JP2007273701A - Method for manufacturing flexible film and manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit board and a manufacturing device which utilizes maximally a reel to reel manufacturing device by splicing a single sheet flexible film to lengthen without increasing the process for a high precision circuit board manufactured by sticking a single sheet flexible film to a stiffening plate while maintaining accuracy, thereby simplifying the grip of starting point of exfoliation of the single sheet flexible film. <P>SOLUTION: The method for manufacturing the circuit board and the manufacturing device is characterized in that it splices flexible films which are on a plurality of members for circuit board in the direction of exfoliation by using two or more of the members for circuit board in which a circuit pattern is formed in the opposite side to the laminated side of a flexible film 1 laminated on a single sheet type stiffening plate 3 through an exfoliable organic layer 2, and the flexible film is exfoliated from the stiffening plate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method and an apparatus for manufacturing a flexible film used for an electronic circuit board or the like on which a semiconductor element is mounted.

  As electronics products become lighter and smaller, printed circuit board patterning needs to be highly accurate. Since the flexible film substrate can be bent, three-dimensional wiring can be formed, and the flexible film substrate is suitable for downsizing of electronic products.

  COF (Chip on Film) technology used for IC connection to a liquid crystal display panel can obtain the finest pattern that is the best as a resin substrate by processing a relatively narrow long polyimide film substrate. The progress of computerization is approaching the limit.

  For miniaturization, there are an index represented by a line width and a space width between lines, and an index represented by a position of a pattern on a substrate. Although there are measures to further reduce the line width and space width, the positional accuracy, which is the latter index, is used to align the electrode pad and the circuit board pattern when joining the electronic components such as the circuit board and IC. In connection with the progress of the increase in the number of pins of ICs, it is becoming strict to meet the required accuracy.

On the other hand, in recent years, it has been proposed to form a very fine circuit pattern by attaching a flexible film to a reinforcing plate and maintaining dimensional accuracy (see Patent Document 1). The flexible film is used after being peeled off from the reinforcing plate after the circuit pattern is formed. The proposal mainly uses a sheet-type reinforcing plate, and a flexible film on which a circuit pattern is formed is also a sheet. By handling large single-wafer substrates in a short tact time, both high-precision processing and high productivity are realized. In the current COF technology, the handling of flexible films on which circuit patterns are formed, such as electronic component connection, test, and connection with LCD panel, is available in both single wafer and long cases. There are many cases where reels are handled on a reel-to-reel basis. However, no proposal has been made for making the flexible film bonded to the reinforcing plate into a long film.
International Publication No. 03/009657 (2nd page)

  SUMMARY OF THE INVENTION An object of the present invention is to provide a circuit board manufacturing method and a manufacturing apparatus, which are particularly high-precision circuit boards, and make maximum use of reel-to-reel equipment.

That is, this invention consists of the following structures.
(1) A plurality of flexible film substrates on which a flexible film is bonded to a single-wafer type reinforcing plate via a peelable organic material layer are sequentially arranged, and only flexible films on adjacent flexible film substrates Is a method of manufacturing a flexible film in which the connected flexible film is continuously peeled from the reinforcing plate and joined together, and the adhesive tape used for joining is separated. A release sheet that has moldability and protects the adhesive surface of the adhesive tape is bonded, the adhesive tape is adsorbed and fixed, and the release sheet is curved to the opposite side of the adhesive tape bonding surface to provide an adhesive tape A method for producing a flexible film, wherein the release sheet is peeled off and used for joining.

  (2) The production of the flexible film as described in (1) above, wherein the pressure-sensitive adhesive tape on the release sheet is cut into a rectangular shape, and the direction in which the release sheet is peeled is the short-side direction of the pressure-sensitive adhesive tape. Method.

  (3) A plurality of flexible film substrates on which a flexible film is bonded to a single-wafer type reinforcing plate via a peelable organic material layer are sequentially arranged, and only a flexible film on an adjacent flexible film substrate is provided. Is a method for producing a flexible film in which a connected flexible film is continuously peeled from a reinforcing plate and joined together using an adhesive tape, and is an organic material that can be peeled off from a single-wafer type reinforcing plate In a flexible film substrate in which a flexible film having substantially the same size as that of a single-wafer type reinforcing plate is bonded via a layer, the organic film layer is not fixed by a peelable organic material layer at the leading end of the flexible film in the connecting traveling direction. A method for producing a flexible film, wherein the length is from 0.1 mm to 10 mm from the end of the reinforcing plate.

  (4) A plurality of flexible film substrates on which a flexible film is bonded to a single-wafer type reinforcing plate via a peelable organic material layer are sequentially arranged, and only a flexible film on an adjacent flexible film substrate is provided. Is a method for producing a flexible film in which the connected flexible film is continuously peeled from the reinforcing plate and joined together, and the peeling step is provided with a peeling roll. The peeling roll is stopped once on the joining portions of the joined flexible films, and then the peeling roll is rotated to peel the continuous flexible film. A method for producing a film.

  (5) After connecting only the flexible film to the flexible film substrate on which the flexible film is attached via the organic layer that can be peeled off from the single-sheet reinforcing plate, the sheet can be removed from the single-sheet reinforcing plate. The peeling step including a peeling roll for peeling the flexible film is (A) the contact point between the peeling roll and the flexible film is the position of the adhesive tape that already connects the two flexible films in the previous step. A step in which the peeling roll stops once, (B) a flexible film fixing jig located in front of the peeling roll presses against the peeling portion of the sheet reinforcing plate and the flexible film. A step of fixing the flexible film to the peeling roll, and (C) a flexibility in which the flexible film fixing jig and the peeling roll are rotated synchronously and fixed to the sheet reinforcing plate. The process of peeling off the film leading end, (D) (4) above, comprising the step of separating the flexible film fixing jig from the flexible film, and then rotating the peeling roll to peel the flexible film substrate from the single-wafer reinforcing plate. A method for producing a flexible film.

(6) A transport unit that supports and transports a flexible film substrate on which a flexible film is attached via an organic layer that can be peeled off from a single wafer reinforcing plate, and sequentially aligns the plurality of flexible film substrates. Alignment unit, connection unit that sequentially connects only flexible films on the flexible film substrate after alignment, separation unit that peels the flexible film from the reinforcing plate of the flexible film substrate, and peeling unit The apparatus for producing a flexible film according to any one of (1), (3), and (4), further comprising a collection unit that collects the joined flexible films.
(7) The distance between the rotation axis of the peeling roll and the position where the flexible film is attached with the adhesive tape is approximately the same as the integral multiple length of the sheet reinforcing plate in the connection traveling direction. The manufacturing apparatus of the flexible film as described in said (6).

  According to the present invention, a plurality of single-wafer flexible films attached to a reinforcing plate through a peelable organic material layer are sequentially arranged, and adjacent flexible films are sequentially connected to form a continuous film. After that, by peeling from the reinforcing plate, the sheet flexible film can be elongated with high accuracy, and the sheet flexible film can be elongated by continuous conveyance. The tact time can be shortened, and handling of the flexible film after peeling is very easy.

  Furthermore, since the adhesive tape is used for joining in a state where the expansion and contraction is small, the flatness of the joining part of the flexible film after joining is high and the handling is good.

  The manufacturing apparatus of the present invention includes a conveying device that supports and conveys a flexible film substrate on which a flexible film is attached via a peelable organic material layer, and a flexible film substrate. A peeling unit for peeling the flexible film from the reinforcing plate, an alignment device for sequentially aligning the plurality of flexible film substrates, and only the flexible films on the adjacent flexible film substrates after the alignment are sequentially connected. A connection unit and a recovery device that continuously peels the flexible film connected from the flexible film substrate by the peeling unit and collects the flexible film are described. An example of the recovery unit will be described with reference to FIG. To do.

  A flexible film substrate 4 bonded to a reinforcing plate 3 through an organic material layer 2 capable of peeling the flexible film 1, a mounting table 5 for holding the reinforcing plate 3, and a curve for peeling along the flexible film. Support 6, take-up roll 7 for winding the peeled flexible film, spacer supply roll 9 for supplying spacer 8 to take-up roll 7, and fixing component 10 are flexible between the surface of support 6. The film is sandwiched and tension is applied to the flexible film by the rotation of the support 6. The control device 11 controls the movement of the mounting table 5 and the rotation of the support 6.

