape PT. When the wafer WF is placed on the support surface 31C with the adhesive sheet AS at the upper side by a transfer means (not shown) such as a hand or an articulated robot or a belt conveyor, the tension applying means 30 is not shown Drive to start holding the wafer WF by suction. Thereafter, the tension applying means 30 drives the linear motor 31A to move the table 31D to the right, and the left end of the adhesive sheet AS is positioned directly below the pressing head 25C, as shown by the two-dot chain line in FIG.

  Next, the holding means 20 drives the linear motion motor 24A, and as shown by the two-dot chain line in FIG. 1, the auxiliary roller 24C is retracted from the lower side of the housing means 23C, The storage means 23C is lowered to a predetermined position immediately above the adhesive sheet AS while being driven to feed the peeling tape PT. Thereafter, the holding means 20 drives the linear motor 25A, and as shown in FIG. 2A, the pressing head 25C is lowered to press and stick the peeling tape PT against the left end of the adhesive sheet AS. At this time, the holding means 20 may drive the heating means 25D to heat the peeling tape PT. When the application of the peeling tape PT to the adhesive sheet AS is completed, the holding means 20 stops the driving of the suction means 23F and drives the linear motor 25A and the linear motor 23A to initialize the pressing head 25C and the housing means 23C. Return to position.

  After that, the tension applying means 30 drives the linear motion motor 34A, and the peeling tape PT is nipped by the pinch roller 34D and the pressing roller 33D with a predetermined pressing force, and then the linear motor 31A is driven to set the adhesive sheet AS. The left end portion is positioned immediately below the lowermost portion of the pressing roller 33D. Next, the holding means 20 drives the rotation motor 22A to wind the peeling tape PT by a predetermined length, and the tension applying means 30 drives the linear motor 33A to hold the tape as shown in FIG. 2 (B). The bent portion of the peeling tape PT is pressed by the lowermost portion of the pressing roller 33D. Next, the tension applying means 30 drives the linear motor 31A and the rotation motor 33C to move the table 31D in the left direction and rotate the pressing roller 33D in the counterclockwise direction. As a result, the adhesive sheet AS is peeled from the wafer WF while the bent portion is pressed by the lowermost portion of the pressing roller 33D. During peeling of the adhesive sheet AS, the tension applying means 30 drives the linear motor 32A to bring the induction roller 32C into contact with the peeling tape PT and the adhesive sheet AS delivered by the pressing roller 33D and the pinch roller 34D. A predetermined tension is applied to them to induce the peeling tape PT and the adhesive sheet AS to be folded in half.

  Then, when the entire adhesive sheet AS is peeled from the wafer WF, the tension applying means 30 stops the drive of the linear motor 32A and the rotation motor 33C, and as shown in FIG. 2C, the pressing roller 33D and the pinch In a state where the peeling rear end portion of the adhesive sheet AS is sandwiched by the roller 34D, the rotation of the rotation motor 33C is locked. Next, after the folding means 40 drives the linear motor 41A to move the slider 41B in the left direction, the holding means 20 and the tension applying means 30 drive the rotation motor 22A and the linear motor 32A, and the adhesive sheet AS The peeling tape PT and the adhesive sheet AS are moved such that the peeling tape PT in the vicinity of the peeling tip of the sheet is positioned directly below the cutting blade 26C. Then, in a state where the holding means 20 locks the rotation of the rotation motor 22A, the tension applying means 30 drives the rotation motor 33C, and after peeling off the adhesive sheet AS from between the pressing roller 33D and the pinch roller 34D. While the end is removed, the linear motor 32A is driven to align the opposite end AS2 of the adhesive sheet AS as shown in FIG. 3 (A). Thereafter, the folding means 40 drives the pressure reducing means and the linear motion motor 41G (not shown) to raise and lower the suction pad 41K to suction and hold the vicinity of the bent portion AS1 of the adhesive sheet AS by the suction pad 41K. Drives the linear motor 32A to return the induction roller 32C to the initial position. Then, the holding means 20 and the folding means 40 drive the linear motion motors 23A and 41D, and the opposite end AS2 is crimped between the accommodation means 23C and the sheet support member 34E as shown in FIG. The bent portion AS1 is crimped by the upper chuck member 41F and the lower chuck member 41L. Next, after the holding means 20 drives the suction means 23F to hold the peeling tape PT by suction on the suction surface 23D, the linear motor 26A is driven to raise and lower the cutting blade 26C using the groove 34F. The tape PT. Thereafter, the holding means 20 drives the linear motion motor 23A to return the housing means 23C to the initial position, and then drives the linear motion motor 24A to return the auxiliary roller 24C to the initial position.

