KR101577301B1 - Embossed mold apparatus and products manufacturing method using this - Google Patents

Abstract

The present invention relates to a process for forming an adhesive or a pressure sensitive adhesive on a release film for chip removal on a position corresponding to a hole to be formed in a processed film and a process for bonding the chip removal film formed with the adhesive or pressure sensitive adhesive to the processed film A step of forming the hole in the processed film by using a mold part and a step of separating the release film for chip removal from the processed film, Or by the pressure-sensitive adhesive, so that mass production of the product can be carried out quickly and efficiently while eliminating the occurrence of defects by a simple structure, and a method of manufacturing a product using the same.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an embossing mold apparatus,

The present invention relates to a relief mold apparatus and a method of manufacturing a product using the relief mold apparatus. More particularly, the present invention relates to a relief mold apparatus capable of rapidly and efficiently mass- And a manufacturing method thereof.

Conventionally, a flexible printed circuit board, a double-sided tape, a packing material, an insulator, a precision processing material, a liquid crystal display device and a protective film have been cut into wooden or metal molds. However, the integration degree of electronic parts has been improved, It is the embossed mold that is designed to cut these products more precisely and stably.

Such an embossed metal mold is a metal mold using a blade formed with a boss. Generally, a thin steel sheet having a thickness of 0.6 mm to 3 mm is generally etched according to a shape and then produced through CNC precision machining.

The embossed mold is easy to install and easy to use, it can be applied to all presses, it is suitable for processing precision products because of its high precision, and it is possible to remove chips There are advantages.

The relief mold is applied to various fields such as a flexible printed circuit board, a double-sided tape, a packing material, an insulator, a precision processing material, a liquid crystal display device, and a protective film by the above-

Embossed molds process a workpiece with a blade having a specific pattern, during which chips cut by the blade are generated and these chips remain on the workpiece or are attached to the blade.

Conventionally, a worker removes a chip cut by a blade, and this operation takes a considerable time. In the case of a small-sized chip, the worker is not conspicuous and can not be removed frequently. Respectively.

In addition, in the case where chips are left on the relief mold, a cutting defect occurs to the workpiece following the remaining chip, and the defective cutting results in a defect of the product.

In view of the above, there has been proposed an apparatus for punching out electronic parts equipped with a guard, a punching system disclosed in Japanese Laid-Open Patent Publication No. 11-70500, "Embossed Mold System ", Registered Patent No. 10-1451896, which has been registered in the past.

However, all of the above-described prior art devices have a problem that a considerable cost is required for a mold design, an air piping, and the like as well as the entire device is structurally very complicated.

Particularly, these prior arts have employed an operation mechanism for ejecting a chip by projecting a pin for chip removal and then sucking the discharged chip back into the air to remove the chip. However, such an operation mechanism can reduce the incidence of defective products However, the process delay is inevitable in accordance with the operation sequence, and such a process delay naturally causes a problem that the production amount is decreased.

In order to solve the above problems, a method of using a method of removing chips as a by-product in processing a workpiece is also applied by using a separate member having an attaching ability such as a release tape or the like.

However, such a removing method using a separate member can not separate the adhesive layer having the adhesive force from the workpiece if the adhesive force is increased, and there is a fear that defects such as tearing of the workpiece in the process of separating the workpiece from the release tape .

Further, in the removing method using such a separate member, if the adhesive force is lowered, the chips may not be separated from the release tape.

Japanese Patent Application Laid-Open No. 5-104163 Japanese Patent Application Laid-Open No. 11-70500 Patent No. 10-1451896

The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a method for manufacturing a product using the same, which enables mass production of products quickly and efficiently while eliminating defects by a simple structure will be.

In addition, the present invention provides an embossing mold apparatus and a method of manufacturing a product using the same, which can reduce the cost of designing a complicated mold and reduce the time consuming to simplify the entire apparatus, thereby improving the efficiency through cost reduction due to initial installation and construction .

