JP2010129632A - Adhesive sheet with peeling sheet, metal plate sticking device, and metal plate sticking method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive sheet with a peeling sheet, a metal plate sticking method, and a metal plate sticking device for sticking an adhesive on a metal plate mounted on a substrate for mounting a semiconductor element (a substrate) and sticking it to the substrate. <P>SOLUTION: The adhesive sheet with a peeling sheet, in which an adhesive layer 6 is formed in a predetermined region on one surface of the long tape peeling sheet 2, includes a cut and alignment mark 10 of a predetermined shape on a predetermined part. The cut is formed with the adhesive layer completely cut and the peeling sheet left at least partially. The alignment mark is formed with both of the adhesive layer and the peeling sheet of the adhesive sheet with the peeling sheet completely cut out. The adhesive layer 9 of an unnecessary part is eliminated with the cut of the predetermined shape formed on the adhesive layer as a boundary. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an adhesive for a metal plate (hereinafter referred to as a stiffener) which is attached to a semiconductor element mounting substrate (hereinafter referred to as a substrate) for the purpose of enhancing heat dissipation or suppressing warpage of the substrate. In addition, the present invention relates to an adhesive sheet with a release sheet, a metal plate laminating method, and a metal plate laminating apparatus for laminating a substrate and a substrate on which a stiffener and an adhesive are bonded.

  Some semiconductor elements such as a semiconductor large scale integrated circuit (LSI) have recently reached an operating speed of several GHz in terms of clock frequency. In such a high-speed semiconductor, the degree of integration of transistors is high, and as a result, the number of input / output terminals may exceed 1000.

  In order to mount such a multi-terminal number of semiconductor elements on a printed wiring board, a multilayer circuit wiring board called an interposer is disposed between the semiconductor elements and the printed wiring board, and serves as a bridge for electrical connection between them. The interposer has a very thin layer structure and fine line-and-space wiring compared to a printed wiring board in order to cope with high-density mounting.

  Recently, in order to respond to further demands for high-density mounting and to increase the operating frequency, thin products have been developed by using a film as a structural material for the interposer. When the thickness of the interposer is reduced, the interposer may be warped due to heat and stress in each process, which may cause inconvenience in the mounting process.

  Therefore, a multilayer circuit board has been proposed in which stiffeners are bonded via an adhesive to suppress warpage. (For example, see Patent Document 1)

  The adhesive used for bonding these stiffeners to the substrate is usually temporarily bonded to one side of the stiffener first. Then, the process of making the surface of the adhesive side of a stiffener and the surface of a board | substrate contact, and crimping | curing and hardening is common.

  As a conventional method for temporarily adhering an adhesive to one side of a stiffener, the following two methods are generally used. In the first conventional method, the adhesive sheet with the release sheet composed of the adhesive layer 1 and the release sheet 2 and the stiffener metal plate 3 are continuously pasted together, and then the stiffener metal plate 3 is bonded with the die set 4. A method in which the adhesive sheet composed of the adhesive layer 6 and the release sheet 7 is temporarily bonded to the entire surface of one side of the stiffener 5 having a predetermined shape by punching the adhesive sheet with the release sheet at the same time (pre-attachment method) It is. (See Figure 1)

  In the second conventional method, for example, an adhesive sheet with a release sheet composed of a stiffener 5, an adhesive layer 1 and a release sheet 2 is previously processed into a predetermined shape with a die set 4 or the like and then aligned. This is a method of pasting with a laminator or the like (post-pasting method). (See Figure 2)

  In the first pasting method, the stiffener and the adhesive layer are exactly the same shape and the same size because the stiffener metal plate and the adhesive sheet with the release sheet are first bonded and then punched into a predetermined shape with a die set. In this case, there is a problem that the adhesive layer spreads and protrudes outside the stiffener in a pressing process or a heat process when the substrate and the stiffener are bonded.

  In the post-bonding method, the stiffener and the adhesive sheet with a release sheet are preliminarily formed in respective predetermined shapes, aligned, and temporarily bonded. Therefore, the problem that the adhesive layer protrudes outside the stiffener can be solved by designing the adhesive sheet shape to be smaller than the stiffener shape. Patent Document 2 is shown as an example of the post-bonding method.