  The connecting device that joins the flexible films adsorbs and holds the release sheet 23, the strip-like adhesive tape 24 bonded thereon, the rotating roll 22 that peels the adhesive tape 24 from the release sheet 23, and the adhesive tape. The vacuum pickup 21 to be moved and pasted to the flexible film, the release sheet collection roll 28, and the supply device for the fixing tape member (not shown), the supply of the fixing tape, and the collection of the release sheet are controlled. It consists of a control unit. Further, the release sheet collecting roll 28 is coupled via a shaft 29 to an encoder (not shown) for measuring the rotation speed of the release sheet, an electromagnetic clutch for controlling the torque applied to the collecting roll, and a rotary motor. . The pressure-sensitive adhesive tape is adsorbed and fixed by the vacuum pickup 21, and the pressure-sensitive adhesive tape in a state where the expansion and contraction is small is peeled off from the release sheet 23 and used for joining flexible films.

  In order to connect the plurality of flexible films 1 before peeling, it is preferable that there are also a plurality of mounting tables 5. The mounting table 5 moves along the rail 16 provided on the base 15 in the direction of the arrow 13 in the drawing in accordance with the rotation of the support 6 to peel off the flexible film. A suction hole is disposed on the upper surface of the mounting table 5, and the reinforcing plate 3 mounted on the surface can be sucked and held by a vacuum source (not shown).

  In the apparatus shown in FIG. 1, a conveying apparatus that supports and conveys a flexible film substrate on which a flexible film is attached via a peelable organic material layer on a single-wafer type reinforcing plate, and a plurality of flexible apparatuses The alignment apparatus for sequentially aligning the film substrates includes a mounting table 5, a rail 16, a mounting table driving source, and a control device. The peeling unit for peeling the flexible film from the reinforcing plate of the flexible film substrate includes the support 6 and the fixing component 10. The collection device for collecting the flexible film includes a winding roll 7 for winding the peeled flexible film, a spacer supply roll 9 for supplying the spacer 8 to the winding roll 7, and a tension roll 17. An example of a connection apparatus that sequentially connects only the flexible films on the adjacent flexible film substrates after alignment will be described later with reference to FIG.

  The degree of freedom of the rotation axis of the support 6 is set to only rotation, and on the other hand, by feeding the flexible film substrate 4 in the direction of the arrow 13 in the drawing, the peeling is advanced, and after joining The collection device (winding roll 7, spacer supply roll 9, tension roll 17, etc.) for collecting the flexible film 1 can be simplified and the apparatus can be made compact. In the present invention, it is preferable to include a unit that can fix the rotating shaft of the support 6 in the horizontal direction and the vertical direction, hold the reinforcing plate 3 and move it in the horizontal direction.

  The support 6 is coupled via a shaft 12 to an encoder (not shown) that measures the rotational angular velocity of the support 6, an electromagnetic clutch that controls the torque applied to the support 11, and a rotary motor.

  An adsorption hole may be arranged on the surface of the support 6 so that a portion of the flexible film 1 that is in contact with the vacuum source (not shown) may be adsorbed. At this time, it is preferable that the suction holes provided in the support 6 have a structure in which portions where the support 6 and the flexible film 1 are in contact are sequentially sucked. The material of the surface of the support 6 is not particularly limited, but is preferably an elastic body such as plastic, rubber, or foamed plastic, and has cushioning properties. Adhesive tape 14 used to prevent damage to the flexible film, or the height of the electronic component connected to the circuit pattern on the flexible film by elastic deformation, or to join the flexible film By absorbing the height, it is possible to prevent the flexible film and the circuit pattern from being broken at these edges. Moreover, when the recessed part corresponding to an electronic component is formed and processed in the support body 6, there exists an effect that it is hard to generate | occur | produce a flexible film by the edge of a recessed part.

  If the surface of the support 6 is too soft, the peeling of the flexible film does not easily progress uniformly in the direction perpendicular to the peeling progress direction. Defects are likely to occur when electronic parts are mounted or when a transport hole (sprocket hole) is provided in the flexible film. That is, uneven tension tends to occur in the direction perpendicular to the progress of peeling of the flexible film, and the flexible film and circuit pattern may be distorted, resulting in a loss of positional accuracy. On the other hand, if the surface of the support 6 is too hard, when the concave portion corresponding to the electronic component is formed as described above, the flexible film is likely to be broken by the edge of the concave portion, and the circuit pattern is caused by friction. There may be a wound. Therefore, the material of the surface of the support 6 is preferably an elastic body having a JIS-A hardness of 30 ° to 80 °.

  Further, as the material of the surface of the support 6, a material having tackiness such as a silicone resin accumulates the extension of the flexible film as the peeling progresses, so that the space between the support 6 and the flexible film 2 is accumulated. Since it is possible to prevent the shift amount from increasing, an increase in the peeling angle accompanying the progress of peeling can be suppressed, which is preferable. As a measure of tackiness, it is preferable that the peel strength in the 180 ° direction when the flexible film 2 is peeled from the holding portion 10 is 9.8 N / m or less.

The surface of the support 6 in contact with the flexible film 1 is preferably antistatic or conductive in order to suppress the charging potential of the flexible film due to peeling charging. When the charging potential is increased, a discharge may occur and the circuit pattern or electronic component may be damaged. Since the antistatic or conductive member is in contact with the surface opposite to the release surface of the flexible film, the potential can be lowered even if the charge generated on the release surface is the same. Can be prevented. As the antistatic material, a plastic, rubber, foamed plastic or the like containing a conductive material and having a surface resistance of 10 ¹² Ω or less is preferable.

  The support 6 is given a radius of curvature that takes into account the amount of deformation allowed for the flexible film 1 on which the circuit pattern is formed and the releasability, but may be given a different radius of curvature. If the radius of curvature is too small, the metal circuit pattern undergoes plastic deformation and curls, or the effect of reducing the stress at the end of the electronic component becomes insufficient. On the other hand, if the radius of curvature is too large, the force in the direction of stretching the flexible film will be larger than the force used to peel the flexible film, resulting in plastic deformation of the circuit pattern made of metal film or the flexible film. Cause. Therefore, the radius of curvature of at least a part of the support 6 that contacts the flexible film 2 is 20 mm or more, more preferably 30 mm or more, and still more preferably 50 mm or more. Further, the radius of curvature of at least a part of the support 6 that contacts the flexible film 2 is 1000 mm or less, more preferably 800 mm or less, and still more preferably 700 mm or less. In the present invention, the radius of curvature is the radius of a circle having the same curvature as the portion having the curvature.

  Further, the rotation of the support 6 and the horizontal movement of the mounting table 5 are independently performed by a rotation motor and a linear motor (not shown), and are controlled so as to continuously peel the flexible film 1 from the reinforcing plate 3. The

  It is preferable that the range of the peeling angle 20 that is an angle formed by the flexible film 2 and the reinforcing plate 4 being peeled is 1 ° or more and 80 ° or less. If the peeling angle is too large, the flexible film may bend at the peeling point. If a circuit pattern made of metal is formed on the flexible film, the circuit pattern may be folded or deformed. There is. On the other hand, if the peel angle is too small, the force in the direction of stretching the flexible film will be larger than the force used to peel the flexible film, causing a circuit pattern made of a metal film or plastic deformation of the flexible film. become. Therefore, the range of the peeling angle 20 for peeling the flexible film from the flexible film substrate 4 with low stress without distortion is preferably 1 ° to 80 °, more preferably 2 ° to 70 °, Most preferably, it is 5 ° or more and 60 ° or less.

  The leading end of the flexible film is joined to the trailing end of the preceding flexible film, travels along the cylindrical support 6 and is peeled off from the reinforcing plate. At this time, in order to give tension to the flexible film, the flexible film is sandwiched and held between the support 6 which is a peeling unit and the fixing component 10, and the support 6 rotates around the shaft 12. To do. It is also possible to fix to the support by vacuum suction from the inside of the support 6 instead of the fixing component. The fixing component 10 rotates around the shaft 12 together with the support while the flexible film is sandwiched. When the fixing component 10 is separated from the support 6 by an air cylinder (not shown), the shaft 12 is rotated. It can be freely rotated as a center, and a predetermined portion of the flexible film to be peeled can be gripped. If it is the first group of flexible films to be joined and there is no preceding flexible film, it is joined to the lead film. Since the reel-compatible apparatus has a film path of several tens of centimeters to several meters from the take-up reel and the take-up reel to the processing section, it is usual to connect a lead film to the surface side and the core side of the reel. In the apparatus shown in FIG. 1, one end of the lead film is fixed to the take-up roll 7, and connected to the peeling start end of the flexible film that peels off the other end first through the roll 17 and the support 6. It is preferable to start peeling after combining. It is preferable that a lead film having an appropriate length is connected to the end of the flexible film group to be joined, and then wound on the take-up roll 7.