  Next, the folding means 40 drives the linear motor 41A to return the slider 41B to the initial position, and after stopping the driving of the pressure reducing means (not shown), the linear motor 41D is driven to move the upper chuck member 41F to the initial position. Wake up. Thereby, the adhesive sheet AS folded in two drops into the collection box 50 by its own weight as shown in FIG. 3 (D). When the upper chuck member 41F is returned to the initial position, the folding means 40 drives a pressure means (not shown) such as a pressure pump or a turbine to eject gas such as air or gas from the suction pad 41K. It is also good. In addition, the folding means 40 may drive the drop-off means 41M to spray gas on the adhesive sheet AS to assist the detachment of the adhesive sheet AS from the lower chuck member 41L.

When the whole of the adhesive sheet AS is peeled from the wafer WF, a hand or a transfer means (not shown) transfers the wafer WF on the table 31D to the next process, and then each means drives the respective driving devices to initialize each member. The same operation is repeated thereafter.

  According to the embodiment as described above, since the folding means 40 includes the bending portion crimping means 41 and the outer peripheral portion crimping means 42, the crimping force is sequentially applied to the entire folded adhesive sheet AS. Since the adhesive sheet AS can be folded without being reduced, it is possible to suppress a decrease in throughput per unit time.

  As described above, the best configuration, method and the like for carrying out the present invention are disclosed in the above description, but the present invention is not limited to this. That is, although the present invention has been particularly illustrated and described primarily with respect to particular embodiments, it is to be understood that shapes relative to the above-described embodiments can be made without departing from the spirit and scope of the invention. A person skilled in the art can make various modifications in material, quantity, and other detailed configurations. Moreover, the description which limited the shape, the material, etc. which were disclosed above is described in an exemplification for facilitating the understanding of the present invention, and the present invention is not limited. The description in the name of the member from which the limitation of some or all of the limitations such as is removed is included in the present invention.

For example, the holding means 20 may be configured to press and stick the peeling tape for sheet to the adhesive sheet AS.
The tape support means 21 may support the peeling tape PT without being biased in the direction of the feeding means 22. In this case, the feeding means 22 may be a pinch roller or the like for holding the peeling tape PT with the feeding roller 22B. Should be adopted.
The lead holding means 23 is configured to hold the peeling tape PT by chuck means such as a mechanical chuck or chuck cylinder, Coulomb force, adhesive, adhesive, magnetic force, Bernoulli adsorption, etc. instead of or in combination with the suction means 23F. Can be adopted.
The holding assisting means 24 can adopt a configuration in which the peeling tape PT is brought into contact with the suction surface 23D by spraying a rod-like member, a plate-like member, or air instead of or in combination with the auxiliary roller 24C.
The holding assisting means 24 may not be able to hold the peeling tape PT after peeling of the adhesive sheet AS if it can be held only by the lead holding means 23.
The pressing means 25 can adopt a pressing member by blowing a blade material, rubber, resin, sponge, air, etc. instead of or in combination with the pressing head 25C, and the peeling tape PT has a pressure-sensitive adhesive bond. In the case of a sheet, the heating means 25D may or may not be present.
At least one of the pressing means 25 and the cutting means 26 may not be accommodated in the accommodating means 23C, and the linear motors 25A, 26A may be supported by a frame (not shown).
The biasing means may adopt rubber, resin or the like instead of or in combination with the spring 21D.
When the peeling tape PT is attached to the adhesive sheet AS by another device, the holding unit 20 includes the tape supporting unit 21, the feeding unit 22, the lead holding unit 23, the holding assisting unit 24, the pressing unit 25 and the cutting unit 26. Alternatively, a configuration may be adopted in which the peeling tape PT attached to the adhesive sheet AS is held by a drive device, suction holding, or the like.
The holding means 20 may hold the adhesive sheet AS directly by a drive device or suction holding without using the peeling tape PT.
The cutting means 26 may be replaced or used in combination with the cutting blade 26C, and may adopt other configurations such as a laser cutter, a heat cutter, an air cutter, a compressed water cutter and the like.
When the peeling tape PT is cut by another device, the cutting means 26 may be omitted in the present invention, or the peeling tape PT may not be cut.