  However, the post-paste method is generally disadvantageous in terms of cost compared to the pre-paste method because of the positioning operation of the stiffener and the adhesive sheet.

Prior patent documents are shown below.
JP 2003-218524 A JP 2006-269718 A

  As described above, when the stiffener and the adhesive are bonded, it is necessary to form the post-bonding method and the first-bonding method using a die set or the like. However, a die set is generally expensive, and an apparatus for using the die set is expensive because it requires high thrust and rigidity.

  Furthermore, since the die set needs to be adjusted frequently, it is common to have two or more of the same shape in order to increase the operating rate of the equipment. The cost is very high. Further, when exchanging the die set by changing the setup, it takes a long time to work.

  When a large number of products with the same shape are formed using one type of die set, the amortization cost of the die set can be covered, and since there are few setup changes, the work time can be reduced, and this problem is apparently small. Become.

  On the other hand, for products of various types and small quantities, a die set must be prepared for each product type, which increases the initial cost of the die set and is very disadvantageous in terms of cost. Furthermore, due to the nature of high-mix and low-volume production, the number of setup changes increases and the problem of increased setup time becomes significant.

There is also a problem in the step of bonding the stiffener to which the adhesive layer is bonded to the substrate.
The first problem is the stability when peeling the release sheet.
Since the stiffeners obtained by the pre-bonding method and the post-bonding method basically punch the adhesive layer and the release sheet simultaneously with the same die set, the shape of the adhesive layer and the shape of the release sheet are the same. Usually, before the stiffener is bonded to the substrate, the release sheet having the predetermined shape is peeled off with an adhesive sheet, and then the stiffener and the substrate are bonded.

  However, when the stiffener and the adhesive layer are bonded to each other, the adhesive layer may be stretched under the influence of heat or pressure, and the end surface of the release sheet may be caught. In such a state, the peeling stability at the time of peeling the release sheet from the adhesive layer is deteriorated, which often causes trouble of the apparatus. Moreover, the adhesion foreign material from an adhesive sheet may attach to a product, and may cause a foreign material defect.

Another problem is air bubbles between the stiffener and the adhesive layer.
This is a problem mainly in the case of a post-bonding method using a thermosetting adhesive for the adhesive layer. Usually, in the case of a post-bonding method, a stiffener having a predetermined shape is heated in advance, and an adhesive sheet with a release sheet made of a release sheet and an adhesive is punched into a predetermined shape and dropped onto the stiffener before lamination.

  However, when the adhesive sheet with a release sheet lands on the stiffener, air bubbles are often included between the adhesive layer and the stiffener surface. If it becomes such a state, even if vacuum defoaming or roller lamination is performed, it becomes difficult to completely remove the bubbles.

  In many cases of manufacturing a substrate, there is a process of heating at about 200 ° C. such as a reflow process at the time of mounting. At this time, if air bubbles are included between the stiffener and the adhesive layer, the air may expand, causing the stiffener and the adhesive layer to be peeled off, resulting in a failure.

The present invention makes it possible to produce a substrate with a stiffener having a high cost merit, particularly in a variety of products and a small amount of production, without using a die set, and enables the release sheet to be stably peeled, and further, the stiffener and the adhesive. An object is to provide an adhesive sheet with a release sheet, a metal plate laminating method, and a metal plate laminating apparatus, in which bubbles are not easily entrained between layers.
In addition, since the adhesive tape is not used when the release sheet is peeled off, the cost merit is increased, and the adhesive foreign matter to the product by the adhesive tape can be eliminated, and the product yield can be increased.

In order to achieve the above object, the invention according to claim 1 of the present invention provides:
In the adhesive sheet with a release sheet in which an adhesive layer is formed in a predetermined region on one side of the long tape-like release sheet,
The adhesive sheet with the release sheet has a predetermined shape, cuts and alignment marks formed in predetermined locations,
The cut is in the thickness direction of the adhesive sheet with the release sheet, the adhesive layer is completely cut, and the release sheet is formed with at least a portion left,
The alignment mark is formed in a state in which both the adhesive layer and the release sheet of the adhesive sheet with the release sheet are completely cut out,
The adhesive sheet with a release sheet is characterized in that an unnecessary part of the adhesive layer is removed with a predetermined shape of cut formed in the adhesive layer as a boundary.