  When the length from the center of the shaft 12 until the support 6 comes into contact with the flexible film 1 on the surface thereof is R, the surface of the support 6 is multiplied by the rotational angular velocity observed by the encoder. The rotational peripheral speed V1 at is calculated. The rotational peripheral speed V1 on the surface of the support 6 is made larger than the horizontal movement speed V2 of the mounting table 6, and V1 is lowered below V2 by the torque limiting unit so that the torque applied to the support 6 does not exceed a predetermined value. It is preferable to control within the range. By controlling in this way, the expansion of the peeling angle due to the elongation of the flexible film is suppressed, and the stable progress of peeling and the deformation of the flexible film and the circuit pattern formed thereon are suppressed. be able to.

  V1, V2 and torque can be controlled by mechanical, electronic, or a combination of both. As the mechanical torque control system, a system called a slip ring can be adopted, which is preferable in terms of simplicity. The electronic torque control method can be realized by a combination of a torque sensor and a servo motor, and is preferable in terms of high control accuracy and high control freedom. The initial setting values of V1 and V2 are preferably set so that V1 / V2 is 1.01 or more. The torque limit set value is set in a range that is sufficient to prevent an increase in the peel angle as the peeling progresses, and that the circuit pattern made of metal or the flexible film does not cause plastic deformation. It is appropriately selected depending on the material, width, and thickness. As described above, in this apparatus, it is preferable that V1 / V2> 1.

  Further, the control device 11 performs control for limiting the working tension to the flexible film by torque control using an electromagnetic clutch, and also the rotational peripheral speed V1 on the support surface and the horizontal movement speed of the mounting table 5. It can also be performed by V2 speed control. In this case, the speed control means that the supply voltage to the electromagnetic clutch is first increased to increase the limit torque so that the rotation of the support 6 does not slip with respect to the rotation of the rotary motor. The rotational speed of the rotary motor and the horizontal movement speed V2 of the mounting table 5 by the linear motor are controlled so as to be an appropriate value exceeding the above. If V1 / V2 increases, the acting tension on the flexible film 1 increases. Therefore, V1 / V2 is determined so as to have a limited tension. Either speed control or torque control may be used, but in the case of torque control, the elongation of the flexible film 1 is accumulated due to the progress of peeling for a long time, thereby preventing the peeling angle from increasing. The flexible film on which the circuit pattern is always formed can be peeled off with low stress. In order to control V1 and V2 independently, the flexible film substrate 4 is not sandwiched between the mounting table 5b and the support body 6, but between the support body 6 and the flexible film substrate 4. It is preferable to set a gap of 0.5 to 5 mm.

  In order to connect a plurality of flexible films 1 before peeling, there are a plurality of mounting tables 5, and they are aligned in a state where the flexible film substrate 1 is mounted like 5a and 5b shown in FIG. A plurality of flexible film substrates can be sequentially aligned. The reinforcing plate 3c from which the flexible film has been peeled is removed from the mounting table by transfer means (not shown). The mounting table 5c from which the reinforcing plate 3c has been removed is moved to the right side of the mounting table 5a by a moving means (not shown), and a new flexible film substrate is mounted. After the leading end of the flexible film held on the mounting table 5a and the end of the flexible film held on the mounting table 5b are brought into contact with each other, two sheets are used by means of holding the adhesive tape 14 and pressing it against the flexible film. Tie flexible films together. As means for holding and transporting the flexible film substrate 4, a roller or a chuck that sandwiches the flexible film width direction end from above and below can be used instead of the mounting table.

  An example of a connection device for sequentially joining the flexible films on the flexible film substrate will be described. The connecting device has a unit for taking out only the strip-like adhesive tape from the fixing tape member and a unit for attaching the adhesive tape to connect the flexible film.

  FIG. 2 is an explanatory diagram of a unit that takes out a strip-shaped adhesive tape from the fixing tape member, and is a cross-sectional view in a direction perpendicular to the feeding direction of the fixing tape member.

First, a fixing tape member in which an adhesive tape is attached to the release sheet 23 is prepared.
As the adhesive tape base material, a polyester film, polypropylene, polyimide, or the like is mainly used, and those having an adhesive strength of 2 N / 25 mm to 20 N / mm are generally used. The adhesive strength here refers to a 25 mm width adhesive tape that is bonded to an adherend of, for example, a stainless steel plate, and is then reciprocated once with a 2 kg roller, and after 30 minutes, 180 ° direction at a pulling speed of 300 mm / min. Says the force when peeled off. The adhesive tape substrate may be a single film or a plurality of films in which the same or different materials are laminated. The release sheet is coated with a release material on one side, and paper, nonwoven fabric or polyester film is mainly used as the base material.

  The width of the fixing tape member is equal to or less than the length of one side where the flexible films are connected, and is a length that does not hinder the transportability of the film. The thickness of the pressure-sensitive adhesive is such that the convex portions on the flexible film after being joined with the pressure-sensitive adhesive tape are sufficiently absorbed by the surface material of the support 6, which hinders the rotation of the support 6 and the conveyance of the flexible film. In order to prevent the peeled flexible film from being broken during winding, the thickness is preferably 5 μm to 100 μm, more preferably 10 μm to 50 mm. The thickness of the release sheet is not particularly limited, but if it is too thick, the curvature radius must be increased in order to curve the release sheet along the rotary roll 22, but in this case, the rotary roll 22 is rotated. Even if it makes it, since it becomes difficult to peel the adhesive tape 14a from a release sheet, application becomes difficult. On the other hand, if the thickness is too thin, the handling property of the fixing tape member is deteriorated, or it is broken by the tension at the time of recovery of the release sheet, so that application becomes difficult. Therefore, the thickness of the release sheet is preferably 20 μm to 1 mm.

  If the expansion and contraction of the adhesive tape is large, the internal residual stress due to the expansion and contraction of the adhesive tape is released after bonding, and the flexible film connecting portion expands and contracts, which hinders stable conveyance and winding of the flexible film. In this invention, the said state is ensured by making a rotating roll bend and release a release sheet to the opposite side to an adhesive tape. The rotating roll 22 is given a radius of curvature that takes into account deformation during the bending of the release sheet, but if the radius of curvature is too small, the release film after peeling the adhesive tape runs along the rotating roll. It is difficult. On the other hand, if the radius of curvature is too large, the adhesive tape is difficult to peel from the release sheet even when the rotary roll is rotated, as in the case where the release sheet is thick. I can't. Although depending on the length of the strip-shaped adhesive tape to be fed, the radius of curvature of the rotary roll is 5 mm or more, more preferably 10 mm or more. On the other hand, it is preferably 100 mm or less, more preferably 10 mm or less.

  It is preferable that the adhesive tape is slit in advance and cut into the width of the adhesive tape necessary for joining. A unit that performs slit processing may be disposed between the supply portion of the fixing tape member and the vacuum pickup 21. Examples of the slit processing include punching with a mold and cutting with a blade. Considering the slit processing accuracy in the thickness direction of the adhesive tape, when the adhesive tape is completely cut, a part of the release sheet under the adhesive tape may be processed. Since the release sheet after the adhesive tape is taken out is recovered by tension, it is important to select processing conditions that do not significantly reduce the tensile strength of the release sheet.

  A method of peeling the adhesive tape 14 from the release sheet 23 will be described with reference to FIG. When the adhesive tape 24 processed into a strip shape is sent in the traveling direction 40, when the most advanced adhesive tape 14a comes to the take-out position (FIG. 2-A), the traveling of the fixing tape member is stopped, and the upper side of the take-out position. The vacuum pick-up 21a standing by falls and vacuum-adsorbs the adhesive tape 14a (FIG. 2-B). The suction force is set so that the pressure-sensitive adhesive tape is not deformed during suction and does not fall off the vacuum pickup due to its own weight.

  In this state, the adhesive tape 14 remains attached to the release sheet 23. After the vacuum pick-up 21a vacuum-adsorbs the adhesive tape 14a, the release sheet 23 is sent to run the adhesive tape. At this time, the vacuum pickup 21 a moves horizontally in the feeding direction 40 at the same speed as the adhesive tape 24. At this time, the release sheet 23 is bent to the opposite side of the adhesive tape by the rotating roll 22 and is peeled off from the adhesive tape 14a. Since the adhesive tape 14a is vacuum-sucked by the vacuum pickup 21a, it can be taken out from the release sheet without receiving a large external force (FIG. 2-C).

  The direction in which the adhesive tape is run is preferably the short side direction of the rectangular strip-like adhesive tape used for joining for the following reason. Since the take-up length of the release sheet 23 when peeling the adhesive tape is short by being conveyed in the short side direction, the tact time can be shortened and the strip-shaped adhesive tape is taken out from the fixing tape member Can be made compact.

