JP4686860B2 - Manufacturing method of flexible printed wiring board - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a flexible printed wiring board having flexibility, such as a TAB (tape automated bonding) wiring board incorporated in an electronic device such as a semiconductor packaging such as an IC card terminal and a portable information terminal, and the like. It relates to a manufacturing apparatus.
[0002]
[Prior art]
In the conventional method of manufacturing a flexible printed wiring board, an adhesive layer is applied to an insulating tape substrate such as a polyimide tape having flexibility, and openings such as device holes, through holes and sprocket holes are provided for electrical conduction. 3 layers structure by punching the mold to form the part and then thermocompression bonding copper foil on the adhesive layer surface with a heating roller (hereinafter, thermocompression bonding of the copper foil with the heating roller is called laminate) A copper foil-attached tape substrate having the following flexibility is formed.
[0003]
Next, a predetermined insulating circuit pattern is formed on the copper foil, this is used as an etching resist, and the exposed portion of the copper foil is removed by a wet etching process. A conductor is formed.
[0004]
In recent years, with the increase in the frequency of semiconductor elements and the miniaturization and high integration of electronic devices, the density of flexible printed wiring boards has increased, and the demand for hole position accuracy has become stricter.
[0005]
However, in the conventional flexible printed wiring board, although the hole is punched by die punching, the hole is made with the positional accuracy of the die. The positional deviation of the opening due to the difference in thermal expansion of each material of the polyimide tape occurred.
[0006]
In recent years, the tape thickness of this polyimide tape tends to be reduced, and the difference in thermal expansion among the copper foil, the adhesive layer, and the polyimide tape has become more prominent.
[0007]
In general, in copper foil lamination, a polyimide tape with an adhesive layer is preheated, and then the copper foil and the polyimide tape are bonded by thermocompression bonding with a heating roller.
[0008]
However, by preheating the polyimide tape with the adhesive layer, the polyimide tape is stretched due to the difference in linear expansion coefficient between the adhesive layer and the polyimide tape, and is further laminated with the copper foil and the heating roller. In addition to the difference in the linear expansion coefficient between the copper foil and the polyimide tape, the linear expansion coefficient of the adhesive layer is greatly involved. Moreover, since an epoxy resin having a large linear expansion coefficient is mainly used as a general-purpose adhesive layer, the positional deviation of the opening portion occurs at the time of copper foil lamination, and it has become impossible to ignore even a high-density wiring board.
[0009]
On the other hand, as a means of avoiding the positional deviation of the opening portion due to the copper foil laminate, a tape substrate with a copper foil bonded with a polyimide tape and a copper foil is prepared first, and then laser processing or wet etching is performed. There is a method of perforating a polyimide tape so as not to damage the copper foil.
[0010]
As laser processing of this polyimide tape, excimer laser or carbon dioxide laser can be used. Excimer laser is a process with low processing speed but high processing cost and low mass productivity, although it has excellent processing accuracy. Further, the carbon dioxide laser has a relatively high processing speed and the processing cost is lower than that of the excimer laser, but the processing accuracy is inferior.
[0011]
As described above, die punching is a punching method excellent in both mass productivity and processing accuracy with respect to laser processing, and die punching is generally widely used as a punching method.
[0012]
However, as described above, it is necessary to perform copper foil laminating after punching for die punching, and the opening portion due to the difference in thermal expansion of each material of the copper foil, the adhesive layer, and the polyimide tape. Misalignment occurred, which was a problem for flexible printed wiring boards.
[0013]
[Problems to be solved by the invention]
As described above, in the conventional flexible printed wiring board, drilling is performed by the die punching method which is excellent in both mass productivity and processing accuracy, and it is possible to open the hole with the accuracy of the mold position. Then, due to the copper foil laminating by the heating roller after that, the positional deviation of the hole portion due to the difference in the linear expansion coefficient among the materials of the copper foil, the adhesive layer and the polyimide tape occurred. In particular, since an epoxy resin having a large linear expansion coefficient is mainly used as a general-purpose adhesive layer, not only the difference in linear expansion coefficient between the copper foil and the polyimide tape, but also the linear expansion coefficient of the adhesive layer is greatly involved, When the copper foil was laminated, a very large misalignment of the apertures occurred.