The invention according to claim 2 is an adhesive sheet with a release sheet in which an adhesive layer is formed in a predetermined region on one side of a long tape-like release sheet.
The adhesive sheet with the release sheet has a predetermined shape, cuts and alignment marks formed in predetermined locations,
The cut is in the thickness direction of the adhesive sheet with the release sheet, the adhesive layer is completely cut, and the release sheet is formed with at least a portion left,
The alignment mark is formed on the surface without the adhesive layer of the release sheet,
The adhesive sheet with a release sheet is characterized in that an unnecessary part of the adhesive layer is removed with a predetermined shape of cut formed in the adhesive layer as a boundary.

According to a third aspect of the present invention, an adhesive layer having a predetermined shape is bonded to a metal plate having a predetermined shape to be attached to the semiconductor element mounting substrate, and the metal plate is further attached to the semiconductor element mounting substrate via the adhesive layer. A metal plate laminating device for laminating
A first transport mechanism for transporting the adhesive sheet with a release sheet in which the adhesive layer of the predetermined shape is formed on a side of a long tape-like release sheet;
A first metal plate holding mechanism for holding the metal plate of the predetermined shape;
With an alignment mark formed on the adhesive sheet with the release sheet, an alignment mechanism that aligns the metal plate and the adhesive layer having a predetermined shape,
Adhesion is achieved by sandwiching the adhesive sheet with the release sheet between the adhesive sheet with the release sheet and the metal plate that is disposed on the surface without the adhesive layer and held by the first metal plate holding mechanism. A laminating roller for laminating the agent layer and the metal plate;
A laminating roller driving mechanism for moving the laminating roller at a predetermined speed;
A first pressure mechanism for pressure bonding the bonded metal plate and the adhesive sheet with the release sheet;
A second metal plate holding mechanism for holding the metal plate to which the adhesive layer is bonded;
A peeling mechanism for peeling the adhesive layer and the peeling tape bonded to the metal plate;
A second transport mechanism for transporting the metal plate to which the adhesive layer is bonded to a predetermined position on the semiconductor element mounting substrate;
A second pressurizing mechanism for pressurizing and bonding the metal plate to which the adhesive layer is bonded to a predetermined position on the semiconductor element mounting substrate;
A metal plate laminating apparatus characterized by comprising:

  The invention according to claim 4 is the bonding apparatus according to claim 3, further comprising a cooling means for cooling the metal plate after pressure bonding by the first pressure mechanism. .

According to a fifth aspect of the invention, an adhesive layer having a predetermined shape is bonded to a metal plate having a predetermined shape to be attached to a semiconductor element mounting substrate, and the metal plate is further attached to the semiconductor element mounting substrate via the adhesive layer. A metal plate laminating method for laminating
A first transporting stage for transporting the adhesive sheet with a release sheet in which the adhesive layer of the predetermined shape is formed on a side of a long tape-like release sheet;
A first metal plate holding step of holding the metal plate of the predetermined shape by a first metal plate holding mechanism;
With the alignment mark formed on the adhesive sheet with the release sheet, an alignment step of aligning the metal plate and the adhesive layer having a predetermined shape,
An adhesive sheet with a release sheet is sandwiched between a laminating roller disposed on the side of the adhesive sheet with the release sheet that does not have an adhesive layer and a metal plate held by the first metal plate holding mechanism. By sticking, a bonding step of bonding the adhesive layer and the metal plate,
A laminating roller driving stage for moving the laminating roller at a predetermined speed; and
A first pressurizing step of press-bonding the bonded metal plate and the adhesive sheet with release sheet by a first pressurizing mechanism;
A second metal plate holding step of holding the metal plate to which the adhesive layer is bonded by a second metal plate holding mechanism;
A peeling step for peeling the adhesive layer and the peeling tape bonded to the metal plate,
A second transport stage for transporting the metal plate to which the adhesive layer is bonded to a predetermined position on the semiconductor element mounting substrate;
A second pressurizing step of pressurizing and bonding the metal plate on which the adhesive layer is bonded to a predetermined position on the semiconductor element mounting substrate;
A metal plate laminating method characterized by comprising:

  The invention according to claim 6 is the bonding method according to claim 5, further comprising cooling means for cooling the metal plate after pressure bonding by the first pressure mechanism. It is.