  The vacuum pickup 21a to which the adhesive tape 14 is vacuum-adsorbed is placed on the point S until the two flexible film substrate ends aligned at the joining position of the flexible film (point S in FIG. 1) come. Then, the substrate end comes to the point S and descends after the conveyance of the flexible film is temporarily stopped. After adhering the adhesive tape, the suction is released and the substrate is lifted. Thereafter, the conveyance of the flexible film substrate is resumed. The conditions for applying the adhesive tape are preferably 2 kPa to 50 kPa and 1 second to 30 seconds.

  In this invention, peeling force is measured by 180 degree direction peel strength when peeling the 1-cm-wide flexible film bonded with the reinforcement board through the peelable organic substance layer. The peeling speed when measuring the peeling force is 300 mm / min. In the present invention, in order to control the above-described peeling angle within an optimum range, the peeling force is preferably in the range of 0.098 N / m to 98 N / m.

  Although the peeling method of the flexible film 2 using a peeling apparatus is demonstrated using FIG. 1, this invention is not limited to this.

  The flexible film substrate 4 is mounted on the mounting table 5a by transfer means (not shown) with the reinforcing plate 3 on the lower side (that is, the flexible film 1a on the upper side). Subsequently, a vacuum source (not shown) is operated to hold the flexible film substrate 4 by suction on the mounting table 5a. The flexible film 1a is the same size as the reinforcing plate in the substrate flow direction (in the direction of arrow 13 in the figure). The reinforcing plate and the mounting table are also the same size in the substrate flow direction. Similarly, the flexible film 1b held on the preceding mounting table 5b has the same size as the reinforcing plate and the mounting table in the substrate flow direction. By abutting the mounting table 5a and the mounting table 5b, the end sides of the flexible film 1a and the flexible film 1b are also abutted. Tie together flexible films.

  When the distance between the flexible film 1a and the flexible film 1b is small, it is difficult to correct the flexible film substrate when the rotational deviation occurs on the mounting table, or the dimensional variation of the reinforcing plate is large. In some cases, the gap may be lost, and when the dimensional variation is further large, the adhesive tape attaching position is deviated from the normal flexible film joining position. On the contrary, when the distance between the flexible film 1a and the flexible film 1b is large, the adhesive of the adhesive tape is fixed to the end of the reinforcing plate under the flexible film, and the flexible film can be peeled off from the reinforcing plate. This is not preferable because it eliminates or uses a long adhesive tape, and the cost is increased and the dimensional expansion and contraction of the adhesive tape is increased. The interval between the flexible film 1a and the flexible film 1b is preferably controlled at an interval of 0.05 mm to 20 mm, and more preferably 0.1 mm to 1 mm.

  Even if there is no circuit pattern on the flexible film 1, a plurality of circuit patterns may be formed at equal intervals in the substrate flow direction. In the process after peeling the flexible film, when the electronic components are connected to each circuit pattern or electrical inspection is performed, the feeding pitch of the flexible film is the same in the joined parts, The flexible film may be conveyed at a constant feed pitch at all times, and the design and control of the apparatus is easy. On the other hand, at the time of circuit pattern formation, it is necessary to provide a power feeding part for electroplating on the outer peripheral part of the flexible film, or the photoresist film thickness becomes large, and the pattern cannot be installed. There is. As described above, in order to make the feeding pitch of the flexible film the same even in the joined parts, before applying to the peeling device, the outer peripheral part in the flow direction of the reinforcing plate and the flexible film is cut. It is preferable to remove and keep the lengths uniform.

  The flexible film is always transported at a constant feed pitch, but it is also possible to design and control the device by skipping a predetermined number of times without joining electronic parts and conducting electrical inspection at the flexible film joining part. It is effective in making it easy. In this case, it is possible to cope with the arrangement of the circuit pattern without cutting and removing the outer peripheral portion in the flow direction of the reinforcing plate and the flexible film.

  The pressure-sensitive adhesive tapes 14 and 24 are preferably polyimide film-based pressure-sensitive adhesive tapes so as to withstand thermal processes such as underfill cure and solder reflow performed after peeling.

  As described above, the leading end of the flexible film is joined to the trailing end of the preceding flexible film, travels along the cylindrical support 6, and is peeled off from the reinforcing plate. At this time, in order to apply tension to the flexible film, the flexible film is fixed to the support body by vacuum suction from the inside of the support body 6 or is sandwiched between the support body 6 and the fixing component 10 and held. Then, the support 6 rotates around the shaft 12. The fixing component 10 rotates around the shaft 12 together with the support while the flexible film is sandwiched. When the fixing component 10 is separated from the support 6 by an air cylinder (not shown), the shaft 12 is rotated. It can be freely rotated as a center, and a predetermined portion of the flexible film to be peeled can be gripped.

  Here, the distance between the point T in FIG. 1 which is the contact point between the support 6 and the flexible film and the point S in FIG. 1 which is the attachment position of the adhesive tape is the length in the transport direction of the flexible film substrate. It is preferably an integer multiple. Strictly speaking, it is necessary to consider the distance between the flexible films 1a and 1b. However, since the distance is very small compared to the distance between the ST points, it may not be considered here. In order to join the flexible film at the point S using the adhesive tape 14b by the vacuum pickup 21, it is necessary to temporarily stop the conveyance of the flexible film substrate. When the conveyance is resumed, since a large tensile force is temporarily applied to the separation between the flexible film and the reinforcing plate at the T point, the flexible film at the T point may be stretched by this force. When the circuit pattern is formed on the flexible film, the dimensional accuracy of the circuit board deteriorates due to the extension, which is not preferable. Even if the circuit pattern is not formed, it is not preferable because the dimensional accuracy of the circuit board deteriorates if the flexible film is partially stretched when the circuit pattern is formed after connecting the flexible film. . Therefore, when the flexible film is temporarily stopped at the point S in order to connect the flexible film with the adhesive tape, it is preferable that the connection part of the adhesive tape exists at the point T. Since the joint portion of the adhesive tape is finally removed without being used as a product, even if the joint portion is somewhat elongated when the peeling is resumed, there is no significant influence.

  When the flexible film is peeled off by the rotation of the support 6, the fixing part 10 is used to peel off the flexible film along the support 6 more reliably, but the adhesive tape 14 is applied as described above. In order to suppress the expansion of the adhesive tape or the flexible film before and after it is peeled off after being attached, the fixing member 10 preferably performs the following movement, and this operation will be described with reference to FIG. However, FIG. 4 is an example of this operation, and the present invention is not limited to this. Moreover, A-1, B-1, C-1, and D-1 of FIG. 4 are A-2, B-2, C-2, D around the adhesive tape application position (S point in FIG. 1). -2 represents the periphery of the support 6 (the vicinity of the point T in FIG. 1).

  A-1 and A-2 in FIG. 4 are states where the flexible film substrate is being conveyed. The support 6 rotates, and the joined flexible film travels along the support 6. The fixing member 10 is located in front of the support body 6 in the transport direction and does not contact the support body 6 or the reinforcing plate.

  The states when the end portions of the adjacent flexible film substrates come to the connecting portion S are B-1 and B-2 in FIG. At this time, the conveyance of the flexible film substrate and the winding of the flexible film are temporarily stopped. The vacuum pickup 21 holding the adhesive tape 14a by suction is lowered, and the adhesive tape 14 is attached to both ends of the flexible film. At this time, the adhesive tape 25 connecting the flexible film is located at a point T which is a contact point between the support 6 and the flexible film and also a point where the flexible film is peeled off from the reinforcing plate. At this time, the fixing member 10 is inserted into the peeling portion of the flexible film and the reinforcing plate, and is pressed against the support 6 to sandwich the flexible film between the support 6 and the fixing member 10.

  Next, the vacuum pickup 21 is raised, and the conveyance of the flexible film substrate and the winding of the flexible film are resumed. For peeling the flexible film from the reinforcing plate, a small force is applied if it is a continuous operation. However, when the peeling is resumed from a stopped state, a large force is required immediately after the start. If peeling is performed with a large force, the peeling portion of the flexible film will be extended, and it will be necessary to form a highly accurate circuit pattern, or if the circuit pattern has already been formed, the accuracy will deteriorate. To do. Therefore, when peeling is resumed, the fixing member 10 is placed near the peeling portion of the support 6 and the flexible film, pressed against the support 6 and peeled together with the flexible film. The elongation of the flexible film or the adhesive tape can be greatly suppressed (C-1 and C-2 in FIG. 4). When peeling of the flexible film is resumed, the flexible film can be peeled by applying a small force continuously thereafter. Therefore, the fixing member 10 releases the pressing to the support 6 after the peeling is resumed (D-1 and D-2 in FIG. 4).