According to an aspect of the present invention, there is provided a method for manufacturing a chip removing film, comprising the steps of: forming an adhesive or a pressure sensitive adhesive on a release film for chip removal, Forming a hole in the processed film by using a mold part; and separating the release film for chip removal and the processed film from each other, And the adhesive is removed by the adhesive or the adhesive formed on the release film for chip removal.

Here, the adhesive or the pressure-sensitive adhesive is formed by printing on the release film for chip removal.

In this case, the adhesive or the adhesive may be printed on all or only a part of the hole corresponding to the hole.

The adhesive or the pressure-sensitive adhesive may be hot-air dried or UV-cured.

After the adhesive formed on the release film for chip removal is hot-air dried, the release film for chip removal and the processed film are laminated together.

The adhesive formed on the release film for chip removal is characterized in that the release film for chip removal and the processed film are cured after UV curing.

The pressure sensitive adhesive formed on the release film for chip removal is characterized in that the release film for chip removal and the processed film are UV-cured before or after being laminated.

The adhesive or the pressure-sensitive adhesive formed on the release film for chip removal is characterized in that it is hot-air dried before the release film for chip removal and the processed film are joined together.

The adhesiveness by the adhesive or the adhesiveness by the adhesive is characterized in that the adhesive or the adhesive is formed on the release film for chip removal, followed by hot air drying or UV curing.

The process for forming an adhesive or a pressure-sensitive adhesive on the release film for chip removal is characterized in that the adhesive or the pressure-sensitive adhesive is printed at a position corresponding to the hole on the release film for chip removal.

The step of forming an adhesive or a pressure-sensitive adhesive on the release film for chip removal may include forming the adhesive or the pressure-sensitive adhesive on the entire surface of the release film for chip removal, And the adhesive or the tackiness of the adhesive or the tacky agent formed on the substrate is removed.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: forming a mold on a processed film including a relief mold for forming a hole; a printing unit for forming an adhesive or an adhesive on a position corresponding to the hole on the release film for chip removal; And a joint portion for joining the formed release film for chip removal with the processed film, wherein chips generated from the hole are removed by the adhesive or the adhesive formed on the release film for chip removal. Device may be provided.

According to the present invention having the above-described configuration, the following effects can be achieved.

In the present invention, a hole is formed in a processed film by using a mold part including a relief mold, and a plurality of chips generated by the hole formation are removed by a release film for chip removal, Since it is possible to produce high-quality products free from defects, reliable devices can be provided to the producers and reliable products can be delivered to the consumers.

In particular, the present invention omits a complicated driving mechanism that causes unnecessary process delay compared with most related prior arts including the applicant's original request, thereby reducing the TAG time and enabling rapid and efficient mass production.

In addition, the present invention provides a mold having only a blade having a basic specific pattern formed thereon, thereby greatly reducing the time and cost consuming and wasting of complicated and large mold design for preparing the existing embossing mold apparatus and system .

The present invention also provides a method for manufacturing a flexible printed circuit board, a double-sided tape, a packing material, an insulator, a precision processing material, etc., in which chip and fine powder generated by fine hole processing are scattered, In the long term, it will be possible to prevent any health problems.

That is, according to the present invention, by using the adhesiveness or tackiness imparted to the release film for chip removal, the chips and fine powder generated by the hole machining of the mold portion are immediately attached and removed to give a pleasant work environment It becomes possible.

