CN106971959B - Sheet adhesion device and adhesion method, and adhesive sheet material - Google Patents

Sheet adhesion device and adhesion method, and adhesive sheet material Download PDF

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Publication number
CN106971959B
CN106971959B CN201610829021.3A CN201610829021A CN106971959B CN 106971959 B CN106971959 B CN 106971959B CN 201610829021 A CN201610829021 A CN 201610829021A CN 106971959 B CN106971959 B CN 106971959B
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sheet
slit
adhesive sheet
unit
peeling
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CN106971959A (en
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上道厚史
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Lintec Corp
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Lintec Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
    • H01L21/447—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428 involving the application of pressure, e.g. thermo-compression bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesive Tapes (AREA)

Abstract

The sheet adhesion device (10) comprises: a drawing unit (20) which draws out a material sheet (RS) which forms an adhesive sheet (AS1) on the inner side of a first cut (CU1) by providing an annular first cut (CU1) which penetrates through an original Adhesive Sheet (AS) temporarily bonded to a release sheet (RL) and does not penetrate through the release sheet (RL), forms a redundant sheet (US) on the outer side of the first cut (CU1), and is provided with a non-annular second cut (CU2) which penetrates through the redundant sheet (US); a peeling unit (30) that folds the material sheet (RS) and peels the adhesive sheet (AS1) from the release sheet (RL); a pressing unit (40) which presses and adheres the adhesive sheet (AS1) to the adherend (WF); a detection unit (50) that detects a detection portion exposed by bending a portion of the material sheet (RS) including the second cut (CU2) with the peeling unit (30), the extraction unit (20) intermittently extracting the material sheet (RS) based on a detection result of the detection unit (50).

