CN117015161B - Preparation process and equipment of high-Tg halogen-free copper-clad plate substrate - Google Patents
Preparation process and equipment of high-Tg halogen-free copper-clad plate substrate Download PDFInfo
- Publication number
- CN117015161B CN117015161B CN202311202125.8A CN202311202125A CN117015161B CN 117015161 B CN117015161 B CN 117015161B CN 202311202125 A CN202311202125 A CN 202311202125A CN 117015161 B CN117015161 B CN 117015161B
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- substrate
- copper foil
- conveyor belt
- frame
- halogen
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- 239000000758 substrate Substances 0.000 title claims abstract description 146
- 238000002360 preparation method Methods 0.000 title claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 103
- 239000011889 copper foil Substances 0.000 claims abstract description 100
- 238000010438 heat treatment Methods 0.000 claims abstract description 62
- 238000007731 hot pressing Methods 0.000 claims abstract description 36
- 238000005520 cutting process Methods 0.000 claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- 238000003825 pressing Methods 0.000 description 13
- 239000012790 adhesive layer Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 244000309464 bull Species 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 239000000155 melt Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a preparation process and equipment of a high Tg halogen-free copper-clad plate substrate, wherein a push rod pushes the substrate onto a first conveyor belt, and the first conveyor belt drives the substrate to move; the clamping jaw drives the copper foil to move and cover the substrate; the hot-pressing roller rotates and extrudes the copper foil, the conductive block is electrically connected with the heating block which is positioned at the lowest inside of the hot-pressing roller and the heating block which is to be moved to the lowest inside, the heating block at the lowest side releases heat, the bonding layer on the substrate is melted, the copper foil is attached to the substrate, and meanwhile, the heating block which is to be moved to the lowest side is preheated, so that subsequent heating work can be carried out; the first conveyor belt conveys the substrate with the copper foil to the second conveyor belt, and the cutting knife cuts off the redundant copper foil. According to the preparation process and the equipment for the high Tg halogen-free copper-clad plate substrate, the copper foil and the substrate can be well pressed by the rotating hot-pressing roller, the copper foil can be protected from being scratched, the conductive block is electrically connected with the heating block, only the lower part of the hot-pressing roller is heated, and energy can be saved.
Description
Technical Field
The invention relates to the technical field of copper-clad plate substrates, in particular to a preparation process and equipment of a high-Tg halogen-free copper-clad plate substrate.
Background
The copper-clad plate substrate is a core material for manufacturing a printed circuit board and consists of a base material film and copper foil attached to the base material film, and some base material films are also provided with adhesive layers for fixing the copper foil.
According to publication (bulletin) No. CN112895675A, publication (bulletin) No. 2021.06.04, a copper-clad plate production device and a copper-clad plate processing method are disclosed, the copper-clad plate production device comprises a pressing table and a pressing device, a pressing groove is formed in the upper end of the pressing table, the pressing device is arranged at the upper end of the pressing groove and comprises a first supporting arm, the first supporting arm is fixedly installed at the side end of the pressing table, a top plate is fixedly installed at the upper end of the first supporting arm, a rotating rod is inserted into the inner wall of the first supporting arm, a pressing wheel is fixedly installed at the inner side of the rotating rod, and a rotating shaft is fixedly installed at the side end of the rotating rod. The supporting arm inner wall grafting bull stick of the device, the bull stick has the effect of making things convenient for the anticlockwise pivoted of pinch roller, the inboard fixed mounting pinch roller of bull stick, the pinch roller sets up to cylindrically, the pinch roller has the effect of conveniently pressing the copper-clad plate, bull stick side fixed mounting pivot one, pressing platform side fixed mounting servo motor two, servo motor two output fixed connection pivot two, fixed connection driving belt between pivot one and the pivot two, servo motor two has the effect of rotating the pinch roller through driving belt, the recess is seted up to pressing platform inner wall, recess inner wall fixed mounting supports the riser, it has the effect of installation spacer sleeve to support the riser side fixed mounting spacer sleeve, the spacer sleeve has the effect of convenient erection bracing seat.
In the prior art including the above patent, when the copper-clad substrate is produced, the hot-pressing roller is required to be matched, the contact part of the copper foil and the substrate is heated, and the adhesive layer on the substrate is melted so as to fix the copper foil on the substrate, but most of the existing hot-pressing rollers are fixed, and when the copper foil is extruded, the copper foil is easy to rub with the copper foil to damage the copper foil on the substrate, and the rolling hot-pressing roller is required to heat the whole of the copper foil, so that more energy is required to be consumed.