[0014]
From the above, the position accuracy of the opening corresponding to the progress of higher density of the flexible printed wiring board cannot be obtained, which is a problem. Therefore, a method for manufacturing a flexible printed wiring board that suppresses the positional deviation of the opening portion during copper foil lamination in order to enable high accuracy of the opening portion position corresponding to the progress of higher density of the flexible printed wiring board. Was requested.
[0015]
In view of the above problems, the present invention provides a method for manufacturing a flexible printed wiring board and a manufacturing apparatus used therefor, which can increase the accuracy of the position of the opening corresponding to the progress of higher density of the flexible printed wiring board. The purpose is to do.
[0016]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the method for producing a flexible printed wiring board according to the present invention comprises an insulating tape with an adhesive layer having a hole by punching a flexible insulating tape substrate with an adhesive layer. A hole forming step for producing a substrate, a laminating step for thermocompression bonding of the insulating tape substrate with an adhesive layer having the aperture and the copper foil, and an etching resist formed on the copper foil to expose the copper foil A pattern etching step of etching away a portion , wherein the laminating step causes the adhesive layer surface of the insulating tape with an adhesive layer having the opening portion and the mat surface of the copper foil to face each other, and the copper foil And an insulating tape with an adhesive layer having an opening are disposed opposite to the first heating and pressing roller disposed on the copper foil side and having a first heating temperature and the first heating and pressing roller. The first pressure b A first laminating step for producing a temporarily fixed copper foil-attached insulating tape substrate by performing heating and pressurization by passing between and a copper foil, and the temporarily fixed copper foil-containing insulating tape substrate A second heating and pressing roller disposed on the copper foil side and having a second heating temperature higher than the first heating temperature and a second pressing force disposed opposite to the second heating and pressing roller A second process for producing an insulative tape substrate with copper foil, which is finally bonded, by applying heat and pressure by passing between the rollers and thermocompression-bonding the temporarily fixed insulating tape substrate with copper foil. And the pattern etching step is to form the etching resist on the copper foil of the copper tape-attached insulating tape substrate with copper foil and remove the exposed portion of the copper foil by etching. The opening portion is And it forms a copper pattern covering.
[0017]
By this process, the first thermocompression bonding is performed by thermocompression bonding at a low temperature, so that the thermal expansion difference between each material of the copper foil, the adhesive, and the insulating tape substrate is temporarily reduced, and the insulating tape substrate is bonded. After temporarily fixing the opened hole position, the main pressure bonding is performed under the high-temperature thermocompression condition in the second and subsequent thermocompression bonding, so the difference in thermal expansion between each material of the copper foil, the adhesive, and the insulating tape substrate It is possible to prevent the positional deviation of the resulting opening portion.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
According to a first aspect of the present invention, there is provided a method for manufacturing a flexible printed wiring board, wherein the insulating tape substrate with an adhesive layer having a hole is formed by punching the insulating tape substrate with an adhesive layer having flexibility. A hole forming step for forming the adhesive layer, a laminating step for thermocompression bonding of the insulating tape substrate with an adhesive layer having the opening and the copper foil, and an exposed portion of the copper foil by forming an etching resist on the copper foil A pattern etching step of etching and removing , wherein the laminating step makes the adhesive layer surface of the insulating tape with an adhesive layer having the opening portion and the mat surface of the copper foil face each other, and The insulating tape with an adhesive layer having the opening portion is opposed to the first heating and pressing roller disposed on the copper foil side and having the first heating temperature and the first heating and pressing roller. With the arranged first pressure roller A first laminating step for producing a temporarily fixed copper foil-attached insulating tape substrate by performing heating and pressurizing by passing the copper foil, and the copper foil side of the temporarily fixed copper foil-containing insulating tape substrate Between a second heating and pressing roller having a second heating temperature higher than the first heating temperature and a second pressing roller arranged opposite to the second heating and pressing roller A second laminating step for producing a pressure-bonded insulating tape substrate with copper foil by thermocompressing the temporarily fixed state of the insulating tape substrate with copper foil, The pattern etching step is performed by forming the etching resist on the copper foil of the copper-bonded insulating tape substrate with copper foil and removing the exposed portion of the copper foil by etching. Cover the hole And characterized in that to form a pattern, this process, in the first thermocompression bonding by thermocompression bonding at a low temperature, the thermal expansion difference between the materials of the copper foil and the adhesive layer and the insulating tape substrate Temporary pressure bonding is performed in an extremely small state, and the position of the opening formed in the insulating tape substrate with copper foil is temporarily fixed, so that the second and subsequent thermocompression bonding can be performed under high temperature thermocompression bonding conditions. Since it has an effect | action, there is little position shift with a copper pattern and an opening part, and the flexible printed wiring board with the high hole position accuracy can be manufactured .