The tension applying means 30 may peel off the adhesive sheet AS by at least one of drive of the delivery means 22, drive of the rotation motor 33C, drive of the linear motor 31A and drive of the linear motor 32A.
The tension applying means 30 may fix the table 31D and move the holding means 20 or the like, or may move both the means and the table 31D.
The moving means 31 may be configured to support the wafer WF by chuck means such as a mechanical chuck or chuck cylinder, Coulomb force, adhesive, adhesive, magnetic force, Bernoulli adsorption or the like.
The guiding means 32 may guide the adhesive sheet AS so that the surfaces on the opposite side of the surface in contact with the wafer WF are folded in two.
A rod-like member, a plate-like member, or the like may be adopted instead of or in combination with the induction roller 32C, or the guidance means 32 may be guided so that the adhesive sheet AS is folded in half by blowing air or the like. Good.
The tension applying means 30 may apply tension to the peeling tape PT by relatively moving the wafer WF and the tape supporting means 21 instead of the guiding roller 32C.
When the wafer WF is moved by another device, the moving means 31 may be omitted in the present invention.
The pressing means 33 may press the adhesive sheet AS peeled off from the wafer WF so as to be in contact with the adhesive sheet AS attached to the wafer WF or may press it so as not to be in contact.
The pressing means 33 may press the adhesive sheet AS at any position such as the left end portion, the middle portion, and the right end portion of the adhesive sheet AS.
The pressing means 33 may press the bent portion of the adhesive sheet AS at a position other than the lowermost portion of the pressing roller 33D.
The pressing means 33 may or may not press the adhesive sheet in the direction of the wafer WF by spraying a plate member or air instead of or in combination with the pressing roller 33D.
In place of or in combination with the pinch roller 34D, the pinching means 34 may or may not hold the peeling tape PT or the like with the pressing roller 33D by a plate-like member or blowing of air.
The sheet support member 34E may be moved by a driving device other than the linear motion motor 41D.
The groove 34F of the sheet support member 34E may not be present.

The bending portion crimping means 41 has a lower chuck member 41L with a hole equivalent to the hole 41J formed in the upper chuck member 41F, and a linear motor 41G provided on the upper chuck member 41F and the linear motor 41G. A member equivalent to the suction pad 41K supported by the output shaft 41H may be provided on the lower surface of the lower chuck member 41L. In this case, the hole 41J on the upper chuck member 41F side or the linear motion motor 41G may or may not be present, and the suction holding of the adhesive sheet AS by the suction pad 41K is performed by at least one of the upper side and the lower side. You can do it from the side.
The bending portion crimping means 41 may not include the linear motion motor 41G and at least the linear motion motor 41G of the suction pad 41K, and may not include the payout means 41M.
The bending portion crimping means 41 may adopt other members such as a roller member in addition to the plate-like member as the upper and lower chuck members 41F and 41L.
The discharging means 41M may be provided on at least one of the support frame 41C and the upper chuck member 41F instead of or in combination with the one provided on the lower chuck member 41L, or a shaft member, a roller member or a plate The adhesive sheet AS may be wiped off from the upper surface of the lower chuck member 41L with a sheet member or the like.
The outer peripheral portion pressure bonding means 42 may be configured to press the opposite end portion AS2 by a member other than the housing means 23C and the sheet support member 34E, for example, a suitable driving device or blowing of air.
The outer peripheral portion pressure bonding means 42 may be configured to crimp the end different from the end held by the holding means 20 and the other end as opposing outer peripheral portions in the folded adhesive sheet AS.
The outer peripheral portion crimping means 42 may crimp the whole of the opposing outer peripheral portion, or may crimp a part thereof.
The folding means 40 may be provided with a stacking and storing means for holding the folded adhesive sheets AS one by one and stacking and storing them in the collection box 50. Such stack and storage means can be configured by appropriately combining drive devices and the like.
In the embodiment, the adhesive sheet AS is folded only once and folded in two in the embodiment, but may be folded twice or more and folded in three or more.
The folding means 40 may fold the adhesive sheet AS so that the surfaces opposite to the surface in contact with the wafer WF are folded in two.