Description

Sheet adhesion device and adhesion method, and adhesive sheet material
Technical Field
The invention relates to a sheet adhesion device and an adhesion method, and an adhesive sheet.
Background
Conventionally, there is known a sheet sticking apparatus that detects an adhesive sheet and repeats so-called intermittent operation of drawing out and stopping the adhesive sheet to draw out the adhesive sheet one by one and stick the sheet to an adherend (see, for example, document 1: japanese patent application laid-open No. 2005-116928).
However, in the conventional sheet bonding apparatus described in document 1, in order to detect the thin boundary between the adhesive sheet formed on the material sheet and the excess sheet, a special and expensive detection unit must be used.
Disclosure of Invention
The invention aims to provide a sheet adhesion device, an adhesion method and an adhesive sheet material, which can reliably perform intermittent operation of the sheet material without using special and expensive detection units.
In order to achieve the above object, a sheet sticking apparatus according to the present invention is a sheet sticking apparatus for sticking an adhesive sheet having a predetermined shape to an adherend by repeating intermittent operations, the sheet sticking apparatus including: a drawing unit that draws out a material sheet having an annular first slit formed therein to form the adhesive sheet of the predetermined shape on an inner side of the first slit, an excess sheet formed on an outer side of the first slit, and an annular or non-annular second slit penetrating the excess sheet, the first slit penetrating a band-shaped original adhesive sheet temporarily bonded to one surface of the band-shaped release sheet and not penetrating the release sheet; a peeling unit configured to bend the material sheet and peel the adhesive sheet having the predetermined shape from the peeling sheet; a pressing unit for pressing and adhering the peeled adhesive sheet of the predetermined shape to an adherend; a detection unit that detects a detection portion that is exposed by the peeling unit by bending the portion of the material sheet including the second cut, the extraction unit intermittently extracting the material sheet based on a detection result of the detection unit.
On the other hand, the sheet adhesion method of the present invention is a method for adhering an adhesive sheet having a predetermined shape to an adherend by repeating an intermittent operation, comprising the steps of: a drawing step of drawing out a material piece having an annular first slit to form the adhesive sheet of the predetermined shape inside the first slit, an excess piece outside the first slit, and an annular or non-annular second slit penetrating the excess piece, the first slit penetrating a band-shaped original adhesive sheet temporarily bonded to one surface of the band-shaped release sheet and not penetrating the release sheet; a peeling step of bending the material sheet by a peeling means and peeling the adhesive sheet having the predetermined shape from the peeling sheet; and an adhering step of pressing and adhering the peeled adhesive sheet of the predetermined shape to the adherend, and performing a drawing step of detecting a detection portion exposed when the peeling unit bends the portion of the material sheet including the second notch, and intermittently drawing out the material sheet based on a result of the detection.
In the adhesive sheet material of the present invention, a strip-shaped original adhesive sheet is temporarily adhered to one surface of a strip-shaped release sheet, wherein an annular first slit penetrating the original adhesive sheet and not penetrating the release sheet is provided so that an adhesive sheet having a predetermined shape can be formed inside the first slit and an excess sheet can be formed outside the first slit, and an annular or non-annular second slit penetrating the excess sheet is provided so that a detection portion can be exposed when a portion including the second slit is bent.
According to the present invention, since the detection portion exposed when the portion including the second notch of the material sheet is bent is detected and the material sheet is intermittently drawn based on the detection result, the intermittent operation of the material sheet can be reliably performed without using a special and expensive detection unit.
Drawings
FIG. 1 is a side view of a sheet adhering apparatus according to an embodiment of the present invention;
FIG. 2 is a view of the AA-AA section BB of FIG. 1, and is an explanatory view of the operation of the sheet adhesion device;
fig. 3 is an explanatory view of an operation of the sheet sticking apparatus according to the modification of the present invention.
Detailed Description
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the present embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes within a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. In the present embodiment, when the direction is indicated based on the observation from the front side in fig. 1 parallel to the Y axis, "up" indicates the direction of the arrow on the Z axis, "down" indicates the opposite direction, "left" indicates the direction of the arrow on the X axis, "right" indicates the opposite direction, "front" indicates the front side in fig. 1 parallel to the Y axis, and "rear" indicates the opposite direction.
In fig. 1, a sheet sticking apparatus 10 repeatedly performs an intermittent operation to stick an adhesive sheet AS1 having a predetermined shape to a semiconductor wafer (hereinafter, also simply referred to AS "wafer") WF AS an adherend, and includes: a drawing unit 20 that draws out a material sheet RS AS an adhesive sheet material, the material sheet RS having an annular first cut CU1, in which an adhesive sheet AS1 having a predetermined shape is formed inside the first cut CU1 and an excess sheet US is formed outside the first cut CU1, and an annular U-shaped second cut CU2 penetrating the excess sheet US and the release sheet RL is provided, the first cut CU1 penetrating a band-shaped original adhesive sheet AS formed by a base material BS and an adhesive AD layer temporarily bonded to one surface of the band-shaped release sheet RL and not penetrating the release sheet RL; a peeling plate 30 AS a peeling means for folding the material sheet RS and peeling the adhesive sheet AS1 having a predetermined shape from the peeling sheet RL; a pressing roller 40 AS a pressing means for pressing and adhering the peeled adhesive sheet AS1 having a predetermined shape to the wafer WF; a detection unit 50 (see fig. 2) such as an optical sensor and an imaging unit that detects a through-hole DH as a detection portion exposed by bending a portion of the material sheet RS including the second notch CU2 by the bending portion 31 of the peeling plate 30; and a support unit 60 for supporting the wafer WF and moving the wafer WF and the pressure roller 40 relative to each other.