FIG. 1 is a perspective view schematically showing a hole is perforated and a chip is generated by using a relief mold apparatus according to an embodiment of the present invention. FIG.
2 is a conceptual diagram illustrating the overall structure of a relief mold apparatus according to an embodiment of the present invention.
FIG. 3 is a conceptual view of an enlarged cross-
4 is a perspective view showing a state in which an adhesive or an adhesive is printed on the release film for chip removal by the printing unit of the relief mold apparatus according to the embodiment of the present invention.
FIG. 5 is a conceptual view of an enlarged cross-
FIG. 6 is a conceptual view of an enlarged cross-
7 is a conceptual view showing the overall structure of the relief mold apparatus according to the first modified example of the present invention
8 is a conceptual view showing the overall structure of the relief mold apparatus according to the second modification of the present invention
9 is a conceptual view showing the overall structure of the relief mold apparatus according to the third modification of the present invention
10 is a conceptual diagram schematically showing a process of removing an adhesive force or an adhesive force using a remover on an adhesive or a pressure sensitive adhesive formed on a release film for chip removal according to another embodiment of the present invention

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings.

However, the present invention is not limited to the embodiments described below, but may be embodied in various other forms.

The present embodiments are provided so that the disclosure of the present invention is thoroughly disclosed and that those skilled in the art will fully understand the scope of the present invention.

And the present invention is only defined by the scope of the claims.

Thus, in some embodiments, well known components, well known operations, and well-known techniques are not specifically described to avoid an undesirable interpretation of the present invention.

In addition, throughout the specification, like reference numerals refer to like elements, and the terms (mentioned) used herein are intended to illustrate the embodiments and not to limit the invention.

In this specification, the singular forms include plural forms unless the context clearly dictates otherwise, and the constituents and acts referred to as " comprising (or having) " do not exclude the presence or addition of one or more other constituents and actions .

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs.

Also, commonly used predefined terms are not ideally or excessively interpreted unless they are defined.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

1 is a perspective view schematically showing holes formed by using a relief mold apparatus according to an embodiment of the present invention and generating chips. FIG. 1 (a) shows a state before a drilling operation, and FIG. 1 1 (b) is a view showing the state after the drilling operation.

2 is a conceptual view showing the overall structure of a relief mold apparatus according to an embodiment of the present invention.

FIG. 3 is an enlarged schematic cross-sectional view of part A of FIG. 2, and FIG. 4 is a cross-sectional view illustrating a state in which an adhesive or a pressure-sensitive adhesive is printed on a release film for chip removal by a printing unit of a relief mold apparatus according to an embodiment of the present invention. FIG. 5 is a conceptual enlarged sectional view of FIG. 2, and FIG. 6 is a conceptual enlarged sectional view of a portion C of FIG.

1 and 2, a mold 20 having a blade 22 having a specific pattern is formed so as to form a hole 11 having a specific shape on a work film 10 supplied as an object to be processed. As shown in FIG.

1, a hole-corresponding portion 11 'at a position corresponding to the hole 11 to be formed on the processed film 10 as shown in FIG. 1 (a) The hole 11 is formed while generating the chip 12 as shown in FIG. 1 (b).

Here, the chips 12 having a specific shape generated from each hole 11 of a specific shape are formed by using the adhesive 31a or the adhesive 31b printed on the release film 30 for chip removal supplied in a specific direction All can be removed.

At this time, the processed film 10 from which the chips 12 are removed is produced in the form of a product P applicable to various fields.

Such a product P can include, for example, a flexible printed circuit board, a double-sided tape, a packing material, an insulator, a precision processing material, and the like.

Therefore, the present invention is characterized in that a hole 11 is formed in a processing film 10 to be processed by using a mold part 20, and a plurality of chips 12 generated by the formation of the hole 11 are bonded It is possible to produce a product P of excellent quality without occurrence of defects by removing the entirety by the release film 30 for removing chips which is imparted with adhesiveness. Therefore, it is possible to provide a reliable device to the producer, Will be possible.

In particular, the present invention can eliminate the complicated driving mechanism that causes unnecessary process delay compared to the prior arts described above, thereby reducing the TAG time and enabling rapid and efficient mass production.

The present invention also provides a method of manufacturing a mold for molding a mold having a blade 22 having a basic specific pattern and a method of manufacturing a mold for molding a mold, Consuming and waste can be greatly reduced.

