JP4561207B2 - Circuit board manufacturing method and manufacturing apparatus - Google Patents

Description

  The present invention relates to a method and apparatus for manufacturing an electronic circuit board, and more particularly to a method and apparatus for peeling a flexible film having a circuit pattern formed thereon from a reinforcing plate.

  In the conventional peeling of the flexible film, the rigid substrate is generally a product, and the flexible film is generally a protective film. Therefore, there is no particular attention to the quality of the flexible film after peeling, and the main focus is on reliably peeling the flexible film. In addition, there are some applications where flexible products are peeled off from rigid substrates, but those that place importance on the efficiency of the peeling work and methods that bend the product to reduce the peeling force have been adopted. Yes. Therefore, there was no idea of peeling while maintaining the flatness and dimensional accuracy of the flexible film.

  On the other hand, in recent years, it has been proposed to form a very fine circuit pattern by attaching a flexible film to a reinforcing plate and maintaining dimensional accuracy (see, for example, Patent Document 1). Since the circuit pattern of the flexible film substrate is used after being peeled off from the reinforcing plate, it is desired to suppress the dimensional change of the circuit pattern when peeling from the reinforcing plate to the micron order. Therefore, it is required to peel the flexible film without applying stress as much as possible.

As a method of peeling the flexible film from the rigid substrate, a method of peeling the flexible film while fixing the rigid substrate has been proposed. Specifically, the end of the flexible film can be gripped (for example, see Patent Document 2), an adhesive tape can be pressed against the surface of the flexible film (for example, see Patent Document 3), or a rigid substrate can be used. To a method of peeling a flexible film by turning up the flexible film from the end (for example, refer to Patent Document 4) or a peeling roller while maintaining an obtuse angle as the angle formed by the flexible film A method of transferring a flexible film and then scraping off the flexible film from a peeling roller with a scraper (see, for example, Patent Document 5) has been proposed. However, all of them are intended to peel off a flexible film as a protective film from the product, and there is no description about peeling a flexible film on which a fine circuit pattern is formed without losing dimensional accuracy and flatness. Absent.
International Publication No. 03/009657 Pamphlet JP-A-5-319675 (2nd page) JP-A-7-315682 (page 3) JP 2002-104726 A (page 5) JP 7-215577 A (2nd page)

  The object of the present invention is to solve the above-mentioned problems of the prior art, peel the flexible film with low stress without bending or distortion, and further suppress the dimensional change of the flexible film at the time of peeling. It is an object of the present invention to provide a circuit board manufacturing method and a manufacturing apparatus capable of performing the above.

In order to solve the above problems, a circuit board manufacturing method according to the present invention provides a circuit pattern on a surface opposite to a bonding surface of a flexible film bonded to a reinforcing plate through an organic layer that can be peeled off. A method of manufacturing a circuit board, wherein after forming, a reinforcing board and a flexible film are peeled off along at least a part of a flexible film along a curved support, and connected to one end of the flexible film. In a state where the peeling auxiliary member protruding from the reinforcing plate is placed along the support, or a part of the flexible film is peeled off from the reinforcing plate, and the peeling portion of the flexible film is put along the support. In this state, the frame and the reinforcing plate that rotatably hold the support without rotating the support are moved relative to each other in the direction in which the flexible film is tensioned, or the frame and the reinforcing plate Support without changing relative position The by rotating in the direction in which tension is applied to the flexible film, the flexible film is adhered to the support and then, while rotating the support, allowed by relatively moving the frame and the reinforcing plate It consists of the method characterized by peeling a flexible film.

Also, the method for manufacturing a circuit board according to the present invention includes forming a circuit pattern on a surface opposite to a bonding surface of a flexible film bonded to a reinforcing plate via an organic layer that can be peeled, and then at least flexible. A method of manufacturing a circuit board in which a reinforcing plate and a flexible film are peeled off along a curved support, with a part of the flexible film being connected to one end of the flexible film and protruding from the reinforcing plate The member can be placed along the support and one end of the peeling auxiliary member is held by a holding means independent of the support, or a part of the flexible film is peeled off from the reinforcing plate. wrinkles film along a said support, and one end of the flexible film while holding a separate gripping means and the support, the gripping means and the reinforcing plate in a direction to apply tension to the flexible film Move relatively Accordingly, the flexible film is adhered to the support and then, while rotating the support, peeling the flexible film by relatively moving the frame for rotatably holding the reinforcing plate The support It consists of the method characterized by doing.

In these circuit board manufacturing methods, after the flexible film is brought into close contact with the support, the flexible film or the peeling auxiliary member is slid on the support while being slid on the support, and then the support is rotated. Meanwhile , the flexible film can be peeled by relatively moving the frame and the reinforcing plate . In addition, after the flexible film is brought into close contact with the support, the peeling assisting member or the end of the flexible film is held by the support, and then the frame and the reinforcing plate are relatively moved while the support is rotated. The flexible film can be peeled off by moving it .

The apparatus for producing a circuit board according to the present invention peels a flexible film from a flexible film substrate in which a flexible film on which a circuit pattern is formed is bonded to a reinforcing plate via an organic layer that can be peeled off. A circuit board manufacturing apparatus, a holding means for holding a reinforcing plate, a curved support for peeling a flexible film, a means for rotating the support, and a means for relatively horizontally moving the support and the reinforcing plate In the state where the flexible film or the peeling assisting member connected to the flexible film is placed along the support, the frame and the reinforcing plate that flexibly hold the support without rotating the support are flexible. Flexible by rotating the support in the direction in which the tension is applied to the flexible film without changing the relative position between the frame and the reinforcing plate On film Applying a force, consisting of those characterized by comprising a means for the flexible film Ru is adhered to the support.

In addition, the circuit board manufacturing apparatus according to the present invention provides a flexible film from a flexible film substrate in which a flexible film on which a circuit pattern is formed is bonded to a reinforcing plate via an organic layer that can be peeled off. A circuit board manufacturing apparatus for peeling , a holding means for holding a reinforcing plate, a curved support for peeling a flexible film, a means for rotating the support, and the support and the reinforcing plate are relatively horizontally moved. A flexible film end gripping means independent of the support or a gripping means at one end of the peeling assisting member, a state where the flexible film or the peeling assisting member connected to the flexible film is placed along the support Then, the tension is applied to the flexible film by moving the gripping means independent of the support relative to the holding portion in the direction in which the tension is applied to the flexible film, and the flexible film is used as the support. It is brought into close contact Consisting of those characterized by comprising a means.

In these circuit board manufacturing apparatuses, after the flexible film is brought into close contact with the support , it is configured to include means for sliding the flexible film or the peeling assisting member along the support on the support. Can do.

Furthermore, the circuit board manufacturing apparatus according to the present invention provides a flexible film from a flexible film substrate in which a flexible film on which a circuit pattern is formed is bonded to a reinforcing plate via an organic layer that can be peeled off. A circuit board manufacturing apparatus for peeling , a holding means for holding a reinforcing plate, a curved support for peeling a flexible film, a means for rotating the support, and the support and the reinforcing plate are relatively horizontally moved. A support member and a fixing member by bending the end of the peeling auxiliary member connected to one end of the flexible film and projecting from the reinforcing plate or the end of the flexible film partially peeled from the reinforcing plate The tension is applied to the flexible film by moving the gripping means independent of the support and the gripping means independent of the support relative to the holding part in the direction in which the tension is applied to the flexible film. Sex film Include means for adhering the lifting member can consist of those characterized by.

  According to the present invention, the flexible film is peeled off with low stress by holding the reinforcing plate and pulling the reinforcing plate away from the flexible film along a curved support part of the flexible film. Can be peeled without causing distortion in the width direction of the flexible film by parallelizing the flexible film before the start of peeling. It can be made minute.

  According to still another aspect of the present invention, the flexible film or the end portion of the peeling auxiliary member connected to the end portion of the flexible film is bent and gripped, so that the flexible film is securely gripped and peeled off. Can be advanced.

  The present invention is a method and apparatus for peeling a part of a flexible film along a curved support when peeling a reinforcing plate and a flexible film to be a circuit board, and a peeling progress direction A method and apparatus for uniformly controlling the stress applied to the flexible film for peeling in a direction perpendicular to.

Hereinafter, preferred embodiments of a circuit board manufacturing method and a manufacturing apparatus according to the present invention will be described with reference to the drawings.
A peeling method 1 in a circuit board manufacturing method and manufacturing apparatus according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a front view of a peeling apparatus 1 according to an embodiment of the present invention, and FIG. 2 is a side view. Peeling apparatus 1 has a main structure of the following. A flexible film substrate 5 bonded to a reinforcing plate 4 via an organic layer 3 capable of peeling the flexible film 2, a mounting table 6 for holding the reinforcing plate 4, and the flexible film 2 to the reinforcing plate 4 And a control unit 8 that controls the relative movement between the peeling unit 7 and the mounting table 6.