  According to the adhesive sheet with a release sheet according to claim 1 or 2, it is possible to replace the adhesive layer with a predetermined shape in advance with an inexpensive Thomson blade or the like, so that an expensive die set is not required, and a variety of products are produced in small quantities. The initial cost of the product can be reduced, and the setup time required for changing the die set can be greatly shortened.

  In addition, by providing an alignment mark on the adhesive sheet with a release sheet, it is possible to increase the bonding position accuracy of the adhesive layer and stiffener of a predetermined shape to ± 0.1 mm.

  Moreover, since the release sheet of the adhesive sheet with the release sheet according to claims 1 and 2 is a series of release sheets, peeling of the adhesive layer and the release sheet, which is a problem in a general pre-attachment method and a post-attachment method, is performed. This can be performed stably, and the occurrence of device troubles can be suppressed. Moreover, since it is not necessary to peel the peeling tape which carried out the predetermined shape with the adhesive tape conventionally, and an adhesive tape is not required, a cost merit is also high. Moreover, generation | occurrence | production of the adhesion foreign material can also be suppressed.

  By using the metal sheet laminating apparatus and the metal sheet laminating method according to claims 3 to 5 using the adhesive sheet with a release sheet according to claim 1 or 2, air bubbles between the stiffener and the adhesive layer are eliminated. A high quality product can be obtained.

  The metal plate bonding apparatus according to claim 4 or the metal plate bonding method according to claim 6 is particularly effective when the adhesive used for the adhesive layer is thermosetting.

  A thermosetting adhesive generally has a high tackiness (adhesiveness) at a high temperature, and is often bonded together with an object to be bonded while being heated and pressurized. However, the tackiness obtained in a state where the temperature is increased may increase not only the object to be bonded but also the adhesion with the release sheet. In this case, there arises a problem that the peelability is deteriorated, which causes a device trouble.

  Therefore, according to the metal plate bonding apparatus of claim 4 or the metal plate bonding method of claim 6, the tackiness of the thermosetting adhesive is lowered by lowering the temperature of the metal plate and the adhesive layer. Therefore, the release sheet can be stably peeled off.

  The stiffener adhesive bonding method, tape, and apparatus of the present invention will be described below in detail along the embodiments with reference to the drawings.

  FIG. 1 is an explanatory diagram of a conventional pasting method, and FIG. 2 is an explanatory diagram of a later pasting method that is also a conventional technology. 3A is a side sectional view of the adhesive sheet with a release sheet of the present invention, and FIG. FIG. 4 is an example of the stiffener adhesive bonding apparatus of the present invention.

  First, FIG. 3 illustrates an example of an adhesive sheet with a release sheet of the present invention and an example of a manufacturing method thereof.

  As shown in FIG. 3A, the Thomson blade 8 is pressed from the adhesive layer 1 side to the adhesive sheet with the release sheet including at least the adhesive layer 1 and the release sheet 2. The tape is half cut by the Thomson blade 8. Here, the half-cut means that the material is not punched out completely in the thickness direction, but is in a state where a cut is formed by position control of the Thomson blade 8 in the thickness direction. In the case shown in FIG. 3, the adhesive layer 1 is cut in a predetermined shape, but the release sheet 2 is not completely cut in the thickness direction.

  In general, Thomson blades are available at a price about 1/20 of a die set. In addition, since the device for setting and operating the device does not require large thrust and rigidity, the Thomson blade outline punching device can be configured at a lower cost than the die set punching device.

  At this time, in order to prevent the adhesive layer 6 from protruding from the periphery of the stiffener later, the outer shape of the adhesive layer 6 is slightly smaller than the outer shape of the stiffener to be bonded. It should just be. (If the stiffener has a frame shape, the adhesive layer 6 has a smaller outer circumference and a wider inner circumference than the stiffener, and the adhesive layer 6 is placed inside the stiffener when the stiffener and the adhesive layer 6 are overlapped. It only has to be possible.)

  Further, in order to guarantee where the adhesive layer 6 having a predetermined shape is, by forming the alignment mark 10 on the release sheet 2 by various marking methods at the time of half-cutting by the Thomson blade 8, At the time of pasting with a subsequent stiffener, the pasting accuracy can be within ± 0.1 mm.