Disclosure of Invention
The invention aims to provide a preparation process and equipment of a high-Tg halogen-free copper-clad plate substrate, and aims to solve the problem that a fixed hot-pressing roller scratches copper foil in the copper foil laminating process when the copper-clad plate is produced.
In order to achieve the above purpose, the invention provides a preparation process of a high Tg halogen-free copper-clad plate substrate, which comprises the following steps:
s1, pushing a substrate onto a first conveyor belt by a push rod, wherein the first conveyor belt drives the substrate to move;
s2, the clamping jaw drives the copper foil to move and cover the substrate;
s3, the hot-press roller rotates and extrudes the copper foil, the conductive block is electrically connected with the heating block which is positioned at the lowest part in the hot-press roller and the heating block which is to be moved to the lowest part, the heating block at the lowest part releases heat, the bonding layer on the substrate is melted, the copper foil is attached to the substrate, and meanwhile, the heating block which is to be moved to the lowest part is preheated, so that subsequent heating work can be carried out;
s4, the first conveyor belt conveys the substrate with the copper foil to the second conveyor belt, and the cutting knife cuts off the redundant copper foil.
The preparation equipment of the high Tg halogen-free copper-clad plate substrate is used for realizing the preparation process of the high Tg halogen-free copper-clad plate substrate in the scheme, and further comprises a frame, wherein the frame is provided with:
a first conveyor belt and a second conveyor belt;
the feeding assembly comprises a push rod movably arranged on the frame;
the feeding assembly comprises a clamping jaw movably mounted on the frame;
the hot press roll is rotatably arranged on the frame;
the cutting assembly, it includes symmetry movable mounting in the frame and be located first conveyer belt with the cutting knife between the second conveyer belt, wherein:
the push rod moves to push the substrate onto the first conveyor belt, the clamping jaw moves to cover the substrate with the copper foil, the hot pressing roller rotates to press the copper foil and the substrate, the first conveyor belt transfers the substrate with the copper foil onto the second conveyor belt, and the cutting knife moves to cut off the copper foil.
Preferably, the belt surface of the first conveyor belt is movably provided with supporting blocks, and the supporting blocks are symmetrically provided with slopes, wherein one slope is a smooth surface, and the other slope is a rough surface.
Preferably, a friction disc for driving the push rod to move is movably arranged on the frame, a spring is arranged between the push rod and the frame, and the base plate is contacted with the friction disc and drives the friction disc and the push rod to move.
Preferably, the clamping jaw comprises a sliding plate movably mounted in the frame, clamping plates are symmetrically and movably arranged on the sliding plate, and a first guide groove and a second guide groove for the clamping plates to move are symmetrically arranged on the frame.
Preferably, a movable belt moving along with the first conveyor belt is arranged in the frame, the sliding plate is movably mounted on the movable belt, and a cavity for the clamping jaw to move is formed in the frame.
Preferably, the inside of the hot-pressing roller is provided with heating blocks distributed in a circumferential array, the rack is provided with a fixing rod extending to the inside of the hot-pressing roller, and the fixing rod is provided with a conductive block electrically connected with the heating blocks.
Preferably, the conductive block is electrically connected with the two heating blocks all the time.
Preferably, the cutting assembly comprises a driving disc symmetrically movably mounted on the frame, a guide groove for guiding the cutting blade is formed in the frame, and the driving disc rotates to enable the cutting blade to reciprocate along the guide groove.
Preferably, locking blocks for locking the driving disc are symmetrically and movably arranged on the frame, and when two adjacent clamping jaws push the locking blocks simultaneously, the driving disc is unlocked.
In the technical scheme, the preparation process and equipment of the high Tg halogen-free copper-clad plate substrate provided by the invention have the following beneficial effects: the push rod pushes the base plate onto the first conveyor belt, the first conveyor belt drives the base plate to move, the clamping jaw drives the copper foil to move and cover on the base plate, the hot-pressing roller rotates and extrudes the copper foil, the conducting block is electrically connected with the heating block which is located at the lowest position inside the hot-pressing roller and the heating block which is to move to the lowest position, the heating block which is to be located at the lowest position releases heat, the bonding layer on the base plate is melted, the copper foil is attached to the base plate, and meanwhile, the heating block which is to be moved to the lowest position is preheated, so that subsequent heating work can be conducted.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.