[0022]
Method of manufacturing a flexible printed wiring board according to claim 2 of the present invention is the invention of claim 1 wherein the heating temperature of the first heating and pressing roller, not more than 80 ° C. at 50 ° C. or higher, the first The heating temperature of the heating and pressing roller 2 is 100 ° C. or more and 140 ° C. or less. By this process, the thermocompression bonding by the first heating and pressing roller is 50 ° C. or more and 80 ° C. By thermocompression bonding at a low temperature of the following, temporary bonding is performed with very little difference in thermal expansion between the copper foil, the adhesive layer, and the insulating tape substrate, and the opening portion formed in the insulating tape substrate In a state where the position is temporarily fixed, it has an effect that the main press-bonding can be performed under a high-temperature thermo-compression condition of 100 ° C. or more and 140 ° C. or less by thermo-compression using the second heat and pressure roller .
[0028]
Hereinafter, an embodiment of the present invention will be described with reference to FIGS. In these drawings, the same members are denoted by the same reference numerals, and redundant description is omitted. In addition, the numerical values and the like shown in the embodiments are examples that can be variously selected, and are not limited thereto.
[0029]
(Embodiment 1)
A method for manufacturing a flexible printed wiring board according to the embodiment of the present invention will be described below. FIG. 1 is a cross-sectional view of a principal part showing a hole drilling process of a method for manufacturing a flexible printed wiring board in an embodiment of the present invention. In FIG. 1, 1 is a polyimide tape, 2 is an epoxy adhesive, 3 is an aperture, and 4 is a polyimide tape with an adhesive layer.
[0030]
First, as shown in FIG. 1A, a polyimide tape 1 having a thickness of 50 μm can be used as a flexible insulating tape substrate. A polyimide tape 1 having a thickness of 12 μm is formed on one surface of the polyimide tape 1. An epoxy adhesive layer 2 is formed.
[0031]
Next, as shown in FIG. 1 (b), the polyimide tape 1 having the epoxy adhesive layer 2 on the surface is formed with an opening 3 such as a through hole or a sprocket hole by die punching. A polyimide tape 4 with an adhesive layer having a hole is produced.
[0032]
FIG. 2 is a cross-sectional view of the main part showing the laminating process of the method for producing a flexible printed wiring board in one embodiment of the present invention. In FIG. 2, 5 is a copper foil having a thickness of 18 μm, 6 is a first heating element disposed on the copper foil 5 side in order to temporarily press-bond the adhesive-attached polyimide tape 4 with an opening and the copper foil 5. The pressure roller 7 is a first pressure roller that is disposed to face the first heating and pressure roller 6 and pressurizes from the side of the polyimide tape 4 with an adhesive layer having an opening. Reference numeral 8 denotes a polyimide tape substrate with a copper foil in a temporarily fixed state in which a polyimide tape 4 with an adhesive layer having an opening and a copper foil 5 are temporarily bonded. Reference numeral 9 denotes a second heating and pressing roller disposed on the copper foil 5 side for main press-bonding of the polyimide foil substrate with copper foil, and reference numeral 10 is disposed so as to face the second heating and pressing roller 9. It is the 2nd pressurizing roller for pressurizing from the polyimide tape board | substrate 8 with a copper foil of a fixed state. Reference numeral 11 denotes a polyimide tape substrate with copper foil after the main pressure bonding.
[0033]
First, as shown in FIG. 2 (a), the adhesive layer surface of the polyimide tape 4 with an adhesive layer having an aperture and the mat surface of the copper foil 5 are opposed to each other, and the copper foil 5 and the adhesive having the aperture are bonded. The polyimide tape with layer 4 is heated and pressed by passing between the first heating and pressing roller 6 and the first pressing roller 7 to produce a temporarily fixed polyimide tape substrate 8 with copper foil. .
[0034]
Here, the heating temperature of the first heating and pressing roller 6 disposed on the copper foil 5 side is set to a low temperature of 50 ° C., and heating is performed from the copper foil 5 side.