  The mounting table 6 is attached to the base 9 so as to be freely raised and lowered, and can be freely raised and lowered by a driving source (not shown). Further, a suction hole is arranged on the upper surface of the mounting table 6 so that the reinforcing plate 4 mounted on the surface can be sucked and held by a vacuum source (not shown).

  The peeling unit 7 includes a support body 11 having a holding portion 10 in contact with the flexible film 2 at its tip, a frame 13 that holds the support body 11 in a cantilevered manner via a shaft 12, and a frame 13 as a base. 9 is provided with a rail 14 that freely guides horizontally on 9 and a fixing part 19 that fixes one end of the flexible film 2. Further, in order to perform rotation of the shaft 12 and horizontal movement of the peeling unit 7, a linear scale 15 that measures the relative movement speed of the frame 13 relative to the mounting table 6, an encoder 16 that measures the rotational angular velocity of the support 11, and the support 11. An electromagnetic clutch 17 for controlling the torque applied to the motor, and a rotary motor 18.

  An adsorption hole may be arranged on the surface of the holding unit 10 so that a portion of the flexible film 2 that is in contact is adsorbed by a vacuum source (not shown). It is preferable that the suction holes provided in the holding unit 10 are configured such that portions where the holding unit 10 and the flexible film 2 are in contact are sequentially sucked. Moreover, the contact surface with the flexible film 2 is a curved surface so that the holding | maintenance part 10 can hold | maintain the flexible film 2 in a curve. Moreover, the flexible film 2 currently hold | maintained at the holding | maintenance part 10 can also be peeled from the holding | maintenance part 10 by sending gas into the suction hole arrange | positioned on the surface of the holding | maintenance part 10 with the ventilation source which is not shown in figure.

  Although the material of the holding | maintenance part 10 is not specifically limited, It is an elastic body, such as a plastic, rubber | gum, a foamed plastic, and it is preferable to have cushioning properties. By providing cushioning properties, it is possible to prevent the flexible film 2 from being damaged, or to absorb the height of the electronic components connected to the circuit pattern on the flexible film 2 by elastic deformation. It is possible to prevent the flexible film 2 and the circuit pattern from being broken at the edge of the component. Further, when forming a recess corresponding to the electronic component in the holding unit 10, there is an effect that the flexible film 2 is not easily broken by the edge of the recess. However, if the holding portion 10 is too soft, the peeling of the flexible film 2 is difficult to progress uniformly in the direction perpendicular to the peeling progress direction. When electronic parts are mounted or when the transport hole (for example, sprocket hole) is provided in the flexible film 2, harmful effects are likely to occur. That is, uneven tension tends to occur in the direction perpendicular to the progress of peeling of the flexible film 2, and the flexible film 2 and the circuit pattern may be distorted and the positional accuracy may be impaired. On the other hand, if the holding portion 10 is too hard, when the concave portion corresponding to the electronic component is formed as described above, the flexible film is likely to be broken by the edge of the concave portion, and the circuit pattern is scratched by friction. May enter. Therefore, the material of the holding part 10 is preferably an elastic body having a JIS-A hardness of 30 ° to 80 °, and more preferably a JIS-A hardness of 40 ° to 70 °. Moreover, as for the material of the holding part 10, a material having tackiness such as a silicone resin accumulates the elongation of the flexible film as the peeling progresses, and the shift between the holding part 10 and the flexible film 2 is caused. Since the increase in the amount can be prevented, an increase in the peeling angle accompanying the progress of peeling can be suppressed, which is preferable. As a measure of tackiness, it is preferable that the peel strength in the 180 ° direction when the flexible film 2 is peeled from the holding portion 10 is 9.8 N / m or less.

The support 11 or the holding unit 10 that is in contact with the flexible film 2 is preferably antistatic or conductive in order to suppress the charging potential of the flexible film 2 due to peeling charging. When the charging potential is increased, a discharge may occur and the circuit pattern or electronic component may be damaged. Since the antistatic or conductive member is in contact with the surface opposite to the peeling surface of the flexible film 2, the potential can be lowered even if the charge generated on the peeling surface is the same. Discharging can be prevented. As the antistatic material, a plastic, rubber, foamed plastic, or the like containing a conductive material and having a surface resistance of 10 ¹² Ω or less can be employed.

  The holding portion 10 is provided with a radius of curvature that takes into account the amount of deformation and the peelability allowed for the flexible film 2 on which the circuit pattern is formed. However, a different radius of curvature may be given partially. If the radius of curvature is too small, the metal circuit pattern undergoes plastic deformation and curls, or the effect of reducing the stress at the end of the electronic component becomes insufficient. On the other hand, if the radius of curvature is too large, the force in the direction in which the flexible film 2 is stretched becomes larger than the force used to peel off the flexible film 2, and the circuit pattern or the flexible film 2 made of a metal film becomes too large. Causes plastic deformation. Accordingly, at least the lower limit value of the radius of curvature of a part of the holding unit 10 that contacts the flexible film 2 is preferably 20 mm or more, more preferably 30 mm or more, and even more preferably 50 mm or more. Moreover, as an upper limit of the magnitude | size of the one part curvature radius which contacts the flexible film 2 of the holding | maintenance part 10 at least, Preferably it is 1000 mm or less, More preferably, it is 800 mm or less, More preferably, it is 700 mm or less. In the present invention, the radius of curvature is the radius of a circle having the same curvature as the portion having the curvature.

  Further, the rotation of the support 11 and the horizontal movement of the frame 13 are performed independently by the rotation motor 18 and the linear motor 20, respectively, and the contact portion between the holding portion 10 and the flexible film 2 is in the horizontal direction (FIG. 1). It is controlled to move sequentially in the direction of the horizontal arrow in the middle.

  It is preferable that the range of the peeling angle which is an angle formed by the flexible film 2 and the reinforcing plate 4 being peeled is 1 ° or more and 80 ° or less. If the peeling angle is too large, the flexible film 2 may be folded at the peeling point. If a circuit pattern made of metal is formed on the flexible film 2, the circuit pattern may be folded or deformed. There are things to do. On the other hand, if the peel angle is too small, the force in the direction of stretching the flexible film 2 becomes too large compared to the force used to peel the flexible film 2, and the circuit pattern made of a metal film or the plasticity of the flexible film 2 is used. Cause deformation. Therefore, the range of the peel angle for peeling the flexible film 2 from the flexible film substrate 5 with low stress without distortion is preferably 1 ° or more and 80 ° or less, more preferably 2 ° or more and 70 ° or less, Most preferably, it is 5 ° or more and 60 ° or less.

  When the length from the center of the shaft 12 to the holding part 10 contacting the flexible film 2 on its holding surface is R, the holding part is obtained by multiplying this R by the rotational angular velocity observed by the encoder 16. 10 A rotational peripheral speed V1 on the holding surface is calculated. The rotational peripheral speed V1 on the flexible film holding surface of the support 11, that is, the surface of the holding part 10 is made larger than the relative moving speed V2 of the support 11 with respect to the mounting table 6, and V1 is supported by the torque limiting mechanism. It is preferable to perform control within a range not lower than V2 so that the torque applied to 11 does not exceed a predetermined value. By controlling in this way, the expansion of the peeling angle due to the elongation of the flexible film 2 is suppressed, and stable peeling progress and the deformation of the flexible film 2 and the circuit pattern formed thereon are suppressed. Can be suppressed.

  V1, V2 and torque can be controlled by mechanical, electronic, or a combination of both. As the mechanical torque control system, a system called a slip ring can be adopted, which is preferable in terms of simplicity. The electronic torque control method can be realized by a combination of a torque sensor and a servo motor as shown in FIG. 2, and is preferable in terms of high control accuracy and high control freedom. The initial setting values of V1 and V2 are preferably set so that V1 / V2 is 1.01 or more. The torque limit set value is set in a range that is sufficient to prevent the peeling angle from increasing with the progress of peeling and that the circuit pattern made of metal or the flexible film 2 does not cause plastic deformation. It should be selected appropriately depending on the material, width, and thickness of the flexible film 2. As described above, in the peeling apparatus 1, V1 / V2> 1 is set, and further, control for limiting the working tension to the flexible film 2 is performed by the control apparatus 8 by torque control using the electromagnetic clutch 17, as well as holding. It can also be performed by speed control of the rotational peripheral speed V1 on the holding surface of the portion 10 and the relative movement speed V2 of the frame 13. In this case, the speed control means that the supply voltage to the electromagnetic clutch 17 is first increased to increase the limit torque so that the rotation of the support 11 does not slip with respect to the rotation of the rotary motor 18, and V1 / V2. The rotational speed of the rotary motor 18 and the relative movement speed V2 of the frame 13 by the linear motor 20 are controlled so that the value becomes an appropriate value of 1 or more. If V1 / V2 increases, the acting tension on the flexible film 2 increases. Therefore, V1 / V2 is determined so that the tension is limited. Either speed control or torque control may be used, but in the case of torque control, the elongation of the flexible film 2 is accumulated due to the progress of peeling for a long time, thereby preventing the peeling angle from increasing. The flexible film 2 on which the circuit pattern is always formed can be peeled off with low stress.