The extraction unit 20 includes: a support roller 21 that supports the material piece RS; a guide roller 22 that guides the material sheet RS; a drive roller 24 driven by a rotation motor 23 as a drive device; a pinch roller 25 that sandwiches the release sheet RL with the excess sheet US between the drive roller 24 and the pinch roller; and a recovery roller 26 for recovering the release sheet RL with the excess sheet US, and the entire drawing unit 20 is supported by a frame 27.
The detection unit 50 is disposed in the housing groove 32 formed in the peeling plate 30 as shown in fig. 2.
The support unit 60 includes a table 62 supported by a slider 61A of a linear motor 61 as a driving device, and a support surface 62A capable of holding the wafer WF by suction by a decompression unit not shown such as a decompression pump or a vacuum syringe.
In the above sheet adhesion device 10, a description is given of a procedure for adhering the adhesive sheet AS1 to the wafer WF.
First, as shown in fig. 1, when an operator sets a material sheet RS in the sheet sticking apparatus 10 in which the respective members are arranged at the initial positions and inputs a signal for starting the automatic operation via an input unit, not shown, such as an operation panel or a personal computer, the extracting unit 20 drives the rotary motor 23 to extract the material sheet RS. Thereafter, when the portion of the material piece RS including the second notch CU2 is bent by the bent portion 31 of the peeling plate 30, the inner side of the second notch CU2 protrudes toward the pressing roller 40 side as shown in fig. 2, forming the protruding portion DT, and the through hole DH appears in the material piece RS. When the detection unit 50 detects the outer edge of the through hole DH, the drawing unit 20 stops the driving of the rotary motor 23 and enters a standby state, and the adhesive sheet AS1 is disposed at the adhesion preparation position.
Thereafter, when the wafer WF is placed on the support surface 62A of the stage 62 at the initial position by a conveying means, not shown, such as a human hand, an articulated robot, a conveyor, or the like, the support means 60 drives a decompression means, not shown, to suction and hold the wafer WF, and then drives the linear motor 61 to move the stage 62 in the left direction. When detecting that the wafer WF has reached the predetermined position, the extracting unit 20 drives the rotary motor 23 to extract the material sheet RS in accordance with the moving speed of the stage 62. The adhesive sheet AS1 is peeled from the release sheet RL by the bent portion 31 and is pressed by the pressing roller 40 to adhere to the wafer WF. After the entire adhesive sheet AS1 is stuck to the wafer WF, the drawing unit 20 continues to drive the rotary motor 23, and when the detection unit 50 detects the next through hole DH, the drawing unit 20 stops driving of the rotary motor 23 and again enters the standby state.
When the adhesion of the adhesive sheet AS1 to the wafer WF is completed, the support unit 60 stops the driving of the linear motor 61 and the decompression unit, not shown, and then the conveyance unit, not shown, conveys the wafer WF to the next step. Then, the support unit 60 drives the linear motor 61 to return the stage 62 to the initial position, and thereafter, the same operation as described above is repeated.
According to the above-described embodiment, the through-hole DH that appears when the portion of the material sheet RS including the second cut CU2 is bent is detected, and the material sheet RS is intermittently drawn based on the detection result, so that the intermittent operation of the material sheet can be reliably performed without using the special and expensive detection unit 50.
As described above, the best configuration, method, and the like for carrying out the present invention are disclosed, but the present invention is not limited thereto. That is, although the present invention has been particularly shown and described with respect to specific embodiments, those skilled in the art can variously modify the shapes, materials, quantities, and other detailed configurations of the above-described embodiments without departing from the scope of the technical idea and the object of the present invention. In addition, the above-disclosed descriptions of the shape, material, and the like are merely exemplary descriptions for easy understanding of the present invention, and do not limit the present invention, and therefore descriptions based on names of components other than some or all of the limitations of the shape, material, and the like are included in the present invention.
For example, when the original adhesive sheet AS in a tape form is temporarily adhered to one surface of the release sheet RL in a tape form, the cut unit 70 may be provided to form the first and second cuts CU1 and CU2 in the sheet. The notching unit 70 has: a cutter roll 74 which is positioned on the base material BS side of the material sheet AS indicated by the two-dot chain line in fig. 1, is rotationally driven by a rotary motor 71 AS a driving means, and is provided with a first cutter blade 72 and a second cutter blade 73, the first cutter blade 72 forming a first cut CU1 which penetrates the original adhesive sheet AS and does not penetrate the release sheet RL, the second cutter blade 73 forming a second cut CU2 which penetrates the original adhesive sheet AS and the release sheet RL; a cutting receiving roller 75 disposed opposite the cutting roller 74 with the material sheet sandwiched therebetween.
The slit unit 70 may form the first and second slits CU1, CU2 on the material sheet by a laser cutter, a thermal cutter, a gas cutter, a compressed water cutter, or the like.