[0035]
Simultaneously with the heating from the copper foil 5 side, the copper foil 5 is formed by the first pressure roller 7 and the first heating and pressure roller 6 disposed on the side of the polyimide tape 4 with an adhesive layer having an opening. The polyimide tape 4 with an adhesive layer having an opening is pressed at 0.4 MPa.
[0036]
As described above, in the first thermocompression bonding, the thermocompression bonding is performed at a low temperature so that the materials of the copper foil 5, the epoxy adhesive layer 2, and the polyimide tape 1 are temporarily bonded and bonded in a state where the difference in thermal expansion is extremely small. It is possible to temporarily fix the position of the opening 3 formed in the layered polyimide tape 4.
[0037]
In particular, since an epoxy resin having a larger linear expansion coefficient than copper foil or polyimide tape is widely used as an adhesive layer, pre-heating the polyimide tape 4 with an adhesive layer before the first thermocompression bonding, When heating was performed from the side of the polyimide tape 4 with an adhesive layer during the thermocompression bonding, a large difference in thermal expansion occurred between the epoxy adhesive layer 2 and the polyimide tape 1, and an extremely large hole misalignment occurred.
[0038]
In the present invention, the hole 3 formed in the polyimide tape 4 with the adhesive layer is formed of the epoxy adhesive layer 2 and the polyimide tape 1 by applying as little heat as possible to the polyimide tape 4 with the adhesive layer having the aperture. There is no displacement of the opening due to the difference in thermal expansion, and the first thermocompression bonding with the copper foil 5 is performed in a state where the position of the opening immediately after the die punching process is maintained. The position of the opening 3 formed in 4 can be temporarily fixed with high accuracy.
[0039]
Here, as a result of investigation by the inventors of the present invention on the heating temperature of the first thermocompression bonding and the positional deviation of the opening portion, when the heating temperature of the first thermocompression bonding is 40 ° C., the thermocompression bonding condition is too low. As a result, there was a defect that the adhesive layer was not sticky and could not be temporarily fixed to the copper foil. In addition, when the heating temperature of the first thermocompression bonding was 90 ° C., the thermocompression bonding conditions were too high, and the positional deviation of the aperture due to the difference in thermal expansion occurred. From the above, it has been found that the heating temperature of the first thermocompression bonding that can be temporarily fixed in a state where the positional deviation of the opening portion is small is suitably 50 ° C. or higher and 80 ° C. or lower.
[0040]
Next, as shown in FIG. 2 (b), the polyimide tape substrate 8 with copper foil in the temporarily fixed state is heated by passing between the second heating and pressing roller 9 and the second pressing roller 10. The polyimide tape substrate 11 with a copper foil after the main pressure bonding is produced by applying pressure.
[0041]
Here, the second heating and pressing roller 9 disposed on the copper foil side of the temporarily fixed polyimide tape substrate 8 with copper foil is set to a main press bonding temperature of 120 ° C. and a high pressure bonding temperature, and from the copper foil side. Heating.
[0042]
Simultaneously with the heating from the copper foil side, the polyimide tape substrate 8 with the copper foil temporarily fixed by the second pressure roller 10 and the second heat and pressure roller 9 arranged on the polyimide tape side becomes 0. Pressurized at 4 MPa.
[0043]
As described above, the second is thermocompression bonding at a high temperature, so that the temporarily fixed polyimide tape substrate 8 with copper foil is firmly main-bonded, and the opening 3 is still temporarily bonded after the main-bonding. The hole position accuracy can be maintained.
[0044]
Here, as a result of investigation by the inventors of the present invention on the heating temperature of the second thermocompression bonding and the positional deviation of the aperture, when the heating temperature of the second thermocompression bonding is 90 ° C., the thermocompression bonding condition is too low. As a result, the adhesive layer was weakly tacky, and a defect occurred in that it could not be firmly bonded with the copper foil. In addition, when the heating temperature of the second thermocompression bonding was 150 ° C., the thermocompression bonding conditions were too high, and the main pressure bonding could not be performed while maintaining the hole position accuracy during the temporary pressure bonding. From the above, it has been found that the heating temperature of the second thermocompression bonding that can be subjected to the main pressure bonding in a state where the positional deviation of the opening portion is small is suitably 100 ° C. or higher and 140 ° C. or lower.
[0045]
In this embodiment, an example in which two-stage thermocompression bonding is performed is shown, but thermocompression bonding may be performed in two or more stages.