  By performing the above-described series of operations, peeling without causing deterioration in dimensions such as expansion and contraction can be resumed on the flexible film even if the adhesive tape for joining is applied and temporarily stopped to attach the adhesive tape.

  The flexible film that has been peeled off after being joined together is taken up by a take-up roll 7 that is a device for collecting the flexible film (FIG. 1). When the circuit pattern is formed on the flexible film, the spacer 8 is sandwiched and wound between the flexible films so as not to damage the circuit pattern. As the spacer, an embossed plastic film can be used.

  As for the flexible film peeled off from the reinforcing plate 3, the adhesive tape is stuck on the joining portion. Similarly, on the side of the bonding surface with the reinforcing plate during the period from the peeling to the take-up roll 7. Adhesive tape can be applied to ensure the connection.

  If there is no flexible film previously peeled off, prepare a lead film from the roll 7 through the support 6 to the point T of the adhesive tape 14b in FIG. Can be connected to lead film. The presence of the lead film is preferable because the handling becomes easy even in the subsequent process.

  In order to reduce the peeling force of the peelable organic substance layer 2, it is preferable that the mounting table 5 is provided with a heating device inside or above. For the same purpose, the support 6 is preferably provided with a heating device. In order to sufficiently reduce the peeling force, it is preferable that the heating temperature is high. However, if the heating temperature is too high, the organic material layer is altered and it is difficult to remove the organic material layer remaining on the flexible film 1 after peeling. Therefore, the heating temperature of the peelable organic layer 2 is preferably 30 ° C. or higher and 280 ° C. or lower.

  The reinforcing plate 3c from which the flexible film has been peeled is removed from the mounting table by transfer means (not shown). The mounting table 5c from which the reinforcing plate 3c has been removed moves along a rail installed on the back side in the direction perpendicular to the paper surface, and is placed on the right side of the mounting table 5a, on which a new flexible film substrate is mounted. The

  FIG. 3 is another embodiment of the present invention. The flexible film substrate 4 is transferred so that the reinforcing plate 3 is on the transport roll group 30 side. The position of the flexible film substrate 4a in the conveyance roll width direction is adjusted by the positioning jig 31, and is abutted with the end of the preceding flexible film substrate 4b. In the apparatus of FIG. 3, the plurality of flexible film substrates 1 can be sequentially aligned by the transport roll group 30 and the positioning jig 31. The flexible film 1 is made to be the same size as the reinforcing plate 3 in the substrate flow direction, so that when the preceding flexible film substrate 4b ends and the following flexible film substrate 4a start ends, the flexible film 1 is flexible. The leading and trailing ends of the conductive films 1a and 1b are also abutted. The strip-shaped adhesive tape 24 used for joining is vacuum-sucked and held by the vacuum pickup 21a from the release sheet 23, and the flexible film 1a and 1b are fixed with adhesive tape at the start and end, and two flexible films are used. Tie together sex films.

  The flexible film 1b is peeled from the reinforcing plate 3 while the flexible film substrate 4b sent to the right side of FIG. 3 is sandwiched between the support 6, the transport roll group 30, the backup roll 32, and the pressing roll 33. . The flexible film can be sandwiched between the support 6 and the fixing component to be fixed and tension can be applied. However, a tension roll 34 is inserted between the take-up roll 7 and the support 6 to form a flexible film. Tension can also be applied.

  The reinforcing plate 2 used in the present invention includes inorganic glasses such as soda lime glass, borosilicate glass, and quartz glass, ceramics such as alumina, silicon nitride, and zirconia, metals such as stainless steel, invar alloy, and titanium, and glass. Those having a small linear expansion coefficient and hygroscopic expansion coefficient, such as a plate having a fiber reinforced resin, are preferred. Among these, inorganic glass and a metal plate are preferable in that appropriate flexibility can be easily obtained. In addition, it has excellent heat resistance and chemical resistance, has a large area with high surface smoothness and is easily available at low cost, is difficult to plastically deform, and is less likely to generate particles due to contact with a transport device A plate made of an inorganic glass is particularly preferable because it is an insulator and does not deposit due to electrolytic plating.

  When a glass substrate having a small thickness is used for the reinforcing plate, warping and twisting increase due to the expansion / contraction force of the flexible film, and the glass substrate may be broken when vacuum-adsorbed on a flat mounting table. Moreover, a flexible film will deform | transform by vacuum adsorption | suction and removal | desorption, and there exists a tendency for ensuring of position accuracy to become difficult. On the other hand, in a glass substrate having a large thickness, it becomes difficult to bend due to peeling, and flatness is lowered due to uneven thickness, and exposure accuracy is also lowered. In addition, the handling load by the robot or the like becomes large, and it becomes impossible to operate quickly, resulting in a decrease in productivity and an increase in transportation cost. From these points, the thickness of the glass substrate is preferably in the range of 0.3 mm to 1.1 mm.

  When a metal substrate with a small thickness is used for the reinforcing plate, warping and twisting increase due to the expansion and contraction force of the flexible film, making it impossible to vacuum-suck on a flat mounting table, and warping or twisting of the metal substrate occurs. When the flexible film is deformed by the amount, a predetermined positional accuracy cannot be ensured. Also, if there is a fold, it becomes a defective product at that time. On the other hand, in the case of a metal substrate having a large thickness, flatness is lowered due to uneven thickness, and it is difficult to bend for peeling, and the exposure accuracy is also lowered. In addition, the handling load by the robot or the like becomes large, and it becomes impossible to operate quickly, resulting in a decrease in productivity and an increase in transportation cost. Therefore, the thickness of the metal substrate is preferably in the range of 0.1 mm to 0.7 mm.

  In the present invention, a plastic film is used as the flexible film. For example, films such as polycarbonate, polyether sulfide, polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyimide, polyamide, and liquid crystal polymer can be employed. Among these, a polyimide film is preferably used because it is excellent in heat resistance and chemical resistance. In addition, a liquid crystal polymer is preferably used in terms of excellent electrical characteristics such as low dielectric loss and low hygroscopicity. It is also possible to employ a flexible glass fiber reinforced resin plate. Moreover, these films may be laminated | stacked.

  Examples of the resin for the glass fiber reinforced resin plate include epoxy, polyphenylene sulfide, polyphenylene ether, maleimide (co) polymer resin, polyamide, and polyimide.

  The thickness of the flexible film is preferably thin for light weight, downsizing, or formation of fine via holes, while the thicker one is required to ensure mechanical strength and maintain flatness. From a preferable point, the range of 4 μm to 125 μm is preferable.

  As the peelable organic layer used in the present invention, an adhesive or a pressure-sensitive adhesive is used. Examples of the peelable adhesive or pressure-sensitive adhesive include a pressure-sensitive adhesive called an acrylic or urethane-based re-peeling agent. Adhesive strength in the region called weak to medium adhesive is preferable in order to have sufficient adhesive force during flexible film processing, and can be easily peeled off during peeling and does not cause distortion in the flexible film substrate. . A silicone resin having tackiness can also be used. It is also possible to use an epoxy resin having tackiness.

  As organic materials that can be peeled, those whose adhesive strength and adhesive strength are reduced at low temperatures, those whose adhesive strength and adhesive strength are reduced by ultraviolet irradiation, and those whose adhesive strength and adhesive strength are reduced by heat treatment are suitably used. . Among these, those caused by ultraviolet irradiation are preferable because of large changes in adhesive strength and adhesive strength. An example of a material whose adhesive strength and adhesive strength are reduced by ultraviolet irradiation is a two-component cross-linking acrylic pressure-sensitive adhesive. Examples of those in which adhesive strength and adhesive strength decrease in a low temperature region include acrylic pressure-sensitive adhesives that reversibly change between a crystalline state and an amorphous state, and are preferably used.

  The thickness of the peelable organic material layer used in the present invention is preferably 0.1 μm or more, because the flatness deteriorates as the thickness decreases, and the unevenness of the peeling force due to the unevenness of the film thickness occurs. More preferably, it is the above. On the other hand, when the thickness of the peelable organic layer is increased, the anchoring property of the organic layer to the flexible film is improved, so that the adhesive strength is increased. Therefore, it is preferably 20 μm or less, and more preferably 10 μm or less. When bonding electronic components to a circuit pattern on a flexible film fixed via a peelable organic layer on the reinforcing plate, the peelable organic layer is used to suppress changes in the thickness direction of the circuit pattern. The thickness is preferably 5 μm or less. When the peelable organic material layer is thick, when the electronic component is heated and pressed, the amount of deformation of the peelable organic material layer is large, and the circuit pattern of the joint portion sinks, which may cause a problem in the reliability of the wiring circuit. When the sinking is large, the circuit pattern may come into contact with the edge of the electronic component to cause a short circuit. The sinking is preferably 6 μm or less and more preferably 3 μm or less in order to ensure the reliability of the wiring circuit.