  As a specific method of relatively moving the support 11 and the reinforcing plate 4 in the direction in which the tension is applied to the flexible film 2 without rotating the support 11, the rotational peripheral speed V 1 of the support 11 is set to 0. In other words, there is a method of controlling the relative movement speed V2 of the frame 13 to a predetermined value. At this time, it is preferable to provide precise torque control so that the flexible film 2 is deformed by excessive tension, or unintended peeling does not proceed.

  As a specific method for relatively moving the support 11 in the direction in which the tension is applied to the flexible film 2 without changing the relative position between the support 11 and the reinforcing plate 4, the relative movement speed V2 of the frame 13 can be used. For example, the rotational peripheral speed V1 of the support 11 may be controlled to a predetermined value by setting 0 to 0. At this time, it is preferable to provide precise torque control so that the flexible film 2 is deformed by excessive tension, or unintended peeling does not proceed.

  As a gripping means for bringing the flexible film 2 along the holding unit 10, a gripping means 51 independent of the support 11 as shown in FIG. 5 can be provided. In FIG. 5, the peeling auxiliary member 50 connected to one end of the flexible film 2 and projecting from the reinforcing plate 4 is gripped by the gripping means 51, and the flexible film 2 is placed along the holding portion 10 on the support 11. Applying tension. When the gripping means 51 independent of the support 11 is used, the gripping means 51 is moved to the right in FIG. 5 without rotating the support 11 or changing the relative position between the support 11 and the reinforcing plate 4. By moving in the direction, the flexible film 2 can be brought into close contact with the support 11. At this time, it is preferable to provide precise tension control so that the flexible film 2 is deformed by excessive tension, or unintended peeling does not proceed. After the flexible film 2 is brought into close contact with the support 11 or the holding unit 10, gripping of one end of the flexible film 2 or one end of the peeling auxiliary member 50 is performed from the gripping means 51 to the gripping means fixed to the support 11. After the transfer, the support 11 is rotated to peel the flexible film 2 from the reinforcing plate 4. Further, the gripping means 51 and the support 11 are moved in synchronization with the gripping means 51 while gripping one end of the flexible film 2 or one end of the peeling assisting member 50, so that the flexible film 2 becomes the support. It can also be peeled off from the reinforcing plate 4 along.

  In this invention, peeling force is measured by 180 degree direction peel strength when peeling the 1-cm-wide flexible film bonded with the reinforcement board through the peelable organic substance layer. The peeling speed when measuring the peeling force is 300 mm / min. In the present invention, in order to control the above-described peeling angle within an optimum range, the peeling force is preferably in the range of 0.098 N / m to 98 N / m.

  Since the mounting table 6 can freely move up and down, when the flexible film 2 and the reinforcing plate 4 are peeled off, the mounting table 6 is raised to a position where the flexible film 2 and the holding unit 10 come into contact with each other with a constant pressure and stopped. . On the other hand, the mounting table 21 is provided for mounting the flexible film 2 adsorbed on the holding unit 10 of the peeling unit 7 on the mounting table 21. That is, after the peeling is completed, the peeling unit 7 moves to the mounting table 21 as indicated by the broken line in FIG. 1 while adsorbing the flexible film 2. The mounting table 21 is raised so that the distance between the holding unit 10 and the mounting table 21 is preferably 0.1 to 3 mm, more preferably 0.1 to 1 mm, the suction is released, and the flexible film 2 is removed. It is released from the holding unit 10 and is mounted on the mounting table 21.

Next, although the peeling method of the flexible film 2 using the peeling apparatus 1 is demonstrated using FIG.1, FIG.2, FIG.3, this invention is not limited to this.
After lowering the mounting table 6 to the lowest point, the mounting table 6 is placed with the flexible film substrate 5 on the lower side (that is, the flexible film 2 on the upper side) by transfer means (not shown). Placed on. Subsequently, a vacuum source (not shown) is operated to hold the flexible film substrate 5 on the mounting table 6 by suction. The flexible film 2 is prepared such that the end portion on the peeling start side protrudes beyond the reinforcing plate 4. Or the peeling auxiliary member 50 (FIG. 5) which one end was connected to the flexible film 2 and overhang | projected from the reinforcement board 4 is prepared. The movement of the frame 13 and the rotational movement of the support 11 are performed so that the starting point S of the holding unit 10 of the peeling unit 7 is positioned directly above the right end of the flexible film 2 located on the reinforcing plate 4 in the drawing. Let it be done. When the positioning of the holding unit 10 is completed, the mounting table 6 is raised, and the right end of the flexible film 2 and the starting point S of the holding unit 10 are brought into contact with each other with a predetermined pressure. The pressure is preferably 0.001 to 1 MPa, more preferably 0.01 to 0.2 MPa. The flexible film 2 or the peeling assisting member 50 (FIG. 5) protruding from the reinforcing plate 4 is bent toward the support 11 by gripping means (not shown), and the flexible film end is fixed to the fixing component 19 and the support 11. Pinch and fix between. At this time, the larger angle 31 between the curved portion of the support 11 shown in FIG. 3 and the flat portion for fixing the end of the flexible film 2 resists the tension acting on the flexible film being peeled. Thus, the force for gripping the flexible film 2 is increased. That is, it is possible to prevent the thin flexible film 2 from slipping out from under the fixing component 19. On the other hand, if the angle is too large, the flexible film 2 near the bend is separated from the holding portion 10 due to the elasticity of the flexible film 2, and the peeling near the start of peeling becomes unstable. It is preferably 45 ° or more and 135 ° or less, and more preferably 60 ° or more and 120 ° or less.

  Next, with the relative position of the frame 13 and the mounting table 6 fixed, the support 11 is rotated to apply tension to the flexible film 2 to bring the holding unit 10 and the flexible film 2 into close contact. Thereafter, the leftward movement of the frame 13 and the left rotation of the support 11 are advanced. At this time, the rotational peripheral speed V1 on the surface of the holding unit 10 is set to be larger than the relative movement speed V2 of the support 11 with respect to the mounting table 6, and V1 is a torque limiting mechanism that causes the torque applied to the support 11 to be a predetermined value. Is controlled within a range not to be lower than V2. By sequentially bringing the curved surface of the holding portion 10 into contact with the upper surface of the flexible film 2 from the right side in FIG. 1, the flexible film 2 is sequentially curved from the right side. The two are peeled sequentially from the right side. When the final point E of the holding part 10 reaches the left end of the flexible film 2 and comes into contact with the flexible film 2, the peeling is completed. The flexible film that has passed the peeling point may be held by providing a suction hole in the holding portion, or the holding portion 10 can be held using a tacky rubber. In addition, it is possible to follow the holding portion only with the tension applied to the flexible film 2. When the peeling is completed, the movement of the frame 13 and the rotation of the support 11 are stopped, and the mounting table 6 is lowered so that the flexible film 2 and the reinforcing plate 4 are completely separated. These mechanisms correspond to the curve separating means in the present invention.

  Thereafter, the peeling unit 7 is moved to the right and positioned so that the flexible film 2 held by the holding unit 10 is directly above the mounting table 21. Then, it transfers to the mounting base 21 by means according to the holding method of the flexible film 2. Next, the separated flexible film 2 and the reinforcing plate 4 on the mounting table 6 are transferred to the next step by a transfer device (not shown). The reinforcing plate 4 is transferred after releasing the suction. The peeling unit 7 is returned to the original position, and thereafter the same operation is repeated to peel the next flexible film substrate 5.

  In order to reduce the peeling force of the peelable organic substance layer 3, it is preferable that the mounting table 6 is provided with a heating device inside or above. For the same purpose, it is preferable that a heating device is provided to the support 11 or the holding unit 10. In order to sufficiently reduce the peeling force, it is preferable that the heating temperature is high. However, if the heating temperature is too high, the organic layer is denatured and it is difficult to remove the organic layer remaining on the flexible film 2 after peeling. Therefore, the heating temperature of the peelable organic layer 3 is preferably 30 ° C. or higher and 280 ° C. or lower.