In addition, the present invention is applicable to workers in a workplace, such as a flexible printed circuit board, a double-sided tape, a packing material, an insulator, a precision processing material, etc., And prevent any health problems in the long run.

That is, according to the present invention, the chip 12 and the fine powder generated in the process of forming the hole 11 of the mold part 20 are immediately removed and removed by using the adhesive property or the tackiness imparted to the release film 30 for chip removal Thus, a pleasant working environment can be created by prioritizing the health of the worker.

It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or scope of the invention.

First, the embossing mold apparatus according to an embodiment of the present invention will be described in more detail. It can be understood that the apparatus includes a mold unit 20, a printing unit 40, and a joining unit 60.

The mold section 20 includes a relief mold 20 for forming a plurality of holes 11 in a processed film 10 supplied as an object to be processed. Hereinafter, the mold section and the relief mold are referred to as " '.

The printing unit 40 is for printing the adhesive 31a or the adhesive 31b on the release film 30 for chip removal including positions corresponding to the respective holes 11. [

The printing unit 40 may be a screen printing machine, an offset printing machine, a gravure printing machine, or the like.

The joint portion 60 is composed of a pair of rollers as shown in the figure and is provided with the release film 30 for chip removal on which the adhesive 31a or the adhesive 31b is printed, And feeding the processed film 10 and the release film 30 for chip removal to each other by supplying them between the pair of rollers.

Therefore, the chips 12 generated from each of the holes 11 are completely removed by using the adhesive 31a or the adhesive 31b applied to the release film 30 for chip removal supplied in a specific direction.

On the other hand, the mold section 20 includes a lower stationary mold 20d for supporting and supporting the working film 10 fed in one direction, a lower fixed mold 20d for raising and lowering from the upper side of the lower stationary mold 20d, A structure including the movable mold 20u can be applied.

The mold part 20 is not limited to the illustrated structure, and it is needless to say that it is applicable to a rotary die mold as well as a press mold as shown in the drawings.

7 to 9 to be described later with reference to Figs. 1 to 6, a manufacturing process for forming the hole 11 in the processed film 10 according to a so-called perfecting operation, that is, complete cutting, It can be applied.

The release film 30 for chip removal is transferred through the printing section 40 and the mold section 20. The release section 60 includes a release film 30 for chip removal which has passed through the printing section 40, So that the processed films 10 are interlaced.

It is a matter of course that the direction in which the release film 30 for chip removal is supplied is the same as the direction in which the processing film 10 is supplied and that the holes 11 in a specific pattern are formed only in the processing film 10.

The adhesive 31a or the adhesive 31b printed on the release film 30 for chip removal is the same as the structure shown in Figs. 3 and 4, and the printing portion 40 and the mold portion 20 are removed It can be understood that the release films 30 are sequentially arranged along the direction in which the release films 30 are supplied.

Concretely, the adhesive 31a or the adhesive 31b is formed on the release film 30 for chip removal as shown in Fig. 4, with the hole corresponding portion 11 'having a shape corresponding to the hole 11 of the processed film 10 The print area and the print pattern may be appropriately adjusted according to the various shapes of the chips 12 corresponding to the hole corresponding part 11 '.

That is, the adhesive 31a or the adhesive 31b may be printed over the entire area corresponding to the hole corresponding portion 11 'as shown in FIG. 4 (a), and the hole corresponding portion 11' ', And the chip 12 is attached and exerted an adhesive force to be removed.

Thus, the processed film 10 is fed between the printing section 40 and the mold section 20 as shown in Figs. 7 to 9, which will be described later, together with Fig. 2, .

The lapped processing film 10 and the release film 30 for chip removal are pressed to form a hole 11 in the vicinity of the blade 22 of the mold portion 20 forming the chips 12 The structure will be briefly described with reference to FIG.