The recovery means may or may not be a belt conveyor, a multi-indirect robot, etc., which transports the peeled adhesive sheet AS, in addition to the recovery box 50.
In the said embodiment, although alignment of opposite end part AS2 of adhesive sheet AS was performed, alignment of said opposite end part AS2 does not need to be performed.

  Further, the material, type, shape and the like of the adhesive sheet AS, the peeling tape PT and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS and the peeling tape PT may have a circular, elliptical, polygonal shape such as a triangle or a quadrangle, or any other shape, or may be in an adhesive form such as pressure-sensitive adhesive or thermal adhesive. In the case where a heat-sensitive adhesive type of adhesive is adopted, affixing may be performed by providing a suitable coil heater for heating the adhesive sheet AS or the peeling tape PT or heating means such as the heating side of the heat pipe. It may be adhered by an appropriate method. Also, such an adhesive sheet AS and a peeling tape PT may be, for example, a single-layer adhesive sheet only, an intermediate layer between the base sheet and the adhesive layer, and the upper surface of the base sheet. It may be such as a so-called double-sided adhesive sheet capable of peeling a substrate sheet from an adhesive layer, and the double-sided adhesive sheet may be a single layer or multiple layers. It may be one having an intermediate layer, or a single layer or multiple layers without an intermediate layer. The adherend may be, for example, food, resin container, semiconductor wafer such as silicon semiconductor wafer or compound semiconductor wafer, circuit substrate, information recording substrate such as optical disk, glass plate, steel plate, pottery, wood plate or resin plate, etc. Any form of member, article or the like can also be targeted. In addition, the adhesive sheet AS is changed to a functional and practical reading, for example, an arbitrary label for information description, a label for decoration, a protective sheet, a dicing tape, a die attach film, a die bonding tape, a recording layer forming resin sheet, etc. Any sheet, film, tape or the like of any shape may be affixed to any adherend as described above.

The means and steps in the present invention are not limited in any way as long as the operations, functions or steps described in the means and steps can be performed, and it is needless to say that the constitutions of only one embodiment shown in the above embodiment or There is no limitation to the process. For example, the holding means is not limited as long as it can hold the adhesive sheet, as long as it is within the technical scope in light of the technical common knowledge at the time of filing of the application (for other means and steps) Description is omitted).
Further, the drive device in the above-described embodiment includes a rotary motor, a linear motion motor, a linear motor, an electric device such as a single-axis robot and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder and a rotary cylinder. Besides being adoptable, it is also possible to adopt a combination of them directly or indirectly (some overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 ... Sheet peeling apparatus 20 ... Holding means 30 ... Tension giving means 32 ... Induction means 40 ... Folding means 41 ... Bending part crimping means 42 ... Outer peripheral part crimping means AS ... Adhesive sheet AS1 ... Bending part AS2 ... Opposite end part (outer periphery Department)
PT: peeling tape WF: wafer (adherend)

Claims (3)

A sheet peeling apparatus for peeling an adhesive sheet attached to an adherend, the sheet peeling apparatus comprising:
Holding means for holding the adhesive sheet;
Tension applying means for applying tension to the adhesive sheet held by the holding means to separate the adhesive sheet from the adherend;
And a folding means for folding the adhesive sheet in half with a predetermined position in the plane of the adhesive sheet peeled off by the tension applying means as a bending portion,
A sheet peeling apparatus characterized in that the folding means includes: a bending portion crimping means for crimping the bending portion; and an outer peripheral portion crimping means for crimping outer peripheral portions facing each other in the folded adhesive sheet. .   2. The sheet peeling apparatus according to claim 1, wherein the tension applying means includes guiding means for guiding the adhesive sheet so that the adhesive sheet peeled from the adherend is folded in two. A sheet peeling method for peeling an adhesive sheet attached to an adherend,
A holding step of holding the adhesive sheet;
A tension applying step of applying tension to the adhesive sheet held in the holding step to separate the adhesive sheet from the adherend;
And a folding step of folding the adhesive sheet in half with a predetermined position in the plane of the adhesive sheet peeled off in the tension applying step as a bending portion,
The folding step includes a bent portion pressing step of pressing the bent portion and an outer peripheral portion pressing step of pressing the opposing outer peripheral portions of the folded adhesive sheet. .

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