  As a method for forming the alignment mark 10 on the release sheet 2, various marking methods such as punching, using an ink jet marker or stamp marker, or using a laser marker can be used. In the case of punching, an inexpensive general-purpose die set may be attached in the vicinity of the Thomson blade 8. In the case of inkjet markers, stamp markers, laser markers, etc., these marker devices are arranged on the side of the release sheet, that is, the side facing the Thomson blade 8, and the mark is placed on the surface of the release sheet 2 on the side without the adhesive layer. Just write it.

  Next, the adhesive layer 9 other than the predetermined region is removed, and the adhesive layer 6 is left on the release sheet 2. The removal method is not limited, but, for example, the adhesive layer 9 is held from the upper surface with a suction pad, a porous chuck, an electrostatic chuck or the like, and is peeled off from the release sheet 2 to have a predetermined shape. The adhesive layer 6 can be left on the release sheet 2.

  Next, an example of the stiffener adhesive bonding apparatus of this invention is shown in FIG.

  First, the adhesive sheet with a release sheet that leaves the adhesive layer 6 having a predetermined shape on the release sheet 2 is set and unwound on the unwinding unit 101, conveyed, and wound up by the winding unit 102. ing. Thereby, the release sheet 2 with the adhesive layer 6 placed thereon is conveyed at a predetermined pitch to each part (described later) of the stiffener adhesive bonding apparatus of the present invention, and the stiffener 5 and the adhesive layer 6 are bonded and bonded. The agent layer 6 and the release sheet 2 are sequentially peeled off, and finally only the release sheet 2 is wound up by the winding unit 102.

  A plurality of stiffeners 5 are stored in the stiffener stocker 601, and the stiffener adsorption transfer pressure unit (bonding unit) 202 picks up the stiffeners 5 one by one. When the adhesive layer 6 having a predetermined shape is thermosetting, the stiffener adsorption transfer pressurizing unit (bonding unit) 202 may heat the stiffener 5 during the adsorption.

  The stiffener adsorption transfer pressurizing unit (bonding unit) 202 includes an adsorption holding unit that adsorbs and holds the stiffener 5, and the adsorption holding unit in the XY direction parallel to the conveyance surface of the release sheet 2 and the vertical Z direction. It has movable moving means. Further, as described above, when the stiffener 5 needs to be heated, a stiffener heating means may be provided.

  Next, the alignment mark 10 on the peeling tape 2 is read by the alignment camera 401, and the peeling tape 2 is conveyed to a predetermined position.

  Further, the position of the stiffener adsorption transfer pressurizing unit (bonding unit) 202 is corrected by looking at the position of the alignment mark 10. Thereby, the pasting accuracy of the stiffener 5 and the adhesive layer 6 having a predetermined shape can be within ± 0.1 mm.

  Next, in a state where pressure is applied from the stiffener adsorption transfer pressurizing unit (bonding unit) 202 side on the roller 12, the roller 12 is operated to convey the peeling tape 2 and form a predetermined shape with the stiffener 5 Adhesive layer 6 is bonded. At this time, the defoaming effect can be enhanced by bonding the adhesive layer 6 to the stiffener 5 in an angled state by the roller 12. At this time, the stiffener adsorption transfer pressurizing unit (bonding unit) 202 moves in synchronization with the conveyance of the release sheet 2.

  When the bonding is completed, the stiffener adsorption transfer pressurizing unit (bonding unit) 202 stops the adsorption of the stiffener 5, so that the stiffener 5 is placed on the release sheet 2 via the adhesive layer 6 and processed next. It is conveyed to the part. When the adhesive layer 6 is thermosetting, the temperature of the stiffener 5 may be lowered by the cooling mechanism 301 during this conveyance. The stiffener adsorption transfer pressurizing unit (bonding unit) 202 returns to the vicinity of the stiffener stocker 601, takes out the next stiffener 5 from the stiffener stocker 601, and repeats the above-described operation.