  FIG. 4 shows an example of another preferred embodiment of the peeling unit of the peeling apparatus 1. After bending one end of the flexible film 2 or one end of the peeling auxiliary member 45 bonded to one end of the flexible film 2 along the notch portion of the support body 41, the support body 41 and the fixing component 46 Insert and fix. The holding portion 42 provided on the surface of the support body 41 is provided with a recess 43 and accommodates the electronic component 44 bonded to the flexible film 2. Instead of providing the concave portion 43, the holding portion 42 can be formed of a cushioning resin to absorb the height of the electronic component. As an example of the size of the recess 43, the depth is 0.5 to 2 mm, and the length and width are 1 to 20 mm. Further, the shape of the recess 43 may be a groove shape in which a plurality of electronic components are accommodated, and the direction of the groove may be parallel to the curvature direction of the holding portion 42 or the curvature direction of the holding portion 42. They may be orthogonal. Further, a suction hole may be provided in the bottom surface of the recess 43, and the bottom surface and the electronic component may be in contact with each other so that the electronic component 44 can also be sucked and fixed to the holding portion. Further, the holding portion 42 can be made of a flexible material having micropores that can be vacuum-sucked, and the electronic component 44 can be embedded in the material and fixed by suction.

  In the present invention, an example of a method of peeling the flexible film while rotating the support after the flexible film or the peeling auxiliary member is slid on the support while being along the support will be described with reference to FIG. To do. One end of the flexible film 2 or the peeling assisting member 45 is sandwiched and gripped by the fixing component 46 and the support body 41. This gripping force is controlled, and the flexible film 2 does not cause plastic deformation. The flexible film 2 or the peeling assisting member 45 is gripped so as to be able to slide between the fixing component 46 and the support body 41 with the tension of. Next, the direction in which the support 41 is tensioned to the flexible film 2 while fixing the relative position between the mounting table 6 fixing the reinforcing plate 4 and the support 41 (counterclockwise in FIG. 4). The flexible film 2 or the peeling assisting member 45 is slid on the holding portion 42 on the surface of the support 41. When the flexible film 2 or the peeling assisting member 45 is slid on the holding portion 42 in a state where tension is applied, the flexible film 2 or the peeling assisting member is self-aligned in an attempt to make the tension uniform in the width direction. 45 parallel projections can be made. A shorter distance for sliding the flexible film 2 or the peeling assisting member 45 is preferable for enhancing productivity, while a longer distance is preferable for ensuring parallelism, so a range of 1 mm to 50 mm is preferable. The range of 2 mm to 20 mm is more preferable. Next, the gripping force between the fixing component 46 and the support body 41 is increased, and the flexible film 2 or the peeling assisting member 45 is completely gripped and fixed. Thereafter, the leftward movement of the support body 41 and the left rotation of the support body 41 are advanced to peel the flexible film 2 from the reinforcing plate 4. If the parallel projection is insufficient, the tension in the width direction of the flexible film 2 being peeled becomes uneven, and the portion where the strong tension is applied is plastically deformed and the position accuracy of the circuit pattern after peeling is impaired. . Further, the flatness may be impaired. The above parallelism can be realized with mechanical accuracy. However, the flexible film 2 or the peeling assisting member 45 can be slid on the support body 41 along the support body 41 and then rotated while the support body 41 is rotated. By peeling the flexible film 2, parallelism can be performed more reliably and with a simple device.

  FIG. 5 shows an example of another preferred embodiment of the peeling unit of the peeling apparatus 1. A gripping means 51 independent of the support 11 grips one end 50 of the flexible film or the peeling assisting member 50. The flexible film 2 is brought into close contact with the support 11 by relatively moving the gripping means 51 and the reinforcing plate 4, that is, the mounting table 6 that adsorbs the reinforcing plate 4, in a direction in which tension is applied to the flexible film 2. . Thereafter, the leftward movement of the support 11 and the left rotation of the support 11 are advanced, and the flexible film 2 is peeled from the reinforcing plate 4. The gripping means 51 is moved in accordance with the rotation and leftward movement of the support 11 while maintaining the relative positional relationship (distance, angle) with the S point of the support 11. Further, after applying tension to the flexible film 2 to bring it into close contact with the support 11, the flexible film is bent toward the support 11 using the gripping means 51, and the same fixing unit as that of the peeling unit of FIG. 1 is used. It is also possible to sandwich and fix between the component 19 and the support 11, and to peel the flexible film 2 from the reinforcing plate 4 by moving the support 11 to the left and rotating the support 11 to the left. .

  Examples of the reinforcing plate 4 used in the present invention include plates made of inorganic glass such as soda lime glass, borosilicate glass, and quartz glass, ceramics such as alumina, silicon nitride, and zirconia, stainless steel, Invar alloy, and titanium. Those having a small linear expansion coefficient and hygroscopic expansion coefficient such as a plate made of metal or glass fiber reinforced resin are preferable. Among them, a plate made of inorganic glass and metal is preferable in that appropriate flexibility can be easily obtained. In addition, it has excellent heat resistance and chemical resistance, has a large area with high surface smoothness and is easily available at low cost, is difficult to plastically deform, and is less likely to generate particles due to contact with a transport device A plate made of an inorganic glass is particularly preferable because it is an insulator and does not deposit by electrolytic plating.

  When a glass substrate having a small thickness is used for the reinforcing plate 4, warping and twisting increase due to the expansion / contraction force of the flexible film 2, and the glass substrate may be cracked when vacuum-adsorbed on a flat mounting table. Further, the flexible film 2 is deformed by vacuum adsorption / desorption, and it is difficult to ensure the positional accuracy. On the other hand, in a glass substrate having a large thickness, it becomes difficult to bend due to peeling, and flatness is lowered due to uneven thickness, and exposure accuracy is also lowered. In addition, the handling load by the robot or the like becomes large, and it becomes impossible to operate quickly, resulting in a decrease in productivity and an increase in transportation cost. From these points, the thickness of the glass substrate is preferably in the range of 0.3 mm to 1.1 mm.

  When a metal substrate with a small thickness is used for the reinforcing plate 4, warping and twisting increase due to the expansion / contraction force of the flexible film, making it impossible to vacuum-suck on a flat mounting table, and warping or twisting of the metal substrate occurs As the flexible film 2 is deformed by this amount, the predetermined positional accuracy cannot be ensured. Also, if there is a fold, it becomes a defective product at that time. On the other hand, in the case of a metal substrate having a large thickness, flatness is lowered due to uneven thickness, and it is difficult to bend for peeling, and the exposure accuracy is also lowered. In addition, the handling load by the robot or the like becomes large, and it becomes impossible to operate quickly, resulting in a decrease in productivity and an increase in transportation cost. Therefore, the thickness of the metal substrate is preferably in the range of 0.1 mm to 0.7 mm.

  In the present invention, a plastic film is used as the flexible film 2. For example, films such as polycarbonate, polyether sulfide, polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyimide, polyamide, and liquid crystal polymer can be employed. Among these, a polyimide film is preferably used because it is excellent in heat resistance and chemical resistance. In addition, a liquid crystal polymer is preferably used in terms of excellent electrical characteristics such as low dielectric loss and low hygroscopicity. It is also possible to employ a flexible glass fiber reinforced resin plate. Moreover, these films may be laminated | stacked.

  Examples of the resin for the glass fiber reinforced resin plate include epoxy, polyphenylene sulfide, polyphenylene ether, maleimide (co) polymer resin, polyamide, and polyimide.

  The thickness of the flexible film 2 is preferably thinner for weight reduction, size reduction, or formation of fine via holes, while the thickness of the flexible film 2 is thicker for ensuring mechanical strength and maintaining flatness. Is preferable, the range of 4 μm to 125 μm is preferable.

  The peeling assisting member used in the present invention can be the same as the flexible film 2 described above, but mechanical strength is important and heat resistance and chemical resistance are unnecessary, so a cheaper polypropylene film. Etc. can be adopted. Moreover, it is preferable that the adhesive layer is provided for fixation with the flexible film end, and it is particularly preferable that the adhesive layer is provided only at the fixing portion with the flexible film end.

  As the peelable organic layer 3 used in the present invention, an adhesive or a pressure-sensitive adhesive is used. Examples of the peelable adhesive or pressure-sensitive adhesive include a pressure-sensitive adhesive called an acrylic or urethane-based re-peeling agent. The flexible film 2 has sufficient adhesive strength during processing, can be easily peeled off at the time of peeling, and does not cause distortion in the flexible film substrate 5, so that it has an adhesive strength in a region called weak adhesive to medium adhesive. Is preferred. A silicone resin having tackiness can also be used. It is also possible to use an epoxy resin having tackiness.