FIG. 1 is a schematic diagram of the overall structure provided by an embodiment of the present invention;
FIG. 2 is a schematic diagram of an internal structure according to an embodiment of the present invention;
FIG. 3 is an enlarged view of FIG. 2 at A;
FIG. 4 is an enlarged view at B in FIG. 2;
FIG. 5 is an enlarged view at C in FIG. 2;
fig. 6 is a schematic structural diagram of a clamping jaw according to an embodiment of the present invention;
FIG. 7 is an enlarged view of FIG. 6 at D;
fig. 8 is an enlarged view of fig. 6 at E.
Reference numerals illustrate:
1. a frame; 111. a push plate; 112. wedge blocks; 113. a push rod; 114. a friction plate; 115. a take-up reel; 116. a first pull rope; 117. a second pull rope; 118. a movable plate; 121. a release roller; 122. a guide roller; 123. a clamping jaw; 124. a movable belt; 125. a clamping plate; 126. a first guide groove; 127. a second guide groove; 128. a cavity; 129. a slide plate; 131. a cutting knife; 132. a drive plate; 133. a sprocket; 134. a carrier roller; 135. a first chain; 136. a torsion spring; 137. a locking piece; 138. a movable rod; 139. a second chain; 141. a hot press roll; 142. a heating block; 143. a fixed rod; 144. a conductive block; 145. a synchronous belt; 146. a first conveyor belt; 147. a second conveyor belt; 151. and a supporting block.
Detailed Description
In order to make the technical scheme of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings.
Example 1
A preparation process of a high Tg halogen-free copper-clad plate substrate comprises the following steps:
s1, pushing a substrate onto a first conveyor belt 146 by a push rod 113, wherein the first conveyor belt 146 drives the substrate to move;
s2, the clamping jaw 123 drives the copper foil to move and cover the substrate;
s3, the hot press roller 141 rotates and presses the copper foil, the conductive block 144 is electrically connected with the heating block 142 at the lowest part inside the hot press roller 141 and the heating block 142 to be moved to the lowest part, the heating block 142 at the lowest part releases heat to melt an adhesive layer on the substrate, so that the copper foil is attached to the substrate, and meanwhile, the heating block 142 to be moved to the lowest part is preheated so as to perform subsequent heating work;
s4, the first conveyor belt 146 sends the substrate with the copper foil to the second conveyor belt 147, and the cutter 131 cuts off the redundant copper foil.
Specifically, the rotating hot-pressing roller 141 can well press the copper foil and the substrate, can protect the copper foil from being scratched, and meanwhile can electrically connect the conductive block 144 with the heating block 142, and only the lower part of the hot-pressing roller 141 is heated, so that energy can be saved.
Example two
As shown in fig. 1-8, a high Tg halogen-free copper-clad plate substrate preparation apparatus for implementing the high Tg halogen-free copper-clad plate substrate preparation process described in the first embodiment, further includes a frame 1, where the frame 1 is provided with:
a first conveyor belt 146 and a second conveyor belt 147;
the feeding assembly comprises a push rod 113 movably arranged on the frame 1;
the feeding assembly comprises a clamping jaw 123 movably mounted on the frame 1;
a hot press roller 141 rotatably installed on the frame 1;
a cutting assembly comprising a cutting blade 131 symmetrically movably mounted on the frame 1 between a first conveyor belt 146 and a second conveyor belt 147, wherein:
the pushing rod 113 moves to push the substrate onto the first conveyor belt 146, the jaw 123 moves to cover the substrate with the copper foil, the heat pressing roller 141 rotates to press the copper foil and the substrate, the first conveyor belt 146 transfers the substrate with the copper foil onto the second conveyor belt 147, and the cutter 131 moves to cut the copper foil.
Specifically, a storage groove for storing the substrate is formed in the frame 1, a push plate 111 is movably arranged in the storage groove, a spring is arranged between the push plate 111 and the frame 1, and a release roller 121 for winding the copper foil and a guide roller 122 for guiding the copper foil are arranged on the frame 1.