[0046]
Furthermore, in the present embodiment, an example in which two-stage thermocompression bonding is performed with the same pressure is shown, but the hardness of the adhesive layer changes according to the heating temperature. By pressing with a pressure corresponding to the hardness, the matte surface of the copper foil can be pressed and cured more firmly in the adhesive layer.
[0047]
FIG. 3 is a cross-sectional view of a principal part showing a pattern etching process of the method for manufacturing a flexible printed wiring board in one embodiment of the present invention. In FIG. 3, 12 is a polyimide film substrate with a copper foil that has been permanently cured with an epoxy adhesive layer, 13 is an etching resist, 14 is a copper pattern, 15 is a plating film, and 16 is a flexible printed wiring board.
[0048]
First, as shown in FIG. 3A, the polyimide film substrate 11 with copper foil after the main pressure bonding is subjected to a heat treatment at 160 ° C. for 6 hours to fully cure the epoxy adhesive layer. A polyimide tape 12 is obtained. Next, an alignment-shaped etching resist 13 is formed on the surface of the copper foil of the polyimide tape 12 with the copper foil after the main curing by using a pattern forming technique such as a photolithography method.
[0049]
Thereafter, as shown in FIG. 3B, a copper pattern 14 is formed by etching away the copper foil portion not covered with the etching resist 13 with an iron chloride etching solution. Next, as shown in FIG. 3C, the etching resist 13 is dissolved and removed with an alkaline solution.
[0050]
Finally, as shown in FIG. 3D, a flexible printed wiring board 16 is produced by laminating a plating film 15 made of nickel and gold on the copper pattern 14.
[0051]
In the present invention, since the hole position accuracy of the hole portion 3 is high, there is little positional deviation between the copper pattern 14 and the hole portion 3, and a flexible printed wiring board having high hole position accuracy can be manufactured. .
[0052]
In the present embodiment, the polyimide tape having an epoxy adhesive layer formed on the surface is described as an example of the flexible insulating tape substrate with an adhesive layer. However, the epoxy adhesive and the polyimide tape are described. Is excellent in processing suitability and versatility, but in the present invention, in addition to the polyimide tape as the substrate, the insulating material having flexibility and flexibility used in conventionally known flexible printed wiring boards. A substrate can also be used. It goes without saying that other thermosetting adhesives can be used as the adhesive in addition to the epoxy adhesive.
[0053]
Further, the copper foil is superior in processing suitability and versatility, but as the metal foil, a metal foil used for a conventionally known flexible printed wiring board can be used in addition to the copper foil.
[0054]
(Embodiment 2)
An apparatus for manufacturing a flexible printed wiring board according to an embodiment of the present invention will be described below.
[0055]
The apparatus for producing a flexible printed wiring board according to the present invention is an apparatus for thermocompression bonding a flexible insulating tape substrate with an adhesive layer and a copper foil. FIG. 4 is an apparatus configuration diagram showing a flexible printed wiring board manufacturing apparatus according to an embodiment of the present invention.
[0056]
In FIG. 4, 17 is a preheating part, 18 is an unwinding reel for supplying the polyimide tape 4 with an adhesive layer having an opening, 19 is an unwinding reel for supplying the copper foil 5, and 20 is copper after the main pressure bonding. It is a take-up reel which winds up the polyimide tape 11 with foil.
[0057]
In the manufacturing apparatus of the present invention, as shown in FIG. 4, the first heating pressure roller 6 and the first pressure roller 7 in the first stage whose heating temperature and pressing force can be adjusted, A second heating and pressing roller 9 and a second pressing roller 10 in the second stage capable of adjusting the pressure are arranged along the moving direction of the polyimide tape 4 with adhesive layer and the copper foil 5.
[0058]
First, the first heating and pressure roller 6 and the first pressure roller 7 can adjust the heating temperature and pressure for temporary bonding under low temperature thermocompression bonding conditions. It is possible to perform temporary pressure bonding in a state where the difference in thermal expansion between the materials of the epoxy adhesive layer and the polyimide tape constituting the polyimide tape 4 with adhesive layer is extremely small.
[0059]
Further, the second heating and pressing roller 9 and the second pressing roller 10 can adjust the heating temperature and the pressurizing force for the main press bonding under the high temperature thermocompression bonding conditions. The tape substrate 8 is firmly pressure-bonded, and the hole portion can maintain the hole position accuracy during temporary pressure-bonding even after the pressure bonding.