  Next, in a state where the stiffener 5 and the adhesive layer 6 having a predetermined shape are bonded together, the stiffener 5 is conveyed to the lower portion of the stiffener adsorption transfer pressure unit (for peeling) 203 to hold the stiffener 5 by suction. The stiffener adsorption transfer pressurizing unit (for peeling) 203 is similar to the stiffener adsorption transfer pressurizing unit (bonding unit) 202, and an adsorption holding unit for adsorbing and holding the stiffener 5, and this adsorption holding unit as the release sheet 2 It has moving means that can move in the XY direction parallel to the transport surface and in the vertical Z direction.

  A release sheet peeling unit 204 is disposed at a position on the opposite side of the release sheet 2 of the stiffener adsorption transfer pressurizing unit (for peeling) 203, and the stiffener 5 has been conveyed to this position. Initially, the stiffener 5, the adhesive layer 6, and the release sheet 2 are sandwiched between the stiffener adsorption transfer pressure unit (for release) 203 and the release sheet release unit 204.

  From such a state, the release sheet peeling unit 204 is moved in the direction opposite to the conveyance direction of the release sheet 2 while the stiffener suction transfer pressure unit (for release) 203 holds the stiffener 5 by suction. The release sheet peeling portion 204 has a substantially triangular prism shape whose downstream thickness in the conveyance direction is smaller than that of the upstream side, and the release sheet 2 is peeled from the adhesive layer 6 along the surface of the release sheet peeling portion 204 and wound. It is wound around the take-up portion 102. In this way, the adhesive 6 having a predetermined shape and the release tape 2 can be stably peeled off.

  Here, the stiffener adsorption transfer pressurizing unit (for peeling) 203 is in a state of adsorbing and holding the stiffener 5 and the adhesive layer 6 having a predetermined shape, and thus the substrate stage 501 as it is. It can be bonded to the substrate 11 on top.

  Thereafter, the stiffener adsorption transfer pressure unit (for peeling) 203 and the release sheet peeling unit 204 are returned to their original positions, and the operation of transporting the release sheet 2 is repeated, so that the stiffener 5 and the predetermined shape are continuously formed. It is possible to perform an operation in which a material bonded to the adhesive layer 6 is manufactured and is bonded to the substrate 11.

As described above, it is possible to manufacture a substrate with a stiffener that is highly cost-effective especially in a variety of products and a small amount of production without using a die set, and it is possible to stably peel the release sheet. It is possible to provide a stiffener adhesive laminating method, a tape, and a device that are difficult to entrain air bubbles therebetween.
In addition, since the adhesive tape is not used when the release sheet is peeled off, cost merit can be increased, and the sticking foreign matter to the product by the adhesive tape can be eliminated, thereby increasing the product yield.

Explanatory drawing of the conventional pasting method Explanatory drawing of the conventional pasting method The (a) sectional side view of the adhesive sheet with a peeling sheet which formed the adhesive bond layer of the predetermined shape on the peeling sheet, (b) Top view. The schematic diagram which shows one Embodiment of the stiffener bonding apparatus of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Adhesive layer 2 ... Release sheet 3 ... Metal plate 4 ... Die set 5 ... Metal plate (stiffener) of predetermined shape
6 ... Adhesive layer 7 having a predetermined shape ... Release sheet 8 having a predetermined shape ... Thomson blade 9 ... Adhesive layer 10 other than the predetermined shape ... Alignment mark 11 ... Substrate 12 ... Roller 101 ... Unwinding portion 102 ... Winding unit 201... Roller driving actuator 202... Stiffener adsorption transfer pressure unit (rolling unit)
203 ... Stiffener adsorption transfer pressure part (peeling part)
204 ... Release sheet peeling part 301 ... Cooling mechanism 401 ... Alignment camera 501 ... Substrate stage 601 ... Stiffener stocker

Claims (6)