Further, the spring pushes the push plate 111 to move upwards, the uppermost substrate of the push plate 111 is opposite to the notch on the frame 1, at this time, the push rod 113 pushes the substrate onto the first conveyor belt 146, the first conveyor belt 146 drives the substrate to move, then the push rod 113 gradually returns to the original position, the push plate 111 sends another substrate to the notch on the frame 1 for next work, meanwhile, the release roller 121 releases the copper foil, the guide roller 122 guides the copper foil to a position close to the substrate, the clamping jaw 123 clamps the copper foil to drive the copper foil to move, the copper foil covers the substrate, when the copper foil passes through the hot-pressing roller 141, the hot-pressing roller 141 rotates and presses the copper foil, the conductive block 144 and the hot-pressing roller 141 are in the lowest heating block 142 in the interior and are electrically connected to the heating block 142 to be moved to the lowest, the lowest heating block 142 releases heat, the bonding layer on the substrate is melted, the copper foil is attached to the substrate, the heating block 142 to be moved to be preheated to be heated to the lowest, the subsequent heating work is carried out, the first conveyor belt 146 sends the attached substrate to the second conveyor belt 147, the copper foil is cut off, the copper foil 131 is driven to move, the copper foil is covered on the substrate, the copper foil is heated, and the copper foil is printed by the copper foil, and the copper foil is well and scratched, and the copper foil is well is electrically and electrically connected to the copper foil, and the copper foil is only heated by the hot-pressing roller 141.
In the above technical solution, the push rod 113 pushes the substrate onto the first conveyor belt 146, the first conveyor belt 146 drives the substrate to move, the clamping jaw 123 drives the copper foil to move and cover the substrate, the hot-pressing roller 141 rotates and presses the copper foil, the conductive block 144 is electrically connected with the heating block 142 at the lowest position inside the hot-pressing roller 141 and the heating block 142 to be moved to the lowest position, the lowest heating block 142 releases heat, the bonding layer on the substrate is melted, the copper foil is attached to the substrate, and meanwhile, the heating block 142 to be moved to the lowest position is preheated, so that the subsequent heating work can be performed, the first conveyor belt 146 sends the substrate with the copper foil onto the second conveyor belt 147, the cutting knife 131 cuts off the redundant copper foil, the rotating hot-pressing roller 141 can well press the copper foil and the substrate, and can protect the copper foil from being scratched, meanwhile, the conductive block 144 is electrically connected with the heating block 142, and only the lower portion of the hot-pressing roller 141 is heated, so that energy can be saved.
As a further provided embodiment of the present invention, the belt surface of the first conveyor belt 146 is movably provided with a supporting block 151, and the supporting block 151 is symmetrically provided with slopes, wherein one slope is a smooth surface, and the other slope is a rough surface.
Specifically, a slope on one side of the supporting block 151, which is close to the guide roller 122, is a smooth surface, a rubber block is arranged at the top end of the supporting block 151, and a rubber layer is covered on the rough surface.
Further, in operation, the push rod 113 pushes the substrate to move onto the first conveyor belt 146, at this time, the substrate contacts with the smooth surface of the supporting block 151, so that the substrate can move farther on the first conveyor belt 146, when the movement of the substrate is resisted, the substrate toggles the rubber block on the top of the supporting block 151, so that the supporting block 151 deflects, at this time, the substrate contacts with the rough surface on the supporting block 151, the friction between the rough surface and the substrate is larger, and the substrate can be driven to move continuously.
As still another embodiment of the present invention, a friction plate 114 for driving the push rod 113 to move is movably disposed on the frame 1, a spring is disposed between the push rod 113 and the frame 1, and the substrate contacts with the friction plate 114 and drives the friction plate 114 and the push rod 113 to move.
Specifically, the stand 1 is symmetrically provided with the wedge block 112, a spring is arranged between the wedge block 112 and the stand 1, the stand 1 is slidably provided with the movable plate 118, the movable plate 118 is rotatably provided with the friction plate 114, the friction plate 114 is provided with the take-up reel 115, a first stay cord 116 is arranged between the take-up reel 115 and the push rod 113, a spring is arranged between the movable plate 118 and the stand 1, and a second stay cord 117 is arranged between the movable plate 118 and the wedge block 112.
Further, when the device works, the former substrate part moves onto the first conveyor belt 146 and is separated from the wedge block 112, the wedge block 112 is pushed by the spring to extend out of the frame 1, at the moment, the second pull rope 117 is loosened, the movable plate 118 is pushed by the spring to move, the friction plate is contacted with the substrate, at the moment, the substrate is blocked, the substrate pulls the rubber block at the top of the supporting block 151 to enable the supporting block 151 to deflect, at the moment, the substrate is contacted with the rough surface on the supporting block 151, the friction force between the rough surface and the substrate is larger, the substrate can be driven to move continuously, the substrate drives the friction plate 114 to rotate, the friction plate 114 drives the take-up reel 115 to rotate, the take-up reel 115 rolls up the first pull rope 116, the push rod 113 is driven to move towards the inside of the frame 1 and compresses the spring between the push rod and the frame 1, after the substrate completely moves onto the first conveyor belt 146, the push plate 111 is pushed upwards under the action of the spring, the uppermost substrate moves along the inclined surface of the wedge block 112 and is pushed into the inside the frame 1, at the moment, the wedge block 112 is pushed to move to the rough surface on the inside of the frame 1, the friction plate is driven by the second pull rope 117 drives the movable plate to move, the friction plate 118 moves to move to the uppermost substrate on the inside the top of the frame 1, and the uppermost substrate can move more rapidly, and the uppermost substrate can move on the top substrate on the top conveyor belt 146, and the uppermost slide belt is pushed to move more than the uppermost substrate, and moves more than the uppermost substrate on the top, and moves.