[0060]
In addition, since the heating source is disposed on the side in contact with the copper foil 5 and can be heated only from the copper foil side, unnecessary heat is not applied to the polyimide tape 4 with an adhesive layer having an aperture, and the aperture is There is no misalignment of the opening due to the difference in thermal expansion between the epoxy adhesive layer constituting the polyimide tape 4 with adhesive layer and the polyimide tape, and the position of the hole immediately after the die punching is maintained. The first thermocompression bonding with the foil 5 is performed, and the position of the opening formed in the polyimide tape 4 with the adhesive layer can be temporarily fixed with high accuracy.
[0061]
Furthermore, the copper foil in the 1st heat pressurizing roller 6 is arrange | positioned by arrange | positioning the preheating part 17 which preheats the copper foil 5 before the 1st heat pressurizing roller 6 and the 1st pressurizing roller 7. Since the heating time of 5 can be shortened, the laminating speed can be increased.
[0062]
【The invention's effect】
By using the method for producing a flexible printed wiring board of the present invention, it is possible to produce a flexible printed wiring board having a highly accurate aperture.
[0063]
Moreover, the manufacturing apparatus of the flexible printed wiring board of this invention enables preparation of the flexible printed wiring board which has a highly accurate opening part.
[0064]
Therefore, it is possible to provide a manufacturing method of a flexible printed wiring board and a manufacturing apparatus used therefor, which can increase the accuracy of the position of the opening corresponding to the progress of higher density of the flexible printed wiring board.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a main part showing a hole drilling process of a flexible printed wiring board in an embodiment of the present invention. FIG. 2 is a cross-sectional view of a main part showing a laminating process of a flexible printed wiring board in an embodiment of the present invention. FIG. 3 is a cross-sectional view of an essential part showing a pattern etching process of a flexible printed wiring board according to an embodiment of the present invention. FIG. 4 is an apparatus configuration showing an apparatus for manufacturing a flexible printed wiring board according to an embodiment of the present invention. Figure [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Polyimide tape 2 Epoxy system adhesive layer 3 Opening part 4 Adhesive layer-attached polyimide tape 5 Copper foil 6 1st heating pressurization roller 7 1st pressurization roller 8 The polyimide tape board | substrate 9 with a copper foil of a temporarily fixed state 2nd Heating and pressure roller 10 Second pressure roller 11 Polyimide tape with copper foil 12 after main pressure bonding Polyimide tape with copper foil after main curing 13 Etching resist 14 Copper pattern 15 Plating film 16 Flexible printed wiring board 17 Preheating part 18 Rewind reel 19 Rewind reel 20 Take-up reel

Claims (2)

A hole machining process for manufacturing the adhesive layer with an insulating tape substrate having an opening portion by performing punching on the insulating tape substrate with the adhesive layer having flexibility, with the adhesive layer having the opening A laminating step of thermocompression bonding the insulating tape substrate and the copper foil, and a pattern etching step of forming an etching resist on the copper foil and etching away the exposed portion of the copper foil , the laminating step comprising: The adhesive layer surface of the insulating tape with an adhesive layer having an opening and the mat surface of the copper foil are opposed to each other, and the copper foil and the insulating tape with an adhesive layer having the aperture are formed on the copper Heating is performed by passing between a first heating and pressing roller disposed on the foil side and having a first heating temperature and a first pressing roller disposed opposite to the first heating and pressing roller. By pressing, with temporarily fixed copper foil A first laminating step for producing an edge tape substrate, and a second heating temperature higher than the first heating temperature and disposed on the copper foil side of the temporarily fixed copper foil-attached insulating tape substrate. The heat and pressure roller is passed between a second pressure roller disposed opposite to the second pressure roller and the second pressure roller, and the insulation with copper foil in the temporarily fixed state is performed. A second laminating step for producing a pressure-bonded insulating tape substrate with copper foil by thermocompression bonding of the adhesive tape substrate, and the pattern etching step is performed with the insulation with copper foil subjected to the main-pressure bonding. by sex tape forming said etching resist on the copper foil substrate to the exposed portion etch removal of the copper foil, the flexible printed wiring board and forming a copper pattern that covers the opening Production method. The heating temperature of the first heating and pressing roller is 50 ° C. or more and 80 ° C. or less, and the heating temperature of the second heating and pressing roller is 100 ° C. or more and 140 ° C. or less. The manufacturing method of the flexible printed wiring board of Claim 1 .

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