As the second slit, a linear second slit CU20 extending obliquely in a direction opposite to the drawing direction from the outer edge of the excess piece US as indicated by a solid line in the right drawing of fig. 3 may be used, or an L-shaped second slit CU21 extending inward in a direction orthogonal to the drawing direction from the outer edge of the excess piece US as indicated by a two-dot chain line in the right drawing of fig. 3 and then toward the rear side in the drawing direction may be used. When the second notch CU20 is used, the detection unit 50 detects the through hole DH1 exposed by the triangular protruding portion DT1 being peeled off by the peeling plate 30 by a predetermined length as shown by a solid line in the left drawing of fig. 3, and when the second notch CU21 is used, the detection unit 50 may detect the through hole DH2 exposed by the rectangular protruding portion DT2 being peeled off by the peeling plate 30 by a predetermined length as shown by a two-dot chain line in the left drawing of fig. 3.
As the shape of the second slit, a V shape, コ shape, or the like can be employed.
In this case, the detection portion may be a through hole which is exposed by partially bending the material sheet including the second notch by the peeling means and peeling off an inner portion of the second notch, or may be an inner portion of the second notch peeled off from the material sheet. The inner portion of the second cut may be removed by a removing unit, not shown, before being bent by the peeling unit, or may be removed in a state of the material sheet.
As shown by the two-dot chain line in fig. 2, a detection portion formation assisting unit 80 that assists formation of the detection portion may be provided at the bent portion 31 of the peeling plate 30. The detection portion formation auxiliary unit 80 may assist the separation of the protruding portion DT by spraying gas, extruding by a pin, vibrating the separation plate 30, or the like.
The peeling unit may be constituted by a round bar, a roller, or the like.
The pressing means may employ a pressing member using a round bar, a plate, rubber, resin, sponge, or the like, or may press the adhesive sheet AS1 against the adherend by gas spraying.
The detection unit 50 may be provided at a position where the outer edge of the protruding portion can be detected, as indicated by a two-dot chain line in fig. 1. When the detection portion is a protruding portion, the second cut penetrates the original adhesive sheet AS and does not penetrate the release sheet RL, similarly to the first cut CU 1.
The detection unit 50 may be a contact type sensor such as a limit switch.
The supporting unit 60 may be configured to support the adherend by a clamp unit such as a mechanical clamp or a clamp cylinder, coulomb force, an adhesive, a magnetic force, bernoulli adsorption, or the like.
The support unit 60 may move the sheet adhesion device 10 while fixing the position of the table 62, or may move both the table 62 and the sheet adhesion device 10.
When the wafer WF is relatively moved by another device with respect to the sheet adhesion device 10, the support unit 60 may not be provided.
The material, type, shape, and the like of the adhesive sheet AS1 and the adherend of the present invention are not particularly limited. For example, the adhesive sheet AS1 may have a polygonal shape such AS a circle, an ellipse, a triangle, or a quadrangle, or other shapes, or may have an adhesive method such AS pressure-sensitive adhesiveness or thermal adhesiveness, and when the adhesive sheet AS1 having thermal adhesiveness is used, the adhesive sheet may be adhered by an appropriate method in which a heating means such AS a coil heater or a heating pipe is provided to heat the adhesive sheet. The adhesive sheet AS1 may be a single-layer adhesive sheet, a double-sided adhesive sheet, or a double-sided adhesive sheet having a single-layer or multi-layer intermediate layer, or a single-layer or multi-layer adhesive sheet having no intermediate layer, for example. Further, the adherend can be any type of member or article such as food, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit boards, information storage boards such as optical disks, glass plates, steel plates, ceramics, wood plates, or resin plates. In addition, the adhesive sheet AS1 can be replaced by any method of reading the function and use, for example, by attaching an arbitrary sheet, film, tape, or the like having an arbitrary shape such AS an information storage label, a decorative label, a protective sheet, a dicing tape, a die bonding film, a bonding tape, or a storage layer forming resin sheet to an arbitrary adherend AS described above.
The substrate and the adhesive layer are not particularly limited, and examples of the substrate include papers such as high-quality paper, cellophane and coated paper, laminated papers obtained by laminating thermoplastic resins such as polyethylene on these papers, plastics such as polyester fibers (e.g., polyethylene terephthalate and polyethylene naphthalate), polyolefins (e.g., polypropylene and polyethylene), polyvinyl chloride, polyvinylidene chloride, polystyrene, polycarbonate, vinyl alcohol, polyurethane and acrylic resins, celluloses such as triacetylcellulose, cellulose triacetate and cellophane, rubbers such as natural rubber and silicone rubber, woods, metals, ceramics, glass and stone, and the adhesive layer is composed of an adhesive of acryl, rubber and silicone and has a thickness of 1 μm to 5 mm. The thickness of the base material and the adhesive layer may be equal to or greater than the thickness of the above-described examples, or equal to or less than the thickness of the examples, as is common in the art.
The units and steps of the present invention are not limited as long as they can function as the operations, functions, or steps described for the units and steps, and are not limited to the components and steps of the simple embodiment shown in the above embodiment. For example, the peeling means is not limited as long as it is within the technical scope of the present application, with reference to the common technical knowledge of the first application, as long as it is a means for folding a material sheet and peeling an adhesive sheet having a predetermined shape from the peeling sheet (the description of other means and steps is omitted).
The drive unit and the drive device in the above embodiments may be configured by directly or indirectly combining electric devices such as a rotary motor, a direct motor, a linear motor, a single-axis robot, a multi-joint robot, and actuators such as a cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder (the same as the above embodiments).