As a further embodiment of the present invention, the clamping jaw 123 includes a sliding plate 129 movably mounted inside the frame 1, the sliding plate 129 is symmetrically movably provided with a clamping plate 125, and the frame 1 is symmetrically provided with a first guiding slot 126 and a second guiding slot 127 for moving the clamping plate 125.
Specifically, a spring is provided between the clamping plate 125 and the sliding plate 129, and a chute for moving the clamping plate 125 is provided between the first guide groove 126 and the second guide groove 127.
Further, when the clamping plates 125 are in the first guiding grooves 126, the clamping plates 125 are pushed to move by the springs, the two clamping plates 125 are opened, at this time, the copper foil is located between the two clamping plates 125, the sliding block moves along the frame 1, the clamping plates 125 are pushed by the first guiding grooves 126 to gradually close, the copper foil is clamped, the clamping plates 125 move along the sliding grooves with the copper foil, so that the copper foil and the substrate synchronously move, and the hot press roller 141 presses the copper foil on the substrate.
As a further embodiment of the present invention, a movable belt 124 moving along with a first conveyor belt 146 is disposed inside the frame 1, a sliding plate 129 is movably mounted on the movable belt 124, and a cavity 128 for moving the clamping jaw 123 is formed on the frame 1.
Specifically, the movable belt 124 is mounted on the driving roller of the first conveyor belt 146, and the movable belt 124 drives the roller of the second conveyor belt 147 to rotate so as to drive the second conveyor belt 147 to work, a spring is disposed between the sliding plate 129 and the movable belt 124, and a slope is disposed at the top of the clamping plate 125.
Further, when the first conveyor belt 146 is operated, the movable belt 124 moves along with the driving roller and moves along with the sliding plate 129, when the sliding plate 129 moves along with the clamping plate 125 into the first guide groove 126, the two clamping plates 125 are pushed open by the spring, meanwhile, the sliding plate 129 is pushed by the spring, the clamping plate 125 stretches out of the frame 1, the copper foil is positioned between the two clamping plates 125, the movable belt 124 continues to move along with the sliding plate 129, the clamping plate 125 on the sliding plate 129 is pushed by the side wall of the first guide groove 126, and the two clamping plates 125 are gradually closed to clamp the copper foil; when the clamping plates 125 move onto the second conveyor belt 147 and into the second guide groove 127, the two clamping plates 125 are pushed by the spring and spread open, releasing the copper foil, whereupon the side slopes of the clamping plates 125 abut against the side walls of the second guide groove 127 and are pushed by the slide plate 129 to move inwards of the frame 1 until the slide plate 129 and the clamping plates 125 thereon enter the cavity 128 inside the frame 1.
As a further embodiment of the present invention, the inside of the thermo roll 141 is provided with heating blocks 142 distributed in a circumferential array, the frame 1 is provided with fixing rods 143 extending to the inside of the thermo roll 141, and the fixing rods 143 are provided with conductive blocks 144 electrically connected to the heating blocks 142.
Specifically, a timing belt 145 is provided between the heat pressing roller 141 and the driving roller of the first conveyor belt 146.
Further, in operation, the driving roller of the first conveyor belt 146 drives the hot-pressing roller 141 to rotate through the synchronous belt 145, the hot-pressing roller 141 rotates and presses the copper foil and the substrate, the conductive block 144 on the fixing rod 143 is electrically connected with the heating block 142 inside the hot-pressing roller 141, the heating block 142 releases heat, the heat is transferred to the hot-pressing roller 141, the hot-pressing roller 141 presses the copper foil and melts the adhesive layer on the substrate, and the copper foil is adhered on the substrate.
As a further embodiment of the present invention, the conductive block 144 is always electrically connected to both heating blocks 142.