  As organic materials that can be peeled, those whose adhesive strength and adhesive strength are reduced at low temperatures, those whose adhesive strength and adhesive strength are reduced by ultraviolet irradiation, and those whose adhesive strength and adhesive strength are reduced by heat treatment are suitably used. . Among these, those caused by ultraviolet irradiation are preferable because of large changes in adhesive strength and adhesive strength. An example of a material whose adhesive strength and adhesive strength are reduced by ultraviolet irradiation is a two-component cross-linking acrylic pressure-sensitive adhesive. Examples of those in which adhesive strength and adhesive strength decrease in a low temperature region include acrylic pressure-sensitive adhesives that reversibly change between a crystalline state and an amorphous state, and are preferably used.

  If the thickness of the peelable organic material layer 3 used in the present invention is too thin, the planarity will be deteriorated, and the peel force will be greatly reduced, resulting in uneven peel strength due to uneven film thickness. It is preferable that it is above, and it is more preferable that it is 0.3 μm or more. On the other hand, if the peelable organic material layer 3 is too thick, the anchoring strength of the organic material layer 3 on the flexible film 2 is improved and the adhesive strength becomes too strong. Therefore, it is preferably 10 μm or less, and 20 μm or less. More preferably it is. When an electronic component is bonded to the circuit pattern on the flexible film 2 fixed via the peelable organic layer 3 on the reinforcing plate 4, the peelable organic substance is used to suppress the change in the thickness direction of the circuit pattern. The layer thickness is preferably 5 μm or less. When the peelable organic material layer 3 is thick, when the electronic component is heated and pressed, the amount of deformation of the peelable organic material layer 3 is large, the circuit pattern of the joint portion sinks, and a problem occurs in the reliability of the wiring circuit. is there. When the sinking is large, the circuit pattern may come into contact with the edge of the electronic component to cause a short circuit. The sinking is preferably 6 μm or less, and more preferably 3 μm or less in order to ensure the reliability of the wiring circuit.

  Considering that the flexible film 2 and the reinforcing plate 4 are peeled off, the adhesive force between the peelable organic layer 3 and the reinforcing plate 4 is greater than the peelable organic layer 3 and the flexible film 2. It is preferable that it is larger than the adhesive strength. As a method for controlling the adhesive strength on both sides in this way, for example, there is a method using aging of an adhesive. That is, a surface with reduced adhesive strength can be obtained by applying a pressure-sensitive adhesive on the side where the adhesive strength is to be increased, and then proceeding with crosslinking for a predetermined period in a state where the air is shut off.

Although the manufacture example of the flexible film board | substrate 5 in the manufacturing method of the circuit board of this invention is demonstrated below, this invention is not limited to this.
A peelable organic material is applied to soda lime glass having a thickness of 1.1 mm using a spin coater, a blade coater, a roll coater, a bar coater, a die coater, screen printing, or the like. Use of a die coater is preferable in order to uniformly apply to a single-wafer substrate sent intermittently. After applying the peelable organic material, drying is performed by heat drying or vacuum drying to obtain a peelable organic material layer having a thickness of 2 μm. An air barrier film made of a release film (a silicone resin layer is provided on a polyester film) is bonded onto the applied peelable organic layer and left at room temperature for 1 week. This period is called aging, and the cross-linking of the peelable organic substance proceeds and the adhesive force gradually decreases. The standing period and the storage temperature are selected so that a desired adhesive strength can be obtained. Instead of laminating the air blocking film, it can be stored in a nitrogen atmosphere or in a vacuum. It is also possible to apply a peelable organic substance to a long film substrate, dry it, and then transfer it to a reinforcing plate.

  Next, a polyimide film having a thickness of 25 μm is prepared. The air blocking film on the glass substrate is peeled off, and the polyimide film is bonded to the glass substrate. As described above, a metal layer (which may be a circuit pattern on the bonding surface) may be formed in advance on one or both surfaces of the polyimide film. The polyimide film may be pasted in a cut sheet having a predetermined size, or may be pasted and cut while being unwound from a long roll. For such a pasting operation, the polyimide film is held on the surface of the flexible planar body proposed by the present inventors in the pamphlet of International Publication No. 03/009657, and then pressed against the glass substrate. A method of laminating a polyimide film on the glass substrate side with high accuracy and stress can be suitably employed.

  Such a laminating apparatus will be described with reference to FIG. FIG. 6 is a schematic front view of the laminating apparatus 100. The flexible sheet 102 is charged by the electrostatic withstand device 104 to adsorb the polyimide film 2. A flexible fabric or thin film can be used for the flexible planar body 102 and is fixed to the frame body 113. Further, the electrostatic charging device 104 is supported by a support column 115 on the base 105, and the support column 115 is electrostatically charged with the frame body 113 and the mounting table 101 that move to the left and right in FIG. The device 104 moves so as not to interfere. Next, the glass substrate 4 coated with the peelable organic material layer 3 is held on the mounting table 101 by vacuum suction or the like. The polyimide film 2 is pressed against the peelable organic material layer 3 together with the flexible planar body 102 with a squeegee 103, and the polyimide film 2 is transferred to the glass substrate 4 side. The squeegee 103 is held by a squeegee holder 114 and can move and move up and down. The mounting table 101 can be moved left and right in the figure by a rail 106, a guide 107, a nut 108, a ball screw 111 supported by support plates 109 and 110, and a motor 112.

  When the metal layer is not provided on the surface opposite to the bonding surface of the polyimide film 2, the metal layer is formed by a full additive method or a semi-additive method. Furthermore, if necessary, plating with gold, nickel, tin or the like is performed to obtain a circuit pattern.

  Further, in the circuit pattern formation, a connection hole can be provided in the polyimide film 2. That is, it is possible to provide a via hole for making an electrical connection with the metal layer provided on the bonding surface side, or to provide a ball placement hole for the ball grid array. Laser holes and chemical etching can be employed as the method for providing the connection holes. When electrical connection is made, it is preferable that after the connection hole is formed, the inner surface of the hole is made into a conductor by plating at the same time as the circuit pattern is formed. The diameter of the connection hole for electrical connection is preferably 15 μm to 200 μm. The diameter of the hole for installing the ball is preferably 50 μm to 800 μm, more preferably 80 μm to 800 μm.

  If necessary, a solder resist layer is formed on the circuit pattern. As the solder resist, a photosensitive solder resist or a thermosetting solder resist is preferable. Among these, it is more preferable to use a photosensitive solder resist for the fine circuit pattern. A photosensitive solder resist is applied onto the circuit pattern with a spin coater, blade coater, roll coater, bar coater, die coater, screen printing machine, etc., dried, and then exposed to ultraviolet rays through a predetermined photomask and developed. Thus, a solder resist pattern is obtained. Next, curing is performed at 100 ° C. to 200 ° C.

  Next, electronic components such as an IC chip, a resistor and a capacitor are mounted on the formed circuit pattern. The means for mounting the electronic component is preferably performed using an apparatus that has an optical position detection function and a positioning function such as a movable stage and can ensure mounting accuracy.

  In addition, as a method of connecting the electronic component and the circuit board, a metal layer such as tin, gold, or solder formed on the connection portion of the circuit board and a metal layer such as gold or solder formed on the connection portion of the electronic component The method of thermocompression bonding and metal bonding, the circuit board and the electronic circuit while crimping the metal layer of tin, gold, solder, etc. at the connection part of the circuit board and the metal layer of gold, solder, etc. formed at the connection part of the electronic component Examples include a method in which an anisotropic conductive adhesive or non-conductive adhesive disposed between components is cured and mechanically joined.

  In order to protect the circuit pattern and peel the flexible film 2 without distortion, it is preferable to form a protective layer on the entire surface or part of the flexible film substrate 5. That is, by forming the protective layer, an effect of suppressing an excessive increase in the peel angle at the time of peeling the flexible film 2 can be obtained. The same effect can be obtained by providing a protective layer on the flexible film 2 and removing the protective layer after peeling the flexible film 2. The protective layer may be formed by laminating a film-like member or coating a liquid material. When the protective layer is liquid, the solution is applied onto the flexible film substrate with a spin coater, blade coater, roll coater, bar coater, die coater, screen printer, curtain coater, and the like, and dried. Furthermore, the protective layer may be removed by dissolving with water or a solvent after peeling the circuit board from the reinforcing plate, and is preferably a solder resist from the viewpoint of having the function.

  Also, the normal circuit pattern has a bias in the wiring direction, and the distribution is often such that the longitudinal direction of the wiring is aligned with a specific direction. In such a case, it is preferable to peel in a direction perpendicular to the direction in which many longitudinal directions of the wiring are arranged, since deformation of the film can be reduced.