Claims (3)

1. A sheet sticking apparatus for sticking an adhesive sheet having a predetermined shape to an adherend by repeating intermittent operations, comprising:
a drawing unit that draws out a material sheet having an annular first slit formed therein to form the adhesive sheet of the predetermined shape on an inner side of the first slit, having an excess sheet formed on an outer side of the first slit, and having an annular second slit penetrating the excess sheet, the first slit penetrating a band-shaped original adhesive sheet temporarily bonded to one surface of the band-shaped release sheet and not penetrating the release sheet;
a peeling unit configured to bend the material sheet and peel the adhesive sheet having the predetermined shape from the peeling sheet;
a pressing unit for pressing and adhering the peeled adhesive sheet of the predetermined shape to an adherend;
a detection unit including a protrusion or a through hole that is exposed to the material sheet by bending a portion of the material sheet including the second cut by the peeling unit,
the extraction unit intermittently extracts the material sheet based on a detection result of the detection unit and recovers the protruding portion together with the release sheet.
2. A sheet adhesion method for adhering an adhesive sheet having a predetermined shape to an adherend by repeating intermittent operations, comprising:
a drawing step of drawing out a material piece having an annular first slit to form the adhesive sheet of the predetermined shape inside the first slit, an excess piece outside the first slit, and an annular second slit penetrating the excess piece, the first slit penetrating a band-shaped original adhesive sheet temporarily bonded to one surface of the band-shaped release sheet and not penetrating the release sheet;
a peeling step of bending the material sheet by a peeling means and peeling the adhesive sheet having the predetermined shape from the peeling sheet;
an adhering step of pressing and adhering the peeled adhesive sheet of the predetermined shape to the adherend,
and performing a drawing step of detecting, as a detection portion, a protruding portion or a through hole exposed in the material sheet when the portion including the second notch of the material sheet is bent by the peeling unit, and intermittently drawing out the material sheet based on a result of the detection,
and performing a step of collecting the protruding portion together with the release sheet.
3. An adhesive sheet material comprising a tape-like original adhesive sheet temporarily adhered to one surface of a tape-like release sheet,
by providing an annular first slit which penetrates the original adhesive sheet and does not penetrate the release sheet, an adhesive sheet having a predetermined shape can be formed inside the first slit and an excess sheet can be formed outside the first slit, and by providing an annular second slit which penetrates the excess sheet, a protruding portion or a through hole which is a detection portion can be exposed when a portion including the second slit is bent, and the protruding portion can be collected together with the release sheet.
CN201610829021.3A 2015-09-30 2016-09-18 Sheet adhesion device and adhesion method, and adhesive sheet material Active CN106971959B (en)

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JP2015192622A JP6543152B2 (en) 2015-09-30 2015-09-30 Sheet sticking apparatus, sticking method, and adhesive sheet material
JP2015-192622 2015-09-30

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CN106971959A CN106971959A (en) 2017-07-21
CN106971959B true CN106971959B (en) 2021-11-02

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