Specifically, during operation, the conductive block 144 is electrically connected to the heating block 142 located at the lowest inside of the hot pressing roller 141 and the heating block 142 to be moved to the lowest, the heating block 142 at the lowest releases heat to melt the adhesive layer on the substrate, so that the copper foil is attached to the substrate, and the heating block 142 to be moved to the lowest is preheated at the same time, so that subsequent heating operation can be performed.
As a further embodiment of the present invention, the cutting assembly includes a driving disc 132 symmetrically movably mounted on the frame 1, a guide slot for guiding the cutting blade 131 is formed on the frame 1, and the driving disc 132 rotates to reciprocate the cutting blade 131 along the guide slot.
Specifically, a second chain 139 is disposed between the two driving discs 132, a cross bar is disposed on the cutter 131, a waist-shaped slot is formed on the cross bar, and a cylindrical tenon adapted to the waist-shaped slot is disposed on the driving disc 132 (deformation of the crank-rocker mechanism is formed, which is not described in detail in the prior art).
Further, when the substrate with copper foil moves onto the second conveyor belt 147, one of the driving disks 132 rotates, the driving disk 132 drives the other driving disk 132 to rotate through the second chain 139, and the cylindrical tenon blocks on the two driving disks 132 drive the two cutting knives 131 to close together, so that the copper foil between the two adjacent substrates is cut off.
As a further embodiment of the present invention, the rack 1 is symmetrically and movably provided with locking blocks 137 for locking the driving disk 132, and when two adjacent clamping jaws 123 simultaneously push the locking blocks 137, the driving disk 132 is unlocked.
Specifically, a groove adapted to the locking block 137 is symmetrically formed in one of the driving discs 132, a sprocket 133 is rotatably arranged on the driving disc 132, a torsion spring 136 is arranged between the sprocket 133 and the driving disc 132, a first chain 135 is arranged between the sprocket 133 and the supporting roller 134 on the first conveyor belt 146, a movable rod 138 is arranged on the locking block 137, and a spring is arranged between the movable rod 138 and the frame 1.
Further, when the device works, the former substrate part moves onto the first conveyor belt 146 and is separated from the wedge block 112, the wedge block 112 is pushed by a spring to extend out of the frame 1, at the moment, the second pull rope 117 is loosened, the movable plate 118 is pushed by the spring to move, the friction plate is contacted with the substrate, at the moment, the substrate is blocked, the substrate pulls the rubber block at the top of the supporting block 151 to enable the supporting block 151 to deflect, at the moment, the substrate is contacted with the rough surface on the supporting block 151, the friction force between the rough surface and the substrate is larger, the substrate can be driven to move continuously, the substrate drives the friction plate 114 to rotate, the friction plate 114 drives the take-up reel 115 to rotate, the take-up reel 115 rolls up the first pull rope 116, the push rod 113 is driven to move towards the inside of the frame 1 and compresses the spring between the push rod and the frame 1, after the substrate completely moves onto the first conveyor belt 146, the friction plate 114 is not stressed any more, the uppermost substrate is pushed by the push plate 111 to move upwards under the action of the spring, the uppermost substrate moves along the inclined surface of the wedge block 112 and is pushed by the wedge block 112 to shrink into the inside the frame 1, at the moment, the friction plate 112 drives the movable plate to move through the rough surface on the second pull plate, the friction plate 118 is driven by the second pull plate to move to the uppermost substrate, the uppermost substrate 113 moves down on the uppermost conveyor belt 146, and moves more than the uppermost substrate on the uppermost conveyor belt, which can move more rapidly, and moves down on the uppermost substrate on the top plate is pushed by the top, and moves more than the top plate is moved upwards;
simultaneously, the movable belt 124 moves along with the driving roller and moves along with the sliding plate 129, when the sliding plate 129 moves along with the clamping plate 125 into the first guide groove 126, the two clamping plates 125 are pushed to open by the spring, meanwhile, the sliding plate 129 is pushed by the spring, the clamping plate 125 stretches out of the rack 1, the copper foil is positioned between the two clamping plates 125, the movable belt 124 continues to move along with the sliding plate 129, the clamping plate 125 on the sliding plate 129 is pushed by the side wall of the first guide groove 126, and the two clamping plates 125 are gradually closed to clamp the copper foil;