  Moreover, it is preferable that the adhesive force of the peelable organic substance layer and the reinforcing plate is larger than the adhesive force of the peelable organic substance layer and the flexible film. As a method for controlling the adhesive strength on both sides in this way, for example, there is a method using aging of an adhesive. That is, a surface with reduced adhesive strength can be obtained by applying a pressure-sensitive adhesive on the side where the adhesive strength is to be increased, and then proceeding with crosslinking for a predetermined period in a state where the air is shut off.

  The flexible film used in the present invention may not be particularly formed with a circuit pattern, or may be formed with a circuit pattern. Further, the present invention can be applied even when a circuit pattern is formed and an electronic component is mounted on the circuit pattern.

  Although the manufacturing method of the flexible film in which the circuit pattern was formed is demonstrated below, this invention is not limited to this.

  A peelable organic material is applied to soda lime glass having a thickness of 1.1 mm using a spin coater, a blade coater, a roll coater, a bar coater, a die coater, screen printing, or the like. Use of a die coater is preferable in order to uniformly apply to a single-wafer substrate sent intermittently. After applying the peelable organic material, drying is performed by heat drying or vacuum drying to obtain a peelable organic material layer having a thickness of 2 μm. An air barrier film made of a release film (a silicone resin layer is provided on a polyester film) is bonded onto the applied peelable organic layer and left at room temperature for 1 week. This period is called aging, and the cross-linking of the peelable organic substance proceeds and the adhesive force gradually decreases. The standing period and the storage temperature are selected so that a desired adhesive strength can be obtained. Instead of laminating the air blocking film, it can be stored in a nitrogen atmosphere or in a vacuum. It is also possible to apply a peelable organic substance to a long film substrate, dry it, and then transfer it to a reinforcing plate.

  Here, when connecting the flexible film with the adhesive tape, the conveyance of the flexible film substrate and the winding of the flexible film are temporarily stopped, and a large force is applied once when the peeling after the adhesive tape is applied is resumed. As described above, in order to reduce the force at the time of resuming peeling, the tip of the flexible film is reinforced without forming a peelable organic layer on the tip of the flexible film substrate in the joining method. It is good that it is not fixed to the agent. The unfixed length is preferably 0.1 mm to 10 mm from the end of the reinforcing plate, and more preferably 0.2 mm to 2 mm. If the length that is not fixed becomes long, the flexible film may begin to peel off from the reinforcing plate in a wet process or the like for forming a circuit pattern, which is not preferable.

    Next, a flexible film having a thickness of 25 μm is prepared. The air blocking film on the glass substrate is peeled off, and the flexible film is bonded to the glass substrate. As described above, a metal layer (which may be a circuit pattern on the bonding surface) may be formed in advance on one or both surfaces of the flexible film. The flexible film may be pasted in a cut sheet having a predetermined size, or may be pasted and cut while being unwound from a long roll. In such a pasting operation, the flexible film is held on the surface of the flexible planar body and then pressed against the glass substrate, so that the flexible film can be applied to the glass substrate side with low stress and high accuracy. A laminating method can be suitably employed. A laminating apparatus used in the above method will be described with reference to FIG. 400 is a schematic front view of the laminating apparatus. The flexible sheet 402 is charged by the electrostatic charging device 401 and the flexible film 403 is adsorbed. A flexible fabric or thin film can be used for the flexible planar body 402 and is fixed to the frame body 404. Further, the electrostatic charging device 401 is supported by a support column 406 on the base 405, and the support column 406 is electrostatically charged with the frame body 404 and the mounting table 407 moving left and right in FIG. 4 by a vertical movement unit (not shown). The device 401 moves so as not to interfere. Next, the glass substrate 409 coated with the peelable organic layer 408 is held on the mounting table 407 by vacuum suction or the like. The squeegee 410 presses the flexible film 403 together with the flexible planar body 402 against the peelable organic material layer 408, and the flexible film 403 is transferred to the glass substrate 409 side. The squeegee 410 is held by a squeegee holder 411 and can move and move up and down. The mounting table 407 can be moved to the left and right in the drawing by a rail 412, a guide 413, a nut 414, brackets 415 and 416, a ball screw 417, and a motor 418.

  When the metal layer is not provided on the surface opposite to the bonding surface of the flexible film, the metal layer is formed by a full additive method or a semi-additive method. Furthermore, if necessary, plating with gold, nickel, tin or the like is performed to obtain a circuit pattern.

  In forming a circuit pattern, a connection hole can be provided in the flexible film. That is, it is possible to provide a via hole for making an electrical connection with the metal layer provided on the bonding surface side, or to provide a ball placement hole for the ball grid array. Laser holes and chemical etching can be employed as the method for providing the connection holes. When electrical connection is made, it is preferable that after the connection hole is formed, the inner surface of the hole is made into a conductor by plating at the same time as the circuit pattern is formed. The diameter of the connection hole for electrical connection is preferably 15 μm to 200 μm. The diameter of the hole for installing the ball is preferably 50 μm to 800 μm, more preferably 80 μm to 800 μm.

  If necessary, a solder resist layer is formed on the circuit pattern. As the solder resist, a photosensitive solder resist or a thermosetting solder resist is preferable. Among these, it is more preferable to use a photosensitive solder resist for the fine circuit pattern. A photosensitive solder resist is applied onto the circuit pattern with a spin coater, blade coater, roll coater, bar coater, die coater, screen printing machine, etc., dried, and then exposed to ultraviolet rays through a predetermined photomask and developed. Thus, a solder resist pattern is obtained. Next, curing is performed at 100 ° C. to 200 ° C.

  When creating a circuit pattern, proceed with processing using a design in which the same circuit pattern is repeatedly arranged in two dimensions, and with the circuit pattern in a strip shape in which the circuit pattern is arranged one-dimensionally before peeling the flexible film The flexible film can be peeled off from the glass substrate after the flexible film is cut. A laser, a high-pressure water jet, a cutter, or the like can be used for cutting the flexible film. The glass substrate is also cut into strips and then peeled off, which can reduce the size of the apparatus and is a preferable mode.

  In the present invention, it is allowed to insert a resistance element or a capacitance element into the circuit pattern as appropriate. In addition, an insulating layer and a wiring layer can be laminated on at least one surface of the flexible film substrate to form a multilayer.

  Since the present invention is particularly effective for securing the mounting accuracy of a large-scale LSI having a small connection pitch and a large number of pins, the LSI package form (mounting form) is not particularly limited, such as a bare chip, a ball grid array type, etc. It can be applied to both.

  The use of the circuit board obtained by the production method of the present invention is not particularly limited, but it is preferably used for a wiring board of an electronic device, an IC package interposer, and the like.

Example 1
As a flexible film, a long polyimide film having a thickness of 25 μm (“Kapton” 100EN manufactured by Toray Du Pont Co., Ltd.) was prepared. Using a reel-to-reel type sputtering apparatus compatible with long films, a 15 nm thick chromium: nickel = 5: 95 (weight ratio) alloy film and a 150 nm thick copper film were laminated in this order on a polyimide film. .

  An ultraviolet curable adhesive “SK Dyne” SW-22 (manufactured by Soken Chemical Co., Ltd.) and a curing agent L45 (Soken Chemicals Co., Ltd.) were applied to a reinforcing plate 1.1 mm thick, 300 × 350 mm soda lime glass with a die coater. Co.) was mixed at 100: 3 (weight ratio) and dried at 80 ° C. for 2 minutes. The adhesive was not applied so that the flexible film would not stick to the end portion 0.2 mm of the reinforcing plate in the transport direction. The peelable organic layer thickness after drying was 2 μm. Next, an air blocking film (a film in which a silicone resin layer that can be easily released on a polyester film) was bonded to the organic layer, and left for one week.

A polyimide film provided with a metal layer was cut out to 300 × 350 mm. After the air blocking film was peeled off, a polyimide film provided with a metal layer on an organic layer that can be peeled off by a laminator shown in FIG. 5 was bonded. The flexible sheet 102 made of polyester mesh was charged by the electrostatic charging device 104, and the polyimide film 1 was adsorbed. Next, the glass substrate 3 coated with the peelable organic layer 2 was held on the mounting table 101 by vacuum suction. The polyimide film 1 was pressed against the peelable organic layer 2 together with the flexible planar body 102 with a squeegee 103, and the polyimide film 1 was transferred to the glass substrate 3 side. Thereafter, the organic layer was cured by irradiating with 1000 mJ / cm ^{2 of} ultraviolet rays from the glass substrate side.