When the upper movable die 20u descends, the blade 22 passes through the work film 10 to form the holes 12 as the holes 11 are formed, and each of these chips 12 is removed for chip removal The adhesive is adhered to the adhesive 31a or the adhesive 31b printed on the releasing film 30 by the printing unit 40. [

The chips 12 attached to the adhesive 31a or the adhesive 31b along the direction in which the release film 30 for chip removal are respectively attached are removed and removed together with the chip release film 30 as shown in FIG. And the product P on which the hole 11 is formed is conveyed in one direction.

It is preferable that the adhesive property and adhesiveness of the adhesive 31a and the adhesive 31b are expressed after the adhesive 31a or the adhesive 31b is printed on the release film 30 for chip removal.

This is because the adhesive 31a or the adhesive 31b adheres to the printing portion 40 to make the printing operation difficult when the adhesive 31a or the adhesive 31b is exposed to the adhesive property or the adhesive property before printing.

Therefore, it is preferable that the adhesive property or tackiness is caused by hot-air drying or UV curing described later after the adhesive 31a or the adhesive 31b is printed on the release film 30 for chip removal.

In other words, the adhesive 31a or the adhesive 31b can be hot-air dried or UV-cured to exhibit adhesiveness or adhesiveness.

7, the printing unit 40 and the mold unit 20 are formed in such a manner that the adhesive 31a can be dried by hot air, so that the adhesive 31a, And a hot air dryer (51) disposed between the heat exchanger and the heat exchanger.

The processed film 10 is supplied between the hot air dryer 51 and the mold section 20 and is joined to the release film 30 for chip removal by the joint section 60. [

That is, the hot air drying by the hot air dryer 51 must be performed before the processed film 10 is joined to the release film for chip removal 30. [

The hot air is dried before the adhesive 31a is laminated in order to prevent damage to the processed film 10, that is, to generate adhesive force of the adhesive 31a by hot air drying, The adhesive 31a can exhibit a reliable removal performance of the chip 12. [

The present invention is also characterized in that it is arranged between the printing section 40 and the mold section 20 so that the adhesive 31a can be cured by UV irradiation so that the adhesive 31a as the UV- The UV curing unit 52 may be provided.

Thus, the processed film 10 is fed between the printing unit 40 and the UV curing unit 52, is joined to the release film 30 for chip removal by the joint unit 60, and the release film 30 , An adhesive 31a, which is a UV curable material as described above, is printed.

That is, the UV curing by the UV curing unit 52 must be performed after the processed film 10 is laminated with the release film 30 for chip removal.

The reason that the adhesive 31a is UV cured after being laminated is that if the adhesive 31a is UV-cured before the processed film 10 is bonded to the release film 30 for chip removal, its adhesive force disappears, Adhesive force is generated immediately after the adhesive 31a is UV-cured after bonding the adhesive 10 with the release film 30 for chip removal so that the adhesive 31a can exert a reliable removal performance of the chip 12 Because.

9, when the pressure sensitive adhesive 31b is applied to the release film 30 for chip removal, the processed film 10 is supplied between the printing section 40 and the mold section 20, The release film 30 for chip removal can be laminated with the release film 30 for chip removal.

Here, since the adhesive 31b is made of a detachable material, hot-air drying and UV curing may be performed before or after laminating the processed film 10 and the release film 30 for chip removal.

At this time, even if the adhesive agent 31b generates an adhesive force by UV curing, it is UV-cured before or after laminating the processed film 10 and the release film for chip removal 30, (12).

Referring to FIGS. 7 through 9 together with FIG. 2, the present invention is characterized in that the processed film 10 and the chips 12, which are discharged through the mold part 20 and formed with the holes 11, The release film 30 for chip removal with each of them is separated and separated in the form of a release film 30 for chip removal (see FIG. 6) to which the product P and the chip 12 are attached via the guide roller 80 (Not shown) may be further provided.