  After connecting the circuit board and the electronic component, the circuit board and the glass substrate are peeled using the peeling method of the present invention. The circuit board on which the electronic component is mounted can be peeled off from the glass substrate after the polyimide film with a circuit pattern is cut into pieces or an assembly of pieces using a laser, a high-pressure water jet, a cutter, or the like.

  In the present invention, it is allowed to insert a resistance element or a capacitance element into the circuit pattern as appropriate. In addition, an insulating layer and a wiring layer can be laminated on at least one surface of the flexible film substrate to form a multilayer.

  Since the present invention is particularly effective for securing the mounting accuracy of a large-scale LSI having a small connection pitch and a large number of pins, the LSI package form (mounting form) is not particularly limited, such as a bare chip, a ball grid array type, etc. It can be applied to both.

  The use of the circuit board obtained by the production method of the present invention is not particularly limited, but it is preferably used for a wiring board of an electronic device, an IC package interposer, a wafer level burn-in socket wiring board, and the like.

  Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited thereto.

Example 1
As a flexible film, a long polyimide film having a thickness of 25 μm (“Kapton” 100EN manufactured by Toray Du Pont Co., Ltd.) was prepared. Using a reel-to-reel type sputtering apparatus compatible with long films, a 15 nm thick chromium: nickel = 5: 95 (weight ratio) alloy film and a 150 nm thick copper film were laminated in this order on a polyimide film. .

  A 1.1 mm thick, 300 mm square soda lime glass prepared as a reinforcing plate is coated with a die coater with an ultraviolet curing adhesive “SK Dyne” SW-22 (manufactured by Soken Chemical Co., Ltd.) and a curing agent L45 (Soken Chemical ( Co.) was mixed at 100: 3 (weight ratio) and dried at 80 ° C. for 2 minutes. The peelable organic layer thickness after drying was 2 μm. Next, an air-blocking film (a film in which a silicone resin layer that can be easily released on a polyester film) was bonded to the organic layer, and left for one week.

After the air blocking film was peeled off, a polyimide film provided with a metal layer on an organic layer that can be peeled off with a low stress and high precision laminator shown in FIG. A polyimide film provided with a metal layer was cut into 300 mm square in advance. The flexible planar body 102 made of polyester mesh was charged by the electrostatic withstand voltage device 104 to adsorb the polyimide film 2. Next, the glass substrate 4 coated with the peelable organic material layer 3 was held on the mounting table 101 by vacuum suction or the like. The polyimide film 2 was pressed against the peelable organic layer 3 together with the flexible planar body 102 with a squeegee 103, and the polyimide film 2 was transferred to the glass substrate 4 side. Thereafter, ultraviolet rays were irradiated from the glass substrate side at 1000 mJ / cm ² to cure the organic layer.

  A positive photoresist was applied onto the copper film with a spin coater and dried at 80 ° C. for 10 minutes. The photoresist was exposed and developed through a photomask to form a photoresist layer having a thickness of 12 μm in a portion where a plating film was unnecessary.

  The test photomask pattern had the following shape. That is, as inner leads, 772 wirings (width 10 μm, length 5 mm) per side were arranged at a pitch of 25 μm on two long sides of a rectangle of 19.3 mm × 2.5 mm. This unit was regarded as one unit, and the units were evenly arranged in 7 rows and 7 columns at a pitch of 40 mm on a 300 mm square substrate.

  Next, a copper layer having a thickness of 8 μm was formed by electrolytic plating in a copper sulfate plating solution using the copper film as an electrode. The photoresist was stripped with a photoresist stripping solution, and then the copper film and the chromium-nickel alloy film that were under the resist layer were removed by soft etching with a hydrogen peroxide-sulfuric acid aqueous solution. Subsequently, a tin layer having a thickness of 0.4 μm was formed on the copper plating film by electroless plating to obtain a circuit pattern.

  When measuring the center distance in the width direction (design value 19.3 mm) of the outermost inner lead of one unit described above with a length measuring machine SMIC-800 (manufactured by Sokkia Co., Ltd.), all units were designed. The position accuracy was within ± 1 μm (± 0.005%), and the positional accuracy was very good.

  A polyester film having a thickness of 25 μm, a width of 300 mm, and a length of 100 mm was prepared as a peeling auxiliary member. Both sides were fixed with an adhesive tape in a state in which one side of the peeling assisting member was superposed on one side of the polyimide film on which the circuit pattern was formed.

  Using the peeling apparatus 1 shown in FIG. 1, the polyimide film with a circuit pattern was peeled from the glass substrate. The curvature radius of the curved surface of the holding part 10 was 80 mm, and a silicone rubber having a JIS-A hardness of 50 ° was used. A polyimide film with a circuit pattern was placed on the mounting table 6 such that the reinforcing plate was on the lower surface, and vacuum suction was performed at 100 hPa. The movement of the frame 13 and the rotational movement of the support 11 are performed so that the starting point S of the holding unit 10 of the peeling unit 7 is positioned slightly to the right of the right end of the flexible film 2 located on the reinforcing plate 4 in the drawing. I did it. After the positioning of the holding part 10 was completed, the mounting table 6 was raised, and the right end of the flexible film 2 and the holding part 10 were pressed at 0.01 MPa. Next, one end of the peeling assisting member was gripped between the fixing component 19 and the support 11. At this time, the bending angle of the peeling assisting member was 100 °. While supporting the voltage supplied to the electromagnetic clutch 17 so that the maximum tension applied to the polyimide film and the peeling auxiliary member is 160 N / m, the support 11 can be rotated in the direction of the arrow while the frame 13 is fixed. The flexible film 2 was adhered to the holding part 10 on the surface of the support 11.

  The right side moving speed when peeling the frame 13 is 0.3 m / min, the rotating peripheral speed of the holding part is 0.31 m / min, and the holding part is rotated when the tension applied to the polyimide film is 160 N / m or more. The flexible film 2 was peeled from the reinforcing plate 4 by moving the support 11 to the left and rotating the support 11 to the left while controlling the peripheral speed to decrease toward the moving speed of the frame. By removing the slack of the peeling auxiliary member before peeling, the peeling angle between the reinforcing plate and the flexible film can be suppressed to 20 ° or less from the beginning of peeling, and the polyimide film with a circuit pattern after peeling can be broken or The curl was not seen and the flatness was good.

  With a length measuring machine SMIC-800 (manufactured by Sokkia Co., Ltd.), for the unit on the polyimide film after peeling, the distance between the centers of the outermost inner leads in the width direction (design value 19.3 mm) was measured. In this unit, the position accuracy was within ± 2 μm (± 0.01%) with respect to the design value, and the position accuracy was very good.

Example 2
A circuit pattern was obtained in the same manner as in Example 1. A polyester film having a thickness of 25 μm, a width of 300 mm, and a length of 100 mm was prepared as a peeling auxiliary member. Both sides were fixed with an adhesive tape in a state in which one side of the peeling assisting member was superposed on one side of the polyimide film on which the circuit pattern was formed. Using the peeling apparatus 1 shown in FIG. 1, the polyimide film with a circuit pattern was peeled from the glass substrate. The curvature radius of the curved surface of the holding part 14 was 80 mm, and silicone rubber having a JIS-A hardness of 50 ° was used. A polyimide film with a circuit pattern was placed on the mounting table 6 such that the reinforcing plate was on the lower surface, and vacuum suction was performed at 100 hPa. The movement of the frame 13 and the rotational movement of the support 11 are performed so that the starting point S of the holding unit 10 of the peeling unit 7 is positioned slightly to the right of the right end of the flexible film 2 located on the reinforcing plate 4 in the drawing. I did it. After the positioning of the holding part 10 was completed, the mounting table 6 was raised, and the right end of the flexible film 2 and the holding part 10 were pressed at 0.01 MPa. Next, one end of the peeling assisting member was gripped between the fixing component 19 and the support 11. At this time, the bending angle of the peeling assisting member was 100 °. While controlling the supply voltage to the electromagnetic clutch 17 so that the maximum tension applied to the polyimide film and the peeling assisting member is 160 N / m, the frame 13 can be moved to the right while keeping the support 11 from rotating. The flexible film 2 was adhered to the holding part 10 on the surface of the support 11.

  The right side moving speed when peeling the frame 13 is 0.3 m / min, the rotating peripheral speed of the holding part is 0.31 m / min, and the holding part is rotated when the tension applied to the polyimide film is 160 N / m or more. The flexible film 2 was peeled from the reinforcing plate 4 by moving the support 11 to the left and rotating the support 11 to the left while controlling the peripheral speed to decrease toward the moving speed of the frame. By removing the slack of the peeling auxiliary member before peeling, the peeling angle between the reinforcing plate and the flexible film can be suppressed to 20 ° or less from the beginning of peeling, and the polyimide film with a circuit pattern after peeling can be broken or The curl was not seen and the flatness was good. In the same manner as in Example 1, the distance between the centers of the outermost inner leads in the width direction (design value 19.3 mm) was measured for the units on the polyimide film after peeling. The positional accuracy was very good within ± 2 μm (± 0.01%).