  A positive photoresist was applied onto the copper film with a spin coater and dried at 80 ° C. for 10 minutes. The photoresist was exposed and developed through a photomask to form a photoresist layer having a thickness of 12 μm in a portion where a plating film was unnecessary.

  The test photomask pattern had the following shape. As inner leads, 772 wirings (width 10 μm, length 5 mm) per side were arranged at a pitch of 25 μm on two long sides of a rectangle of 19.3 mm × 2.5 mm. With this as one unit, the glass substrates were arranged equally in the 300 mm length direction from the center, and seven rows were arranged at a pitch of 35 mm. Ten glass substrates were arranged at an interval of 30 mm from the center in the direction of 350 mm length.

  Next, a copper layer having a thickness of 8 μm was formed by electrolytic plating in a copper sulfate plating solution using the copper film as an electrode. The photoresist was stripped with a photoresist stripping solution, and then the copper film and the chromium-nickel alloy film that were under the resist layer were removed by soft etching with a hydrogen peroxide-sulfuric acid aqueous solution. Subsequently, a tin layer having a thickness of 0.4 μm was formed on the copper plating film by electroless plating to obtain a circuit pattern.

  With a length measuring machine SMIC-800 (manufactured by Sokkia Co., Ltd.), the distance between the centers of the outermost inner leads in the width direction (design value 19.3 mm) was measured for all units on the polyimide film. The position accuracy was within ± 1 μm (0.005%) of the design value, and the position accuracy was very good.

  Using a YAG laser, the polyimide film was cut into strips having a width of 35 mm and a length of 350 mm. In the strip, 10 units are arranged in one row. Furthermore, according to the polyimide fill, the glass substrate was also cut into strips of 35 mm width and 350 mm length with a glass scribe device, and seven strip samples were obtained from the 300 × 350 mm substrate.

  Then, the polyimide film was peeled from the glass substrate with the peeling apparatus shown in FIG. The curvature radius of the curved surface of the support 6 was 80 mm, and silicone rubber having a JIS-A hardness of 50 ° was used. A polyimide film having a thickness of 25 μm and a width of 35 mm was prepared as a lead film. One end of the lead film was fixed to the take-up roll 7, and the polyimide film-based adhesive tape was connected to one end of the polyimide film-based pressure-sensitive adhesive tape through the roll 17 and the support 6 in a state where the expansion and contraction of the polyimide film-based adhesive tape was small. Adhesive tape is a 35 mm wide Osaka Seal Printing Co., Ltd. F4PBT (50 μm thickness, adhesive strength 6.08 N / 10 mm) and P2AP8 (16 μm thickness, adhesive strength 2.35 N / 10 mm) laminated tape. The pressure was 10 kPa and the time was 30 seconds. The adhesive tape used was slit in advance to a width of 5 mm. The warp of the joint portion of the flexible film after peeling from the reinforcing plate was 1 mm or less, and there was no hindrance to peeling and winding of the flexible film in the next step.

  The strip-shaped sample 4 was placed on the mounting table 5 and then moved rightward, and the peeling start end of the flexible film 1 was positioned immediately below the shaft 12. The lead film was sandwiched between the fixing jig 10 and the support 6 and fixed.

  Next, the second flexible film substrate 4 to be peeled was placed on the mounting table 5a and abutted with the preceding mounting table 5b. The rear end of the flexible film that was previously peeled off was joined to the front end of the newly supplied flexible film with a polyimide film-based adhesive tape 14.

  The right side moving speed at the time of peeling the mounting table 5 is 0.3 m / min, the rotational peripheral speed of the support 6 is 0.31 m / min, and it is supported when the tension applied to the polyimide film 1 is 160 N / m or more. While controlling the rotational peripheral speed of the body 6 to decrease toward the moving speed of the mounting table, the flexible film 1 is removed from the reinforcing plate 2 by moving the mounting table 5 in the right direction and rotating the support body 6 to the left. The film was peeled by a length of 25 mm, the operation was stopped once, and the fixing component 10 was separated from the lead film.

  Under the same conditions as described above, the right side movement at the time of peeling of the mounting table 5 and the rotation of the support body 6 are resumed and moved to 325 mm to complete the peeling of the first flexible film from the reinforcing plate. Was temporarily stopped. At this time, the adhesive tape 14 is positioned on the flexible film portion directly below the shaft 12. After the flexible film was sandwiched between the support 6 and the fixing component 10 and fixed, the second flexible film was peeled by a length of 25 mm, and then the operation was stopped. Thereafter, the vacuum pickup 21 holding the adhesive tape was lowered, and the single wafer flexible film behind the support 6 was connected. Thereafter, the third and subsequent flexible film substrates were peeled in the same manner as the second flexible film substrate. The peeled flexible film was wound up on a winding roll 7. An embossed spacer 45 mm wide was sandwiched between the polyimide films.

  The polyimide film with a circuit pattern after peeling had no flatness or curl and good flatness. With the length measuring machine SMIC-800, the distance between the centers of the outermost inner leads in the width direction (design value 19.3 mm) was measured for the units on the polyimide film after peeling. On the other hand, it was within ± 1 μm (0.005%), and the positional accuracy was very good.

Example 2
An ultraviolet curable adhesive “SK Dyne” SW-22 (manufactured by Soken Chemical Co., Ltd.) and a curing agent L45 (Soken Chemicals Co., Ltd.) were applied to a reinforcing plate 1.1 mm thick, 300 × 350 mm soda lime glass with a die coater. When applying a mixture of 100: 3 (weight ratio), apply adhesive so that the flexible film does not stick to the tip of the reinforcing plate 0.05 mm in the connecting direction. Except not having carried out, the sheet | seat flexible film board | substrate was produced like Example 1, and it bonded together with the adhesive tape using the manufacturing apparatus of FIG. 1, and peeled from the reinforcement board.

  When laminating the single-wafer flexible film with the adhesive tape, the conveyance of the flexible film and the winding of the flexible film were temporarily stopped, and the peeling of the flexible film was resumed after the adhesive tape was applied. Since there is a large difference between the torque control value sent from the control device 11 coupled to the shaft 12 of the support 6 and the torque output value actually coupled to the shaft 12 of the support 6 after the start of peeling, it is not shown in FIG. The emergency stop device attached to the manufacturing apparatus was activated, and the peeling operation stopped. A large difference between the two torque values means that the peeled flexible film has a large elongation.

  From this, when the length which the adhesive agent was not apply | coated at the front-end | tip part of the reinforcement board of a joining direction is 0.05 mm, the film extended 20 micrometers because the peeling force at the time of peeling restart of a flexible film was large. When peeling the joint portion, the influence of the decrease in the dimensional accuracy of the film due to the increase in tension at the time of peeling the joint portion can be separated by fixing the flexible film with the support 6 and the fixing part 10. Thereby, the product portion was within ± 1 μm with respect to the design value, and the position accuracy of the product portion was very good.

Example 3
An ultraviolet curable adhesive “SK Dyne” SW-22 (manufactured by Soken Chemical Co., Ltd.) and a curing agent L45 (Soken Chemicals Co., Ltd.) were applied to a reinforcing plate 1.1 mm thick, 300 × 350 mm soda lime glass with a die coater. When applying a mixture of 100: 3 (weight ratio) manufactured by Co., Ltd., the adhesive is not applied so that the flexible film does not adhere to the tip 15 mm of the reinforcing plate in the connecting direction. A single wafer flexible film substrate was produced in the same manner as in Example 1 except that.

  In order to form a circuit pattern on a flexible film, a plating process such as copper plating or tin plating, or a wet process such as development or peeling for forming a plating resist is flowed. For processing, chemicals such as plating solution and developer in the processing tank, and pure water for cleaning are forcibly circulated using bubbling or jets, or the flexible film is swung or locked in the processing solution. Apply forced vibration such as shock.

  Since the tip of the reinforcing plate 15 mm is not fixed to the reinforcing plate this time, after forming the circuit pattern, the tip of the flexible film substrate cut into strips 35 mm wide and 350 mm long is the flexible film Was peeled from the reinforcing plate by 20 mm. For this reason, it entered between the flexible film and the reinforcing plate, and the back surface of the flexible film as the product part was contaminated with chemicals.

  Regarding the peeling of the connected flexible film, the peeling device of FIG. When peeling the joint portion, the influence of the decrease in the dimensional accuracy of the film due to the increase in tension at the time of peeling the joint portion can be separated by fixing the flexible film with the support 6 and the fixing part 10. Thereby, the product portion was within ± 1 μm with respect to the design value, and the position accuracy of the product portion was very good.