the driving roller of the first conveyor belt 146 drives the hot-pressing roller 141 to rotate through the synchronous belt 145, the hot-pressing roller 141 rotates and presses the copper foil and the substrate, the conductive block 144 on the fixing rod 143 is electrically connected with the heating block 142 inside the hot-pressing roller 141, the heating block 142 releases heat, the heat is transferred to the hot-pressing roller 141, the hot-pressing roller 141 presses the copper foil and melts an adhesive layer on the substrate, the copper foil is adhered to the substrate, the conductive block 144 is electrically connected with the heating block 142 at the lowest inside of the hot-pressing roller 141 and the heating block 142 to be moved to the lowest, the heating block 142 at the lowest releases heat, the adhesive layer on the substrate is melted, the copper foil is attached to the substrate, and the heating block 142 to be moved to the lowest is preheated at the same time, so that subsequent heating work can be performed;
when the first conveyor belt 146 works, the carrier roller 134 holds the belt surface and rotates, the carrier roller 134 drives the first sprocket 133 to rotate through the first chain 135, then the torsion spring 136 is deformed and builds torsion potential energy, at the moment, the driving disc 132 is locked, when the substrate with copper foil moves towards the second conveyor belt 147, two clamping jaws 123 between two adjacent substrates are abutted against the bottom of the movable rod 138 and push the movable rod 138 to move upwards, the movable rod 138 moves with the locking block 137, the locking block 137 is separated from the driving disc 132, the driving disc 132 rotates under the action of the torsion spring 136, the driving disc 132 drives the other driving disc 132 to rotate through the second chain 139, the cylindrical tenon blocks on the two driving discs 132 drive the two cutting knives 131 to close, the copper foil between the adjacent two substrates is cut off, at the same time, the clamping jaws 123 are separated from the movable rod 138, when the driving disc 132 rotates for one circle, the locking block 137 is reinserted into the driving disc 132 under the pushing of the spring, and only when the two clamping jaws 123 are pushed against the movable rod 138 at the same time, the driving disc 132 can be unlocked;
the second conveyor 147 continues to move with the substrate, and when the clamping plates 125 on the movable belt 124 move onto the second conveyor 147 and enter the second guide groove 127, the two clamping plates 125 are pushed by the springs and spread apart, and the copper foil is released, and at this time, the slopes of the sides of the clamping plates 125 abut against the side walls of the second guide groove 127 and are pushed by the sliding plate 129 to move toward the inside of the frame 1 until the sliding plate 129 and the clamping plates 125 thereon enter the cavity 128 inside the frame 1 to be used next time.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the invention, which is defined by the appended claims.
Claims (10)
1. The preparation process of the high Tg halogen-free copper-clad plate substrate is characterized by comprising the following steps of:
s1, pushing a substrate onto a first conveyor belt (146) by a push rod (113), wherein the first conveyor belt (146) drives the substrate to move;
s2, the clamping jaw (123) drives the copper foil to move and cover the substrate;
s3, the hot-press roller (141) rotates and extrudes copper foil, the conductive block (144) is electrically connected with the heating block (142) which is positioned at the lowest part inside the hot-press roller (141) and the heating block (142) which is to be moved to the lowest part, the heating block (142) which is to be moved to the lowest part releases heat, the bonding layer on the substrate is melted, the copper foil is attached to the substrate, and meanwhile, the heating block (142) which is to be moved to the lowest part is preheated, so that subsequent heating work can be carried out;
s4, the first conveyor belt (146) conveys the substrate with the copper foil to the second conveyor belt (147), and the cutter (131) cuts off the redundant copper foil.
2. The high Tg halogen-free copper-clad plate substrate preparation equipment is characterized by being used for realizing the high Tg halogen-free copper-clad plate substrate preparation process in the claim 1, and further comprising a frame (1), wherein the frame (1) is provided with:
a first conveyor belt (146) and a second conveyor belt (147);
the feeding assembly comprises a push rod (113) movably arranged on the frame (1);
the feeding assembly comprises a clamping jaw (123) movably mounted on the frame (1);
a hot press roller (141) rotatably mounted on the frame (1);
-a cutting assembly comprising a cutting blade (131) symmetrically movably mounted on the frame (1) and located between the first conveyor belt (146) and the second conveyor belt (147), wherein:
the pushing rod (113) moves to push the substrate onto the first conveyor belt (146), the clamping jaw (123) moves to cover the substrate with the copper foil, the hot pressing roller (141) rotates to press the copper foil and the substrate, the first conveyor belt (146) transfers the substrate with the copper foil onto the second conveyor belt (147), and the cutting knife (131) moves to cut off the copper foil.
3. The high-Tg halogen-free copper-clad plate substrate preparation device according to claim 2, wherein a supporting block (151) is movably arranged on a belt surface of the first conveyor belt (146), slopes are symmetrically arranged on the supporting block (151), one slope is a smooth surface, and the other slope is a rough surface.