Example 3
A circuit pattern was obtained in the same manner as in Example 1. A polyester film having a thickness of 25 μm, a width of 300 mm, and a length of 100 mm was prepared as a peeling auxiliary member. Both sides were fixed with an adhesive tape in a state in which one side of the peeling assisting member was superposed on one side of the polyimide film on which the circuit pattern was formed. Instead of the peeling unit of the peeling apparatus in FIG. 1, a peeling unit having the gripping means 51 shown in FIG. 5 was used. The curvature radius of the curved surface of the holding part 10 was 80 mm, and a silicone rubber having a JIS-A hardness of 50 ° was used. A polyimide film with a circuit pattern was placed on the mounting table 6 such that the reinforcing plate was on the lower surface, and vacuum suction was performed at 100 hPa. The gripping means 51 grips one end of the peeling assisting member. The frame 13 and the support 11 are rotated so that the starting point S of the holding unit 10 of the peeling unit 7 is positioned to the right of the right end of the flexible film 2 located on the reinforcing plate 4 in the drawing. I let them. After the positioning of the holding part 10 was completed, the mounting table 6 was raised, and the right end of the flexible film 2 and the holding part 10 were pressed at 0.01 MPa. While the position of the reinforcing plate 4 is fixed, the gripping means 51 is pulled in the tangential direction of the starting point S of the support 11 while controlling the maximum tension applied to the polyimide film and the peeling assisting member to be 160 N / m. The member 50 was brought into close contact with the holding unit 10 on the surface of the support 11.

  The rightward moving speed at the time of peeling the frame 13 is 0.3 m / min, the rotation peripheral speed of the holding part is 0.31 m / min, and the gripping means 51 is rotated around the shaft 12 in accordance with the rotation of the holding part. It was. When the tension applied to the polyimide film is 160 N / m or higher, the rotation of the support 11 and the gripping means is controlled to decrease toward the moving speed of the frame, while the support 11 is moved leftward and the support. The flexible film 2 was peeled from the reinforcing plate 4 by the left rotation of 11. By removing the slack of the peeling auxiliary member before peeling, the peeling angle between the reinforcing plate and the flexible film can be suppressed to 20 ° or less from the beginning of peeling, and the polyimide film with a circuit pattern after peeling can be broken or The curl was not seen and the flatness was good. In the same manner as in Example 1, the distance between the centers of the outermost inner leads in the width direction (design value 19.3 mm) was measured for the units on the polyimide film after peeling. The positional accuracy was very good within ± 2 μm (± 0.01%).

Example 4
A circuit pattern was obtained in the same manner as in Example 1. A polyester film having a thickness of 25 μm, a width of 300 mm, and a length of 100 mm was prepared as a peeling auxiliary member. Both sides were fixed with an adhesive tape in a state in which one side of the peeling assisting member was superposed on one side of the polyimide film on which the circuit pattern was formed. The peeling unit shown in FIG. 4 was used instead of the peeling unit of the peeling apparatus in FIG. The curvature radius of the curved surface of the holding part 42 was 100 mm, and silicone rubber having a JIS-A hardness of 50 ° was used. A polyimide film with a circuit pattern was placed on the mounting table 6 such that the reinforcing plate was on the lower surface, and vacuum suction was performed at 100 hPa. The frame 13 and the support 41 were moved and positioned so that the holding portion 42 was in contact with the right end of the flexible film 2 positioned on the reinforcing plate 4, and then the mounting table 6 was raised. One end of the peeling assisting member 45 was held by the fixing component 46. At this time, the pressing pressure of the fixing jig was controlled so that the peeling assisting member 45 was able to slide between the fixing component 46 and the support body 41 when a tension of 80 N / m was applied to the peeling assisting member. . While the positions of the centers of the reinforcing plate 2 and the support body 41 are fixed, the support body 41 is rotated counterclockwise so that the surface of the holding section is moved by 15 mm, whereby the peeling assisting member is slid on the surface of the holding section. Parallelism of the rotation direction and the length direction of the peeling auxiliary member was performed. After the pressing force of the fixing part 46 is increased and the peeling assisting member 45 is completely gripped, the rightward moving speed at the time of peeling the frame 13 is 0.3 m / min, and the rotational peripheral speed of the holding portion is 0.31 m / min. In addition, when the tension applied to the polyimide film is 160 N / m or more, the rotation of the support 41 is controlled to decrease toward the moving speed of the frame, and the support 41 is moved to the left and the support is controlled. The flexible film 2 was peeled from the reinforcing plate 4 by rotating left 41. By removing the slack of the peeling auxiliary member before peeling, the peeling angle between the reinforcing plate and the flexible film can be suppressed to 20 ° or less from the beginning of peeling, and further, the rotation direction of the support and the peeling auxiliary member Due to self-aligning parallel to the length direction, peeling was performed with uniform stress in the width direction, so the polyimide film with a circuit pattern after peeling was not curled at all and the flatness was extremely good Met. In the same manner as in Example 1, the distance between the centers of the outermost inner leads in the width direction (design value 19.3 mm) was measured for the units on the polyimide film after peeling. The positional accuracy was very good within ± 1 μm (± 0.005%).

Example 5
A circuit pattern was obtained in the same manner as in Example 1. A polyester film having a thickness of 25 μm, a width of 300 mm, and a length of 100 mm was prepared as a peeling auxiliary member. Both sides were fixed with an adhesive tape in a state in which one side of the peeling assisting member was superposed on one side of the polyimide film on which the circuit pattern was formed.

  Using the peeling apparatus 1 shown in FIG. 1, the polyimide film with a circuit pattern was peeled from the glass substrate in the same manner as in Example 1. However, the curvature radius of the curved surface of the holding part 14 was 80 mm, and a urethane rubber sheet having a JIS-A hardness of 20 ° was used.

  The polyimide film with a circuit pattern after peeling did not show any folds or large curls, but due to uneven tension, there was a slight undulation at one end of the polyimide film, and the flatness was somewhat poor. In the same manner as in Example 1, when the distance between the centers of the outermost inner leads in the width direction (design value 19.3 mm) was measured for the unit on the polyimide film after peeling, the unit near the end where the undulation occurred. However, although the positional accuracy was better than that of the comparative example, it was slightly poorer than that of Example 1, although the maximum elongation was 6 μm (0.03%) with respect to the design value.

Example 6
A circuit pattern was obtained in the same manner as in Example 1. A polyester film having a thickness of 25 μm, a width of 300 mm, and a length of 100 mm was prepared as a peeling auxiliary member. Both sides were fixed with an adhesive tape in a state in which one side of the peeling assisting member was superposed on one side of the polyimide film on which the circuit pattern was formed.

  Using the peeling apparatus 1 shown in FIG. 1, the polyimide film with a circuit pattern was peeled from the glass substrate in the same manner as in Example 1. However, the curvature radius of the curved surface of the holding part 14 was 80 mm, and a silicone rubber sheet having a JIS-A hardness of 40 ° was used.

  The polyimide film with a circuit pattern after peeling had no curl and good flatness. In the same manner as in Example 1, the distance between the centers of the outermost inner leads in the width direction (design value 19.3 mm) was measured for the units on the polyimide film after peeling. The positional accuracy was very good within ± 1 μm (0.005%).

Example 7
A circuit pattern was obtained in the same manner as in Example 1. Next, an IC chip in which 772 gold-plated bump rows are arranged on each of two long sides of a 19.3 mm × 2.5 mm rectangle at a pitch of 25 μm is bonded to the inner lead on the polyimide film and metal bonded by a flip chip bonder. did. At this time, the IC holding and holding tool was heated to 400 ° C., the temperature of the stage on which the glass was placed was set to 180 ° C., and the IC was sequentially joined to all 49 units arranged on a 300 mm square substrate. A polyester film having a thickness of 25 μm, a width of 300 mm, and a length of 100 mm was prepared as a peeling auxiliary member. Both sides were fixed with an adhesive tape in a state in which one side of the peeling assisting member was superposed on one side of the polyimide film on which the circuit pattern was formed.

  The peeling unit of the peeling apparatus 1 shown in FIG. 1 was changed to that shown in FIG. That is, the holding portion 42 is provided with a groove 43 for accommodating the IC chip in a portion corresponding to the IC position connected to the circuit pattern. Next, in the same manner as in Example 1, the polyimide film with a circuit pattern in which the IC chip was bonded from the glass substrate was peeled off. One end of the peeling assisting member was gripped between the fixing component 46 and the support body 41. The curvature radius of the curved surface of the holding part 42 was 160 mm, and a silicone rubber sheet having a JIS-A hardness of 65 ° was used.