Here, although not shown in the drawing, the separating portion is separately provided for separating the processed film 10 from the chip-removing releasing film 30 to which the chip 12 is attached in a state of being adsorbed by forming a negative pressure on the surface of the product P A processing film 10 in which a hole 11 to be discharged through a guide roller 80 is formed and a releasing film 30 for chip removal with chips 12 attached thereto, ) May be a worker who manually separates by hand.

A method of manufacturing the product P using the relief mold apparatus according to various embodiments of the present invention will now be described in more detail with reference to FIGS. 1 to 9.

The present invention is characterized in that chips 12 generated from each of a plurality of holes 11 formed in a processing film 10 as an object to be processed by a mold part 20 are adhered to a release film 30 for chip removal ) To remove all of them.

Here, it is understood that the blades 22 having the specific pattern corresponding to each of the holes 11 having the specific shape are formed in the mold portion 20. [

At this time, the metal mold part 20 is arranged so as to be capable of ascending and descending from above the work film 10, and the hole 11 is formed by pressing the work film 10.

As described above, the completion work shown in Figs. 2 to 9 may include a process of printing, laminating, pressing, and separating.

First, a process of printing an adhesive 31a or an adhesive 31b on the release film 30 for chip removal, including a position corresponding to each of the holes 11, is performed.

Thereafter, a process of laminating the release film 30 for chip removal, on which the adhesive 31a or the adhesive 31b is printed, with the processing film 10 is performed.

Next, a process of forming the holes 11 by pressing the work film 10 with the metal mold 20 is performed.

Subsequently, a process of separating the release film 30 for chip removal from the film 10 is carried out.

Thus, the chips 12 are adhered to and removed from the adhesive 31a or the adhesive 31b printed on the release film 30 for chip removal.

At this time, it is needless to say that the holes 11 of a specific pattern must be formed only on the processed film 10.

The adhesive 31a or the adhesive 31b is printed including a position corresponding to the hole 11 of a specific pattern, , Or may be printed only on a part of the hole forming portion 11 'at a position corresponding to each of the holes 11 as shown in Fig. 4 (b) Of course.

On the other hand, when the adhesive 31a is printed on the surface of the release film 30 for chip removal, it is necessary to perform hot air drying as shown in Fig. 7 or UV curing as shown in Fig. 8 depending on the properties of the adhesive 31a .

After the pressure-sensitive adhesive 31b is printed on the surface of the release film 30 for chip removal, it is preferable that the adhesive force is developed by the hot-air drying and UV curing as described above, The releasing film 30 for chip removal is joined to the processing film 10 by the joining portion 60 and then pressed against the processing film 10 by using the mold portion 20. [

On the other hand, the adhesive 31a or the adhesive 31b can be printed over the entire surface of the release film 30 for chip removal, and the adhesive 31a or the adhesive 31b can be printed over the entire surface of the release film 30 for chip removal, The adhesive 31a or the adhesive 31b printed on the remaining portion of the printed adhesive 31a or the adhesive 31b other than the portion where the holes 11 of a specific pattern are to be formed may be the same as the adhesive 31a or 31b, can be removed using a remover (32) separately provided as shown in (c).

That is, as shown in FIG. 10 (b), the removing agent does not leave the adhesive 31a or the adhesive 31b up to the portion where the adhesive 31a or the adhesive 31b is unnecessary, (31a) or the adhesive (31b).

10 (c), the removing agent 32 is a glue killer or a glue killer which removes the adhesive force or the adhesive force of the adhesive 31a or the adhesive 31b, ) And the like can be applied.

It is needless to say that the adhesive 31a or the adhesive 31b may be removed by a method of precisely printing using the same equipment as the printing unit 40, although not specifically shown in the application of the removing agent 32. [

Therefore, the adhesive 31a or the adhesive 31b is removed by the removing agent 32, or the release film 30 for chip removal, from which the adhesive force or adhesive force is removed, and the processing film 10 are interlaced by the joint portion 60 will be.