4. The high-Tg halogen-free copper-clad plate substrate preparation equipment according to claim 2, wherein a friction disc (114) for driving the push rod (113) to move is movably arranged on the frame (1), a spring is arranged between the push rod (113) and the frame (1), and the substrate is contacted with the friction disc (114) and drives the friction disc (114) and the push rod (113) to move.
5. The high-Tg halogen-free copper-clad plate substrate preparation device according to claim 2, wherein the clamping jaw (123) comprises a sliding plate (129) movably mounted in the frame (1), clamping plates (125) are symmetrically and movably arranged on the sliding plate (129), and a first guide groove (126) and a second guide groove (127) for the clamping plates (125) to move are symmetrically arranged on the frame (1).
6. The high-Tg halogen-free copper-clad plate substrate preparation device according to claim 5, wherein a movable belt (124) moving along with the first conveyor belt (146) is arranged in the frame (1), the sliding plate (129) is movably mounted on the movable belt (124), and a cavity for the clamping jaw (123) to move is formed in the frame (1).
7. The high Tg halogen-free copper clad laminate substrate preparation device according to claim 2, wherein heating blocks (142) distributed in a circumferential array are provided inside the hot press roller (141), a fixing rod (143) extending to the inside of the hot press roller (141) is provided on the frame (1), and a conductive block (144) electrically connected with the heating blocks (142) is provided on the fixing rod (143).
8. The high Tg halogen-free copper clad laminate substrate manufacturing apparatus according to claim 7, wherein the conductive block (144) is electrically connected to both of the heating blocks (142) at all times.
9. The high Tg halogen-free copper clad laminate substrate preparation device according to claim 2, wherein the cutting assembly comprises a driving disc (132) symmetrically movably mounted on the frame (1), a guiding groove for guiding the cutting blade (131) is formed in the frame (1), and the driving disc (132) rotates to enable the cutting blade (131) to reciprocate along the guiding groove.
10. The high-Tg halogen-free copper-clad plate substrate preparation device according to claim 9, wherein a locking block (137) for locking the driving plate (132) is symmetrically and movably arranged on the frame (1), and when two adjacent clamping jaws (123) push the locking block (137) simultaneously, the driving plate (132) is unlocked.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311202125.8A CN117015161B (en) | 2023-09-18 | 2023-09-18 | Preparation process and equipment of high-Tg halogen-free copper-clad plate substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311202125.8A CN117015161B (en) | 2023-09-18 | 2023-09-18 | Preparation process and equipment of high-Tg halogen-free copper-clad plate substrate |
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| Publication Number | Publication Date |
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| CN117015161A CN117015161A (en) | 2023-11-07 |
| CN117015161B true CN117015161B (en) | 2024-02-02 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002204047A (en) * | 2000-12-28 | 2002-07-19 | Matsushita Electric Ind Co Ltd | Method and apparatus for manufacturing flexible printed wiring board |
| US7597826B1 (en) * | 2005-04-12 | 2009-10-06 | Mario Rabinowitz | Manufacture of transparent mirrored micro-balls for solar energy concentration and optical functions |
| KR20150129523A (en) * | 2014-05-12 | 2015-11-20 | (주)후세메닉스 | Laminating system for substrates |
| CN214960189U (en) * | 2021-05-31 | 2021-11-30 | 深圳市中航盛世模切机械有限公司 | Circuit board heating laminating roller |
| CN114928952A (en) * | 2022-06-18 | 2022-08-19 | 卢一宁 | Production device and method for copper-clad laminate for printed circuit board |
-
2023
- 2023-09-18 CN CN202311202125.8A patent/CN117015161B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002204047A (en) * | 2000-12-28 | 2002-07-19 | Matsushita Electric Ind Co Ltd | Method and apparatus for manufacturing flexible printed wiring board |
| US7597826B1 (en) * | 2005-04-12 | 2009-10-06 | Mario Rabinowitz | Manufacture of transparent mirrored micro-balls for solar energy concentration and optical functions |
| KR20150129523A (en) * | 2014-05-12 | 2015-11-20 | (주)후세메닉스 | Laminating system for substrates |
| CN214960189U (en) * | 2021-05-31 | 2021-11-30 | 深圳市中航盛世模切机械有限公司 | Circuit board heating laminating roller |
| CN114928952A (en) * | 2022-06-18 | 2022-08-19 | 卢一宁 | Production device and method for copper-clad laminate for printed circuit board |
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|---|---|
| CN117015161A (en) | 2023-11-07 |
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