  The polyimide film with a circuit pattern after peeling had no curl and good flatness. Further, the circuit pattern was not damaged at the end of the IC chip or the end of the groove 43. In the same manner as in Example 1, the distance between the centers of the outermost inner leads in the width direction (design value 19.3 mm) was measured for the units on the polyimide film after peeling. The position accuracy was within ± 1 μm (0.005%).

Example 8
A circuit pattern was obtained in the same manner as in Example 1. Next, in the same manner as in Example 7, the inner leads on the IC chip polyimide film were metal bonded. A polyester film having a thickness of 25 μm, a width of 300 mm, and a length of 100 mm was prepared as a peeling auxiliary member. Both sides were fixed with an adhesive tape in a state in which one side of the peeling assisting member was superposed on one side of the polyimide film on which the circuit pattern was formed.

  Similarly to Example 7, the peeling unit of the peeling apparatus 1 shown in FIG. 1 was changed to that shown in FIG. Next, in the same manner as in Example 1, the polyimide film with a circuit pattern in which the IC chip was bonded from the glass substrate was peeled off. The curvature radius of the curved surface of the holding part 42 was 160 mm, and styrene rubber having a JIS-A hardness of 90 ° was used.

  The polyimide film with a circuit pattern after peeling had no curl and good flatness. However, the circuit pattern may be damaged at the end of the groove 43. In the same manner as in Example 1, the distance between the centers of the outermost inner leads in the width direction (design value 19.3 mm) was measured for the units on the polyimide film after peeling. The position accuracy was within ± 1 μm (0.005%).

Comparative Example 1
A circuit pattern was obtained in the same manner as in Example 1. A polyester film having a thickness of 25 μm, a width of 300 mm, and a length of 100 mm was prepared as a peeling auxiliary member. Both sides were fixed with an adhesive tape in a state in which one side of the peeling assisting member was superposed on one side of the polyimide film on which the circuit pattern was formed. Using the peeling apparatus 1 shown in FIG. 1, the polyimide film with a circuit pattern was peeled from the glass substrate in the same manner as in Example 1. However, after gripping one end of the peeling assisting member between the fixing component 19 and the support 11, the operation of moving the frame 13 in the right direction was not performed while keeping the support 11 from rotating.

  Before the start of peeling, there is a loosening of the peeling auxiliary member, and at the beginning of peeling, the peeling angle between the reinforcing plate and the flexible film may exceed 80 °, and the copper forming the circuit pattern curls in that part, Flatness was impaired. Further, when the distance between the center of the outermost inner leads in the width direction (design value 19.3 mm) was measured at the portion where the flatness was impaired, the maximum value was 9.6 μm (0.05%) with respect to the design value. A shift was seen and it was bad.

It is a schematic front view of the peeling apparatus which concerns on one embodiment of this invention. It is a schematic side view of the peeling apparatus of FIG. It is a schematic front view which shows one embodiment of a support body. It is a schematic front view which shows one embodiment of a peeling unit. It is a schematic front view which shows another embodiment of a peeling unit. It is a schematic front view of the laminating apparatus suitable for this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Peeling device 2 Flexible film 3 Peelable organic substance layer 4 Reinforcing plate 5 Flexible film substrate 6 Mounting table 7 Peeling unit 8 Control device 10, 42 Holding part 11 which controls relative movement of a peeling unit and a mounting table , 41 Support body 12 Axis 13 Frame 17 Electromagnetic clutch 18 Rotating motor 19, 46 Fixing part 21 Mounting table 43 Electronic component storage recess 44 Electronic component 45, 50 Auxiliary member for peeling 51 Holding means 100 Laminating device 101 Mounting table 102 Flexible Surface 103 103 Squeegee 104 Electrostatic charging device 106 Rail 111 Ball screw

Claims (8)

After forming a circuit pattern on the surface opposite to the bonding surface of the flexible film bonded to the reinforcing plate via the organic layer that can be peeled off, at least a part of the flexible film is aligned with the curved support. A method of manufacturing a circuit board that peels off the reinforcing plate and the flexible film, with the peeling auxiliary member connected to one end of the flexible film and projecting from the reinforcing plate along the support, or, peeling off the portion of the flexible film from the reinforcing plate, the separated portion of the flexible film in a state that along a said support member, for rotatably holding the support the support without rotating The frame and the reinforcing plate are moved relative to each other in the direction in which the tension is applied to the flexible film, or the support is applied to the flexible film without changing the relative position between the frame and the reinforcing plate. By rotating to The flexible film is adhered to the support and then, while rotating the support method of manufacturing a circuit board, which comprises peeling the flexible film by relatively moving the frame and the reinforcing plate . After forming a circuit pattern on the surface opposite to the bonding surface of the flexible film bonded to the reinforcing plate via the organic layer that can be peeled off, at least a part of the flexible film is aligned with the curved support. A circuit board manufacturing method in which a reinforcing plate and a flexible film are peeled to each other, wherein a peeling auxiliary member connected to one end of the flexible film and extending from the reinforcing plate is placed along the support, and the peeling assist one end of the member while gripping a separate gripping means and the support, or peeling the portion of the flexible film from the reinforcing plate, the peeled flexible film along a said support member, and A flexible film is moved by relatively moving the reinforcing plate and the gripping means in a direction in which tension is applied to the flexible film in a state where one end of the flexible film is gripped by the gripping means independent of the support. Dense on the support Is allowed, then while rotating the support method of manufacturing a circuit board, which comprises peeling the flexible film by relatively moving the frame for rotatably holding the reinforcing plate The support . After the flexible film is brought into close contact with the support , the frame and the reinforcing plate are moved relative to each other while the support is rotated after the flexible film or the peeling assisting member is slid along the support and is slid on the support. The method for manufacturing a circuit board according to claim 1 , wherein the flexible film is peeled off by moving in a moving manner. After the flexible film is brought into close contact with the support, the peeling auxiliary member or the end of the flexible film is held by the support, and then the frame and the reinforcing plate are relatively moved while rotating the support . The method for manufacturing a circuit board according to claim 1 , wherein the flexible film is peeled off. A circuit board manufacturing apparatus for peeling a flexible film from a flexible film substrate in which a flexible film on which a circuit pattern is formed is bonded to a reinforcing plate via an organic layer that can be peeled off. Holding means for holding, curved support for peeling the flexible film, means for rotating the support, means for moving the support and the reinforcing plate relatively horizontally, flexible film or flexible film With the connected peeling assisting member along the support, the frame and the reinforcing plate that hold the support rotatably without rotating the support are relatively positioned in the direction in which the tension is applied to the flexible film. Without moving the relative position between the frame and the reinforcing plate, the support film is rotated in the direction in which the tension is applied to the flexible film to apply tension to the flexible film. Support Apparatus for manufacturing a circuit board, characterized in that it comprises a means for Ru is adhered. A circuit board manufacturing apparatus for peeling a flexible film from a flexible film substrate in which a flexible film on which a circuit pattern is formed is bonded to a reinforcing plate via an organic layer that can be peeled off. Holding means for holding, curved support for peeling the flexible film, means for rotating the support, means for horizontally moving the support and the reinforcing plate, and flexible film independent of the support The gripping means independent of the support is flexible with the gripping means at one end of the end gripping means or the peeling assisting member, the flexible film or the peeling assisting member connected to the flexible film placed along the support. the tension to the flexible film by relatively moving with respect to the holding unit in a direction in which tension is applied to the sex film, circuit characterized in that it comprises a means for Ru is adhered to the flexible film to a support Substrate Forming apparatus. The method according to claim 5, further comprising means for causing the flexible film to adhere to the support and then sliding the flexible film or the peeling auxiliary member along the support while being slid on the support. Circuit board manufacturing equipment. A circuit board manufacturing apparatus for peeling a flexible film from a flexible film substrate in which a flexible film on which a circuit pattern is formed is bonded to a reinforcing plate via an organic layer that can be peeled off. Holding means for holding, curved support for peeling the flexible film, means for rotating the support, means for moving the support and the reinforcing plate relatively horizontally , and reinforcing by connecting to one end of the flexible film Independent of the support, means to bend and hold the end of the peeling auxiliary member protruding from the plate or the end of the flexible film partially peeled from the reinforcing plate and sandwiched between the support and the fixing member Including means for applying tension to the flexible film by moving the gripping means moved relative to the holding portion in a direction in which tension is applied to the flexible film, and bringing the flexible film into close contact with the support. Features Apparatus for manufacturing a circuit board.

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