Comparative Example 1
A circuit pattern was obtained in the same manner as in Example 1, and the polyimide film was further cut into strips having a width of 35 mm and a length of 350 mm using a YAG laser. According to the polyimide film, the glass substrate was also cut into strips having a width of 35 mm and a length of 350 mm using a glass scribing device to obtain seven strip samples.

  The polyimide film 1 with a circuit pattern was peeled from the glass substrate 3 using the peeling apparatus 600 shown in FIG. On the base 604, a rail 608, a peeling unit 602, and the like were provided. The curvature radius of the curved surface of the support 605 was 80 mm, and a silicone rubber having a JIS-A hardness of 50 ° was used. A polyimide film with a circuit pattern was placed on the mounting table 601 so that the glass substrate was on the lower surface, and vacuum suction was performed at 100 hPa. A lead film of the same material and width was joined to the right end of the polyimide film 1 using a polyimide film-based adhesive tape. The frame 607 was moved and the support 605 was rotated so that the starting point S of the support 605 of the peeling unit 602 was positioned slightly to the right of the right end of the polyimide film 1 in the drawing. After the positioning of the support 605 was completed, the mounting table 601 was raised and the right end of the polyimide film 1 and the support 605 were pressed at 0.01 MPa. Next, one end of the lead film was gripped between the fixing component 609 and the support 605. While controlling the maximum tension applied to the polyimide film and the lead film by the control device 603 to be 160 N / m, the support 605 is rotated in the direction of the arrow in the figure while the frame 607 is fixed, and the polyimide film 1 is moved. The support 605 was brought into close contact with the surface.

  When the frame 607 is peeled off, the moving speed on the right side is 0.3 m / min, the rotational speed of the support 605 is 0.31 m / min, and when the tension applied to the polyimide film is 160 N / m or more, the support 605 The polyimide film 1 was peeled from the glass substrate 3 by the leftward movement of the support 605 and the left rotation of the support 605 while controlling the rotation peripheral speed of the support 605 to decrease toward the movement speed of the frame 607. The frame 607 was moved to the right on the rail 608, and the peeled polyimide film with a circuit pattern was placed on the mounting table 610. Further, the polyimide film was sent to the next step by means of transfer means (not shown). The polyimide film after peeling had no flatness or curl and good flatness. However, bonding the lead film to each strip-shaped sample increases the number of consumable members, and increases the labor of fixing the lead film with fixing parts.

  When the frame 607 is peeled off, the moving speed on the right side is 0.3 m / min, the rotational peripheral speed of the support 605 is 0.31 m / min, and when the tension applied to the polyimide film is 160 N / m or more, the support 606 The polyimide film 1 was peeled from the glass substrate 3 by the leftward movement of the support 606 and the left rotation of the support 605 while controlling the rotation peripheral speed of the support 606 to decrease toward the movement speed of the frame 607. The frame 607 was moved to the right on the rail 608, and the peeled polyimide film with a circuit pattern was placed on the mounting table 610. Further, the polyimide film was sent to the next step by means of transfer means (not shown). The polyimide film after peeling had no flatness or curl and good flatness. However, bonding the lead film to each strip-shaped sample increases the number of consumable members, and increases the labor of fixing the lead film with fixing parts. With the length measuring machine SMIC-800, the distance between the centers of the outermost inner leads in the width direction (design value 19.3 mm) was measured for the units on the polyimide film after peeling. On the other hand, it was within ± 1 μm (0.005%), and the positional accuracy was good. Subsequently, seven strip samples were joined using a manual splicer (manufactured by Tokyo Seimitsu Co., Ltd.) and a polyimide film-based adhesive tape. Since the polyimide film peeling from the glass substrate and the bonding of the polyimide film were separate processes, the number of processes increased. Furthermore, it has been difficult to automate the operation of splicing the polyimide film with a circuit pattern after peeling from the glass substrate with a splicer.

The schematic front view of the manufacturing apparatus of this invention. The schematic sectional drawing of the apparatus which takes out an adhesive tape. The schematic front view of the manufacturing apparatus which showed another aspect of this invention. Operation | movement explanatory drawing of sticking of an adhesive tape and peeling of a flexible film. 1 is a schematic front view of a laminating apparatus suitable for the present invention. A peeling device used in a comparative example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Flexible film 2 Releasable organic substance layer 3 Reinforcement board 4 Flexible film board | substrate 5,601 Mounting stand 6,605 Support body 7 Winding roll 8 Spacer 10,609 Fixing jig | tool 12,29,606 Shaft 14 , 24 Adhesive tape 16, 608 Rail 20 Peeling angle 21 Vacuum pick-up 22 Rotating roll 23 Release sheet 28 Recovery roll 30 Conveying roll 32 Backup roll 33 Pressing roll 34 Tension roll 400 Laminating apparatus 401, 601, 610 Mounting table 402 Flexible Surface 403 Squeegee 401 Electrostatic charging device 600 Peeling device 607 Frame

Claims (7)

A plurality of flexible film substrates on which flexible films are bonded to each other via a peelable organic material layer are sequentially aligned, and only flexible films on adjacent flexible film substrates are adhesive tape. Is a method for producing a flexible film in which the connected flexible films are continuously peeled from the reinforcing plate and joined together, and the adhesive tape used for joining has a release property. A release sheet that protects the adhesive surface of the pressure-sensitive adhesive tape is bonded, and the pressure-sensitive adhesive tape is adsorbed and fixed, and the release sheet is bent to the side opposite to the pressure-sensitive adhesive tape bonding surface and released from the pressure-sensitive adhesive tape. A method for producing a flexible film, wherein the sheet is peeled and used for joining. 2. The method for producing a flexible film according to claim 1, wherein the pressure-sensitive adhesive tape on the release sheet is die-cut into a rectangular shape, and the direction in which the release sheet is peeled is the short side direction of the pressure-sensitive adhesive tape. A plurality of flexible film substrates on which flexible films are bonded to each other via a peelable organic material layer are sequentially aligned, and only flexible films on adjacent flexible film substrates are adhesive tape. Is a method for producing a flexible film in which the connected flexible films are continuously peeled from the reinforcing plate and joined together through an organic layer that can be peeled off from the single-wafer type reinforcing plate. In a flexible film substrate in which a flexible film having substantially the same dimensions as that of the single-wafer type reinforcing plate is bonded, the length of the flexible film tip in the connecting traveling direction is not fixed by the peelable organic layer. A method for producing a flexible film, wherein the thickness is from 0.1 mm to 10 mm from the end of the reinforcing plate. A plurality of flexible film substrates on which flexible films are bonded to each other via a peelable organic material layer are sequentially aligned, and only flexible films on adjacent flexible film substrates are adhesive tape. Is a method for producing a flexible film in which the connected flexible films are continuously peeled from the reinforcing plate and joined together, and a peeling roll is provided in the peeling step. Production of a flexible film characterized in that a continuous roll of flexible film is peeled off by temporarily stopping the peeling roll on the joined portions of the joined flexible films and then rotating the peeling roll. Method. After connecting only the flexible film to the flexible film substrate on which the flexible film is bonded via the peelable organic material layer, the flexible film is removed from the single-sheet reinforcing plate. When the peeling step including the peeling roll for peeling the sheet is (A) the contact point between the peeling roll and the flexible film is already at the position of the adhesive tape connecting the two flexible films in the previous step. The step of stopping the peeling roll at one end, (B) the flexible film fixing jig located in the forward direction of the peeling roll presses the peeling portion between the sheet reinforcing plate and the flexible film. Step of fixing the flexible film to the peeling roll, (C) Progress of the flexible film fixed to the sheet reinforcing plate by rotating the flexible film fixing jig and the peeling roll synchronously (D) flexible film 5. The apparatus according to claim 4, comprising a step of separating the rumm fixing jig from the flexible film, and then rotating the peeling roll to peel off the flexible film substrate from the sheet reinforcing plate. A method for producing a flexible film. A transport unit that supports and transports a flexible film substrate on which a flexible film is attached via an organic material layer that can be peeled off from a sheet reinforcing plate; an alignment unit that sequentially aligns a plurality of flexible film substrates; After the alignment, only the adjacent flexible film substrate-like flexible film is sequentially connected, the peeling unit for peeling the flexible film from the reinforcing plate of the flexible film substrate, and the peeled unit by the peeling unit. The apparatus for producing a flexible film according to claim 1, further comprising a collection unit that collects the flexible film. The distance between the rotation axis of the peeling roll and the position where the flexible film is attached with the adhesive tape is approximately the same as the integral multiple length of the sheet reinforcing plate in the direction of connection. 6. The apparatus for producing a flexible film according to 6.

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