As described above, the printing of the adhesive 31a, the adhesive 31b, the remover 32, and the like may be performed by appropriately selecting any one of screen printing, offset printing, and gravure printing.

Here, the adhesive 31a may be any one of A, B, C, and D, or a combination of one or more.

At this time, the adhesive 31b may be any one of a, b, c, and d, or a combination of one or more.

The remover 32 may be any one of I, II, III and IV or a combination of one or more.

As described above, the present invention is based on a basic technical idea to provide a relief mold apparatus and a method of manufacturing a product using the same, which enable mass production of a product quickly and efficiently while eliminating defects by a simple structure have.

It will be apparent to those skilled in the art that many other modifications and applications are possible within the scope of the basic technical idea of the present invention.

10 ... processed film
11 ... hole
11 '... hole forming portion
12 ... chip
20 ... mold part (embossed mold)
20d ... lower fixed mold
20u ... upper movable mold
22 ... blade
30 ... Release film for chip removal
31a ... glue
31b ... Adhesive
32 ... Remover
40 ... printing section
51 ... hot air dryer
52 ... UV curing machine
60 ... joint part
70 ... auxiliary release film
72 ... adhesive layer
80 ... guide roller

Claims (12)

A step of forming an adhesive or a pressure-sensitive adhesive on a release film for chip removal at a position corresponding to a hole to be formed in the processed film,
Bonding the chip removing film on which the adhesive or pressure-sensitive adhesive is formed, with the processed film;
Forming the hole in the processed film by using a mold part;
Separating the release film for chip removal and the processed film from each other,
Wherein the chip generated during the process of forming the hole using the mold part is removed by the adhesive or the adhesive formed on the release film for chip removal.
The method according to claim 1,
Wherein the adhesive or the adhesive is formed by printing on the release film for chip removal.
The method according to claim 1,
Wherein the adhesive or the adhesive is printed on all or only a part of the hole corresponding to the hole.
The method according to claim 1,
Wherein the adhesive or the pressure-sensitive adhesive is hot-air dried or UV-cured.
The method of claim 4,
Wherein the release agent for chip removal and the processed film are joined together after the adhesive formed on the release film for chip removal is hot air dried.
The method of claim 4,
Wherein the adhesive formed on the release film for chip removal is UV-cured after being laminated with the release film for chip removal and the processed film.
The method according to claim 1,
Wherein the pressure sensitive adhesive formed on the release film for chip removal is UV cured before or after the release film for chip removal and the processed film are laminated or laminated.
The method according to claim 1,
Wherein the adhesive or the pressure-sensitive adhesive formed on the release film for chip removal is hot-air dried before the release film for chip removal and the process film are laminated together.
The method according to claim 1,
Wherein the adhesiveness by the adhesive or the adhesiveness by the adhesive is expressed by hot air drying or UV curing after the adhesive or the adhesive is formed on the release film for chip removal. Way.
The method according to claim 1,
The step of forming an adhesive or a pressure-sensitive adhesive on the release film for chip-
And the adhesive or the adhesive is printed at a position corresponding to the hole on the release film for chip removal.
The method according to claim 1,
The step of forming an adhesive or a pressure-sensitive adhesive on the release film for chip-
The adhesive or the adhesive is formed over the entire surface of the release film for chip removal and then the adhesiveness or tackiness of the adhesive or the adhesive formed on the remaining portion except for the portion where the hole is to be formed is removed And a method of manufacturing a product using the embossing mold apparatus.
A mold part including a relief mold for forming a hole in the processed film;
A printing unit for forming an adhesive or a pressure-sensitive adhesive at a position corresponding to the hole on the release film for chip removal,
And a joint portion for joining the release film for chip removal, on which the adhesive or the adhesive is formed, with the processed film,
Wherein the mold part forms the hole in the processed film laminated with the chip removing mold film by the joint part,
Wherein the chip generated from the hole is removed by the adhesive or the adhesive formed on the release film for chip removal.

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