In the adhesive sheet with a release sheet in which an adhesive layer is formed in a predetermined region on one side of the long tape-like release sheet,
The adhesive sheet with the release sheet has a predetermined shape, cuts and alignment marks formed in predetermined locations,
The cut is in the thickness direction of the adhesive sheet with the release sheet, the adhesive layer is completely cut, and the release sheet is formed with at least a portion left,
The alignment mark is formed in a state in which both the adhesive layer and the release sheet of the adhesive sheet with the release sheet are completely cut out,
An adhesive sheet with a release sheet, wherein an unnecessary part of the adhesive layer is removed with a notch of a predetermined shape formed in the adhesive layer as a boundary. In the adhesive sheet with a release sheet in which an adhesive layer is formed in a predetermined region on one side of the long tape-like release sheet,
The adhesive sheet with the release sheet has a predetermined shape, cuts and alignment marks formed in predetermined locations,
The cut is in the thickness direction of the adhesive sheet with the release sheet, the adhesive layer is completely cut, and the release sheet is formed with at least a portion left,
The alignment mark is formed on the surface without the adhesive layer of the release sheet,
An adhesive sheet with a release sheet, wherein an unnecessary part of the adhesive layer is removed with a notch of a predetermined shape formed in the adhesive layer as a boundary. Metal plate laminating apparatus for bonding a predetermined shape adhesive layer to a predetermined shape metal plate for mounting on a semiconductor element mounting substrate, and further bonding the metal plate to the semiconductor element mounting substrate via the adhesive layer Because
A first transport mechanism for transporting the adhesive sheet with a release sheet in which the adhesive layer of the predetermined shape is formed on a side of a long tape-like release sheet;
A first metal plate holding mechanism for holding the metal plate of the predetermined shape;
With an alignment mark formed on the adhesive sheet with the release sheet, an alignment mechanism that aligns the metal plate and the adhesive layer having a predetermined shape,
Adhesion is achieved by sandwiching the adhesive sheet with the release sheet between the adhesive sheet with the release sheet and the metal plate that is disposed on the surface without the adhesive layer and held by the first metal plate holding mechanism. A laminating roller for laminating the agent layer and the metal plate;
A laminating roller driving mechanism for moving the laminating roller at a predetermined speed;
A first pressure mechanism for pressure bonding the bonded metal plate and the adhesive sheet with the release sheet;
A second metal plate holding mechanism for holding the metal plate to which the adhesive layer is bonded;
A peeling mechanism for peeling the adhesive layer and the peeling tape bonded to the metal plate;
A second transport mechanism for transporting the metal plate to which the adhesive layer is bonded to a predetermined position on the semiconductor element mounting substrate;
A second pressurizing mechanism for pressurizing and bonding the metal plate to which the adhesive layer is bonded to a predetermined position on the semiconductor element mounting substrate;
The metal plate bonding apparatus characterized by comprising.   The bonding apparatus according to claim 3, further comprising a cooling unit that cools the metal plate after pressure bonding by the first pressure mechanism. A metal plate laminating method in which an adhesive layer having a predetermined shape is bonded to a metal plate having a predetermined shape to be attached to a substrate for mounting a semiconductor element, and further, the metal plate is bonded to the substrate for mounting a semiconductor element via the adhesive layer. Because
A first transporting stage for transporting the adhesive sheet with a release sheet in which the adhesive layer of the predetermined shape is formed on a side of a long tape-like release sheet;
A first metal plate holding step of holding the metal plate of the predetermined shape by a first metal plate holding mechanism;
With the alignment mark formed on the adhesive sheet with the release sheet, an alignment step of aligning the metal plate and the adhesive layer having a predetermined shape,
An adhesive sheet with a release sheet is sandwiched between a laminating roller disposed on the side of the adhesive sheet with the release sheet that does not have an adhesive layer and a metal plate held by the first metal plate holding mechanism. By sticking, a bonding step of bonding the adhesive layer and the metal plate,
A laminating roller driving stage for moving the laminating roller at a predetermined speed; and
A first pressurizing step of press-bonding the bonded metal plate and the adhesive sheet with release sheet by a first pressurizing mechanism;
A second metal plate holding step of holding the metal plate to which the adhesive layer is bonded by a second metal plate holding mechanism;
A peeling step for peeling the adhesive layer and the peeling tape bonded to the metal plate,
A second transport stage for transporting the metal plate to which the adhesive layer is bonded to a predetermined position on the semiconductor element mounting substrate;
A second pressurizing step of pressurizing and bonding the metal plate on which the adhesive layer is bonded to a predetermined position on the semiconductor element mounting substrate;
The metal plate bonding method characterized by comprising.   The bonding method according to claim 5, further comprising a cooling unit that cools the metal plate after pressure bonding by the first pressure mechanism.

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